Light-emitting substrate, backlight module and display device

Abstract

A light emitting substrate includes a light emitting region and a test region located at least one side of the light emitting region. The light emitting substrate includes a plurality of light emitting device groups, a plurality of driving circuits, a power line, a first test pad, a second test pad, and a first test device group. The plurality of light emitting device groups and the plurality of driving circuits are disposed in the light emitting region, and each driving circuit is electrically connected with at least one light emitting device group. The plurality of driving circuits includes a selected driving circuit, and the selected driving circuit includes at least one first type output terminal and at least one second type output terminal, and the first type output terminal is electrically connected with the light emitting device group. The power line is electrically connected with the plurality of light emitting device groups. The first test pad and the second test pad are disposed in the test region, the first test pad is electrically connected with the second type output terminal of the selected driving circuit, and the second test pad is electrically connected with the power line. The first test device group is electrically connected with the first test pad and the second test pad.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a light-emitting substrate, a backlight module, and a display device. Background Technology

[0002] Currently, the fabrication of micro light-emitting diode (Micro LED) display devices faces significant challenges due to the complexity of the mass transfer process.

[0003] Mini LED (Mini Light-Emitting Diode) displays are considered a transitional product to Micro LED displays. With their superior display quality, thinness, high contrast, and long lifespan, Mini LED displays have attracted widespread attention and research.

[0004] Public content

[0005] On one hand, a light-emitting substrate is provided. The light-emitting substrate includes a light-emitting area and a test area located on at least one side of the light-emitting area. The light-emitting substrate includes multiple light-emitting device groups, multiple driving circuits, a power line, a first test pad, a second test pad, and a first test device group. The multiple light-emitting device groups and multiple driving circuits are disposed in the light-emitting area, and each driving circuit is electrically connected to at least one light-emitting device group. The multiple driving circuits include a selected driving circuit, which includes at least one first type output terminal and at least one second type output terminal, the first type output terminal being electrically connected to the light-emitting device group. The power line is electrically connected to the multiple light-emitting device groups. The first test pad and the second test pad are disposed in the test area, the first test pad being electrically connected to the second type output terminal of the selected driving circuit, and the second test pad being electrically connected to the power line. The first test device group is electrically connected to the first test pad and the second test pad.

[0006] In some embodiments, the plurality of light-emitting device groups and the plurality of driving circuits are arranged in multiple rows, with each row of light-emitting device groups and each row of driving circuits arranged along a first direction. The light-emitting substrate further includes a bonding area, and the bonding area and the test area are respectively located on opposite sides of the light-emitting area along a second direction.

[0007] Along the second direction, pointing from the test area to the bonding area, the multiple rows of light-emitting device groups are respectively row 1 to row M, and the multiple rows of driving circuits are respectively row 1 to row N, where M and N are integers greater than or equal to 2. The row 1 light-emitting device group is electrically connected to the row 1 driving circuit, and the row 1 driving circuit includes the selected driving circuit.

[0008] In some embodiments, the selected driving circuit includes two first-type output terminals and two second-type output terminals. The two first-type output terminals are electrically connected to two adjacent light-emitting device groups in the first row of light-emitting device groups, and either of the two second-type output terminals is electrically connected to the first test pad.

[0009] In some embodiments, the light-emitting device groups in rows 2 to M include multiple device units, each device unit including two adjacent rows of light-emitting device groups, and the device unit is electrically connected to one row of the driving circuit in rows 2 to N. The driving circuit includes four output terminals, which are electrically connected to four light-emitting device groups in the device unit, respectively.

[0010] In some embodiments, the power line includes a first sub-power line and a plurality of second sub-power lines. The first sub-power line extends along a first direction and is disposed on the side of the light-emitting area near the test area. The plurality of second sub-power lines extend along a second direction and are electrically connected to the first sub-power line.

[0011] The light-emitting substrate further includes a bonding area. The test area and the bonding area are located on opposite sides of the light-emitting area along a second direction. The first sub-power line is electrically connected to one end of the plurality of second sub-power lines near the test area. The second test pad is electrically connected to the first sub-power line.

[0012] In some embodiments, the light-emitting substrate further includes a first connecting line and a second connecting line. One end of the first connecting line is electrically connected to the first test pad, and the other end is electrically connected to the selected driving circuit. One end of the second connecting line is electrically connected to the second test pad, and the other end is electrically connected to the first sub-power line.

[0013] In some embodiments, the light-emitting substrate includes a substrate, and a first conductive layer and a second conductive layer sequentially stacked on the substrate. The first conductive layer includes a first sub-ground line extending along a first direction, the first sub-ground line being located on the side of the light-emitting area closer to the test area, and the first sub-power line and the first test pad being located on the second conductive layer.

[0014] The selected drive circuit is located on the side of the first sub-ground line and the first sub-power line away from the first test pad. The first connection line includes at least one first connection segment located on the first conductive layer and at least one second connection segment located on the second conductive layer. The orthographic projection of the first connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-power line on the substrate, and the orthographic projection of the second connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-ground line on the substrate. Of the at least one first connection segment and the at least one second connection segment, the connection segment closest to the first test pad is the second connection segment, and the first test pad is electrically connected to the closest second connection segment.

[0015] In some embodiments, the second connecting line extends generally along the second direction, and the second connecting line and the first sub-power line are made of the same material and are disposed in the same layer.

[0016] In some embodiments, the first test device group includes test light-emitting devices and / or resistors.

[0017] In some embodiments, the first test device group includes a test light-emitting device and a resistor. The light-emitting substrate further includes a third test pad, one end of the test light-emitting device being electrically connected to the first test pad and the other end being electrically connected to the third test pad. One end of the resistor is electrically connected to the second test pad and the other end is electrically connected to the third test pad.

[0018] In some embodiments, the light-emitting device group includes a plurality of light-emitting devices and a plurality of traces, wherein the plurality of light-emitting devices are connected in series through the plurality of traces. The light-emitting substrate further includes a fourth test pad, a fifth test pad, and a second test device group. The fourth and fifth test pads are disposed in the test area. The fourth and fifth test pads are each electrically connected to the same trace. A portion of the trace between the location where the fourth test pad is electrically connected to the trace and the location where the fifth test pad is electrically connected to the trace is disconnected. The second test device group is electrically connected to the fourth and fifth test pads.

[0019] In some embodiments, the light-emitting substrate further includes a bonding region, and the test region and the bonding region are located on opposite sides of the light-emitting region along a second direction. The plurality of light-emitting device groups are arranged in multiple rows, with each row of light-emitting device groups arranged along a first direction. Along the second direction and pointing from the test region to the bonding region, the multiple rows of light-emitting device groups are designated as rows 1 to M. The fourth test pad and the fifth test pad are both electrically connected to any trace in the first row of light-emitting device groups.

[0020] In some embodiments, the light-emitting substrate further includes two third connecting lines, one end of which is electrically connected to the fourth test pad and the other end of which is electrically connected to the trace. The other third connecting line is electrically connected to the fifth test pad and the other end of which is electrically connected to the trace.

[0021] In some embodiments, the light-emitting substrate includes a first conductive layer and a second conductive layer stacked sequentially. The first conductive layer includes a first sub-ground line extending along a first direction, and the second conductive layer includes a first sub-power line extending along the first direction. The fourth test pad and the fifth test pad are located on the second conductive layer.

[0022] The fourth and fifth test pads are both located on the side of the first sub-ground line and the first sub-power line away from the trace. The third connection line includes at least one third connection segment located on the first conductive layer and at least one fourth connection segment located on the second conductive layer. The orthographic projection of the third connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-power line on the substrate, and the orthographic projection of the fourth connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-ground line on the substrate.

[0023] In one third connection line, among at least one third connection segment and at least one fourth connection segment, the connection segment closest to the fourth test pad is the fourth connection segment, and the fourth test pad is electrically connected to the closest fourth connection segment. In another third connection line, among at least one third connection segment and at least one fourth connection segment, the connection segment closest to the fifth test pad is the fourth connection segment, and the fifth test pad is electrically connected to the closest fourth connection segment.

[0024] In some embodiments, the light-emitting substrate further includes at least one input signal line, a ground line, at least one sixth test pad, and at least one test point. The at least one input signal line extends along a second direction and is electrically connected to the plurality of driving circuits. The ground line is electrically connected to the plurality of driving circuits. At least one sixth test pad is disposed in the test area, and each sixth test pad is electrically connected to one input signal line. At least one test point is disposed in the light-emitting area and is electrically connected to the ground line.

[0025] In some embodiments, the light-emitting substrate further includes a bonding region, the bonding region and the test region being located on opposite sides of the light-emitting region along a second direction. The light-emitting substrate also includes a signal connection line, one end of which is electrically connected to the sixth test pad, and the other end of which is electrically connected to the end of the input signal line near the test region.

[0026] In some embodiments, the light-emitting substrate includes a first conductive layer and a second conductive layer stacked sequentially, the first conductive layer including a first sub-ground line extending along a first direction, the second conductive layer including a first sub-power line extending along the first direction, and the sixth test pad located on the second conductive layer.

[0027] The selected driving circuit is located on the side of the first sub-ground line and the first sub-power line away from the sixth test pad. The signal connection line includes at least one fifth connection segment located on the first conductive layer and at least one sixth connection segment located on the second conductive layer. The orthographic projection of the fifth connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-power line on the substrate, and the orthographic projection of the sixth connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-ground line on the substrate. Of the at least one fifth connection segment and the at least one sixth connection segment, the connection segment closest to the sixth test pad is the sixth connection segment, and the sixth test pad is electrically connected to the nearest sixth connection segment.

[0028] In some embodiments, the at least one input signal line includes at least one of a power supply voltage signal line, a clock signal line, and a data signal line.

[0029] In some embodiments, the light-emitting substrate further includes multiple cascaded signal lines and multiple seventh test pads, with two adjacent driving circuits along a first direction and / or two adjacent driving circuits along a second direction electrically connected via the cascaded signal lines. Multiple seventh test pads are disposed in the test area, and each seventh test pad is electrically connected to one cascaded signal line.

