Double-sided vertical electroplating fixture
By designing a double-sided vertical electroplating fixture, and utilizing a combination of hangers, conductive blocks, and wire assemblies, double-sided multi-piece electroplating was achieved, solving the problems of production capacity and uniformity, and improving the production efficiency and product quality of electroplating fixtures.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-04-12
- Publication Date
- 2026-03-31
AI Technical Summary
Existing electroplating fixtures cannot meet customers' production capacity requirements, cannot achieve double-sided multi-piece designs, and cannot achieve single-sided single-current matching or single-product single-current matching according to customer needs, resulting in low production capacity, low product yield, and poor uniformity of thickness.
A double-sided vertical electroplating fixture was designed, including an electroplating tank and an electroplating mechanism. The electroplating mechanism is equipped with electroplating components. Through the combination of hangers, conductive blocks, electric columns and wire assemblies, a double-sided multi-plate design is realized. And by independently controlling the electric field and flow field on the front and back sides, single-sided single current matching is achieved.
This technology enables double-sided, multi-piece electroplating, improving production capacity, ensuring product yield and thickness uniformity, and solving the problems of low production capacity and poor thickness uniformity in traditional tooling.
Smart Images

Figure CN116200797B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of fixture technology for vertical electroplating systems, specifically to double-sided vertical electroplating fixtures. Background Technology
[0002] A wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. Electroplating is the process of depositing a thin layer of other metals or alloys onto the surface of certain metals using the principle of electrolysis. After a specific metal is deposited on the conductive layer of a wafer, it has advantages such as excellent conductivity, good stability, and ease of wire bonding and sintering, making the electroplating work on wafers very important. At the same time, the electroplating work of some panels is similar to that of wafers. Therefore, electroplating fixtures used for wafer or panel electroplating have emerged accordingly. With the continuous development of technology, the development trend of electroplating fixtures is becoming more and more diversified.
[0003] Existing electroplating fixtures have the following technical defects: They are generally designed for single-sided, single-product electroplating or double-sided, single-product electroplating, and lack a double-sided, multi-piece design, making it impossible to meet customer production capacity requirements. Furthermore, existing electroplating fixtures can only achieve single-current, single-electric-field electroplating, and cannot achieve single-sided, single-current matching or single-product, single-current matching according to customer needs, or ensure that the electric fields on the front and back sides of the fixture do not interfere with each other. This results in low production capacity, low product yield, and poor uniformity of thickness. Summary of the Invention
[0004] The purpose of this invention is to provide a double-sided, multi-sheet vertical electroplating fixture to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a double-sided vertical electroplating fixture, including an electroplating tank, an electroplating mechanism is provided inside the electroplating tank, the electroplating mechanism is slidably connected to the electroplating tank, an electroplating component is provided on the electroplating mechanism, the electroplating mechanism is used to fix the object to be plated in the electroplating tank, and the electroplating tank is filled with an electroplating solution for electroplating the object to be plated on the electroplating mechanism;
[0006] The electroplating mechanism includes a hanger, a conductive block, a current collector, an electric column, a wire assembly, and a hoisting structure. The hanger is slidably connected to the inner side of the electroplating tank. The conductive block is fixedly connected to the upper part of the hanger. The current collector is fixedly connected to the inner side of the upper part of the hanger and to one side of the conductive block. The electric column is fixedly connected to the upper side of the current collector. The wire assembly is fixedly connected to the lower part of the current collector and inside the hanger. The hoisting structure is also provided on the hanger.
[0007] Furthermore, the structure of the wire assembly includes a first wire, a second wire, and a third wire. The first wire is fixedly connected to the lower side of the current collector and near the center of the bracket. The second wire is fixedly connected to the lower side of the current collector and away from the first wire. The third wire is fixedly connected to the lower side of the current collector and away from the second wire. The first, second, and third wires are of equal length and are symmetrically arranged about the electroplating tank, and are also arranged on both sides about the electroplating tank.
[0008] Furthermore, the hoisting structure includes a mounting plate and hoisting holes. The bracket has hoisting holes, and the bracket is fixedly connected to the mounting plate by mounting screws. The mounting plate corresponds to the hoisting holes.
