Substrate transport apparatus and substrate transport method

Abstract

A substrate conveying device and a substrate conveying method that improve conveying accuracy. The substrate conveying device includes: a tile-shaped unit provided in a conveying chamber, having a coil and a Hall element; a conveying unit having a permanent magnet and moving above the tile-shaped unit to convey a substrate; a temperature sensor that detects a temperature in the tile-shaped unit; and a control section that estimates a position of the conveying unit based on a temperature of the Hall element obtained from a detected value of the temperature sensor and a detected value of the Hall element.

Description

Technical Field

[0001] This invention relates to a substrate conveying device and a substrate conveying method. Background Technology

[0002] Patent Document 1 discloses a substrate conveying device including a conveying unit that is magnetically levitated above a planar motor located in a conveying chamber, thereby conveying the substrate.

[0003] <Prior art documents>

[0004] <Patent Documents>

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-86986 Summary of the Invention

[0006] <Problem to be solved by this invention>

[0007] In one aspect, the aim is to provide a substrate conveying device and substrate conveying method that can improve conveying accuracy.

[0008] <Methods for solving problems>

[0009] To address the aforementioned problems, according to one approach, a substrate conveying device is provided, comprising: a tile-shaped unit disposed in a conveying chamber, having a coil and a Hall element; a conveying unit having a permanent magnet and moving above the tile-shaped unit to convey a substrate; a temperature sensor for detecting the temperature in the tile-shaped unit; and a control unit for estimating the position of the conveying unit based on the temperature of the Hall element obtained from the detection value of the temperature sensor and the detection value of the Hall element.

[0010] <The Effects of the Invention>

[0011] According to one aspect, a substrate conveying device and substrate conveying method that improves conveying accuracy can be provided. Attached Figure Description

[0012] Figure 1 This is a top view showing the configuration of an example of a substrate processing system according to one embodiment.

[0013] Figure 2 This is a perspective view showing an example of a conveying unit according to one embodiment.

[0014] Figure 3 This is a three-dimensional diagram illustrating the driving principle of the substrate conveying device.

[0015] Figure 4 This is an example of a top view showing the configuration of a temperature sensor.

[0016] Figure 5 This is an example of a top view illustrating the configuration of temperature sensors within tiles in an area requiring high precision.

[0017] Figure 6 This is an example of a functional block diagram of the control unit.

[0018] Figure 7 This is an example of a top view illustrating the alignment of the transport unit when the substrate is placed on the loading stage.

[0019] Figure 8 This is another example of a top view illustrating the alignment of the transport unit when the substrate is placed on the loading stage. Detailed Implementation

[0020] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals are used for the same constituent parts, and sometimes repeated descriptions are omitted.

[0021] <Substrate Processing System 100>

[0022] For an example of the overall configuration of a substrate processing system 100 in one embodiment, using Figure 1 Please provide an explanation. Figure 1 This is a top view showing an example configuration of a substrate processing system 100 according to one embodiment.

[0023] Figure 1 The substrate processing system 100 shown is a cluster-structured (multi-chamber) system. The substrate processing system 100 includes multiple processing chambers 110, a vacuum transport chamber 120, a load locking chamber 130, an atmospheric transport chamber 140, a loading port 150, and a control unit 160. It should be noted that... Figure 1 In this description, the long side of the vacuum conveying chamber 120 is set as the X direction, the short side (width direction) of the vacuum conveying chamber 120 is set as the Y direction, and the height direction of the vacuum conveying chamber 120 is set as the Z direction.

[0024] Processing chamber 110 is depressurized to a predetermined vacuum atmosphere, and desired processing (etching, film deposition, cleaning, ashing, etc.) is performed on the semiconductor wafer (hereinafter also referred to as "substrate W") within it. Processing chamber 110 is arranged adjacent to vacuum transport chamber 120. Processing chamber 110 and vacuum transport chamber 120 are connected by the opening and closing of gate valve 112. Processing chamber 110 has a mounting stage 111 for mounting substrate W. It should be noted that the operation of each part of the processing in processing chamber 110 is controlled by control unit 160.

