A heat dissipation module and a data center

Abstract

The embodiment of the application discloses a heat dissipation module and a data center, relates to the field of equipment heat dissipation technology, and solves the problem of uneven heat dissipation in the related art. The heat dissipation module comprises a circulation loop for guiding the flow of a heat dissipation medium, the circulation loop comprises at least two heat exchange units and a heat dissipation assembly, the at least two heat exchange units are sequentially and serially arranged in the circulation loop, and the heat exchange units are used for exchanging heat with electronic equipment; the heat dissipation assembly comprises at least two heat dissipation units, the at least two heat dissipation units and the at least two heat exchange units are alternately arranged along the flow direction of the heat dissipation medium, and the heat dissipation units are used for dissipating heat of the heat dissipation medium. The heat dissipation module of the application is used for cooling electronic equipment.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of equipment heat dissipation, and particularly to a heat dissipation module and a data center. Background Technology

[0002] In related technologies, the temperature of each heat exchange unit in the heat dissipation module is uneven, and redundant design is required, which affects the heat dissipation effect. Summary of the Invention

[0003] The heat dissipation module and data center provided in this application embodiment have a balanced temperature, require no redundant design, and have a good heat dissipation effect.

[0004] In a first aspect, embodiments of this application provide a heat dissipation module, including a circulation loop for guiding the flow of a heat dissipation medium. The circulation loop includes at least two heat exchange units and a heat dissipation component. The at least two heat exchange units are sequentially connected in series in the circulation loop, and the heat exchange units are used to exchange heat with electronic devices. The heat dissipation component includes at least two heat dissipation units, and the at least two heat dissipation units and at least two heat exchange units are alternately arranged along the flow direction of the heat dissipation medium. The heat dissipation units are used to dissipate heat from the heat dissipation medium.

[0005] The heat dissipation module provided in this application includes a circulation loop that guides the flow of a heat dissipation medium, enabling the medium to rapidly transfer heat from one location to another along the loop. Specifically, the circulation loop includes at least two heat exchange units, which exchange heat with electronic devices, transferring the heat generated by the electronic devices to the heat dissipation medium in the circulation loop to reduce heat accumulation at the electronic devices. The at least two heat exchange units are connected in series in the circulation loop, meaning the heat dissipation medium flows sequentially through each heat exchange unit to remove heat from each unit. Furthermore, the circulation loop also includes a heat dissipation component, which includes heat dissipation units. These units transfer heat from the heat dissipation medium to the outside, cooling the medium and ensuring continuous heat absorption within the circulation loop. Specifically, the heat dissipation component includes at least two heat dissipation units, which, along with at least two heat exchange units, are alternately arranged along the flow direction of the heat dissipation medium. That is, a heat dissipation unit is placed after each heat exchange unit. When the heat dissipation medium absorbs heat from the heat exchange unit and heats up, it continues to flow and encounters a heat dissipation unit, which cools the medium. This ensures that the medium is at a lower temperature when it flows through the next heat exchange unit, allowing it to absorb heat more effectively. This cycle continues, resulting in a small temperature difference between each heat exchange unit and relatively balanced heat dissipation efficiency, facilitating standardization. The heat dissipation medium receives good heat dissipation after flowing through each heat exchange unit, reducing the possibility of poor subsequent heat exchange efficiency due to excessively high medium temperature. Furthermore, the heat dissipation medium is dissipated quickly, with minimal temperature difference as it flows through each heat exchange unit, thus eliminating the need for redundant design and reducing costs. Compared to related technologies where the heat dissipation medium reaches a higher temperature when flowing through the next heat exchange unit, requiring redundant heat dissipation design, the heat dissipation scheme of this application can effectively dissipate heat from the electronic equipment at each heat exchange unit sequentially, without requiring redundant design, resulting in lower costs and a more uniform temperature across each heat exchange unit.

[0006] In one possible implementation of this application, at least two heat dissipation units are configured within a heat dissipation space, and at least two heat exchange units are configured within a heat exchange space, wherein the heat dissipation space and the heat exchange space do not overlap. This configuration ensures that the spaces containing the heat dissipation units and the spaces containing the heat exchange units are independent of each other, preventing the heat dissipation units from affecting the heat exchange units, and the relatively concentrated heat dissipation units facilitate maintenance.

