A miniaturized optical transceiver device and a method of manufacturing the same

Abstract

The application relates to the technical field of optical fiber sensing, and provides a miniaturized optical transceiver device and a manufacturing method thereof. A light source assembly is used for emitting outgoing signal light into a planar optical waveguide and emitting the outgoing signal light via the planar optical waveguide; the planar optical waveguide is used for transmitting incident signal light entering the device to a double-PD differential assembly; and the double-PD differential assembly is used for detecting the incident signal light and spatial crosstalk light, and performing differential processing on the respectively generated detection current and crosstalk current. The application greatly reduces the size and assembly complexity of the optical transceiver device, reduces the manufacturing difficulty and cost of the optical transceiver device, and can also reduce the insertion loss caused by optical fiber fusion.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical fiber sensing technology, in particular to a miniaturized optical transceiver device and a manufacturing method thereof. BACKGROUND

[0002] The optical fiber sensing device, such as an optical fiber gyroscope, is an instrument capable of accurately measuring the rotational angular velocity. In the prior art, the optical fiber gyroscope includes a light source, a detector, a tapered coupler, an integrated waveguide device, and a fiber coil. The above-mentioned devices are independent devices with tail fibers. The light source, the detector, and the tapered coupler are connected by optical fiber fusion. As a result, the optical fiber sensing device is large in size, and the assembly process is complex and difficult in technology. Therefore, it is urgent to overcome the defects of the prior art in the technical field. SUMMARY

[0003] The present application relates to the field of optical fiber sensing technology, in particular to a miniaturized optical transceiver device and a manufacturing method thereof.

[0004] The embodiment of the present application adopts the following technical scheme:

[0005] In a first aspect, the present application provides a miniaturized optical transceiver device, which comprises a light source assembly 1, a planar optical waveguide 2, a double-PD differential assembly 3, and a transimpedance amplification circuit 4. The light source assembly 1 and the double-PD differential assembly 3 are coupled with the planar optical waveguide 2. The transimpedance amplification circuit 4 is electrically connected with the double-PD differential assembly 3. Specifically,

[0006] The light source assembly 1 is used to emit outgoing signal light into the planar optical waveguide 2 and emit the outgoing signal light via the planar optical waveguide 2.

[0007] The planar optical waveguide 2 is used to transmit the incoming signal light entering the device to the double-PD differential assembly 3.

[0008] The double-PD differential assembly 3 is used to detect the incoming signal light and the spatial crosstalk light and differentially process the detection current and the crosstalk current generated respectively.

[0009] The transimpedance amplification circuit 4 is used to amplify the gain of the photoelectric current output by the double-PD differential assembly 3 after differential processing and output the amplified voltage signal.

[0010] Preferably, the planar optical waveguide 2 comprises a 1x2 beam splitter 21, which comprises a first branch port 211, a second branch port 212, and a third convergence port 213. Specifically,

[0011] The outgoing signal light enters the 1x2 beam splitter 21 from the first branch port 211 and exits from the third convergent port 213;

[0012] The incident light beam of the device enters the 1x2 beam splitter 21 from the third convergent port 213 and exits from the second branch port 212 to the first PD chip 31 of the dual-PD differential assembly 3.

[0013] Preferably, the 1x2 beam splitter 21 further comprises:

[0014] The waveguide for forming the third convergent port 213 has an arc structure with a 180° bend, so that the first branch port 211, the second branch port 212 and the third convergent port 213 are located on the same side of the planar optical waveguide 2.

[0015] Preferably, the dual-PD differential assembly 3 comprises the first PD chip 31, the second PD chip 32 and the carrier 33, and the first PD chip 31 and the second PD chip 32 are arranged on the carrier 33, wherein the first PD chip 31 is used for detecting the incident signal light and outputting a detection current; and the second PD chip 32 is used for detecting the crosstalk light and outputting a crosstalk current.