[0025] Vacuum transport chamber 120 is connected to multiple chambers (processing chamber 110, load locking chamber 130) via gate valves 112 and 132, and is depressurized to a predetermined vacuum atmosphere. Furthermore, a substrate transport device 125 for transporting substrate W is provided inside vacuum transport chamber 120. Substrate transport device 125 includes a planar motor 10 disposed in vacuum transport chamber 120 and multiple transport units 30 (30A, 30B) movable on the planar motor 10. Each transport unit 30 includes a conveyor 31 movable on the planar motor 10 and an arm 32 configured to hold substrate W. Substrate transport device 125 moves substrate W between processing chamber 110 and vacuum transport chamber 120 according to the opening and closing of gate valve 112. Additionally, substrate transport device 125 moves substrate W between load locking chamber 130 and vacuum transport chamber 120 according to the opening and closing of gate valve 132. It should be noted that the operation of the substrate conveying device 125 and the opening and closing of the gate valves 112 and 132 are controlled by the control unit 160. It should also be noted that the substrate conveying device 125 (planar motor 10, conveying unit 30) uses... Figures 2 to 4 To be discussed later.

[0026] Additionally, within the vacuum transport chamber 120, during the movement of the transport unit 30, there is a precision requirement area 200 (where high alignment accuracy is required) Figure 1 (Indicated by double-dotted lines). For example, the area including the transport unit 30 where the transport unit 30 delivers the substrate W to the mounting stage 111 of the processing chamber 110 and / or receives the substrate W from the mounting stage 111 becomes the precision requirement area 200 where high alignment accuracy is required. Alternatively, the transport unit 30 can deliver the substrate W to the mounting stage 131 of the load locking chamber 130 and / or from the mounting stage 111. 3 The position of the conveying unit 30 when receiving substrate W is set to the accuracy requirement area 200.

[0027] On the other hand, within the vacuum transport chamber 120, the transport area 210 (the area within the vacuum transport chamber 120 other than the precision requirement area 200) that connects the precision requirement area 200 to other precision requirement areas 200 is an area that does not require the alignment accuracy of the transport unit 30 like the precision requirement area 200.

[0028] A load locking chamber 130 is disposed between a vacuum delivery chamber 120 and an atmospheric delivery chamber 140. The load locking chamber 130 has a mounting stage 131 for mounting the substrate W. The load locking chamber 130 is capable of switching between atmospheric and vacuum atmospheres. The load locking chamber 130 is connected to the vacuum delivery chamber 120 (vacuum atmosphere) via the opening and closing of a gate valve 132. The load locking chamber 130 is connected to the atmospheric delivery chamber 140 (atmospheric atmosphere) via the opening and closing of a gate valve 133. It should be noted that the switching between vacuum and atmospheric atmospheres within the load locking chamber 130 is controlled by a control unit 160.

[0029] The atmospheric transport chamber 140 is filled with an atmospheric atmosphere, for example, a downward flow of clean air is formed. Furthermore, a transport device (not shown) for transporting the substrate W is provided inside the atmospheric transport chamber 140. The transport device (not shown) moves the substrate W between the load locking chamber 130 and the atmospheric transport chamber 140 according to the opening and closing of the gate valve 133. It should be noted that the operation of the transport device (not shown) and the opening and closing of the gate valve 133 are controlled by the control unit 160.

[0030] Additionally, a loading port 150 is provided on the wall of the atmospheric delivery chamber 140. The loading port 150 is fitted with a carrier (not shown) that houses the substrate W or an empty carrier. For example, a FOUP (Front Opening Unified Pod) can be used as the carrier.

[0031] The conveying device (not shown) can remove the substrate W contained in the carrier installed in the loading port 150 and place it on the mounting stage 131 of the load locking chamber 130. Alternatively, the conveying device (not shown) can remove the substrate W placed on the mounting stage 131 of the load locking chamber 130 and place it in the carrier installed in the loading port 150.

