Linear lamp array for improved thermal uniformity and profile control

Abstract

Methods and apparatuses for an upper reflector assembly for use in a processing chamber are provided herein. In some embodiments, an upper reflector assembly for use in a processing chamber includes a reflector mounting ring and an upper reflector plate coupled to the reflector mounting ring and having an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels extending substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes an air cooling slot extending from the upper surface to the lower surface.

Description

[0001] This application is a divisional application of the invention patent application filed on October 22, 2020, with application number 202080085703.2 and invention title "Linear Lamp Array for Improved Thermal Uniformity and Contour Control". Technical Field

[0002] The embodiments of this disclosure generally relate to substrate processing equipment. Background Technology

[0003] Some methods of processing substrates (e.g., epitaxial deposition) may be sensitive to the temperature of the processing environment within the processing chamber. For example, one or more components that may affect the temperature of the processing environment may be chamber walls and / or surfaces that may exchange heat with the processing environment. However, a lack of thermal control in an epitaxial deposition chamber can lead to uneven thickness and concentration of the material deposited on the substrate.

[0004] Therefore, the inventors provide an improved device for heating and temperature management in a substrate processing system. Summary of the Invention

[0005] This document provides methods and apparatus for an upper reflector assembly used in a processing chamber. In some embodiments, an upper reflector assembly for use in a processing chamber includes: a reflector mounting ring; and an upper reflector plate coupled to the reflector mounting ring and having an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels extending substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes an air-cooling slot extending from the upper surface to the lower surface.

[0006] In some embodiments, an upper lamp module includes: an upper reflector assembly and a shield assembly. The upper reflector assembly includes a reflector mounting ring coupled to an upper reflector plate. The upper reflector plate has an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels extending substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes an air-cooling slot extending from the upper surface to the lower surface. The shield assembly includes a housing coupled to the lamp mounting ring and a plurality of linear heating lamps coupled to the lamp mounting ring, wherein the lamp mounting ring is removably coupled to the reflector mounting ring, and wherein the plurality of linear heating lamps extend within the plurality of linear channels to reflect heat away from the sidewalls of the plurality of linear channels.

[0007] In some embodiments, an epitaxial chamber includes: a chamber body coupled to an upper dome and a lower dome to define a processing volume of the epitaxial chamber; a support base disposed in the internal volume to support a substrate; an upper reflector plate coupled to the chamber body above the upper dome and having an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels extending substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes an air-cooling slot extending from the upper surface to the lower surface; and a shroud assembly including a lamp mounting ring and a plurality of linear heating lamps coupled to the lamp mounting ring, wherein the plurality of linear heating lamps extend within the plurality of linear channels to reflect heat toward the upper dome away from the sidewalls of the plurality of linear channels.

[0008] Other and further implementations of this disclosure are described below. Attached Figure Description

[0009] The embodiments of this disclosure, which are briefly outlined above and discussed in more detail below, can be understood by referring to the illustrative embodiments depicted in the accompanying drawings. However, the drawings only show typical embodiments of this disclosure and should therefore not be considered as limiting the scope, as other equivalent embodiments are permissible.

[0010] Figure 1 A schematic side view of a processing chamber according to some embodiments of the present disclosure is depicted.

[0011] Figure 2 A partial schematic side view of a processing chamber according to some embodiments of the present disclosure is depicted.

[0012] Figure 3 Isometric cross-sectional views of a processing chamber according to some embodiments of the present disclosure are depicted.

[0013] Figure 4 An isometric view of a lamp clamping mechanism according to some embodiments of the present disclosure is depicted.

[0014] Figure 5 An isometric view of a lamp clamping mechanism according to some embodiments of the present disclosure is depicted.

[0015] Figure 6 Partial equidistant cross-sectional views of an upper lamp module according to some embodiments of the present disclosure are depicted.

[0016] Figure 7 Partial equidistant cross-sectional views of an upper lamp module according to some embodiments of the present disclosure are depicted.

[0017] For ease of understanding, the same reference numerals are used where possible to denote the same elements common in the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be advantageously incorporated into other embodiments without further description. Detailed Implementation

[0018] This document provides an embodiment of an upper lamp module for use in a substrate processing chamber. The upper lamp module includes an upper reflector assembly having a reflector coupled to a shroud assembly having a plurality of linear heating lamps. The reflector is advantageously shaped to focus energy from the plurality of linear heating lamps onto specific locations on the surface of the substrate to be processed, thereby improving thermal uniformity and profile control.