[0007] In one possible implementation of this application, at least two heat dissipation units are arranged in parallel directions, and the heat dissipation medium in each heat dissipation unit flows along the corresponding extension direction. Arranging the heat dissipation units in the same direction facilitates the arrangement of multiple heat dissipation units, thereby reducing the space occupied.

[0008] In one possible implementation of this application, at least two heat dissipation units are stacked along a preset direction, which is perpendicular to the extension direction within the heat dissipation unit. The heat dissipation units are stacked to avoid multiple heat dissipation units being piled up, ensuring that the heat dissipation conditions of each heat dissipation unit are similar and the difference in heat dissipation capacity is small.

[0009] In one possible implementation of this application, the heat dissipation unit includes two connection ports, which are respectively connected to two corresponding heat exchange units, and the two connection ports are disposed at both ends of the heat dissipation unit along its extension direction. By distributing the two connection ports at both ends of the heat dissipation unit, compared to distributing them at the same end, the heat dissipation medium in the heat dissipation unit flows in a single direction, resulting in better heat dissipation and less friction loss during flow.

[0010] In one possible implementation of this application, the two connection ports of the heat dissipation unit are a first port and a second port, respectively. The first ports of at least two heat dissipation units are located in a first space, and the second ports of at least two heat dissipation units are located in a second space. The first space and the second space do not overlap. The heat exchange unit is connected to either the two first ports or the two second ports. This arrangement allows the heat exchange units to be connected to the same side of the heat dissipation assembly, facilitating the arrangement of pipes between the heat exchange units and the heat dissipation assembly, avoiding pipe overlap between multiple heat exchange units, resulting in neater piping and easier maintenance.

[0011] In one possible implementation of this application, the heat dissipation unit includes at least two heat dissipation pipes, within which a heat dissipation medium flows. The heat dissipation unit has multiple heat dissipation pipes, increasing the contact area between the heat dissipation medium and the heat dissipation unit, effectively improving the heat exchange efficiency between the two.

[0012] In one possible implementation of this application, a heat dissipation channel is formed between two adjacent heat dissipation pipes. The heat dissipation channel is filled with heat dissipation filler, or it is used for ventilation and heat dissipation. The formation of a heat dissipation channel between the heat dissipation pipes increases the contact area between the heat dissipation unit and the outside environment, thereby improving heat dissipation efficiency.

[0013] In one possible implementation of this application, the heat dissipation unit has a first connecting portion and a second connecting portion at both ends. The first ends of at least two heat dissipation pipes are connected to the first connecting portion, and the second ends of each heat dissipation pipe are connected to the second connecting portion. The first and second connecting portions are respectively connected to corresponding heat exchange units. By providing the connecting portions, the heat dissipation medium in the multiple heat dissipation pipes is converged, facilitating pipe connections between the heat exchange units and the heat dissipation unit.

[0014] Secondly, embodiments of this application provide a data center, including electronic devices and a heat dissipation module as described in the first aspect, the heat dissipation module being used for heat dissipation of the electronic devices.

[0015] The data center provided in this application embodiment, since it includes the heat dissipation module of the first aspect, has the same technical effect, that is, it can effectively dissipate heat from the electronic devices at each heat exchange unit in sequence, without the need for redundant design, with low cost, and the temperature of each heat exchange unit is relatively uniform. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the heat dissipation module in related technologies;

[0017] Figure 2 This is a schematic diagram of the heat dissipation module provided in the embodiments of this application;

[0018] Figure 3 A schematic diagram (isometric view) of the heat dissipation module provided in the embodiments of this application;

[0019] Figure 4 A schematic diagram (top view) of the heat dissipation module provided in an embodiment of this application;

[0020] Figure 5 A schematic diagram (axonometric view) of the heat dissipation component in the heat dissipation module provided in the embodiments of this application;

[0021] Figure 6 A schematic diagram (front view) of the heat dissipation component in the heat dissipation module provided in the embodiments of this application;

[0022] Figure 7 A top view of the structure of the heat dissipation component in the heat dissipation module provided in the embodiments of this application;

[0023] Figure 8 This is a schematic diagram of the structure of the heat dissipation filler in the heat dissipation module provided in the embodiments of this application;

[0024] Figure 9 for Figure 7 A schematic diagram of the cross-sectional structure along the middle AA.