[0030] In some embodiments, the grounding wire includes a first sub-grounding wire and a plurality of second sub-grounding wires. The first sub-grounding wire extends along a first direction and is disposed on the side of the light-emitting area near the test area. The plurality of second sub-grounding wires extend along a second direction and are electrically connected to the first sub-grounding wire.

[0031] The light-emitting substrate further includes a bonding area. The test area and the bonding area are located on opposite sides of the light-emitting area along a second direction. The first sub-grounding wire is electrically connected to one end of the plurality of second sub-grounding wires near the test area. The plurality of test points are electrically connected to the first sub-grounding wire.

[0032] In some embodiments, the light-emitting substrate includes a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer stacked sequentially.

[0033] The first sub-grounding wire is located in the first conductive layer, and the test point is located in the second conductive layer. The test point is electrically connected to the first sub-grounding wire through a via in the first insulating layer. The second insulating layer has a first test hole that exposes the test point. Alternatively, the test point is a second test hole that penetrates both the first and second insulating layers, and the second test hole exposes the first sub-grounding wire.

[0034] In some embodiments, the grounding wire further includes a plurality of connection patterns and a plurality of third sub-grounding wires, each connection pattern electrically connecting two adjacent second sub-grounding wires and electrically connected to the drive circuit. The plurality of third sub-grounding wires extend along a second direction, each third sub-grounding wire being electrically connected to at least one connection pattern, and the end of each third sub-grounding wire near the test area being electrically connected to a first sub-grounding wire.

[0035] In some embodiments, the light-emitting substrate includes a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer stacked sequentially. The power line is located on the second conductive layer, and the second insulating layer has a third test hole exposing the power line. The second conductive layer also includes multiple second sub-grounding lines, and the second insulating layer has a fourth test hole exposing the second sub-grounding lines.

[0036] In some embodiments, the light-emitting substrate includes a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer stacked sequentially. The second conductive layer includes multiple output signal lines and multiple conductive test patterns. Each output signal line is electrically connected to the light-emitting device group and a corresponding driving circuit, and is also electrically connected to a conductive test pattern. The second insulating layer has a fifth test hole that exposes the conductive test pattern.

[0037] On the other hand, a backlight module is provided. The backlight module includes the light-emitting substrate described in any of the above embodiments.

[0038] In another aspect, a display device is provided. The display device includes a display panel and a backlight module as described in the above embodiments, wherein the display panel is disposed on the light-emitting side of the backlight module. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0040] Figure 1 This is a structural diagram of a light-emitting substrate according to some embodiments;

[0041] Figure 2A and Figure 2B for Figure 1 A magnified view of the light-emitting substrate at point A;

[0042] Figure 2C for Figure 2B A partial cross-sectional view of the light-emitting substrate along section line AA';

[0043] Figure 2D for Figure 2B A magnified view of the light-emitting substrate at point D;

[0044] Figure 2E for Figure 2B A magnified view of the light-emitting substrate at point E;

[0045] Figure 3 This is a structural diagram of a drive circuit according to some embodiments;

[0046] Figure 4A and Figure 4B for Figure 1 A magnified view of the light-emitting substrate at point B;

[0047] Figure 4C for Figure 4B A partial cross-sectional view of the light-emitting substrate along section line BB';

[0048] Figure 5A and Figure 5B for Figure 1 A magnified view of the light-emitting substrate at point C;

[0049] Figure 5C and Figure 5D for Figure 5B A partial cross-sectional view of the light-emitting substrate along the section line CC';

[0050] Figure 6 This is a structural diagram of a backlight module according to some embodiments;

[0051] Figure 7A This is a structural diagram of a display device according to some embodiments;

[0052] Figure 7B for Figure 7A A partial cross-sectional view of the display device along section line DD'. Detailed Implementation

[0053] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0054] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0055] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0056] In describing some embodiments, the term "connection" and its derivative expressions may be used. For example, the term "electrical connection" may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.

[0057] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0058] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0059] As used herein, depending on the context, the term “if” may optionally be interpreted as meaning “when”, “in the event of”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if it is determined that…” or “if [the stated condition or event] is detected” may optionally be interpreted as meaning “in the event of determination that…”, “in response to determination that…”, “when [the stated condition or event] is detected”, or “in response to the detection of [the stated condition or event]”.

[0060] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0061] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0062] As used herein, “approximately” includes the values ​​stated and the average value within an acceptable range of deviation from the given values, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0063] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0064] In related technologies, during the fabrication of a light-emitting substrate, it is necessary to detect the current and / or voltage information of the circuits on the substrate to monitor open-circuit or short-circuit conditions. However, due to the large number of light-emitting devices in the substrate, the complex circuit layout, and the limited number of pins on the open-short (OS) test fixture, detecting the current and / or voltage information of the circuits presents a significant challenge. The inability to detect precise current and / or voltage information prevents the supply of appropriate current and voltage ranges to the light-emitting devices in the substrate, thus hindering their normal light emission.

[0065] To solve the above problems, such as Figure 1 As shown, some embodiments of this disclosure provide a light-emitting substrate 100, which includes a light-emitting region A1 and a test region A2 located on at least one side of the light-emitting region A1.

[0066] For example, such as Figure 1 As shown, the light-emitting substrate 100 also includes a bonding region A3, and the bonding region A3 and the test region A2 are located on opposite sides of the light-emitting region A1 along the second direction Y.

[0067] like Figure 1 and Figure 2A As shown, the light-emitting substrate 100 includes a plurality of light-emitting device groups 1 disposed in the light-emitting area A1 and a plurality of driving circuits (e.g., micro integrated circuits) 2. Each driving circuit 2 is electrically connected to at least one light-emitting device group 1 to drive the light-emitting device group 1 to emit light.

[0068] In some examples, each driving circuit 2 is electrically connected to two light-emitting device groups 1. In other examples, each driving circuit 2 is electrically connected to four light-emitting device groups 1. The number of light-emitting device groups 1 electrically connected to each driving circuit 2 will be explained below.

[0069] like Figure 2A and Figure 3 As shown, the plurality of driving circuits 2 include a selected driving circuit 20, which includes at least one first type output terminal 21 and at least one second type output terminal 22. The first type output terminal 21 is electrically connected to the light-emitting device group 1.

[0070] It is understandable that the first type of output terminal 21 of the selected driving circuit 20 is electrically connected to the light-emitting device group 1, and the number of the first type of output terminal 21 is sufficient to meet the number of light-emitting device groups 1 that are electrically connected. The second type of output terminal 22 does not necessarily have to be electrically connected to the light-emitting device group 1.

[0071] Of course, the second type of output terminal 22 of the selected driving circuit 20 can also be electrically connected to the light-emitting device group 1.

[0072] like Figure 2A As shown, the light-emitting substrate 100 also includes a power line 3, which is electrically connected to a plurality of light-emitting device groups 1 to transmit a power supply voltage signal to the light-emitting device groups 1 and provide power for the light emission of the light-emitting device groups 1.

[0073] like Figure 1 and Figure 2AAs shown, the light-emitting substrate 100 also includes a first test pad P1, a second test pad P2 and a first test device group T1 disposed in the test area A2. The first test pad P1 is electrically connected to the second type output terminal 22 of the selected driving circuit 20, the second test pad P2 is electrically connected to the power line 3, and the first test device group T1 is electrically connected to the first test pad P1 and the second test pad P2.

[0074] In the light-emitting substrate 100 of the above embodiments of this disclosure, the plurality of driving circuits 2 include a selected driving circuit 20. The selected driving circuit 20 includes at least one first type output terminal 21 and at least one second type output terminal 22. The first type output terminal 21 is electrically connected to the light-emitting device group 1.

[0075] Based on this, a first test pad P1 and a second test pad P2 are provided in the test area A2 of the light-emitting substrate 100. The first test pad P1 is electrically connected to the second type output terminal 22 of the selected driving circuit 20, and the second test pad P2 is electrically connected to the power line 3. A first test device group T1 is connected between the first test pad P1 and the second test pad P2, forming a series circuit of the selected driving circuit 20, the first test pad P1, the first test device group T1, the second test pad P2 and the power line 3. Electrical signals are transmitted to the circuit on the light-emitting substrate 100 through the pins located in the bonding area, so that the selected driving circuit 20 and the light-emitting device group 1 connected thereto receive electrical signals through the corresponding signal lines. In this case, a test fixture is used to perform a pin piercing test on the first test pad P1 and the second test pad P2, and the current value in the first test device group T1 can be detected, thereby obtaining the current value in the power line 3.

[0076] Furthermore, based on the detected current value in the power line 3 and the design resistance value of the power line 3, the voltage drop (IR-Drop) between the end of the power line 3 near the bonding region A3 and the end far from the bonding region A3 can be calculated. Then, the design resistance value of the power line 3 can be adjusted according to the voltage drop, or the input voltage of the power line 3 can be compensated to ensure the normal light emission of the light-emitting device.

[0077] In addition, in some embodiments, the first test pad P1 and the second test pad P2 may not be connected to the first test device group T1. Instead, a test fixture is used to directly perform a pin piercing test on the first test pad P1 and the second test pad P2, forming a series circuit of the selected drive circuit 20, the first test pad P1, the test fixture, the second test pad P2 and the power line 3. The test fixture is connected to the series circuit as a test device, and the current value passing through it is detected by the test fixture to obtain the current value in the power line 3.

[0078] In some embodiments, such as Figure 2AAs shown, the first test device group T1 includes a test light-emitting device T11 and / or a resistor T12.

[0079] For example, the first test device group T1 includes a test light-emitting device T11, one end of which is electrically connected to the first test pad P1 and the other end is electrically connected to the second test pad P2.

[0080] For example, the first test device group T1 includes a resistor T12, one end of which is electrically connected to the first test pad P1 and the other end of which is electrically connected to the second test pad P2.

