A radiator for liquid-cooled resistor devices

Abstract

The present invention relates to the field of resistors, and specifically to a heat sink for liquid-cooled resistor-type devices, comprising a heat sink cavity, wherein the front and rear ends of the heat sink cavity are respectively fixed with a front flange, a transition duct, and a rear flange; the heat sink cavity is composed of a heat sink substrate and a cover plate; the inner wall of the heat sink substrate is fixed with a plurality of rectangular ribs horizontally from bottom to top, and both ends of the rectangular ribs are spaced apart from the inner end face of the heat sink cavity; a plurality of micro-ribs are fixed parallel to each other from bottom to top between the rectangular ribs, and a plurality of triangular wing-shaped plates for generating eddy currents are fixed horizontally between all adjacent micro-ribs; and a resistor-type device is mounted on the outer wall of the heat sink substrate. The present invention overcomes the shortcomings of traditional heat sinks for resistor-type devices, utilizes rectangular ribs, micro-ribs, and triangular wing-shaped plates to give full play to the characteristics of the coolant, enables the resistor-type device to dissipate heat efficiently, ensures its normal operation, and conforms to its development direction of high frequency, miniaturization, intelligence, and high reliability.

Description

Technical Field

[0001] The present invention relates to the field of resistors, and in particular to a radiator for liquid-cooled resistor devices. Background Art

[0002] With the continuous expansion and application of power electronics and cutting-edge railway locomotive technologies, converters, as core components of railway locomotives, are developing toward high-frequency, miniaturized, intelligent, and highly reliable resistors. To increase power density, converters often utilize planar, non-inductive power resistors. However, during normal operation, the internal temperature of these resistors remains high, making efficient heat dissipation a crucial factor in ensuring their long-term stable operation.

[0003] When using a planar non-inductive power resistor, the bottom ceramic substrate is coated with thermal grease and attached to the surface of the radiator. During operation, heat is transferred to the radiator through the thermal grease. The existing radiator uses coolant or forced air cooling to perform heat exchange to ensure the operating temperature of the resistor.

[0004] The liquid cooling method used in prior art 1 involves applying thermal grease to the ceramic substrate at the bottom of a flat, non-inductive power resistor and attaching it to the surface of a radiator. The radiator is then fixed as a separate component. Liquid flow channels are set up inside the radiator, and the inlet and outlet use quick-connect fittings. Branch pipes connect to the main cooling pipe of the converter unit. The heat absorbed by the radiator is exchanged with the flowing coolant. However, this has the following disadvantages:

[0005] 1) The radiator is large in size and heavy in weight, occupies a large space in the converter unit, and needs to be installed and fixed independently, which is not conducive to the use of the converter unit with high power density;

[0006] 2) The radiator uses a branch pipe to connect to the main cooling pipe, which is in parallel with other liquid cooling devices. Its own flow resistance affects the flow distribution of the entire liquid cooling system. The flow resistance of other branch pipes must be considered during design, otherwise a water short circuit will occur.

[0007] 3) The internal flow channel of the radiator is single, which does not give full play to the characteristics of the coolant and cannot achieve efficient heat dissipation of resistor components;

[0008] 4) The radiator's quick-plug water connector contains a rubber seal, which needs to be replaced during the inverter unit's advanced repair process. The new part has high procurement and maintenance costs. It is also difficult to remove once connected to the main cooling pipe, reducing overall serviceability.

[0009] 5) The rubber branch pipes used in the radiator have a complex installation structure, and the quick-plug water joints used for the liquid inlet and outlet are expensive, which increases the overall cost.

[0010] The forced air cooling method used in the second prior art is specifically installed as follows: the bottom ceramic substrate of the flat non-inductive power resistor is coated with thermal grease and then attached to the surface of the radiator. The radiator uses a finned air-cooled radiator, and a heat pipe with high thermal conductivity is embedded inside the radiator. Radiating fins are arranged vertically on one side of the radiator. During installation, the radiator surface (the side with the radiating fins) is attached to the outer surface of the independent air duct, and the radiating fins on its surface are completely extended into the independent air duct. A cooling fan is arranged at the top / bottom of the independent air duct to drive the air in the air duct to exchange heat with the radiating fins. The fins increase the heat exchange area between the radiator and the primary cooling air in the air duct, thereby achieving the purpose of cooling resistor devices. However, there are the following disadvantages:

[0011] 1) The air-cooled finned radiator is large in size and heavy in weight, occupies a large space in the converter unit, and requires an independent air duct for cooling, which is not conducive to its use in locomotive converter units with high power density;

[0012] 2) The air-cooled finned radiator is installed in the converter and is difficult to disassemble. The radiator base plate must be installed on the duct wall with high flatness, and its sealing performance cannot be guaranteed to be optimal during maintenance.

