A heat-conducting surface-adjustable heat-conducting device and a method of use

Abstract

The application provides a heat-conducting device with adjustable heat-conducting surface and a use method. The heat-conducting plate is matched with a base plate for mounting the circuit board through a plurality of wedge-shaped steps. The height of the heat-conducting plate is controlled by adjusting the screw to control the displacement of the heat-conducting plate along the direction of the wedge-shaped steps. The heat-conducting pad is arranged on the heat-conducting plate. The height of the heat-conducting plate is changed. The heat-conducting pad is matched with the upper end of the heat dissipation air duct. The heat transfer channel between the circuit board and the heat dissipation air duct is connected. The heat dissipation efficiency of the circuit board is improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation in electronic devices, and in particular to an adjustable heat conduction device and its usage method. Background Technology

[0002] To address heat dissipation issues for components on printed circuit boards (PCBs) in reinforced, enclosed electronic devices, metal heat-conducting boxes are typically used to cover the components for heat conduction, which then transfers heat to the chassis. However, these boxes often have insufficient contact area, resulting in low heat transfer efficiency. This contradiction with the ever-increasing heat dissipation demands is becoming increasingly prominent. Therefore, increasing the heat transfer area between the PCB and the chassis is a common method to improve efficiency. However, because the upper contact surface of the heat-conducting box is not adjustable, it's difficult to simultaneously satisfy the fit between the PCB and the base plate, and the fit between the upper contact surface of the heat-conducting box and the chassis's cooling ducts. When the PCB and the base plate of the heat-conducting box are in contact, the heat-conducting box often cannot fit tightly against the internal cooling ducts of the chassis, resulting in a significant gap. Furthermore, the chassis's cooling ducts themselves often have uneven surfaces or errors after processing, making it difficult to achieve a complete fit between the heat-conducting box and the cooling ducts, thus reducing heat dissipation efficiency.

[0003] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0004] The technical problem to be solved by this invention is how to ensure the fit between the heat-conducting box and the heat dissipation air duct inside the chassis to eliminate gaps and thus improve heat dissipation efficiency.

[0005] The present invention adopts the following technical solution:

[0006] In a first aspect, a heat-conducting device with an adjustable heat-conducting surface includes: a substrate 1, a heat-conducting plate 2, a heat-conducting pad 3, and an adjusting screw 4, wherein:

[0007] A wedge-shaped platform 11 is provided on the substrate 1. The wedge-shaped platform 11 is used to cooperate with the wedge-shaped surface on the lower surface of the heat-conducting plate 2, so that the heat-conducting plate 2 is disposed on the wedge-shaped platform 11.

[0008] The substrate 1 is also provided with a mounting platform 12, which is provided with a through hole 121. One end of the screw of the adjusting screw 4 passes through the through hole 121 and is threadedly connected to the heat-conducting plate 2. One end of the nut of the adjusting screw 4 abuts against the mounting platform 12 and is used to rotate, thereby driving the heat-conducting plate 2 to move along the direction of the adjusting screw 4, and further driving the heat-conducting plate 2 to move along the wedge-shaped platform 11 to change the height of the heat-conducting plate 2 relative to the substrate 1.

[0009] The lower end of the substrate 1 is used to mount the circuit board 5;

[0010] The thermal pad 3 is positioned above the thermal plate 2. By adjusting the height of the thermal plate 2, the thermal pad 3 is ensured to fit in close contact with the heat dissipation duct 6 in the chassis, thereby improving the heat transfer efficiency of the heat transfer channel between the circuit board 5 and the heat dissipation duct 6.

[0011] Preferably, the surface of the wedge-shaped platform 11 is wedge-shaped stepped, and each wedge-shaped step on the wedge-shaped platform 11 is inclined upward in the first direction, so as to ensure that the height of the heat-conducting plate 2 increases when the heat-conducting plate 2 moves in the first direction on the wedge-shaped platform 11.

[0012] The first direction is the horizontal direction toward the mounting platform 12.

[0013] Preferably, the heat-conducting plate 2 is further provided with limiting pins 21 on both sides, and the wedge-shaped platform 11 is provided with pin holes 111 on both sides that cooperate with the limiting pins 21. The limiting pins 21 and the pin holes 111 are both parallel to the inclined surface of the wedge-shaped platform 11, so as to ensure that when the heat-conducting plate 2 moves on the wedge-shaped platform 11, the moving path of the heat-conducting plate 2 is parallel to the inclined surface on the wedge-shaped platform 11.

