Display module, manufacturing method thereof, and display device

Abstract

The display module, the manufacturing method thereof and the display device provided by the present disclosure include a display panel, a backlight side of the display panel, and a back film assembly attached to the backlight side of the display panel. The display panel includes a display area and a peripheral area located at the periphery of the display area, and the peripheral area includes a bending area. The back film assembly includes a back film body and a heat dissipation film body attached to a side of the back film body facing away from the display panel. The back film body includes a first area attached to at least the display area and a second area attached to at least the bending area. The heat dissipation film body includes a plurality of film layers stacked together, and at least some of the plurality of film layers include an opening pattern. The orthogonal projection of the opening pattern on the back film body at least partially overlaps with the second area. The display module, the manufacturing method thereof and the display device provided by the present disclosure can reduce material costs, reduce production processes, and improve production efficiency.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] In related technologies, with the development of display technology, display module products need to continuously reduce costs while improving quality. Costs involve production operations, materials, and other factors. Therefore, reducing the amount of materials used, streamlining production processes, and improving production efficiency have become top priorities. Summary of the Invention

[0003] This disclosure provides a display module and its manufacturing method, as well as a display device, which can reduce material costs, reduce production steps, and improve production efficiency.

[0004] The technical solutions provided in this disclosure are as follows:

[0005] A display module, comprising:

[0006] The display panel includes a display area and a peripheral area surrounding the display area, the peripheral area including a bending area; and

[0007] Back film assembly bonded to the backlight side of the display panel;

[0008] The backsheet assembly includes:

[0009] Back film body, the back film body including a first region at least attached to the display area and a second region at least attached to the bending area; and

[0010] A heat dissipation film body is attached to the side of the back film body facing away from the display panel. The heat dissipation film body includes a plurality of stacked film layers, and at least a portion of the plurality of film layers includes an opening pattern. The orthographic projection of the opening pattern on the back film body at least partially coincides with the second area.

[0011] For example, the plurality of film layers include: a heat dissipation material layer, and an adhesive layer bonded to the back film body and the heat dissipation material layer, wherein...

[0012] The materials of the heat dissipation material layer and the adhesive layer are removed at the positions corresponding to the second region to form the opening pattern.

[0013] For example, the plurality of film layers include: a heat dissipation material layer, and an adhesive layer bonded to the back film body and the heat dissipation material layer, wherein...

[0014] The orthographic projection of the adhesive layer on the back film body at least partially coincides with the first region and the second region; the heat dissipation material layer includes a retention pattern for retaining the heat dissipation material and an opening pattern for removing the heat dissipation material, the opening pattern exposing at least a portion of the adhesive layer located in the second region.

[0015] For example, the adhesive layer includes a mesh adhesive layer and a foam adhesive layer, with the mesh adhesive layer located between the foam adhesive layer and the back film body.

[0016] For example, the heat dissipation material layer has a first adhesive layer attached to the side facing the adhesive layer. The first adhesive layer is attached only between the retained pattern and the adhesive layer after the opening pattern is removed, so as to connect the heat dissipation material layer and the adhesive layer.

[0017] For example, double-sided tape is attached to the surface of the adhesive layer that is exposed by the opening pattern.

[0018] For example, when the opening pattern exposes at least a portion of the adhesive layer located in the second region, a second adhesive layer is attached to the side of the adhesive layer facing the heat dissipation material layer, and at least a portion of the second adhesive layer is located in the retention pattern to bond the heat dissipation material layer and the adhesive layer, and at least another portion is located on the surface of the portion of the adhesive layer exposed by the opening pattern.

[0019] For example, the adhesive layer includes a tacky silicone layer, with at least a portion of the silicone layer located within the retention pattern to bond the heat-dissipating material layer, and at least another portion exposed by the opening pattern.

[0020] A method for manufacturing a display module, comprising the steps described above:

[0021] The back film assembly is attached to the backlight side of the display panel;

[0022] The bending area is bent, wherein the second area of ​​the back film body and / or the portion of the film layer in the heat dissipation film body that is not provided with the opening pattern in the second area serves as a protective structure for the bending area;

[0023] The bent area is then pasted and fixed to the backlight side of the display panel.