[0016] Preferably, the first PD chip 31 and the second PD chip 32 are connected through the PD backplane with the gold-plated pattern 34 generated on the carrier 33, the negative electrode of the first PD chip 31 is connected with the positive electrode of the second PD chip 32; the positive electrode of the first PD chip 31 is powered by -5V, the negative electrode of the second PD chip 32 is grounded, and the positive electrode of the second PD chip 32 is connected with the current input end of the transimpedance amplification circuit 4; wherein the light-sensitive surfaces of the two PD chips are oriented in the same direction as the end surface of the super-radiation light-emitting diode in the light source assembly 1.

[0017] Preferably, the back surface of the transimpedance amplification circuit 4 is a silver-plated layer, which is used as the ground electrode of the amplification circuit and is adhered to the upper surface of the planar optical waveguide 2 by direct adhesion or adhesion through an insulating layer; the ground electrode of the transimpedance amplification circuit 4 is connected with the negative electrode of the second PD chip 32 by gold wire bonding.

[0018] Preferably, the dual-PD differential assembly 3 comprises the first PD chip 31, the second PD chip 32 and the carrier 33, the first PD chip 31 is arranged on the front surface of the carrier 33, the second PD chip 32 is arranged on the back surface of the carrier 33, and one or more waveguides 35 are arranged between the front surface and the back surface of the carrier 33, the one or more waveguides 35 are used for transmitting the crosstalk light near the first PD chip to the second PD chip located on the back surface of the carrier 33.

[0019] The first PD chip 31 is used for detecting incident signal light and outputting a detection current; and the second PD chip 32 is used for detecting spatial crosstalk light and outputting a crosstalk current.

[0020] Preferably, the light-incident surface of the one or more waveguides 35 is arranged on the front surface of the carrier 33 to fix the periphery of the first PD chip 31 region.

[0021] Preferably, the application further comprises a refrigerator assembly 5, which comprises a thermistor 51 and a semiconductor refrigerator 52, in particular:

[0022] The thermistor 51 is located beside the light source assembly 1 to detect the temperature of the light source; the cold end of the semiconductor refrigerator is connected to the heat-conductive ceramic substrate, and the hot end is connected to the bottom plate of the tube shell.

[0023] The heat-conductive ceramic substrate is used to carry the light source assembly 1, the planar light waveguide 2, the dual-PD differential assembly 3, and the transimpedance amplification circuit 4.

[0024] In a second aspect, the application provides a manufacturing method of a miniaturized optical transceiver device, which comprises the following steps: depositing and etching to manufacture a carrier 33 of a dual-PD differential assembly 3, wherein one or more waveguides 35 are generated between the front surface and the back surface of the carrier 33; the front surface of the carrier 33 is used to arrange a first PD chip 31, and the back surface of the carrier 33 is used to arrange a second PD chip 32; the one or more waveguides 35 are used to transmit crosstalk light near the first PD chip to the second PD chip located on the back surface of the carrier 33; and assembling each component according to the miniaturized optical transceiver device of the first aspect to obtain the miniaturized optical transceiver device.

[0025] Compared with the prior art, the embodiment of the application has the following advantages:

[0026] The miniaturized optical device provided by the application reduces the fiber fusion between devices, has the characteristics of high integration, small size, and low cost, greatly reduces the size and assembly complexity of the optical transceiver device, reduces the manufacturing difficulty and cost of the optical transceiver device, and also reduces the insertion loss caused by fiber fusion.

[0027] Further, in the preferred scheme of the application, an improved scheme of the dual-PD differential assembly is further provided, which can make the detection of crosstalk current more accurate, and make the optical transceiver device of the application further overcome the problem of reduced detection accuracy caused by crosstalk of light when the PD and the laser are arranged on the same side while improving the integration. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0029] Figure 1 is a schematic diagram of a small-sized optical transceiver device structure provided by the embodiment of the present application;

[0030] Figure 2 is a schematic diagram of a planar optical waveguide structure in a small-sized optical transceiver device provided by the embodiment of the present application;

[0031] Figure 3 is a schematic diagram of a double-PD differential assembly structure in a small-sized optical transceiver device provided by the embodiment of the present application;