[0013] 3) The heat pipes are buried inside the radiator, and the overall size of the radiator is large, which leads to increased procurement costs;

[0014] 4) After the converter is arranged with an independent air duct, a cooling fan needs to be added, which increases the space occupied and the cost. Summary of the Invention

[0015] The present invention takes ensuring the working reliability of resistors as its starting point. In order to solve the problems that the radiators in the prior art are not adapted to the development direction of miniaturization and intelligence, and to ensure its efficient heat dissipation, a radiator suitable for liquid-cooled resistor-type devices in converter devices is proposed.

[0016] The present invention is realized by the following technical solutions: a heat sink for liquid-cooled resistor devices, comprising a heat dissipation cavity, a front flange fixed at the front inlet of the heat dissipation cavity, a transition duct fixed at the rear outlet of the heat dissipation cavity, and a rear flange fixed at the end of the transition duct; the heat dissipation cavity is composed of a heat dissipation substrate and a cover plate; a plurality of rectangular ribs are fixed on the inner side wall of the heat dissipation substrate from bottom to top in parallel, and there is a gap between the two ends of the rectangular ribs and the front and rear end surfaces of the inner cavity of the heat dissipation cavity, and the rectangular ribs are arranged horizontally; the inner side wall of the heat dissipation substrate is located between adjacent rectangular A plurality of micro-ribs are fixed in parallel from bottom to top between the ribs, and a plurality of micro-ribs are also fixed in parallel on the inner side wall of the heat dissipation substrate of the uppermost rectangular rib from bottom to top. Similarly, a plurality of micro-ribs are also fixed in parallel on the inner side wall of the heat dissipation substrate of the lowermost rectangular rib from bottom to top, and the micro-ribs are parallel to the rectangular ribs; a plurality of triangular wing-shaped plates for generating eddy currents are fixed horizontally between all adjacent micro-ribs; a plurality of reserved holes for installing resistor-type devices are provided on the outer side wall of the heat dissipation substrate, and the heat dissipation cavity is sealed and fixed on the main cooling pipeline through the front end flange and the rear end flange (the structure is described as follows Figure 1 The reference direction is the usage state of the radiator, such as Figure 5 、 Figure 6 shown).

[0017] During actual operation, the cooling liquid (the cooling liquid can be a mixed liquid or a single liquid with good heat dissipation performance such as water and ethylene glycol) enters the heat dissipation cavity from the front flange, and the resistor components are fixed on the radiator (outer wall of the heat dissipation substrate) through the reserved holes to achieve fixed installation of the resistor components. Rectangular ribs, micro ribs and triangular wing plates are provided on the inner side of the heat dissipation substrate to further exert the effect of the coolant and maximize the heat dissipation of the resistor components. Diverted by the multiple rectangular ribs within the heat dissipation cavity, the liquid flows into multiple channels, increasing the heat exchange area between the cooling liquid and the heat dissipation substrate. Micro-ribs are positioned between adjacent rectangular ribs and between the rectangular ribs and the inner wall of the heat dissipation cavity. The micro-channels formed by the micro-ribs further increase the heat exchange area between the cooling liquid and the heat dissipation substrate. Triangular airfoils are placed within the micro-rib channels. These not only redirect the flow direction of the liquid within the channels but also effectively enhance the heat exchange between the micro-ribs and the fluid within the channels. The enhanced heat exchange mechanism is as follows: First, the triangular airfoils between the micro-ribs expand the contact area between the micro-ribs and the liquid, thereby enhancing the heat exchange performance between the micro-ribs and the fluid. Second, the triangular airfoils between the micro-ribs effectively disrupt the flow and thermal boundary layers on the micro-rib surfaces in this area, thereby enhancing the heat exchange capacity between the micro-ribs and the fluid. Finally, the cooling liquid enters the transition duct at the rear end of the heat dissipation cavity and exits through the rear flange. The radiator is fixed to the main cooling pipeline through the front flange and the rear flange. Compared with the traditional resistance radiator, it does not divide the pipeline flow and does not affect the heat dissipation of the branch pipeline; and no longer uses quick-plug water joints as the connection medium for liquid inlet and outlet, reducing the overall design cost.