[0009] Furthermore, the electroplating assembly includes a silicon wafer groove, a product body, a conductive sheet, a conductive ring, a rubber ring, a metal bump, and a manual sealing assembly. The bracket has a silicon wafer groove, and the product body is snapped into the inner side of the silicon wafer groove. The conductive sheet is fixedly connected inside the bracket, and the bracket has a groove corresponding to the conductive sheet.
[0010] Furthermore, a conductive ring is snapped into the inner side of the silicon wafer groove and the outer side of the product body. The conductive ring has a protrusion corresponding to the conductive sheet, and the protrusion is in close contact with the conductive sheet. A rubber ring is snapped into the inner side of the silicon wafer groove and the outer side of the conductive ring, and the rubber ring is in close contact with the product body.
[0011] Place the product body in the silicon wafer groove opened on the hanger and align it with the boundary of the silicon wafer groove. Then align the conductive ring protrusion with the conductive sheet and make it in close contact with it. At the same time, snap the conductive ring into the inside of the silicon wafer groove. Then align the rubber ring with the conductive ring and stack it on the outside of the conductive ring. At the same time, the rubber ring should be pressed tightly against the outside of the product body.
[0012] Furthermore, the manual sealing assembly includes a manual sealing frame and Torx screws. The manual sealing frame is provided on the outer side of the bracket and corresponds to the product body. The manual sealing frame is fixedly connected to the bracket by evenly distributed Torx screws. The manual sealing frame is provided with metal protrusions. The rubber ring is in close contact with the manual sealing frame and the product body.
[0013] The metal bump and the manual sealing frame are integrally formed by milling.
[0014] Place the manual sealing frame on the hanger and align the screw holes on the manual sealing frame with the screw holes on the hanger. Insert the Torx screws into the screw holes one by one, and the operator uses the external screwdriver knob to fix them. This completes the operation of fixing the product body on the hanger. Repeat this process to install multiple product bodies at multiple positions on the front and back of the hanger.
[0015] Furthermore, it also includes an automatic sealing assembly, which comprises an airbag, a lifting seat, a spring, a pad, and an automatic sealing frame. The airbag, lifting seat, and spring are snapped into the inner side of the bracket, arranged sequentially from the inside to the outside. The bracket has grooves corresponding to the lifting seat and spring. The pad is snapped into the inner side of the bracket, and the product body is snapped into the inner side of the pad. The automatic sealing frame is also snapped into the inner side of the bracket. The lifting seat is provided with evenly distributed cylindrical protrusions, and the spring is provided with teardrop-shaped openings corresponding to the cylindrical protrusions. The automatic sealing frame is fixedly connected with locking pins corresponding to the teardrop-shaped openings.
[0016] It also includes a pneumatic cylinder-type sealed bracket, replacing the airbag, lifting seat, and spring with a pneumatic cylinder.
[0017] The product itself has a square design.
[0018] Install the airbag, lifting seat, and spring clip into the inside of the bracket in sequence. Then install the pad into the inside of the bracket. Next, install the product body into the inside of the pad. Then insert the locking pin on the automatic sealing frame into the inside of the bracket and align it with the teardrop-shaped opening on the spring clip.
[0019] Because the inside of the bracket has through holes corresponding to the airbag, and a connecting tube is installed in the through holes, one end of the connecting tube is connected to the airbag, so that an external air pump is connected to the other end of the connecting tube. When the external air pump is started, gas is used to inflate the airbag through the connecting tube. After the airbag is inflated, it lifts the lifting seat. Because the lifting seat and the edge of the spring have uneven design, this feature is used to fasten the lifting seat and the spring to the outside of the airbag and in the groove inside the bracket. During the lifting process, the lifting seat pushes the inner ring of the spring to tilt outward, so that the locking pin on the automatic sealing frame extends from the large side of the teardrop-shaped opening and moves to the small side.
[0020] The airbag is then deflated, allowing the lifting seat and spring to gradually return to their initial state. During this process, the locking pin is pulled down, which in turn tightens the automatic sealing frame, thus achieving the purpose of automatic sealing installation of the product body.
