Display method of substrate arrangement data, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

Abstract

A display method of substrate arrangement data includes a setting step of setting a transfer parameter that determines arrangement of a predetermined substrate loaded into a substrate holder and carrier information of the predetermined substrate loaded into the substrate holder, respectively; a creation step of creating substrate arrangement data in a case where the substrate is loaded into the substrate holder, based on the set transfer parameter and the carrier information; and a display step of displaying at least data indicating arrangement of the substrate in a state where the substrate is loaded into the substrate holder, when the substrate arrangement data is displayed.

Description

Technical Field

[0001] This disclosure relates to a method for displaying substrate configuration data, a method for manufacturing a semiconductor device, a substrate processing apparatus, and a recording medium. Background Technology

[0002] Recently, with the continuous miniaturization and 3D development of devices, substrate processing has become more diversified, and the types and complexity of substrate transfer conditions have increased. Until now, as with Japanese Patent Application Publication Nos. 2009-231748 and 2009-135418, it has been possible to display and confirm the substrate transfer status. However, currently, it is impossible to confirm the transfer status before the actual substrate is transported. Therefore, operators need to fully understand the transfer conditions and calculate the transfer status in the same way as the controller.

[0003] Consequently, operators may find it difficult to control the transfer conditions, potentially leading to undesirable substrate transfer situations. In such cases, reduced production efficiency may result from equipment shutdowns due to insufficient substrates, and reduced substrate processing quality may occur due to changes in processing conditions, resulting in substrate loss. Summary of the Invention

[0004] The problem that the invention aims to solve

[0005] The purpose of this disclosure is to provide a technique for confirming the configuration of a substrate in a substrate holder before transferring the substrate to the substrate holder.

[0006] Methods for solving problems

[0007] According to one aspect of this disclosure, a technique is provided comprising: steps of setting transfer parameters that determine the configuration of at least a predetermined substrate to be loaded into a substrate holder and carrier information for accommodating the predetermined substrate to be loaded into the substrate holder; steps of generating substrate configuration data in the case where the substrate is loaded into the substrate holder based on the set transfer parameters and the carrier information; and steps of displaying at least the data indicating the configuration of the substrate in the state where the substrate is loaded into the substrate holder when displaying the substrate configuration data.

[0008] Invention Effects

[0009] According to this technology, the configuration of the substrate in the substrate holder can be confirmed before the substrate is transferred to the substrate holder. Attached Figure Description

[0010] Figure 1 This is a side perspective view of a substrate processing apparatus according to an embodiment of the present disclosure.

[0011] Figure 2This is a top view of the processing furnace of the substrate processing apparatus according to an embodiment of the present disclosure.

[0012] Figure 3 yes Figure 2 A vertical sectional view at line AA.

[0013] Figure 4 This is a diagrammatic example of the controller structure according to an embodiment of this disclosure.

[0014] Figure 5A This is a diagram illustrating the typical transfer process during substrate handling.

[0015] Figure 5B This is a flowchart illustrating a simulation of an embodiment of the present disclosure.

[0016] Figure 6 This is a flowchart illustrating the substrate configuration procedure of the first embodiment of this disclosure.

[0017] Figure 7 This is an example of a simulated setup screen.

[0018] Figure 8 This is a graph representing an example of simulation results.

[0019] Figure 9 This is a flowchart illustrating the substrate configuration procedure of the second embodiment of this disclosure.

[0020] Figure 10 This is a graph representing an example of simulation results.

[0021] Figure 11 This is a flowchart illustrating the substrate configuration procedure of the third embodiment of this disclosure.

[0022] Figure 12 This is a graph representing an example of simulation results.

[0023] Figure 13 This is a flowchart illustrating an example of a substrate processing procedure that utilizes simulation results. Detailed Implementation

[0024] The substrate processing apparatus according to the embodiments of the present disclosure will be described with reference to the accompanying drawings. However, in the following description, the same structural elements are sometimes labeled with the same reference numerals and repeated descriptions are omitted. In addition, in order to make the description clearer, the drawings sometimes schematically show the width, thickness, shape, etc. of each part compared with the actual way, but this is only an example and does not limit the interpretation of the present disclosure.

[0025] In this embodiment, as an example, the substrate processing apparatus is configured as a semiconductor manufacturing apparatus that performs the substrate processing step in a method for manufacturing a semiconductor device (IC: Integrated Circuit).

[0026] like Figure 1 As shown, the substrate processing apparatus 100 of this embodiment uses a wafer cassette 110 as a carrier for housing wafers (substrates) 200 made of silicon or the like, and has a frame 111. A wafer cassette loading / unloading outlet 112 is provided on the front wall 111a of the frame 111, connecting the inside and outside of the frame 111. The wafer cassette loading / unloading outlet 112 is opened and closed by a front opener / closer 113. A loading port 114 is provided on the front side of the wafer cassette loading / unloading outlet 112, and the wafer cassette 110 is placed on the loading port 114. The wafer cassette 110 is loaded onto the loading port 114 by an in-process transport device (not shown) and removed from the loading port 114.

[0027] A storage shelf 105, serving as a buffer shelf, is provided at the upper part of the approximately central portion within the frame 111. The storage shelf 105 rotates around the support column 116, and multiple wafer cassettes 110 are stored on the shelf 117. For example... Figure 2 As shown, a wafer cassette conveying device 118 is provided between the loading port 114 and the storage shelf 105 inside the frame 111. The wafer cassette conveying device 118 consists of a wafer cassette lift 118a that can be raised and lowered while holding the wafer cassette 110 and a wafer cassette conveying mechanism 118b that serves as a horizontal conveying mechanism, and conveys the wafer cassette 110 between the loading port 114, the storage shelf 105, and the wafer cassette opener 121.

[0028] like Figure 1 As shown, a sub-frame 119 is constructed in the lower part of the approximately central portion of the frame 111 in the front-rear direction, extending all the way to the rear end. On the front wall 119a of the sub-frame 119, a pair of wafer loading / unloading outlets 120 are provided in a vertically arranged manner in two layers for moving the wafer 200 into and out of the sub-frame 119. A pair of wafer cassette openers 121 are provided in the upper and lower wafer loading / unloading outlets 120 respectively.

[0029] The wafer cassette opener 121 includes a mounting stage 122 for placing wafer cassettes 110 and a cover loading / unloading mechanism 123 for loading and unloading the cover (cover body) of the wafer cassettes 110. The wafer cassette opener 121 loads and unloads the cover of the wafer cassettes 110 placed on the mounting stage 122 via the cover loading / unloading mechanism 123, thereby opening and closing the wafer inlet / outlet of the wafer cassettes 110. The mounting stage 122 is a transfer shelf for placing wafer cassettes 110 during substrate transfer.

[0030] like Figure 1As shown, the sub-frame 119 forms a transfer chamber 124 that is atmospherically isolated from the installation space of the wafer cassette transport device 118 and the storage shelf 105. A wafer transfer mechanism 125, serving as a substrate transfer section, is provided in the front region of the transfer chamber 124.

[0031] The wafer transfer mechanism 125 comprises a wafer transfer device 125a that holds the wafer 200 in clamps 125c and is capable of rotating or moving horizontally, and a wafer transfer device lift 125b for raising and lowering the wafer transfer device 125a. Through the continuous operation of these wafer transfer device lifts 125b and wafer transfer devices 125a, wafers 200 are loaded and unloaded from the boat 217. As shown in the figure, in this embodiment, there are five clamps 125c, and the wafer transfer mechanism 125 is configured to transport five wafers together or one wafer at a time.