[0019] Figure 1 A schematic side view of a processing chamber 100 according to some embodiments of this disclosure is depicted. In some embodiments, the processing chamber 100 may be a commercially available processing chamber with appropriate modifications, such as any epitaxial deposition reactor available from Applied Materials, Inc., Santa Clara, California (e.g., any Centura® EPI family of processing chambers), or any suitable semiconductor processing chamber that may use a heating lamp as described herein. Other processing chambers using heating lamp assemblies may also benefit from the teachings provided herein.

[0020] In some embodiments, the processing chamber 100 is an epitaxial deposition chamber. The processing chamber 100 typically includes a chamber body 110, a support system 130, a controller 140, and a power source 150. The chamber body 110 typically includes an upper portion 102, a lower portion 104, and a housing 120. A vacuum system 123 may be coupled to the chamber body 110 to facilitate maintaining a desired pressure within the chamber body 110. In some embodiments, the vacuum system 123 may include a throttle valve (not shown) for venting the chamber body 110 and a vacuum pump 119. In some embodiments, the pressure inside the chamber body 110 can be regulated by adjusting the throttle valve and / or the vacuum pump 119.

[0021] The upper part 102 is disposed on the lower part 104 and includes an upper dome 106, a clamping ring 108, a gasket 116, a base plate 112, an upper lamp module 172, and an upper pyrometer 156. The upper lamp module 172 is disposed above the upper dome 106. In some embodiments, the upper dome 106 has a dome-shaped shape factor; however, a cover with other shape factors (e.g., a flat or reverse-curved cover) is also contemplated.

[0022] The lower portion 104 is coupled to the inlet port 114 and the exhaust port 118, and includes a base plate assembly 121, a lower dome 132, a substrate support 124, a preheating ring 122, a substrate lifting assembly 160, a substrate support assembly 164, a lower heating lamp assembly 152, a lower reflector assembly 154, and a lower pyrometer 158. The upper dome 106 and the lower dome 132 are coupled to the chamber body 110 to define a processing volume 148 of the processing chamber 100. The substrate support 124 is disposed in the processing volume 148 to support the substrate 101. In some embodiments, the substrate 101 may be a semiconductor wafer, such as a 150mm, 200mm, 300mm, 450mm wafer or the like, or any other substrate type used in film manufacturing processes. In some embodiments, the substrate 101 may be a patterned substrate.

[0023] Although the term "ring" is used to describe certain components of the processing chamber 100, such as the preheating ring 122, these components do not necessarily have to be circular in shape and can include any shape, including but not limited to rectangular, polygonal, elliptical, and similar shapes. In some embodiments, a gas supplier 117 may supply one or more processing gases to the processing chamber 100 via an inlet port 114. In such embodiments, a valve or mass flow controller 115 may be coupled to the gas supplier 117 to control the flow rate of the processing gas from the gas supplier 117. The upper dome 106, the clamping ring 108, and the lower dome 132 are formed of quartz; however, other IR-transparent and processing-compatible materials may also be used to form these components.

[0024] During processing, substrate 101 is mounted on substrate support 124. One or more heating lamp assemblies (e.g., heating lamp assembly 238, lower heating lamp assembly 152, hereinafter referred to as heating lamps) are infrared (IR) radiation (e.g., heat) sources used to generate a predetermined temperature distribution across substrate 101. The one or more heating lamp assemblies receive power from power source 150.

[0025] The substrate support assembly 164 typically includes a support bracket 134 having a plurality of support pins 166 coupled to the substrate support member 124. The substrate lifting assembly 160 includes a substrate lifting shaft 126 and a plurality of lifting pin modules 161 selectively resting on respective pads 127 of the substrate lifting shaft 126. In some embodiments, the lifting pin module 161 includes an optional upper portion of a lifting pin 128 movably configured to pass through a first opening 162 in the substrate support member 124. In operation, the substrate lifting shaft 126 moves to engage the lifting pin 128. When engaged, the lifting pin 128 can raise the substrate 101 above or lower the substrate 101 onto the substrate support member 124.