[0032] Figure 4 is a schematic diagram of a double-PD differential assembly structure in a small-sized optical transceiver device provided by the embodiment of the present application;

[0033] Figure 5 is a schematic diagram of a double-PD differential assembly circuit in a small-sized optical transceiver device provided by the embodiment of the present application;

[0034] Figure 6 is a schematic diagram of another improved double-PD differential assembly structure in a small-sized optical transceiver device provided by the embodiment of the present application;

[0035] Figure 7 is an axial view of another improved double-PD differential assembly structure in a small-sized optical transceiver device provided by the embodiment of the present application;

[0036] Figure 8 is a front view of another improved double-PD differential assembly structure in a small-sized optical transceiver device provided by the embodiment of the present application;

[0037] Figure 9 is a left view of another improved double-PD differential assembly structure in a small-sized optical transceiver device provided by the embodiment of the present application;

[0038] Figure 10 is a left view of another improved double-PD differential assembly structure in a small-sized optical transceiver device provided by the embodiment of the present application;

[0039] Figure 11 is a top view of a small-sized optical transceiver device structure provided by the embodiment of the present application;

[0040] Figure 12This is a front view schematic diagram of a miniaturized optical transceiver device structure provided in an embodiment of the present invention;

[0041] Figure 13 This is a schematic diagram of a dual PD differential component structure in a miniaturized optical transceiver device provided in an embodiment of the present invention. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0043] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0044] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0045] Example 1:

[0046] Embodiment 1 of the present invention provides a miniaturized optical transceiver device, such as Figure 1 As shown, the system includes a light source assembly 1, a planar optical waveguide 2, a dual-PD differential assembly 3, and a transimpedance amplifier circuit 4. Both the light source assembly 1 and the dual-PD differential assembly 3 are coupled to the planar optical waveguide 2. The transimpedance amplifier circuit 4 is electrically connected to the dual-PD differential assembly 3. Specifically:

[0047] The light source assembly 1 is used to emit outgoing signal light into the planar optical waveguide 2, and emit the outgoing signal light through the planar optical waveguide 2;

[0048] Planar optical waveguide 2 is used to transmit the incident signal light entering the device to the dual PD differential component 3;

[0049] The dual PD differential component 3 is used to detect incident signal light and spatial crosstalk light, and to perform differential processing on the generated detection current and crosstalk current respectively.

[0050] The transimpedance amplifier circuit 4 is used to amplify the gain of the differentially processed photocurrent output by the dual PD differential component 3 and output the amplified voltage signal.

[0051] The miniaturized optical device provided by this invention reduces fiber optic splicing between devices and features high integration, small size, and low cost. It greatly reduces the size and assembly complexity of optical transceivers, reduces the manufacturing difficulty and cost of optical transceivers, and can also reduce insertion loss caused by fiber optic splicing.

[0052] In conjunction with the embodiments of the present invention, specific implementation examples of the planar optical waveguide 2 are also provided, such as... Figure 2 and Figure 3 As shown, the planar optical waveguide 2 includes a 1x2 beam splitter 21, which comprises a first branch port 211, a second branch port 212, and a third convergence port 213. Specifically:

[0053] The emitted signal light enters the 1x2 beam splitter 21 from the first branch port 211 and exits from the third convergence port 213;

[0054] The incident beam of the device enters the 1x2 beam splitter 21 from the third converging port 213 and exits through the second branch port 212 onto the first PD chip 31 of the dual PD differential assembly 3.

[0055] To further improve integration, the 1x2 beam splitter 21 in this embodiment of the invention has undergone further structural optimization, such as... Figure 2 As shown, the waveguide used to form the third convergence port 213 has a 180° curved arc structure, so that the first branch port 211, the second branch port 212, and the third convergence port 213 are located on the same side of the planar optical waveguide 2. This approach can greatly improve the integration density and avoid the laser emitting surface and the detector PD photosensitive surface from being directly opposite each other, thus avoiding the possibility of introducing large optical signal crosstalk. However, inevitably, weak spatial crosstalk light (reflection from the inner wall of the tube shell) will be introduced inside the device due to the presence of the laser. The present invention introduces the dual PD differential component 3 to improve the impact of spatial crosstalk light on the optical crosstalk of the first PD chip 31.