[0081] For example, such as Figure 2A As shown, the first test device group T1 includes a test light-emitting device T11 and a resistor T12. In this case, the light-emitting substrate 100 also includes a third test pad P3. One end of the test light-emitting device T11 is electrically connected to the first test pad P1, and the other end is electrically connected to the third test pad P3. One end of the resistor T12 is electrically connected to the second test pad P2, and the other end is electrically connected to the third test pad P3, so as to realize the series connection of the test light-emitting device T11 and the resistor T12.

[0082] In some embodiments, such as Figure 1 As shown, multiple light-emitting device groups 1 are arranged in an array along a first direction X and a second direction Y, and multiple driving circuits 2 are arranged in an array along the first direction X and the second direction Y. The first direction X and the second direction Y intersect; exemplarily, the first direction X and the second direction Y are perpendicular. The first direction X can be the row direction of the light-emitting device groups 1 and / or the driving circuits 2, and the second direction Y can be the column direction of the light-emitting device groups 1 and / or the driving circuits 2.

[0083] like Figure 1 and Figure 2A As shown, along the second direction Y, pointing from test area A2 to binding area A3, the multi-row light-emitting device group 1 consists of the first to Mth rows of light-emitting device groups, and the multi-row driving circuit 2 consists of the first to Nth rows of driving circuits, where M and N are integers greater than or equal to 2. The first row of light-emitting device groups is electrically connected to the first row of driving circuits, and the first row of driving circuits includes a selected driving circuit 20, meaning that the selected driving circuit 20 is located within the first row of driving circuits in the multi-row driving circuit 2.

[0084] It should be noted that, as Figure 1 As shown, multiple signal lines in the light-emitting substrate 100 (e.g., power line 3, ground line 4, and multiple input signal lines 5 electrically connected to the driving circuit 2) converge to the bonding area A3, making the signal line arrangement on the side of the light-emitting area A1 closer to the bonding area A3 more complex.

[0085] If the selected driving circuit 20 is placed on the side of the light-emitting area A1 close to the bonding area A3, the connecting line L needs to cross the bonding area A3 to achieve the electrical connection between the first test pad P1 and the selected driving circuit 20, or cross the light-emitting area A1 to achieve the electrical connection between the first test pad P1 and the selected driving circuit 20. This makes the preparation of the connecting line L connecting the first test pad P1 and the selected driving circuit 20 quite difficult.

[0086] Therefore, in the above embodiments of this disclosure, by setting the selected driving circuit 20 in the first row of the multi-row driving circuit 2, that is, setting the selected driving circuit 20 on the side of the light-emitting area A1 away from the binding area A3, that is, setting the selected driving circuit 20 on the side of the light-emitting area A1 closer to the test area A2. Figure 2B As shown, compared to the side of the light-emitting area A1 near the bonding area A3, the side of the light-emitting area A1 near the test area A2 has fewer signal lines and a simpler arrangement. By setting the selected driving circuit 20 on the side of the light-emitting area A1 near the test area A2, the number of signal lines that the connecting line L needs to cross is reduced, thus reducing the difficulty of fabricating the connecting line L.

[0087] Furthermore, since the selected driving circuit 20 is located on the side of the light-emitting area A1 close to the test area A2, and the first test pad P1 is located in the test area A2, the trace length of the connection line L between the first test pad P1 and the selected driving circuit 20 can be shortened.

[0088] In some embodiments, such as Figure 2A and Figure 3 As shown, the selected driving circuit 20 includes two first-type output terminals 21 and two second-type output terminals 22. The two first-type output terminals 21 are electrically connected to two adjacent light-emitting device groups 1 in the first row of light-emitting device groups, respectively. Either of the two second-type output terminals 22 is electrically connected to the first test pad P1.

[0089] It is understandable that, such as Figure 2A and Figure 3 As shown, the selected driving circuit 20 has four output terminals (CH1, CH2, CH3, and CH4), including two first-type output terminals 21 and two second-type output terminals 22. Furthermore, in the first row of light-emitting device groups, a selected driving circuit 20 is provided between two adjacent light-emitting device groups 1, and the two first-type output terminals 21 of the selected driving circuit 20 are electrically connected to the two adjacent light-emitting device groups 1.

[0090] Provided that all light-emitting device groups 1 on the light-emitting substrate are electrically connected to the corresponding driving circuit 2, there is a situation where two second type output terminals 22 of the selected driving circuit 20 are idle (i.e. not electrically connected to any light-emitting device group 1). Thus, either of the two second type output terminals 22 of the selected driving circuit 20 can be electrically connected to the first test pad P1.

[0091] In some embodiments, such as Figure 1 As shown, the light-emitting device groups in rows 2 to M include multiple device units 10. Each device unit 10 includes two adjacent rows of light-emitting device groups 1, and the device unit 10 is electrically connected to one row of driving circuit 2 in the driving circuits of rows 2 to N. That is, in the light-emitting device groups in rows 2 to M, two adjacent rows of light-emitting device groups 1 are electrically connected to one row of driving circuit 2.

[0092] like Figure 1 and Figure 3 As shown, the driving circuit 2 includes four output terminals (CH1, CH2, CH3 and CH4), which are electrically connected to the four light-emitting device groups 1 in the device unit 10, respectively.

[0093] It is understandable that, such as Figure 1 As shown, each device unit 10 includes multiple sub-device units 11. Each sub-device unit 11 includes four light-emitting device groups 1 in two rows and two columns of light-emitting device groups 1. The four output terminals of each driving circuit 2 are electrically connected to the four light-emitting device groups 1 in each sub-device unit 11.

[0094] In some embodiments, such as Figure 1 As shown, the power line 3 includes a first sub-power line 31 and multiple second sub-power lines 32. The first sub-power line 31 extends along a first direction X and is located on the side of the light-emitting area A1 near the test area A2. The multiple second sub-power lines 32 extend along a second direction Y and are electrically connected to the first sub-power line 31. By connecting the multiple second sub-power lines 32 through the first sub-power line 31, multiple parallel channels are formed, which can reduce the overall resistance of the power line 3 and thus improve the stability of the power signal transmission of the power line 3.

[0095] It should be noted that, where the arrangement space on the light-emitting substrate 100 allows, the power line 3 may include multiple first sub-power lines 31 extending along the first direction X. The multiple first sub-power lines 31 and multiple second sub-power lines 32 form a grid structure, which can further reduce the overall resistance of the power line 3 and improve the stability of the power line 3 in transmitting power signals.

[0096] like Figure 1 and Figure 2AAs shown, the first sub-power line 31 is electrically connected to one end of multiple second sub-power lines 32 near the test area A2, and the second test pad P2 is electrically connected to the first sub-power line 31.

[0097] By setting the first sub-power line 31 closer to the test area A2, and the second test pad P2 electrically connected to the first sub-power line 31 via the connecting line L, the routing length of the connecting line L can be shortened, the number of signal lines crossed by the connecting line L can be reduced, and the fabrication difficulty of the connecting line L can be reduced.

[0098] In some embodiments, such as Figure 2A As shown, the light-emitting substrate 100 also includes a first connecting line L1 and a second connecting line L2. One end of the first connecting line L1 is electrically connected to the first test pad P1, and the other end is electrically connected to the selected driving circuit 20, so as to realize the electrical connection between the first test pad P1 and the selected driving circuit 20.

[0099] One end of the second connecting line L2 is electrically connected to the second test pad P2, and the other end is electrically connected to the first sub-power line 31, so as to realize the electrical connection between the second test pad P2 and the first sub-power line 31.

[0100] The specific structures of the first connecting line L1 and the second connecting line L2 are described below in conjunction with the film layer structure of the light-emitting substrate 100.

[0101] In some embodiments, such as Figure 2B and Figure 2C As shown, the light-emitting substrate 100 includes a substrate 101, and a first conductive layer 102 and a second conductive layer 104 sequentially stacked on the substrate 101. The first conductive layer 102 includes a first sub-ground line 41 extending along a first direction X, and the first sub-ground line 41 is located on the side of the light-emitting region A1 near the test region A2. A first sub-power line 31 and a first test pad P1 are located on the second conductive layer 104.

[0102] It should be noted that the light-emitting substrate 100 also includes a first insulating layer 103 located between the first conductive layer 102 and the second conductive layer 104, so as to achieve insulation between the first conductive layer 102 and the second conductive layer 104.

[0103] Furthermore, the light-emitting substrate 100 also includes a second insulating layer 105 disposed on the side of the second conductive layer 104 away from the substrate 101, which serves to protect the second conductive layer 104.

[0104] like Figure 2BAs shown, the selected drive circuit 20 is located on the side of the first sub-ground line 41 and the first sub-power line 31 away from the first test pad P1. Therefore, the first connection line L1 needs to cross the first sub-ground line 41 and the first sub-power line 31 to be electrically connected to the first test pad P1 and the selected drive circuit 20.

[0105] like Figure 2B As shown, the first connection line L1 includes at least one first connection segment L11 located on the first conductive layer 102 and at least one second connection segment L12 located on the second conductive layer 104. The orthographic projection of the first connection segment L11 onto the substrate 101 at least partially overlaps with the orthographic projection of the first sub-power line 31 onto the substrate 101, thereby crossing the first sub-power line 31 through the first connection segment L11. The orthographic projection of the second connection segment L12 onto the substrate 101 at least partially overlaps with the orthographic projection of the first sub-ground line 41 onto the substrate 101, thereby crossing the first sub-ground line 41 through the second connection segment L12.

[0106] like Figure 2B As shown, among at least one first connecting segment L11 and at least one second connecting segment L12, the connecting segment closest to the first test pad P1 is the second connecting segment L12, and the first test pad P1 is electrically connected to the closest second connecting segment L12.

[0107] It is understandable that the first test pad P1 and the second connecting segment L12 are both located on the second conductive layer 104. Therefore, the first test pad P1 and the second connecting segment L12 can make direct electrical contact.