[0014] Preferably, one end of the nut of the adjusting screw 4 abuts against the mounting platform 12 and is used for rotation, specifically including:

[0015] A limiting cover 122 is provided on one side of the nut at the through hole 121. When the adjusting screw 4 is inserted into the through hole 121 and threadedly connected to the heat-conducting plate 2, the limiting cover 122 covers the nut of the adjusting screw 4 and is riveted to the mounting platform 12 to ensure that the nut fits snugly against the mounting platform 12.

[0016] The upper end of the limiting cover 122 is also provided with an opening, through which the nut is adjusted, thereby causing the heat-conducting plate 2 to move along the direction of the adjusting screw 4.

[0017] Preferably, a sealing frame 7 is provided on the outer periphery of the wedge-shaped platform 11 and the outer periphery of the heat-conducting plate 2. The lower end of the sealing frame 7 is connected to the substrate 1 and is used to seal the gap between the wedge-shaped platform 11 and the heat-conducting plate 2.

[0018] Preferably, the sealing frame 7 specifically includes: an upper frame 71, a middle frame 72, and a lower frame 73, wherein:

[0019] The lower frame 73 is located at the lower end of the sealing frame 7, is connected to the substrate 1, and is arranged around the periphery of the wedge-shaped platform 11;

[0020] The upper frame 71 is located at the top of the sealing frame 7 and is arranged around the periphery of the heat-conducting plate 11;

[0021] The middle frame 72 is located between the upper frame 71 and the lower frame 73, connecting the upper frame 71 and the lower frame 73. The middle frame 72 is made of elastic material to ensure that when the heat-conducting plate 2 moves relative to the wedge stage 11, the upper frame 71 can move synchronously relative to the lower frame 73.

[0022] Preferably, one end of the adjusting screw 4 passes through the through hole 121 and is threadedly connected to the heat-conducting plate 2, specifically including:

[0023] The heat-conducting plate 2 is provided with a mounting block 22 at a position opposite to the through hole 121 on the mounting platform 12. The mounting block 22 is provided with a threaded hole 221 on the side facing the mounting platform 12 for connecting with the adjusting screw 4.

[0024] Preferably, one end of the adjusting screw 4 passes through the through hole 121 and is threadedly connected to the heat-conducting plate 2, and further includes:

[0025] Connecting blocks 23 are provided on both sides of the mounting block 22 on the heat-conducting plate 2, and the mounting block 22 and the connecting blocks 23 are connected in series by the guide rod 24.

[0026] Preferably, the lower end of the substrate 1 is further provided with a groove 13 and a heat dissipation protrusion 14. The heat dissipation protrusion 14 is disposed inside the groove 13. The groove 13 is used to accommodate the components on the circuit board 5. The heat dissipation protrusion 14 is used to fit with the components on the circuit board 5, thereby establishing a heat transfer channel between the components on the circuit board 5 and the thermal pad 3.

[0027] Secondly, a method of using a heat-conducting device with an adjustable heat-conducting surface, wherein the heat-conducting device with an adjustable heat-conducting surface is used, wherein:

[0028] Insert the adjustable heat-conducting device into the chassis and place it on the top of the circuit board 5. At the same time, attach the components on the circuit board 5 to the heat dissipation protrusion 14 at the bottom of the substrate 1.

[0029] Rotating the adjusting screw 4 causes the heat-conducting plate 2 to move towards the mounting platform 12 while its height increases, ensuring that the heat-conducting pad 3 is in contact with the heat dissipation duct 6 inside the chassis, thereby improving the heat transfer efficiency of the heat transfer channel between the circuit board 5 and the heat dissipation duct 6.

[0030] This invention provides an adjustable heat-conducting device and its usage method. A heat-conducting plate 2 is engaged with a substrate 1 used to mount a circuit board 5 through multiple wedge-shaped steps. The heat-conducting plate 2 is moved along the direction of the wedge-shaped steps by adjusting screws 4, thereby controlling the height of the heat-conducting plate 2. At the same time, a heat-conducting pad 3 is provided on the heat-conducting plate 2. Changing the height of the heat-conducting plate 2 eliminates the gap between the heat-conducting pad 3 and the heat dissipation duct, and brings the heat-conducting pad 3 into contact with the heat dissipation duct 6 inside the chassis, ensuring the connection of the heat transfer channel between the circuit board 5 and the heat dissipation duct 6, thereby improving the heat dissipation efficiency of the circuit board 5. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of an adjustable heat-conducting device according to an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of a heat-conducting device with an adjustable heat-conducting surface provided in an embodiment of the present invention, which eliminates the need for adjusting screws.