[0021] The automatic sealing assembly can also be designed as a pneumatic cylinder type or a spring type. The pneumatic cylinder type is designed to remove the airbag, lifting seat, spring and pad and replace them with a cylinder. The pneumatic cylinder on the bracket fastens the locking pin on the automatic sealing ring to achieve the sealing effect.
[0022] Furthermore, as shown in the figure, the number of electrode posts is set to six, and the six electrode posts correspond to the first wire, the second wire, and the third wire. This patent application encompasses all products to be plated that are mounted on an electroplating fixture. Therefore, the tank size and electroplating fixture size are increased, allowing for a greater number of products to be plated.
[0023] Furthermore, the product types are not limited to round and square shapes, and can vary according to customer needs;
[0024] After installing all the product bodies on both sides of the bracket, use an external voltmeter to measure whether there is conductivity between the conductive block and the product body. If the voltmeter reading is between 0. and 0., the conductivity is normal. If not, the installation needs to be readjusted.
[0025] When the conductivity between the conductive block and the product body is found to be normal, the surface of the product body is cleaned with an air gun. Then, multiple external cathode wires are connected to the conductive block, allowing each cathode wire to independently control the current in one of the first, second, or third wires. The current from the external power supply is distributed evenly to the surface of the object being plated via the conductive block, wires, current collector, electrode post, wire assembly, and finally, via a conductive ring. The surface of the product body is then rinsed with an external water gun.
[0026] Furthermore, a guide block is fixedly connected to the outside of the bracket, and a rectangular through slot corresponding to the guide block is opened on the electroplating tank. The electric column and the conductive block are connected by an electric wire.
[0027] Furthermore, the number of conductive sheets corresponds to the number of the first wire, the second wire, and the third wire, and the corresponding conductive sheets are fixedly connected to the first wire, the second wire, and the third wire, respectively. The conductive sheets are placed in the o'clock direction, the o'clock direction, and the o'clock direction.
[0028] After cleaning, the fixture is inserted into the electroplating tank containing the electroplating solution. Then, the electroplating tank is started by an external industrial computer to perform electroplating on the product body on the fixture. During the electroplating process, because the electroplating mechanism is placed in the middle of the electroplating tank, it divides the electroplating solution inside the electroplating tank into two independent electric fields and flow fields, so that the electric fields and flow fields on the front and back sides can be controlled independently. At the same time, the current flowing into each product body can also be controlled independently.
[0029] Compared with the prior art, the present invention provides a double-sided vertical electroplating fixture, which has the following advantages:
[0030] 1. The fixture of this vertical electroplating system, through the cooperation of the hanger, conductive ring, conductive sheet, silicon wafer groove, rubber ring, conductive ring, metal bump, manual sealing frame and Torx screw, enables the installation of multiple products for electroplating on both sides of the hanger, thus achieving the effect of double-sided multi-sheet design. This solves the problem that existing electroplating fixtures are generally single-sided single-product electroplating or double-sided one-product electroplating methods and structures, which do not have a double-sided multi-sheet design and cannot meet the customer's production capacity requirements.
[0031] 2. The fixture of this vertical electroplating system is designed so that the first, second, and third wires are all placed inside the hanger, thereby ensuring that the first, second, and third wires are always in a dry environment. This changes the traditional method of exposing the wires of the fixture to the chemical solution, and eliminates the problem of metal layer growing on the surface of the wires of the traditional fixture due to long-term exposure to the chemical solution, which affects the service life and the uniformity of the plated object.