[0056] like Figure 4 The diagram shown is a structural schematic of a dual PD differential component 3 proposed in an embodiment of the present invention. It includes a first PD chip 31, a second PD chip 32, and a carrier 33. The first PD chip 31 and the second PD chip 32 are disposed on the carrier 33. The first PD chip 31 is used to detect incident signal light and output a detection current; the second PD chip 32 is used to detect spatial crosstalk light and output a crosstalk current.

[0057] like Figure 5As shown, the first PD chip 31 and the second PD chip 32 are connected through the PD backboard with the gold-plated pattern 34 generated on the carrier 33, the negative pole of the first PD chip 31 is connected with the positive pole of the second PD chip 32; the positive pole of the first PD chip 31 is powered by -5V, the negative pole of the second PD chip 32 is grounded, and the positive pole of the second PD chip 32 is connected with the current input end of the transimpedance amplification circuit 4; wherein the light-sensitive surfaces of the two PD chips are consistent with the end surface direction of the super-radiation light-emitting diode in the light source assembly 1.

[0058] Reference Figure 1 , the back surface of the transimpedance amplification circuit 4 is a silver-plated layer, and serves as the ground pole of the amplification circuit, and is adhered to the upper surface of the planar light waveguide 2 through direct or interval of a heat insulation layer; the ground pole of the transimpedance amplification circuit 4 is conducted with the negative pole of the second PD chip 32 through gold wire bonding.

[0059] As Figure 6 , Figure 7 and Figure 8 shown, the improved scheme of the double-PD differential assembly 3 further proposed by the embodiment of the present application, compared with the above Figure 4 comprises a first PD chip 31, a second PD chip 32 and a carrier 33, the first PD chip 31 is arranged on the front surface of the carrier 33, the second PD chip 32 is arranged on the back surface of the carrier 33, and one or more waveguides 35 are arranged between the front surface and the back surface of the carrier 33, the one or more waveguides 35 are used to transmit the crosstalk light near the first PD chip to the second PD chip located on the back surface of the carrier 33; in Figure 7 , the mode of four waveguides 35 is exemplified, and considering the process complexity of the waveguide 35 in the manufacturing process, it is preferred to adopt the parallel arrangement of two-by-two as shown in Figure 7 , so that the two waveguides on the same horizontal plane can be manufactured in the same etching and growth process. Among them, the first PD chip 31 is used to detect incident signal light and output a detection current; the second PD chip 32 is used to detect spatial crosstalk light and output a crosstalk current.

[0060] Compared with the layout and implementation mode of the first PD chip 31 and the second PD chip 32 as shown in Figure 4 , Figure 6 and Figure 7 presented mode, the problem of detecting spatial crosstalk light accuracy caused by the size of the PD chip itself can be further overcome, that is, to Figure 4In this way, the light that the second PD chip 32 can actually collect, which causes crosstalk to the first PD chip 31, has already deviated. This deviation will actually be carried into the subsequent differential calculation of the detection current of the first PD chip 31 and the crosstalk current of the second PD chip 32, thus affecting the effectiveness of the crosstalk removal in the final calculation result.

[0061] Considering the reliability and cost of existing manufacturing technologies, the most typical manufacturing method for waveguide 35 is as follows: Figure 7 and Figure 8 The waveguides 35 shown are manufactured in a horizontal shape. This means that the waveguides 35 distributed around the first PD chip 31 require a second PD chip 32 with a larger photosensitive surface to capture the crosstalk light transmitted from each waveguide 35. However, as... Figure 8 As shown, the present invention also provides a solution that simplifies the structural requirements of the second PD chip 32. By introducing a lens 36, crosstalk light transmitted from multiple dispersed waveguides 35 is converged to one point via the lens 36, thus enabling the use of a general detector as the second PD chip 32. Figure 6 Effective detection of crosstalk light under the improved scheme shown.