[0108] Through the above-mentioned structural design of the first connecting line L1, the first connecting line L1 can cross the first sub-power line 31 and the first sub-ground line 41.

[0109] For example, such as Figure 2B and Figure 2C As shown, the first connecting line L1 includes two first connecting segments L11 (first connecting segment L11a and first connecting segment L11b) located in the first conductive layer 102, and three second connecting segments L12 (second connecting segment L12a, second connecting segment L12b and second connecting segment L12c) located in the second conductive layer 104. The second connecting segments L12a, L11a, L12b, L11b and L12c are sequentially electrically connected, and adjacent connecting segments are electrically connected through vias in the first insulating layer 103.

[0110] Furthermore, the end of the second connecting segment L12a away from the first connecting segment L11a is electrically connected to the first test pad P1, and the end of the second connecting segment L12c away from the first connecting segment L11b is electrically connected to the selected drive circuit 20.

[0111] It should be noted that, as Figure 2B As shown, the first sub-grounding wire 41 is provided with a first opening 41A, the first connecting segment L11a is located in the first opening 41A, and the first connecting segment L11a does not contact the first sub-grounding wire 41, which can realize the insulation between the first connecting segment L11a and the first sub-grounding wire 41, and realize that the first connecting segment L11a crosses the first sub-power line 31.

[0112] In some embodiments, such as Figure 2B As shown, the second connecting line L2 extends approximately along the second direction Y, and the second connecting line L2 and the first sub-power line 31 are made of the same material and are disposed in the same layer, that is, both the second connecting line L2 and the first sub-power line 31 are located in the second conductive layer 104. Therefore, the second connecting line L2 can make direct electrical contact with the first sub-power line 31.

[0113] And, as Figure 2B As shown, the second test pad P2 is also located on the second conductive layer 104. Therefore, the second connecting line L2 can also make direct electrical contact with the second test pad P2.

[0114] Some embodiments of this disclosure also provide a scheme for detecting the current in each light-emitting device group 1, which will be described in the following embodiments.

[0115] like Figure 4A As shown, the light-emitting device group 1 includes multiple light-emitting devices 1a and multiple traces 1b, with the multiple light-emitting devices 1a connected in series through the multiple traces 1b. The light-emitting devices 1a are inorganic light-emitting diodes with a size of 50-500µm, such as Mini LEDs.

[0116] like Figure 4A As shown, the light-emitting substrate 100 also includes a fourth test pad P4 and a fifth test pad P5 disposed in the test area A2, and a second test device group T2. The fourth test pad P4 and the fifth test pad P5 are each electrically connected to the same trace 1b. In this trace 1b, the portion between the position where the fourth test pad P4 is electrically connected to the trace 1b and the position where the fifth test pad P5 is electrically connected to the trace 1b is disconnected. The second test device group T2 is electrically connected to the fourth test pad P4 and the fifth test pad P5.

[0117] It should be noted that, see Figure 4A and Figure 4BThe trace 1b (the trace 1b between the light-emitting device LED-2 and the light-emitting device LED-3) connected to the fourth test pad P4 and the fifth test pad P5 includes a first sub-trace 11b and a second sub-trace 12b. The first sub-trace 11b and the second sub-trace 12b are disconnected. The fourth test pad P4 is electrically connected to the first sub-trace 11b, and the fifth test pad P5 is electrically connected to the second sub-trace 12b to meet the testing requirements.

[0118] Please continue reading Figure 4A and Figure 4B The aforementioned trace 1b also includes a sub-connection trace 13b. It should be noted that the sub-connection trace 13b is located in the first conductive layer 102, while the first sub-trace 11b and the second sub-trace 12b are both located in the second conductive layer 104. Furthermore, the orthographic projections of the first sub-trace 11b and the second sub-trace 12b onto the substrate 101 at least partially overlap with the orthographic projection of the sub-connection trace 13b onto the substrate 101. After testing, a laser can be used to irradiate the overlapping portions of the first sub-trace 11b, the second sub-trace 12b, and the sub-connection trace 13b, thereby electrically connecting the first sub-trace 11b, the second sub-trace 12b, and the sub-connection trace 13b, thus reconnecting the disconnected trace 1b and ensuring the normal operation of the light-emitting substrate 100.

[0119] In the light-emitting substrate 100 of the above embodiments of this disclosure, a fourth test pad P4 and a fifth test pad P5 are provided in the test area A2. The fourth test pad P4 and the fifth test pad P5 are electrically connected to the same trace 1b. By breaking the trace 1b between the two and the connection position of the trace 1b, and connecting the second test device group T2 between the fourth test pad P4 and the fifth test pad P5, a series circuit of the second test device group T2 and a plurality of light-emitting devices 1a is formed.

[0120] Electrical signals are transmitted to the circuit on the light-emitting substrate 100 through the pins located in the bonding area, so that the selected driving circuit 20 and the connected light-emitting device group 1 receive electrical signals through the corresponding signal lines. In this case, the fourth test pad P4 and the fifth test pad P5 are subjected to a pin test using a test fixture, and the current value in the second test device group T2 can be detected, thereby obtaining the current value in the series circuit of multiple light-emitting devices 1a.

[0121] Furthermore, as mentioned above, each light-emitting device group 1 is electrically connected to the power supply line 3 and the driving circuit 2, as shown in the reference. Figure 1 The driving circuit 2 is also electrically connected to the grounding wire 4 (the specific connection method between the driving circuit 2 and the grounding wire 4 will be described later). Therefore, the series circuit of multiple light-emitting devices 1a is also connected in series with the driving circuit 2 and the grounding wire 4. The current value in the series circuit of multiple light-emitting devices 1a is equal to the current value flowing into the grounding wire 4 from the driving circuit 2.

[0122] Based on the current value flowing into the grounding wire 4 from the driving circuit 2 and the current resistance value of the grounding wire 4, the voltage drop at the end of the grounding wire 4 near the bonding area A3 and the end away from the bonding area A3 can be calculated. Then, the design resistance value of the grounding wire 4 can be adjusted according to whether the voltage drop meets the product requirements, so as to ensure that the current value in the series circuit of multiple light-emitting devices 1a meets the product requirements and can guarantee the light-emitting effect of multiple light-emitting devices 1a.

[0123] In addition, in some embodiments, the fourth test pad P4 and the fifth test pad P5 may not be connected to the second test device group T2. The test fixture is used to directly perform a pin piercing test on the fourth test pad P4 and the fifth test pad P5, forming a series circuit of the test fixture and multiple light-emitting devices 1a. The test fixture is connected to the series circuit as a test device, and the current value passing through it is detected by the test fixture to obtain the current value in the series circuit.

[0124] In some embodiments, such as Figure 4A As shown, the second test device group T2 includes a resistor T22, one end of which is electrically connected to the fourth test pad P4, and the other end is electrically connected to the fifth test pad P5.

[0125] In some embodiments, such as Figure 1 and Figure 4A As shown, the fourth test pad P4 and the fifth test pad P5 are both electrically connected to any trace 1b in the first row of light-emitting device group.

[0126] In the above embodiments of this disclosure, since the first row of light-emitting device group is disposed on the side of light-emitting area A1 away from bonding area A3, that is, on the side of light-emitting area A1 close to test area A2. Compared with the side of light-emitting area A1 close to bonding area A3, the side of light-emitting area A1 close to test area A2 has fewer signal lines and a simpler arrangement. By electrically connecting the fourth test pad P4 and the fifth test pad P5 to any trace 1b in the first row of light-emitting device group, the number of signal lines that the connection line L between the fourth test pad P4 and the fifth test pad P5 and the trace 1b needs to cross is smaller, reducing the difficulty of fabricating the connection line L.

[0127] Furthermore, since the first row of light-emitting devices is located on the side of the light-emitting area A1 close to the test area A2, the fourth test pad P4 and the fifth test pad P5 are both located in the test area A2. The fourth test pad P4 and the fifth test pad P5 are both electrically connected to any of the traces 1b in the first row of light-emitting devices, which can shorten the trace length of the connecting line L.

[0128] In some embodiments, such as Figure 4AAs shown, the light-emitting substrate 100 also includes two third connection lines L3, one end of which is electrically connected to the fourth test pad P4 and the other end is electrically connected to the trace 1b, so as to realize the electrical connection between the fourth test pad P4 and the trace 1b.

[0129] One end of the other third connection line L3 is electrically connected to the fifth test pad P5, and the other end is electrically connected to the trace 1b, so as to realize the electrical connection between the fifth test pad P5 and the trace 1b.

[0130] The specific structure of the third connecting line L3 will be described below in conjunction with the film structure of the light-emitting substrate 100.

[0131] In some embodiments, such as Figure 4B As shown, the fourth test pad P4 and the fifth test pad P5 are located on the second conductive layer 104. Both the fourth test pad P4 and the fifth test pad P5 are located on the side of the first sub-ground line 41 and the first sub-power line 31 away from the trace 1b. Therefore, the third connection line L3 needs to cross the first sub-ground line 41 and the first sub-power line 31.

[0132] like Figure 4B and Figure 4C As shown, the third connection line L3 includes at least one third connection segment L31 located on the first conductive layer 102 and at least one fourth connection segment L32 located on the second conductive layer 104. The orthographic projection of the third connection segment L31 onto the substrate 101 at least partially overlaps with the orthographic projection of the first sub-power line 31 onto the substrate 101, thereby crossing the first sub-power line 31 through the third connection segment L31. The orthographic projection of the fourth connection segment L32 onto the substrate 101 at least partially overlaps with the orthographic projection of the first sub-ground line 41 onto the substrate 101, thereby crossing the first sub-ground line 41 through the fourth connection segment L32.

[0133] like Figure 4B and Figure 4C As shown, among at least one third connecting segment L31 and at least one fourth connecting segment L32 of a third connecting line L3, the connecting segment closest to the fourth test pad P4 is the fourth connecting segment L32, and the fourth test pad P4 is electrically connected to the closest fourth connecting segment L32.