[0032] 3. The fixture of this vertical electroplating system is connected one-to-one with conductive sheets, conductive blocks, and electric columns through the first, second, and third wires. The electroplating mechanism divides the electroplating solution inside the electroplating tank into two independent electric fields and flow fields, so that the electric fields and flow fields on the front and back sides can be controlled independently. At the same time, it achieves single-sided single current matching or single-product single current matching, and the electric fields on the front and back sides of the fixture do not interfere with each other. This solves the problems of low production capacity, low product yield, and poor uniformity of thickness. Attached Figure Description
[0033] Figure 1 This is a three-dimensional structural diagram of the combination of the tooling and the electroplating tank of the present invention;
[0034] Figure 2 This is an exploded three-dimensional structural diagram of the tooling and electroplating tank of the present invention;
[0035] Figure 3 This is a cross-sectional three-dimensional structural diagram of the electroplating tank of the present invention;
[0036] Figure 4 This is a front three-dimensional structural diagram of the bracket of the present invention;
[0037] Figure 5 This is a three-dimensional structural diagram of the back of the hanging bracket of the present invention;
[0038] Figure 6 This is a three-dimensional structural diagram of the silicon wafer groove of the present invention;
[0039] Figure 7 This is a three-dimensional structural diagram of the electroplating mechanism of the present invention;
[0040] Figure 8 This is a bottom-view three-dimensional structural diagram of the bracket of the present invention;
[0041] Figure 9 This is a three-dimensional structural diagram of the wire assembly of the present invention;
[0042] Figure 10 This is a schematic diagram of the combined three-dimensional structure of the hanger and electroplating components of the present invention after disassembly.
[0043] Figure 11 This is an exploded three-dimensional structural diagram of the electroplating component of the present invention.
[0044] Figure 12 This is an exploded three-dimensional structural diagram of the back side of the electroplating component of the present invention;
[0045] Figure 13 This is a schematic diagram of the overall exploded three-dimensional structure of the tooling in Embodiment 2 of the present invention;
[0046] Figure 14 This is an exploded three-dimensional structural diagram of the automatic sealing component in Embodiment 2 of the present invention.
[0047] In the diagram: 1. Electroplating tank; 2. Electroplating mechanism; 21. Hanger; 22. Conductive block; 23. Current collector; 24. Electrostatic column; 25. Wire assembly; 251. First wire; 252. Second wire; 253. Third wire; 26. Lifting structure; 261. Mounting plate; 262. Lifting hole; 3. Electroplating assembly; 31. Silicon wafer groove; 32. Product body; 33. Conductive sheet; 34. Conductive ring; 35. Rubber ring; 36. Metal protrusion; 37. Manual sealing assembly; 371. Manual sealing frame; 372. Torx screw; 4. Automatic sealing assembly; 41. Airbag; 42. Lifting seat; 43. Spring; 44. Pad; 45. Automatic sealing frame. Detailed Implementation
[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1
[0049] Please see Figures 1-12A double-sided vertical electroplating fixture includes an electroplating tank 1, an electroplating mechanism 2 is provided inside the electroplating tank 1, the electroplating mechanism 2 is slidably connected to the electroplating tank 1, an electroplating component 3 is provided on the electroplating mechanism 2, the electroplating mechanism 2 is used to fix the object to be plated in the electroplating tank 1, the electroplating tank 1 is filled with electroplating solution, and is used to electroplat the object to be plated on the electroplating mechanism 2.
[0050] The electroplating mechanism 2 includes a hanger 21, a conductive block 22, a current collector 23, an electric column 24, a wire assembly 25, and a hoisting structure 26. The hanger 21 is slidably connected to the inner side of the electroplating tank 1. The conductive block 22 is fixedly connected to the upper part of the hanger 21. The current collector 23 is fixedly connected to the inner side of the upper part of the hanger 21 and to one side of the conductive block 22. The electric column 24 is fixedly connected to the upper side of the current collector 23. The wire assembly 25 is fixedly connected to the lower part of the current collector 23 and inside the hanger 21. The hoisting structure 26 is also provided on the hanger 21.
[0051] Furthermore, the structure of the wire assembly 25 includes a first wire 251, a second wire 252, and a third wire 253. The first wire 251 is fixedly connected to the lower side of the current collector 23 and near the center of the bracket 21. The second wire 252 is fixedly connected to the lower side of the current collector 23 and away from the first wire 251. The third wire 253 is fixedly connected to the lower side of the current collector 23 and away from the second wire 252. The first wire 251, the second wire 252, and the third wire 253 are of equal length. The first wire 251, the second wire 252, and the third wire 253 are symmetrically arranged about the electroplating tank 1 and are also arranged on both sides about the electroplating tank 1.
[0052] Furthermore, the structure of the hoisting structure 26 includes a mounting plate 261 and a hoisting hole 262. The bracket 21 has a hoisting hole 262, and the mounting plate 261 is fixedly connected to the bracket 21 by mounting screws. The mounting plate 261 corresponds to the hoisting hole 262.