[0025] Figure label:

[0026] 1-Heat exchange unit; 1a-First heat exchange unit; 1b-Second heat exchange unit; 2-Heat dissipation assembly; 21-Heat dissipation unit; 21a-First heat dissipation unit; 21a1-First heat dissipation pipe; 21b-Second heat dissipation unit; 21b1-Second heat dissipation pipe; 211-Connection port; 2111-First port; 2112-Second port; 212-Heat dissipation channel; 213-Heat dissipation filler; 22-Shell; 221-First chamber; 222-Second chamber; 223-First partition plate; 224-Third chamber; 225-Fourth chamber; 226-Second partition plate; 23-Connecting part; 24-Avoidance part; 3-First high-temperature drainage pipe; 4-First low-temperature drainage pipe; 5-Second high-temperature drainage pipe; 6-Second low-temperature drainage pipe. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the specific technical solutions of this application will be further described in detail below with reference to the accompanying drawings of the embodiments of this application. The following embodiments are used to illustrate this application, but are not intended to limit the scope of this application.

[0028] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0029] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0030] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0031] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0032] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0033] This application provides a data center, which is a globally collaborative network of specific devices used to transmit, accelerate, display, compute, and store data information over internet infrastructure. Data centers typically house a large number of servers to provide applications for processing business and operational organizational data.

[0034] Specifically, the data center provided in this application includes electronic devices and a heat dissipation module. The heat dissipation module is used to dissipate heat and cool down the electronic devices. The electronic devices can be servers, switches, memory, power supplies, etc. This application does not limit them. These electronic devices generate heat during operation. The accumulation of heat will cause the operating environment of the electronic devices to rise steadily, affecting the normal operation of the electronic devices. Therefore, it is necessary to cool down the electronic devices. The heat dissipation module is used to cool down the electronic devices so that the electronic devices can work in a suitable ambient temperature.

[0035] Reference Figure 1 This is a schematic diagram of the principle of a heat dissipation module in related technologies. The arrows indicate the flow direction of the heat dissipation medium. It includes two heat exchange units 1 and one heat dissipation component 2. The heat dissipation medium flows through the two heat exchange units 1 in sequence and is then cooled by the heat dissipation component 2. With this configuration, when the heat dissipation medium flows through the first heat exchange unit 1, the temperature will rise, thereby affecting the heat dissipation of the second heat dissipation unit 21.

[0036] Therefore, embodiments of this application also provide a heat dissipation module, referring to... Figure 2 , Figure 3 and Figure 4 The heat dissipation module of this application includes a circulation loop, which is used to guide the flow of the heat dissipation medium, wherein Figure 2The arrows in the diagram indicate the flow direction of the heat dissipation medium. The circulation loop includes at least two heat exchange units 1 and a heat dissipation component 2. The at least two heat exchange units 1 are connected in series in the circulation loop. The heat exchange units 1 are used to exchange heat with electronic devices. The heat dissipation component 2 includes at least two heat dissipation units 21. The at least two heat dissipation units 21 and the at least two heat exchange units 1 are arranged alternately along the flow direction of the heat dissipation medium. That is, a heat dissipation unit 21 is arranged between two adjacent heat exchange units 1. The heat dissipation unit 21 is used to dissipate heat from the heat dissipation medium.

[0037] The heat dissipation module provided in this application includes a circulation loop, which can guide the flow of heat dissipation medium so that the heat dissipation medium can quickly transfer heat from one location to another along the circulation loop.

[0038] Specifically, the circulation loop includes at least two heat exchange units 1. The heat exchange units 1 are used to exchange heat with the electronic device, thereby exchanging the heat generated by the electronic device to the heat dissipation medium in the circulation loop to reduce the heat accumulation at the electronic device. The at least two heat exchange units 1 are arranged in series in the circulation loop, that is, the heat dissipation medium in the circulation loop will flow through each heat exchange unit 1 in sequence to remove the heat at each heat exchange unit 1.

[0039] Based on this, the circulation loop also includes a heat dissipation component 2, which includes a heat dissipation unit 21. The heat dissipation unit 21 can transfer the heat in the heat dissipation medium to the outside, thereby dissipating and cooling the heat dissipation medium, so that the heat dissipation medium can continuously absorb heat in the circulation loop.