[0032] The control unit 160 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and HDD (Hard Disk Drive). The control unit 160 is not limited to an HDD and may include other storage areas such as an SSD (Solid State Drive). The HDD, RAM, and other storage areas store schemes that set the process sequence, process conditions, and transport conditions.

[0033] The CPU controls the processing of the substrates W in each processing chamber 110 according to the scheme, thereby controlling the transport of the substrates W. Programs for executing the processing and transport of the substrates W in each processing chamber 110 can be stored in HDD or RAM. These programs can be provided by storing them in storage media or by providing them from an external device via a network.

[0034] Next, an example of the operation of the substrate processing system 100 will be described. Here, as an example of the operation of the substrate processing system 100, the operation is described as follows: the substrate W, which is housed in the carrier mounted on the loading port 150, is processed in the processing chamber 110, and then housed in the empty carrier mounted on the loading port 150. It should be noted that at the beginning of the operation, gate valves 112, 132, and valve 133 are closed, and the load locking chamber 130 becomes atmospheric.

[0035] The control unit 160 opens the gate valve 133. The control unit 160 controls the conveying device in the atmospheric conveying chamber 140 to remove the substrate W from the carrier at the loading port 150 and place it on the mounting stage 131 of the load locking chamber 130. After the substrate W is placed on the mounting stage 131 of the load locking chamber 130 and the conveying device retracts from the load locking chamber 130, the control unit 160 closes the gate valve 133.

[0036] The control unit 160 controls the exhaust device (not shown) of the load locking chamber 130 to exhaust the air in the chamber, thereby switching the load locking chamber 130 from an atmospheric atmosphere to a vacuum atmosphere.

[0037] Next, the substrate W placed on the mounting stage 131 in the load locking chamber 130 is transported to the processing chamber 110 and placed on the mounting stage 111. Specifically, the control unit 160 opens the gate valve 132. The control unit 160 controls the substrate transport device 125 (described later) to insert the arm 32 into the load locking chamber 130 to a pre-set handover position, holding the substrate W placed on the mounting stage 131 in the load locking chamber 130 and transporting it to the vacuum transport chamber 120. After the arm 32 retracts from the load locking chamber 130, the control unit 160 closes the gate valve 132.

[0038] The control unit 160 opens the gate valve 112 of the processing chamber 110 containing the transported object. The control unit 160 controls the substrate transport device 125 to insert the arm 32 into the processing chamber 110 to a pre-set handover position and places the held substrate W onto the loading stage 111 of the processing chamber 110. After the arm 32 retracts from the processing chamber 110, the control unit 160 closes the gate valve 112.

[0039] The control unit 160 controls the processing chamber 110 to perform the desired processing on the substrate W.

[0040] After the substrate W is processed, the substrate W placed on the mounting stage 111 in the processing chamber 110 is transported to the load locking chamber 130 and placed on the mounting stage 131. Specifically, the control unit 160 opens the gate valve 112. The control unit 160 controls the substrate transport device 125 to insert the arm 32 into the processing chamber 110 to a pre-set handover position, hold the substrate W placed on the mounting stage 111 in the processing chamber 110, and transport it to the vacuum transport chamber 120. After the arm 32 retracts from the processing chamber 110, the control unit 160 closes the gate valve 112.

[0041] The control unit 160 opens the gate valve 132. The control unit 160 controls the substrate conveying device 125 to insert the arm 32 into the load locking chamber 130 to a pre-set handover position, and places the held substrate W on the mounting stage 131 of the load locking chamber 130. After the arm 32 retracts from the load locking chamber 130, the control unit 160 closes the gate valve 132.

[0042] The control unit 160 controls the gas supply device (not shown) of the load locking chamber 130 to supply, for example, clean air into the chamber, thereby switching the load locking chamber 130 from a vacuum atmosphere to an atmospheric atmosphere.

[0043] The control unit 160 opens the gate valve 133. The control unit 160 controls the conveying device (not shown) to remove the substrate W placed on the mounting stage 131 of the load locking chamber 130 and accommodate it in the carrier of the loading port 150. After the substrate W is removed from the mounting stage 131 of the load locking chamber 130 and the conveying device (not shown) retracts from the load locking chamber 130, the control unit 160 closes the gate valve 133.