[0053] Furthermore, the electroplating component 3 includes a silicon wafer groove 31, a product body 32, a conductive sheet 33, a conductive ring 34, a rubber ring 35, a metal bump 36, and a manual sealing component 37. The bracket 21 has a silicon wafer groove 31, and the product body 32 is snapped into the inner side of the silicon wafer groove 31. The conductive sheet 33 is fixedly connected inside the bracket 21, and the bracket 21 has a groove corresponding to the conductive sheet 33.
[0054] Furthermore, a conductive ring 34 is snapped into the inner side of the silicon wafer groove 31 and the outer side of the product body 32. The conductive ring 34 has a protrusion corresponding to the conductive sheet 33. The protrusion is in close contact with the conductive sheet 33. A rubber ring 35 is snapped into the inner side of the silicon wafer groove 31 and the outer side of the conductive ring 34. The rubber ring 35 is in close contact with the product body 32.
[0055] Place the product body 32 in the silicon wafer groove 31 opened on the bracket 21 and align it with the boundary of the silicon wafer groove 31. Then align the protrusion of the conductive ring 34 with the conductive sheet 33 and make it in close contact with it. At the same time, snap the conductive ring 34 into the inside of the silicon wafer groove 31. Then align the rubber ring 35 with the conductive ring 34 and stack it on the outside of the conductive ring 34. At the same time, the rubber ring 35 is pressed tightly against the outside of the product body 32.
[0056] Furthermore, the manual sealing assembly 37 includes a manual sealing frame 371 and Torx screws 372. The manual sealing frame 371 is provided on the outer side of the bracket 21. The manual sealing frame 371 corresponds to the product body 32. The manual sealing frame 371 is fixedly connected to the bracket 21 by evenly distributed Torx screws 372. The manual sealing frame 371 is provided with metal protrusions 36 and rubber rings 35, which are in close contact with the manual sealing frame 371 and the product body 32.
[0057] Place the manual sealing frame 371 on the bracket 21 and align the screw holes on the manual sealing frame 371 with the screw holes on the bracket 21. Insert the Torx screws 372 into the screw holes one by one, and the operator uses an external screwdriver to tighten the screws. This completes the operation of fixing the product body 32 on the bracket 21. Repeat this process to install multiple product bodies 32 at multiple positions on the front and back of the bracket 21 according to the above operation.
[0058] Furthermore, the number of electrical posts 24 is set to six, with the six electrical posts 24 corresponding to the first wire 251, the second wire 252, and the third wire 253.
[0059] After all the product bodies 32 on both sides of the bracket 21 are installed, use an external voltmeter to measure whether there is conductivity between the conductive block 22 and the product body 32. If the voltmeter reading is between 0.4 and 0.8, the conductivity is normal. If not, the installation needs to be readjusted.
[0060] When the conductivity between the conductive block 22 and the product body 32 is normal, the surface of the product body 32 is cleaned with an air gun. Then, multiple external cathode wires are connected to the conductive block 22, so that one cathode wire independently controls the current of one of the first wire 251, the second wire 252 and the third wire 253. Then, the surface of the product body 32 is rinsed with an external water gun.
[0061] Furthermore, a guide block is fixedly connected to the outside of the bracket 21, and a rectangular through slot corresponding to the guide block is opened on the electroplating tank 1. The electric post 24 and the conductive block 22 are connected by an electric wire.
[0062] Furthermore, the number of conductive sheets 33 corresponds to the number of the first wire 251, the second wire 252, and the third wire 253, and the corresponding conductive sheets 33 are fixedly connected to the first wire 251, the second wire 252, and the third wire 253 respectively. The conductive sheets 33 can be placed in the 12 o'clock, 11 o'clock, and 3 o'clock directions.