[0040] Specifically, the heat dissipation component 2 includes at least two heat dissipation units 21. The at least two heat dissipation units 21 and at least two heat exchange units 1 are alternately arranged along the flow direction of the heat dissipation medium. That is, a heat dissipation unit 21 is arranged after each heat exchange unit 1. When the heat dissipation medium absorbs heat from the heat exchange unit 1 and becomes hot, it will continue to flow and encounter the heat dissipation unit 21. The heat dissipation unit 21 cools down the heat dissipation medium so that the temperature of the heat dissipation medium is lower when it flows through the next heat exchange unit 1, and it can better absorb the heat at the next heat exchange unit 1. This cycle continues, and the temperature difference of each heat exchange unit 1 is small, the heat dissipation efficiency is relatively balanced, and it is easy to standardize.

[0041] The heat dissipation medium can achieve good heat dissipation after flowing through each heat exchange unit 1, reducing the possibility of poor subsequent heat exchange efficiency due to excessively high temperature of the heat dissipation medium. Moreover, the heat dissipation medium can be dissipated in time, and the temperature difference when it flows through each heat exchange unit 1 is small. Therefore, there is no need for redundant design, which can reduce costs.

[0042] Compared with related technologies, where the temperature of the heat dissipation medium is high when it flows through the next heat exchange unit 1, requiring redundant heat dissipation design, the heat dissipation solution of this application can effectively dissipate heat from the electronic equipment at each heat exchange unit 1 in sequence, without the need for redundant design, resulting in lower cost and more uniform temperature in each heat exchange unit 1.

[0043] The heat dissipation medium can be a liquid or a gaseous medium, and can be water, oil, or fluorinated liquid, etc. It can have insulating or antifreezing properties. This application does not limit this, as long as it ensures that the heat dissipation medium can flow in the circulation loop and transfer heat.

[0044] It should be noted that the heat exchange unit 1 can exchange heat with the electronic device as a whole, or the heat exchange unit 1 can exchange heat with a heat-generating component on the electronic device, such as a central processing unit (CPU), hard disk, power supply unit (PSU), etc. This application does not limit this.

[0045] Among them, there are at least two heat exchange units 1, and there can be two, three or more heat exchange units 1. Correspondingly, there are at least two heat dissipation units 21 of the heat dissipation component 2, and there can be two, three or more heat dissipation units 21. It is only necessary to ensure that the heat exchange units 1 and the heat dissipation units 21 correspond one-to-one.

[0046] Reference Figure 3 and Figure 4 In one possible embodiment of this application, there are two heat exchange units 1, each of which dissipates heat for one CPU. The two heat exchange units 1 are a first heat exchange unit 1a and a second heat exchange unit 1b, respectively. Correspondingly, the heat dissipation assembly 2 includes two heat dissipation units 21, which are a first heat dissipation unit 21a and a second heat dissipation unit 21b, respectively. The first heat exchange unit 1a and the first heat dissipation unit 21a are connected by a first high-temperature drainage pipe 3, the first heat dissipation unit 21a and the second heat exchange unit 1b are connected by a second low-temperature drainage pipe 6, the second heat exchange unit 1b and the second heat dissipation unit 21b are connected by a second high-temperature drainage pipe 5, and the second heat dissipation unit 21b and the first heat exchange unit 1a are connected by a first low-temperature drainage pipe 4, thereby forming a loop.

[0047] Specifically, the heat dissipation medium in the first low-temperature drainage pipe 4 has a low temperature. When the heat dissipation medium flows through the first heat exchange unit 1a along the first low-temperature drainage pipe 4, it absorbs the heat from the corresponding CPU through the first heat exchange unit 1a, thus increasing its temperature. The heat dissipation medium in the first high-temperature drainage pipe 3 has a high temperature. When the heat dissipation medium flows through the first heat dissipation unit 21a along the first high-temperature drainage pipe 3, the first heat dissipation unit 21a cools the heat dissipation medium, thus decreasing its temperature, making the temperature of the heat dissipation medium in the second low-temperature drainage pipe 6 similar to that in the first low-temperature drainage pipe 4. When the heat dissipation medium flows through the second heat exchange unit 1b along the second low-temperature drainage pipe 6, it absorbs the heat from the corresponding CPU through the second heat exchange unit 1b, thus increasing its temperature. The heat dissipation medium in the second high-temperature drainage pipe 5 has a high temperature. When the heat dissipation medium flows through the second heat dissipation unit 21b along the second high-temperature drainage pipe 5, the second heat dissipation unit 21b cools the heat dissipation medium, thus decreasing its temperature, making the temperature of the heat dissipation medium in the first low-temperature drainage pipe 4 similar to that in the second low-temperature drainage pipe 6.