[0044] It should be noted that, in the substrate processing system 100, although the configuration in which the substrate transport device 125 transports the substrate W placed on the mounting stage 131 of the load locking chamber 130 to the mounting stage 111 of the processing chamber 110, and transports the processed substrate W from the mounting stage 111 of the processing chamber 110 to the mounting stage 131 of the load locking chamber 130, is described as an example, it is not limited to this. The configuration in which the substrate transport device 125 transports the substrate W placed on the mounting stage 111 of one processing chamber 110 to the mounting stage 111 of another processing chamber 110 is also possible.

[0045] <Substrate conveying device 125>

[0046] Next, the substrate transport device 125 will be further described. The substrate transport device 125 includes a planar motor 10 disposed in the vacuum transport chamber 120, and a transport unit 30 capable of moving on the planar motor 10. It should be noted that, as described later... Figure 4 As shown, multiple tile shape units 11 (refer to) Figure 3The planar motors 10 are arranged in the vacuum delivery chamber 120.

[0047] Figure 2 This is a perspective view showing an example of a conveying unit 30 according to one embodiment. The conveying unit 30 has a carrier 31 and an arm 32. The carrier 31 is configured to be able to move by magnetic levitation above the planar motor 10. The arm 32 is configured to be fixed to the carrier 31 at one end and to hold the substrate W at the other end. In addition, multiple conveying units 30 may be provided in the vacuum conveying chamber 120.

[0048] For the tile-shaped unit 11 of the planar motor 10 and the conveyor 31 of the conveying unit 30, using Figure 3 Further explanation is needed. Figure 3 This is a perspective view illustrating the driving principle of the substrate conveying device 125.

[0049] In the tile-shaped unit 11 of the planar electric motor 10, a plurality of coils 15 are arranged within a housing 14 made of a non-magnetic metal or resin. The coils 15 generate a magnetic field by supplying current. (See control unit 160). Figure 1 It is configured to individually control the current value energized to each coil 15.

[0050] The transporter 31 has multiple permanent magnets 35 arranged on it. The transporter 31 can be magnetically levitated above the tile-shaped unit 11 by the magnetic field generated by the coil 15. In addition, the transporter 31 can move above the tile-shaped unit 11 by the magnetic field generated by the coil 15, thereby being able to move above the planar motor 10 formed by multiple tile-shaped units 11.

[0051] With this configuration, a control unit 160 is formed (see reference). Figure 1 The current value of each coil 15 of the planar motor 10 (tile shape unit 11) is controlled, thereby enabling control of the position (position in the horizontal direction (X-axis direction, Y-axis direction), position in the vertical direction (Z-axis direction) (suspending amount)) and orientation (tilt around the X-axis, tilt around the Y-axis, tilt around the Z-axis) of the conveying unit 30 (transporter 31).

[0052] Additionally, within the tile-shaped unit 11, a plurality of Hall elements (position detection sensors) 16 are provided inside the housing 14. The Hall element 16 is an example of a magnetic sensor, used to detect the position and orientation of the transporter 31. Specifically, the Hall element 16 detects a value (Hall voltage) corresponding to the magnetic flux density formed by the permanent magnet 35 of the transporter 31. The detection value of the Hall element 16 is input to the control unit 160 (see reference). Figure 1The control unit 160 calculates the magnetic flux density at the position (magnetic flux measurement position) of each Hall element 16 based on the detection values ​​of multiple Hall elements 16, and estimates the position and orientation of the transporter 31 based on the calculated magnetic flux density at the multiple magnetic flux measurement positions.

[0053] Here, within the housing 14 of the tile-shaped unit 11, multiple coils 15 and Hall elements 16 are provided. Furthermore, when the conveying unit 30 is suspended and moved above the planar motor 10, the coils 15 corresponding to the positions of the conveying unit 30 are energized. When the coils 15 are energized, they heat up, and this heat is conducted to the Hall elements 16. Additionally, the heat from the coils 15 is also conducted to the Hall elements 16 in adjacent tile-shaped units 11. Therefore, a temperature difference may sometimes occur in the Hall elements 16.

