A distribution system for process fluids used in the chemical and / or electrolytic surface treatment of substrates

Abstract

The present disclosure relates to a dispensing system for process fluid for chemical and / or electrolytic surface treatment of a substrate and a manufacturing method for a dispensing system for process fluid for chemical and / or electrolytic surface treatment of a substrate. The dispensing system for process fluid for chemical and / or electrolytic surface treatment of a substrate comprises a dispensing body and a dispensing medium. The dispensing body comprises a plurality of openings for process fluid and / or electric current. The dispensing medium covers at least some of the openings of the dispensing body. The dispensing medium comprises a meshed frame with passages adapted to dispense process fluid and / or electric current from the dispensing body.

Description

Technical Field

[0001] This disclosure relates to a process fluid distribution system for chemically and / or electrolytically surface treating a substrate, and a method for manufacturing the process fluid distribution system for chemically and / or electrolytically surface treating a substrate. Background Technology

[0002] In the production of large-sized printed circuit boards (PCBs), the use of a so-called HSP system, which incorporates high-speed electroplating technology, yields optimal processing results. In high-speed electroplating, one or two HSPs (High Speed ​​Plates) are immersed in a bath containing liquid electrolyte along with one or more anodes and one or two substrates. Electrolyte flow is guided from the interior of the HSP to the substrate surface via jet orifices, while current is guided through the HSP to the substrate surface via drain orifices. The drain orifices are used to remove used electrolyte from the substrate. Due to the small distance between the HSP and the substrate, and the high ejection velocity of the electrolyte from the jet orifices, the electrolyte flow is poorly dispersed and impacts the substrate surface point by point. The diameter of the affected area is almost the same as the diameter of the fluid electrolyte flow exiting the jet orifice. The arrangement of the jet and drain orifices is crucial for achieving uniform material deposition on the substrate, thus completely covering the target surface with the fluid electrolyte flow from the jet orifices, and uniformly distributing the current through the drain orifices, especially when the substrate has a patterned surface.

[0003] To overcome the challenges of fluid electrolyte flow ejection from the injection orifice and current ejection through the drain orifice, existing technologies employ various arrangements of injection and drain orifices on the HSP surface. The primary aim of these arrangements is to achieve full HSP coverage by the fluid electrolyte flow and current. However, these arrangements have limitations when dealing with substrates having patterned surfaces to be electrochemically coated. In particular, if the drain or injection orifice is located directly in front of a hole or cavity in the substrate, the coating thickness in that area will increase, while adjacent areas will show a decreased coating thickness. This results in an uneven coating surface. Attempting to reduce this problem by increasing the density of available injection and drain orifices significantly limits the fabrication of the HSP board. A minimum distance must be ensured between individual injection and drain orifices, and these orifices must have a minimum diameter. Currently, it is technically impossible to manufacture HSPs with injection and drain orifices having diameters and distances below a specific minimum. Summary of the Invention

[0004] Therefore, it may be necessary to provide an improved distribution system for process fluids used in chemical and / or electrolytic surface treatment of substrates, particularly for achieving more uniform surface treatment of the substrates.

[0005] It should be noted that the various aspects described below in this disclosure also apply to a process fluid distribution system for chemical and / or electrolytic surface treatment of a substrate, and a method for manufacturing a process fluid distribution system for chemical and / or electrolytic surface treatment of a substrate.

[0006] According to this disclosure, a distribution system for process fluids used in chemical and / or electrolytic surface treatment of a substrate is proposed. The distribution system includes a distribution body and a distribution medium. The distribution body includes multiple openings for process fluids and / or currents. The distribution medium covers at least some of the openings of the distribution body. The distribution medium includes a mesh frame with pathways adapted to distribute process fluids and / or currents from the distribution body.

[0007] To overcome the limitations of existing technologies, a distribution system with a distribution medium has been invented that ensures the dispersion or dispersion of process fluid flow and / or current exiting from the pathway of the distribution medium. With the aid of the distribution medium, the diameter of the impact zone of the process fluid flow and / or current on the substrate surface can be significantly increased. This allows for the maintenance of a small gap, small opening, and / or high flow velocity of the process fluid between the distributor and the substrate without point-to-point impact of the process fluid on the substrate surface. Because there is no or only a minor point-to-point impact or shock, it may be easier to completely or at least better cover the substrate surface with the process fluid flow and / or distribute the current more uniformly on the substrate surface. Furthermore, by using a distribution medium to ensure the dispersion of the process fluid flow / current exiting from the opening, the topology of the substrate surface has a smaller impact on coating uniformity. Therefore, the surface treatment can be more uniform, and other effects, such as a more uniform coating, can be achieved. This is particularly suitable for substrates with patterned surfaces.