[0048] Among them, heat exchange unit 1 can be a thermally conductive copper plate or other device with good thermal conductivity, and heat dissipation unit 21 can be a heat dissipation fin, a heat dissipation fan or the like. This application does not limit this. It should be noted that the performance parameters of the first heat exchange unit 1a and the second heat exchange unit 1b can be the same or different, and the performance parameters of the first heat dissipation unit 21a and the second heat dissipation unit 21b can be the same or different. It is only necessary to ensure that the performance of the first heat exchange unit 1a and the first heat dissipation unit 21a is compatible, so that the temperature of the heat dissipation medium in the first low temperature drainage pipe 4 and the second low temperature drainage pipe 6 is similar.

[0049] In addition, in order to drive the heat dissipation medium to flow in the circulation loop, the circulation loop also includes a driving component. The driving component can be a pump body, and the driving component can be set at the heat exchange unit 1, the heat dissipation unit 21, or the driving component can be set on the pipe. There can be one, two or more driving components. When two or more driving components are used, each driving component should ensure that the heat dissipation medium flows in one direction in the circulation loop.

[0050] To avoid the heat from heat exchange unit 1 affecting heat dissipation unit 21, optionally, in one possible embodiment of this application, at least two heat dissipation units 21 are configured in a heat dissipation space, and at least two heat exchange units 1 are configured in a heat exchange space. The heat dissipation space and the heat exchange space do not overlap. With this configuration, the heat dissipation space and the heat exchange space are independent of each other. The heat from heat exchange unit 1 in the heat exchange space is unlikely to affect heat dissipation unit 21, so that heat dissipation unit 21 in the heat dissipation space can transfer heat to the outside more efficiently, thereby achieving cooling of the heat dissipation medium.

[0051] For example, electronic equipment is installed in a cabinet, heat exchange unit 1 is also configured inside the cabinet, while heat dissipation unit 21 is configured outside the cabinet. The cabinet isolates the heat exchange space where heat exchange unit 1 is located from the heat dissipation space where heat dissipation unit 21 is located.

[0052] It should be noted that at least two heat dissipation units 21 can be centrally located or distributed. Centrally located heat dissipation units 21 are easier to manage and maintain, and facilitate pipe layout. Distributed heat dissipation units 21 have less mutual interference and higher heat dissipation efficiency. (Refer to...) Figure 3 and Figure 5 In one possible implementation of this application, at least two heat dissipation units 21 are centrally located.

[0053] Specifically, the heat dissipation assembly 2 includes a housing 22, and at least two heat dissipation units 21 are disposed in the housing 22. The at least two heat dissipation units 21 can extend in the same direction or in different directions in the housing 22.

[0054] To save space, refer to Figure 5 In one possible embodiment of this application, at least two heat dissipation units 21 are arranged in parallel directions, which makes it easier to stack multiple heat dissipation units 21 and requires less space, which is beneficial to the miniaturization of the heat dissipation component 2.

[0055] In this process, the heat dissipation medium in the heat dissipation unit 21 flows along the extension direction of the corresponding heat dissipation unit 21. It should be noted that the heat dissipation medium in different heat dissipation units 21 can flow in the same direction or in opposite directions. This application does not limit this. For the convenience of pipe arrangement, the heat dissipation medium in the first heat dissipation unit 21a and the second heat dissipation unit 21b can flow in opposite directions.

[0056] It should be noted that there are multiple possible arrangements of at least two heat dissipation units 21 in the housing 22. For example, at least two heat dissipation units 21 may be arranged sequentially along their extension direction; for another example, at least two heat dissipation units 21 may be arranged in a ring array; for yet another example, at least two heat dissipation units 21 may be arranged in a square array. This application does not limit these arrangements.

[0057] In order to ensure that the heat dissipation capacity of each heat dissipation unit 21 is balanced, refer to Figure 5 In one possible embodiment of this application, at least two heat dissipation units 21 are stacked along a preset direction, which is perpendicular to the extension direction of the heat dissipation unit 21. The stacking of at least two heat dissipation units 21 allows each heat dissipation unit 21 to directly contact the outside world, rather than indirectly contacting the outside world through adjacent heat dissipation units 21, thereby making the heat dissipation conditions of each heat dissipation unit 21 more balanced.