[0054] For Hall element 16, sensitivity decreases as temperature rises. Therefore, if a temperature difference occurs between multiple Hall elements 16, a difference in sensitivity will occur between them. Consequently, there is concern that the position and orientation of the transporter 31 estimated based on the magnetic flux density detected by the Hall elements 16 may deviate from the actual position and orientation of the transporter 31. Consequently, there is concern that the alignment accuracy of the transport unit 30 may decrease.

[0055] Here, for the planar motor 10 of this embodiment, a temperature sensor 17 is provided inside the housing 14 of the tile-shaped unit 11. The temperature sensor 17 can be, for example, a thermocouple. The detected value of the temperature sensor 17 is input to the control unit 160 (see reference). Figure 1 ).

[0056] Next, regarding the configuration of temperature sensors 17 (17A, 17B), using... Figure 4 as well as Figure 5 Please provide an explanation. Figure 4 This is an example of a top view showing the configuration of temperature sensor 17.

[0057] The planar motor 10 of this embodiment is formed by arranging a plurality of tile-shaped units 11. A precision requirement area 200 is provided on the planar motor 10. A temperature sensor 17A is provided in the precision requirement area 200 of the planar motor 10.

[0058] Figure 5 This is an example of a top view illustrating the configuration of the temperature sensor 17A within the tile-shaped unit 11 in the area 200 where accuracy is required.

[0059] like Figure 5 As shown in (a), the temperature sensor 17A can be individually disposed on each Hall element 16. Thus, the temperature of each Hall element 16 in the accuracy requirement region 200 can be detected with high precision.

[0060] In addition, such as Figure 5 As shown in (b), multiple Hall elements 16 can be provided within the tile-shaped unit 11 for the temperature sensor 17A. For example, in a rectangular tile-shaped unit 11, the temperature sensor 17A can be provided at the corners and the center. Therefore, based on the temperature detected by the temperature sensor 17A, the temperature distribution within the tile-shaped unit 11 in the accuracy requirement region 200 can be estimated, thereby estimating the temperature of each Hall element 16 in the accuracy requirement region 200. Furthermore, the number of temperature sensors 17A can be reduced, thereby reducing the cost of the tile-shaped unit 11.

[0061] return Figure 4 In the planar motor 10, a temperature sensor 17B is provided for measuring the temperature distribution of the entire planar motor 10. For example, in a rectangular planar motor 10 with multiple tile-shaped units 11 arranged in a row, multiple temperature sensors 17B can be provided along the outer perimeter, and a temperature sensor 17B can be provided at the center of the planar motor 10. Thus, based on the temperature detected by the temperature sensor 17B, the temperature distribution within the planar motor 10 can be estimated, thereby enabling the estimation of the temperature of each Hall element 16 in the area 200 where accuracy is required.

[0062] Next, use Figure 6 The control unit 160 for estimating the position of the conveying unit 30 will be described. Figure 6 This is an example of a functional block diagram of the control unit 160. The control unit 160 includes a temperature acquisition unit 161, a Hall element temperature estimation unit 162, a magnetic flux density calculation unit 163, and a position estimation unit 164. It should be noted that the storage unit of the control unit 160 stores the position (temperature measurement position) of the temperature sensor 17 (17A, 17B) and the position (magnetic flux measurement position) of the Hall element 16.

[0063] The detected value of the temperature sensor 17 is input to the temperature acquisition unit 161, and the temperature acquisition unit 161 acquires the temperature of each temperature measurement position detected by the temperature sensor 17.