[0008] The mesh framework with pathways refers to a framework that is a group of pathways (or channels) interconnected to form a pathway network. Process fluids and / or currents entering the mesh framework can be transported to the interconnected pathways to diffuse within the framework of pathways. Here, a pathway network refers to interconnected pathways or channels that allow process fluids and / or currents to travel from one pathway to another. Because the mesh framework can provide a predictable flow path for the process fluids and / or currents, it is also possible to generate a targeted flow (local ejection of process fluid / current) to a specific region of the substrate to be treated.

[0009] Due to the high dispensing capability of the dispensing system, the size of the dispensing body and / or the dispensing medium can be smaller than the substrate to be processed. Therefore, it is possible to eliminate or at least significantly reduce the limitations imposed on the size of the dispensing system by the substrate size, and the size of the dispensing system can be selected completely or at least partially independent of the substrate to be processed.

[0010] Surface treatment can be a chemical and / or electrolytic surface treatment of the substrate. The surface treatment can be material deposition, electroplating, photolithography, wet or dry etching, wet or dry cleaning, water rinsing or chemical rinsing, etc.

[0011] The substrate can be any plate-like material with or without structure and / or layers on at least one surface. The substrate can be a semiconductor, insulator (e.g., glass, quartz, plastic, polymer, etc.), solar cell, printed circuit board, (flat panel) display, etc. Two substrates can also be processed together or simultaneously.

[0012] The distributor can be understood as a plate or any plate-like material having several, numerous, or arrayed openings that direct the flow of process fluids (e.g., electrolytes) and / or current density distribution to the substrate. The distributor can be arranged between the anode and the substrate forming the cathode.

[0013] The opening can be understood as a hole, cavity, or channel extending through the distributor. The opening may have a discharge port on the front surface of the distributor facing the substrate. The opening may have an inlet on the rear surface of the distributor facing the anode. The inlet and / or the discharge port may also be located on the side of the distributor, facing, for example, an opening in the side wall or bottom of a processing chamber into which the distributor is inserted or immersed. The opening may extend straight or at an angle through the distributor. The opening may be a jet orifice adapted to guide process fluid from the distributor to the substrate. The opening may be a discharge orifice for the return of process fluid from the substrate and through the distributor.

[0014] The dispensing medium may be located on the surface of the dispensing body facing the substrate. The dispensing medium may at least partially cover the dispensing body. The dispensing medium can be understood as a porous body. The dispensing medium may include a mesh or grid-like frame or structure with passages or channels to allow the process fluid and / or the current to pass through the dispensing medium and to dispense or spray the process fluid and / or the current in a direction away from the dispensing medium, preferably towards the substrate.

[0015] The distribution medium and / or its mesh framework can be understood as a porous body, foam, sponge, grid, etc. The mesh framework may include a network of randomly or non-randomly distributed pathways or channels in a bulk material, wherein the pathways allow process fluid flow and / or current to flow from one side of the distribution medium to the other. The network is an arrangement of intersecting horizontal and vertical lines. At least some lines may also be arranged at angles different from the horizontal and vertical. By intersecting the pathways or channels, the process fluid and / or current can be diffused to other portions of the distribution medium, thereby enabling emission from these other portions onto the substrate to be treated. The pathways or channels may extend straight or at an angle through the distribution medium. The pathways or channels may extend, and the process fluid flow and / or current may flow from one side (e.g., the rear surface or side surface) of the distribution medium to the other side (e.g., the front surface or side surface).

[0016] In one embodiment, the opening covered by the distribution medium is a jet orifice configured to direct the process fluid to the substrate. The jet orifice or nozzle can be an opening to direct the process fluid from the distribution body to the substrate. In one embodiment, additionally or alternatively, the opening covered by the distribution medium is a discharge orifice configured to discharge the process fluid relative to the substrate. The discharge orifice or nozzle can be an opening for the process fluid to return from the substrate and flow back through the distribution body. This means that, for better distribution of the process fluid flow, only the jet orifice-type opening can be covered by the distribution medium, while the discharge orifice-type opening may be uncovered. Conversely, only the discharge orifice-type opening can be covered to disperse current, while the jet orifice-type opening may be uncovered. Preferably, both types of openings (jet orifices and discharge orifices) are covered by the distribution medium, or each type is covered by a different version of the distribution medium.