[0032] like Figure 1 As shown, a processing furnace 202 is disposed above the boat 217. The processing furnace 202 has a processing chamber (not shown) inside, and heaters (not shown) are arranged around the processing chamber to heat the processing chamber. The lower end of the processing furnace 202 is opened and closed by a furnace gate valve 147.

[0033] like Figure 1 As shown, a sealing cover 129 is horizontally installed at the lower part of the boat 217. The sealing cover 129 is configured to vertically support the boat 217 and can seal the lower end of the processing furnace 202.

[0034] Next, the operation of the substrate processing apparatus of this embodiment will be described. For example... Figure 1 , Figure 2 As shown, when the wafer cassette 110 is supplied to the loading port 114, the wafer cassette loading / unloading outlet 112 is opened by the front opener 113, and the wafer cassette 110 is loaded through the wafer cassette loading / unloading outlet 112. The loaded wafer cassette 110 is automatically transported by the wafer cassette conveying device 118 and handed over to the designated shelf 117 of the storage shelf 105.

[0035] After being temporarily stored on the storage shelf 105, the wafer cassette 110 is transported from the shelf 117 to a wafer cassette opener 121 and then transferred to the loading stage 122, or it is directly transported from the loading port 114 to the wafer cassette opener 121 and then transferred to the loading stage 122. At this time, the wafer loading / unloading outlet 120 of the wafer cassette opener 121 is closed by the cover loading / unloading mechanism 123, and clean air circulates and fills the transfer chamber 124.

[0036] like Figure 1As shown, the cover of the wafer cassette 110, placed on the mounting stage 122, is removed by the cover loading / unloading mechanism 123, opening the wafer inlet / outlet of the wafer cassette 110. Meanwhile, the wafer 200 is picked up from the wafer cassette 110 by the wafer transfer mechanism 125 and transferred to the carrier 217 for loading. The wafer transfer mechanism 125, having transferred the wafer 200 to the carrier 217, returns to the wafer cassette 110, and the next wafer 200 is loaded into the carrier 217.

[0037] In the wafer 200 loading operation of the wafer 200 to the boat 217 based on the wafer transfer device 125a in the wafer cassette opener 121 on one side (upper or lower layer), other wafer cassettes 110 are transported from the storage shelf 105 or loading port 114 by the wafer cassette transport device 118 in the wafer cassette opener 121 on the other side (lower or upper layer), while the wafer cassettes 110 based on the wafer cassette opener 121 are opened.

[0038] When a predetermined number of wafers 200 are loaded into the boat 217, the lower end of the furnace 202 is opened by the furnace gate valve 147. Next, the sealing cover 219 is raised by the boat lift 115, and the boat 217, supported by the sealing cover 219, is moved into the processing chamber within the furnace 202 (boat loading process). After being moved in, the wafers 200 undergo arbitrary processing in the processing chamber (substrate processing process). After processing, the boat 217 is removed using the boat lift 115 (boat unloading process), and then, following roughly the reverse steps described above, the wafers 200 and the wafer cassette 110 are discharged to the outside of the housing 111.

[0039] (Structure of the processing furnace)

[0040] like Figure 2 and Figure 3 As shown, a heater 207, serving as a heating element, is provided in the processing furnace 202 for heating the wafer (substrate) 200. Inside the heater 207, a reaction tube 203 constituting a reaction vessel (processing vessel) is arranged concentrically with the heater 207. The reaction tube 203 is made of a heat-resistant material such as quartz (SiO2) and is formed into a cylindrical shape that is closed at the top and open at the bottom.

[0041] A manifold 209, made of materials such as stainless steel, is installed at the lower end of the reaction tube 203. The manifold 209 is cylindrical, and its lower opening is hermetically sealed by a sealing cap 219, which serves as a cover. O-rings 220 are provided between the reaction tube 203, the manifold 209, and the sealing cap 219. The reaction tube 203, the manifold 209, and the sealing cap 219 form the processing chamber 201. A boat 217, serving as a substrate holder, is erected on the sealing cap 219 via a boat support 218.

[0042] In the boat 217, multiple wafers 200 to be processed are loaded horizontally and longitudinally in multiple layers. The boat 217 can be raised and lowered relative to the reaction tube 203 by a boat lift 115. To improve processing uniformity, a boat rotation mechanism 267 for rotating the boat 217 is provided at the lower end of the boat support 218. The heater 207 heats the wafers 200 inserted into the processing chamber 201 to a predetermined temperature.

[0043] In the processing chamber 201, nozzles 410 (first nozzle 410), 420 (second nozzle 420), and 430 (third nozzle 430) are installed through the lower part of the reaction tube 203. The nozzles 410, 420, and 430 are respectively connected to gas supply pipes 310 (first gas supply pipe 310), 320 (second gas supply pipe 320), and 330 (third gas supply pipe 330), which serve as gas supply lines. Thus, with three nozzles 410, 420, and 430 and three gas supply pipes 310, 320, and 330 installed in the reaction tube 203, it is configured to supply multiple, in this case, three types of gases (processing gases) to the processing chamber 201.

[0044] Starting from the upstream side, the gas supply pipe 310 is provided with a mass flow controller (MFC) 312, which serves as a flow control device (flow control unit), and a valve 314, which serves as an on / off valve. The front end of the gas supply pipe 310 is connected to a nozzle 410. The nozzle 410 is configured as an elongated nozzle, with its horizontal portion extending through the sidewall of the manifold 209. The vertical portion of the nozzle 410 is positioned in an arc-shaped space formed between the inner wall of the reaction pipe 203 and the wafer 200, standing upright along the inner wall of the reaction pipe 203 towards the upward (in the loading direction of the wafer 200) (i.e., standing upright from one end of the wafer arrangement area towards the other end). In other words, the nozzle 410 is positioned horizontally to the side of the wafer arrangement area where the wafers 200 are arranged, surrounding the wafer arrangement area.

[0045] A gas supply port 410a is provided on the side of the nozzle 410 for supplying gas. The gas supply port 410a opens toward the center of the reaction tube 203. Multiple gas supply ports 410a are provided from the bottom to the top of the reaction tube 203, each with the same or the same inclined opening area, and are arranged at the same opening spacing. The first gas supply system mainly consists of a gas supply tube 310, an MFC 312, a valve 314, and a nozzle 410.

[0046] In addition, the gas supply pipe 310 is connected to the carrier gas supply pipe 510 for supplying carrier gas. The first carrier gas supply system mainly consists of the carrier gas supply pipe 510, MFC 512, and valve 514.

[0047] In the gas supply pipe 320, starting from the upstream side, an MFC 322 serving as a flow control device (flow control unit) and a valve 324 serving as an on / off valve are sequentially arranged. The front end of the gas supply pipe 320 is connected to a nozzle 420. The nozzle 420 is configured as a long nozzle, similar to the nozzle 410. The horizontal and vertical sections of the nozzle 420 also have the same structure as those of the nozzle 410.

[0048] A gas supply port 420a is provided on the side of the nozzle 420 for supplying gas. The gas supply port 420a has the same structure as the gas supply port 410a. The second gas supply system mainly consists of a gas supply pipe 320, an MFC 322, a valve 324, and a nozzle 420.

[0049] Furthermore, the gas supply pipe 320 is connected to the carrier gas supply pipe 520 used for supplying carrier gas. The second carrier gas supply system mainly consists of the carrier gas supply pipe 520, MFC 522, and valve 524.

