A heat sink and server

Abstract

The application provides a heat sink and a server, the heat sink comprises: a copper sheet, the copper sheet is arranged on the upper part of a CPU and closely adheres to the CPU; a first temperature sensor, the first temperature sensor is arranged on the upper part of the copper sheet and is configured to measure the temperature of the CPU; heat dissipation fins, the heat dissipation fins are vertically arranged on the upper part of the copper sheet, the bottom of the heat dissipation fins closely adheres to the copper sheet, and the heat dissipation fins are arranged at intervals; a copper pipe, the copper pipe is configured in a U shape, the bottom of the copper pipe is in contact with the copper sheet, the copper pipe is arranged perpendicularly to the surface of the heat dissipation fins and passes through the heat dissipation fins through a preset hole on the heat dissipation fins; and a heat dissipation part, the heat dissipation part comprises a fan, the fan is arranged on the upper part of the heat dissipation fins, the fan comprises a transmission structure, the transmission structure is fixedly connected with the copper pipe, and the heat dissipation part is configured to slide the fan out and start the fan to cool the server based on the temperature measured by the first temperature sensor. Through the use of the scheme of the application, the heat dissipation efficiency of the server can be improved, the power consumption of the system can be reduced, the service life of the CPU can be improved, and the working efficiency of the CPU can be ensured.

Description

Technical Field

[0001] This invention relates to the field of computers, and more particularly to a heat sink and a server. Background Technology

[0002] Servers primarily rely on air cooling, which uses system cooling fans to direct airflow and dissipate heat through heatsinks. However, current methods generally have the following problems: system cooling fans cool the entire system, not just a specific component, but the core component of a server is the CPU, which is also the main heat-generating component. The CPU's temperature often affects its performance, and consequently, the overall performance of the server. Air cooling also has its issues. If the CPU temperature is too high, the outflowing air will also be too hot, affecting components behind the heatsink and hindering their cooling, potentially even causing malfunctions in those components. Summary of the Invention

[0003] In view of this, the purpose of this invention is to provide a heat sink and a server. By using the technical solution of this invention, the heat dissipation efficiency of the server can be improved, the power consumption of the system can be reduced, the lifespan of the CPU can be increased, and the working efficiency of the CPU can be guaranteed.

[0004] To achieve the above objectives, one aspect of the present invention provides a heat sink, comprising:

[0005] Copper sheet, which is placed on the upper part of the CPU and closely attached to the CPU;

[0006] The first temperature sensor is located on the upper part of the copper plate and is configured to measure the temperature of the CPU.

[0007] The heat sink is placed vertically on top of the copper sheet, with the bottom of the heat sink in close contact with the copper sheet, and the heat sinks are spaced apart.

[0008] The copper tube is configured in a U-shape, with its bottom in contact with the copper plate. The copper tube is set perpendicular to the surface of the heat sink and passes through the heat sink through a pre-set hole.

[0009] The heat dissipation unit includes a fan, which is mounted on the upper part of the heat sink. The fan includes a transmission structure, which is fixedly connected to a copper pipe. The heat dissipation unit is configured to slide the fan out and turn on the fan to cool the server based on the temperature measured by a first temperature sensor.

[0010] According to one embodiment of the present invention, it further includes:

[0011] The second temperature sensor is located on the back of the heatsink facing the direction of the system fan's airflow.

[0012] According to one embodiment of the present invention, it further includes:

[0013] The fan blade structure is located on the back of the heatsink facing the direction of the system fan's airflow. The fan blade structure is configured to open or close based on the temperature measured by a second temperature sensor.

[0014] According to one embodiment of the present invention, it further includes:

[0015] The heat absorber is placed vertically on top of the copper sheet, with its bottom tightly attached to the copper sheet. The heat absorber is set parallel to the heat sink and is tightly attached to the heat sink at the corresponding position.

[0016] According to one embodiment of the present invention, the heat-absorbing sheet is configured as a hollow sheet structure, and the interior of the heat-absorbing sheet is filled with liquid.