[0017] The discharge orifice may be arranged near or around the injection orifice. In other words, there is at least one discharge orifice dedicated to or assigned to the injection orifice. Preferably, there are multiple discharge orifices dedicated to or corresponding to a small number of injection orifices. The discharge orifice allows for a relatively short flow path and / or a relatively small flow grid. This is particularly significant compared to prior art distribution bodies, which guide backflow through the opening edge of the distribution body, thus forming a longer flow path and / or a larger flow grid. The distribution body includes a high-speed plate (HSP) formed by multiple injection orifices that direct process fluid to the substrate and multiple discharge orifices that handle the backflow of process fluid returning from the substrate and passing through the discharge orifice. The HSP can allow the process fluid to be accelerated and / or more easily controlled, balanced, and / or equalized in terms of current distribution toward the substrate.

[0018] In one example, the number of openings in the distribution body may exceed the number of passages in the distribution medium, or the number of openings and passages may be equal. When the distribution system has an equal number of openings and passages, each passage may correspond to one opening. Therefore, all process fluids and / or currents traveling through the distribution body can be efficiently guided to the substrate through the distribution medium. Of course, in another example, the number of passages may exceed the number of openings.

[0019] In one embodiment, the dispensing medium includes a mesh frame with channels adapted to dispensing process fluid and / or current from the dispenser body through the dispensing medium toward or relative to a substrate. In one embodiment, the mesh frame forms a sponge with randomly distributed channels. This means that the channels can be irregularly distributed like polymer chains. Random distribution can also be understood as the number of channels forming the mesh frame per unit area may not be equal throughout the dispensing medium. In another embodiment, the mesh frame forms a grid with uniformly distributed channels. This means that the channels can be regularly distributed like a grid pattern. Uniform distribution can also be understood as the number of channels forming the mesh frame per unit area being equal throughout the dispensing medium. In all embodiments, the channels can be understood as a network of channels within the mesh frame that allows process fluid and / or current to flow from a first surface of the dispensing medium (e.g., the surface facing the dispenser body) to another second surface (e.g., the surface facing the substrate).

[0020] In one embodiment, at least some pathways may be interconnected. This means that at least one pathway may be connected to at least another pathway to transfer from one surface of the distribution medium to another surface of the distribution medium. Interconnected pathways can allow the process fluid flow and / or current to be better transferred from one pathway to another (e.g., via a relay) across the distribution medium. The interconnected pathways may form a straight piercing from one surface of the distribution medium to another, preferably opposite surfaces of the distribution medium. Additionally or alternatively, the interconnected pathways may form an intertwined, lateral, or inclined interconnection between one surface and another of the distribution medium. The interconnected pathways may also form branches and / or bypasses. Preferably, the interconnected pathways are configured such that the process fluid and / or current can flow along the flow path without interruption. Therefore, energy loss and velocity reduction in the flow of the process fluid and / or current can be kept to a minimum.

[0021] The bulk material of the distribution medium between relatively empty channels can be understood as a mesh, pores, or (honeycomb) honeycomb. In one embodiment, the mesh frame comprises a single layer of mesh and channels. This can be understood as the distribution medium having essentially only one layer in height (viewed from a surface perpendicular to the distribution medium), with one mesh arranged adjacent to a channel and without stacking. In another embodiment, the mesh frame comprises at least two layers of mesh and channels. This can be understood as the distribution medium having essentially only two or more layers in height (viewed from a surface perpendicular to the distribution medium), wherein the term layer is defined as a single mesh arranged adjacent to a channel without stacking.

[0022] When a mesh frame comprises at least two layers of mesh and pathways, the interlocking layers can be at least partially displaced relative to each other, like a brick wall with displaced brick layers. This means that the first pathway of the first layer is not at least perfectly aligned with the second pathway of the second layer laid above it. Of course, in contrast, the pathways of the interlocking layers can be aligned with each other such that the first pathway of the first layer is at least partially aligned with the second pathway of the second layer laid above it.