[0134] It is understandable that the fourth test pad P4 and the fourth connecting segment L32 are both located in the second conductive layer 104, therefore, the fourth test pad P4 and the fourth connecting segment L32 can be in direct electrical contact.

[0135] like Figure 4B and Figure 4CAs shown, among at least one third connecting segment L31 and at least one fourth connecting segment L32 of another third connecting line L3, the connecting segment closest to the fifth test pad P5 is the fourth connecting segment L32, and the fifth test pad P5 is electrically connected to the closest fourth connecting segment L32.

[0136] It is understandable that the fifth test pad P5 and the fourth connecting segment L32 are both located on the second conductive layer 104. Therefore, the fifth test pad P5 and the fourth connecting segment L32 can make direct electrical contact.

[0137] Through the above-mentioned structural design of the third connecting line L3, the third connecting line L3 can cross the first sub-power line 31 and the first sub-ground line 41.

[0138] For example, such as Figure 4B and Figure 4C As shown, the third connecting line L3 includes a third connecting segment L31 located in the first conductive layer 102 and two fourth connecting segments L32 (fourth connecting segment L32a and fourth connecting segment L32b) located in the second conductive layer 104. The fourth connecting segment L32a, the third connecting segment L31, and the fourth connecting segment L32b are electrically connected sequentially, and adjacent connecting segments are electrically connected through vias in the first insulating layer 103.

[0139] Furthermore, the end of the fourth connecting segment L32a furthest from the third connecting segment L31 is electrically connected to the fourth test pad P4, and the end of the fourth connecting segment L32b furthest from the third connecting segment L31 is electrically connected to the trace 1b.

[0140] Furthermore, some embodiments of this disclosure also provide a scheme for detecting the voltage of an input signal line electrically connected to the drive circuit 2, which will be described in the following embodiments.

[0141] like Figure 5A As shown, the light-emitting substrate 100 also includes at least one input signal line 5, which extends along the second direction Y and is electrically connected to a plurality of driving circuits 2 for providing input signals to the driving circuits 2.

[0142] For example, such as Figure 5A As shown, at least one input signal line 5 includes at least one of a power supply voltage signal line 51, a clock signal line 52, and a data signal line 53.

[0143] And, as Figure 3 and Figure 5AAs shown, the driving circuit 2 includes a power supply voltage signal terminal Vcc, a clock signal terminal CLK, and a data signal terminal Dip. The power supply voltage signal line 51 is electrically connected to the power supply voltage signal terminal Vcc and is configured to transmit a power supply voltage signal to the power supply voltage signal terminal Vcc. The clock signal line 52 is electrically connected to the clock signal terminal CLK and is configured to transmit a clock signal to the clock signal terminal CLK. The data signal line 53 is electrically connected to the data signal terminal Dip and is configured to transmit a data signal to the data signal terminal Dip.

[0144] like Figure 3 and Figure 5A As shown, the light-emitting substrate 100 also includes a grounding wire 4, which is electrically connected to multiple driving circuits 2 to ground the multiple driving circuits 2. The connection method between the grounding wire 4 and the driving circuits 2 will be described in detail below.

[0145] For example, the drive circuit 2 also includes a ground terminal GND, and the grounding wire 4 is electrically connected to the ground terminal GND and is configured to ground the drive circuit 2.

[0146] like Figure 5B As shown, the light-emitting substrate 100 also includes at least one sixth test pad P6 disposed in the test area A2, and at least one test point TP disposed in the light-emitting area A1. Each sixth test pad P6 is electrically connected to an input signal line 5, and each test point TP is electrically connected to a ground line 4 (i.e., the voltage value of the test point TP is 0).

[0147] It should be noted that, as Figure 5B As shown, the light-emitting substrate 100 also includes a signal connection line L4. One end of the signal connection line L4 is electrically connected to the sixth test pad P6, and the other end is electrically connected to the end of the input signal line 5 near the test area A2.

[0148] In the light-emitting substrate 100 of the above embodiments of this disclosure, at least one sixth test pad P6 is provided in the test area A2, and each sixth test pad P6 is electrically connected to an input signal line 5. At least one test point TP is provided in the light-emitting area A1, and each test point TP is electrically connected to a ground line 4.

[0149] Furthermore, an electrical signal is transmitted to the circuit on the light-emitting substrate 100 through the pins located in the bonding area, so that the selected driving circuit 20 and the light-emitting device group 1 connected thereto receive the electrical signal through the corresponding signal line. In this case, a test fixture is used to perform a pin test on the sixth test pad P6 and the test point TP, and the voltage value of the input signal line 5 electrically connected to the sixth test pad P6 (the voltage value of the end of the input signal line 5 away from the bonding area A3) can be detected.

[0150] Based on the detected voltage value at the end of the input signal line 5 furthest from the bonding area A3, and the voltage value of the signal received by the input signal line 5 in the bonding area A3, the voltage drop between the end of the input signal line 5 closest to the bonding area A3 and the end furthest from the bonding area A3 can be calculated. Then, the design resistance value of the input signal line 5 can be adjusted according to the voltage drop to ensure that the voltage value of the input signal provided by the input signal line 5 to the drive circuit 2 meets the normal operation requirements of the drive circuit 2.

[0151] In addition, compared to the side of the light-emitting area A1 near the bonding area A3, the side of the light-emitting area A1 near the test area A2 has fewer signal lines and a simpler arrangement. By electrically connecting the signal connection line L4 to the end of the input signal line 5 near the test area A2, the number of signal lines that the signal connection line L4 needs to cross is reduced, thus lowering the difficulty of fabricating the signal connection line L4.

[0152] Furthermore, since the sixth test pad P6 is located in test area A2, the signal connection line L4 can be electrically connected to the end of the input signal line 5 closest to test area A2, which can shorten the routing length of the signal connection line L4.

[0153] The specific structure of the signal connection line L4 will be described below in conjunction with the film layer structure of the light-emitting substrate 100.

[0154] In some embodiments, such as Figure 5B As shown, the sixth test pad P6 is located on the second conductive layer 104. The selected drive circuit 20 is located on the side of the first sub-ground line 41 and the first sub-power line 31 away from the sixth test pad P6. Therefore, the signal connection line L4 needs to cross the first sub-ground line 41 and the first sub-power line 31.

[0155] like Figure 5B As shown, the signal connection line L4 includes at least one fifth connection segment L41 located on the first conductive layer 102 and at least one sixth connection segment L42 located on the second conductive layer 104. The orthographic projection of the fifth connection segment L41 onto the substrate 101 at least partially overlaps with the orthographic projection of the first sub-power line 31 onto the substrate 101, thereby crossing the first sub-power line 31 through the fifth connection segment L41. The orthographic projection of the sixth connection segment L42 onto the substrate 101 at least partially overlaps with the orthographic projection of the first sub-ground line 41 onto the substrate 101, thereby crossing the first sub-ground line 41 through the sixth connection segment L42.

[0156] like Figure 5B As shown, among at least one fifth connecting segment L41 and at least one sixth connecting segment L42, the connecting segment closest to the sixth test pad P6 is the sixth connecting segment L42, and the sixth test pad P6 is electrically connected to the closest sixth connecting segment L42.

[0157] It is understandable that the sixth test pad P6 and the sixth connecting segment L42 are both located on the second conductive layer 104. Therefore, the sixth test pad P6 and the sixth connecting segment L42 can make direct electrical contact.

[0158] Through the above structural design of the signal connection line L4, the signal connection line L4 can cross the first sub-power line 31 and the first sub-ground line 41.

[0159] For example, such as Figure 5B As shown, the signal connection line L4, which is electrically connected to the power supply voltage signal line 51, includes two fifth connection segments L41 (fifth connection segment L41a and fifth connection segment L41b) located in the first conductive layer 102, and three sixth connection segments L42 (sixth connection segment L42a, sixth connection segment L42b and sixth connection segment L42c) located in the second conductive layer 104. The sixth connection segments L42a, L41a, L42b, L41b and L42c are sequentially electrically connected, and adjacent connection segments are electrically connected through vias in the first insulating layer 103.

[0160] Furthermore, the end of the sixth connecting segment L42a furthest from the fifth connecting segment L41a is electrically connected to the sixth test pad P6, and the end of the sixth connecting segment L42c furthest from the sixth connecting segment L42b is electrically connected to the selected drive circuit 20.

[0161] It should be noted that, as Figure 5B As shown, the first sub-grounding wire 41 is also provided with a second opening 41B, and the fifth connecting segment L41a is located in the second opening 41B. The fifth connecting segment L41a does not contact the first sub-grounding wire 41, which can realize the insulation between the fifth connecting segment L41a and the first sub-grounding wire 41. In addition, the fifth connecting segment L41a crosses the first sub-power line 31.

[0162] For example, such as Figure 5B As shown, the signal connection line L4, which is electrically connected to the clock signal line 52, includes a fifth connection segment L41' located in the first conductive layer 102 and two sixth connection segments L42' (sixth connection segment L42a' and sixth connection segment L42b') located in the second conductive layer 104. The sixth connection segments L42a', L41', and L42b' are sequentially electrically connected, and adjacent connection segments are electrically connected through vias in the first insulating layer 103.

[0163] Furthermore, the end of the sixth connecting segment L42a' furthest from the fifth connecting segment L41' is electrically connected to the sixth test pad P6, and the end of the sixth connecting segment L42b' furthest from the fifth connecting segment L41' is electrically connected to the selected drive circuit 20.

[0164] It should be noted that, as Figure 5B As shown, the first sub-grounding wire 41 is also provided with a third opening 41C, and the fifth connecting segment L41' is located in the third opening 41C. The fifth connecting segment L41' does not contact the first sub-grounding wire 41, which can realize the insulation between the fifth connecting segment L41' and the first sub-grounding wire 41. In addition, the fifth connecting segment L41' crosses the first sub-power line 31.