[0050] In the gas supply pipe 330, starting from the upstream side, an MFC 332 serving as a flow control device (flow control unit) and a valve 334 serving as an on / off valve are sequentially arranged. The front end of the gas supply pipe 330 is connected to the nozzle 430. The nozzle 430, like the nozzle 410, is configured as a long nozzle. The structure of the horizontal and vertical portions of the nozzle 430 is also the same as that of the nozzles 410 and 420.

[0051] A gas supply port 430a is provided on the side of the nozzle 430 for supplying gas. The gas supply port 430a has the same structure as the gas supply ports 410a and 420a. The third gas supply system mainly consists of a gas supply pipe 330, an MFC 332, a valve 334, and a nozzle 430.

[0052] Furthermore, the gas supply pipe 330 is connected to the carrier gas supply pipe 530 for supplying carrier gas. The third carrier gas supply system mainly consists of the carrier gas supply pipe 530, MFC 532, and valve 534.

[0053] In this embodiment, the gas supply method involves supplying gas via nozzles 410, 420, and 430 arranged within an arc-shaped longitudinal space defined by the inner wall of the reaction tube 203 and the ends of the multiple wafers 200 mounted thereon. Gas is first ejected into the reaction tube 203 near the wafers 200 from gas supply holes 410a, 420b, and 430c, which open at the nozzles 410, 420, and 430, respectively. This ensures that the primary gas flow within the reaction tube 203 is parallel to the surface of the wafers 200, i.e., horizontally. This structure allows for uniform gas supply to each wafer 200, resulting in uniform film thickness of the thin films formed on each wafer 200. While nozzles 410, 420, and 430 are described as elongated nozzles with horizontal and vertical sections integrally formed, they could also be nozzles constructed by assembling separately formed horizontal and vertical sections.

[0054] A first raw material gas is supplied to the processing chamber 201 from the gas supply pipe 310 via MFC 312, valve 314, and nozzle 410. A second raw material gas is also supplied to the processing chamber 201 from the gas supply pipe 320 via MFC 322, valve 324, and nozzle 420. A reaction gas is supplied to the processing chamber 201 from the gas supply pipe 330 via MFC 332, valve 334, and nozzle 430.

[0055] Inactive gases are supplied to the processing chamber 201 from carrier gas supply pipes 510, 520 and 530 via MFCs 512, 522 and 532, valves 514, 524 and 534, and nozzles 410, 420 and 430, respectively.

[0056] An exhaust pipe 231 is provided in the reaction tube 203 to exhaust the atmosphere of the processing chamber 201. The exhaust pipe 231 is configured to penetrate the side wall of the manifold 209 at a position opposite to the nozzles 410, 420, and 430. According to this configuration, the gas supplied to the vicinity of the wafer 200 in the processing chamber 201 from the gas supply holes 410a, 420a, and 430a flows horizontally, that is, in a direction parallel to the surface of the wafer 200, and then flows downward and is discharged from the exhaust pipe 231.

[0057] In the exhaust pipe 231, starting from the upstream side, a pressure sensor 245 (which acts as a pressure detector, or pressure sensing unit) is connected in sequence, along with an APC (Auto Pressure Controller) valve 243 and a vacuum pump 246 (which functions as a vacuum exhaust device). The APC valve 243 is an exhaust valve that functions as a pressure regulating unit. The exhaust system, or exhaust line, mainly consists of the exhaust pipe 231, the APC valve 243, and the pressure sensor 245. Alternatively, the vacuum pump 246 can also be included in the exhaust system.

[0058] Furthermore, the APC valve 243 is configured to adjust the valve opening while the vacuum pump 246 is operating, thereby adjusting the pressure in the processing chamber 201.

[0059] A temperature sensor 263, which serves as a temperature detector, is installed inside the reaction tube 203. The electrical current supplied to the heater 207 is adjusted based on the temperature information detected by the temperature sensor 263, thereby achieving the desired temperature distribution in the processing chamber 201. The temperature sensor 263, like the nozzles 410, 420, and 430, is configured in an L-shape and is installed along the inner wall of the reaction tube 203.

[0060] like Figure 4 As shown, the controller 130, serving as the control unit, is configured as a computer having a CPU (Central Processing Unit) 130a, RAM (Random Access Memory) 130b, a storage device 130c as the storage unit, and an I / O port 130d. The RAM 130b, storage device 130c, and I / O port 130d are configured to exchange data with the CPU 130a via an internal bus. The controller 130 is connected to an input / output device 131, such as a touch panel, serving as the operation unit.

[0061] The storage device 130c is configured such as flash memory or HDD (Hard Disk Drive). The storage device 130c stores, in a readable manner, a control program that controls the operation of the substrate processing apparatus, such as a process flow describing the steps and conditions of substrate processing. Additionally, it stores the substrate configuration program, which will be described later in this embodiment. Furthermore, these process flows are combined in such a way that the controller 130 executes each step of the substrate processing to obtain a predetermined result, and function as a program. Hereinafter, the process flow, control program, etc., will sometimes be collectively referred to as a program. The RAM 130b is configured as a storage area (working area) for temporarily holding programs, data, etc., read by the CPU 130a.

[0062] I / O port 130d is connected to the aforementioned MFC312, 322, 332, 512, 522, 532, valves 314, 324, 334, 514, 524, 534, APC valve 243, pressure sensor 245, vacuum pump 246, heater 207, temperature sensor 263, boat rotation mechanism 267, boat lifting mechanism 115, wafer cassette transport device 118, wafer transfer mechanism 125, etc.

[0063] CPU 130a is configured to read and execute control programs from storage device 130c, and to read process data from storage device 130c based on input operation commands from the operation unit. Furthermore, CPU 130a is configured to control, according to the read process data, the flow rate adjustment of various gases based on MFCs 312, 322, 332, 512, 522, and 532; the opening and closing of valves 314, 324, 334, 514, 524, and 534; the opening and closing of APC valve 243; the pressure adjustment of APC valve 243 based on pressure sensor 245; the temperature adjustment of heater 207 based on temperature sensor 263; the start and stop of vacuum pump 246; the rotation and speed adjustment of boat 217 based on boat rotation mechanism 267; and the lifting of boat 217 based on boat lift 115.

[0064] The controller 130 is not limited to being configured as a dedicated computer, but can also be configured as a general-purpose computer. For example, the program can be installed on a general-purpose computer using an external storage device (e.g., a semiconductor memory such as a USB memory) 133, which stores the program described above, thereby enabling the controller 130 of this embodiment to be configured.

[0065] The unit for supplying programs to a computer is not limited to supplying them via external storage unit 133. For example, communication units such as the Internet or dedicated lines can be used to supply programs without using external storage unit 133. Furthermore, storage device 130c and external storage unit 133 constitute a computer-readable recording medium. Hereinafter, they will also be referred to simply as recording medium. In addition, when the term "recording medium" is used in this disclosure, sometimes only storage device 130c is included, sometimes only external storage unit 133 is included, or sometimes both are included.

[0066] First, use Figure 5A as well as Figure 5B The process for pre-confirming the transfer status of the substrate in this embodiment will be explained. Figure 5A The flowchart shows the process from when the wafer cassette 110 (wafer 200) is placed into the device until the wafer 200 is transferred to the carrier 217. Figure 5B The flowchart is a process for confirming the configuration of the wafer 200 loaded into the boat 217 before the actual delivery of the wafer 200. Here, "boat mapping" in this disclosure is a general term for data and drawings, etc., representing the configuration of the wafer 200 in the state where the wafer 200 is loaded into the boat 217. A schematic diagram of a boat 217 holding multiple simulated wafers 200 is provided (for example, see reference 217). Figure 8 It is also included in "boat-and-vessel mapping".