[0064] The Hall element temperature estimation unit 162 estimates the temperature of each Hall element 16 based on the temperature at each temperature measurement location obtained by the temperature acquisition unit 161. For example, when estimating the temperature of the Hall element 16 within the accuracy requirement region 200, the Hall element temperature estimation unit 162 estimates the temperature distribution of the tile-shaped unit 11 within the accuracy requirement region 200 based on the temperature detected by the temperature sensor 17A at each temperature measurement location, and estimates the temperature of each Hall element 16 based on the estimated temperature distribution of the tile-shaped unit 11. Additionally, in the estimation transport region 210 (refer to...), Figure 1In the case of the temperature of the Hall element 16 within the motor, the Hall element temperature estimation unit 162 estimates the temperature distribution of the planar motor 10 based on the temperature of each temperature measurement position detected by the temperature sensor 17B, and estimates the temperature of each Hall element 16 based on the estimated temperature distribution of the planar motor 10.

[0065] The temperatures of each Hall element 16 estimated by the Hall element temperature estimation unit 162 and the detected values ​​(Hall voltages) of the Hall element 16 are input to the magnetic flux density calculation unit 163. The magnetic flux density calculation unit 163 calculates the magnetic flux density at each magnetic flux measurement position detected by the Hall element 16. Here, the magnetic flux density calculation unit 163 compensates for the detected values ​​of the Hall element 16 based on the temperatures of the Hall element 16 estimated by the Hall element temperature estimation unit 162 and the temperature characteristics of the Hall element 16. Thus, the magnetic flux density calculation unit 163 calculates the magnetic flux density at the magnetic flux measurement position after the temperature characteristics of the Hall element 16 have been compensated.

[0066] The position estimation unit 164 estimates the position and orientation of the transport unit 30 (permanent magnet 35) based on the magnetic flux density calculated by the magnetic flux density calculation unit 163.

[0067] Figure 7 This is an example of a top view illustrating the alignment of the transport unit 30 when the substrate W is placed on the mounting stage 111.

[0068] In the accuracy requirement area 200, a temperature sensor 17A (reference) is installed. Figure 4 , 5 Therefore, in the precision requirement area 200, when aligning the transport unit 30, the temperature of the Hall element 16 can be corrected, and the position of the transport unit 30 can be detected with high precision. This improves the alignment accuracy of the transport unit 30. Furthermore, the substrate W can be placed on the mounting stage 111 with high precision.

[0069] It should be noted that, although a thermocouple installed within the tile-shaped unit 11 has been used as an example of the temperature sensor 17 for detecting the temperature of the Hall element 16, it is not limited to this. For example, a thermal camera installed at the top of the vacuum delivery chamber 120 can be used to capture images of the tile-shaped unit 11 within the accuracy requirement area 200. The Hall element temperature estimation unit 162 estimates the temperature of each Hall element 16 based on the temperature distribution of the tile-shaped unit 11 captured by the thermal camera.

[0070] Furthermore, the Hall element temperature estimation unit 162 can estimate the heat generated by each coil 15 based on the current carried by each coil 15. Moreover, the Hall element temperature estimation unit 162 can estimate the temperature distribution of the tile-shaped unit 11 (planar motor 10) based on the estimated heat generated by each coil 15 and the temperature detected by the temperature sensor 17 at each temperature measurement location, and based on the estimated temperature distribution of the tile-shaped unit 11 (planar motor 10), estimate the temperature of each Hall element 16. Therefore, the temperature distribution of the tile-shaped unit 11 (planar motor 10) can be estimated considering the heat generated by the coil 15, thereby enabling a more accurate estimation of the temperature of each Hall element 16. Thus, the position and orientation of the conveying unit 30 can be estimated with even higher accuracy.

[0071] Next, for other components that improve the alignment accuracy in region 200, the following methods will be used. Figure 8 Please provide an explanation. Figure 8 This is another example of a top view illustrating the alignment of the transport unit 30 when the substrate W is placed on the mounting stage 111.

[0072] A position detection sensor 18 is provided to detect the position of the conveying unit 30 within the detection accuracy requirement area 200. The position detection sensor 18 is, for example, a laser displacement gauge installed on the side wall of the vacuum conveying chamber 120. The position detection sensor 18 includes two position detection sensors 18A installed on the side wall of the gate valve 112 on which the vacuum conveying chamber 120 is located, and two position detection sensors 18B installed on the other side wall of the vacuum conveying chamber 120, thereby detecting the position and orientation of the conveying unit 30 (transporter 31). This improves the alignment accuracy of the conveying unit 30. Furthermore, the substrate W can be placed on the mounting stage 111 with high precision.

