A reaction device with a cleaning device and its cleaning method

Abstract

The present invention belongs to the technical field of chemical production, and particularly relates to a reaction device with a cleaning device and a cleaning method thereof. A discharge port is provided at the bottom of the reaction vessel of the reaction device, and the discharge port is connected to a discharge pipe; the stirring device is arranged inside the reaction vessel along the vertical direction; the cleaning device is connected to the stirring device, and the cleaning device is located inside the discharge port and the discharge pipe. The cleaning method includes discharging the material through the discharge port and the discharge pipe in response to the completion of the reaction; cleaning the discharge port and the discharge pipe through the cleaning device. Through the discharge port and the discharge pipe, the material after the reaction can be conveniently and quickly transferred to the next container. The stirring device can fully stir the material in the reaction vessel, making the reaction more sufficient, reducing the reaction time, and reducing the formation of lumps of solid raw materials at the bottom discharge port and the discharge pipe. The cleaning device can break, scrape and sweep away the lumps of solid raw materials at the bottom discharge port and the discharge pipe.

Description

Technical Field

[0001] The present invention belongs to the technical field of chemical production, and particularly relates to a reaction device with a cleaning device and a cleaning method thereof. Background Art

[0002] In a broad sense, a reaction device is a container for physical or chemical reactions. Through the structural design and parameter configuration of the container, functions such as heating, evaporation, cooling, and mixing at low and high speeds required by the process are achieved. Reaction devices are widely used in petroleum, chemical industry, rubber, pesticides, dyes, pharmaceuticals, and food, and are pressure vessels used to complete processes such as vulcanization, nitrification, hydrogenation, alkylation, polymerization, and condensation, such as reactors, reaction kettles, decomposition kettles, polymerization kettles, etc.; the materials are generally carbon manganese steel, stainless steel, zirconium, nickel-based alloys, and other composite materials.

[0003] In the preparation process of alkyl phosphate oligomers, the present invention adds solid powdered phosphorus pentoxide to triethyl phosphate liquid for reaction. Solid materials are likely to form lumps at the bottom discharge port of the reaction container and the discharge pipeline, hindering the discharge of the discharge port of the reaction container and the cleaning of the discharge port and discharge pipeline of the reaction container. Summary of the Invention

[0004] To solve the problem that solid raw materials are likely to form lumps at the bottom discharge port of the reaction container and the discharge pipeline, hindering the discharge of the discharge port of the reaction container and the cleaning of the discharge port and discharge pipeline of the reaction container, the present invention provides a reaction device with a cleaning device.

[0005] In a first aspect, the present invention provides a reaction device with a cleaning device,

[0006] The reaction device includes a reaction container, a stirring device, and a cleaning device;

[0007] A discharge port is provided at the bottom of the reaction container, and the discharge port is connected to a discharge pipeline;

[0008] The stirring device is arranged vertically inside the reaction container, and the stirring device stirs the raw materials in the reaction container;

[0009] The cleaning device is connected to the stirring device, and the cleaning device is located inside the discharge port and the discharge pipeline.

[0010] In some embodiments, the cleaning device further includes a moving component, and the moving component is connected to the cleaning device and the stirring device;

[0011] The moving component includes: an outer rod and an inner rod;

[0012] The inner rod is arranged inside the outer rod, and the outer rod and the inner rod are axially slidably connected.

[0013] In some embodiments, the cleaning device further includes a cleaning rod and cleaning blades; the cleaning rod is connected to one end of the inner rod, the cleaning rod extends in the vertical direction, and a plurality of cleaning blades are distributed along the circumferential direction of the cleaning rod.

[0014] In some embodiments, the cleaning device further includes a first power device, and the first power device is connected to the outer rod.

[0015] In some embodiments, the reaction device further includes a material pipe; the material pipe is connected to the bottom end of the stirring device and can move vertically between a first position and a second position, and the outer diameter of the material pipe is greater than or equal to the inner diameter of the discharge port; when the material pipe is in the first position, there is a gap between the bottom of the material pipe and the bottom of the reaction vessel; when the material pipe is in the second position, the bottom of the material pipe contacts the bottom of the reaction vessel and covers the discharge port.

[0016] In some embodiments, the material pipe further includes: a second power device, which is drivingly connected to the material pipe.

[0017] In some embodiments, the reaction device further includes: a flow rate acquisition component, and the flow rate acquisition component includes one or more of the following:

[0018] A pressure sensor, disposed at the bottom of the inner wall of the reaction vessel;

[0019] A liquid level sensor, disposed on the side wall of the reaction vessel;

[0020] A weight sensor, disposed at the bottom of the outer wall of the reaction vessel.