[0017] According to one embodiment of the present invention, the heat dissipation unit includes an upper layer and a lower layer, and the fan includes a first fan, a second fan and a third fan. The first fan is disposed in the lower layer and its area covers the heat sink. The second fan and the third fan are disposed side by side in the upper layer. The second fan has a first groove and slides through the first groove. The third fan has a second groove and slides through the second groove.

[0018] According to one embodiment of the present invention, the transmission structure includes:

[0019] A first motor and a first transmission rod are located on the upper layer. The first motor is connected to the first transmission rod, and the first transmission rod is connected to the second fan. The first motor is configured to drive the first transmission rod to extend or retract.

[0020] The second motor and the second transmission rod are located on the upper layer. The second motor is connected to the second transmission rod, and the second transmission rod is connected to the third fan. The second motor is configured to drive the second transmission rod to extend or retract.

[0021] According to one embodiment of the present invention, the copper tube includes a left copper tube and a right copper tube, the left copper tube being fixedly connected to a first transmission rod, and the right copper tube being fixedly connected to a second transmission rod.

[0022] According to one embodiment of the present invention, it further includes:

[0023] The controller is configured to control the first and second motors to rotate forward or in reverse based on the temperature measured by the first temperature sensor.

[0024] In another aspect of the present invention, a server is also provided, the server including the heat sink described above.

[0025] The present invention has the following beneficial technical effects: The heat sink provided in the embodiments of the present invention includes a copper plate, which is disposed on the upper part of the CPU and closely attached to the CPU; a first temperature sensor, which is disposed on the upper part of the copper plate and configured to measure the temperature of the CPU; a heat sink, which is vertically placed on the upper part of the copper plate, with the bottom of the heat sink closely attached to the copper plate, and the heat sinks are spaced apart; a copper tube, which is configured in a U-shape, with the bottom of the copper tube in contact with the copper plate, and the copper tube is perpendicular to the surface of the heat sink and passes through the heat sink through a pre-set hole on the heat sink; and a heat dissipation part, which includes a fan, which is disposed on the upper part of the heat sink, and the fan includes a transmission structure, which is fixedly connected to the copper tube. The heat dissipation part is configured to slide out and turn on the fan based on the temperature measured by the first temperature sensor to cool the server. This technical solution can improve the heat dissipation efficiency of the server, reduce the power consumption of the system, increase the lifespan of the CPU, and ensure the working efficiency of the CPU. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a heat sink according to an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the back area of ​​a heat sink according to an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the upper fan region according to an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of the side of a fan according to an embodiment of the present invention. Detailed Implementation

[0031] The following describes embodiments of the present disclosure. However, it should be understood that the disclosed embodiments are merely examples, and other embodiments may take various alternative forms. The drawings are not necessarily drawn to scale; certain functions may be exaggerated or minimized to show details of particular components. Therefore, the specific structural and functional details disclosed herein should not be construed as limiting, but merely as a representative basis for teaching those skilled in the art to use the invention in various ways. As will be understood by those skilled in the art, various features shown and described with reference to any of the drawings may be combined with features shown in one or more other drawings to produce embodiments not explicitly shown or described. The combinations of features shown provide representative embodiments for typical applications. However, various combinations and modifications of features consistent with the teachings of this disclosure may be desirable for certain particular applications or implementations.

[0032] Based on the above objectives, a first aspect of the embodiments of the present invention provides an embodiment of a heat sink. Figure 1 The diagram shown is a schematic of the heat sink.

[0033] like Figure 1 As shown, the heat sink may include:

[0034] Copper plate 1 is positioned on the upper part of the CPU and is in close contact with it. Copper plate 1 can quickly absorb the heat generated by the CPU and transfer the heat to the heatsink.

[0035] It also includes a first temperature sensor 2, which is disposed on the upper part of the copper plate 1 and configured to measure the CPU temperature. The first temperature sensor 2 can quickly sense the CPU temperature, transmit the sensed temperature to the control system, and control the fan speed.