[0026] Support system 130 includes components for performing and monitoring a predetermined process (e.g., growing an epitaxial film) within processing chamber 100. Such components typically include various subsystems (e.g., multiple gas panels, gas distribution conduits, vacuum and exhaust subsystems, and the like) and means for processing chamber 100 (e.g., power supply, processing control instruments, and the like). These components are well known to those skilled in the art and are omitted from the drawings for clarity.

[0027] A controller 140 may be provided and coupled to the processing chamber 100 for controlling components of the processing chamber 100. The controller 140 may be any suitable controller for controlling the operation of the substrate processing chamber. The controller 140 typically includes a central processing unit (CPU) 142, memory 144, and support circuitry 146, and is directly coupled to and controls the processing chamber 100, support system 130, and power source 150 (e.g., [missing information]). Figure 1 (as shown), or alternatively, coupled via a computer (or controller) associated with the processing chamber and / or support system.

[0028] CPU 142 can be any form of general-purpose computer processor that can be used in an industrial environment. Support circuitry 146 is coupled to CPU 142 and may include cache, clock circuitry, input / output subsystems, power supplies, and the like. Software routines may be stored in memory 144 of controller 140. When executed by CPU 142, the software routines transform CPU 142 into a dedicated computer (controller) 140. Software routines may also be stored and / or executed by a second controller (not shown) located remotely from controller 140. Alternatively or in combination, in some embodiments, such as when processing chamber 100 is part of a multi-chamber processing system, each processing chamber of the multi-chamber processing system may have a corresponding controller for controlling portions of the inventive methods disclosed herein that can be executed in that particular processing chamber. In such embodiments, the respective controllers may be configured similarly to controller 140 and may be coupled to controller 140 to synchronize the operation of processing chamber 100.

[0029] Figure 2A partial schematic side view of a processing chamber 100 according to some embodiments of this disclosure is depicted. In some embodiments, the upper lamp module 172 includes a shroud assembly 229 removably coupled to the upper reflector assembly 236. In some embodiments, the shroud assembly 229 includes a housing 202 coupled to a lamp mounting ring 208 disposed therein. In some embodiments, the lamp mounting ring 208 is coupled to the housing 202 via one or more brackets 212. The housing 202 is typically an annular body having a central opening 204. In some embodiments, the housing 202 may partially define a housing 120. The sidewalls of the housing 202 include exhaust ports 214 to provide a gas outlet for any gas (such as air) introduced through the central opening 204.

[0030] Lamp mounting ring 208 is coupled to heating lamp assembly 238. Heating lamp assembly 238 includes a plurality of linear heating lamps 222 extending across a central opening of lamp mounting ring 208. In some embodiments, an annular heat shield 228 is coupled to lamp mounting ring 208. In some embodiments, an annular heat shield 228 is coupled to first protrusion 220 in any suitable manner (e.g., via fastener 226). An annular heat shield 228 advantageously reflects heat from the linear heating lamps 222 toward upper dome 106. In some embodiments, an annular heat shield 228 is gold-plated.

[0031] The upper reflector assembly 236 includes a reflector mounting ring 206 disposed around and coupled to the upper surface 217 of the upper reflector plate 224. The upper reflector plate 224 is disposed above the upper dome 106. The lower surface 248 of the upper reflector plate 224 includes a plurality of linear channels 244 extending substantially parallel to each other across the lower surface 248. A plurality of linear heating lamps 222 extend within the plurality of linear channels 244 to reflect heat away from the sidewalls of the plurality of linear channels 244 and direct heat toward the upper dome 106. The plurality of linear channels 244 have different cross-sectional shapes to focus peak radiation at specific locations on the wafer, enabling temperature control at these locations. In some embodiments, the plurality of linear channels 244 have at least one of a U-shaped cross-section, a V-shaped cross-section, an elliptical cross-section, a parabolic cross-section, or a rectangular cross-section. The lower surface 248 of the upper reflector plate 224 may be designed to deliver irradiation peaks at numerous locations across the entire substrate 101 to advantageously achieve better thermal profile control. In some embodiments, the plurality of linear channels 244 comprises up to ten linear channels. In some embodiments, the upper reflector plate is configured to produce as many irradiation peaks as the number of lamps in the plurality of linear heating lamps 222. In some embodiments, the upper reflector plate 224 is gold-plated. In some embodiments, the upper reflector plate 224 comprises multiple portions coupled together to form a disc-shaped plate.