[0021] In a second aspect, the present invention further provides a cleaning method for a reaction device having a cleaning device.

[0022] In some embodiments, the cleaning method includes:

[0023] In response to the completion of the reaction, discharging the material through the discharge port and the discharge pipe;

[0024] Cleaning the discharge port and the discharge pipe through the cleaning device.

[0025] In some embodiments, the reaction device further includes a flow rate acquisition component;

[0026] Cleaning the discharge port and the discharge pipe through the cleaning device further includes:

[0027] Obtaining a first flow rate of the material discharge through the flow rate acquisition component;

[0028] If the first flow rate is greater than or equal to the first flow rate threshold, the cleaning device does not operate;

[0029] If the first flow rate is less than the first flow rate threshold, the cleaning device operates at the discharge port and the discharge pipe.

[0030] In some embodiments, cleaning the discharge port and the discharge pipe by the cleaning device further includes:

[0031] The cleaning device operates at the discharge port and the discharge pipe, and the second flow rate of the discharged material is obtained by the flow rate acquisition component.

[0032] If the second flow rate is greater than or equal to the second flow rate threshold, stop the cleaning device from operating at the discharge port and the discharge pipe, where the second flow rate threshold is greater than or equal to the first flow rate threshold;

[0033] If the second flow rate is less than the second flow rate threshold, the cleaning device continues to operate at the discharge port and the discharge pipe.

[0034] In some embodiments, the reaction device further includes a material pipe;

[0035] The cleaning method further includes:

[0036] In response to the start of the reaction, the material pipe moves to the second position and covers the discharge port;

[0037] In response to the completion of the reaction, the material pipe moves to the first position, away from the discharge port, and a gap is formed between the bottom of the material pipe and the bottom of the reaction vessel.

[0038] To solve the problem that solid raw materials are prone to form lumps at the bottom discharge port and the discharge pipe of the reaction vessel, hindering the discharge of the discharge port of the reaction vessel and the cleaning of the discharge port and the discharge pipe of the reaction vessel, the present invention has the following advantages: The reaction device includes a reaction vessel, a stirring device, and a cleaning device.

[0039] By providing a discharge port and a discharge pipe at the bottom of the reaction vessel, after the reaction in the reaction vessel ends, the material after the reaction in the reaction vessel can be conveniently and quickly transferred to the next container through the discharge port and the discharge pipe.

[0040] By providing a stirring device in the reaction vessel, the stirring device is arranged vertically in the reaction vessel, so that the stirring device can fully stir the materials in the reaction vessel, making the contact between the materials more sufficient, making the reaction in the reaction vessel more complete, reducing the reaction time, and reducing the formation of lumps of solid raw materials at the bottom discharge port and the discharge pipe of the reaction device.

[0041] The cleaning device is arranged at the bottom of the stirring device. The cleaning device can break up, scrape off, and sweep away the lumps of solid raw materials at the bottom discharge port and the discharge pipe of the reaction vessel. By providing the cleaning device, the normal use of the reaction device is ensured, the blockage of the bottom discharge port and the discharge pipe of the reaction vessel is prevented, and at the same time, the method of cleaning the reaction device is simple and fast, which is convenient for the use of production personnel. Description of the Drawings

[0042] Figure 1 Shows a schematic diagram of a reaction device of an embodiment;

[0043] Figure 2 Shows a schematic diagram of a reaction vessel of an embodiment;

[0044] Figure 3 Shows a schematic diagram of a stirring device of an embodiment;

[0045] Figure 4 Shows a schematic diagram of a cleaning device and a material pipe of an embodiment;

[0046] Figure 5 Shows a schematic diagram of a positioning block and a positioning groove of a moving component of an embodiment;

[0047] Figure 6 Shows a schematic diagram of a flow rate acquisition component of an embodiment;

[0048] Figure 7 Shows a schematic diagram of a cleaning method flow of a reaction device with a cleaning device of an embodiment.

[0049] The corresponding relationship between the reference numerals and the component names is as follows in the table:

[0050]

[0051] Detailed implementation manners

[0052] Now, the content of the present disclosure will be described with reference to several exemplary embodiments. It should be understood that these embodiments are described only to enable those of ordinary skill in the art to better understand and thus implement the content of the present disclosure, rather than implying any limitation on the scope of the present disclosure.

[0053] As used herein, the term "comprising" and its variants are to be construed as open-ended terms meaning "including but not limited to". The term "based on" is to be construed as "at least partially based on". The term "one embodiment" and "an embodiment" are to be construed as "at least one embodiment". The term "another embodiment" is to be construed as "at least one other embodiment".