[0063] After cleaning, the fixture is inserted into the electroplating tank 1 containing the electroplating solution. Then, the electroplating tank 1 is started by an external industrial computer to perform electroplating on the product body 32 on the fixture. During the electroplating process, the electroplating mechanism 2 is placed in the middle of the electroplating tank 1, which divides the electroplating solution inside the electroplating tank 1 into two independent electric fields and flow fields. This allows the electric fields and flow fields on the front and back sides to be controlled independently, and the current flowing into each product body 32 can also be controlled independently. Example 2
[0064] like Figure 13 , 14 As shown, components that are the same as or corresponding to those in Embodiment 1 are referred to using the same reference numerals as in Embodiment 1. For simplicity, only the differences from Embodiment 1 are described below. The difference between Embodiment 2 and Embodiment 1 is as follows:
[0065] In this embodiment, an automatic sealing assembly 4 is also included. The automatic sealing assembly 4 includes an airbag 41, a lifting seat 42, a spring 43, a pad 44, and an automatic sealing frame 45. The airbag 41, the lifting seat 42, and the spring 43 are snapped into the inner side of the bracket 21. The airbag 41, the lifting seat 42, and the spring 43 are arranged sequentially from the inside to the outside inside the bracket 21. The bracket 21 has grooves corresponding to the lifting seat 42 and the spring 43. The pad 44 is snapped into the inner side of the bracket 21. The product body 32 is snapped into the inner side of the pad 44. The automatic sealing frame 45 is also snapped into the inner side of the bracket 21. The lifting seat 42 is provided with evenly distributed cylindrical protrusions. The spring 43 is provided with teardrop-shaped openings corresponding to the cylindrical protrusions. The automatic sealing frame 45 is fixedly connected with locking pins corresponding to the teardrop-shaped openings.
[0066] It also includes a pneumatic cylinder type sealing bracket, replacing the airbag 41, lifting seat 42, and spring 43 with a pneumatic cylinder.
[0067] The product body 32 has a square design.
[0068] The airbag 41, the lifting seat 42, and the spring 43 are sequentially snapped onto the inside of the bracket 21. Then, the pad 44 is snapped onto the inside of the bracket 21. Next, the product body 32 is snapped onto the inside of the pad 44. Then, the locking pin on the automatic sealing frame 45 is inserted into the inside of the bracket 21 and corresponds to the teardrop-shaped opening on the spring 43.
[0069] Since the inside of the bracket 21 has a through hole corresponding to the airbag 41, and a connecting tube is installed in the through hole, one end of the connecting tube is connected to the airbag 41, so that the other end of the connecting tube is connected to an external air pump. When the external air pump is started, gas is used to inflate the airbag 41 through the connecting tube. After the airbag 41 is inflated, it lifts the lifting seat 42. Since the lifting seat 42 and the spring 43 have uneven edges, the lifting seat 42 and the spring 43 are fastened to the outside of the airbag 41 and in the groove inside the bracket 21. During the lifting process, the lifting seat 42 pushes the inner ring of the spring 43 to tilt outward, so that the locking pin on the automatic sealing frame 45 extends from the large side of the teardrop-shaped opening and moves to the small side.
[0070] Then the airbag 41 is deflated, allowing the lifting seat 42 and spring 43 to gradually return to their initial state. During this process, the locking pin is pulled down, thereby tightening the automatic sealing frame 45, thus achieving the purpose of automatic sealing installation of the product body 32.
[0071] The specific usage and function of this embodiment are as follows:
[0072] In use, first place the product body 32 in the silicon wafer groove 31 opened on the bracket 21 and align it with the boundary of the silicon wafer groove 31. Then, align the protrusion of the conductive ring 34 with the conductive sheet 33 and make it in close contact with it. At the same time, snap the conductive ring 34 into the inside of the silicon wafer groove 31. Then, align the rubber ring 35 with the conductive ring 34 and stack it on the outside of the conductive ring 34. At the same time, the rubber ring 35 is pressed against the outside of the product body 32. Then, stack the metal protrusion 36 on the outside of the rubber ring 35 so that the metal protrusion 36 fills the groove where the conductive sheet 33 is located.
[0073] Then, the manual sealing frame 371 is placed on the bracket 21, and the screw holes on the manual sealing frame 371 are aligned with the screw holes on the bracket 21. The Torx screws 372 are then inserted into the screw holes one by one, and the operator uses an external screwdriver knob to fix them, thus completing the operation of fixing the product body 32 on the bracket 21. This process is repeated to install multiple product bodies 32 at multiple positions on the front and back of the bracket 21 according to the above operation.