[0036] It also includes heat sinks 3, which are placed vertically on top of copper plates 1. The bottom of the heat sinks 3 is in close contact with the copper plates 1, and the heat sinks 3 are spaced apart. Multiple heat sinks 3 are made of aluminum, which is easy to conduct heat, to facilitate rapid heat transfer, increase the area for receiving airflow, and facilitate rapid heat dissipation by air cooling.

[0037] It also includes a copper pipe 4, which is U-shaped. The bottom of the copper pipe 4 contacts the copper plate 1. The copper pipe 4 is perpendicular to the surface of the heat sink 3 and passes through the heat sink 3 through pre-drilled holes. The copper pipe 4 has strong thermal conductivity. Its bottom is close to the CPU, and its top is tightly attached to the heat sink 3 to facilitate rapid heat conduction to the heat sink 3. The upper ends of the copper pipes on the left and right sides are connected to the second and third fans, respectively. When the temperature is too high, the motor rotates and pushes the transmission rod outward, causing the fans and copper pipes to move to both sides, which can increase the heat dissipation area.

[0038] It also includes a heat dissipation unit 5, which includes a fan mounted on top of the heat sink 3. The fan includes a transmission structure fixedly connected to the copper pipe 4. The heat dissipation unit 5 is configured to slide out and turn on the fan to cool the server based on the temperature measured by the first temperature sensor 2. The heat dissipation unit includes an upper layer and a lower layer. The fan includes a first fan 6, a second fan 7, and a third fan 8. The first fan 6 is located on the lower layer, and its area covers the heat sink. The second fan 7 and the third fan 8 are arranged side by side on the upper layer. The second fan has a first sliding groove, and the third fan has a second sliding groove, and the third fan slides through the second sliding groove. The transmission structure includes a first motor 9 and a first transmission rod 10, both located on the upper layer. The first motor 9 is connected to the first transmission rod 10, which in turn is connected to a second fan 7. The first motor 9 is configured to extend or retract the first transmission rod 10. A second motor 11 and a second transmission rod 12 are also located on the upper layer. The second motor 11 is connected to the second transmission rod 12, which in turn is connected to a third fan 8. The second motor 11 is configured to extend or retract the second transmission rod 12. The copper tubes include a left copper tube and a right copper tube. The left copper tube is fixedly connected to the first transmission rod 10, and the right copper tube is fixedly connected to the second transmission rod 12. (See reference...) Figure 3 .

[0039] The technical solution of this invention can improve the heat dissipation efficiency of the server, reduce the power consumption of the system, extend the life of the CPU, and ensure the working efficiency of the CPU.

[0040] In a preferred embodiment of the present invention, such as Figure 2 As shown, it also includes:

[0041] The second temperature sensor 14 is located on the back of the heatsink facing the direction of the system fan's airflow.

[0042] In a preferred embodiment of the present invention, it further includes:

[0043] The fan blade structure 15 is located on the back of the heatsink facing the direction of the system fan's airflow. The fan blade structure 15 is configured to open or close based on the temperature measured by the second temperature sensor 14. The back of the heatsink faces the direction of the system fan's airflow. The fan blade structure can open and close, and a second temperature sensor is also placed on top of it. In the default state, the fan blade structure is open. When the temperature of the airflow from the system fan is higher than a certain value, the fan blade structure closes to prevent the airflow from affecting the CPU temperature. When the airflow temperature is lower than a certain value and lower than the temperature of the CPU's internal temperature sensor, the fan blade structure opens, prompting the airflow to dissipate heat from the heatsink.

[0044] In a preferred embodiment of the present invention, it further includes:

[0045] The heat absorber 13 is placed vertically on the upper part of the copper sheet 1. The bottom of the heat absorber 13 is in close contact with the copper sheet 1. The heat absorber 13 is arranged parallel to the heat sink 3 and is in close contact with the heat sink 3 at the corresponding position.