[0054] This embodiment discloses a reaction device 1 with a cleaning device:

[0055] The reaction device 1 includes a reaction vessel 2, a stirring device 3, and a cleaning device 4;

[0056] The reaction device 1 is used for containing solid raw materials and liquid raw materials to react to generate liquid products;

[0057] A discharge port 201 is provided at the bottom of the reaction vessel 2, and the discharge port 201 is connected to a discharge pipe 202. The discharge port 201 and the discharge pipe 202 are used to discharge the materials in the reaction vessel 2 from the reaction device 1.

[0058] The stirring device 3 is arranged vertically inside the reaction vessel 2. The stirring device 3 stirs the raw materials in the reaction vessel 2 to mix the solid raw materials and the liquid raw materials.

[0059] The cleaning device 4 is connected to the stirring device 3 and is located inside the discharge port 201 and the discharge pipe 202.

[0060] In this embodiment, the reaction device 1 includes a reaction vessel 2, a stirring device 3, and a cleaning device 4. In this solution, a discharge port 201 is provided at the bottom of the reaction vessel 2, and the discharge port 201 is connected to the discharge pipe 202. The reaction vessel 2 is connected to other devices through the discharge pipe 202. After the reaction in the reaction vessel 2 ends, the materials in the reaction vessel 2 after the reaction are conveniently and quickly transferred to the next container through the discharge port 201 and the discharge pipe 202. By arranging the stirring device 3 inside the reaction vessel 2, the stirring device 3 is mainly used to mix and stir the materials in the reaction vessel 2, thereby facilitating the progress of the reaction. Most of the stirring devices 3 are installed with stirring plates 302 on the stirring shaft 301, and the stirring plates 302 are driven to rotate by the stirring shaft 301 to achieve the effect of mixing and stirring. The stirring device 3 is arranged vertically inside the reaction vessel 2, and the stirring shaft 301 is connected to the top of the reaction vessel 2. The stirring device 3 can fully stir the materials in the reaction vessel 2, reduce the phenomenon of solid materials agglomerating or the phenomenon of solid materials existing in the form of large particles, and reduce the formation of lumps of solid raw materials at the bottom discharge port 201 and the discharge pipe 202 of the reaction vessel 2; make the contact between the materials more sufficient and reduce the reaction time inside the reaction device 1. The cleaning device 4 is arranged at the bottom of the stirring device 3. Through the cleaning device 4, the lumps of solid raw materials at the bottom discharge port 201 and the discharge pipe 202 of the reaction vessel 2 can be broken, scraped, and swept clean. By arranging the cleaning device 4, the normal use of the reaction device 1 is ensured, the blockage of the bottom discharge port 201 and the discharge pipe 202 of the reaction vessel 2 is prevented, and at the same time, the method of cleaning the reaction device 1 is simple and fast, which is convenient for the use of production personnel.

[0061] In some embodiments, the cleaning device 4 further includes a moving component 401, and the moving component 401 is connected to the cleaning device 4 and the stirring shaft 301 of the stirring device 3; the moving component 401 includes: an outer rod 4011 and an inner rod 4012; the inner rod 4012 is arranged inside the outer rod 4011, and the outer rod 4011 and the inner rod 4012 are axially slidably connected.

[0062] In this embodiment, the moving component 401 includes an outer rod 4011 and an inner rod 4012. The inner rod 4012 is disposed inside the outer rod 4011. The outer rod 4011 and the inner rod 4012 are axially slidably connected and non-rotatable circumferentially. The inner rod 4012 is fixedly connected with a positioning block 4013. The inner wall of the outer rod 4011 is provided with a positioning groove 4014. The positioning block 4013 is located in the positioning groove 4014, and the positioning block 4013 and the positioning groove 4014 are in clearance fit. By arranging the moving component 401 between the cleaning device 4 and the stirring device 3, and moving the moving device 401 vertically up and down, the cleaning device 4 can be moved vertically up and down. The cleaning device 4 obtains the effect of moving up and down. On the one hand, when the cleaning device 4 is not needed, the cleaning device 4 can move upward and move out of the discharge port 201 and the discharge pipe 202, preventing the cleaning device 4 from occupying the space of the discharge port 201 and the discharge pipe 202 and increasing the material discharge speed of the reaction device 1. On the other hand, the cleaning device 4 can move up and down. When the discharge port 201 and the discharge pipe 202 are caked with solid raw materials, the cleaning device 4 can move to the position where the caking is most serious for precise cleaning, increasing the cleaning effect. At the same time, the outer rod 4011 and the inner rod 4012 of the moving component 401 are non-rotatable axially. The inner rod 4012 is fixedly connected with a positioning block 4013. The inner wall of the outer rod 4011 is provided with a positioning groove 4014. The positioning block 4013 is located in the positioning groove 4014, and the positioning block 4013 and the positioning groove 4014 are in clearance fit, so that the cleaning device 4 rotates coaxially with the stirring device 3, the inner rod 4012 and the outer rod 4011 do not slip, the cleaning device 4 and the stirring device 3 rotate together, and there is no need to add a new rotating structure for the cleaning device 4, reducing the transformation difficulty and saving costs. At the same time, it is modified on the basis of the existing reaction device 1, with a lower modification cost and difficulty, which is beneficial to popularization and use.