[0034] Figure 3 This is a schematic diagram of another adjustable heat-conducting device with a heat-conducting surface provided in an embodiment of the present invention, without the adjustment screw;

[0035] Figure 4 This is a cross-sectional view of an adjustable heat-conducting device with an adjustable heat-conducting surface provided in an embodiment of the present invention after being inserted into the chassis;

[0036] Figure 5 This is a side sectional view of an adjustable heat-conducting surface heat-conducting device provided in an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of another adjustable heat-conducting surface heat-conducting device provided in an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of the structure of an adjustable heat-conducting device for removing heat-conducting plates and heat-conducting pads according to an embodiment of the present invention;

[0039] Figure 8 This is a schematic diagram of another adjustable heat conduction device provided in an embodiment of the present invention;

[0040] Figure 9This is a side sectional view of another adjustable heat-conducting surface heat-conducting device provided in an embodiment of the present invention;

[0041] Figure 10 This is a schematic diagram of the structure of an adjustable heat-conducting device according to an embodiment of the present invention;

[0042] Figure 11 This is a cross-sectional view of the movable block of an adjustable heat-conducting device with a heat-conducting surface connected to a limiting cover, provided in an embodiment of the present invention.

[0043] Figure 12 This is a schematic diagram of a heat-conducting device with an adjustable heat-conducting surface and a sealing frame provided in an embodiment of the present invention;

[0044] Figure 13 This is a schematic diagram of the sealing frame of an adjustable heat-conducting device according to an embodiment of the present invention;

[0045] Figure 14 This is a schematic diagram of the structure of an adjustable heat-conducting device according to an embodiment of the present invention;

[0046] Figure 15 This is a schematic diagram of a heat-conducting device with an adjustable heat-conducting surface provided in an embodiment of the present invention, which eliminates the need for adjusting screws.

[0047] Figure 16 This is a schematic diagram of a heat-conducting device with an adjustable heat-conducting surface for removing circuit boards, provided in an embodiment of the present invention.

[0048] The labels in the attached diagram are as follows:

[0049] 1. Substrate; 2. Heat-conducting plate; 3. Heat-conducting pad; 4. Adjusting screw; 11. Wedge-shaped platform; 12. Mounting platform; 121. Through hole; 5. Circuit board; 6. Heat dissipation duct; 21. Limiting pin; 111. Pin hole; 122. Limiting cover; 7. Sealing frame; 71. Upper frame; 72. Middle frame; 73. Lower frame; 22. Mounting block; 221. Threaded hole; 23. Connecting block; 24. Guide rod; 13. Groove; 14. Heat dissipation boss; 25. Moving block. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0051] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0052] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0053] Example 1:

[0054] Embodiment 1 of the present invention provides a heat-conducting device with an adjustable heat-conducting surface; such as Figures 1-5 As shown, it includes: a substrate 1, a heat-conducting plate 2, a heat-conducting pad 3, and an adjusting screw 4, wherein:

[0055] A wedge-shaped platform 11 is provided on the substrate 1. The wedge-shaped platform 11 is used to cooperate with the wedge-shaped surface on the lower surface of the heat-conducting plate 2, so that the heat-conducting plate 2 is disposed on the wedge-shaped platform 11.

[0056] like Figure 6 As shown, in this embodiment, the wedge-shaped platform 11 is integrally formed with the substrate 1. The upper surface of the wedge-shaped platform 11 and the lower surface of the heat-conducting plate 2 are both wedge-shaped steps. The upper surface of the wedge-shaped platform 11 matches the shape of the lower surface of the heat-conducting plate 2, ensuring that when the heat-conducting plate 2 is placed on the wedge-shaped platform 11, the wedge-shaped surface of the lower surface of the heat-conducting plate 2 matches the upper surface of the wedge-shaped platform 11.

[0057] The surface of the wedge-shaped platform 11 is wedge-shaped and stepped, and each wedge-shaped step on the wedge-shaped platform 11 is inclined upward in a first direction, so as to ensure that when the heat-conducting plate 2 moves on the wedge-shaped platform 11 in the first direction, the height of the heat-conducting plate 2 increases, wherein the first direction is the horizontal direction toward the mounting platform 12.

[0058] like Figure 2 As shown, a mounting platform 12 is also provided on the substrate 1. The mounting platform 12 has a through hole 121. One end of the screw of the adjusting screw 4 passes through the through hole 121 and is threadedly connected to the heat-conducting plate 2. One end of the nut of the adjusting screw 4 abuts against the mounting platform 12 and is used for rotation, thereby driving the heat-conducting plate 2 to move along the direction of the adjusting screw 4, and further driving the heat-conducting plate 2 to move vertically along the wedge-shaped platform 11, so as to change the height of the heat-conducting plate 2 relative to the substrate 1. After the height is changed, as shown... Figure 3 As shown.