[0165] For example, such as Figure 5B As shown, the signal connection line L4, which is electrically connected to the data signal line 53, includes a fifth connection segment L41" located in the first conductive layer 102 and two sixth connection segments L42" (sixth connection segment L42a" and sixth connection segment L42b") located in the second conductive layer 104. The sixth connection segment L42a", the fifth connection segment L41", and the sixth connection segment L42b" are electrically connected sequentially, and adjacent connection segments are electrically connected through vias in the first insulating layer 103.

[0166] Furthermore, the end of the sixth connection segment L42a "away from the fifth connection segment L41" is electrically connected to the sixth test pad P6, and the end of the sixth connection segment L42b "away from the fifth connection segment L41" is electrically connected to the selected drive circuit 20.

[0167] It should be noted that, as Figure 5B As shown, the fifth connecting segment L41" is located inside the third opening 41C, and the fifth connecting segment L41" does not contact the first sub-grounding wire 41, which can realize the insulation between the fifth connecting segment L41" and the first sub-grounding wire 41, and realize that the fifth connecting segment L41" crosses the first sub-power line 31.

[0168] Furthermore, some embodiments of this disclosure also provide a scheme for detecting the voltage of a cascaded signal line electrically connected to the drive circuit 2, which will be described in the following embodiments.

[0169] In some embodiments, such as Figure 5A As shown, the light-emitting substrate 100 also includes multiple cascaded signal lines 6. Two adjacent driving circuits 2 along the first direction X and / or two adjacent driving circuits 2 along the second direction Y are electrically connected through the cascaded signal lines 6. The cascaded signal output by the driving circuit 2 is transmitted to the next stage driving circuit 2 that is electrically connected to it.

[0170] For example, such as Figure 3 and Figure 5AAs shown, the driving circuit 2 also includes a cascaded input signal terminal Dis and a cascaded output signal terminal Dos. The cascaded signal line 6 is electrically connected to the cascaded input signal terminal Dis and is configured to transmit the cascaded input signal to the cascaded input signal terminal Dis. The cascaded signal line 6 is electrically connected to the cascaded output signal terminal Dos and is configured to use the cascaded output signal output by the cascaded output signal terminal Dos as the cascaded input signal and transmit it to the cascaded input signal terminal Dis of the next stage driving circuit 2.

[0171] Combination Figure 1 and Figure 5A Multiple drive circuits 2 are arranged in multiple columns, with each column of drive circuits 2 arranged along a first direction X. Each pair of adjacent columns of drive circuits 2 forms a cascade unit 2A. In each cascade unit 2A, each column of drive circuits 2 is electrically connected via a cascade signal line 6. The first drive circuit 2 of each pair of adjacent columns of drive circuits 2, located along a second direction Y and pointing from test area A2 to bonding area A3, is connected via the cascade signal line 6. Figure 5A The cascaded signal lines 6) extending along the first direction X shown in the figure are electrically connected to form a cascaded unit 2A.

[0172] It is understandable that, such as Figure 1 As shown, along the second direction Y, pointing from test area A2 to bonding area A3, the last drive circuit 2 of a column of drive circuits 2 is the first stage drive circuit 2 of the cascaded unit 2A. fst The last drive circuit 2 of the other column of drive circuits 2 is the last stage drive circuit 2 of the cascaded unit 2A. lst First-stage drive circuit 2 fst The cascaded output signal is transmitted as a cascaded input signal to the second-stage driver circuit, and so on, until the last-stage driver circuit 2. lst The cascaded input signal was received.

[0173] like Figure 5A As shown, the light-emitting substrate 100 also includes a plurality of seventh test pads P7 disposed in the test area A2, each of the seventh test pads P7 being electrically connected to a cascaded signal line 6.

[0174] It should be noted that, Figure 5ATwo seventh test pads P7 are shown. One seventh test pad P7 is electrically connected to the cascade signal line 6 and the cascade input signal terminal Dis of a driver circuit 2. The other seventh test pad P7 is electrically connected to the cascade signal line 6 and the cascade input signal terminal Dis of the next-stage driver circuit 2. Electrical signals are transmitted to the circuits on the light-emitting substrate 100 through pins located in the bonding area, so that the selected driver circuit 20 and its connected light-emitting device group 1 receive electrical signals through the corresponding signal lines. In this case, a test fixture can be used to perform a pin piercing test on one seventh test pad P7 and the test point TP to detect the voltage value of the cascade input signal terminal Dis of one driver circuit 2. A test fixture is also used to perform a pin piercing test on the other seventh test pad P7 and the test point TP to detect the voltage value of the cascade input signal terminal Dis of the next-stage driver circuit 2.

[0175] Because a cascaded signal line 6 connects two adjacent drive circuits 2, the voltage difference between the cascaded input signal terminals Dis of the two adjacent drive circuits 2 is approximately equal to the voltage difference across the cascaded signal line 6. Therefore, the design resistance value of the cascaded signal line 6 can be adjusted according to this voltage difference to ensure that the voltage value of the cascaded input signal provided by the cascaded signal line 6 to the drive circuit 2 meets the normal operation requirements of the drive circuit 2.

[0176] Furthermore, compared to the side of the light-emitting area A1 closer to the bonding area A3, the side of the light-emitting area A1 closer to the test area A2 has fewer signal lines and a simpler arrangement. For example... Figure 5A As shown, the seventh test pad P7 is electrically connected to the cascaded signal line 6 near the test area A2 via the cascaded signal connection line L5. The number of signal lines that the cascaded signal connection line L5 needs to cross is small, which reduces the difficulty of preparing the cascaded signal connection line L5.

[0177] Furthermore, since the seventh test pad P7 is located in test area A2, the cascade signal connection line L5 can be electrically connected to the cascade signal line 6 near test area A2, which can shorten the routing length of the cascade signal connection line L5.

[0178] The specific structure of the cascaded signal connection line L5 will be described below in conjunction with the film layer structure of the light-emitting substrate 100.

[0179] In some embodiments, such as Figure 5B As shown, the seventh test pad P7 is located on the second conductive layer 104. The cascaded signal line 6 is located on the side of the first sub-ground line 41 and the first sub-power line 31 away from the seventh test pad P7. Therefore, the cascaded signal connection line L5 needs to cross the first sub-ground line 41 and the first sub-power line 31.

[0180] like Figure 5BAs shown, the cascaded signal connection line L5 includes at least one seventh connection segment L51 located on the first conductive layer 102 and at least one eighth connection segment L52 located on the second conductive layer 104. The orthographic projection of the seventh connection segment L51 onto the substrate 101 at least partially overlaps with the orthographic projection of the first sub-power line 31 onto the substrate 101, thereby crossing the first sub-power line 31 through the seventh connection segment L51. The orthographic projection of the eighth connection segment L52 onto the substrate 101 at least partially overlaps with the orthographic projection of the first sub-ground line 41 onto the substrate 101, thereby crossing the first sub-ground line 41 through the eighth connection segment L52.

[0181] like Figure 1 As shown, among at least one seventh connecting segment L51 and at least one eighth connecting segment L52, the connecting segment closest to the seventh test pad P7 is the eighth connecting segment L52, and the seventh test pad P7 is electrically connected to the closest eighth connecting segment L52.

[0182] It is understandable that the seventh test pad P7 and the eighth connection segment L52 are both located on the second conductive layer 104, therefore, the seventh test pad P7 and the eighth connection segment L52 can make direct electrical contact.

[0183] Through the above-described structural design of the cascaded signal connection line L5, the cascaded signal connection line L5 can span the first sub-power line 31 and the first sub-ground line 41.

[0184] For example, Figure 5B The diagram shows two seventh test pads P7 and two cascaded signal connection lines L5. The cascaded signal connection line L5 on the right side includes two seventh connection segments L51 (seventh connection segment L51a and seventh connection segment L51b) located in the first conductive layer 102, and two eighth connection segments L52 (eighth connection segment L52a and eighth connection segment L52b) located in the second conductive layer 104. The eighth connection segments L52a, L51a, L52b, and L51b are electrically connected sequentially, and adjacent connection segments are electrically connected through vias in the first insulating layer 103.

[0185] Furthermore, the end of the eighth connecting segment L52a furthest from the seventh connecting segment L51a is electrically connected to the seventh test pad P7, and the end of the seventh connecting segment L51b furthest from the eighth connecting segment L52b is connected to the cascaded signal line 6.

[0186] It should be noted that, as Figure 5BAs shown, a fourth opening 41D is provided in the first sub-grounding wire 41, and the seventh connecting segment L51a is located in the fourth opening 41D. The seventh connecting segment L51a does not contact the first sub-grounding wire 41, which can realize the insulation between the seventh connecting segment L51a and the first sub-grounding wire 41. In addition, the seventh connecting segment L51a crosses the first sub-power line 31.

[0187] For example, such as Figure 5B As shown, the specific structure of the cascaded signal connection line L5 on the left is the same as that on the right, and will not be described in detail here.

[0188] As mentioned earlier, in the scheme for detecting the voltage of input signal line 5 and cascaded signal line 6, a test fixture is required to perform a pin-punch test on the test point TP, and each test point TP is electrically connected to the ground wire 4. The connection method between multiple test points TP and the ground wire 4 is described below.

[0189] In some embodiments, such as Figure 5A and Figure 5B As shown, the grounding wire 4 includes a first sub-grounding wire 41 extending along a first direction X, and multiple second sub-grounding wires 42 extending along a second direction Y. The first sub-grounding wire 41 is located on the side of the light-emitting area A1 near the test area A2, and is electrically connected to the multiple second sub-grounding wires 42. Connecting the multiple second sub-grounding wires 42 through the first sub-grounding wire 41 improves the stability of the grounding of the grounding wire 4.

[0190] It should be noted that, where the arrangement space on the light-emitting substrate 100 allows, the grounding wire 4 may include multiple first sub-grounding wires 41, and the multiple first sub-grounding wires 41 and multiple second sub-grounding wires 42 form a grid structure, which can further improve the grounding stability of the grounding wire 4.