[0032] In some embodiments, the upper reflector assembly 236 includes an inner housing 246 coupled to the top surface of the reflector mounting ring 206. A top plate 250 having an air inlet 256 is coupled to the top of the inner housing 246 to define an internal air volume 254 therein. The air inlet 256 is coupled to an air supply duct 270 and fluidly coupled to an exhaust port 214. In some embodiments, one or more flow turning blades 260 are disposed between the top plate 250 and the upper reflector plate 224 to divert airflow from the air inlet 256 and direct airflow to various regions of the upper reflector plate 224. In some embodiments, one or more flow turning blades 260 are coupled to the upper surface 217 of the upper reflector plate 224. In some embodiments, the upper reflector assembly 236 includes a flange 215 coupled to the inner housing 246 and extending radially outward to mate with the outer housing 202.

[0033] The upper reflector plate 224 includes an air-cooling slot 242 extending from the upper surface 217 to the lower surface 248. The upper reflector assembly 236 and the shroud assembly 229 are configured to allow air to flow from the air inlet 256 through the air-cooling slot 242 and the annular heat shield 228 of the upper reflector plate 224 to the exhaust port 214. In some embodiments, the air-cooling slot 242 includes a plurality of first slots 258 configured to direct airflow toward a plurality of linear heating lamps 222 to cool the plurality of linear heating lamps 222 to maintain a target lamp temperature. In some embodiments, the target lamp temperature is less than 800 degrees Celsius. In some embodiments, the plurality of first slots 258 advantageously extend at an angle of less than 90 degrees relative to the upper surface 217 of the upper reflector plate 224 to control the amount of cooling air reaching the plurality of linear heating lamps 222 relative to the cooling air supplied to the upper dome 106. In some embodiments, the air-cooled slot 242 includes a plurality of second slots 262 to advantageously cool the upper dome 106 to maintain a target upper dome temperature. In some embodiments, the target upper dome temperature is about 200 to about 600 degrees Celsius. In some embodiments, the plurality of first slots 258 are smaller than the plurality of second slots 262. The air-cooled slot 242 is sized to provide sufficient back pressure for slot-to-slot flow uniformity. In some embodiments, the plurality of second slots 262 extend orthogonally to the upper surface 217 of the upper reflector plate 224.

[0034] In some embodiments, the lamp mounting ring 208 includes a plurality of first protrusions 220 extending radially inward from the lamp mounting ring 208. In some embodiments, a plurality of alignment pins 216 are coupled to the lamp mounting ring 208. In some embodiments, each of the plurality of alignment pins 216 is coupled to a corresponding protrusion of the first protrusion 220. In some embodiments, the plurality of alignment pins 216 are coupled to the first protrusion 220 via fasteners 232. The plurality of alignment pins 216 are configured to extend through an opening 218 in the reflector mounting ring 206 to align the lamp mounting ring 208 and removably couple it to the reflector mounting ring 206. The removable coupling of the lamp mounting ring 208 to the reflector mounting ring 206 allows the reflector mounting ring 206 to be advantageously and easily removed for access to the linear heating lamp 222 for replacement and for access to the interior of the processing chamber 100 for visual inspection. In some embodiments, the lamp mounting ring 208 includes one or more pins 252 extending from the lower surface of the lamp mounting ring 208 to align the lamp mounting ring 208 with the clamping ring 108.

[0035] Multiple linear heating lamps 222 are positioned as close as possible to the upper dome 106 to improve radiation efficiency and thermal control, yet at a sufficient distance to prevent localized cold spots that could lead to parasitic deposits on the inner side of the upper dome 106. In some embodiments, the multiple linear heating lamps 222 are positioned approximately 25.0 to approximately 150.0 mm away from the upper dome 106. This proximity between the multiple linear heating lamps 222 and the upper dome 106 advantageously allows for improved radiation efficiency, thus requiring less power to reach the processing temperature. The close proximity also advantageously enables effective dome cooling because the gas flow through the multiple air cooling slots 242 directly impacts the dome, improving convective heat transfer.