[0058] To facilitate communication between the heat dissipation unit 21 and the heat exchange unit 1, refer to Figure 6 In one possible embodiment of this application, the heat dissipation unit 21 includes two connection ports 211, which are respectively connected to two corresponding heat exchange units 1. For example, one connection port 211 of the first heat dissipation unit 21a is connected to the first heat exchange unit 1a through the first high temperature drainage pipe 3, and the other connection port 211 of the first heat dissipation unit 21a is connected to the second heat exchange unit 1b through the second cold water unit.

[0059] The two connection ports 211 can be located at the same end or different ends of the heat dissipation unit 21. For example, the two connection ports 211 can be located at both ends of the heat dissipation unit 21 along the extension direction of the heat dissipation unit 21. With this arrangement, the heat dissipation medium in the heat dissipation pipe flows from one end to the other end, and the temperature gradually decreases, which is more conducive to heat dissipation.

[0060] Based on this, since the extension directions of at least two heat dissipation units 21 are parallel, and the two connection ports 211 of the heat dissipation unit 21 are respectively located at both ends of the heat dissipation unit 21, one connection port 211 of the heat dissipation unit 21 is located at the first end of the housing 22, and the other connection port 211 is located at the second end of the housing 22. The heat exchange unit 1 connects the two heat dissipation units 21, so the connection ports 211 of the two heat dissipation units 21 connected to the heat exchange unit 1 can be located at the same end of the housing 22 or at different ends of the housing 22.

[0061] For ease of pipe laying, refer to Figure 6 In one possible embodiment of this application, the two connection ports 211 of the heat dissipation unit 21 are respectively the first port 2111 and the second port 2112. The first ports 2111 of at least two heat dissipation units 21 are located in the first space, that is, the first port 2111 is located at the first end of the housing 22. The second ports 2112 of at least two heat dissipation units 21 are located in the second space, that is, the second ports 2112 are located at the second end of the housing 22. The first space and the second space do not overlap. The heat exchange unit 1 is connected to the two first ports 2111, or the heat exchange unit 1 is connected to the two second ports 2112, that is, the two connection ports 211 connected to the heat exchange unit 1 are located on the same side of the housing 22.

[0062] To improve heat dissipation efficiency, refer to Figure 5 and Figure 6In one possible embodiment of this application, the heat dissipation unit 21 includes at least two heat dissipation pipes, namely, the first heat dissipation unit 21a includes two first heat dissipation pipes 21a1, and the second heat dissipation unit 21b includes two second heat dissipation pipes 21b1. The heat dissipation medium flows in the heat dissipation pipes. Since multiple heat dissipation pipes are provided, the contact area between the heat dissipation medium and the heat dissipation unit 21 is increased, which is conducive to heat transfer between the two and thus improves the heat dissipation efficiency.

[0063] The radial cross-sectional shape of the heat dissipation pipe can be varied. For example, the radial cross-section of the heat dissipation pipe can be circular; or it can be square. Alternatively, the radial cross-section of the heat dissipation pipe can be elongated, i.e., the heat dissipation pipe can be flattened, which can reduce the space occupied along the stacking direction when the heat dissipation pipes are stacked.

[0064] To facilitate the dissipation of heat to the outside through the heat dissipation pipes, refer to... Figure 6 and Figure 9 In one possible embodiment of this application, a heat dissipation channel 212 is formed between two adjacent heat dissipation pipes. The heat dissipation channel 212 is used for ventilation and heat dissipation. For example, a fan is installed at the heat dissipation pipe so that the airflow generated by the fan flows in the heat dissipation channel 212 to improve the heat exchange efficiency between the heat dissipation channel 212 and the outside world.

[0065] Reference Figure 8 The heat dissipation channel 212 is filled with heat dissipation filler 213, which can absorb heat evenly, thereby making the heat in the heat dissipation pipe more uniform and avoiding heat concentration, which would affect the local heat dissipation efficiency.

[0066] To facilitate pipe layout and enable at least two heat dissipation pipes of the same heat dissipation unit 21 to be connected to the same drainage pipe, optionally, in one possible embodiment of this application, the two ends of the heat dissipation unit 21 are respectively provided with a first connecting part and a second connecting part, the first ends of the at least two heat dissipation pipes of the same heat dissipation unit 21 are all connected to the first connecting part, the second ends of the at least two heat dissipation pipes of the same heat dissipation unit 21 are all connected to the second connecting part, and the first connecting part and the second connecting part are respectively connected to the corresponding heat exchange unit 1.

