A housing, preferably a transistor outline housing, a socket for the housing, and an assembly comprising the housing and / or socket

By designing a socket structure in the TO housing that separates the high thermal conductivity metal socket from the thermoelectric cooler, the problem of insufficient housing cooling capacity is solved, achieving efficient cooling and minimizing signal loss, making it suitable for electronic components that transmit high-frequency data.

CN116157970BActive Publication Date: 2026-06-02SCHOTT AG
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SCHOTT AG
Filing Date
2021-07-28
Publication Date
2026-06-02

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Abstract

The invention relates to a housing for an electronic component, in particular a transistor outline (TO) housing. Furthermore, the invention relates to a socket for a housing, and an assembly for an electronic component comprising such a housing and a thermoelectric cooler.
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