[0036] Figure 3 Partial equidistant cross-sectional views of a processing chamber according to some embodiments of the present disclosure are depicted. In some embodiments, a plurality of linear heating lamps 222 extend through a cutout 302 in an annular heat shield 228. In some embodiments, the plurality of linear heating lamps 222 are halogen tungsten lamps. In some embodiments, a first end 308 of each of the plurality of linear heating lamps 222 is coupled to a lamp mounting ring 208 via a lamp clamping mechanism 306. In some embodiments, each of the plurality of linear heating lamps 222 is coupled to a power line 310 to provide power to the plurality of linear heating lamps 222. In some embodiments, the plurality of linear heating lamps 222 comprises up to ten lamps for processing a 300 mm semiconductor substrate. Each of the plurality of linear heating lamps 222 includes a filament 304. The total length of each of the multiple linear heating lamps 222 is greater than the length of the lit filament, so that the first end 308 with the lamp clamping point (e.g., clamping portion 404), which is the structurally weaker part of the multiple linear heating lamps 222, is moved away from the hot area of ​​the processing chamber 100.

[0037] Multiple linear heating lamps 222 have different dimensions to maximize the length of filament 304 within a circular processing volume 148. For example, the length of the lamps extending over the central region within the lamp mounting ring 208 is typically longer than the length of the lamps extending over the peripheral region within the lamp mounting ring 208. The filament 304 can emit a continuous radiant flux along the axis of each of the multiple linear heating lamps 222, or the filament 304 can be profiled to allow for varying the radiant flux along the axis of each of the multiple linear heating lamps 222. For example, lamp 222A of the multiple linear heating lamps 222 features a profile-adjusted filament 304 with gaps between the coil portions of the filament 304 to vary the radiant flux along the axis of lamp 222A. The length of the filament 304 and the radiant profile of the filament 304 along the axis are selected to adjust the irradiation profile on the substrate 101.

[0038] Multiple linear heating lamps 222 can be oriented such that the lamp axis is parallel or perpendicular to the gas flow path of the process gas (e.g., from gas supply 117). Figure 2 As shown, the lamps are oriented perpendicular to the gas flow path. In addition to the ability of the multiple linear heating lamps 222 to control the thermal profile on substrate 101, the lamp closest to the inlet port 114 can also be used to vary the temperature of the preheating ring 122 and / or the substrate support to allow for different gas preheating temperatures. This additional control over the temperature of the preheating ring 122 and / or the substrate support advantageously provides an additional tuning nob for thickness and / or concentration uniformity on substrate 101. When the multiple linear heating lamps 222 are oriented parallel to the flow path, the temperatures of the liner 116 and the preheating ring 122 at the leading and trailing edges of the gas flow path may be lower. Lower temperatures at the leading and trailing edges of the gas flow path of the liner 116 and the preheating ring 122 can advantageously reduce parasitic deposition on the liner 116 and the preheating ring 122, advantageously increase the deposition rate, and advantageously reduce the time required to perform in-situ cleaning of the processing chamber 100.

[0039] Figure 4 Isometric views of a lamp clamping mechanism 306 according to some embodiments of the present disclosure are depicted. In some embodiments, the lamp mounting ring 208 includes a plurality of second protrusions 406 extending radially inward from the lamp mounting ring 208. In some embodiments, the lamp clamping mechanism 306 includes a mounting block 402 coupled to the lamp mounting ring 208. In some embodiments, the lamp clamping mechanism 306 is coupled to each of the plurality of second protrusions 406. The mounting block 402 includes a first side 408 and a second side 410 and a slot 414 disposed between the first side 408 and the second side 410. The slot 414 is configured to receive a plurality of linear heating lamps 222. In some embodiments, the upper surface 418 of the mounting block 402 along the slot 414 is profiled to position each of the plurality of linear heating lamps 222. The first end 308 of the plurality of linear heating lamps 222 includes a clamping portion 404, where the plurality of linear heating lamps 222 have a rectangular cross-sectional profile, in contrast to the circular cross-sectional profile of the rest of the plurality of linear heating lamps 222.

[0040] In some embodiments, the lamp clamping mechanism 306 includes a rear block 430 coupled to the mounting block 402 and disposed in a slot 414. In some embodiments, the rear block 430 has an opening 426 to receive a power line 310. In some embodiments, the rear block 430 includes a slot 424 extending from the opening 426 to an outer surface of the rear block 430. In some embodiments, a clamping portion 404 is disposed in the slot 424 to prevent rotational movement of each of the plurality of linear heating lamps 222 relative to the mounting block 402.