[0063] In some embodiments, the cleaning device 4 further includes a cleaning rod 402 and cleaning blades 403. The cleaning rod 402 is connected to one end of the inner rod 4012. The cleaning rod 402 extends in the vertical direction, and a plurality of cleaning blades 403 are distributed along the circumferential direction of the cleaning rod 402. When the cleaning rod 402 rotates, the cleaning blades 403 rotate in the discharge port 201 and the discharge pipe 202.

[0064] In this embodiment, the cleaning device 4 includes a cleaning rod 402 and cleaning blades 403. The cleaning rod 402 is a straight metal rod as a whole. One end of the cleaning rod 402 is fixedly connected to the inner rod 4012 of the moving device 401. The fixed connection methods include threaded connection, hinge connection, etc. A buffer 4021 is provided between the fixed connection of the cleaning rod 402 and the inner rod 4012, which can effectively absorb part of the impact between the cleaning rod 402 and the reaction vessel 2, preventing the cleaning device 4 from being damaged due to excessive stress caused by bumping when the moving device 401 moves up and down. And there are various choices for the setting method of the buffer 4021. In this embodiment, the buffer 4021 preferably uses a spring. A plurality of cleaning blades 403 are distributed in multiple layers along the circumferential direction of the cleaning rod 402. The shapes of the cleaning blades 403 are diverse, including but not limited to blades, brushes, scrapers, etc. When the cleaning rod 402 rotates, the cleaning blades 403 rotate in the discharge port 201 and the discharge pipe 202. Through the rotation of the cleaning blades 403, the cleaning blades 403 break up or the materials driven by the cleaning blades 403 impact and break up the lumps formed at the bottom discharge port 201 of the reaction vessel 2 and the discharge pipe 202, ensuring the smoothness of the bottom discharge port 201 of the reaction vessel 2 and the discharge pipe 202 and preventing the reaction vessel 2 from being blocked.

[0065] In some embodiments, the cleaning device 4 further includes a first power device 404. The first power device 404 is connected to the outer rod 4012 and is used to drive the moving assembly 401 to perform telescopic and / or rotational movements.

[0066] In this embodiment, the first power device 404 is connected to the moving assembly 401. The first power device 404 provides power for the moving assembly 401, enabling the inner rod 4012 in the moving assembly 401 to perform telescopic movement relative to the outer rod 4011. In this embodiment, the first power device 404 for telescopic movement preferably uses a hydraulic drive motor; the first power device 404 provides power for the moving assembly 401 and can also enable the inner rod 4012 in the moving assembly 401 to perform rotational movement relative to the outer rod 4011, that is, the rotation of the inner rod 4012 drives the connected cleaning rod 402 to rotate, so that the rotation speed of the cleaning device 4 is not the same as that of the stirring device 3. The rotation speed adjustment range of the stirring device 3 is relatively small, generally 20 - 100 r / min. The rotation of the inner rod 4012 drives the connected cleaning rod 402 to rotate, which can increase the rotation speed adjustment range of the cleaning device 4, making the rotation speed of the cleaning device 4 larger or smaller, and the cleaning effect on the bottom discharge port 201 of the reaction vessel 2 and the discharge pipe 202 better, the cleaning time shorter, and the cleaning force greater. In this embodiment, the first power device 404 for rotational movement preferably uses an electromagnetic motor.

[0067] In some embodiments, the reaction device 1 further includes a material pipe 5; the material pipe 5 is connected to the bottom end of the stirring device 3 and can move vertically between a first position and a second position. The outer diameter of the material pipe 5 is greater than or equal to the inner diameter of the discharge port 201; when the material pipe 5 is in the first position, there is a gap between the bottom of the material pipe 5 and the bottom of the reaction vessel 2; when the material pipe 5 is in the second position, the bottom of the material pipe 5 contacts the bottom of the reaction vessel 2 and covers the discharge port 201.

