Copper-based metal cutting knife for cutting alumina ceramics and preparation method thereof

By using a copper-based metal cutting knife, combined with the addition of potassium oxalate, the problem of the cutting force reduction caused by the adhesion of the powder when cutting alumina ceramics is solved, achieving better cutting quality and blade life.

CN116213727BActive Publication Date: 2025-04-04SUZHOU SAIL TECH CO LTD
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Patent Information

Application Number
CN202211704374.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-29
Publication Date
2025-04-04
Estimated Expiration
2042-12-29

AI Technical Summary

Technical Problem

When existing tools cut alumina ceramics, alumina powder will adhere to the blade edge of the blade during long-distance cutting, resulting in a decrease in cutting force and affecting the cutting quality.

Method used

Copper-based metal cutting knife is prepared by cold pressing and sintering processes.

Benefits of technology

When cutting alumina ceramic, the surface of this blade is smooth, reducing the adhesion of alumina powder, maintaining a high cutting force, improving the cutting quality and the life of the blade.

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Abstract

The invention discloses a copper-based metal cutting blade for cutting alumina ceramics and a preparation method thereof. The preparation method comprises the following steps: mixing copper powder, tin powder, silver powder, potassium oxalate and diamond, and then cold pressing and sintering to obtain the copper-based metal cutting blade for cutting alumina ceramics. The invention uses copper powder as a basis, uses tin powder and silver powder as metal modifiers, and adds potassium oxalate. It is unexpectedly found that the blade prepared by the formula is used for cutting ceramic substrates with adhesive layers, and has the characteristics of good cutting quality and long service life.
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Description

Technical Field

[0001] The invention belongs to blade technology, and in particular relates to a copper-based metal cutting blade for cutting alumina ceramics and a preparation method thereof. Background Art

[0002] Alumina ceramics are a type of ceramic material with aluminum oxide (Al2O3) as the main component. They are used for thick film integrated circuits. Alumina ceramics have good conductivity, mechanical strength and high temperature resistance. At present, resin blades are mainly used to cut ceramics. The applicant previously disclosed a diamond scriber for ceramic substrate segmentation and a preparation method thereof. A mixture of diamond, epoxy resin powder, silicon carbide, aluminum oxide, titanium oxide fiber, and 4-methylbenzyl alcohol is passed through a 300-mesh sieve to obtain a molding material; the molding material is hot-pressed to obtain a hot-pressed green body; the hot-pressed green body is cured to obtain a molding; the molding is processed to obtain a diamond scriber for ceramic substrate segmentation, which can be used for ceramic substrate cutting. The applicant also disclosed a long-life resin-based cutting blade and a preparation method thereof. Diamond, resin powder, hydroxylated multi-walled carbon nanotubes, tungsten powder, and nickel powder are mixed and hot-pressed, and then cured to obtain a long-life resin-based cutting blade, which is used for cutting hard and brittle quartz glass. The applicant previously disclosed a metal-bonded ultra-thin ultra-precision cutting knife and a preparation method, which includes the following steps: mixing copper powder and tin powder, then adding cobalt powder, then adding silicon carbide, and finally adding abrasive to obtain a material; then cold pressing the material and sintering it to obtain a blank; the blank is processed to obtain a metal-bonded ultra-thin ultra-precision cutting knife for cutting CSP glass. However, the cutting knife is not suitable for cutting alumina ceramics. Alumina ceramics have a high hardness. During the cutting process of the dicing knife, a high cutting force needs to be maintained to ensure the cutting quality of alumina ceramics. During long-distance cutting, the blade edge of the existing tool will adhere to alumina powder, resulting in a decrease in cutting force and affecting the cutting quality of alumina ceramics. Summary of the invention

[0003] The invention discloses a copper-based metal cutting knife for cutting alumina ceramics and a preparation method thereof. The invention takes copper powder as a basis, uses tin powder and silver powder as metal modifiers, and adds potassium oxalate. It is unexpectedly found that the blade prepared by the formula is used for cutting ceramic substrates with adhesive layers, and has the characteristics of good cutting quality and long service life.