[0059] The mounting platform 12 is mainly used to set the adjusting screw 4, providing a fixed force application position for the adjusting screw 4. The through hole 121 is not threaded, only used for the adjusting screw 4 to pass through, and does not engage with the adjusting screw 4 threadedly. The adjusting screw 4 includes a nut and a screw rod, wherein the screw rod passes through the through hole 121 and is threadedly connected to the threaded hole 221 on the heat-conducting plate 2. By rotating the adjusting nut, the screw rod enters the threaded hole 221 of the heat-conducting plate 2 until the nut part abuts against the mounting platform 12. This is the initial state. If it is necessary to raise the height of the heat-conducting plate 2 vertically along the wedge-shaped platform 11, the adjusting screw 4 is rotated to continue to enter the threaded hole 221 of the heat-conducting plate 2. However, during this process, since the nut part has abutted against the mounting platform 12, the mounting platform 12 is in a fixed state and cannot be moved. Therefore, the adjusting screw 4 cannot be displaced relative to the mounting platform 12 towards the heat-conducting plate 2. Therefore, the heat-conducting plate 2 can only be displaced towards the mounting platform 12, thereby driving the heat-conducting plate 2 to move along the direction of the adjusting screw 4.

[0060] Since the height of the heat-conducting plate 2 changes, the height of the adjusting screw connected to it also changes. Therefore, the diameter of the through hole 121 in the vertical direction is larger than the cross-sectional diameter of the adjusting screw 4. When the adjusting screw 4 needs to move vertically with the heat-conducting plate 2, the through hole 121 can provide space in the vertical direction for the adjusting screw 4 to move up and down in the vertical direction.

[0061] Furthermore, the lower end of the substrate 1 is used to mount the circuit board 5; as shown... Figure 4 As shown, the thermal pad 3 is disposed above the thermal plate 2. By adjusting the height of the thermal plate 2 in the vertical direction, the thermal pad 3 is ensured to be in contact with the heat dissipation duct 6 in the chassis, thereby improving the heat transfer efficiency of the heat transfer channel between the circuit board 5 and the heat dissipation duct 6.

[0062] The thermal pad 3 is made of a thermally conductive material with a certain degree of elasticity. This ensures that when the thermal pad 3 is in contact with the heat dissipation duct 6, it can undergo elastic deformation to buffer the rise of the thermal pad 3. Furthermore, since the heat dissipation duct 6 of the chassis usually has unevenness or errors on its surface after processing, it is difficult to achieve a complete fit between the upper surface of the thermal pad and the heat dissipation duct 6. However, the thermal pad 3 in this embodiment can fill the unevenness or errors on the lower surface of the heat dissipation duct 6 by the compression between the thermal plate 2 and the heat dissipation duct 6, based on its own elastic deformation, thereby ensuring a full fit between the thermal pad 3 and the heat dissipation duct 6 and further improving the heat dissipation efficiency.

[0063] In this embodiment, the adjustable heat-conducting device is directly inserted into the chassis, with the insertion position located between the circuit board 5 and the heat dissipation duct 6. The heat dissipation duct 6 is used to dissipate heat from the circuit board 5. However, due to the internal structure of the chassis, the heat dissipation duct 6 cannot be directly attached to the circuit board 5, and there is a distance between the two installation positions. The adjustable heat-conducting device is inserted between the circuit board 5 and the heat dissipation duct 6, with the circuit board 5 attached to the lower end of the adjustable heat-conducting device and the heat dissipation duct 6 attached to the upper end of the adjustable heat-conducting device, thereby establishing a heat transfer channel between the circuit board 5 and the heat dissipation duct 6.

[0064] In the existing structure, when heat is conducted between the circuit board 5 and the heat dissipation duct 6 through the heat conduction box, the height of the heat conduction box itself is usually not adjustable, making it difficult to fully fit the heat conduction box with the heat dissipation duct 6. In some cases, there may even be gaps, which makes it difficult for the heat conduction box to fully transfer the heat from the circuit board 5 to the heat dissipation duct 6, thereby reducing the heat dissipation efficiency.

[0065] This embodiment provides an adjustable heat-conducting device. The heat-conducting plate 2 is engaged with the substrate 1 used to mount the circuit board 5 through multiple wedge-shaped steps. The heat-conducting plate 2 is moved along the direction of the wedge-shaped steps by adjusting the screw 4, thereby controlling the height of the heat-conducting plate 2. At the same time, a heat-conducting pad 3 is provided on the heat-conducting plate 2. By changing the height of the heat-conducting plate 2, the heat-conducting pad 3 is brought into contact with the heat dissipation air duct 6 inside the chassis, ensuring the connection of the heat transfer channel between the circuit board 5 and the heat dissipation air duct 6, thereby improving the heat dissipation efficiency of the circuit board 5.