[0067] right Figure 5A A simplified flowchart illustrating the typical substrate processing steps is provided. When a wafer cassette input notification is received from the controller 130, Figure 4 The transport controller (not shown) stores the carrier information of the wafer cassette 110. It also sends a transport instruction (request) to the wafer cassette transport device 118, which serves as the transport mechanism. Upon receiving the instruction, the wafer cassette transport device 118 places the wafer cassette 110 onto the receiving shelf 105 and notifies the transport controller of transport completion. When the wafer cassette 110 has only the quantity required for substrate processing placed on the receiving shelf 105, the transport controller notifies the controller 130 of transport completion. Furthermore, upon receiving an execution instruction from the controller 130, it checks in advance whether the wafer 200 can be transferred, creates substrate configuration data including the checked boat mapping, and controls the wafer transfer mechanism 125, which serves as the transport mechanism, along this substrate configuration data. Finally, when the transfer of the wafer 200 to the boat 217 of the wafer transfer mechanism 125 is completed, the transport controller notifies the controller 130 of transfer completion. Furthermore, in the pre-test, it is preferable to check whether the wafer 200 can be transferred, and to display a message indicating the different number of wafers 200 that can be loaded into the boat 217 if the number of wafers 200 is different. If such a check is added to the pre-test, it is possible to detect whether the substrate configuration data has also changed along with the modification, for example, if the type of film in the device is changed, before the simulation is performed.

[0068] Here, the transport controller is configured to control the wafer cassette transport device 118 and the wafer transfer mechanism 125 as a transport mechanism. Additionally, the boat lift 115 and the boat rotation mechanism 267 may also be included in the transport mechanism. Furthermore, when the transfer of the wafer 200 to the boat 217 is completed, the controller 130 is configured, for example, to execute the aforementioned process steps, performing wafer 200 processing.

[0069] In the Figure 5B Before briefly explaining the flowchart, firstly, the substrate configuration program for creating a boat-and-dish mapping based on carrier information is downloaded from the transport controller to the controller 130, making it executable. For example, the substrate configuration program is configured to be stored in RAM 130b, and when the substrate configuration program is started, a boat-and-dish mapping creation unit is generated within the controller 130. Here, the data resulting from the controller 130 executing the substrate configuration program is collectively referred to as "substrate configuration data." Therefore, the simulation result data and attached figures are also included in the "substrate configuration data." For example, in addition to the aforementioned "boat-and-dish mapping," various data obtained by comparing "boat-and-dish mappings" with each other, the number of transports displayed during simulation, transport sequence, transport destination information, transport source information, etc., are also included in the "substrate configuration data."

[0070] For simulation Figure 5B A simplified flowchart of the boat mapping process is provided. The boat mapping fabrication unit receives the simulation-required data from the operation screen of the input / output device 131 or the controller 130 and fabricates substrate transfer data. Furthermore, when an execution instruction is received from the operation screen of the input / output device 131 or the controller 130, a preliminary check is performed to determine whether boat mapping (or substrate configuration data) can be fabricated based on the fabricated substrate transfer data. In summary, this preliminary check is related to... Figure 5A The pre-check in the flowchart checks whether the transfer of wafer 200 can be performed.

[0071] If the pre-check is normal (OK), the boat-and-vessel mapping production department creates the boat-and-vessel mapping, and the GUI creates data for screen display based on the result, and displays it on the operation screen of the input / output device 131 or the controller 130.

[0072] (First Implementation)

[0073] use Figure 6 right Figure 5B The flowchart shown will be explained in detail. Figure 6 This is an example of a flowchart used to confirm the transfer status of the wafer 200 before transferring the wafer 200 in this embodiment to the carrier 217. Here, an example of confirming the offset is specifically described by comparing the already created carrier mapping with the configuration data (carrier mapping) of the expected wafer 200 pre-input by the user.

[0074] Figure 6 The simulation consists of four steps: registering the simulation mapping (S1), setting up the simulation for execution (S2), executing the simulation (S3), and outputting the simulation results (S4). Each step is explained below.

[0075] (S1: Transfer parameter selection)

[0076] Select a transfer parameter file (referred to as a WAP file in this disclosure) that determines the predetermined configuration of multiple wafers 200, including at least product wafers 200A and virtual wafers 200B, to be loaded into the wafer 217. The WAP (Wafer Arrangement Parameter) includes a logical method for setting the number of wafers 200, the loading method, and for the controller 130 to automatically determine the wafer mapping, and a direct method for setting the type of wafer loaded into each slot of the wafer 217. A slot refers to a substrate support provided for loading wafers 200 into the wafer 217. Here, a WAP file for which the transfer status is to be confirmed is selected in advance. Here, as a method for configuring the wafers 200 in the WAP file, there are logical methods for setting the number of wafers, the transfer method, and for the controller to automatically determine the wafer mapping, and a direct method for setting the type of wafer 200 loaded into each slot of the wafer 217. The transfer parameter file (WAP file) is a file that defines the transfer parameters and the setting method.

[0077] Here, the desired boat-shaped mapping is pre-created directly prior to this step, and the WAP file is saved as a reference file in storage device 130c. Furthermore, the WAP file selected in this step can be compared with the simulation results. Additionally, multiple WAP files are stored in the storage device 130c of the controller 130.

[0078] Furthermore, when selecting the WAP file and pressing the designated button (the button to start the transport simulation function), in Figure 6 In the flowchart shown, the process moves to the step (S2) of setting the transport parameters and carrier information required for transporting the wafer 200. However, this process is an example and is not limited to this process.

[0079] (S2: Conveying parameter settings)

[0080] Next, as a parameter file related to transport other than the WAP file, select configuration parameters, function parameters, and maintenance parameters. By selecting configuration parameters, set parameters related to the structure and module structure of the transport mechanism. By selecting function parameters, set parameters related to transport functions such as carrier transport, wafer transfer, and boat transport. By selecting maintenance parameters, set parameters related to transport adjustment functions such as interlock release. Specifically, selecting function parameters displays a screen for clamping product wafer 200A, virtual wafer 200B, and monitoring wafer 200C respectively; therefore, set the parameter for prioritizing the use of five clamps or a single clamp. Similarly, selecting function parameters displays a screen for sharing virtual wafer 200B, setting the parameter for transferring the side virtual wafer 200B1 as a supplementary virtual wafer 200B2. Hereinafter, when used as a general term for chips, it is referred to as chip 200; when used as a category of chips, it is referred to as product chip 200A, virtual chip 200B, monitoring chip 200C, side virtual chip 200B1, and supplementary virtual chip 200B2.

[0081] (S2: Carrier Information Setting)

[0082] The carrier information, including the type of wafers stored in the wafer cassette 110, the number of each wafer, and the configuration position of the wafer cassette 110 to the buffer shelf, is set, and a wafer cassette 110 for storing a predetermined variety of wafers 200 loaded into the directional boat 217 is selected.

[0083] The aforementioned transport parameter settings and carrier information settings (S2) are configured to enable... Figure 7 The settings are shown in the simulation settings screen.

[0084] like Figure 7 As shown, in the parameter setting area, you can select configuration parameters, function parameters, and maintenance parameters. Specifically, when you select the filename unit and press the detail button, you are taken to a screen that displays a list of files with the selected delivery parameters, where you can select a file. Additionally, you can confirm the name of the WAP file here.