[0074] After all the product bodies 32 on both sides of the bracket 21 are installed, use an external voltmeter to measure whether there is conductivity between the conductive block 22 and the product body 32. If the resistance value of the voltmeter is between 0.4 and 0.8Ω, the conductivity is normal. If not, the installation needs to be readjusted.
[0075] When the conductivity between the conductive block 22 and the product body 32 is normal, the surface of the product body 32 is cleaned with an air gun. Then, multiple external cathode wires are connected to the conductive block 22, so that one cathode wire independently controls the current of one of the first wire 251, the second wire 252 and the third wire 253. Then, the surface of the product body 32 is rinsed with an external water gun.
[0076] After cleaning, the fixture is inserted into the electroplating tank 1 containing the electroplating solution. Then, the electroplating tank 1 is started by an external industrial computer to perform electroplating on the product body 32 on the fixture. During the electroplating process, the electroplating mechanism 2 is placed in the middle of the electroplating tank 1, which divides the electroplating solution inside the electroplating tank 1 into two independent electric fields and flow fields. This allows the electric fields and flow fields on the front and back sides to be controlled independently, and the current flowing into each product body 32 can also be controlled independently.
[0077] When the airbag design is in operation, the airbag 41, the lifting seat 42, and the spring 43 are sequentially snapped onto the inside of the bracket 21. Then, the pad 44 is snapped onto the inside of the bracket 21. Next, the product body 32 is snapped onto the inside of the pad 44. Then, the locking pin on the automatic sealing frame 45 is inserted into the inside of the bracket 21 and corresponds to the teardrop-shaped opening on the spring 43.
[0078] Since the inside of the bracket 21 has a through hole corresponding to the airbag 41, and a connecting tube is installed in the through hole, one end of the connecting tube is connected to the airbag 41, so that the other end of the connecting tube is connected to an external air pump. When the external air pump is started, gas is used to inflate the airbag 41 through the connecting tube. After the airbag 41 is inflated, it lifts the lifting seat 42. Since the lifting seat 42 and the spring 43 have uneven edges, the lifting seat 42 and the spring 43 are fastened to the outside of the airbag 41 and in the groove inside the bracket 21. During the lifting process, the lifting seat 42 pushes the inner ring of the spring 43 to tilt outward, so that the locking pin on the automatic sealing frame 45 extends from the large side of the teardrop-shaped opening and moves to the small side.
[0079] Then the airbag 41 is deflated, allowing the lifting seat 42 and spring 43 to gradually return to their initial state. During this process, the locking pin is pulled down, thereby tightening the automatic sealing frame 45, thus achieving the purpose of automatic sealing installation of the product body 32.
[0080] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. Double-sided vertical electroplating apparatus comprising an electroplating bath (1), characterized in that: The inside of the electroplating tank (1) is provided with an electroplating mechanism (2), which is in sliding connection with the electroplating tank (1), and the electroplating mechanism (2) is provided with an electroplating assembly (3), which is used for fixing the to-be-plated object in the electroplating tank (1), and the inside of the electroplating tank (1) contains electroplating solution, which is used for electroplating the to-be-plated object on the electroplating mechanism (2); The electroplating mechanism (2) comprises a hanger (21), a conductive block (22), a current collecting block (23), an electric column (24), a wire assembly (25) and a hoisting structure (26), the inside of the electroplating tank (1) is in sliding connection with the hanger (21), the upper part of the hanger (21) is fixedly connected with the conductive block (22), the upper inside of the hanger (21) and on one side of the conductive block (22) are fixedly connected with the current collecting block (23), the upper side of the current collecting block (23) is fixedly connected with the electric column (24), the lower part of the current collecting block (23) and in the inside of the hanger (21) are fixedly connected with the wire assembly (25), and the hanger (21) is further provided with the hoisting structure (26); The structure of the wire assembly (25) comprises a first wire (251), a second wire (252) and a third wire (253), the lower side of the current collecting block (23) and close to the center of the hanger (21) are fixedly connected with the first wire (251), the lower side of the current collecting block (23) and away from one