[0046] In a preferred embodiment of the present invention, the heat-absorbing sheet 13 is configured as a hollow sheet structure, and the interior of the heat-absorbing sheet 13 is filled with liquid. The heat-absorbing sheet is a hollow sheet structure, with its bottom close to the copper sheet, which facilitates rapid heat absorption. The liquid with a high specific heat capacity, such as water, is filled in the middle, which can play a certain role in stabilizing the temperature and preventing the CPU temperature from rising rapidly.

[0047] In a preferred embodiment of the present invention, such as Figure 3 and Figure 4 As shown, the heat dissipation unit includes an upper layer and a lower layer, and the fans include a first fan, a second fan and a third fan. The first fan is disposed on the lower layer and its area covers the heat sink. The second fan and the third fan are disposed side by side on the upper layer. The second fan has a first slide groove and slides through the first slide groove. The third fan has a second slide groove and slides through the second slide groove.

[0048] In a preferred embodiment of the present invention, the transmission structure includes:

[0049] A first motor and a first transmission rod are located on the upper layer. The first motor is connected to the first transmission rod, and the first transmission rod is connected to the second fan. The first motor is configured to drive the first transmission rod to extend or retract.

[0050] The second motor and the second transmission rod are located on the upper layer. The second motor is connected to the second transmission rod, and the second transmission rod is connected to the third fan. The second motor is configured to drive the second transmission rod to extend or retract.

[0051] In a preferred embodiment of the present invention, the copper tube includes a left copper tube and a right copper tube, the left copper tube being fixedly connected to the first transmission rod, and the right copper tube being fixedly connected to the second transmission rod.

[0052] In a preferred embodiment of the present invention, it further includes:

[0053] The controller is configured to control the first and second motors to rotate forward or in reverse based on the temperature measured by the first temperature sensor.

[0054] One aspect of the present invention also provides a method for heat dissipation using the above-described heat sink, wherein the following settings are provided: the temperature sensed by the first temperature sensor is X, the temperature sensed by the second temperature sensor is Y, the units of the following numbers are degrees Celsius, passive heat dissipation is using the system fan for cooling, and the system operating mode is set as follows:

[0055] 1) When 45≥x≥y, the fan blades on the back of the heatsink are open and the heatsink fan is stationary, and the CPU uses passive cooling.

[0056] 2) When 50≥x>45 and x≥y, the fan blades on the back of the heatsink are open, the first fan of the heatsink is at 10% speed, and the CPU uses passive cooling and the heatsink fan's active cooling mode.

[0057] 3) When 55≥x>50 and x≥y, the fan blades on the back of the heatsink are open, the first fan of the heatsink is at 30% speed, and the CPU uses passive cooling and the heatsink fan's active cooling mode.

[0058] 4) When 60 ≥ x > 55 and x ≥ y, the fan blades on the back of the heatsink are open, and the first fan is running at 60% speed. The second and third fans start rotating at 10% speed. At this time, the CPU uses both passive cooling and active cooling modes of the heatsink fans.

[0059] 5) When 65 ≥ x > 60 and x ≥ y, the fan blades on the back of the heatsink are open, and the first fan is at 100% speed. The motor starts working, pushing the transmission rod, which in turn pushes the second and third fans of the heatsink 50% of the way to the sides (50% of the transmission rod's rotation). The second and third fans begin to rotate, increasing their speed by 10% per minute until they reach 50%. At this point, the CPU uses both passive cooling and the heatsink fans' active cooling mode.

[0060] 6) When x > 65 and x ≥ y, the fan blades on the back of the heatsink are open, and the first fan is running at 100% speed. The motor starts working, pushing the transmission rod to move the second and third fans to the sides by 100% (100% of the transmission rod's length). The second and third fans then begin to rotate at 10% speed per minute until they reach 100%. At this point, the CPU uses both passive cooling and the heatsink fans' active cooling mode.