[0023] In an example where the mesh framework comprises two layers, these layers can have pathways of different densities (in other words, different numbers of pathways). By varying the proportion of pathways in the layers, the flow rate and dispersion of process fluids and / or currents from the distributor can be controlled.

[0024] The distribution medium and / or the mesh framework may have high permeability to avoid additional current resistance in the openings (especially injection orifices) and / or to avoid incomplete discharge of process fluids through the openings (especially discharge orifices). The permeability may be described as porosity, hydraulic conductivity, etc. Porosity can be understood as the ratio of pore volume to bulk volume of a porous material. Permeability can be understood as a parameter describing the quality or nature of the connections between pores in a porous material. In one embodiment, the porosity of the distribution medium is between 0.1 and 0.95, preferably between 0.4 and 0.9, and more preferably between 0.6 and 0.85. The term "porosity" can be understood as effective porosity, the accessible void ratio through connected pores and / or interconnecting pathways, a measure of the void (i.e., "empty") space in a material, and the proportion of void volume in the total volume.

[0025] There are several methods for measuring porosity: directly by measuring the bulk volume of a porous sample, and then measuring the volume of a non-porous framework material (pore volume = total volume). Material volume), optical methods measure the area of ​​the material and the area of ​​pores visible under a microscope, 3D renderings of the external and internal geometry (including pores) are created using computed tomography (CT) scans, and similar methods are used to perform defect analysis using computer software.

[0026] In one embodiment, the hydraulic conductivity of the dispensing medium is 10. -4 The speed range is between m / s and 10 m / s, with the preferred range being 10 m / s. -3 m / s-1m / s, with a more preferred range of 10 m / s. -3 m / s-10 -1 m / s. The term "hydraulic conductivity" can be understood as a property describing how easily a fluid flows through voids or pores. The hydraulic conductivity may depend on the inherent permeability and saturation of the material, as well as the density and viscosity of the fluid. By definition, hydraulic conductivity is the ratio of velocity to hydraulic gradient, representing the permeability of porous media.

[0027] There are several methods to measure hydraulic conductivity. One method is the constant head method, which allows water to flow through a sample under steady-state head conditions while simultaneously measuring the amount of water flowing through the sample over a period of time. Using the known water volume ΔV measured over time Δt for a sample of length L and cross-sectional area A, and the head h (i.e., the height difference of the water column), the hydraulic conductivity K can be calculated using the following formula:

[0028]

[0029] Another method is the drop head method, where the sample is first saturated under specific head conditions. Then, liquid (preferably water) is allowed to flow through the sample without any further addition, so that the pressure head decreases as the liquid flows through a sample of length L. If the head drops from height h in time Δt... i Descend to altitude h f Then the hydraulic conductivity K is equal to:

[0030]

[0031] In one embodiment, permeability, porosity, and / or hydraulic conductivity are anisotropic. This means that permeability, porosity, and / or hydraulic conductivity differ in a first direction (e.g., parallel to the surface of the dispensing medium) from a second direction through the dispensing medium (e.g., perpendicular to the surface of the dispensing medium). For example, permeability, porosity, and / or hydraulic conductivity are lower in the direction parallel to the surface of the dispensing medium than in the direction perpendicular to the surface of the dispensing medium. This allows the process fluid and / or current to be diffused or dispensed within the dispensing medium before being dispensed or sprayed outside the dispensing medium (preferably towards the substrate away from the dispensing medium). This results in a wider distribution of the process fluid and / or current and a more uniform surface treatment of the substrate. Of course, permeability, porosity, and / or hydraulic conductivity can also be higher in the direction parallel to the surface of the dispensing medium than in the direction perpendicular to the surface of the dispensing medium. Of course, anisotropy may also not exist, and permeability, porosity, and / or hydraulic conductivity may be similar in all directions.

[0032] The passageway, or more precisely, the orifice or opening of the passageway for the dispensing medium, can be partially closed, for example, by laser writing. This closure method allows for selective sealing of orifices based on the size and / or location of the structure on the substrate. Unsealed orifices provide fluid flow and current to achieve the target process, i.e., metal deposition, on the substrate, while sealed orifices restrict fluid and current and thus limit the target process on the substrate. The orifices of the dispensing medium can be selectively closed, either as a single or adjacent or arrayed or grouped or arrayed orales, to form, for example, random or non-random patterns.