[0068] In this embodiment, the material pipe 5 includes an outer material pipe 502 and an inner material pipe 503. The outer material pipe 502 is fixedly connected to the stirring shaft 301 of the stirring device 3, and the inner material pipe 503 can move vertically between a first position and a second position. When in the first position, the inner material pipe 503 retracts into the outer material pipe 502, which does not affect the reaction of the reaction device 1 and is also hidden for a more aesthetic appearance. When in the second position, after the inner material pipe 503 moves outwards, it covers the discharge port 201 at the bottom of the reaction vessel 2, and the outer diameter of the inner material pipe 503 is greater than or equal to the inner diameter of the discharge port 201. At the same time, there is a sealing device 504 at the bottom of the inner material pipe 503. When covering the discharge port 201, there is a good sealing effect between the inner material pipe 503 and the discharge port 201, and it can also prevent the inner material pipe 503 from being squeezed or bumped against the discharge port 201. In this embodiment, the sealing device 504 is made of flexible rubber material. When using the reaction device 1, due to its own gravity and the nature of the stirring device 3, the stirring at the bottom of the reaction device 1 is insufficient, and a large amount of solid materials often precipitate or accumulate at the bottom of the reaction device 1. Therefore, before the reaction starts or before the solid materials are put in, the inner material pipe 503 is in the second position, covering the discharge port 201 at the bottom of the reaction vessel 2, to prevent the materials from precipitating or accumulating at the discharge port 201, resulting in insufficient reaction, blockage of the discharge port 201, and other problems.

[0069] Meanwhile, the cleaning device 4 is connected inside the inner material pipe 503 of the material pipe 5. When the inner material pipe 503 is in the first position, the moving component 401 of the cleaning device 4 retracts, and the overall structure of the cleaning device 4 enters the inner material pipe 503 to prevent the cleaning device 4 from being bumped by sundries during material feeding and daily use, protect the cleaning device 4, and extend the service life of the cleaning device 4; before material discharge, when the inner material pipe 503 is in the second position, the moving component 401 of the cleaning device 4 extends, and the cleaning device 4 works to pre-clean the discharge port 201 at the bottom of the reaction vessel 2 and the discharge pipe 202, which can increase the service life of the equipment and maintain the daily cleaning of the equipment; after material discharge, it is found that solid materials form lumps at the discharge port 201 at the bottom of the reaction vessel 2 and the discharge pipe 202. At this time, the inner material pipe 503 is in the first position, the moving component 401 of the cleaning device 4 extends, and the cleaning device 4 works to clean the discharge port 201 at the bottom of the reaction vessel 2 and the discharge pipe 202. There is also a cleaning nozzle 505 inside the inner material pipe 503, which can wash and clean the cleaning device 4 after the cleaning device 4 is used to prevent material adhesion and affect the service life of the cleaning device 4.

[0070] In some embodiments, the material pipe 5 further includes: a second power device 501, which is drivingly connected to the material pipe 5.

[0071] In this embodiment, the material pipe 5 is connected to the second power device 501, and the second power device 501 provides power for the material pipe 5 to make the inner material pipe 503 inside the material pipe 5 move telescopically relative to the outer material pipe 502. In this embodiment, the second power device 501 for telescopic movement preferably uses a hydraulic drive motor. When the second power device 501 drives the screw to rotate, the inner material pipe 503 will move outward or inward.

[0072] In some embodiments, the reaction device 1 further includes: a flow rate acquisition component 6, and the flow rate acquisition component 6 includes one or more of the following:

[0073] A pressure sensor 601, which is arranged at the bottom of the inner wall of the reaction vessel 2 and is used to acquire the pressure at the bottom inside the reaction vessel 2;

[0074] A liquid level sensor 602, which is arranged on the side wall of the reaction vessel 2 and is used to acquire the liquid level inside the reaction vessel 2;

[0075] A weight sensor 603, which is arranged at the bottom of the outer wall of the reaction vessel 2 and is used to acquire the weight of the reaction device 1.

[0076] In this embodiment, the flow rate acquisition component 6 calculates the flow rate of the discharged material by acquiring the parameter changes of the reaction device 1. That is

[0077] v = m / t; v is the discharged flow rate, m is the parameter change of the reaction device 1, and t is the time.