[0018] Further preferably, the width of the rectangular rib is 0.8-1 times the width of the inner cavity of the heat dissipation cavity. When the width of the rectangular rib is 1 times the width of the inner cavity of the heat dissipation cavity, the other side of the rectangular rib is in seamless contact with the inner wall of the cover body; when the width of the rectangular rib is 0.8 times the width of the inner cavity of the heat dissipation cavity, there is a gap between the other side of the rectangular rib and the inner wall of the cover body.

[0019] More preferably, the width of the micro-rib is 0.1-0.3 times the width of the rectangular rib. The micro-rib only protrudes a portion from the inner side of the heat dissipation substrate, which adapts to the development trend of miniaturization.

[0020] Furthermore, preferably, the rectangular ribs and the micro-ribs have the same length, which is 0.7-0.9 times the inner length of the heat dissipation cavity. The channels and micro-channels have the same length, maximizing the heat exchange area between the cooling liquid and the heat dissipation substrate, adapting to its development direction.

[0021] Specifically, there are five rectangular ribs arranged, and the rectangular ribs divide the heat dissipation cavity into six channels.

[0022] Further preferably, the triangular airfoil is a right-angled triangular plate, with the right-angled surface facing the incoming flow. The vertical surface of the triangular airfoil arranged in the microchannel serves as the incoming flow surface, which changes the flow state of the liquid and generates longitudinal vortices in the incoming flow direction. These longitudinal vortices scour the surface of the heat dissipation cavity, further enhancing the liquid's heat exchange capacity. The trailing vortex zone, formed by the inclined surface of the triangular airfoil, eliminates the dead vortex zone caused by the vortex generator.

[0023] Further preferably, TIG welding is employed between the front flange, heat sink substrate, cover plate, transition duct, and rear flange. The entire plate is made of aluminum and welded using TIG (tungsten inert gas welding). The integrated design facilitates quick and easy installation, significantly improving the radiator's serviceability and maintainability. Those skilled in the art will appreciate that tungsten inert gas welding uses a tungsten rod as an electrode and argon gas for shielding. During welding, argon gas is continuously ejected from the nozzle of the welding gun, forming a protective layer around the arc to isolate the air and prevent oxidation of the tungsten electrode, the molten pool, and the adjacent heat-affected zone, thereby producing a high-quality weld. Filler wire may or may not be added during welding, depending on the specific requirements of the workpiece.

[0024] Further preferably, a sealing gasket is provided when the front flange and the rear flange are connected to the main cooling pipeline to improve the sealing performance between the pipelines.

[0025] Preferably, a bracket is provided on the top of the heat dissipation cavity, and the radiator is fixed to the cabinet via the bracket. Threaded holes are added according to the specific conditions within the cabinet to achieve direct mechanical connection with the cabinet. Compared to traditional resistor radiators, this direct mechanical connection to the cabinet further enhances the mechanical strength of the entire radiator, preventing the adverse effects of impact and vibration caused by the train during movement.

[0026] The present invention provides a heat sink for liquid-cooled resistor devices, which has the following advantages:

[0027] 1. The design of rectangular ribs and micro ribs increases the heat exchange area between the liquid and the radiator, thereby improving the heat dissipation efficiency;

[0028] 2. The triangular wing plate arranged in the micro-rib channel increases the contact area between the micro-rib and the liquid, and also enhances the vortex ability of the liquid in the micro-rib channel, improving the heat dissipation efficiency. The micro-channel and triangular wing plate structure fully utilizes the characteristics of the coolant;

[0029] 2. When installed, it is connected in series as part of the main cooling pipeline, does not take away the pipeline flow, and does not affect the heat dissipation of the branch pipeline;

[0030] 3. Small design size, light weight, easy to design layout and convenient installation and maintenance;

[0031] 4. Combine part of the main pipe with the radiator to save materials and reduce costs;

[0032] 5. Flange connection is used, which has low cost, convenient and quick installation, and improved repairability and maintainability. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 It is a front view of the present invention;

[0035] Figure 2 is an axial cross-sectional view of the present invention;

[0036] Figure 3 It is a partial enlarged schematic diagram of the present invention;

[0037] Figure 4 Schematic diagram of the direction of fluid movement at the delta wing plate of the inner delta wing of the present invention;

[0038] Figure 5 This is a schematic diagram of the actual installation structure of the present invention;

[0039] Figure 6 This is a schematic diagram of the water flow direction of the actual installation structure of the present invention;

[0040] Figure 7 It is an axial cross-sectional line diagram of the present invention;

[0041] Figure 8 It is a sectional perspective view of the present invention.