[0004] The present invention adopts the following technical solution:

[0005] A copper-based metal cutting blade for cutting alumina ceramics is prepared by mixing copper powder, tin powder, silver powder, potassium oxalate and diamond, and then cold pressing and sintering to obtain the copper-based metal cutting blade for cutting alumina ceramics. Preferably, conventional mechanical processing is performed after sintering to obtain the copper-based metal cutting blade for cutting alumina ceramics.

[0006] Preferably, copper powder and tin powder are first mixed, then silver powder and potassium oxalate are added and mixed, and then diamond is added and mixed to obtain a material; and then the material is heated at 3.2-5 tons / cm 2 Cold press for 5-7 seconds, then heat up from room temperature to 550-650°C at a heating rate of 40-55°C / min, keep warm for 10-30 minutes, then cool with the furnace, and then perform conventional machining to obtain a copper-based metal cutting knife for alumina ceramic cutting, such as conventional machining for inner hole and outer circle machining, and double-end face thinning machining.

[0007] In the present invention, copper powder, tin powder, silver powder and potassium oxalate constitute the metal matrix, and the mass percentage of each component is as follows:

[0008] Tin powder 20-30%

[0009] Silver powder 5-10%

[0010] Potassium oxalate 0.1-1.0%

[0011] Copper powder residue

[0012] Preferably, the mass percentage of each component is as follows:

[0013] Tin powder 22-27%

[0014] Silver powder 7-9%

[0015] Potassium oxalate 0.3-0.8%

[0016] Copper powder residue

[0017] In the present invention, the volume of the metal matrix and the diamond is 100%, the concentration of the diamond is 25%-50%, preferably 30%-40%; the particle size of the diamond is 800#-400#.

[0018] The invention discloses application of the copper-based metal cutting knife for cutting alumina ceramics in cutting alumina ceramics.

[0019] The invention discloses a method for cutting alumina ceramics by using the copper-based metal cutting knife for cutting alumina ceramics. The method comprises the following steps: fixing the alumina ceramics and then cutting the alumina ceramics by using the copper-based metal cutting knife for cutting alumina ceramics.

[0020] In the present invention, the alumina ceramic is preferably an alumina ceramic with a glue layer.

[0021] The prior art uses potassium oxalate for polishing, mainly utilizing the reactivity of potassium oxalate with the workpiece being processed. For example, an artificial stone mirror polishing abrasive and its preparation method use one or more of potassium tetraoxalate, potassium hydrogen oxalate and oxalic acid as an acidic additive, and after heating and curing, an artificial stone polishing abrasive capable of obtaining a high-gloss mirror surface is obtained. For example, a solidified abrasive polishing pad and a dry polishing method for hygroscopic KDP crystals, in which the reactant potassium oxalate in the polishing pad undergoes a solid-phase chemical reaction with the KDP crystals, and the generated transition layer is removed under the mechanical action of the abrasive particles to obtain a smooth surface. For example, a solidified abrasive polishing pad and a dry polishing method for hygroscopic crystalline lanthanum bromide, in which the potassium oxalate reactant and the lanthanum bromide crystals undergo a solid-phase chemical reaction under the action of a catalyst to generate a transition layer, which is removed under the mechanical action of the abrasive particles and the polishing pad to obtain a smooth surface. The present invention adopts a new technical idea. The addition of potassium oxalate can improve wear resistance, especially to prevent the metal binder from bonding to the ceramic material on the surface during the cutting process. At the same time, potassium oxalate does not affect the high-temperature sintering of the metal matrix. This is a technical idea different from the existing polishing that uses potassium oxalate to react with the processing object. The present invention is based on copper powder, tin powder and silver powder as metal modifiers, and potassium oxalate is added. It is unexpectedly found that the blade prepared by this formula is used for cutting ceramic substrates with glue layers, and has the characteristics of good cutting quality and long service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Photo of a good cut for the present invention.