[0191] like Figure 5A and Figure 5B As shown, the first sub-grounding wire 41 is electrically connected to one end of multiple second sub-grounding wires 42 near the test area A2, and multiple test points TP are electrically connected to the first sub-grounding wire 41 to achieve grounding of multiple test points TP.

[0192] In some embodiments, such as Figure 5C As shown, the first sub-grounding wire 41 is located in the first conductive layer 102, and the test point TP is located in the second conductive layer 104. The test point TP is electrically connected to the first sub-grounding wire 41 through a via in the first insulating layer 103. The second insulating layer 105 has a first test hole H1 that exposes the test point TP.

[0193] With the above setup, during the testing process, the pins of the test fixture can pass through the first test hole H1 and make electrical contact with the test point TP located on the second conductive layer 104, thereby enabling pin puncture testing.

[0194] In some embodiments, such as Figure 5D As shown, the test point TP is the second test hole H2 that penetrates the first insulating layer 103 and the second insulating layer 105, and the second test hole H2 exposes the first sub-ground wire 41.

[0195] Understandably, the test point TP is not fabricated using a conductive layer. Instead, it penetrates the first insulating layer 103 and the second insulating layer 105 through the form of a second test hole H2, exposing the first sub-grounding wire 41. During the testing process, the pins of the test fixture can pass through the second test hole H2 and directly make electrical contact with the first sub-grounding wire 41 located on the first conductive layer 102, thereby enabling pin piercing testing.

[0196] In some embodiments, such as Figure 5A and Figure 5B As shown, the grounding wire 4 also includes multiple third sub-grounding wires 43 and multiple connection patterns 44. Each connection pattern 44 is electrically connected to two adjacent second sub-grounding wires 42 and is electrically connected to the drive circuit 2. The third sub-grounding wires 43 extend along the second direction Y, and each third sub-grounding wire 43 is electrically connected to at least one connection pattern 44, with the end of the third sub-grounding wire 43 near the test area A2 being electrically connected to the first sub-grounding wire 41.

[0197] By using the above configuration method, the grid density of the grounding wire 4 can be increased, thereby further improving the grounding stability of the grounding wire 4.

[0198] Furthermore, some embodiments of this disclosure also provide a scheme for detecting the voltage in the power line 3, which will be described in the following embodiments.

[0199] like Figure 5B As shown, the power line 3 is located in the second conductive layer 104, and the second insulating layer 105 has a third test hole H3 to expose the power line 3. The second conductive layer 104 also includes multiple second sub-grounding wires 42, and the second insulating layer 105 has a fourth test hole H4 to expose the second sub-grounding wires 42.

[0200] With the above setup, during the testing process, one pin of the test fixture can pass through the third test hole H3 and make electrical contact with the second sub-power line 32 of the power line 3 located in the second conductive layer 104. Furthermore, the other pin of the test fixture can pass through the fourth test hole H4 and make electrical contact with the second sub-ground line 42 located in the second conductive layer 104. This allows the detection of the voltage difference between the corresponding position on the power line 3 and the corresponding position on the second sub-ground line 42. By calculating the difference between this voltage difference and the standard voltage difference, the design resistance value of the power line 3 and / or the ground line 4 can be adjusted, or the input voltage of the power line 3 can be compensated, to ensure the normal light emission of the light-emitting device.

[0201] Alternatively, during testing, one pin of the test fixture can pass through the third test hole H3 and make electrical contact with the second sub-power line 32 of the power line 3 located in the second conductive layer 104. Furthermore, another pin of the test fixture can make electrical contact with the test point TP, thereby allowing the voltage value in the power line 3 to be detected.

[0202] Furthermore, some embodiments of this disclosure also provide a scheme for detecting the voltage of the output signal line electrically connected to the drive circuit 2, which will be described in the following embodiments.

[0203] like Figure 5B As shown, the second conductive layer 104 includes multiple output signal lines 7. Each output signal line 7 is electrically connected to the light-emitting device group 1 and the corresponding driving circuit 2. The output signal of the driving circuit 2 is transmitted to the driving circuit 2 through the output signal line 7 to drive the light-emitting device group 1 to emit light.

[0204] like Figure 5B As shown, the second conductive layer 104 also includes multiple conductive test patterns 8, and each output signal line 7 is electrically connected to a conductive test pattern 8. The second insulating layer 105 has a fifth test hole H5 that exposes the conductive test pattern 8.

[0205] With the above setup, during the testing process, one pin of the test fixture can pass through the fifth test hole H5 and make electrical contact with the conductive test pattern 8 located on the second conductive layer 104. Furthermore, the other pin of the test fixture can pass through the fourth test hole H4 and make electrical contact with the second sub-ground wire 42 located on the second conductive layer 104. This allows the voltage value in the output signal line 7 to be detected, and the voltage drop in the output signal line 7 can be calculated. Based on this voltage drop, the design resistance value of the output signal line 7 can be adjusted to ensure the normal light emission of the light-emitting device.

[0206] In addition, some embodiments of this disclosure also provide a scheme for detecting the voltage of the sensor power line and the sensor connection line, which will be described in the following embodiments.

[0207] like Figure 2B , Figure 2D and Figure 2E As shown, the light-emitting substrate 100 also includes a plurality of sensors S, a sensor power line S1 extending along the second direction Y, and a plurality of sensor connection lines S2 extending along the second direction Y.

[0208] Multiple sensors S are arranged in multiple columns, with each column of sensors S arranged along the second direction Y. Each column of sensors S is electrically connected to a sensor power line S1, which provides power to the connected sensors S. Within each column of sensors S, adjacent sensors S are electrically connected via sensor connection lines S2.

[0209] For example, the sensor S can be a temperature sensor, which can be used to detect the operating temperature of the light-emitting substrate 100.

[0210] like Figure 2B , Figure 2D and Figure 2E As shown, the light-emitting substrate 100 also includes a plurality of eighth test pads P8 disposed in the test area A2, at least one eighth test pad P8 being electrically connected to the sensor power line S1, and at least one eighth test pad P8 being electrically connected to the sensor connection line S2.

[0211] In the light-emitting substrate 100 of the above embodiments of this disclosure, an electrical signal is transmitted to the circuit on the light-emitting substrate 100 through a pin located in the bonding area, so that the selected driving circuit 20 and the light-emitting device group 1 connected thereto receive the electrical signal through the corresponding signal line. In this case, a test fixture is used to perform a pin test on the eighth test pad P8 (electrically connected to the sensor power line S1) and the test point TP, and the voltage value of the sensor power line S1 (the voltage value of the end of the sensor power line S1 away from the bonding area A3) can be detected.

[0212] Based on the detected voltage value of the end of the sensor power line S1 furthest from the bonding area A3, and the voltage value of the signal received by the sensor power line S1 in the bonding area A3, the voltage drop between the end of the sensor power line S1 closest to the bonding area A3 and the end furthest from the bonding area A3 can be calculated. Then, the design resistance value of the sensor power line S1 can be adjusted according to the voltage drop to ensure that the voltage value of the input signal provided by the sensor power line S1 to the sensor S meets the normal operation requirements of the sensor S.

[0213] Similarly, by using a test fixture to perform a pin test on the eighth test pad P8 (electrically connected to the sensor connection line S2) and the test point TP, the voltage value of the sensor connection line S2 can be detected, so as to adjust the design resistance value of the sensor connection line S2.

[0214] Some embodiments of this disclosure also provide a backlight module, such as Figure 6As shown, the backlight module 200 includes the light-emitting substrate 100 described in any of the above embodiments.

[0215] For example, the light-emitting substrate 100 is a Mini LED light-emitting substrate, and the backlight module 200 is a Mini LED backlight module.

[0216] The backlight module 200 of the above embodiments of this disclosure can conveniently detect voltage and current information in the circuit, so as to facilitate monitoring of voltage and current information.

[0217] Some embodiments of this disclosure also provide a display device, such as... Figure 7A and Figure 7B As shown, the display device 300 includes a display panel 301 and a backlight module 200 in the above embodiment. The display panel 301 is disposed on the light-emitting side E of the backlight module 200, and the backlight module 200 can be used to provide a backlight source for the display panel 301.

[0218] The aforementioned display device 300 may be a liquid crystal display (LCD).

[0219] The beneficial effects that the display device 300 in the above embodiments of this disclosure can achieve are the same as those that the backlight module 200 can achieve, which can facilitate the detection of voltage and current information in the circuit, so as to facilitate the monitoring of voltage and current information.

[0220] The aforementioned display device 300 can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether it contains text or images. More specifically, the embodiments described are contemplated to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0221] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A light-emitting substrate, comprising a light-emitting region and a test region located on at least one side of the light-emitting region; The light-emitting substrate includes: Multiple groups of light-emitting devices are disposed in the light-emitting area; Multiple driving circuits are disposed in the light-emitting area, and each driving circuit is electrically connected to at least one light-emitting device group; the multiple driving circuits include a selected driving circuit, the selected driving circuit includes at least one first type output terminal and at least one second type output terminal, the first type output terminal being electrically connected to the light-emitting device group; The power cord is electrically connected to the plurality of light-emitting device groups; A first test pad and a second test pad are disposed in the test area; the first test pad is electrically connected to the second type of output terminal of the selected drive circuit, and the second test pad is electrically connected to the power line; The first test device group is electrically connected to the first test pad and the second test pad.

2. The light-emitting substrate according to claim 1, wherein, The plurality of light-emitting device groups and the plurality of driving circuits are arranged in multiple rows, and each row of light-emitting device groups and each row of driving circuits are arranged along a first direction; The light-emitting substrate further includes a bonding area, and the bonding area and the test area are respectively located on opposite sides of the light-emitting area along the second direction; Along the second direction and from the test area to the binding area, the multiple rows of light-emitting device groups are the 1st to Mth rows of light-emitting device groups, and the multiple rows of driving circuits are the 1st to Nth rows of driving circuits, where M and N are integers greater than or equal to 2; the 1st row of light-emitting device groups is electrically connected to the 1st row of driving circuits, and the 1st row of driving circuits includes the selected driving circuit.