[0062] It should be noted that, regardless of whether multiple waveguides or lenses are used, the crosstalk light entering the second PD chip can be made approximately equal in intensity to the crosstalk light entering the first PD chip by specifically designing the waveguide or lens configuration.

[0063] like Figure 9 As shown, this corresponds to the above. Figure 7 The left view of the dual PD differential component 3 implementation shows that the light-incident surfaces of one or more waveguides 35 are arranged around the area where the first PD chip 31 is fixed on the front side of the carrier 33. However, in actual implementation, after fully considering the shape of the first PD chip 31 and the fabrication method of the waveguides 35, this embodiment of the invention also proposes a preferred layout, namely, adopting... Figure 10 The structural diagram shown overlaps the four diagonals of the four waveguides 35 with the four sides of the first PD chip, which is horizontally arranged along the diagonal lines connecting the two chips. For actual effect reference... Figure 10 The state shown is as described. In this way, the accuracy of crosstalk light acquisition can be significantly enhanced by sacrificing some of the waveguide transmission characteristics.

[0064] Example 2:

[0065] This invention provides a method for fabricating a miniaturized optical transceiver, based on the method described in Embodiment 1. Figure 6- Figure 8 The miniaturized optical transceiver device of the dual PD differential component 3, specifically:

[0066] The carrier 33 of the dual-PD differential assembly 3 is manufactured by a deposition process and an etching process, wherein one or more waveguides 35 are generated between the front and back surfaces of the carrier 33; the front surface of the carrier 33 is used to arrange the first PD chip 31, and the back surface of the carrier 33 is used to arrange the second PD chip 32; the one or more waveguides 35 are used to transmit the crosstalk light near the first PD chip to the second PD chip located at the back surface of the carrier 33; and the assembly of each component is completed according to the miniaturized optical transceiver device as described in Embodiment 1, thereby obtaining the miniaturized optical transceiver device.

[0067] The miniaturized optical device provided by the application reduces the optical fiber fusion between devices, has the characteristics of high integration, small size and low cost, greatly reduces the size and assembly complexity of the optical transceiver device, reduces the manufacturing difficulty and cost of the optical transceiver device, and also reduces the insertion loss caused by optical fiber fusion. The detection of crosstalk current can be more accurate, and the optical transceiver device of the application further overcomes the problem of reduced detection accuracy caused by the arrangement of the PD and the laser on the same side due to optical crosstalk while improving the integration.

[0068] Example 3:

[0069] The structure characteristics contained in the optical transceiver device in Embodiment 1 will be described in integrity in the embodiment, in which the numbering of the corresponding components and objects is re-associated for the sake of smoothness of the appearance order and numbering of the main object, but the corresponding relationship between the embodiment and Embodiment 1 can be established based on the names of the corresponding components and objects, which will not be described in detail here.

[0070] As shown in Figure 11 The optical transceiver device in the embodiment includes a light source assembly 10, a lens assembly 20, a planar optical waveguide 30 and a dual-PD differential assembly 50. The light source assembly 10 is used to emit an outgoing light beam with a certain divergence angle, which is usually composed of a super-radiation light-emitting diode or a semiconductor laser. The outgoing light beam is transformed into a convergent light beam by the lens assembly 20 and transmitted into the waveguide channel of the planar optical waveguide 30. The planar optical waveguide 30 includes a first port 31, a second port 32, a third port 33 and a waveguide bending structure 34. The convergent light beam enters the planar optical waveguide 30 from the first port 31, passes through the Y-branch structure and the waveguide bending structure 34 in turn and is emitted from the third port 33. The incident light beam enters the planar optical waveguide 30 from the third port 33 through the optical fiber coupling terminal 40, passes through the waveguide bending structure 34 and the Y-branch structure in turn and is emitted from the second port 32 to the first PD chip 51 of the dual-PD differential assembly 50. The first PD chip 51 is used to detect the incident signal light, and the second PD chip 52 is used to detect the spatial crosstalk light, and the generated corresponding photocurrent is differentially processed through the circuit connection.