[0078] In this embodiment, the parameters of the reaction device 1 preferably include the pressure at the bottom of the reaction device 1, the liquid level of the reaction device 1, the overall weight of the reaction device 1, etc. By changing the parameters of the reaction device 1, the material flow rate in the discharge port 201 of the reaction vessel 2 and the discharge pipe 202 is calculated to determine the state of the material flow rate. The pressure sensor 601 is located inside the reaction vessel 2 and around the bottom of the reaction vessel 2. The pressure sensor 601 detects at least one pressure of the material inside the reaction vessel 2. The pressure sensor 601 has a diaphragm, and the diaphragm can be exposed to the pressure of the material on one side and bend more or less strongly under this influence. According to the degree of bending of the diaphragm, the pressure of the reaction vessel 2 is obtained. The liquid level sensor 602 is located on the side wall of the reaction vessel 2. The liquid level sensor is preferably a magnetic flap liquid level sensor, and the magnetic flap liquid level sensor can accurately measure the change in the liquid level of the reaction vessel 2. The weight sensor 603 is located outside the reaction vessel 2. The weight sensor 603 is installed at the support point of the reaction vessel 2, and at the same time, the connecting pipeline of the reaction vessel 2 is replaced with a flexible connecting pipeline to reduce the influence of the connecting pipeline on the weight sensor. By measuring the overall weight of the reaction vessel 2, the change in the weight of the material inside the reaction vessel 2 is calculated. By calculating the flow rate of the discharged material, it is convenient to judge the state of the discharge port 201 of the reaction vessel 2 and the discharge pipe 202, providing a judgment basis for the operation of the cleaning device 4.

[0079] In a second aspect, the present invention also provides a cleaning method for a reaction device 1 having a cleaning device. The cleaning method of the reaction device 1 includes: discharging the material through the discharge port 201 and the discharge pipe 202 in response to the completion of the reaction; cleaning the discharge port 201 and the discharge pipe 202 by the cleaning device 4.

[0080] In this embodiment, the completion of the reaction in the reaction device 1 is judged by the reaction time or by detecting the reaction parameters. After the reaction is completed, the valve provided at the discharge port 201 of the reaction vessel 2 is opened. Due to gravity, the material in the reaction vessel 2 flows to the discharge port 201 provided at the bottom of the reaction vessel 2 and flows down the discharge pipe 202 to the next container. At the same time, the cleaning device 4 operates. The cleaning device 4 rotates to clean the discharge port 201 and the discharge pipe 202, preventing solid materials from forming lumps and blocking the discharge port 201 and the discharge pipe 202, which affects the discharge of the material.

[0081] In some embodiments, the reaction device 1 further includes a flow rate acquisition component 6; cleaning the discharge port 201 and the discharge pipe 202 by the cleaning device 4 further includes: acquiring a first flow rate v of the discharged material through the flow rate acquisition component 6;

[0082] If the first flow rate v is greater than or equal to the first flow rate threshold v1, the cleaning device 4 does not operate;

[0083] If the first flow rate v is less than the first flow rate threshold v1, the cleaning device 4 operates at the discharge port 201 and the discharge pipe 202.

[0084] In this embodiment, the flow rate acquisition component 6 calculates the first flow rate v of the discharged material by obtaining the parameter changes of the reaction device 1. The first flow rate threshold v1 is less than the flow rate when the material is discharged normally. In this embodiment, it is preferably 90%-95% of the flow rate when the material is discharged normally. When the calculated first flow rate v of the discharged material is greater than or equal to the first flow rate threshold v1, it indicates that the discharge port 201 and the discharge pipe 202 are unobstructed, the solid material has not formed lumps to block the discharge port 201 and the discharge pipe 202, or the influence of the lumps on the material discharge is small, so the cleaning device 4 does not need to operate; when the calculated first flow rate v of the discharged material is less than the first flow rate threshold v1, it indicates that the discharge port 201 and the discharge pipe 202 are blocked, the solid raw material forms lumps at the bottom discharge port 201 of the reaction device 1 and the discharge pipe 202, hindering the discharge of the discharge port 201 of the reaction device 1, so the cleaning device 4 starts to operate, rotates in the discharge port 201 and the discharge pipe 202, and breaks the lumps formed by the solid raw material. The flow rate acquisition component 7 obtains the first flow rate v of the discharged material, and judges whether the cleaning device 4 needs to be started based on the obtained first flow rate v, reducing the start-up times of the cleaning device 4, prolonging the service life of the cleaning device 4, and making the start-up and use of the cleaning device more reasonable and scientific.

[0085] In some embodiments, the cleaning of the discharge port 201 and the discharge pipe 202 by the cleaning device 4 further includes: the cleaning device 4 operates at the discharge port 201 and the discharge pipe 202, and the flow rate acquisition component 6 obtains the second flow rate w of the discharged material.