[0066] In order to prevent the relative movement distance of the heat-conducting plate 2 from being too large during the movement of the heat-conducting plate 2 on the wedge stage 11, which would result in an excessive reduction in the contact area between the heat-conducting plate 2 and the wedge stage 11, it is necessary to limit the displacement distance of the heat-conducting plate 2.

[0067] like Figure 6 and Figure 7 As shown, the heat-conducting plate 2 is also provided with limiting pins 21 on both sides, and the wedge-shaped platform 11 is provided with pin holes 111 on both sides that cooperate with the limiting pins 21. The limiting pins 21 and the pin holes 111 are parallel to the inclined surface of the wedge-shaped platform 11, so as to ensure that when the heat-conducting plate 2 moves on the wedge-shaped platform 11, the moving path of the heat-conducting plate 2 is parallel to the inclined surface on the wedge-shaped platform 11.

[0068] In this embodiment, the limiting pins 21 are disposed on both sides of the heat-conducting plate 2, with at least two limiting pins 21 disposed on one side. A pin hole 111 is provided on the wedge-shaped platform 11 corresponding to each limiting pin 21. The limiting pins 21 are screwed to the side of the heat-conducting plate 2 and are sleeved in the pin holes 111. When the heat-conducting plate 2 moves relative to the wedge-shaped platform 11, the limiting pins 21 slide in the pin holes 111. By setting the length of the pin holes 111, the movement is controlled... The limiting pin 21 slides a certain distance in the pin hole 111, thereby controlling the moving distance of the heat-conducting plate 2. This prevents the gap between the wedge-shaped surface of the heat-conducting plate 2 and the wedge-shaped platform 11 from becoming too large due to excessive moving distance of the heat-conducting plate 2, which would affect the heat dissipation efficiency. Furthermore, since the limiting pin 21 is parallel to the side of the heat-conducting plate 2, when the limiting pin 21 engages with the pin hole 111, it limits the heat-conducting plate 2 in the direction of both sides of the wedge-shaped platform 11, preventing the heat-conducting plate from moving in the direction of both sides of the wedge-shaped platform 11.

[0069] By setting the length of the pin hole 111, the maximum displacement distance of the heat conduction plate 2 on the wedge stage 11 is controlled, thus avoiding excessive gap between the wedge surface of the heat conduction plate 2 and the wedge stage 11, which would affect the heat dissipation efficiency.

[0070] When the height of the heat-conducting plate 2 is raised or lowered, it is achieved by screwing the adjusting screw 4 in or out of the heat-conducting plate 2. When the adjusting screw 4 is screwed in, since the nut abuts against the mounting platform 12, the adjusting screw 4 does not move, but the heat-conducting plate 2 moves by rotating the adjusting screw 4. However, when the adjusting screw 4 is screwed out, if the adjusting screw 4 can be displaced, the heat-conducting plate 2 may not move, and the adjusting screw 4 may come off the mounting platform 12. Therefore, while ensuring that the adjusting screw 4 can be rotated and adjusted, it is necessary to press the adjusting screw 4 onto the mounting platform 12 to prevent the adjusting screw 4 from being displaced.

[0071] Specifically, such as Figure 8 and Figure 9 As shown, one end of the nut of the adjusting screw 4 abuts against the mounting platform 12 and is used for rotation, specifically including:

[0072] A limiting cover 122 is provided on one side of the nut at the through hole 121 of the mounting platform 12. When the adjusting screw 4 is inserted into the through hole 121 and threadedly connected to the heat-conducting plate 2, the limiting cover 122 covers the nut of the adjusting screw 4 and is riveted to the mounting platform 12, thereby pressing the nut of the adjusting screw 4 to ensure that the nut fits snugly against the mounting platform 12.

[0073] The upper end of the limiting cover 122 is also provided with an opening, through which the nut is adjusted, thereby causing the heat-conducting plate 2 to move along the direction of the adjusting screw 4.

[0074] In this embodiment, the limiting cover 122 is a hollow cylinder with the middle for accommodating the adjusting screw 4. The diameter of the opening at the top is smaller than the diameter of the nut, and the height of the limiting cover 122 is slightly greater than the height of the nut, thereby pressing down the nut of the adjusting screw 4.

[0075] like Figure 10 and Figure 11 As shown, considering that the mounting platform 12 is perpendicular to the bottom surface of the substrate 1, when adjusting the adjusting screw 4, it is more convenient to apply force by rotating it while it is abutting against the adjusting screw 4 from the outside. However, it is not conducive to the adjusting screw 4 moving vertically upward or downward in the through hole 121 when it is abutting against the adjusting screw 4 from the outside. Therefore, a moving block 25 is also provided on the outside of the through hole 121 on the mounting platform 12. The moving block 25 is in contact with the mounting platform 12 through the inclined surface. The moving block 25 is provided with a corresponding... The second through hole corresponding to the through hole 121 on the mounting platform 12, the adjusting screw 4 passes through the through hole 121 and the second through hole and is then threaded to the heat-conducting surface 2. The limiting cover 122 covers the second through hole and is riveted to the moving block 25. When the adjusting screw 4 moves in the vertical direction, it directly drives the moving block 25 to move along the inclined surface on the mounting platform 12. This makes it easier to apply force when the adjusting screw 4 is manually operated, as the moving block 25 moves along the inclined surface to complete the vertical position.