[0071] The light source assembly 10, the lens assembly 20, the planar light waveguide 30 and the dual-PD differential assembly 50 are encapsulated in a package 70. The light source assembly 10 emits an outgoing beam with a certain divergence angle, which is converged into a convergent beam by the lens assembly 20, so that the lens assembly 20 maximizes the coupling of the energy of the outgoing beam into the first port 31, improving the coupling efficiency. In Embodiment 1, the lens assembly 20 is not involved, because the light source assembly 10 can be directly coupled to the planar light waveguide 30 if the processing precision is high enough.

[0072] As shown in Figure 11 and Figure 12 , the lens assembly 20 includes a collimating lens 21 and a focusing lens 22. The collimating lens 21 is used to collimate the outgoing beam into a parallel beam. The focusing lens 22 is located between the collimating lens 21 and the planar light waveguide 30. The focusing lens 22 is used to converge the parallel beam into a convergent beam. In this way, a larger displacement tolerance can be obtained, improving the environmental and mechanical stability of the optical transceiver device and enhancing the reliability of the optical transceiver device. In another embodiment, the lens assembly includes an isolator located between the first lens and the second lens, which is used to prevent the reflection of the beam back to the light emitting surface of the light source assembly.

[0073] As shown in Figure 11 and Figure 12 , the optical transceiver device includes a thermistor 81 and a semiconductor refrigerator 82. The thermistor is used to detect the operating temperature of the light source assembly 10, and the semiconductor refrigerator 82 is used to adjust the operating temperature of the light source assembly 10 to a set temperature. Since the central wavelength of the light beam emitted by the light source assembly 10 will change with the operating temperature, the operating wavelength will drift. Under the action of the thermistor 81 and the semiconductor refrigerator 82, the operating temperature of the light source assembly 10 will be maintained at a constant temperature, so that the performance parameters such as the light output power and the central wavelength of the light source assembly 10 remain stable.

[0074] The set temperature is usually 25°C. If the operating temperature is higher than 25°C, the semiconductor refrigerator 82 is used to cool until the operating temperature is 25°C. Of course, if the operating temperature is lower than 25°C, the semiconductor refrigerator 82 can also be used to heat until the operating temperature is 25°C.

[0075] Meanwhile, the cooler assembly 80 can keep other components on the ceramic substrate 60 working at a relatively stable temperature. For the dual-PD differential assembly 50 and the trans-impedance amplification circuit 90, keeping the components working at 25°C can effectively suppress the dark current of the corresponding components in a high-temperature environment, and improve the signal-to-noise ratio of the device. For the lens assembly 20, the displacement amount of the lens assembly 20 in a variable-temperature environment can be effectively reduced, thereby reducing the high-low temperature variation of the output power of the device. For the connection part of the planar lightwave circuit 30 and the fiber coupling terminal 40, the temperature control system can keep the stability of the insertion loss of the connection part in a high-low temperature process.

[0076] It should be noted that the semiconductor cooler refers to a device for producing cold by using the thermoelectric effect of a semiconductor. The semiconductor cooler includes two ceramic plates connected by a semiconductor. When the semiconductor cooler is connected to an electric current, the temperature of one of the ceramic plates rises, and the temperature of the other ceramic plate falls.

[0077] As shown in Figure 12 , the back surface of the ceramic substrate 60 is connected to the upper surface of the semiconductor cooler by welding, and the planar lightwave circuit 30 is connected to the front surface of the ceramic substrate 60 by bonding. The ceramic substrate 60 is an integral whole, which can avoid deformation caused by heating or cooling, thereby avoiding changes in the relative positions of the light source assembly 10, the lens assembly 20, the planar lightwave circuit 30, and the dual-PD differential assembly 50, which can cause changes in the optical path of the optical transceiver device. The ceramic substrate 60 has good heat conduction performance, which facilitates heat conduction between the optical components and the semiconductor cooler 82.

[0078] As shown in Figure 12 , the back surface of the trans-impedance amplification circuit 90 is a silver-plated layer, which is bonded to the upper surface of the planar lightwave circuit directly or through an insulating layer, forming a castellated structure. In this way, the space in the tube shell 70 can be effectively utilized, and the actual size of the device can be reduced.