[0086] If the second flow rate w is greater than or equal to the second flow rate threshold v2, stop the cleaning device 4 from operating at the discharge port 201 and the discharge pipe 202, where the second flow rate threshold v2 is greater than or equal to the first flow rate threshold v1; if the second flow rate w is less than the second flow rate threshold v1, the cleaning device 4 continues to operate at the discharge port 201 and the discharge pipe 202.

[0087] In this embodiment, when the cleaning device 4 rotates during operation within the discharge port 201 and the discharge pipe 202, the flow rate acquisition component 6 continues to obtain the parameter changes of the reaction device 1, and calculates the second flow rate w of the discharged material. If the second flow rate w is greater than or equal to the second flow rate threshold v2, it indicates that the solid raw material in the discharge port 201 and the discharge pipe 202 has formed a blockage and has been cleaned, and the discharge port 201 and the discharge pipe 202 have been unclogged. Then, the rotation of the cleaning device 4 within the discharge port 201 and the discharge pipe 202 is stopped, and the operation of the cleaning device 4 is ended. If the second flow rate w is less than the second flow rate threshold v2, it indicates that the blockage formed by the solid raw material in the discharge port 201 and the discharge pipe 202 still exists, and the discharge port 201 and the discharge pipe 202 are still blocked. Then, the cleaning device 4 continues to rotate and clean within the discharge port 201 and the discharge pipe 202. By judging the second flow rate w of the reaction device 1 when the cleaning device 4 rotates within the discharge port 201 and the discharge pipe 202, the state of the discharge port 201 and the discharge pipe 202 is determined, shortening the startup time of the cleaning device 4, prolonging the service life of the cleaning device 4, and making the shutdown of the cleaning device 4 more reasonable and scientific. The second flow rate threshold v2 is greater than or equal to the first flow rate threshold v1, indicating that the cleaning device 4 will only be shut down after the flow rate has recovered to a relatively unobstructed level, ensuring the working effect of the cleaning device 4.

[0088] In some embodiments, the reaction device 1 further includes a material pipe 5; the cleaning method further includes:

[0089] In response to the start of the reaction, the material pipe 5 moves to the second position and covers the discharge port 201;

[0090] In response to the completion of the reaction, the material pipe 5 moves to the first position, away from the discharge port 201, and a gap is formed between the bottom of the material pipe 5 and the bottom of the reaction vessel 2.

[0091] In this embodiment, the reaction device 1 further includes a material pipe 5. At the start of the reaction, the material pipe 5 moves to the second position and covers the discharge port 201. By covering the discharge port 201 with the material pipe 5, the material pipe 5 covers the discharge port 201 at a position that is difficult for the stirring device 3 to stir, enabling the stirring device 3 to fully stir the material, preventing the material from precipitating or accumulating at the discharge port 201, and causing problems such as incomplete reaction and blockage of the discharge port 201. After the reaction is completed, the material pipe 5 moves to the first position, away from the discharge port 201, and a gap is formed between the bottom of the material pipe 5 and the bottom of the reaction vessel 2, allowing the material to flow out from the discharge port 201 and flow into the next container through the discharge pipe 202.

[0092] In some embodiments, the present invention provides a cleaning method for a reaction device 1 having a cleaning device:

[0093] S0: The reaction starts. The second power device 501 drives the inner material pipe 503 to move to the second position and covers the discharge port 201.

[0094] S1: The raw materials enter the reaction vessel 2, and the stirring device 3 rotates to mix the raw materials until the reaction ends.

[0095] S2: The reaction is completed. The second power device 501 drives the inner material pipe 503 to move to the first position. The material flows into the discharge port 201 and then flows into the next container through the discharge pipe 202. The flow rate acquisition component 6 acquires the flow rate of the reaction device 1.

[0096] S3: The first flow rate v is acquired by the flow rate acquisition component 6.

[0097] S4: If the first flow rate v is greater than or equal to the first flow rate threshold v1, the cleaning device 4 does not operate.

[0098] If the first flow rate v is less than the first flow rate threshold v1, the cleaning device 4 rotates and cleans inside the discharge port 201 and the discharge pipe 202.

[0099] S5: When the cleaning device 4 rotates and cleans inside the discharge port 201 and the discharge pipe 202, the flow rate acquisition component 7 acquires the second flow rate w of the reaction device 1.

[0100] S6: If the second flow rate w is greater than or equal to the second flow rate threshold v2, stop the cleaning device 4 from rotating inside the discharge port 201 and the discharge pipe 202; if the second flow rate w is less than the second flow rate threshold v2, the cleaning device 4 continues to rotate inside the discharge port 201 and the discharge pipe 202.

[0101] S7: When the material is emptied from the reaction vessel 2, the process ends.