[0033] The passageway or orifice or opening of the dispensing medium can also be partially closed, in other words, narrowed. Narrowing the outlet of the passageway (the opening of the passageway or orifice) can allow for localized control of process fluid and / or current flow based on the required thickness of a specific portion of the substrate surface, for example.

[0034] One or more unsealed orifices in the dispensing medium can be circular, angular, or linear. Linear openings or groups of openings can be straight, circular, serrated, or corrugated, etc. Multiple orifices can include combinations of different shapes or sizes, or they can all be identical. Openings at the edges of the dispensing medium can be larger than those at the center of the dispensing medium to offset the higher density of process fluids and / or currents reaching the center of the substrate (through overlap of process fluids / currents from surrounding openings). Similarly, in the center of the dispensing medium, the opening size can be smaller to reduce the chemical and / or electrolytic surface treatment of the substrate at the center, balancing the lower surface treatment at the substrate edges. The diameter or cross-sectional size of the passages in the dispensing medium can range from micrometers to millimeters.

[0035] The dispensing medium can be made of any material and can be of any form and / or thickness. Furthermore, the dispensing medium can comprise only one material or a variety of materials representing composite materials.

[0036] The dispensing medium can be attached to the dispensing body in various ways, removably or non-removably, i.e., mechanically, chemically, etc., and the dispensing medium can be attached to the dispensing body by one or a combination of these methods. Mechanical attachment of the dispensing medium can be achieved using clamps or fastening devices, such as screws. The advantage of mechanical attachment to the dispensing body is that it can be removed and replaced at any time without damaging the dispensing medium or the dispensing body. Another possibility is to chemically attach the dispensing medium to the dispensing body through chemical bonding between two interfaces. This can be achieved by forming a direct chemical bond between the two interfaces or by using an adhesive between them, wherein the dispensing body is chemically bonded to one side of the adhesive, and the dispensing medium is chemically bonded to the other side of the adhesive. One advantage of the chemical bond between the dispensing body and the dispensing medium is the strong bond between them, which ensures a fixed, immovable position in the desired location. Chemical bonding can be induced by thermal or mechanical means, i.e. by applying pressure, or the dispensing medium can be manufactured directly on the dispensing body, i.e., by directly 3D printing the dispensing medium onto the dispensing body, or the dispensing body and the dispensing medium can be produced together in the same manufacturing step (i.e., 3D printing).

[0037] According to this disclosure, a method for manufacturing a distribution system for process fluids used in chemical and / or electrolytic surface treatment of a substrate is also provided. The manufacturing method includes, but is not limited to, the following steps:

[0038] - Provide a distribution body, wherein the distribution body includes a plurality of openings for process fluid and / or current.

[0039] - Use a dispensing medium to cover at least some openings of the dispensing body, wherein the dispensing medium includes a mesh frame with pathways adapted to dispense process fluids and / or currents from the dispensing body.

[0040] The manufacturing method of the present invention allows for the easy manufacture of a distribution system having a distribution medium, which can increase the dispersion or diffusion of process fluid flowing out of the path of the distribution medium and / or the dispersion of current flowing through the path of the distribution medium. Therefore, the surface treatment of the distribution system can be more uniform, and can result in, for example, a more uniform coating.

[0041] The distribution medium and / or the mesh frame may be porous, such as a sponge or a grid. The distribution medium and / or its mesh frame may include a network of randomly or non-randomly distributed channels or pathways within the material, allowing process fluid flow and / or current to flow from one side of the distribution medium to the other. At least some pathways may be interconnected, meaning that at least one pathway is connected to at least another pathway.

[0042] The opening covered by the distribution medium may be a jet orifice configured to direct the process fluid to the substrate. The opening covered by the distribution medium may also be a drain orifice configured to discharge electrolyte relative to the substrate. There may be at least one drain orifice dedicated to or assigned to the jet orifice. Preferably, multiple drain orifices dedicated to or assigned to a small number of jet orifices are provided. The distribution body may be a high-speed plate (HSP) including multiple jet orifices for directing process fluid to the substrate and multiple drain orifices for handling process fluid returning from the substrate and flowing back through the drain orifices.

[0043] It should be understood that the systems and methods described in the independent claims have similar and / or identical preferred embodiments, particularly as defined in the dependent claims. It should be further understood that the preferred embodiments of this disclosure can also be any combination of the dependent claims and the corresponding independent claims.