[0079] The lens assembly 20 can be bonded to the ceramic substrate 60. In this way, the operability of the lens assembly 20 can be ensured. Specifically, the lens assembly 20 can be bonded to the ceramic substrate 60 by ultraviolet glue or laser welding.

[0080] Please refer to Figure 11 and Figure 12The planar light waveguide 30 is a planar light waveguide splitter, which can be a silicon-based or silica-based waveguide chip. After the incident light beam enters the planar light waveguide 30 from the third port 33 through the fiber coupling terminal 40, the propagation direction of the incident light beam is turned by 180° by the curved waveguide structure 34, and then the light power of the incident light beam can be equally divided into the first port 31 and the second port 32 through the Y-branch structure of the planar light waveguide splitter. At the same time, the first port 31, the second port 32, and the third port 33 are located on the same side of the planar light waveguide, so that the lens assembly 20, the dual-PD differential assembly 50, and the fiber coupling terminal 40 are also conveniently arranged, making the optical path structure more compact, and further reducing the volume of the optical transceiver device.

[0081] The waveguides connected by the first port 31, the second port 32, and the third port 33 can all be single-mode optical waveguides. Further, the optical fibers used in the fiber coupling terminal 40 can all be single-mode optical fibers. A single-mode optical fiber refers to an optical fiber that can only transmit one mode, i.e., a fundamental mode.

[0082] As shown in Figure 13 , the dual-PD differential assembly 50 includes a first PD chip 51, a second PD chip 52, a PD backboard 53, and a gold-plated pattern 54. The PD chip can be a PIN diode or an APD diode. The first PD chip 51 is used to detect the incident light beam and convert the optical signal into a current signal. The second PD chip 52 is used to detect the spatial crosstalk light. The first PD chip 51 and the second PD chip 52 are adhered to the PD backboard 53 by conductive silver paste, and the back surface is the negative electrode of the chip. The positive electrode of the first PD chip is connected to the negative electrode of the second PD chip by gold wire bonding. The positive electrode of the first PD chip is supplied with 5V power, and the negative electrode of the second PD chip is grounded. In an embodiment, as shown in Figure 11 , the light-sensitive surfaces of the two PD chips face in the same direction as the end surface of the superluminescent diode in the light source assembly.

[0083] The transimpedance amplifier 52 converts the differential current signal generated by the dual-PD differential assembly 50 into a voltage signal, thereby achieving amplification output. The transimpedance amplifier 52 can be composed of a thick-film ceramic circuit or a TIA chip circuit. Specifically, the positive electrode of the second PD chip is connected to the current input end of the transimpedance amplification circuit, and the ground electrode of the transimpedance amplification circuit 90 is conductive with the negative electrode of the second PD chip by gold wire bonding.

[0084] The optical transceiver device adopts hermetic packaging. In this way, the components inside the tube shell 70 are less affected by the water vapor or other impurities outside the tube shell 70. The tube shell 70 has a butterfly-shaped structure, with 8 pins on each side and one ground pin on each side, and the tail pipe of the tube shell is offset from the center line of the tube shell.

[0085] The above merely describes preferred embodiments of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A miniaturized optical transceiver device, characterized in that, The system includes a light source assembly (1), a planar optical waveguide (2), a dual-PD differential assembly (3), and a transimpedance amplifier circuit (4). The light source assembly (1) and the dual-PD differential assembly (3) are both coupled to the planar optical waveguide (2), and the transimpedance amplifier circuit (4) is electrically connected to the dual-PD differential assembly (3). Specifically: A light source assembly (1) is used to emit outgoing signal light into a planar optical waveguide (2) and emit the outgoing signal light through the planar optical waveguide (2); Planar optical waveguide (2) is used to transmit the incident signal light entering the device to the dual PD differential component (3). The dual PD differential component (3) is used to detect incident signal light and spatial crosstalk light, and to perform differential processing on the generated detection current and crosstalk current respectively; The transimpedance amplifier circuit (4) is used to amplify the gain of the differentially processed photocurrent output by the dual PD differential component (3) and output the amplified voltage signal. The dual PD differential component (3) includes a first PD chip (31), a second PD chip (32), and a carrier (33). The first PD chip (31) is disposed on the front side of the carrier (33), and the second PD chip (32) is disposed on the back side of the carrier (33). One or more waveguides (35) are disposed between the front and back sides of the carrier (33). The one or more waveguides (35) are used to transmit crosstalk light near the first PD chip to the second PD chip located on the back side of the carrier (33). The first PD chip (31) is used to detect incident signal light and output detection current; the second PD chip (32) is used to detect spatial crosstalk light and output crosstalk current.

