Display panel and manufacturing method thereof

Abstract

This invention discloses a display panel and a method for manufacturing the display panel. The display panel includes: a first substrate and a second substrate, which are disposed opposite to each other; a driving circuit layer is disposed on the surface of the first substrate adjacent to the second substrate; a plurality of light-emitting chips are disposed on the surface of the second substrate adjacent to the first substrate, and a touch layer is also disposed on the second substrate, the touch layer including a plurality of touch electrodes; the vertical projection of the touch layer onto the second substrate does not overlap with the vertical projection of the light-emitting chips onto the second substrate; a plurality of grooves are disposed on the surface of the second substrate, and some of the light-emitting chips are disposed in the grooves, so that the plurality of light-emitting chips are flush with the surface away from the second substrate; the plurality of light-emitting chips are electrically connected to the driving circuit layer. This invention provides a touch setting scheme in which the touch layer does not occupy the internal space of the driving circuit layer, reducing the wiring and manufacturing difficulty of the driving circuit and the touch layer.

Description

Technical Field

[0001] This invention relates to display technology, and more particularly to a display panel and a method for manufacturing the display panel. Background Technology

[0002] Micro-LEDs, with dimensions below 30µm, offer advantages such as long lifespan, direct display, and high brightness. However, due to the complexity of Micro-LED driving and compensation circuits, the space on the driving backplane is limited, leaving no extra space for a touch film layer. Therefore, the planning of the touch film layer has become an urgent problem to be solved. Summary of the Invention

[0003] This invention provides a display panel and a method for manufacturing the display panel, so as to provide a touch setting scheme in which the touch layer does not occupy the internal space of the driving circuit layer, thereby reducing the wiring and manufacturing difficulty of the driving circuit and the touch layer.

[0004] In a first aspect, embodiments of the present invention provide a display panel, comprising:

[0005] A first substrate and a second substrate, wherein the first substrate and the second substrate are disposed opposite to each other;

[0006] A driving circuit layer is disposed on the surface of the first substrate adjacent to the second substrate;

[0007] The second substrate has a plurality of light-emitting chips disposed on its surface adjacent to the first substrate. A touch layer is also disposed on the second substrate, the touch layer including a plurality of touch electrodes. The vertical projection of the touch layer onto the second substrate does not overlap with the vertical projection of the light-emitting chips onto the second substrate. A plurality of grooves are disposed on the surface of the second substrate, and some of the light-emitting chips are disposed in the grooves, so that the plurality of light-emitting chips are flush with the surface of the second substrate away from the surface of the second substrate.

[0008] The plurality of light-emitting chips are electrically connected to the driving circuit layer.

[0009] Optionally, the touch layer is disposed on the same layer as the light-emitting chip; or, the touch layer is disposed on the surface of the second substrate away from the first substrate; or, the second substrate includes a first flexible substrate and a polarizing layer, and the touch layer is disposed between the polarizing layer and the first flexible substrate.

[0010] Optionally, the first flexible substrate is disposed on the side of the polarizing layer adjacent to the light-emitting chip, and the groove is disposed on the surface of the first flexible substrate; or, the polarizing layer is disposed on the side of the first flexible substrate adjacent to the light-emitting chip, and the groove is disposed on the surface of the polarizing layer.

[0011] Optionally, the display panel may also include:

[0012] A protective layer is disposed on the side of the driving circuit layer away from the first substrate, and the protective layer surrounds the light-emitting chip.

[0013] Optionally, the material of the protective layer includes anisotropic conductive film, epoxy resin, or photocurable material.

[0014] Optionally, the driving circuit layer includes a plurality of pads on the side away from the first substrate, and the light-emitting chip is electrically connected to the pads.

[0015] Optionally, the first substrate is a glass substrate or a second flexible substrate; the light-emitting chip is a micro-LED or a mini-LED.

[0016] Secondly, embodiments of the present invention also provide a method for manufacturing a display panel, comprising:

[0017] A first substrate is provided; wherein a driving circuit layer is disposed on the surface of the first substrate adjacent to a second substrate;

[0018] A second substrate is provided; wherein, a plurality of light-emitting chips are disposed on the surface of the second substrate adjacent to the first substrate, and a touch layer is disposed on the second substrate; the touch layer includes a plurality of touch electrodes, the vertical projection of the touch layer on the second substrate does not overlap with the vertical projection of the light-emitting chips on the second substrate, and a plurality of grooves are disposed on the surface of the second substrate, some of the light-emitting chips are disposed in the grooves, so that the plurality of light-emitting chips are flush with the surface of the second substrate away from the surface of the second substrate.