[0085] like Figure 7 As shown, in the area schematically representing buffer shelves (here, a 3-layer, 4-column shelf, or a 2-layer, 2-column shelf), wafer cassettes 110 are indicated by □ (corners). Shelves without □ (corners) indicate that no wafer cassettes 110 are placed on them. Additionally, in the material selection area, the wafer cassettes 110 required for processing are selected. Here, four wafer cassettes are selected, but this is merely an example.

[0086] Furthermore, the device is configured to display various setting screens when the edit button, located in the area schematically representing the buffer shelf, or the change button, located in the area for selecting materials (actually the wafer cassette 110), is pressed. Detailed settings for the wafer cassette 110 and the wafer 200 can be performed on these various setting screens. These detailed settings will be described later.

[0087] (S3: Simulated Execution)

[0088] Controller 130 when pressed Figure 7 When the simulated button is pressed, the controller 130 generates substrate configuration data, such as boat mapping, for loading various wafers 200 into the boat 217, based on the transfer parameters and carrier information set in S1 and S2. Additionally, it generates substrate configuration data, such as boat mapping, for loading various wafers 200 into the boat 217, based on a pre-saved WAP file used as a reference file.

[0089] The controller 130 compares the created boat mapping (or substrate configuration data) with the target boat mapping (or substrate configuration data) pre-registered in the storage device 130c. Here, the created boat mapping is compared with a reference file that pre-creates the desired boat mapping by directly setting various wafers 200 in each slot. The controller 130 calculates the offset between the created boat mapping and the desired boat mapping. Specifically, between the created boat mapping (or substrate configuration data) and the desired boat mapping, the type of wafers 200 loaded into the boat 217 is compared for each slot to determine if they are the same type. This determination is performed the number of times the number of wafers that can be loaded into the boat 217 (total number of slots).

[0090] Furthermore, the controller 130 calculates the ratio of the number of wafers 200 of the same type to the number of wafers 200 that can be loaded into the carrier 217 in the carrier mapping (or substrate configuration data). For example, when the number of wafers that can be loaded into the carrier 217 is set to 100 and the number of wafers 200 of different types is set to 2, the calculation result is 98%. Additionally, if the number of wafers 200 of different types is large and is considered to be due to obvious misconfiguration, an error message (not shown) may be displayed without proceeding to the next step. For example, if the consistency rate is less than 60%, the controller 130 may determine that the parameter setting is incorrect, display an error message, and only display an NG (Not Valid) button, forcibly returning to the selection screen for selecting a WAP file. Specifically, when the number of wafers 200 that can be loaded into the carrier 217 is different, it is preferable to display a message indicating that the number of wafers is different. For example, if modifications such as changing the type of film used in the device are made, and the number of wafers 200 set in each of the substrate configuration data produced in S3 differs from the WAP file containing the reference file stored in the storage device 130c, it can be determined that there is an obvious misconfiguration. This allows for checking whether the WAP file containing the reference file stored in the storage device 130c is an old file from before the modification or a setting error in S2.

[0091] (S4: Display of simulation results)

[0092] Figure 8 Here is an example of the simulation results. The baseline boat-and-dish map and the fabricated boat-and-dish map are displayed side-by-side. The fabricated boat-and-dish map is displayed as 98% of the calculation result (hereinafter also referred to as the consistency rate) due to the offset. It could also be displayed as 2% due to the offset. Alternatively, it can be displayed in a way that at least the configuration positions of the different types of wafers 200 are known, but this is just one example. Figure 8 The configuration is such that it does not display the entire boat-and-dish mapping, but rather displays boat-and-dish mappings of different categories of the chip 200.

[0093] Furthermore, in Figure 8 When the "NG" button is pressed, the user is returned to the WAP file selection screen. In other words, the user is returned to... Figure 6 The step shown is selecting a WAP file (S1). On this selection screen, confirm the settings in the WAP file and make appropriate corrections. Furthermore, when the offset is 0%, save the boat mapping created by pressing the OK button and end. At this time, it is preferable not to display the error button on the screen. Alternatively, only the error button may be displayed and cannot be pressed.

[0094] In addition, Figure 7In this process, only the name of the WAP file is confirmed, but it can also be configured to allow for future selection of WAP files, confirmation of settings, or modification of settings. That is, in Figure 8 Alternatively, pressing the NG button can return to the simulation settings screen. In this case, in addition to the WAP file, other transmission parameters can also be viewed.

[0095] According to this embodiment, it is possible to confirm whether the generated WAP file is the desired boat mapping before the actual delivery of the wafer 200. Therefore, situations where the desired slot of the boat 217 does not contain the wafer 200, or where wafers 200 of different types are loaded, will not occur. Therefore, the process will not have to be re-executed due to different configurations of the wafers 200 loaded into the boat 217, which can help improve the machine's operating rate and productivity.

[0096] (Second Implementation)

[0097] use Figure 9 right Figure 5B The flowchart shown will be explained in detail. For example, if you want to create a WAP file that resembles a boat map as expected by the user, if you use... Figure 9 The illustrated process can confirm whether the user-registered WAP mapping matches the WAP mapping formed by the WAP files already stored in the storage device 130c (whether there is an offset). That is, through this simulation, the WAP file with the highest consistency rate (minimum offset) can be searched. Here, as described above, it can also be configured to display an error message indicating this if the number of WAP files mounted on the chip 200 is different.

[0098] Figure 9 and Figure 6 Similarly, it has four steps: registering the mapping of the boat (S10), setting up for the simulation (S20), performing the simulation (S30), and outputting the simulation results (S40).

[0099] (S10: Registration of the boat-and-vessel mapping)

[0100] Here, select a WAP file, configure various chips 200 by direct input, and save the WAP file to the storage device 130c. Then, select the WAP file saved in the WAP selection screen and press the simulation button.

[0101] (S20: Parameter file settings)

[0102] When the simulation button is pressed on the WAP selection screen, the simulation settings screen is displayed. Figure 7 Here, you set the transport parameters and carrier information. Figure 6It is similarly configured to display various setting screens while making settings, but the details of the settings will be described later.

[0103] (S30: Simulated execution)

[0104] When pressed Figure 7 When the simulated button is pressed, the controller 130 generates substrate configuration data such as the boat-shaped mapping when various wafers 200 are loaded into the boat-shaped 217, based on the boat-shaped mapping set in S10, the transport parameters set in S20, and carrier information.

[0105] The controller 130 is configured to retrieve WAP files stored in the storage device 130c, expand them in the RAM 130b, perform a pre-check to determine whether a match (whether the chip 200 can be delivered) is achieved even if the substrate configuration program is executed, and create a substrate mapping (or substrate configuration data) for all WAP files that are determined to be deliverable through the pre-check.

[0106] The controller 130 compares all WAP files determined to be transferable during pre-checking with the target boat mapping (or substrate configuration data) created in the same manner as in the first embodiment and the target boat mapping (or substrate configuration data) pre-registered in the storage device 130c. Furthermore, the controller 130 calculates the consistency rate, which is the ratio of the number of wafers 200 of the same type between the boat mappings (substrate configuration data) to the number of wafers 200 that can be loaded into the boat 217. For example, if the number of wafers that can be loaded into the boat 217 is set to 100, and the number of wafers 200 of different types is set to 2, then the consistency rate is 98%.

[0107] (S40: Display of simulation results)

[0108] The controller 130 is configured such that, based on the comparison of boat-and-dish mappings, it prioritizes displaying boat-and-dish mappings with higher consistency rates in the boat-and-dish mapping result screen. For example, as... Figure 10 As shown, it can also be configured to display the boat-and-dish maps sequentially starting from those with a high consistency rate with the reference boat-and-dish map (in this embodiment, there are three boat-and-dish maps with high consistency rates sequentially). Furthermore, if there is only one boat-and-dish map with a 100% consistency rate, then only the 100% consistency boat-and-dish map is displayed.