[0042] In the figure: 1-heat dissipation cavity; 2-heat dissipation substrate; 3-cover plate; 4-rectangular rib; 5-micro rib; 6-triangular wing plate; 7-front flange; 8-transition pipe; 9-rear flange; 10-main cooling pipe; 11-bracket; 12-resistance device. DETAILED DESCRIPTION

[0043] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "horizontal", "vertical", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the systems or components referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the present invention. The terms "first" and "second" are only used for descriptive purposes and should not be understood as indicating or implying relative importance. In addition, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrally connected; they can be mechanically connected or electrically connected; they can be directly connected or indirectly connected through an intermediate medium, or they can be internal communication between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] like Figure 1-8 As shown, the present invention provides an embodiment of a heat sink for liquid-cooled resistor devices, comprising a heat dissipation cavity 1, a front flange 7 fixedly provided at the front inlet of the heat dissipation cavity 1, a transition duct 8 fixedly provided at the rear outlet of the heat dissipation cavity 1, and a rear flange 9 fixedly provided at the end of the transition duct 8; the heat dissipation cavity 1 is composed of a heat dissipation substrate 2 and a cover plate 3 (the heat dissipation substrate 2 and the cover plate 3 are actually formed as one piece to enhance their structural strength); five rectangular ribs 4 are fixedly provided on the inner side wall of the heat dissipation substrate 2 from bottom to top in parallel (such as Figure 2 As shown in FIG), there is a gap between the two ends of the rectangular rib 4 and the front and rear end surfaces of the inner cavity of the heat dissipation cavity 1, and the rectangular rib 4 is arranged horizontally (the actual width of the rectangular rib 4 is equal to the width of the inner cavity of the heat dissipation cavity 1, that is, the other side of the rectangular rib 4 is in contact with the inner wall of the cover 3; as shown in FIG. Figure 3 As shown, the rectangular ribs 4 and the micro-ribs 5 have the same length, which is 0.8 times the inner cavity length of the heat dissipation cavity 1); the inner wall of the heat dissipation substrate 2 is located between adjacent rectangular ribs 4 and is fixed with a plurality of micro-ribs 5 in parallel from bottom to top. The inner wall of the heat dissipation substrate 2 located at the top rectangular rib 4 is also fixed with a plurality of micro-ribs 5 in parallel from bottom to top. Similarly, the inner wall of the heat dissipation substrate 2 located at the bottom rectangular rib 4 is also fixed with a plurality of micro-ribs 5 in parallel from bottom to top; the micro-ribs 5 are parallel to the rectangular ribs 4; a plurality of triangular wing plates 6 for generating eddy currents are fixed horizontally between all adjacent micro-ribs 5 (actually, a plurality of slots are fixed between the micro-ribs 5, and the triangular wing plates 6 are installed in the slots); a plurality of reserved holes for fixing resistor-type devices 12 are provided on the outer wall of the heat dissipation substrate 2, and the heat dissipation cavity 1 is sealed and fixed on the main cooling pipeline 10 through the front flange 7 and the rear flange 9. As shown Figure 4As shown, the triangular wing plate 6 is a right-angled triangular plate, and the right-angled surface is set toward the upstream surface. In fact, TIG welding is adopted between the front flange 7, the heat dissipation substrate 2, the cover plate 3, the transition duct 8 and the rear flange 9; a sealing gasket is provided when the front flange 7, the rear flange 9 and the main cooling pipe 10 are connected; a bracket 11 is fixed on the top of the heat dissipation cavity 1 (as shown in FIG. Figure 5 As shown, the radiator is fixed to the cabinet through the bracket 11).

[0045] During actual operation, first, the front end flange 7 and the rear end flange 9 at both ends of the heat dissipation cavity 1 are installed on the main cooling pipe 10 by bolts to realize their mechanical connection, and a sealing gasket is used to ensure the reliability of the seal between the front end flange 7, the rear end flange 9 and the main cooling pipe 10; then the resistor device 12 is installed, and during installation, thermal conductive silicone grease is applied to the ceramic substrate at the bottom of the resistor device 12, and then it is attached to the outer wall of the heat dissipation substrate 2, that is, the heat dissipation surface, and the inner wall thereof is arranged with rectangular ribs 4, micro ribs 5 and triangular wing plates 6, and a bolt group is used to realize the mechanical connection of the resistor device 12; the liquid in the main cooling pipe 10 flows into the heat dissipation cavity 1, and is diverted to six channels formed by the five rectangular ribs 4. Under the action of the micro ribs 5 and the triangular wing plates 6 arranged in the channels, the role of the cooling liquid is fully exerted, and the resistor device 12 is effectively and efficiently heat-exchanged, so that the resistor device 12 can operate normally.