[0076] Since a gap will inevitably be generated between the wedge-shaped surface of the heat-conducting plate 2 and the wedge-shaped stage 11 when relative displacement occurs between them, this embodiment also involves the following preferred design in order to further reduce the decrease in heat transfer efficiency caused by this gap.

[0077] The heat-conducting plate 2 and the wedge-shaped platform 11 are filled with a heat-conducting medium.

[0078] In this embodiment, the heat-conducting medium is either a paste or a liquid. When the heat-conducting medium is a paste, it is directly applied in advance to the upper surface of the wedge-shaped platform 11 and the lower surface of the heat-conducting plate 2, thereby improving the heat conduction efficiency during use. When the heat-conducting medium is a liquid, it is pre-injected into the space between the sealing frame 7, the wedge-shaped platform 11, and the heat-conducting plate 2. When the heat-conducting plate 2 moves relative to the wedge-shaped platform 11, the heat-conducting medium flows into the gap between the heat-conducting plate 2 and the wedge-shaped platform 11, thereby improving the heat conduction efficiency during use.

[0079] In order to further reduce the heat transfer loss caused by the gap between the heat-conducting plate 2 and the wedge-shaped platform 11, this embodiment provides a sealing frame 7 on the outer periphery of the side of the wedge-shaped platform 11 and the outer periphery of the side of the heat-conducting plate 2 to seal the gap between the wedge-shaped platform 11 and the heat-conducting plate 2 and the heat-conducting medium in the gap.

[0080] like Figure 10 and Figure 11 As shown, a sealing frame 7 is also provided on the outer periphery of the wedge-shaped platform 11 and the outer periphery of the heat-conducting plate 2. The lower end of the sealing frame 7 is connected to the substrate 1 and is used to seal the gap between the wedge-shaped platform 11 and the heat-conducting plate 2.

[0081] The sealing frame 7 specifically includes: an upper frame 71, a middle frame 72, and a lower frame 73, wherein:

[0082] The lower frame 73 is located at the lower end of the sealing frame 7, is connected to the substrate 1, and is arranged around the periphery of the wedge-shaped platform 11;

[0083] The upper frame 71 is located at the top of the sealing frame 7 and is arranged around the periphery of the heat-conducting plate 11;

[0084] The middle frame 72 is located between the upper frame 71 and the lower frame 73, connecting the upper frame 71 and the lower frame 73. The middle frame 72 is made of elastic material to ensure that when the heat-conducting plate 2 moves relative to the wedge stage 11, the upper frame 71 can move synchronously relative to the lower frame 73.

[0085] In this embodiment, the middle frame 72 is made of rubber to ensure that when the heat-conducting plate 2 is displaced relative to the wedge stage 11, the middle frame 72 can deform to match the relative synchronous displacement between the upper frame 71 and the lower frame 73.

[0086] In this embodiment, the height of the upper frame 71 is the same as the height of the heat-conducting plate 2, and the heat-conducting pad 3 is disposed on the upper end of the heat-conducting plate 2. Therefore, the height of the heat-conducting pad 3 is higher than the height of the upper frame 71.

[0087] like Figure 12 and Figure 13 As shown, one end of the adjusting screw 4 passes through the through hole 121 and is threadedly connected to the heat-conducting plate 2, specifically including:

[0088] The heat-conducting plate 2 is provided with a mounting block 22 at a position opposite to the through hole 121 on the mounting platform 12. The mounting block 22 is provided with a threaded hole 221 on the side facing the mounting platform 12 for connecting with the adjusting screw 4.

[0089] One end of the adjusting screw 4 passes through the through hole 121 and is threadedly connected to the heat-conducting plate 2. It also includes:

[0090] Connecting blocks 23 are provided on both sides of the mounting block 22 on the heat-conducting plate 2, and the mounting block 22 and the connecting blocks 23 are connected in series by the guide rod 24.

[0091] In this embodiment, the mounting block 22 is typically positioned in the middle of the side of the heat-conducting plate 2 to ensure uniform and stable force distribution.

[0092] The connecting block 23 is connected to the mounting block 22 via the guide rod 24, ensuring that the force applied to the mounting block 22 is also distributed to the connecting blocks 23 on both sides, thus ensuring the overall stability of the heat-conducting plate 2.