[0044] These and other aspects of this disclosure will become apparent and will be elucidated from the embodiments described below. Attached Figure Description

[0045] Exemplary embodiments of this disclosure will now be described with reference to the accompanying drawings:

[0046] Figure 1 According to this disclosure, embodiments of a dispensing system for process fluids for chemical and / or electrolytic surface treatment of a substrate are illustrated schematically and exemplary. Detailed Implementation

[0047] Figure 1 An embodiment of a dispensing system 10 for chemical and / or electrolytic surface treatment of a substrate 20 is illustrated schematically and exemplary. The dispensing system 10 includes a dispensing body 11 and a dispensing medium 12.

[0048] In this embodiment, the distribution body 11 is a plate, specifically a high-speed plate (HSP), having multiple openings 13 for process fluid and / or current to guide the process fluid flow F (electrolyte) and / or current density distribution C to the substrate 20. The distribution body 11 is arranged between the anode 21 and the substrate 20 forming the cathode. The distribution system 10 can be immersed in a tank containing at least the process fluid and the anode 21 and the substrate 20.

[0049] The opening 13 is a through-hole extending through the dispensing body 11. The opening 13 has an outlet on the front surface of the dispensing body 11 facing the substrate 20 and the dispensing medium 12. The opening 13 has an inlet on the rear surface of the dispensing body 11 facing the anode.

[0050] Some openings 13 are injection holes 15 for guiding process fluid from the distribution body 11 to the substrate 20 and the distribution medium 12. Some openings 13 are discharge holes 16 for the return of process fluid to drain current returning from the substrate 20 and the distribution medium 12 and passing through the distribution body 11. The discharge holes 16 are arranged adjacent to the injection holes 15. Each discharge hole 16 is assigned to one injection hole. Preferably, there are more discharge holes 16 than injection holes 15.

[0051] The dispensing medium 12 is located on the front surface of the dispensing body 11 facing the substrate 20. The dispensing medium 12 covers the dispensing body 11 and the opening 13 of the dispensing body 11.

[0052] The distribution medium 12 can be understood as a perforated body, such as a porous body, foam, sponge, grid, etc. The distribution medium 12 includes a mesh frame with passages 14 to allow process fluids and / or currents to pass through and through the distribution body 11 and the distribution medium 12, and to disperse the process fluids and / or currents away from the distribution medium 12 and toward the substrate 20.

[0053] The pathways 14 allow the process fluid flow F and / or current C to flow from one side of the distribution medium 12 (here, the first or rear surface facing the distribution body 11) to the other side (here, the second or front or opposite surface facing the substrate 20). The pathways 14 in the distribution medium 12 can be randomly or non-randomly distributed within the bulk material. The pathways 14 in the distribution medium 12 can form a sponge with randomly distributed pathways 14; this means the pathways 14 can be distributed like polymer chains. The pathways 14 in the distribution medium 12 can form a grid with uniformly distributed pathways 14; this means the pathways 14 can be distributed like a grid pattern.

[0054] In this embodiment, the pathways 14 are interconnected, meaning that pathway 14 is connected to at least one other pathway 14 to allow process fluid flow F and / or current C to be transferred from one surface of the distribution medium 12 to another surface of the distribution medium 12. The pathways 14 may also form branches, connections, and / or bypasses.

[0055] The blocky material of the distribution medium 12 between the relatively empty channels 14 can be understood as a mesh, pores, (honeycomb) honeycomb, etc. In this embodiment, the mesh frame comprises several layers of mesh and channels 14. This means that the distribution medium 12 has essentially two or more layers in height (viewed from a surface perpendicular to the distribution medium 12), where the term layer is defined as a mesh arranged adjacent to a channel 14 without stacking. The anchored layers are displaced relative to each other, such that the first channel 14 of the first layer is not flush with the second channel 14 of the second layer laid on top of it.

[0056] It should be noted that the embodiments of this disclosure are described with reference to different subject matters. Specifically, some embodiments are described with reference to method-type claims, while others are described with reference to apparatus-type claims. However, those skilled in the art will recognize from the foregoing and following description that, unless otherwise stated, any combination of features relating to different subject matters is to be considered, in addition to any combination of features belonging to one subject matter, as disclosed with this application. However, all features can be combined to provide more synergistic effects than a simple superposition of features.