[0102] The descriptions of the above specification and embodiments are used to explain the protection scope of the present invention, but do not constitute a limitation on the protection scope of the present invention. Through the inspiration of the present invention or the above embodiments, those of ordinary skill in the art, combining common general knowledge, ordinary technical knowledge in this field, and / or existing technologies, can obtain modifications, equivalent replacements, or other improvements to the embodiments of the present invention or some of its technical features through logical analysis, reasoning, or limited experiments, and all should be included within the protection scope of the present invention.

Claims

1. A reaction device with a cleaning device, characterized in that, The reaction device includes a reaction vessel, a stirring device, and a cleaning device; A discharge port is provided at the bottom of the reaction vessel, and the discharge port is connected to a discharge pipe; The stirring device is arranged vertically inside the reaction vessel, and the stirring device stirs the raw materials in the reaction vessel; The reaction device further includes a material pipe, which includes an outer material pipe and an inner material pipe. The outer material pipe is fixedly connected to the stirring shaft of the stirring device. The inner material pipe can move vertically between a first position and a second position. The outer diameter of the inner material pipe is greater than or equal to the inner diameter of the discharge port. When the material pipe is in the first position, the inner material pipe retracts into the outer material pipe, and there is a gap between the bottom of the material pipe and the bottom of the reaction vessel. When the material pipe is in the second position, the inner material pipe moves outwards and covers the discharge port; The cleaning device is connected inside the inner material pipe of the material pipe. When the material pipe is in the first position, the overall structure of the cleaning device enters the inner material pipe. When the material pipe is in the second position, the cleaning device extends and works to clean the discharge port and the discharge pipe; 2. The reaction device with a cleaning device according to claim 1, characterized in that: The cleaning device further includes a moving component, and the moving component is connected to the cleaning device and the stirring device; The moving component includes: an outer rod and an inner rod; The inner rod is arranged inside the outer rod, and the outer rod and the inner rod are axially slidably connected; 3. The reaction device with a cleaning device according to claim 2, characterized in that: The cleaning device further includes a cleaning rod and cleaning blades; the cleaning rod is connected to one end of the inner rod, the cleaning rod extends vertically, and a plurality of the cleaning blades are distributed along the circumferential direction of the cleaning rod; 4. A reaction device with a cleaning device according to claim 3, characterized in that: The cleaning device further includes a first power device, and the first power device is connected to the outer rod; 5. The reaction device with a cleaning device according to claim 1, characterized in that: The material pipe further includes: A second power device, which is drivingly connected to the material pipe; 6. The reaction device with a cleaning device according to claim 5, characterized in that: The reaction device further includes: a flow rate acquisition component, and the flow rate acquisition component includes one or more of the following: A pressure sensor, which is arranged at the bottom of the inner wall of the reaction vessel; A liquid level sensor, which is arranged on the side wall of the reaction vessel; A weight sensor, which is arranged at the bottom of the outer wall of the reaction vessel; 7. The reaction device with a cleaning device according to claim 1, characterized in that: The cleaning method of the reaction device with a cleaning device includes: In response to the completion of the reaction, discharging the material through the discharge port and the discharge pipe; Cleaning the discharge port and the discharge pipe through the cleaning device; 8. The reaction device with a cleaning device according to claim 7, characterized in that: The reaction device further includes a flow rate acquisition component; Cleaning the discharge port and the discharge pipe through the cleaning device further includes: Obtaining a first flow rate of the material discharge through the flow rate acquisition component; If the first flow rate is greater than or equal to a first flow rate threshold, the cleaning device does not work; If the first flow rate is less than the first flow rate threshold, the cleaning device works at the discharge port and the discharge pipe; 9. The reaction device with a cleaning device according to claim 8, characterized in that: Cleaning the discharge port and the discharge pipe through the cleaning device further includes: When the cleaning device works at the discharge port and the discharge pipe, obtaining a second flow rate of the material discharge through the flow rate acquisition component, If the second flow rate is greater than or equal to the second flow rate threshold, stop the cleaning device from working at the discharge port and the discharge pipe, where the second flow rate threshold is greater than or equal to the first flow rate threshold; If the second flow rate is less than the second flow rate threshold, the cleaning device continues to work at the discharge port and the discharge pipe.

10. The reaction device with a cleaning device according to claim 9, characterized in that: The reaction device further includes a material pipe; The cleaning method further includes: In response to the start of the reaction, the material pipe moves to a second position and covers the discharge port; In response to the completion of the reaction, the material pipe moves to a first position, away from the discharge port, and a gap is generated between the bottom of the material pipe and the bottom of the reaction vessel.

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