[0093] In this embodiment, since the height of the upper frame 71 is the same as the height of the heat-conducting plate 2, the periphery of the heat-conducting plate 2 is surrounded by the upper frame 71. Therefore, slots need to be provided at the corresponding positions of the upper frame 71, the mounting block 22, and the connecting block 23. The mounting block 22 and the connecting block 23 are directly connected to the heat-conducting plate 2 through the slots. In this embodiment, the mounting block 22 and the connecting block 23 are fixedly connected to the heat-conducting plate 2 by screws.

[0094] Considering that the heat dissipation target is the components on the circuit board 5, and the components are usually high relative to the circuit board 5 itself, and the circuit board 5 is usually provided with components of different heights, it is necessary to attach the components of different heights to the substrate 1. Therefore, this embodiment also involves the following preferred design.

[0095] like Figure 14 As shown, the lower end of the substrate 1 is also provided with a groove 13 and a heat dissipation protrusion 14. The heat dissipation protrusion 14 is disposed inside the groove 13. The groove 13 is used to accommodate the components on the circuit board 5. The heat dissipation protrusion 14 is used to fit with the components on the circuit board 5, thereby establishing a heat transfer channel between the components on the circuit board 5 and the thermal pad 3.

[0096] In this embodiment, the groove 13 is used to accommodate all the components on the circuit board 5. Therefore, the range of the groove 13 on the substrate 1 should cover all the components on the circuit board 5, and the depth of the groove 13 should be greater than or equal to the maximum height of the components on the circuit board 5. The heat dissipation protrusion 14 should be customized separately for different circuit boards 5. According to the position and height of each component on the corresponding model of the circuit board 5, different heat dissipation protrusions 14 are assigned to different components on the circuit board 5. When the circuit board 5 is installed on the lower end of the substrate 1, it should be ensured that the heat dissipation protrusion 14 is in contact with the corresponding component, thereby establishing a heat transfer channel between the component and the heat dissipation air duct 6.

[0097] Example 2:

[0098] Based on Embodiment 1, this embodiment of the invention provides a method for using an adjustable heat-conducting device, which is applied to the adjustable heat-conducting device in Embodiment 1.

[0099] Insert the adjustable heat-conducting device into the chassis and place it on the top of the circuit board 5. At the same time, attach the components on the circuit board 5 to the heat dissipation protrusion 14 at the bottom of the substrate 1.

[0100] Rotating the adjusting screw 4 causes the heat-conducting plate 2 to move in the first direction while its height increases, ensuring that the heat-conducting pad 3 is in contact with the heat dissipation duct 6 inside the chassis, thereby improving the heat transfer efficiency of the heat transfer channel between the circuit board 5 and the heat dissipation duct 6.

[0101] For details on the specific structure of the adjustable heat conduction device, please refer to the aforementioned embodiments, which will not be repeated here.

[0102] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat-conducting device with an adjustable heat-conducting surface, characterized in that, include: The components are: a substrate (1), a heat-conducting plate (2), a heat-conducting pad (3), and an adjusting screw (4), wherein: A wedge-shaped platform (11) is provided on the substrate (1). The wedge-shaped platform (11) is used to cooperate with the wedge-shaped surface on the lower surface of the heat-conducting plate (2) so that the heat-conducting plate (2) is placed on the wedge-shaped platform (11). The substrate (1) is also provided with a mounting platform (12), the mounting platform (12) is provided with a through hole (121), one end of the screw of the adjusting screw (4) passes through the through hole (121) and is threadedly connected to the heat-conducting plate (2), one end of the nut of the adjusting screw (4) abuts against the mounting platform (12) and is used to rotate, thereby driving the heat-conducting plate (2) to move along the direction of the adjusting screw (4), and further driving the heat-conducting plate (2) to move along the wedge-shaped platform (11) to change the height of the heat-conducting plate (2) relative to the substrate (1); The lower end of the substrate (1) is used to mount the circuit board (5); The heat-conducting pad (3) is placed above the heat-conducting plate (2). By adjusting the height of the heat-conducting plate (2), the heat-conducting pad (3) is made to fit with the heat dissipation duct (6) in the chassis, thereby improving the heat transfer efficiency of the heat transfer channel between the circuit board (5) and the heat dissipation duct (6). A sealing frame (7) is also provided on the outer periphery of the wedge-shaped platform (11) and the outer periphery of the heat-conducting plate (2). The lower end of the sealing frame (7) is connected to the substrate (1) to seal the gap between the wedge-shaped platform (11) and the heat-conducting plate (2). The sealing frame (7) specifically includes: an upper frame (71), a middle frame (72), and a lower frame (73), wherein: the lower frame (73) is located at the lower end of the sealing frame (7), is connected to the substrate (1), and is arranged around the wedge-shaped platform (11). The upper frame (71) is located on top of the sealing frame (7) and surrounds the periphery of the heat-conducting plate (2); the middle frame (72) is located between the upper frame (71) and the lower frame (73) and connects the upper frame (71) and the lower frame (73). The middle frame (72) is made of elastic material to ensure that when the heat-conducting plate (2) moves relative to the wedge (11), the upper frame (71) can move synchronously relative to the lower frame (73). The heat-conducting plate (2) and the wedge platform (11) are filled with a heat-conducting medium. The heat-conducting medium is liquid. The heat-conducting medium is pre-injected into the space between the sealing frame (7), the wedge platform (11), and the heat-conducting plate (2). When the heat-conducting plate (2) moves relative to the wedge platform (11), the heat-conducting medium flows into the gap between the heat-conducting plate (2) and the wedge platform (11), thereby improving the heat conduction efficiency during use. The heat-conducting plate (2) is also provided with limiting pins (21) on both sides. The wedge-shaped platform (11) is provided with pin holes (111) that cooperate with the limiting pins (21) on both sides. The limiting pins (21) and the pin holes (111) are parallel to the inclined surface of the wedge-shaped platform (11), ensuring that when the heat-conducting plate (2) moves on the wedge-shaped platform (11), the moving path of the heat-conducting plate (2) is parallel to the inclined surface on the wedge-shaped platform (11).