[0057] While this disclosure has been detailed and described in the accompanying drawings and foregoing description, such description should be considered illustrative or exemplary, not restrictive. This disclosure is not limited to the disclosed embodiments. Other variations of the disclosed embodiments can be understood and implemented by those skilled in the art through a study of the drawings, the disclosure, and the dependent claims.

[0058] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite terms "an" or "a" do not exclude multiple. A processor or other unit can perform the functions of several items re-referenced in the claims. The mere fact that certain measures are re-referenced in mutually different dependent claims does not indicate that a combination of these measures cannot be used to exert an advantage. Any references in the claims should not be construed as limiting the scope of protection.

Claims

1. A distribution system (10) for chemically and / or electrolytically surface treating a substrate (20), comprising: -Distribution body (11), and -Distribution medium (12) The distributor (11) is arranged between the anode (21) and the substrate (20) forming the cathode. The distribution body (11) is a plate-like body that includes multiple openings (13) for process fluids and / or current. a- Some of the openings (13) are injection holes (15) configured to guide the process fluid from inside the distribution body (11) to the distribution medium (12) and the substrate (20) at an enhanced outlet flow rate; and b- Some of the openings (13) are discharge holes (16) that extend through the distribution body (11) and are configured to discharge backflow of used process fluid returning from the substrate (20) and passing through the distribution body (11) away from the substrate (20), wherein the discharge holes (16) are also configured to direct current from the anode (21) to the substrate (20). The dispensing medium (12) covers at least some of the openings of the dispensing body (11). The distribution medium (12) includes a mesh frame with passages (14) adapted to distribute process fluids and / or currents from the distribution body (11).

2. The distribution system (10) according to claim 1, wherein the mesh frame forms a sponge with randomly distributed pathways (14).

3. The distribution system (10) according to claim 1, wherein the mesh frame forms a grid with uniformly distributed pathways (14).

4. The distribution system (10) according to claim 1, wherein the distribution medium (12) is porous.

5. The distribution system (10) according to claim 4, wherein the porosity of the distribution medium (12) is between 0.1 and 0.

95.

6. The distribution system (10) according to claim 1, wherein the hydraulic conductivity of the distribution medium (12) is 10. -4 Between m / s and 10 m / s.

7. The distribution system (10) according to claim 4, wherein the porosity of the distribution medium (12) is anisotropic.

8. The distribution system (10) according to claim 6, wherein the hydraulic conductivity is anisotropic.

9. The distribution system (10) according to claim 1, wherein the mesh frame comprises a single-layer mesh and pathways (14).

10. The distribution system (10) according to claim 1, wherein the mesh frame comprises at least two layers of mesh and pathways (14).

11. The distribution system (10) according to claim 10, wherein the pathways (14) in adjacent grid layers and pathways (14) are partially displaced relative to each other.

12. The distribution system (10) according to claim 1, wherein the pathways (14) are interconnected.

13. The distribution system (10) according to claim 1, wherein the opening (13) covered by the distribution medium (12) is a jet hole (15).

14. The distribution system (10) according to claim 1, wherein the opening (13) covered by the distribution medium (12) is a discharge port (16).

15. The distribution system (10) according to claim 1, wherein the distribution medium (12) at least partially covers the distribution body (11).

16. A method of manufacturing a process fluid distribution system (10) for chemically and / or electrolytically surface treating a substrate (20), comprising: - Provide a distribution body (11) disposed between the anode (21) and the substrate (20) forming the cathode, wherein the distribution body (11) is a plate-like body including a plurality of openings (13) for process fluid and / or current. a- Some of the openings (13) are injection holes (15) configured to guide the process fluid from inside the distribution body (11) to the distribution medium (12) and the substrate (20) at an enhanced outlet flow rate; and b- Some of the openings (13) are discharge holes (16) that extend through the distribution body (11) and are configured to discharge backflow of used process fluid returning from the substrate (20) and passing through the distribution body (11) away from the substrate (20), wherein the discharge holes (16) are also configured to direct current from the anode (21) to the substrate (20). as well as - Use the distribution medium (12) to cover at least some of the openings (13) of the distribution body (11), wherein the distribution medium (12) includes a mesh frame with passages (14) adapted to distribute process fluids and / or currents from the distribution body (11).

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