[0041] Mounting block 402 includes a clamp 412 rotatably coupled to a first side 408 of mounting block 402. In some embodiments, clamp 412 includes a body 403 coupled to a first end 405 of arm 407. A second end 420 of arm 407 includes a pin 422. In use, the second end 420 of arm 407 swings over each of the plurality of linear heating lamps 222 to the second side 410 such that pin 422 can enter an opening 428 in the second side 410 to hold each lamp between arm 407 and upper surface 418. In some embodiments, pin 422 is threaded to engage a corresponding thread provided in the opening 428.

[0042] Figure 5 An isometric view of a lamp clamping mechanism 306 according to some embodiments of this disclosure is depicted. From Figure 5 The lamps of the multiple linear heating lamps 222 are omitted to avoid obscuring the details of the lamp holding mechanism 306. In some embodiments, the lamp holding mechanism 306 includes a mounting block 502 coupled to a lamp mounting ring 208. In some embodiments, the mounting block 502 is coupled to each of a plurality of second protrusions 406. In some embodiments, the mounting block 502 includes a body 516 and a raised portion 520. The raised portion includes an upper surface 518, which is profiled to position each of the plurality of linear heating lamps 222.

[0043] Mounting block 502 includes a first side 508 and a second side 510. In some embodiments, clamp 512 is rotatably coupled to the body 516 of mounting block 502. In some embodiments, clamp 512 includes a first pin 503 rotatably coupled to mounting block 502 and an arm 507 coupled to the first pin 503. In some embodiments, a second pin 505 is coupled to mounting block 502. Arm 507 includes a recess 522 configured to receive the second pin 505 when the arm 507 rotates toward the second pin 505. The second pin 505 is configured to prevent further rotation of the arm 507. In some embodiments, the first pin 503 is located near the first side 508, and the second pin 505 is located near the second side 510. In some embodiments, the first pin 503 is located near the second side 510, and the second pin 505 is located near the first side 508. The lamps of the multiple linear heating lamps 222 are held between the first pin 503 and the second pin 505 and between the arm 507 and the body 516.

[0044] In some embodiments, the lamp clamping mechanism 306 includes a rear block 530 disposed on the lamp mounting ring 208. In some embodiments, the lamp clamping mechanism 306 includes a pin 532 extending through the rear block 530 and coupled to a mounting block 502, such that the rear block 530 is laterally movable along the pin 532. A biasing element 534 is disposed around the pin 532 between the head 536 of the pin 532 and the rear block 530 to push the rear block 530 and each of the plurality of linear heating lamps 222 toward the mounting block 502. The biasing element 534 pushes one end opposite to a first end 308 of each of the plurality of linear heating lamps 222 toward a fixed position block (not shown) to provide repeatable axial alignment of each lamp relative to the mounting block 502. The rear block 530 can be pushed toward the head 536 to facilitate the installation and removal of each of the plurality of linear heating lamps 222. In some embodiments, the rear block 530 has an opening 526 to receive a power line 310. In some embodiments, the rear block 530 includes a slot 524 extending from the opening 526 to the outer surface of the rear block 530. In some embodiments, a clamping portion 404 is provided in the slot 524 to prevent rotational movement of each of the plurality of linear heating lamps 222 relative to the mounting block 502.

[0045] Figure 6 Partial isometric cross-sectional views of an upper lamp module according to some embodiments of the present disclosure are depicted. In some embodiments, the upper reflector plate 224 is cooled to reduce or prevent plating defects. In some embodiments, the upper surface 217 of the upper reflector plate 224 includes a plurality of coolant channels 604. In some embodiments, the plurality of coolant channels 604 extend parallel to a plurality of linear heating lamps 222. Cooling pipes 606 are disposed in the plurality of coolant channels to circulate coolant therethrough. Cooling pipes 606 are coupled at one end to an inlet 610 and at the other end to an outlet 612. In some embodiments, the number of the plurality of coolant channels 604 corresponds to the number of the plurality of linear channels 244.