[0019] Multiple light-emitting chips are laminated and electrically connected to the driving circuit.

[0020] Optionally, a second substrate may be provided, including:

[0021] Provide a support layer;

[0022] A second substrate is fabricated on the surface of the support layer;

[0023] A touch layer is fabricated on the surface of the second substrate;

[0024] A light-emitting chip is disposed on the surface of the second substrate.

[0025] Optionally, the second substrate includes a first flexible substrate and a polarizing layer, and providing the second substrate includes:

[0026] Provide a support layer;

[0027] A polarizing layer is fabricated on the surface of the support layer;

[0028] A touch layer is fabricated on the surface of the polarizing layer;

[0029] A first flexible substrate is fabricated on the surface of the touch layer;

[0030] A light-emitting chip is disposed on the surface of a first flexible substrate, wherein the surface of the first flexible substrate is provided with a plurality of grooves.

[0031] Optionally, the second substrate includes a first flexible substrate and a polarizing layer, and providing the second substrate includes:

[0032] Provide a support layer;

[0033] A first flexible substrate is fabricated on the surface of the support layer;

[0034] A touch layer is fabricated on the surface of a first flexible substrate;

[0035] A polarizing layer is fabricated on the surface of the touch layer;

[0036] A light-emitting chip is disposed on the surface of a polarizing layer, wherein the surface of the polarizing layer is provided with multiple grooves.

[0037] Optionally, after laminating and electrically connecting the plurality of light-emitting chips to the driving circuit, the method further includes:

[0038] Remove the support layer.

[0039] Optionally, before laminating and electrically connecting the plurality of light-emitting chips to the driving circuit, the method further includes:

[0040] A protective layer is provided on the side of the driving circuit layer away from the first substrate, and the protective layer covers the driving circuit layer.

[0041] In this embodiment of the invention, both the light-emitting chip and the touch layer are fabricated on the second substrate. Then, the light-emitting chip is laminated and electrically connected to the driving circuit layer on the surface of the first substrate. This prevents the touch layer from occupying the internal space of the driving circuit layer, reducing the wiring and fabrication difficulty of the driving circuit. Furthermore, some of the light-emitting chips are disposed in the grooves on the surface of the second substrate, achieving planarization of the light-emitting chips and making the surfaces of the light-emitting chips adjacent to the driving circuit layer flush, further reducing the difficulty of laminating and electrically connecting the light-emitting chips and the driving circuit layer. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of a display panel provided in an embodiment of the present invention;

[0043] Figure 2 This is a schematic diagram of another display panel provided in an embodiment of the present invention;

[0044] Figure 3 This is a schematic diagram of another display panel provided in an embodiment of the present invention;

[0045] Figure 4This is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;

[0046] Figure 5 This is a schematic diagram of another display panel provided in an embodiment of the present invention;

[0047] Figure 6 This is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;

[0048] Figure 7 This is a process diagram illustrating the fabrication of a second substrate according to an embodiment of the present invention;

[0049] Figure 8 This is a process diagram illustrating the fabrication of a second substrate according to an embodiment of the present invention;

[0050] Figure 9 This is a fabrication diagram of the first substrate provided in an embodiment of the present invention. Detailed Implementation

[0051] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0052] This embodiment provides a display panel. Figure 1 This is a schematic diagram of a display panel provided in an embodiment of the present invention, for reference. Figure 1 The display panel includes:

[0053] The first substrate 10 and the second substrate 20 are disposed opposite to each other.

[0054] A driving circuit layer 30 is disposed on the surface of the first substrate 10 adjacent to the second substrate 20;

[0055] A plurality of light-emitting chips 40 are disposed on the surface of the second substrate 20 adjacent to the first substrate 10. A touch layer 50 is also disposed on the second substrate 20, and the touch layer 50 includes a plurality of touch electrodes. The vertical projection of the touch layer 50 on the second substrate 20 does not overlap with the vertical projection of the light-emitting chips 40 on the second substrate 20. A plurality of grooves 21 are disposed on the surface of the second substrate 20, and some of the light-emitting chips 40 are disposed in the grooves 21, so that the plurality of light-emitting chips 40 are flush with the surface of the second substrate 20 away from it. The plurality of light-emitting chips 40 are electrically connected to the driving circuit layer 30.