[0067] Reference Figure 7 and Figure 9The first end of the housing 22 is provided with a first chamber 221 and a second chamber 222, which are separated by a first partition plate 223. The second end of the housing 22 is provided with a third chamber 224 and a fourth chamber 225, which are separated by a second partition plate 226. The first chamber 221 is the first connecting part of the first heat dissipation unit 21a, and the third chamber 224 is the second connecting part of the first heat dissipation unit 21a. The first ends of the two first heat dissipation pipes 21a1 included in the first heat dissipation unit 21a are all connected to the first chamber 221, and the second ends of the two first heat dissipation pipes 21a1 are all connected to the second chamber 222. In addition, the first chamber 221 is connected to the first heat exchange unit 1a through the first high temperature drainage pipe 3, and the third chamber 224 is connected to the second heat exchange unit 1b through the second low temperature drainage pipe 6.

[0068] Correspondingly, the second chamber 222 is the first connecting part of the second heat dissipation unit 21b, and the fourth chamber 225 is the second connecting part of the second heat dissipation unit 21b. The first ends of the two second heat dissipation pipes 21b1 included in the second heat dissipation unit 21b are all connected to the second chamber 222, and the second ends of the two second heat dissipation pipes 21b1 are all connected to the fourth chamber 225. In addition, the second chamber 222 is connected to the first heat exchange unit 1a through the second low temperature drainage pipe 6, and the fourth chamber 225 is connected to the second heat exchange unit 1b through the second high temperature drainage pipe 5.

[0069] In addition, to facilitate the installation of heat dissipation component 2, refer to Figure 5 , Figure 7 and Figure 8 The heat dissipation component 2 is also provided with a connecting part 23, which can be a buckle, a connecting hole, etc.; and the heat dissipation component 2 may also be provided with a relief part 24, such as a bend in the middle of the housing 22, etc., which is not limited in this application.

[0070] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A data center, comprising: Server rack; Electronic equipment is installed in the cabinet; A heat dissipation module for the electronic device, the heat dissipation module comprising: A circulation loop for guiding the flow of the heat dissipation medium, the circulation loop comprising: At least two heat exchange units are connected in series in the circulation loop, and the heat exchange units are used to exchange heat with electronic equipment. A heat dissipation assembly includes at least two heat dissipation units, wherein the at least two heat dissipation units and at least two heat exchange units are alternately arranged along the flow direction of the heat dissipation medium, and the heat dissipation units are used to dissipate heat from the heat dissipation medium. At least two of the heat dissipation units are configured in a heat dissipation space and located outside the cabinet, and at least two of the heat exchange units are configured in a heat exchange space and located inside the cabinet. The heat dissipation space and the heat exchange space do not overlap.

2. The data center according to claim 1, wherein at least two of the heat dissipation units are arranged in parallel directions, and the heat dissipation medium in the heat dissipation unit flows along the extension direction of the corresponding heat dissipation unit.

3. The data center according to claim 2, wherein at least two of the heat dissipation units are stacked along a preset direction, the preset direction being perpendicular to the extension direction within the heat dissipation unit.

4. The data center according to claim 2, wherein the heat dissipation unit includes two connection ports, the two connection ports are respectively connected to two corresponding heat exchange units, and the two connection ports are disposed at both ends of the heat dissipation unit along the extension direction of the heat dissipation unit.

5. The data center according to claim 4, wherein the two connection ports of the heat dissipation unit are a first port and a second port, the first ports of at least two heat dissipation units are located in a first space, the second ports of at least two heat dissipation units are located in a second space, the first space and the second space do not overlap, and the heat exchange unit is connected to the two first ports, or the heat exchange unit is connected to the two second ports.

6. The data center according to any one of claims 1 to 5, wherein the heat dissipation unit comprises at least two heat dissipation pipes, and the heat dissipation medium flows within the heat dissipation pipes.

7. In the data center according to claim 6, a heat dissipation channel is formed between two adjacent heat dissipation pipes, the heat dissipation channel is filled with heat dissipation filler, or the heat dissipation channel is used for ventilation and heat dissipation.

8. The data center according to claim 6, wherein the heat dissipation unit is provided with a first connecting portion and a second connecting portion at both ends, the first ends of at least two heat dissipation pipes are all connected to the first connecting portion, the second ends of the heat dissipation pipes are all connected to the second connecting portion, and the first connecting portion and the second connecting portion are respectively connected to the corresponding heat exchange unit.

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