[0061] 7) When 45≥y≥x, the fan blades on the back of the heatsink are open and the first fan of the heatsink is stationary, and the CPU uses passive cooling mode.

[0062] 8) When 50 ≥ y > 45 and y > x,

[0063] ① When x < 45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 5% speed, and the CPU uses the heatsink's active cooling mode.

[0064] ② When x≥45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 15% speed, and the CPU uses the heatsink's active cooling mode.

[0065] 9) When 55 ≥ y > 50, and y > x,

[0066] ① When x < 45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 5% speed, and the CPU uses the heatsink's active cooling mode.

[0067] ② When 50>x≥45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 15% speed, and the CPU uses the heatsink's active cooling mode.

[0068] ③ When 55>x≥50, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 35% speed, and the CPU uses the heatsink's active cooling mode.

[0069] 10) When 60 ≥ y > 55 and y > x,

[0070] ① When x < 45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 5% speed, and the CPU uses the heatsink's active cooling mode.

[0071] ② When 50>x≥45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 15% speed, and the CPU uses the heatsink's active cooling mode.

[0072] ③ When 55>x≥50, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 35% speed, and the CPU uses the heatsink's active cooling mode.

[0073] ④ When 60 > x ≥ 55, the fan blades on the back of the heatsink are closed, and the first fan is running at 65% speed. The second and third fans start rotating at 10% speed. The CPU uses the heatsink's active cooling mode.

[0074] 11) When 65 ≥ y > 60, and y > x,

[0075] ① When x < 45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 5% speed, and the CPU uses the heatsink's active cooling mode.

[0076] ② When 50>x≥45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 15% speed, and the CPU uses the heatsink's active cooling mode.

[0077] ③ When 55>x≥50, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 35% speed, and the CPU uses the heatsink's active cooling mode.

[0078] ④ When 60 > x ≥ 55, the fan blades on the back of the heatsink are closed, and the first fan is running at 65% speed. The second and third fans start rotating at 10% speed. The CPU uses the heatsink's active cooling mode.

[0079] ⑤ When 65 > x ≥ 60, the fan blades on the back of the heatsink are closed, and the first fan is running at 100% speed. The motor starts working, pushing the transmission rod, which in turn pushes the second and third fans of the heatsink 50% of the way to the sides (50% of the transmission rod's length). The second and third fans then begin to rotate at a speed increasing by 10% per minute until they reach 50%. The CPU then uses passive cooling mode.

[0080] 12) When y > 65 and y > x,

[0081] ① When x < 45, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 5% speed, and the CPU uses the heatsink's active cooling mode.

[0082] ② When 50>x≥45, the fan blades on the back of the heatsink are closed, but the first heatsink fan is at 15% speed, and the CPU uses the heatsink's active cooling mode.

[0083] ③ When 55>x≥50, the fan blades on the back of the heatsink are closed, but the first heatsink fan is at 35% speed, and the CPU uses the heatsink's active cooling mode.

[0084] ④ When 60>x≥55, the fan blades on the back of the heatsink are closed, but the first fan of the heatsink is at 65% speed, and the CPU uses the heatsink's active cooling mode.

[0085] ⑤ When 65 > x ≥ 60, the fan blades on the back of the heatsink are closed, but the first fan is running at 100% speed. The motor starts working, pushing the transmission rod, which in turn pushes the second and third fans of the heatsink 50% of the way to the sides (50% of the transmission rod's rotation). The second and third fans then begin to rotate at a speed increasing by 10% per minute until they reach 50%. The CPU uses passive cooling mode.

[0086] ⑥ When 65 > x ≥ 60, the fan blades on the back of the heatsink are closed, and the first fan is at 100% speed. The motor starts working, pushing the transmission rod, which in turn pushes the second and third fans of the heatsink 100% of their original distance to both sides (100% of the transmission rod's length). The second and third fans then begin to rotate at a speed increasing by 10% per minute until they reach 100%. The CPU uses both passive cooling and active cooling modes of the heatsink fans.