2. The adjustable heat-conducting surface heat-conducting device according to claim 1, characterized in that, The surface of the wedge-shaped platform (11) is wedge-shaped and stepped, and each wedge-shaped step on the wedge-shaped platform (11) is inclined upward in the first direction to ensure that the height of the heat-conducting plate (2) increases when the heat-conducting plate (2) moves in the first direction on the wedge-shaped platform (11); The first direction is the horizontal direction toward the mounting platform (12).

3. The adjustable heat-conducting surface heat-conducting device according to claim 1, characterized in that, One end of the nut of the adjusting screw (4) abuts against the mounting platform (12) and is used for rotation, specifically including: A limiting cap (122) is provided on one side of the nut at the through hole (121). When the adjusting screw (4) is inserted into the through hole (121) and threadedly connected to the heat-conducting plate (2), the limiting cap (122) covers the nut of the adjusting screw (4) and is riveted to the mounting platform (12) to ensure that the nut fits snugly against the mounting platform (12). The upper end of the limiting cover (122) is also provided with an opening, through which the nut is adjusted, so that the heat-conducting plate (2) moves in the direction of the adjusting screw (4).

4. The adjustable heat-conducting surface heat-conducting device according to claim 1, characterized in that, One end of the adjusting screw (4) passes through the through hole (121) and is threadedly connected to the heat-conducting plate (2), specifically including: The heat-conducting plate (2) is provided with a mounting block (22) at a position opposite to the through hole (121) on the mounting platform (12). The mounting block (22) is provided with a threaded hole (221) on the side facing the mounting platform (12) for connecting with the adjusting screw (4).

5. The adjustable heat-conducting surface heat-conducting device according to claim 4, characterized in that, One end of the adjusting screw (4) passes through the through hole (121) and is threadedly connected to the heat-conducting plate (2), and also includes: Connecting blocks (23) are provided on both sides of the mounting block (22) on the heat-conducting plate (2), and the mounting block (22) and the connecting block (23) are connected in series by the guide rod (24).

6. The adjustable heat-conducting surface heat-conducting device according to claim 1, characterized in that, The substrate (1) is further provided with a groove (13) and a heat dissipation boss (14) at its lower end. The heat dissipation boss (14) is disposed inside the groove (13). The groove (13) is used to accommodate the components on the circuit board (5). The heat dissipation boss (14) is used to fit with the components on the circuit board (5), thereby establishing a heat transfer channel between the components on the circuit board (5) and the heat-conducting pad (3).

7. A method of using a heat-conducting device with an adjustable heat-conducting surface, characterized in that, Using the adjustable heat-conducting surface heat-conducting device as described in any one of claims 1-6, wherein: Insert the adjustable heat-conducting device into the chassis and place it on the upper end of the circuit board (5). At the same time, attach the components on the circuit board (5) to the heat dissipation protrusion (14) at the lower end of the substrate (1). Rotate the adjusting screw (4) to move the heat-conducting plate (2) toward the mounting platform (12) and raise its height, so that the heat-conducting pad (3) is in contact with the heat dissipation air duct (6) in the chassis, thereby improving the heat transfer efficiency of the heat transfer channel between the circuit board (5) and the heat dissipation air duct (6).

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