[0046] Figure 7 Partial isometric cross-sectional views of an upper lamp module according to some embodiments of the present disclosure are depicted. In some embodiments, a mounting block 702 is disposed on a top plate 250. In some embodiments, one or more temperature sensors 708 for measuring the temperature of at least one of the upper dome 106 and the substrate 101 are mounted to the mounting block 702. The mounting block 702 and the top plate 250 include an opening 717 to provide an optical path from the one or more temperature sensors 708 to the upper dome 106. In some embodiments, the one or more temperature sensors 708 are pyrometers. In some embodiments, a shielding tube 724 extends from the one or more temperature sensors 708 and into an internal air volume 254 to shield the one or more temperature sensors 708 from thermal noise.

[0047] In some embodiments, one or more lasers 706 are mounted to mounting block 702 to transfer photon energy to substrate 101 to provide localized point heating during processing. Localized point heating can increase the deposition rate on a target area of ​​substrate 101. Mounting block 702 and top plate 250 include openings 718 to provide a path for one or more lasers 706 toward upper dome 106. In some embodiments, shielding tubes 728 extend from one or more lasers 706 and into internal air volume 254. In some embodiments, one or more lasers 706 include alignment features to adjust the laser head, thereby precisely positioning the laser head. In some embodiments, one or more lasers 706 are positioned between 0.0 mm and 160.0 mm from the center of upper dome 106. In some embodiments, where upper 102 includes one or more flow deflector blades 260, openings 704 are provided in one or more flow deflector blades 260 to provide a laser path for one or more lasers 706 and an optical path for one or more temperature sensors 708 passing through the openings 704.

[0048] In some embodiments, the upper reflector plate 224 includes an opening 704 for a laser path for one or more lasers 706 and an optical path for one or more temperature sensors 708. In some embodiments, a transparent window 710 is positioned above the opening 704 to reduce or prevent localized cold spots on the upper dome 106 caused by cooling air passing through the opening 704. The transparent window 710 is made of a material suitable for transmitting signals from at least one of the substrate 101 or the upper dome 106 to one or more temperature sensors 708. In some embodiments, the transparent window 710 is configured to transmit signals having a wavelength of about 2.5 micrometers to about 5.0 micrometers. In some embodiments, the transparent window 710 is coated with a suitable material for transmitting signals with a wavelength of about 2.5 micrometers to about 5.0 micrometers. In some embodiments, the coating on the transparent window 710 is an anti-reflective coating. In some embodiments, the transparent window 710 is made of quartz or calcium fluoride (CaF2). In some embodiments, the transparent window 710 is made of transparent quartz for temperature measurement of the substrate 101. Quartz can be used to minimize signal loss from substrate 101 to one or more temperature sensors 708. In some embodiments, a transparent window 710 is made of CaF2 for measurement of the upper dome 106. CaF2 can be used to minimize signal loss from the upper dome 106 to one or more temperature sensors 708.

[0049] In some embodiments, one or more temperature sensors 708 may be used to calibrate the amount of power supplied to each of the plurality of linear heating lamps 222 to achieve a specific temperature of substrate 101 for a given temperature setpoint. In some embodiments, one or more temperature sensors 708 are positioned across upper reflector plate 224. For example, calibration may be performed periodically or during any lamp replacement.

[0050] Although the foregoing relates to embodiments of this disclosure, other and further embodiments of this disclosure may be designed without departing from the basic scope of this disclosure.

Claims

1. An epitaxial deposition chamber, comprising: A chamber body coupled to an upper dome and a lower dome to define the processing volume of the epitaxial deposition chamber; A support base disposed in the processing volume to support the substrate; Upper reflector plate, the upper reflector plate being coupled to the chamber body above the upper dome, the upper reflector comprising: upper surface; Lower surface; Multiple linear channels, the multiple linear channels extending substantially parallel to each other across the lower surface; and A plurality of air-cooling slots extending from the upper surface to the lower surface, wherein the plurality of air-cooling slots include a plurality of first slots and a plurality of second slots, the plurality of first slots having a shallower depth than the plurality of second slots, wherein the plurality of first slots extend at an angle of less than 90 degrees relative to the upper surface of the upper reflector plate; and A shield assembly including a lamp mounting ring and a plurality of linear heating lamps coupled to the lamp mounting ring, wherein the plurality of linear heating lamps extend within the plurality of linear channels to reflect heat toward the upper dome away from the sidewalls of the plurality of linear channels.