[0056] The light-emitting chip is a small light-emitting unit such as Mini-LED or Miro-LED. The first substrate 10 can be a rigid glass substrate or a flexible substrate. The second substrate 20 is a flexible substrate. The touch layer 50 can be directly fabricated on the surface of the second substrate 20 or fabricated inside the second substrate 20. The touch layer 50 includes touch electrodes and touch traces. The touch electrodes can be self-capacitive touch electrodes or mutual-capacitive touch electrodes. The light-emitting chip 40 is directly disposed on the surface of the second substrate 20. Specifically, the touch layer 50 and the light-emitting chip 40 can be fabricated on the second substrate 20, and a driving circuit layer 30 can be fabricated on the surface of the first substrate 10. Then, the light-emitting chip 40 is pressed and electrically connected to the driving circuit layer 30. The light-emitting chip 40 can include a red light-emitting chip 41, a green light-emitting chip 42, and a blue light-emitting chip 43. Since the heights of the different light-emitting chips 40 are different, in order to reduce the difficulty of electrical connection between the light-emitting chips 40 and the driving circuit layer 30, the light-emitting chips 40 need to be planarized. The second substrate 20 can be formed by coating on the support layer. Multiple light-emitting chips 40 can be disposed on the surface of the second substrate 20 before the second substrate 20 is completely cured. Pressure is applied to the multiple light-emitting chips 40 so that a portion of the light-emitting chips 40 is embedded in the second substrate 20, that is, the multiple light-emitting chips 40 are disposed in the groove 21 so that the multiple light-emitting chips 40 are flush with the surface away from the second substrate 20. After the multiple light-emitting chips 40 are pressed together with the driving circuit layer 30, the support layer can be removed.

[0057] In this embodiment, both the light-emitting chip 40 and the touch layer 50 are fabricated on the second substrate 20. Then, the light-emitting chip 40 is pressed and electrically connected to the driving circuit layer 30 on the surface of the first substrate 10. This prevents the touch layer 50 from occupying the internal space of the driving circuit layer 30, reducing the wiring and fabrication difficulty of the driving circuit. Furthermore, some of the light-emitting chips 40 are disposed in the grooves 21 on the surface of the second substrate 20, achieving planarization of the light-emitting chips 40. This makes the surface of the light-emitting chips 40 adjacent to the driving circuit layer 30 flush, reducing the difficulty of pressing and electrically connecting the light-emitting chips 40 and the driving circuit layer 30.

[0058] Figure 2 This is a schematic diagram of another display panel provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of another display panel provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of another display panel provided in an embodiment of the present invention. Optionally, refer to... Figure 1 The touch layer 50 and the light-emitting chip 40 are set on the same layer; or, refer to Figure 2 The touch layer 50 is disposed on the surface of the second substrate 20 away from the first substrate 10; or, refer to Figure 3 and Figure 4The second substrate 20 includes a first flexible substrate 22 and a polarizing layer 23, and the touch layer 50 is disposed between the polarizing layer 23 and the first flexible substrate 22.

[0059] refer to Figure 1 The touch layer 50 and the light-emitting chip 40 are disposed on the same layer, meaning that both the touch layer 50 and the light-emitting chip 40 are fabricated on the surface of the second substrate 20 adjacent to the first substrate 10. The touch layer 50 can be fabricated on the surface of the second substrate 20 after the support layer is coated, and the light-emitting chip 40 can be placed after the touch layer 50 is fabricated. The groove 21 can be formed by photolithography before the touch layer 50 is fabricated, or it can be formed by applying pressure to the light-emitting chip 40 after it is placed; this embodiment does not impose a specific limitation. The co-layering of the touch layer 50 and the light-emitting chip 40 can reduce the thickness of the display panel.

[0060] refer to Figure 2 When the touch layer 50 is disposed on the surface of the second substrate 20 away from the first substrate 10, the touch layer 50 can be directly formed on the surface of the second substrate 20 away from the first substrate 10 after the light-emitting chip 40 is electrically connected to the driving circuit layer 30 and the support layer used in the fabrication of the second substrate 20 is removed.

[0061] refer to Figure 3 When the light-emitting chip 40 is disposed on the surface of the first flexible substrate 22, the touch layer 50 can be directly fabricated on the surface of the polarizing layer 23 after the polarizing layer 23 is fabricated on the support layer, and then the first flexible substrate 22 can be fabricated on the surface of the touch layer 50.