[0023] Figure 2 This is a photo of the existing blade cutting chipping, the chipping angle is 71μm. DETAILED DESCRIPTION

[0024] Alumina ceramics have a high hardness, and a high cutting force needs to be maintained during the cutting process of the dicing knife to ensure the cutting quality of alumina ceramics. The surface quality of existing cutting tools is not as good as that of metal knives prepared by adding potassium oxalate. During long-distance cutting, the blade edge will adhere to alumina powder, resulting in a decrease in cutting force and affecting the cutting quality of alumina ceramics. The blade with potassium oxalate added has a smooth surface that can effectively reduce the adhesion of alumina powder, improve the cutting force of long-distance cutting, and improve the cutting quality. The raw materials of the present invention are all commercially available products, which meet the conventional requirements of cutting blades. The specific preparation operation and cutting processing of the present invention are conventional technologies, and the particle size of diamond is 800#-600#.

[0025] Embodiment 1 A copper-based metal cutting knife for cutting alumina ceramics, the metal-based matrix components and mass contents thereof are as follows:

[0026] Copper powder 66.5%

[0027] Tin powder 25%

[0028] Silver powder 8%

[0029] Potassium oxalate 0.5%

[0030] (1) Mixing: According to the above formula ratio, use a conventional mixer to first add copper powder and tin powder and mix for 1 hour, then add silver powder and potassium oxalate and mix for 0.5 hour, and finally add diamond and mix for 1 hour to obtain a material with a metal matrix of 1 kg, the volume of the metal matrix and diamond being 100%, and the concentration of diamond being 35%;

[0031] (2) Cold pressing: The material in step (1) is passed through a 200-mesh sieve and sieved 5 times. The material under the sieve is then pressed at room temperature and a pressure of 4 tons / cm is applied. 2 , the holding time is 6 seconds, and a cold pressed green body is obtained;

[0032] (3) Sintering: Place the cold pressed green body in step (2) together with the mold into a sintering furnace, heat up at a rate of 50°C / min, heat from room temperature to a final sintering temperature of 600°C, keep at that temperature for 30 minutes, cool down to room temperature, take out, remove burrs and set aside;

[0033] (4) Inner hole and outer circle processing: The sintered blank is placed on the tooling, the inner circle grinding feed speed is 1μm / S, the grinding machine speed is self-determined, and the outer circle grinding feed speed is 5μm / S. Process to the dimensional accuracy required by the drawing, and then use oilstone to remove the electro-machining burrs;

[0034] (5) Double-end surface thinning processing: Place the blank after inner and outer circle processing in the double-end surface thinning machine, fix the fixture, select the appropriate pressure, speed and thinning grinding wheel, and process it to the dimensional accuracy required by the drawing to obtain a 54mm (OD)X0.1mm (T)X40mm (ID) dicing knife.

[0035] In the above method, deburring and step (4) and step (5) are all conventional techniques.

[0036] The thickness of alumina ceramic material is 0.6mm, the thickness of alumina ceramic material is 0.4mm, the adhesive layer is 0.2mm, and the cutting speed is 7mm / s. The cutting depth is through cutting.

[0037] Example 1 Processing results: Cutting 100 meters, the blade has no aluminum oxide powder adhered to it, the quality is good, and there is no obvious edge collapse and corner collapse. Figure 1 .

[0038] CN114472889A discloses a metal bonded ultra-thin ultra-precision cutting knife, which is used for the same cutting process as above. When cutting 72 meters, it was found that the cutting angle was 71 μm. Figure 2 .

[0039] On the basis of Example 1, potassium oxalate is omitted and the rest remain unchanged. During the cutting process of the dicing knife, the blade will adhere to aluminum oxide powder, resulting in a decrease in the cutting force of the blade and poor cutting quality.