[0024] For example, the step of attaching and fixing the bent area to the backlight side of the display panel specifically includes:

[0025] When double-sided tape is applied to the surface of the adhesive layer that is exposed by the opening pattern, the bending area is fixed by the double-sided tape.

[0026] When the adhesive layer is attached to a second adhesive layer on the side facing the heat dissipation material layer, and the second adhesive layer is at least partially located on the surface of the portion of the adhesive layer exposed by the opening pattern, the bending area is fixed by the second adhesive layer.

[0027] When the adhesive layer includes a sticky silicone layer, and the silicone layer is at least partially exposed by the opening pattern, the bending area is fixed by the silicone layer.

[0028] A display device includes a display module as described above.

[0029] This disclosure also provides a display device, including the display module described above.

[0030] The beneficial effects of the embodiments disclosed herein are as follows:

[0031] In the above solution, the back film body and heat dissipation film body of the display module are extended to the bending area of ​​the display panel, and the heat dissipation film body is patterned. At least part of the heat dissipation material layer is removed at the bending area to form an opening pattern, so that the part of the adhesive layer retained in the back film body and / or the heat dissipation film body can be directly used as a protective structure for the bending area, that is, to replace the protective adhesive in related technologies to protect the bending area, thereby reducing the protective adhesive coating process in related technologies.

[0032] Therefore, the display module, manufacturing method, and display device provided in this disclosure can effectively reduce the total cost of materials, while reducing processes, production losses, and production time. Attached Figure Description

[0033] Figure 1 This is a schematic diagram illustrating the structure of a display module in related technologies;

[0034] Figure 2 This disclosure provides schematic diagrams of the structure of display modules according to some exemplary embodiments;

[0035] Figure 3 This shows a front view of the structure of a display module provided in some other exemplary embodiments of this disclosure;

[0036] Figure 4 This is a structural front view of the display module provided in some other embodiments of this disclosure;

[0037] Figure 5 This indicates that in some embodiments of the present disclosure, the back film assembly in the display module is in the bending area before bending. Figure 4 Sectional view along the X-X' direction;

[0038] Figure 6 express Figure 5The illustrated embodiment shows a cross-sectional view of the back film assembly of the display module after bending in the bending area;

[0039] Figure 7 In some embodiments of this disclosure, the back film assembly in the display module is in the bending area before bending. Figure 3 Sectional view along the X-X' direction;

[0040] Figure 8 express Figure 7 The illustrated embodiment shows a cross-sectional view of the back film assembly of the display module after bending in the bending area;

[0041] Figure 9 In other embodiments of this disclosure, the back film assembly in the display module is in place before the bending area is bent. Figure 3 Sectional view along the X-X' direction;

[0042] Figure 10 express Figure 9 The illustrated embodiment shows a cross-sectional view of the back film assembly of the display module after bending in the bending area. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0044] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0045] Before providing a detailed description of the back film, display module, manufacturing method thereof, and display device provided in the embodiments of this disclosure, it is necessary to explain the related technologies as follows:

[0046] In related technologies, during the display module manufacturing process, the back film and heat dissipation film are supplied separately and applied separately, and as follows: Figure 1 As shown, the back film 1 and the heat dissipation film 2 only cover the display area. The back film 1 and the heat dissipation film 2 have grooved areas at the corresponding positions of the bending area 3 of the display panel 5. Therefore, protective adhesive 4 needs to be applied separately before the bending process to protect the bending area, and the flexible circuit board of the bending area 3 is glued and fixed by setting double-sided adhesive 6 on the bending area 3.

[0047] To reduce costs and streamline production processes, this disclosure provides a display module, its manufacturing method, and a display device.

[0048] like Figures 2 to 10 As shown, the display module provided in this embodiment includes:

[0049] The display panel 10 and the back film assembly 20 attached to the backlight side of the display panel 10 are described. The display panel 10 includes a display area A and a peripheral area located around the display area A. The peripheral area includes a bending area B located on the side where the flexible circuit board is bonded. It should be noted that the bending area B is bent and attached to the backlight side of the display panel 10 during the display module manufacturing process.