[0062] refer to Figure 4 When the light-emitting chip 40 is disposed on the surface of the polarizing layer 23, the first flexible substrate 22 can be fabricated on the support layer, and then the touch layer 50 can be fabricated on the surface of the first flexible substrate 22, and then the first flexible substrate 22 can be formed on the surface of the touch layer 50.

[0063] refer to Figures 2-4 The touch layer 50 is disposed on the surface of the second substrate 20 away from the first substrate 10; or, when the touch layer 50 is disposed between the polarizing layer 23 and the first flexible substrate 22, the touch layer 50 will not interfere with the light-emitting chip 40 or the driving circuit layer 30, making the fabrication and design of the touch layer 50 easier.

[0064] Optional, see reference Figure 3 The first flexible substrate 22 is disposed on the side of the polarizing layer 23 adjacent to the light-emitting chip 40, and the groove 21 is disposed on the surface of the first flexible substrate 22; or, refer to Figure 4 The polarizing layer 23 is disposed on the side of the first flexible substrate 22 adjacent to the light-emitting chip 40, and the groove 21 is disposed on the surface of the polarizing layer 23.

[0065] Specifically, the groove 21 can be formed directly on the surface of the first flexible substrate 22 and the polarizing layer 23 using a photolithography process. Alternatively, both the first flexible substrate 22 and the polarizing layer 23 can be formed using a coating process. After coating the first flexible substrate 22 or the polarizing layer 23, the light-emitting chip 40 can be directly placed on the surface of the first flexible substrate 22 or the polarizing layer 23. By applying a certain pressure to a portion of the light-emitting chip 40, a groove 21 is formed on the surface of the first flexible substrate 22 or the polarizing layer 23, making the surface of the light-emitting chip 40 flush with the surface of the second substrate 20.

[0066] Figure 5 This is a schematic diagram of another display panel provided in an embodiment of the present invention. Optional, see reference. Figure 5 The display panel also includes:

[0067] A protective layer 70 is disposed on the side of the driving circuit layer 30 away from the first substrate 10, and the protective layer 70 surrounds the light-emitting chip 40.

[0068] Specifically, the protective layer 70 protects and fixes the light-emitting chip 40. During the manufacturing process, a protective material is first placed on the surface of the driving circuit layer 30, and then the light-emitting chip 40 is pressed onto the protective material. By applying pressure, the light-emitting chip 40 squeezes out part of the protective material, thereby achieving an electrical connection between the light-emitting chip 40 and the driving circuit layer 30.

[0069] Optionally, the material of the protective layer 70 may include anisotropic conductive film, epoxy resin, or photocurable material.

[0070] Specifically, the protective layer 70 can be made of materials with high light transmittance, such as anisotropic conductive film, epoxy resin, or photocurable materials. Since the anisotropic conductive film is conductive in the vertical direction, by using anisotropic conductive film material for the protective layer 70, electrical connection between the light-emitting chip 40 and the driving circuit layer 30 can be achieved even if there is some protective material between them.

[0071] In addition, epoxy resin or UV-curable materials have simple manufacturing processes and low material costs, and using these materials can reduce process and material costs.

[0072] Optional, see reference Figure 4 and Figure 5 The driving circuit layer 30 includes a plurality of pads 60 on the side away from the first substrate 10, and the light-emitting chip 40 is electrically connected to the pads 60.

[0073] Optionally, the first substrate 10 is a glass substrate or a second flexible substrate.

[0074] Specifically, when the display panel is a flexible display panel, the first substrate 100 uses a second flexible substrate. During manufacturing, the second flexible substrate can be first fabricated on a support layer, and then a driving circuit layer 30 can be fabricated on the surface of the second flexible substrate. After the light-emitting chip 40 and the driving circuit layer 30 are laminated, the support layer is removed. When the display panel is a rigid display panel, the first substrate 10 is a glass substrate, and the driving circuit layer 30 can be directly fabricated on the surface of the glass substrate. In addition, the materials of the first flexible substrate 22 and the second flexible substrate can both be materials with high light transmittance, such as polyimide (PI), polyethylene (PE), polypropylene (PP), or polydimethylsiloxane (PDMS).

[0075] This invention also provides a method for manufacturing a display panel. Figure 6 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. (Refer to...) Figure 6 The method includes:

[0076] S110. A first substrate is provided, wherein a driving circuit layer is disposed on the surface of the first substrate adjacent to the second substrate.