[0040] On the basis of Example 1, potassium oxalate was replaced with ammonium bicarbonate, and the rest remained unchanged to obtain a dicing blade. For the same cutting process as above, only 68 meters can be cut; adding bicarbonate has no significant improvement on the surface quality of the blade, and ammonium bicarbonate will volatilize carbon dioxide, ammonia and other gases at high temperature to form pores in the blade, which affects the overall density of the blade, affecting the cutting quality and life of the blade.

[0041] On the basis of Example 1, the silver powder is replaced with nickel powder, and the rest remains unchanged to obtain a dicing knife. During the cutting process, the temperature of the blade is too high, resulting in burning of the adhesive layer of the ceramic material.

[0042] Comparative Example

[0043] A copper-based metal cutting knife for cutting alumina ceramics, the metal-based matrix components and mass contents of which are as follows:

[0044] Copper powder 65.5%

[0045] Tin powder 25%

[0046] Silver powder 8%

[0047] Potassium oxalate 1.5%

[0048] The rest is the same as in Example 1, and a dicing knife is obtained. When potassium oxalate is added too much, the strength of the metal knife binder is reduced, and the cutting life of the blade is reduced, and the cutting distance is less than 80 meters.

[0049] This formula adopts a copper-based formula. By adding oxalate, the self-sharpening and chip removal capabilities of the dicing knife can be improved. At the same time, the copper binder is modified by silver powder. The addition of silver powder can improve the strength of the dicing knife and has good thermal conductivity. The dicing knife made according to the modified formula has excellent cutting quality and can replace the resin dicing knife for cutting ceramic substrates with glue layers. At the same time, it has the characteristics of a long life of a metal dicing knife.

Claims

1. A copper-based metal cutting blade for cutting alumina ceramics, wherein the preparation method comprises mixing copper powder, tin powder, silver powder, potassium oxalate and diamond, and then cold pressing and sintering to obtain a copper-based metal cutting blade for cutting alumina ceramics; the copper powder, tin powder, silver powder and potassium oxalate form a metal matrix, and the mass percentage of each component is as follows: ; The volume of the metal matrix and diamond is 100%, the concentration of diamond is 25%-50%; the particle size of the diamond is 800#-400#.

2. The copper-based metal cutting knife for cutting alumina ceramics according to claim 1, characterized in that: Copper powder, tin powder, silver powder and potassium oxalate constitute the metal matrix, and the mass percentage of each component is as follows: Tin powder 22-27% Silver powder 7-9% Potassium oxalate 0.3-0.8% Copper powder residue.

3. The copper-based metal cutting knife for cutting alumina ceramics according to claim 1, characterized in that: The concentration of diamond is 30%-40%.

4. The method for preparing the copper-based metal cutting knife for cutting alumina ceramics according to claim 1, characterized in that: Copper powder and tin powder are first mixed, then silver powder and potassium oxalate are added and mixed, and then diamond is added and mixed to obtain a material; the material is then cold pressed and then heat treated to obtain a copper-based metal cutting knife for cutting alumina ceramics.

5. The method for preparing the copper-based metal cutting knife for cutting alumina ceramics according to claim 4, characterized in that: First, copper powder and tin powder are mixed, and then silver powder and potassium oxalate are added and mixed, and then diamond is added and mixed to obtain a material; the material is then cold pressed at 3.2-5 tons / cm2 for 5-7 seconds, and then heated from room temperature to 550-650°C at a heating rate of 40-55°C / min, and kept warm for 10-30 minutes, and then cooled with the furnace to obtain a copper-based metal cutting knife for alumina ceramic cutting.

6. Use of the copper-based metal cutting knife for cutting alumina ceramics as claimed in claim 1 in cutting alumina ceramics.

Citation Information

Patent Citations

  • Metallic bond ultra-thin and ultra-fine cutting knife and preparation method thereof

    CN114472889A

  • Formula and production method of metal-diamond combined ultrathin cutting blade

    CN101862826A

  • Metal sintering ultrathin cutting knife for silicon wafer cutting and preparation method

    CN114472894A