[0050] The backsheet assembly 20 includes:

[0051] The back film body 21 includes a first region A' at least attached to the display area A and a second region B' at least attached to the bending area B. That is, the back film body 21 can cover the display area A and extend to cover the bending area B; and

[0052] A heat dissipation film body 22 is attached to the side of the back film body 21 facing away from the display panel 10. The heat dissipation film body 22 includes a plurality of stacked film layers, and at least some of the plurality of film layers include an opening pattern. The orthographic projection of the opening pattern on the back film body 21 at least partially coincides with the second region B'.

[0053] In the above solution, the back film body 21 and the heat dissipation film body 22 are extended to the bending area B of the display panel 10, and the heat dissipation film body 22 is patterned and contoured. At least part of the film layer in the heat dissipation material layer 221 is removed at the bending area B to form an opening pattern 221b. Thus, the part of the film layer retained in the back film body and the heat dissipation film body can directly serve as a protective structure for the bending area B, that is, to replace the protective adhesive in related technologies to protect the bending area, thereby reducing the protective adhesive coating process in related technologies.

[0054] In some embodiments, the back film body 21 and the heat dissipation film body 22 are designed as an integrated unit. In this way, the heat dissipation film body 22 can be attached at the same time as the back film assembly 20. Compared with the display module manufacturing process in related technologies, the module bonding process can be reduced, and the impact damage to the display panel 10 during the process can be reduced.

[0055] In some embodiments, such as Figure 2 As shown, the heat dissipation film body 22 includes: a heat dissipation material layer 221, and an adhesive layer 222 bonded between the back film body 21 and the heat dissipation material layer 221. The materials of the heat dissipation material layer 221 and the adhesive layer 222 are removed at the position corresponding to the second region B' to form the opening pattern 221b. That is, all material is removed from the heat dissipation film body 22 at the position corresponding to the second region B'. In this way, the back film body can replace the protective adhesive used in related technologies to protect the bending area, reducing the protective adhesive coating process and simplifying the manufacturing process.

[0056] In other embodiments, such as Figures 3 to 10 As shown, the heat dissipation film body 22 includes: a heat dissipation material layer 221, and an adhesive layer 222 bonded to the back film body 21 and the heat dissipation material layer 221. The orthographic projection of the adhesive layer 222 on the back film body 21 at least partially overlaps with the first region A' and the second region B'.

[0057] The heat dissipation material layer 221 includes a retained pattern 221a for retaining the heat dissipation material and an opening pattern 221b for removing the heat dissipation material. The orthographic projection of the opening pattern 221b onto the back film body 21 at least partially coincides with the bending region B, thereby exposing at least a portion of the adhesive layer 222 located in the bending region B. In other words, the heat dissipation film body 22 is thinned in the bending region B, the heat dissipation material layer 221 is removed in the opening pattern 221b, while the adhesive layer 222 is retained in the opening pattern 221b.

[0058] In the above solution, the heat dissipation film body 22 is patterned and contoured. At the bending area B, the heat dissipation material layer 221 is removed to form an opening pattern 221b, while the adhesive layer 222 on the heat dissipation film body 22 is retained, thereby exposing the adhesive layer 222 of the heat dissipation film body 22 itself. The portion of the adhesive layer 222 exposed by the opening pattern 221b can be directly used as a protective adhesive for the bending area B, that is, it replaces the protective adhesive in related technologies to protect the bending area, thereby reducing the protective adhesive coating process in related technologies.

[0059] Therefore, the back film assembly 20 provided in this embodiment can effectively reduce the total cost of materials by integrating the back film assembly 20 and the heat dissipation film material, while reducing multiple processes, reducing production losses and shortening production time; at the same time, since the heat dissipation film is attached to the back film assembly 20 during the bonding process, the heat dissipation film can be used in advance during the process to protect the display panel 10, reduce panel impacts during the process, and improve production yield.

[0060] In some embodiments, the material of the heat dissipation material layer 221 can be any suitable heat dissipation material such as copper foil.

[0061] In some exemplary embodiments, such as Figure 4 and Figure 5 As shown, the adhesive layer 222 may include a mesh adhesive layer 2221 and a foam adhesive layer 2222, with the mesh adhesive layer 2221 located between the foam adhesive layer 2222 and the back film body 21. In the above solution, the foam adhesive layer 2222 can replace the protective adhesive used in related technologies to protect the bending area B, reducing the number of protective adhesive coating steps.