side of the first wire (251) are fixedly connected with the second wire (252), and the lower side of the current collecting block (23) and away from one side of the second wire (252) are fixedly connected with the third wire (253), the first wire (251), the second wire (252) and the third wire (253) are arranged in equal length, the first wire (251), the second wire (252) and the third wire (253) are symmetrically arranged about the electroplating tank (1) and are double-sided about the electroplating tank (1); The electroplating assembly (3) comprises a silicon wafer groove (31), a product body (32), a conductive sheet (33), a conductive ring (34), a rubber ring (35), a metal bump (36) and a manual sealing assembly (37), the hanger (21) is provided with the silicon wafer groove (31), the inside of the silicon wafer groove (31) is clamped with the product body (32), the inside of the hanger (21) is fixedly connected with the conductive sheet (33), and the hanger (21) is provided with a groove corresponding to the conductive sheet (33); The inside of the silicon wafer groove (31) and outside of the product body (32) are clamped with the conductive ring (34), the conductive ring (34) is provided with a bump corresponding to the conductive sheet (33), the bump is in close contact with the conductive sheet (33), the inside of the silicon wafer groove (31) and outside of the conductive ring (34) are clamped with the rubber ring (35), and the rubber ring (35) is in close contact with the product body (32); The number of the electric columns (24) is six, and the six electric columns (24) correspond to the first wire (251), the second wire (252) and the third wire (253). The outer side of the hanger (21) is fixedly connected with a guide block, a rectangular through slot corresponding to the guide block is formed on the electroplating tank (1), and the electric column (24) is connected with the conductive block (22) through an electric wire; The number of the conductive sheets (33) corresponds to the first electric wire (251), the second electric wire (252) and the third electric wire (253), and the corresponding conductive sheets (33) are fixedly connected with the first electric wire (251), the second electric wire (252) and the third electric wire (253) respectively, and the placement positions of the conductive sheets (33) have the 12 o'clock direction, the 11 o'clock direction and the 3 o'clock direction. The electroplating mechanism (2) is placed in the middle of the electroplating tank (1) to separate the electroplating liquid in the electroplating tank (1) into two independent electric fields and flow fields, so that the electric fields and flow fields of the front and back surfaces can be independently controlled, and the current passing through each product body (32) can also be independently controlled.
2. The dual-sided vertical electroplating apparatus of claim 1, wherein: The structure of the hoisting structure (26) comprises a mounting plate (261) and a hoisting hole (262), the hoisting hole (262) is formed on the hanger (21), and the mounting plate (261) is fixedly connected to the hanger (21) through mounting screws.
3. The dual-sided vertical electroplating apparatus of claim 1, wherein: The structure of the manual sealing assembly (37) comprises a manual sealing frame (371) and a torx screw (372), the outer side of the hanger (21) is provided with the manual sealing frame (371), the manual sealing frame (371) corresponds to the product body (32), the manual sealing frame (371) is fixedly connected to the hanger (21) through the uniformly distributed torx screws (372), the manual sealing frame (371) is provided with a metal lug (36), and the rubber ring (35) is in close contact with the manual sealing frame (371) and the product body (32).
4. The dual-sided vertical electroplating apparatus of claim 1, wherein: The automatic sealing assembly (4) comprises an air bag (41), a jacking seat (42), a spring piece (43), a backing plate (44) and an automatic sealing frame (45), the inner side of the hanger (21) is connected with the air bag (41), the jacking seat (42) and the spring piece (43), the air bag (41), the jacking seat (42) and the spring piece (43) are arranged in the hanger (21) from inside to outside, the hanger (21) is provided with a groove corresponding to the jacking seat (42) and the spring piece (43), the inner side of the hanger (21) is connected with the backing plate (44), the product body (32) is connected to the inner side of the backing plate (44), and the inner side of the hanger (21) is also connected with the automatic sealing frame (45); The air cylinder type sealing hanger is also included, and the air bag (41), the jacking seat (42) and the spring piece (43) are replaced by an air cylinder; The product body (32) is designed in a square shape.
Citation Information
Patent Citations
Electroplating hanger and electroplating device
CN114351226A
Novel wafer cathode carrier device
CN214782241U