[0109] Additionally, the controller 130 is configured such that when selected in Figure 10When displaying the boat-and-tablet mapping images, details of the differences from the reference boat-and-tablet mapping are shown. For example, the portion where the offset occurs between the boat-and-tablet mapping created based on the transfer parameters and the data representing the configuration of the registered substrate can be prioritized. Alternatively, boat-and-tablet mappings for different substrate categories can be prioritized. When the save button is pressed on this screen, a WAP file corresponding to the selected boat-and-tablet mapping image is saved as the WAP file used to create the target boat-and-tablet mapping, and the user returns to the previous screen. Figure 10 The result output screen. When the cancel button is pressed, it only returns to the previous screen. Figure 10 .

[0110] Alternatively, color differentiation can be used based on the consistency rate. For example, if the consistency rate is 100%, no color is applied. If the consistency rate is 95% or higher but less than 100%, it can be displayed in blue; if the consistency rate is 80% or higher but less than 95%, it can be displayed in yellow; and if the consistency rate is less than 80%, it can be displayed in red. Furthermore, in addition to consistency rate, color differentiation can also be used for wafers 200 that differ from the reference wafer mapping. Moreover, in cases of low consistency rate, such as less than 60%, it may not be colored. Figure 10 Instead of displaying the correct screen, the system shows an error message and an NG (Not Okay) button, forcibly returning to the screen where you select parameters.

[0111] In addition, Figure 10 In the selection screens for the boat-and-dish mapping images displayed (screens that confirm the differences from the reference boat-and-dish mapping in detail), even if the consistency rate is not 100%, it can sometimes be considered normal (OK) as long as it does not affect the processing of the chip 200. For example, if the side virtual chip 200B1 and the supplementary virtual chip 200B2 described later are different, you can choose to edit the data to set the consistency rate to 100%, or directly use the consistency rate.

[0112] According to this embodiment, in Figure 10 When the Cancel button is pressed again, the user returns to the WAP selection screen, where they can choose to save a WAP file. Furthermore, if the consistency rate is not 100%, the user can expand the WAP file on this selection screen to check and correct the settings. Additionally, the user can press the Simulation button to perform a simulation and check the consistency rate.

[0113] According to this embodiment, it is possible to retrieve WAP files that can be used to create the desired boat mapping. Alternatively, it can be configured such that when... Figure 10 When the cancel button is pressed, return to Figure 7 The simulated setup screen shown. In this case, in addition to the WAP file, other transport parameters can also be viewed.

[0114] (Third implementation method)

[0115] use Figure 11 right Figure 5B The flowchart shown will be explained in detail. Figure 11 This is an example of a flowchart used to confirm the transfer status of the wafer 200 before transferring the wafer 200 in this embodiment to the carrier 217. Here, the process of confirming the carrier mapping of the created WAP file will be explained.

[0116] Figure 11 and Figure 6 Similarly, it has four steps: registering the simulation mapping (S1), setting up for the simulation (S2), executing the simulation (S3), and outputting the simulation results (S4). Each step is explained below. Furthermore, the following is in conjunction with... Figure 6 In similar situations, explanations are sometimes omitted.

[0117] The steps for selecting transfer parameters (S1) and Figure 6 Similarly, when the transfer-related transport parameters are selected and the simulation button is pressed, the following is displayed: Figure 7 The simulated setup screen shown.

[0118] In step (S2), which is set up to perform the simulation, various conveying parameters, material information, and carrier information are configured. Regarding the settings of each conveying parameter... Figure 7 The settings for each conveying parameter shown are performed in the same manner as in the first embodiment. Here, the settings for material information, carrier information, etc., will be explained. Material information is set by selecting... Figure 7 To begin, click the edit button shown, and then select settings such as carrier information. Figure 7 Start by clicking the change button shown.

[0119] First, when choosing Figure 7 When the edit button is shown, it will be displayed. Figure 11 The material information setting screen shown. Specifically, it is configured to schematically represent... Figure 7 The buffer shelf areas shown (here, 3-layer, 4-column shelves and 2-layer, 2-column buffer shelves) are magnified and displayed in different screens. Wafer cassettes 110 are arranged on each buffer shelf, and the shelves are distinguished by color according to the type of wafers 200 stored within them, allowing for editing. Therefore, the configuration is such that when a wafer cassette 110 (or shelf) is selected at a position set by the aforementioned transfer parameters, transport parameters, etc., the material information within the wafer cassette 110 can be set.

[0120] Additionally, in the material information settings screen, if there is no need to change the configuration of the wafer cassette 110 or the type of the wafers 200 stored within the wafer cassette 110, pressing the OK button will return to the previous screen. Figure 7 This reflects the settings of the transfer and transport parameters. Furthermore, pressing the cancel button returns to... Figure 7 Then select the delivery parameters again. Additionally, when in... Figure 11 When the wafer cassette 110 placed on the buffer shelf is selected in the material information setting screen shown, the following is displayed: Figure 11 The material information editing screen shown can correct the material information (information of the wafer 200) within the selected wafer cassette 110.

[0121] For example, the material information (shelf number, carrier attribute information, carrier number, number of wafers) configured to display wafer cassette 110 can be edited. When a unit representing carrier attribute information is selected, a screen for selecting attribute information is displayed, allowing the carrier's attributes to be changed. Here, the attribute information includes three types: product wafer 200A, monitoring wafer 200C, and virtual wafer 200B. Virtual wafer 200B includes at least two types: side virtual wafer 200B1 and supplementary virtual wafer 200B2. In this material information editing screen, pressing the OK button (not shown) reflects the settings, while pressing the Cancel button does not. Here, the carrier's attributes indicate the type of wafer contained within the carrier.

[0122] Therefore, it is possible to arbitrarily set which type of wafer cassette 110 is placed on which shelf. Thus, depending on the placement of the wafer cassette 110, the transport time from the start of wafer cassette 110 transport to the end of wafer transfer to the boat may be shortened. Furthermore, keeping the shelf containing the product wafer 200A and the shelf containing the wafer cassette containing the virtual wafer 200B far apart may help suppress contamination of the product wafer 200A.

[0123] Next, when pressed Figure 7 When the change button is shown, it displays Figure 11 The carrier setting screen shown displays the wafer cells 110 required for carrier mapping (substrate configuration data), and each wafer cell 110 is configured to be editable. Specifically, the configuration allows for selection... Figure 7 The area of ​​the material shown (actually wafer cassette 110) is magnified and displayed on different screens. In addition to color-coding the selected wafer cassette 110 and the types of chips stored in the wafer cassette 110, the information on the number of chips stored in the wafer cassette 110 is also displayed and can be edited.

[0124] Therefore, when a wafer cassette 110 (or shelf) is selected and positioned according to the aforementioned transfer parameters, transport parameters, etc., information about the wafers 200 housed in the wafer cassette 110 can be set. Here, without needing to change the number of selected wafer cassettes 110, the type of wafers 200, or the number of wafers 200, pressing the OK button returns to the previous screen. Figure 7 This reflects the settings of the transfer and transport parameters. Additionally, if canceled, it returns to... Figure 7 Then select the delivery parameters again.

[0125] Additionally, when in Figure 11 When any carrier (wafer cell) 110 is selected in the carrier setting screen shown, the following is displayed: Figure 11 The screen showing the number of wafers used allows you to set the number of wafers 200 used in the wafer cassette 110.