2. The miniaturized optical transceiver device according to claim 1, characterized in that, The planar optical waveguide (2) includes a 1x2 beam splitter (21), which comprises a first branch port (211), a second branch port (212), and a third convergence port (213). Specifically: The emitted signal light enters the 1x2 beam splitter (21) from the first branch port (211) and exits from the third convergence port (213); The incident beam of the device enters the 1x2 beam splitter (21) from the third converging port (213) and exits through the second branch port (212) onto the first PD chip (31) of the dual PD differential assembly (3).

3. The miniaturized optical transceiver device according to claim 2, characterized in that, The 1x2 beam splitter (21) also includes: The waveguide used to form the third convergence port (213) has a 180° curved arc structure, so that the first branch port (211), the second branch port (212) and the third convergence port (213) are located on the same side of the planar optical waveguide (2).

4. The miniaturized optical transceiver device according to claim 1, characterized in that, The first PD chip (31) and the second PD chip (32) are connected through a PD backplate with a gold-plated pattern (34) generated on the carrier (33). The negative terminal of the first PD chip (31) is connected to the positive terminal of the second PD chip (32). The positive terminal of the first PD chip (31) is powered by -5V, the negative terminal of the second PD chip (32) is grounded, and the positive terminal of the second PD chip (32) is connected to the current input terminal of the transimpedance amplifier circuit (4). The photosensitive surfaces of the two PD chips are aligned with the end face of the superluminescent diode in the light source assembly (1).

5. The miniaturized optical transceiver device according to claim 4, characterized in that, The back of the transimpedance amplifier circuit (4) is plated with silver and serves as the ground of the amplifier circuit. It is bonded to the upper surface of the planar optical waveguide (2) directly or with a layer of insulation between them. The ground of the transimpedance amplifier circuit (4) is connected to the negative terminal of the second PD chip (32) by gold wire bonding.

6. The miniaturized optical transceiver device according to claim 1, characterized in that, The light-incident surfaces of one or more waveguides (35) are arranged around the area on the front side of the carrier (33) where the first PD chip (31) is fixed.

7. The miniaturized optical transceiver device according to claim 1, characterized in that, It also includes a cooler assembly (5), which includes a thermistor (51) and a semiconductor cooler (52), specifically: The thermistor (51) is located next to the light source assembly (1) and is used to detect the temperature of the light source; the cold end of the semiconductor cooler is connected to the thermally conductive ceramic substrate, and the hot end is connected to the bottom plate of the tube shell. The thermally conductive ceramic substrate is used to support the light source assembly (1), the planar optical waveguide (2), the dual PD differential assembly (3), and the transimpedance amplifier circuit (4).

8. A method for fabricating a miniaturized optical transceiver, characterized in that, A carrier (33) for a dual PD differential component (3) is fabricated by deposition and etching processes, wherein one or more waveguides (35) are formed between the front and back sides of the carrier (33); the front side of the carrier (33) is used to set the first PD chip (31), the back side of the carrier (33) is used to set the second PD chip (32), and the one or more waveguides (35) are used to transmit crosstalk light near the first PD chip to the second PD chip located on the back side of the carrier (33); the miniaturized optical transceiver device is assembled according to any one of claims 1-3 and 6-7 to obtain the miniaturized optical transceiver device.

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