[0062] The foam adhesive layer 2222 is bonded and fixed to the heat dissipation material layer 221. Specifically, as follows: Figure 5 and Figure 6 As shown, in some exemplary embodiments, the heat dissipation material layer 221 has a first adhesive layer 23 attached to the side facing the adhesive layer 222. When only the heat dissipation material layer 221 is removed in the bending area B, the first adhesive layer 23 is removed along with the heat dissipation material layer 221 in the opening pattern 221b, and is only adhered between the retained pattern 221a and the adhesive layer 222 to connect the heat dissipation material layer 221 and the adhesive layer 222. That is, the heat dissipation material layer 221 itself has the first adhesive layer 23 attached to it. When the heat dissipation material layer 221 is removed in the opening pattern 221b, the first adhesive layer 23 in the opening pattern 221b is also removed, so that the foam adhesive layer 2222 is exposed in the opening pattern 221b portion. At this time, as Figure 3As shown, the surface of the adhesive layer 222 exposed by the opening pattern 221b can be covered with double-sided tape 26, which can be used to attach and fix the bending area B to the backlight side of the display panel 10.

[0063] In other exemplary embodiments, such as Figure 7 and Figure 8 As shown, when the opening pattern exposes at least a portion of the adhesive layer located in the second region B', the adhesive layer 222 has a second adhesive layer 24 attached to the side facing the heat dissipation material layer 221, and at least a portion of the second adhesive layer 24 is located in the retained pattern 221a to bond the heat dissipation material layer 221 to the adhesive layer 222, and at least another portion is located on the surface of the portion of the adhesive layer 222 exposed by the opening pattern 221b. That is, the second adhesive layer 24 is attached to the adhesive layer 222 itself, and when the heat dissipation material layer 221 in the opening pattern 221b is removed, the second adhesive layer 24 in the opening pattern 221b will not be removed, so that the second adhesive layer 24 is retained and exposed in the portion of the opening pattern 221b. At this time, as Figure 4 As shown, the portion of the second adhesive layer 24 exposed by the opening pattern 221b no longer needs to be covered with double-sided tape. The bending area B can be directly adhered and fixed to the backlight side of the display panel 10 using the portion of the second adhesive layer 24 exposed by the opening pattern 221b. Compared to the related technology where adhesive pads or other adhesives are needed to fix the bending area B when bending, there is no need to apply adhesive pads separately. The bending and pasting can be performed directly, thereby reducing the number of steps and saving materials.

[0064] Furthermore, in some other exemplary embodiments, such as Figure 9 and Figure 10 As shown, the adhesive layer 222 may include a silicone layer 25 with its own adhesive properties. When only the heat dissipation material layer 221 is removed from the bending area B, at least a portion of the silicone layer 25 is located in the retained pattern 221a to adhere and connect the heat dissipation material layer 221, and at least another portion is exposed by the opening pattern 221b. In this way, the silicone layer 25 can be used directly to replace double-sided tape and other materials used in related technologies to adhere and fix the bending area B during the bending process, reducing steps and saving materials.

[0065] Furthermore, this disclosure also provides a method for manufacturing a display module, used to manufacture the display module provided in this disclosure, the method comprising the following steps:

[0066] Step S01: Attach the back film assembly 20 to the backlight side of the display panel 10;

[0067] Step S02: Bend the bending area B, wherein the second area B' of the back film body 21 and / or the portion of the film layer in the heat dissipation film body 22 that is not provided with the opening pattern 221b in the second area B' serves as a protective structure for the bending area B;

[0068] Step S03: Attach and fix the bent area B to the backlight side of the display panel 10.

[0069] For example, step S03 specifically includes:

[0070] When double-sided tape is applied to the surface of the adhesive layer 222 exposed by the opening pattern 221b (i.e., as...) Figure 5 and Figure 6 The back film assembly 20 shown is used to fix the bending area B by the double-sided adhesive.