[0087] The above operating modes can be adjusted appropriately based on the normal operating conditions of the CPU. For example, the operating temperature of CPUs on other platforms may be 40-60 degrees Celsius, and the strategy can be fine-tuned accordingly.

[0088] The technical solution of this invention can improve the heat dissipation efficiency of the server, reduce the power consumption of the system, extend the life of the CPU, and ensure the working efficiency of the CPU.

[0089] In view of the above objectives, a second aspect of the present invention provides a server that includes the aforementioned heat sink.

[0090] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0091] The above embodiments, especially any "preferred" embodiments, are possible examples of implementation and are presented merely for the purpose of clearly understanding the principles of the invention. Many variations and modifications can be made to the above embodiments without departing from the spirit and principles of the technology described herein. All modifications are intended to be included within the scope of this disclosure and protected by the appended claims.

Claims

1. A radiator, characterized in that, include: A copper sheet is disposed on the upper part of the CPU and is in close contact with the CPU. A first temperature sensor is disposed on the upper part of the copper sheet and configured to measure the temperature of the CPU. A heat sink is placed vertically on top of a copper sheet, with the bottom of the heat sink in close contact with the copper sheet, and the heat sinks are spaced apart. The copper tube is configured in a U-shape, with its bottom in contact with a copper sheet. The copper tube is perpendicular to the surface of the heat sink and passes through a pre-set hole in the heat sink. The heat dissipation unit includes a fan, and further includes an upper layer and a lower layer. The fan includes a first fan, a second fan, and a third fan. The first fan is disposed on the lower layer, and its area covers the heat sink. The fan is disposed on the upper part of the heat sink. The fan includes a transmission structure, which is fixedly connected to a copper pipe. The heat dissipation unit is configured to slide out the second fan, the third fan, and the copper pipe based on the temperature measured by a first temperature sensor, and to turn on the second fan and the third fan to cool the server.

2. The radiator according to claim 1, characterized in that, Also includes: The second temperature sensor is located on the back of the heatsink facing the direction of the system fan's airflow.

3. The radiator according to claim 2, characterized in that, Also includes: The fan blade structure is located on the back of the heat sink facing the direction of the system fan's airflow, and the fan blade structure is configured to open or close based on the temperature measured by a second temperature sensor.

4. The radiator according to claim 1, characterized in that, Also includes: A heat-absorbing sheet is placed vertically on top of the copper sheet, with its bottom tightly attached to the copper sheet. The heat-absorbing sheet is arranged parallel to the heat sink and is tightly attached to the heat sink at the corresponding position.

5. The radiator according to claim 4, characterized in that, The heat-absorbing sheet is configured as a hollow sheet structure, and the inside of the heat-absorbing sheet is filled with liquid.

6. The radiator according to claim 1, characterized in that, The second fan and the third fan are arranged side by side on the upper layer. The second fan has a first slide groove and slides through the first slide groove. The third fan has a second slide groove and slides through the second slide groove.

7. The radiator according to claim 6, characterized in that, The transmission structure includes: A first motor and a first transmission rod are located on the upper layer. The first motor is connected to the first transmission rod, and the first transmission rod is connected to the second fan. The first motor is configured to drive the first transmission rod to extend or retract. The second motor and the second transmission rod are located on the upper layer. The second motor is connected to the second transmission rod, and the second transmission rod is connected to the third fan. The second motor is configured to drive the second transmission rod to extend or retract.

8. The radiator according to claim 7, characterized in that, The copper tube includes a left copper tube and a right copper tube. The left copper tube is fixedly connected to the first transmission rod, and the right copper tube is fixedly connected to the second transmission rod.

9. The radiator according to claim 8, characterized in that, Also includes: The controller is configured to control the first and second motors to rotate forward or in reverse based on the temperature measured by the first temperature sensor.

10. A server, characterized in that, The server includes the heat sink according to any one of claims 1-9.

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