2. The epitaxial deposition chamber of claim 1, wherein the second slot extends perpendicular to the upper surface.

3. The epitaxial deposition chamber of claim 1, wherein the plurality of linear channels extend substantially parallel to each other across the lower surface, wherein each of the plurality of linear channels has one of a U-shaped cross-section, a V-shaped cross-section, an elliptical cross-section, a parabolic cross-section, or a rectangular cross-section, and one or more of the plurality of linear channels have different cross-sectional shapes.

4. The epitaxial deposition chamber of claim 1, wherein the plurality of linear heating lamps are positioned at a distance of about 25.0 to about 150.0 mm from the upper dome.

5. The epitaxial deposition chamber of claim 1, wherein the upper surface of the upper reflector plate includes a plurality of coolant channels, and a cooling pipe is disposed in the plurality of coolant channels to circulate coolant through the cooling pipe.

6. The epitaxial deposition chamber of claim 1, wherein the air cooling slot comprises a plurality of first slots configured to cool the plurality of linear heating lamps and a plurality of second slots configured to cool the upper dome of the epitaxial deposition chamber.

7. The epitaxial deposition chamber of claim 1, wherein the upper reflector plate includes an opening through the upper reflector plate, the opening being covered by a transparent window, and a temperature sensor is mounted to the upper part of the epitaxial deposition chamber to measure the temperature of at least one of the upper dome or the substrate disposed on the support base through the transparent window.

8. The epitaxial deposition chamber according to claim 7, wherein the transparent window is made of quartz or calcium fluoride (CaF2).

9. An epitaxial deposition chamber, comprising: A chamber body coupled to an upper dome and a lower dome to define the processing volume of the epitaxial deposition chamber; Upper reflector plate, the upper reflector plate being coupled to the chamber body above the upper dome, the upper reflector plate comprising: upper surface; Lower surface; and Multiple channels are formed in the lower surface; A plurality of air-cooling slots extend from the upper surface of the upper reflector plate to the lower surface, wherein the plurality of air-cooling slots include a plurality of first slots and a plurality of second slots, and the plurality of first slots have a shallower depth than the plurality of second slots, wherein the plurality of first slots extend at an angle of less than 90 degrees relative to the upper surface of the upper reflector plate. and Multiple heating lamps are coupled to a lamp mounting ring, wherein the multiple heating lamps extend within multiple channels to reflect heat toward the upper dome away from the sidewalls of the multiple channels, and Mounting block, coupled to the lamp mounting ring, wherein the mounting block includes a first side and a second side and a slot disposed between the first side and the second side, wherein the slot is configured to accommodate one of the plurality of heating lamps.

10. The epitaxial deposition chamber of claim 9, wherein one of the plurality of heating lamps is positioned by adjusting the profile of the upper surface of the mounting block along the slot.

11. The epitaxial deposition chamber of claim 9, wherein the upper reflector plate further comprises: Each of the plurality of air-cooled slots is configured to guide gas across a portion of the surface of one of the plurality of heating lamps and the surface of the upper dome.

12. The epitaxial deposition chamber of claim 9, wherein the plurality of second slots extend perpendicular to the upper surface.

13. The epitaxial deposition chamber of claim 11, wherein the air cooling slot comprises a plurality of first slots configured to cool the plurality of linear heating lamps and a plurality of second slots configured to cool the upper dome of the epitaxial deposition chamber.

14. The epitaxial deposition chamber of claim 9, wherein the plurality of channels extend substantially parallel to each other across the lower surface, wherein each of the plurality of channels has one of a U-shaped cross-section, a V-shaped cross-section, an elliptical cross-section, a parabolic cross-section, or a rectangular cross-section, and one or more of the plurality of channels have different cross-sectional shapes.

15. The epitaxial deposition chamber of claim 9, wherein the plurality of heating lamps are positioned at a distance of about 25.0 to about 150.0 mm from the upper dome.

16. The epitaxial deposition chamber of claim 9, wherein the upper surface of the upper reflector plate includes a plurality of coolant channels, and a cooling pipe is disposed in the plurality of coolant channels to circulate coolant through the cooling pipe.

17. The epitaxial deposition chamber of claim 9, wherein the upper reflector plate includes an opening through the upper reflector plate, the opening being covered by a transparent window, and a temperature sensor is mounted to the upper part of the epitaxial deposition chamber to measure the temperature of at least one of the upper dome or the substrate disposed on the support base through the transparent window.

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