Display panel and display device

CN116190541BActive Publication Date: 2026-06-26AU OPTRONICS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
AU OPTRONICS CORP
Filing Date
2023-04-06
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

After the display panels are spliced ​​together, the thickness of the flexible circuit board causes seams to appear on the display panels, affecting the continuity of the image.

Method used

By designing a first joint, a first extension, a second extension, and a second joint for the side lines, and using a thin-film flip-chip packaging structure to join to the second joint of the side lines, the bezel width is reduced and the bonding process margin is improved.

Benefits of technology

This reduces the bezel width of the display panel, increases the screen-to-body ratio, and enhances the bonding process margin and maintenance space of the thin-film flip-chip packaging structure.

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  • Figure CN116190541B_ABST
    Figure CN116190541B_ABST
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Abstract

A display panel and a display device, the display panel includes a circuit substrate, a plurality of light emitting elements, a side edge circuit and a thin film flip chip packaging structure. The circuit substrate includes a circuit structure on a first surface. The side edge circuit includes a first bonding portion, a first extending portion, a second extending portion and a second bonding portion. The first bonding portion is disposed on the first surface of the circuit substrate and bonded to the circuit structure. The first extending portion is disposed on a side surface of the circuit substrate. The second extending portion is disposed on a second surface of the circuit substrate and overlaps a peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate and its orthographic projection overlaps a display region. The first bonding portion, the first extending portion, the second extending portion and the second bonding portion are connected in sequence and have the same resistivity. The thin film flip chip packaging structure is bonded to the second bonding portion.
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