[0077] S120. A second substrate is provided, wherein a plurality of light-emitting chips are disposed on the surface of the second substrate adjacent to the first substrate, and a touch layer is disposed on the second substrate; the touch layer includes a plurality of touch electrodes, the vertical projection of the touch layer on the second substrate does not overlap with the vertical projection of the light-emitting chips on the second substrate, a plurality of grooves are disposed on the surface of the second substrate, and some of the light-emitting chips are disposed in the grooves, so that the plurality of light-emitting chips are flush with the surface of the second substrate away from the surface of the second substrate.

[0078] S130. The plurality of light-emitting chips are laminated and electrically connected to the driving circuit.

[0079] Figure 7 This is a process diagram illustrating the fabrication of a second substrate according to an embodiment of the present invention. Optionally, refer to... Figure 7 The second substrate includes:

[0080] Provide a support layer of 100;

[0081] A second substrate 20 is fabricated on the surface of the support layer 100;

[0082] A touch layer 50 is fabricated on the surface of the second substrate 20;

[0083] A light-emitting chip 40 is disposed on the surface of the second substrate 20, wherein a plurality of grooves 21 are disposed on the surface of the second substrate 20, and some of the light-emitting chips 40 are disposed in the grooves 21, so that the plurality of light-emitting chips 40 are flush with the surface of the second substrate 20 away from it.

[0084] Specifically, the support layer 100 can be removed after the light-emitting chip 40 is laminated and electrically connected to the driving circuit.

[0085] Figure 8 This is a process diagram illustrating the fabrication of a second substrate according to an embodiment of the present invention. Optionally, refer to... Figure 8 The second substrate includes a first flexible substrate and a polarizing layer, and providing the second substrate includes:

[0086] Provide a support layer of 100;

[0087] A polarizing layer 23 is fabricated on the surface of the support layer 100;

[0088] A touch layer 50 is fabricated on the surface of polarizing layer 23;

[0089] A first flexible substrate 22 is fabricated on the surface of the touch layer 50;

[0090] A light-emitting chip 40 is disposed on the surface of a first flexible substrate 22, wherein a plurality of grooves 21 are disposed on the surface of the first flexible substrate 22, and some of the light-emitting chips 40 are disposed in the grooves 21, so that the plurality of light-emitting chips 40 are flush with the surface of the second substrate away from the surface of the second substrate.

[0091] Optionally, the second substrate includes a first flexible substrate 22 and a polarizing layer 23. A second substrate is provided, and a plurality of light-emitting chips 40 are disposed on the surface of the second substrate adjacent to the first substrate. A touch layer 50 is disposed on the second substrate, including:

[0092] Provide a support layer of 100;

[0093] A first flexible substrate 22 is fabricated on the surface of the support layer 100;

[0094] A touch layer 50 is formed on the surface of the first flexible substrate 22;

[0095] A polarizing layer 23 is fabricated on the surface of the touch layer 50;

[0096] A light-emitting chip 40 is disposed on the surface of the polarizing layer 23, wherein the surface of the polarizing layer 23 is provided with a plurality of grooves 21, and some of the light-emitting chips are disposed in the grooves, so that the plurality of light-emitting chips are flush with the surface away from the second substrate.

[0097] Optionally, after laminating and electrically connecting the plurality of light-emitting chips to the driving circuit, the method further includes:

[0098] Remove support layer 100.

[0099] Figure 9 This is a fabrication diagram of the first substrate provided in an embodiment of the present invention. Optional, refer to... Figure 9 Before laminating and electrically connecting the plurality of light-emitting chips to the driving circuit, the method further includes:

[0100] A protective layer 70 is provided on the side of the driving circuit layer 30 away from the first substrate 10, and the protective layer 70 covers the driving circuit layer 30.

[0101] Specifically, when the surface of the drive circuit layer 30 is provided with solder pads 60, the protective layer 70 covers the solder pads 60 and the drive circuit layer 30.

[0102] In addition, refer to Figure 9 When the first substrate 10 is the second flexible substrate, the second flexible substrate can be fabricated on the support substrate 200. After the light-emitting chip is electrically connected to the driving circuit layer 30, the support substrate 200 is removed.

[0103] The method for manufacturing the display panel provided in this embodiment belongs to the same inventive concept as the display panel provided in any embodiment of the present invention and has the same beneficial effects. For technical details not covered in this embodiment, please refer to the display panel described in any embodiment of the present invention.