[0071] When the adhesive layer 222 is attached to the side facing the heat dissipation material layer 221 with a second adhesive layer 24, and the second adhesive layer 24 is at least partially located on the surface of the portion of the adhesive layer 222 exposed by the opening pattern 221b (i.e., as...) Figure 7 and Figure 8 The back film assembly 20 shown is attached and fixed to the bending area B by the second adhesive layer 24;

[0072] When the adhesive layer 222 includes an adhesive silicone layer 25, and the silicone layer 25 is at least partially exposed by the opening pattern 221b (i.e., as...) Figure 9 and Figure 10 The back film assembly 20 shown is used to attach and fix the bending area B through the silicone layer 25.

[0073] This disclosure also provides a display device, including the display module provided in this disclosure.

[0074] The following points need to be explained:

[0075] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0076] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0077] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0078] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A display module, comprising: The display panel includes a display area and a peripheral area surrounding the display area, the peripheral area including a bending area; and Back film assembly bonded to the backlight side of the display panel; The backsheet assembly is characterized in that it comprises: Back film body, the back film body including a first region at least attached to the display area and a second region at least attached to the bending area; and A heat dissipation film body is attached to the side of the back film body facing away from the display panel. The heat dissipation film body includes multiple stacked film layers, and at least a portion of the multiple film layers includes an opening pattern. The orthographic projection of the opening pattern on the back film body at least partially coincides with the second area. The plurality of film layers include: a heat dissipation material layer and an adhesive layer bonded to the back film body and the heat dissipation material layer, wherein the orthographic projection of the adhesive layer on the back film body at least partially coincides with the first region and the second region; the heat dissipation material layer includes a retaining pattern for retaining the heat dissipation material and an opening pattern for removing the heat dissipation material, the opening pattern exposing at least a portion of the adhesive layer located in the second region; the back film body and the heat dissipation film body are integrally designed.

2. The display module according to claim 1, characterized in that, The adhesive layer includes a mesh adhesive layer and a foam adhesive layer, with the mesh adhesive layer located between the foam adhesive layer and the back film body.

3. The display module according to claim 2, characterized in that, The heat dissipation material layer has a first adhesive layer attached to the side facing the adhesive layer. The first adhesive layer is attached only between the remaining pattern and the adhesive layer after the opening pattern is removed, so as to connect the heat dissipation material layer and the adhesive layer.

4. The display module according to claim 3, characterized in that, The surface of the adhesive layer exposed by the opening pattern is covered with double-sided tape.

5. The display module according to claim 2, characterized in that, When the opening pattern exposes at least a portion of the adhesive layer located in the second region, a second adhesive layer is attached to the side of the adhesive layer facing the heat dissipation material layer, and at least a portion of the second adhesive layer is located on the retention pattern to bond the heat dissipation material layer and the adhesive layer, and at least another portion is located on the surface of the portion of the adhesive layer exposed by the opening pattern.

6. The display module according to claim 1, characterized in that, The adhesive layer includes a tacky silicone layer, at least a portion of which is located within the retention pattern to bond the heat dissipation material layer, and at least another portion is exposed by the opening pattern.

7. A method for manufacturing a display module, characterized in that, The method for manufacturing a display module as described in any one of claims 1 to 6 comprises the following steps: The back film assembly is attached to the backlight side of the display panel; The bending area is bent, wherein the second area of ​​the back film body and the portion of the film layer in the heat dissipation film body that is not provided with the opening pattern in the second area serve as the protective structure of the bending area; The bent area is then pasted and fixed to the backlight side of the display panel.

8. The method according to claim 7, characterized in that, When the back film assembly is the back film assembly as described in claim 3 The step of attaching and fixing the bent area to the backlight side of the display panel specifically includes: When double-sided tape is applied to the surface of the adhesive layer that is exposed by the opening pattern, the bending area is fixed by the double-sided tape. When the adhesive layer is attached to a second adhesive layer on the side facing the heat dissipation material layer, and the second adhesive layer is at least partially located on the surface of the portion of the adhesive layer exposed by the opening pattern, the bending area is fixed by the second adhesive layer. When the adhesive layer includes a sticky silicone layer, and the silicone layer is at least partially exposed by the opening pattern, the bending area is fixed by the silicone layer.

9. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 6.

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