[0126] For example, the configuration is designed to display information about the wafers 200 housed in the wafer cassette 110 (wafer configuration within the carrier), which can be edited. By selecting a unit indicating the number of the wafer support within the carrier, the presence or absence of the wafers 200 can be changed. Thus, the number of wafers 200 housed in the wafer cassette 110 can be arbitrarily changed.

[0127] In step (S3) of performing the simulation, when the button is pressed... Figure 7 When the simulated button is pressed, the controller 130 generates substrate configuration data such as boat mapping when various wafers 200 are loaded into the boat 217, based on the transfer parameters (WAP file) selected in S1, the transport parameters set in S20, carrier information, etc.

[0128] The controller 130 is configured to, during the fabrication of the carrier mapping, calculate wafer information such as the type and number of wafers 200 held in the carrier 217, the required number of carriers and carrier attributes (the type of wafers 200 stored in the wafer cassette 110), carrier information such as the shelf number preset on the shelf in the wafer cassette 110, slot number indicating the number of the substrate support portion set in the carrier 217, the number of transports by the wafer transfer mechanism 125, and the sequence of loading wafers 200 into the carrier 217 based on the wafer transfer mechanism 125. Furthermore, the controller 130 generates image data related to the substrate configuration data containing this wafer information, carrier information, transport information, etc., and displays it editably on the input / output device 131.

[0129] In the step (S4) of outputting simulation results, as a result of the controller 130 generating substrate configuration data such as boat mapping, for example, it is shown that... Figure 12The example screen shown illustrates this. Thus, the controller 130 is configured to display, based on the transfer parameters selected in S1 and various transport parameters set in S2, the type and number of wafers 200 held in the carrier 217, the carrier mapping, and carrier attributes (in...). Figure 13 The data includes substrate configuration data such as category, shelf number of the shelf in the wafer cassette 110, slot number of the substrate support portion in the boat 217, number of times the wafer transfer mechanism 125 transfers the wafer 200, and transfer order in which the wafer 200 is loaded into the slot number by the wafer transfer mechanism 125.

[0130] Furthermore, by confirming the screen, for example, if the number of transmissions increases, pressing the cancel button returns to the screen for selecting the WAP file, allowing for repeated simulations. Additionally, transmission parameters can be adjusted each time a simulation is repeated, and the screen can be displayed multiple times. Figure 12 The screen shown confirms the substrate configuration data.

[0131] According to this embodiment, the time spent confirming the configuration of the wafer 200 or whether it follows a prescribed delivery sequence can be reduced. Furthermore, discrepancies related to the wafer configuration by the user and the controller can be eliminated, preventing setting errors. Moreover, since the number of times the wafer 200 is transferred to the carrier 217 may vary depending on the delivery parameter settings, optimal delivery parameter settings that minimize the number of deliveries can be achieved.

[0132] (Effects of this implementation method)

[0133] As described above, according to this embodiment, one or more of the effects shown below are obtained.

[0134] (1) According to this embodiment, it is possible to confirm whether the generated WAP file is the desired wafer mapping before the actual delivery of the wafer 200.

[0135] (2) According to this embodiment, the type of wafer mapping can be confirmed by generating a WAP file without actually transporting the wafer 200.

[0136] (3) According to this embodiment, if the desired WAP file mapping is input in advance, the best WAP file can be retrieved by comparing it with the pre-stored WAP file-based WAP file mapping. Therefore, the time can be shortened compared with creating a new WAP file, and a WAP file with very few transmission errors caused by misconfiguration can be created.

[0137] Next, use Figure 13 The process of performing the substrate processing procedure is explained. Regarding this substrate processing procedure, the process is created based on the transfer parameter file obtained from this simulator, and the process is executed to process the substrate.

[0138] Step S101 is the process of creating a WAP file for the manufacturing process. Basically, a WAP file stored in the storage device 130c is selected. However, it is also possible to use a file created via... Figure 5B The simulated WAP file shown above.

[0139] Step S102 is to obtain the pass Figure 5B The above-described process for creating a simulated WAP file is illustrated. Specifically... Figure 5B In the case of controller 130, the control unit downloads the WAP file obtained through simulation to the transport controller, which then reads and expands the WAP file. Furthermore, in the case of manufacturing the processing wafer 200 using the WAP file stored in storage device 130c, step S102 is skipped, and the process proceeds to step S103.

[0140] and, Figure 5B The control unit does not necessarily have to be the controller 130; it can be configured as a general-purpose computer. For example, it can be a commercially available personal computer (hereinafter referred to as a PC). Furthermore, such a PC can be configured separately from the substrate processing device 100 (transfer controller). In short, the substrate mapping fabrication unit is built inside the PC, as long as it can execute the substrate configuration program.

[0141] Step S103 is a process step in fabricating the processing chip 200. This process is performed by selecting a process technology stored in the storage device 130c. A WAP file can be pre-associated with the process technology. When associated with a process technology, the WAP file is selected along with the process technology selection. Conversely, when not associated with a process technology, a separate WAP file can be selected. Alternatively, the process technology and the WAP file can be mutually associated. In this case, the WAP file is selected along with the process technology selection, and the process technology is selected by selecting the WAP file.

[0142] In step S104, the controller 130 is configured to perform a substrate processing step, which involves processing the substrate by executing the process fabricated in step S103.

[0143] This substrate processing step is, for example, a step used in the manufacture of semiconductor devices. Furthermore, in the following description, the operation and processing of each part constituting the substrate processing apparatus 100 are controlled by the controller 130.

[0144] Here, an example of forming a film on a wafer 200 by alternately supplying a first processing gas (raw material gas) and a second processing gas (reactant gas) to the wafer 200, which serves as a substrate, will be described. Furthermore, for example, a predetermined film may be pre-formed on the wafer 200, and a predetermined pattern may also be pre-formed on the wafer 200 or the predetermined film.

[0145] (Substrate handling process)

[0146] First, a substrate loading process is performed, in which the wafer 200 is loaded into the boat 217 and moved into the processing chamber 201.

[0147] (Film forming process)

[0148] Next, a film formation process is performed to form a film on the surface of the wafer 200. The film formation process consists of the following four steps performed sequentially. In addition, between steps 1 to 4 below, the wafer 200 is heated to a predetermined temperature using a heater 206. Furthermore, the pressure is maintained at a predetermined pressure.

[0149] [Step 1]

[0150] In step 1, the raw material gas is circulated. First, the valve located in the raw material gas supply pipe and the APC valve 243 located in the exhaust pipe 231 are opened together, allowing the raw material gas, whose flow rate is regulated by the MFC, to be supplied to the processing chamber 201 through the nozzle while being exhausted from the exhaust pipe 231. At this time, the pressure in the processing chamber 201 is maintained at a predetermined pressure. As a result, a silicon thin film is formed on the surface of the wafer 200.

[0151] [Step 2]

[0152] In step 2, the valve of the raw material gas supply pipe is closed to stop the supply of raw material gas. The APC valve 243 of the exhaust pipe 231 remains open, and the vacuum pump 246 is used to exhaust the processing chamber 201 to remove residual gas from the processing chamber 201.

[0153] [Step 3]

[0154] In step 3, the reaction gas is circulated. Valve 334, located in the third gas supply pipe 330, and APC valve 243, located in the exhaust pipe 231, are opened together. NH3 gas, whose flow rate is regulated by MFC 332, is supplied from nozzle 430 to the processing chamber 201 and exhausted from the exhaust pipe 231. Additionally, the pressure in the processing chamber 201 is adjusted to a predetermined pressure. Through the supply of the reaction gas, the raw material gas undergoes a surface reaction with the thin film formed on the surface of the wafer 200, forming a predetermined film on the wafer 200.