[0104] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, include: A first substrate and a second substrate, wherein the first substrate and the second substrate are disposed opposite to each other; A driving circuit layer is disposed on the surface of the first substrate adjacent to the second substrate; A plurality of light-emitting chips are disposed on the surface of the second substrate adjacent to the surface of the first substrate. A touch layer is also disposed on the second substrate, the touch layer including a plurality of touch electrodes. The vertical projection of the touch layer onto the second substrate does not overlap with the vertical projection of the light-emitting chips onto the second substrate. A plurality of grooves are disposed on the surface of the second substrate, and some of the light-emitting chips are disposed in the grooves, so that the plurality of light-emitting chips are flush with the surface of the second substrate away from the light-emitting chips. This reduces the difficulty of bonding and electrically connecting the light-emitting chips to the driving circuit layer. The plurality of light-emitting chips are laminated and electrically connected to the driving circuit.

2. The display panel according to claim 1, characterized in that: The touch layer is disposed on the same layer as the light-emitting chip; or, the touch layer is disposed on the surface of the second substrate away from the first substrate; or, the second substrate includes a first flexible substrate and a polarizing layer, and the touch layer is disposed between the polarizing layer and the first flexible substrate.

3. The display panel according to claim 2, characterized in that: The first flexible substrate is disposed on the side of the polarizing layer adjacent to the light-emitting chip, and the groove is disposed on the surface of the first flexible substrate; or, the polarizing layer is disposed on the side of the first flexible substrate adjacent to the light-emitting chip, and the groove is disposed on the surface of the polarizing layer.

4. The display panel according to claim 1, characterized in that, Also includes: A protective layer is disposed on the side of the driving circuit layer away from the first substrate, and the protective layer surrounds the light-emitting chip.

5. The display panel according to claim 4, characterized in that: The protective layer is made of materials including anisotropic conductive adhesive film, epoxy resin, or photocurable material.

6. The display panel according to claim 1, characterized in that: The first substrate is a glass substrate or a second flexible substrate; the light-emitting chip is a micro-LED or a mini-LED.

7. A method for manufacturing a display panel, characterized in that, include: A first substrate is provided; wherein a driving circuit layer is disposed on the surface of the first substrate adjacent to a second substrate; A second substrate is provided; wherein, a plurality of light-emitting chips are disposed on the surface of the second substrate adjacent to the surface of the first substrate, and a touch layer is disposed on the second substrate; the touch layer includes a plurality of touch electrodes, the vertical projection of the touch layer onto the second substrate does not overlap with the vertical projection of the light-emitting chips onto the second substrate, a plurality of grooves are disposed on the surface of the second substrate, and some of the light-emitting chips are disposed in the grooves, so that the plurality of light-emitting chips are flush with the surface of the second substrate away from the surface; reducing the difficulty of bonding and electrically connecting the light-emitting chips to the driving circuit layer; Multiple light-emitting chips are laminated and electrically connected to the driving circuit.

8. The method according to claim 7, characterized in that, The provision of the second substrate includes: Provide a support layer; The second substrate is fabricated on the surface of the support layer; The touch layer is fabricated on the surface of the second substrate; The light-emitting chip is disposed on the surface of the second substrate; Alternatively, the second substrate includes a first flexible substrate and a polarizing layer, and providing the second substrate includes: Provide a support layer; A polarizing layer is fabricated on the surface of the support layer; A touch layer is fabricated on the surface of the polarizing layer; A first flexible substrate is fabricated on the surface of the touch layer; A light-emitting chip is disposed on the surface of the first flexible substrate, wherein the surface of the first flexible substrate is provided with a plurality of grooves; Alternatively, the second substrate includes a first flexible substrate and a polarizing layer, and providing the second substrate includes: Provide a support layer; A first flexible substrate is fabricated on the surface of the support layer; A touch layer is fabricated on the surface of the first flexible substrate; A polarizing layer is fabricated on the surface of the touch layer; A light-emitting chip is disposed on the surface of the polarizing layer, wherein the surface of the polarizing layer is provided with multiple grooves.

9. The method according to claim 8, characterized in that, After laminating and electrically connecting the plurality of light-emitting chips to the driving circuit, the method further includes: Remove the support layer.

10. The method according to claim 7, characterized in that, Before laminating and electrically connecting the plurality of light-emitting chips to the driving circuit, the method further includes: A protective layer is provided on the side of the driving circuit layer away from the first substrate, and the protective layer covers the driving circuit layer.

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