[0046] Those skilled in the art will appreciate that the triangular airfoil 6 plays an important role in inducing multiple longitudinal vortices during liquid flow, thereby effectively disrupting and reducing the thickness of the thermal boundary layer. Furthermore, any slight change in parameters such as the shape, position, and angle of attack of the triangular airfoil 6 will produce a different flow field. The present invention employs a right-angled triangular airfoil.

[0047] The present invention adopts a triangular wing plate 6 that generates eddy currents, and utilizes it to change the flow direction of the fluid, effectively enhancing the heat exchange effect between the micro-ribs 5 in the channel and the fluid, overcoming the shortcomings of the traditional heat dissipation device of the resistor-type device 12. The heat dissipation cavity 1 is designed by a new method and a new process to meet the high-frequency, miniaturization, intelligence and high-reliability development of the resistor-type device 12. The micro-ribs 5 (microchannels) + triangular wing plate 6 structure arranged in the flow channel inside the heat dissipation cavity 1 enhances the heat exchange performance between the radiator and the liquid, and realizes efficient and reliable heat dissipation of the resistor-type device 12; the overall radiator adopts a small-size, integrated design, which reduces the weight of the radiator and improves the maintainability of the resistor-type device 12.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat sink for liquid-cooled resistor devices, characterized by: The invention comprises a heat dissipation cavity (1), wherein a front flange (7) is fixedly provided at the front inlet of the heat dissipation cavity (1), a transition duct (8) is fixedly provided at the rear outlet of the heat dissipation cavity (1), and a rear flange (9) is fixedly provided at the end of the transition duct (8); the heat dissipation cavity (1) is composed of a heat dissipation substrate (2) and a cover plate (3); a plurality of rectangular ribs (4) are fixedly provided on the inner side wall of the heat dissipation substrate (2) from bottom to top in parallel, and there is a gap between the two ends of the rectangular ribs (4) and the front and rear end surfaces of the inner cavity of the heat dissipation cavity (1), and the rectangular ribs (4) are arranged horizontally; a plurality of rectangular ribs (4) are fixedly provided on the inner side wall of the heat dissipation substrate (2) from bottom to top in parallel, and the plurality of rectangular ribs (4) are fixedly provided on the inner side wall of the heat dissipation substrate (2) between adjacent rectangular ribs (4) The micro-ribs (5) are also provided on the inner side wall of the heat dissipation substrate (2) located at the uppermost rectangular rib (4) in parallel from bottom to top. Similarly, the inner side wall of the heat dissipation substrate (2) located at the lowermost rectangular rib (4) is also provided with a plurality of micro-ribs (5) in parallel from bottom to top. The micro-ribs (5) are parallel to the rectangular ribs (4). A plurality of triangular wing plates (6) for generating eddy currents are horizontally provided between all adjacent micro-ribs (5). The outer side wall of the heat dissipation substrate (2) is provided with a plurality of reserved holes for installing resistor-type devices (12). The heat dissipation cavity (1) is sealed and fixed on the main cooling pipeline (10) through the front flange (7) and the rear flange (9). The width of the rectangular rib (4) is 0.8-1 times the inner width of the heat dissipation cavity (1); The width of the micro-rib (5) is 0.1-0.3 times the width of the rectangular rib (4); The rectangular ribs (4) and the micro-ribs (5) have the same length, which is 0.7-0.9 times the inner cavity length of the heat dissipation cavity (1).

2. The heat sink for liquid-cooled resistor devices according to claim 1, characterized in that: The number of the rectangular ribs (4) arranged is five.

3. The heat sink for liquid-cooled resistor devices according to claim 1, characterized in that: The triangular wing plate (6) is a right-angled triangular plate, and the right-angled surface is arranged toward the oncoming surface.

4. The heat sink for liquid-cooled resistor devices according to claim 1, characterized in that: The front end flange (7), the heat dissipation substrate (2), the cover plate (3), the transition duct (8) and the rear end flange (9) are connected by TIG welding.

5. The heat sink for liquid-cooled resistor devices according to claim 1, characterized in that: When the front end flange (7) and the rear end flange (9) are connected to the main cooling pipeline (10), a sealing gasket is provided.

6. A heat sink for liquid-cooled resistor devices according to any one of claims 1 to 5, characterized in that: A bracket (11) is fixedly provided on the top of the heat dissipation cavity (1).

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