[0155] [Step 4]

[0156] In step 4, the processing chamber 201 based on inactive gas is purged again. Valve 334 of the third gas supply pipe 330 is closed to stop the supply of reactive gas. The APC valve 243 of the exhaust pipe 231 remains open, and the processing chamber 201 is vented using the vacuum pump 246 to remove residual gas from the processing chamber 201.

[0157] The above steps 1 to 4 are repeated as a cycle, and the cycle is repeated multiple times, thereby forming a specified film on the wafer 200.

[0158] (Substrate removal process)

[0159] Next, the boat 217, on which the wafer 200 with the prescribed film is placed, is removed from the processing chamber 201.

[0160] As described above, by using a boat-and-table mapping simulator to manufacture the process, it is possible to determine where the wafer 200 will be transferred to the boat 217. Therefore, even if there is an error in the transfer position of the wafer 200, it can be detected. Thus, errors in the transfer position of the wafer 200 can be suppressed. As a result, even while the process is being executed, substrate loss due to errors in the wafer 200's placement will be prevented.

[0161] As described above, by using a boat-and-vessel mapping simulator to create the process, it is possible to obtain the optimal transfer parameter file through the simulator. As a result, a process with optimal processing conditions can be created. For example, if a transfer parameter file with the shortest transfer time is selected, throughput is expected to improve. Furthermore, for example, if a transfer parameter file with the fewest transfer cycles is selected, the maintenance cycle of the transfer machine can be extended.

[0162] Furthermore, the entire disclosure of Japanese Patent Application No. 2020-160829, filed on September 25, 2020, is incorporated herein by reference.

[0163] All the documents, patent applications and technical standards described in this specification are specific to the same extent as those obtained by reference to each document, patent application and technical standard described in this specification.

Claims

1. A method for displaying substrate configuration data, characterized in that, have: The process involves setting transfer parameters that determine the configuration of at least a predetermined substrate to be loaded into the substrate holder, and carrier information for receiving the predetermined substrate to be loaded into the substrate holder. The manufacturing process involves creating substrate configuration data based on the set transfer parameters and carrier information, in order to load the substrate onto the substrate holder. In the display process, when displaying the substrate configuration data, at least the configuration data of the substrate in the state where the substrate is loaded into the substrate holder is displayed. The manufacturing process includes a calculation step, which compares the manufactured substrate configuration data with pre-registered target substrate configuration data and calculates the offset between the manufactured substrate configuration data and the target substrate configuration data.

2. The method for displaying substrate configuration data according to claim 1, characterized in that, In the calculation process, the types of substrates filled in the substrate holder are compared.

3. The method for displaying substrate configuration data according to claim 1, characterized in that, In the calculation process, the ratio of the number of substrates of different types in the substrate configuration data to the number of substrates that can be loaded into the substrate holder is calculated.

4. The method for displaying substrate configuration data according to claim 1, characterized in that, In the display process, when displaying the offset situation, the portion of the substrate configuration data where the substrate category differs between the substrate configuration data is displayed first.

5. The method for displaying substrate configuration data according to claim 1, characterized in that, The display method further includes: a correction step, which corrects the configuration data of the manufactured substrate. In the correction process, the contents set in the transfer parameters used in the fabrication of the substrate configuration data are corrected.

6. The method for displaying substrate configuration data according to claim 1, characterized in that, The display method further includes: a registration step, which registers data indicating the configuration of the substrate in a state where the substrate is loaded into the substrate holder. In the manufacturing process, the consistency rate between substrate configuration data manufactured according to a plurality of pre-stored transfer parameters and the registered data representing the configuration of the substrate is calculated.

7. The method for displaying substrate configuration data according to claim 6, characterized in that, In the display process, the side with the higher consistency rate is displayed first.

8. The method for displaying substrate configuration data according to claim 6, characterized in that, In the display process, the portion that deviates from the substrate configuration data generated according to the selected transfer parameters is displayed first.

9. The method for displaying substrate configuration data according to claim 8, characterized in that, The display method further includes: a correction step, which corrects the configuration data of the fabricated substrate; The storage process involves storing the substrate configuration data produced based on the selected transfer parameters. In the correction process, the contents set in the transfer parameters used in the fabrication of the saved substrate configuration data are corrected.

10. The method for displaying substrate configuration data according to claim 1, characterized in that, In the setting process, transport parameters related to the transport mechanism that transports the substrate to the substrate holder are also set.

11. The method for displaying substrate configuration data according to claim 10, characterized in that, The transport parameters are set from at least one of the following groups: parameters related to information about the structure of the transport mechanism, parameters related to the transport function including wafer transfer, and parameters related to the adjustment function of the transport mechanism during maintenance.

12. The method for displaying substrate configuration data according to claim 1, characterized in that, In the manufacturing process, at least one is calculated from the group consisting of the type and number of substrates held in the substrate holder, the carrier attributes determined by the type of wafer housed in the carrier, the slot number indicating the number of the substrate support provided in the substrate holder, the number of times the substrate is transported by the transport mechanism, and the transport sequence in which the substrate is loaded into the slot number by the transport mechanism.

13. A method for manufacturing a semiconductor device, characterized in that, have: The process involves setting transfer parameters that determine the configuration of at least a predetermined substrate to be loaded into a substrate holder and carrier information that stores the predetermined substrate to be loaded into the substrate holder. A process of creating substrate configuration data for loading the substrate into the substrate holder based on the set transfer parameters and carrier information; When displaying the substrate configuration data, at least the process of displaying data indicating the configuration of the substrate in the state of being loaded into the substrate holder; The process of conveying the substrate according to the substrate configuration data; The manufacturing process includes: comparing the manufactured substrate configuration data with pre-registered target substrate configuration data, and calculating the offset between the manufactured substrate configuration data and the target substrate configuration data.

14. A computer-readable recording medium containing a program, characterized in that, The procedure causes the substrate processing device to execute: The steps include setting transfer parameters that determine the configuration of at least a predetermined substrate to be loaded into the substrate holder and carrier information for receiving the predetermined substrate to be loaded into the substrate holder. The step of creating substrate configuration data for loading the substrate into the substrate holder based on the set transfer parameters and carrier information; When displaying the substrate configuration data, at least the step of displaying data indicating the configuration of the substrate in a state where the substrate is loaded into the substrate holder is shown; The manufacturing process includes the following steps: comparing the manufactured substrate configuration data with pre-registered target substrate configuration data, and calculating the offset between the manufactured substrate configuration data and the target substrate configuration data.

15. A substrate processing apparatus comprising: The processing chamber, which processes the substrate; A substrate holder that holds the substrate; A conveying mechanism that loads the substrate into the substrate holder; The control unit controls the conveying mechanism. Its features are, The control unit is configured to set transfer parameters that determine the arrangement of at least a predetermined substrate to be loaded into the substrate holder, and carrier information for receiving the predetermined substrate to be loaded into the substrate holder. Based on the set transfer parameters and carrier information, it generates substrate arrangement data when the substrate is loaded into the substrate holder. When displaying the substrate arrangement data, it displays at least the data indicating the arrangement of the substrate when the substrate is loaded into the substrate holder. When the substrate configuration data is being generated, the control unit compares the generated substrate configuration data with the pre-registered target substrate configuration data and calculates the offset between the generated substrate configuration data and the target substrate configuration data.

Images