3. The light-emitting substrate according to claim 2, wherein, The selected driving circuit includes two first-type output terminals and two second-type output terminals; The two first-type output terminals are respectively electrically connected to two adjacent light-emitting device groups in the first row of light-emitting device groups; Either of the two second-type output terminals is electrically connected to the first test pad.

4. The light-emitting substrate according to claim 2, wherein, The light-emitting device groups in rows 2 to M include multiple device units, each device unit includes two adjacent rows of light-emitting device groups, and the device unit is electrically connected to one row of the driving circuit in rows 2 to N; The driving circuit includes four output terminals, which are electrically connected to the four light-emitting device groups in the device unit, respectively.

5. The light-emitting substrate according to any one of claims 1 to 4, wherein, The power cord includes: The first sub-power line extends along the first direction and is disposed on the side of the light-emitting area close to the test area; Multiple second sub-power lines extend along a second direction and are electrically connected to the first sub-power line; The light-emitting substrate further includes a bonding area, the test area and the bonding area are respectively located on opposite sides of the light-emitting area along the second direction, and the first sub-power line is electrically connected to one end of the plurality of second sub-power lines near the test area; The second test pad is electrically connected to the first sub-power line.

6. The light-emitting substrate according to claim 5, further comprising: The first connecting line has one end electrically connected to the first test pad and the other end electrically connected to the selected driving circuit; The second connecting wire has one end electrically connected to the second test pad and the other end electrically connected to the first sub-power line.

7. The light-emitting substrate according to claim 6, comprising a substrate, and a first conductive layer and a second conductive layer sequentially stacked on the substrate; the first conductive layer includes a first sub-ground line extending along a first direction, the first sub-ground line being located on the side of the light-emitting area closer to the test area; the first sub-power line and the first test pad are located in the second conductive layer; The selected drive circuit is located on the side of the first sub-ground line and the first sub-power line away from the first test pad; The first connection line includes at least one first connection segment located in the first conductive layer and at least one second connection segment located in the second conductive layer. The orthographic projection of the first connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-power line on the substrate, and the orthographic projection of the second connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-ground line on the substrate. Of the at least one first connecting segment and the at least one second connecting segment, the connecting segment closest to the first test pad is the second connecting segment, and the first test pad is electrically connected to the closest second connecting segment.

8. The light-emitting substrate according to claim 6 or 7, wherein, The second connecting line extends along the second direction, and the second connecting line and the first sub-power line are made of the same material and are arranged in the same layer.

9. The light-emitting substrate according to any one of claims 1 to 4, wherein, The first test device group includes test light-emitting devices and / or resistors.

10. The light-emitting substrate according to claim 9, wherein, The first test device group includes test light-emitting devices and resistors; The light-emitting substrate further includes: The third test pad, one end of the test light-emitting device is electrically connected to the first test pad, and the other end is electrically connected to the third test pad; One end of the resistor is electrically connected to the second test pad, and the other end is electrically connected to the third test pad.

11. The light-emitting substrate according to any one of claims 1 to 4, wherein, The light-emitting device group includes multiple light-emitting devices and multiple traces, and the multiple light-emitting devices are connected in series through the multiple traces; The light-emitting substrate further includes: A fourth test pad and a fifth test pad are disposed in the test area; the fourth test pad and the fifth test pad are respectively electrically connected to the same trace; in the trace, the portion between the position where the fourth test pad is electrically connected to the trace and the position where the fifth test pad is electrically connected to the trace is disconnected; The second test device group is electrically connected to the fourth test pad and the fifth test pad.

12. The light-emitting substrate according to claim 11, further comprising a bonding region, wherein the test region and the bonding region are respectively located on opposite sides of the light-emitting region along the second direction; The plurality of light-emitting device groups are arranged in multiple rows, with each row of light-emitting device groups arranged along a first direction and along a second direction from the test area to the binding area, and the multiple rows of light-emitting device groups are respectively the 1st row to the Mth row of light-emitting device groups; Both the fourth and fifth test pads are electrically connected to any one of the traces in the first row of light-emitting device groups.

13. The light-emitting substrate according to claim 12, further comprising: Two third connecting lines, one end of which is electrically connected to the fourth test pad and the other end of which is electrically connected to the wiring; the other third connecting line is electrically connected to the fifth test pad and the other end of which is electrically connected to the wiring.

14. The light-emitting substrate according to claim 13, comprising a substrate, and a first conductive layer and a second conductive layer sequentially stacked on the substrate, wherein the first conductive layer includes a first sub-ground line extending along a first direction, and the second conductive layer includes a first sub-power line extending along the first direction; the fourth test pad and the fifth test pad are located on the second conductive layer; Both the fourth test pad and the fifth test pad are located on the side of the first sub-ground wire and the first sub-power wire away from the trace. The third connection line includes at least one third connection segment located in the first conductive layer and at least one fourth connection segment located in the second conductive layer. The orthographic projection of the third connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-power line on the substrate, and the orthographic projection of the fourth connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-ground line on the substrate. In a third connection line, among at least one third connection segment and at least one fourth connection segment, the connection segment closest to the fourth test pad is the fourth connection segment, and the fourth test pad is electrically connected to the closest fourth connection segment. Of the at least one third connection segment and at least one fourth connection segment of the other third connection line, the connection segment closest to the fifth test pad is the fourth connection segment, and the fifth test pad is electrically connected to the closest fourth connection segment.

15. The light-emitting substrate according to any one of claims 1 to 4, further comprising: At least one input signal line extends along a second direction and is electrically connected to the plurality of drive circuits; The grounding wire is electrically connected to the plurality of drive circuits; At least one sixth test pad is disposed in the test area, and each sixth test pad is electrically connected to an input signal line; At least one test point is set in the light-emitting area and electrically connected to the grounding wire.

16. The light-emitting substrate according to claim 15, further comprising a bonding region, wherein the bonding region and the test region are respectively located on opposite sides of the light-emitting region along the second direction; The light-emitting substrate further includes: One end of the signal connection line is electrically connected to the sixth test pad, and the other end is electrically connected to the end of the input signal line closest to the test area.

17. The light-emitting substrate according to claim 16, comprising a substrate, and a first conductive layer and a second conductive layer sequentially stacked on the substrate, wherein the first conductive layer includes a first sub-ground line extending along a first direction, and the second conductive layer includes a first sub-power line extending along the first direction; the sixth test pad is located on the second conductive layer. The selected drive circuit is located on the side of the first sub-ground line and the first sub-power line away from the sixth test pad; The signal connection line includes at least one fifth connection segment located on the first conductive layer and at least one sixth connection segment located on the second conductive layer. The orthographic projection of the fifth connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-power line on the substrate, and the orthographic projection of the sixth connection segment on the substrate at least partially overlaps with the orthographic projection of the first sub-ground line on the substrate. Of the at least one fifth connecting segment and the at least one sixth connecting segment, the connecting segment closest to the sixth test pad is the sixth connecting segment, and the sixth test pad is electrically connected to the closest sixth connecting segment.

18. The light-emitting substrate according to claim 15, wherein, The at least one input signal line includes at least one of a power supply voltage signal line, a clock signal line, and a data signal line.

19. The light-emitting substrate according to claim 15, further comprising: Multiple cascaded signal lines are electrically connected between two adjacent drive circuits along a first direction and / or two adjacent drive circuits along a second direction. Multiple seventh test pads are disposed in the test area, and each seventh test pad is electrically connected to a cascaded signal line.

20. The light-emitting substrate according to claim 15, wherein, The grounding wire includes: The first sub-grounding wire extends along the first direction and is disposed on the side of the light-emitting area close to the test area; Multiple second sub-grounding wires extend along a second direction and are electrically connected to the first sub-grounding wire; The light-emitting substrate further includes a bonding area, the test area and the bonding area are respectively located on opposite sides of the light-emitting area along the second direction, and the first sub-grounding wire is electrically connected to one end of the plurality of second sub-grounding wires near the test area; The multiple test points are electrically connected to the first sub-grounding wire.

21. The light-emitting substrate according to claim 20, comprising a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer sequentially stacked; The first sub-grounding wire is located in the first conductive layer, and the test point is located in the second conductive layer; the test point is electrically connected to the first sub-grounding wire through a via in the first insulating layer; the second insulating layer has a first test hole exposing the test point; or... The test point is a second test hole that penetrates the first insulation layer and the second insulation layer, and the second test hole exposes the first sub-grounding wire.

22. The light-emitting substrate according to claim 20, wherein, The grounding wire also includes: Multiple connection patterns, each connection pattern is electrically connected to two adjacent second sub-grounding lines and is also electrically connected to the drive circuit; Multiple third sub-grounding wires extend along a second direction; each third sub-grounding wire is electrically connected to at least one connection pattern, and the end of the third sub-grounding wire closest to the test area is electrically connected to the first sub-grounding wire.

23. The light-emitting substrate according to any one of claims 1 to 4, comprising a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer sequentially stacked; The power line is located in the second conductive layer, and the second insulating layer has a third test hole that exposes the power line. The second conductive layer also includes multiple second sub-grounding wires, and the second insulating layer has a fourth test hole that exposes the second sub-grounding wires.

24. The light-emitting substrate according to any one of claims 1 to 4, comprising a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer sequentially stacked; The second conductive layer includes multiple output signal lines and multiple conductive test patterns; each output signal line is electrically connected to the light-emitting device group and the corresponding driving circuit, and is electrically connected to a conductive test pattern; the second insulating layer has a fifth test hole that exposes the conductive test pattern.

25. A backlight module comprising a light-emitting substrate as described in any one of claims 1 to 24.

26. A display device, comprising: Display panel; The backlight module as described in claim 25, wherein the display panel is disposed on the light-emitting side of the backlight module.

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