[0073] It should be noted that, although a laser displacement meter installed on the side wall of the vacuum conveying chamber 120 has been used as an example to describe the position detection sensor 18 for detecting the position of the conveying unit 30 within the accuracy requirement area 200, it is not limited to this. As the position detection sensor 18 for detecting the position of the conveying unit 30 within the accuracy requirement area 200, for example, a camera device (e.g., a CCD camera) installed on the top of the vacuum conveying chamber 120 to capture images of the conveying unit 30 within the accuracy requirement area 200 can be used.

[0074] Although the substrate processing system 100 has been described above, the present invention is not limited to the above embodiments, and various modifications and improvements can be made within the scope of the spirit of the present invention as described in the claims.

Claims

1. A substrate conveying device, comprising: A planar electric motor is located in a conveying chamber and is composed of multiple tile-shaped units arranged together, each tile-shaped unit having a coil and a Hall element; A conveying unit having a permanent magnet and moving above the aforementioned ceramic tile-shaped unit to convey a substrate; A temperature sensor detects the temperature within the aforementioned tile-shaped unit; and The control unit, based on the temperature of the Hall element obtained from the detection value of the temperature sensor and the detection value of the Hall element, estimates the position of the conveying unit. The aforementioned conveying chamber has a precision-required area for aligning the aforementioned conveying units, and a conveying area that is an area outside the precision-required area. The aforementioned precision requirement area includes the position of the aforementioned transport unit when the aforementioned substrate is handed over to the mounting stage and / or when the aforementioned substrate is received from the mounting stage. The above temperature sensor has the following characteristics: The first temperature sensor, comprising Hall elements respectively located in the aforementioned areas requiring high accuracy; and The second temperature sensor is used to measure the overall temperature distribution of the aforementioned planar motor.

2. A substrate conveying device, comprising: A planar electric motor is located in a conveying chamber and is composed of multiple tile-shaped units arranged together, each tile-shaped unit having a coil and a Hall element; A conveying unit having a permanent magnet and moving above the aforementioned ceramic tile-shaped unit to convey a substrate; A temperature sensor detects the temperature within the aforementioned tile-shaped unit; and The control unit, based on the temperature of the Hall element obtained from the detection value of the temperature sensor and the detection value of the Hall element, estimates the position of the conveying unit. The aforementioned conveying chamber has a precision-required area for aligning the aforementioned conveying units, and a conveying area outside the precision-required area. The aforementioned precision requirement area includes the position of the aforementioned transport unit when the aforementioned substrate is handed over to the mounting stage and / or when the aforementioned substrate is received from the mounting stage. The above temperature sensor has the following characteristics: A first temperature sensor is used to measure the temperature distribution in the area requiring the aforementioned accuracy; and The second temperature sensor is used to measure the overall temperature distribution of the aforementioned planar motor.

3. The substrate conveying device according to claim 1 or 2, wherein, The control unit estimates the temperature distribution of the ceramic tile shape unit based on the detection value of the temperature sensor, and estimates the temperature of the Hall element based on the estimated temperature distribution.

4. The substrate conveying device according to claim 1 or 2, wherein, The control unit estimates the temperature distribution of the ceramic tile shape unit based on the current carried by the coil and the detection value of the temperature sensor, and estimates the temperature of the Hall element based on the estimated temperature distribution.

5. The substrate conveying device according to claim 1 or 2, wherein, The temperature sensor described above is a thermocouple located within the aforementioned ceramic tile-shaped unit.

6. A substrate transport method, which is a substrate transport method of the substrate transport apparatus according to any one of claims 1 to 5, wherein the substrate transport method comprises: Based on the temperature sensor readings, the temperature distribution of the aforementioned tile shape unit is estimated. Based on the estimated temperature distribution described above, the temperature of the Hall element is estimated. Based on the estimated temperature of the Hall element and the detected value of the Hall element, the position of the conveying unit is estimated, thereby aligning the conveying unit.

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