Electrical contact radio frequency testing device

Abstract

The application discloses an electronic contact radio frequency testing device, which comprises a first substrate, a second substrate, an electronic contact to be tested and at least one grounded electronic contact. The first substrate is provided with a first testing path with a first contact pad and a first reference ground, the second substrate is provided with a second testing path with a second contact pad and a second reference ground, the electronic contact to be tested is mounted on the first contact pad, and the grounded electronic contact is mounted on the first reference ground. When the electronic contact to be tested is in a testing state, the first testing path and the second testing path are electrically connected through the electronic contact to be tested to form a signal path of a radio frequency testing loop, and the first reference ground and the second reference ground are electrically connected through the grounded electronic contact to form a reference ground. Compared with the prior art, the electronic contact can be tested in radio frequency without being connected with a mainboard, the structure is simple, the testing process is simple and efficient, and the radio frequency performance of the electronic contact can be accurately obtained.

Description

Technical Field

[0001] This invention relates to the field of radio frequency performance testing technology, and in particular to a radio frequency testing device for electronic contacts. Background Technology

[0002] Electronic contacts, as connecting components in radio frequency (RF) (also known as "high frequency") transmission channels, are widely used in electronic devices or terminals. Examples include spring contacts (or contactors) connecting the motherboard and antenna module of a mobile phone, and Pogo pin connectors (also known as spring pin connectors) used for signal connections between different circuit boards. As transmission channels for RF (or high frequency) signals, their RF performance parameters, such as voltage standing wave ratio (VSWR) and insertion loss, are often considered when selecting electronic contacts.

[0003] Current methods for testing the RF performance of electronic contacts typically involve soldering the contacts onto a motherboard and connecting an antenna to test their RF performance. This system-based testing approach, which tests within the overall RF environment, cannot accurately obtain the RF performance specifications of the electronic contacts themselves. Therefore, there is an urgent need for a device capable of performing RF testing on electronic contacts independently. Summary of the Invention

[0004] This application provides an electronic contact radio frequency (RF) testing device that can perform RF testing on electronic contacts independently, and the obtained RF performance test results of electronic contacts are more accurate.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] An electronic contact radio frequency testing device, comprising:

[0007] The first substrate has a first test path having a first pad and a first reference ground;

[0008] The second substrate is provided with a second test path and a second reference ground having a second pad;

[0009] The electronic contact under test has a first contact point that is flexible and movable for electrical contact connection. The electronic contact under test is mounted on the first contact pad and is used to electrically connect the first test path and the second test path to form a signal path of radio frequency test circuit.

[0010] and at least one grounding electronic contact having a second contact point that is resiliently movable for electrical contact connection, the grounding electronic contact being mounted on the first reference ground and located beside the first pad for electrically connecting the first reference ground and the second reference ground to the reference ground of the signal path that forms an RF test loop;

[0011] When the electronic contact under test is in the test state, both the grounding electronic contact and the electronic contact under test are in the pressed state and have the same height after being pressed.

[0012] Preferably, there are two grounding electronic contacts, which are symmetrically mounted on the first reference ground about the first pad, so that the entire area where the grounding electronic contacts and the electronic contacts under test are electrically connected to the first substrate and the second substrate respectively forms an impedance matching region.

[0013] Preferably, the first substrate is further provided with a test calibration path, and a first insulating strip is provided between the first test path and the first reference ground and between the test calibration path and the first reference ground; a second insulating strip is provided between the second test path and the second reference ground.

[0014] Preferably, the grounding electronic contact is a spring structure, and the length of the spring structure in its natural state is not less than the height of the electronic contact under test after being pressed during testing.

[0015] Preferably, the grounding electronic contact is a spring-loaded structure, and the height of the spring-loaded structure in its natural state is not less than the height of the electronic contact under test after being pressed during testing.

[0016] Preferably, the grounding electronic contact has the same structure as the electronic contact under test.

[0017] Preferably, the first substrate has a notch structure, and the end of the first test path is located on the sidewall of the notch structure.

[0018] Preferably, it further includes a substrate fixing frame, the substrate fixing frame including a first fixing mechanism for fixing the first substrate and a second fixing mechanism for fixing the second substrate;

[0019] The substrate holder further includes a first adjustment mechanism, which is connected to the first fixing mechanism or the second fixing mechanism, and is used to adjust the distance between the first substrate and the second substrate in a first direction.

[0020] Preferably, the substrate holder further includes a scale structure for observing the adjustment distance of the first adjustment mechanism along the first direction; or,

[0021] It also includes a standard gauge block, which is movably disposed between the first substrate and the second substrate, for quantitatively measuring the height of the electronic contact mounted on the first substrate in the test state.

[0022] Preferably, the substrate holder further includes a second adjustment mechanism, which is connected to the first fixing mechanism or the second fixing mechanism, and is used to adjust the distance between the first substrate and the second substrate in a second direction, wherein the first direction and the second direction are perpendicular to each other.

[0023] The beneficial effects of this invention are as follows: A first substrate and a second substrate are provided. The first substrate has a first test path with a first pad and a first reference ground. The second substrate has a second test path with a second pad and a second reference ground. The electronic contact under test (DUT) is mounted on the first pad, and the grounded electronic contact is mounted on the first reference ground. When the DUT is in a test state, the first and second test paths are electrically connected through the DUT to form a signal path for an RF test circuit. The first and second reference grounds are electrically connected through the grounded electronic contact to form a reference ground for the signal path of the RF test circuit. Together, they form a complete RF test channel. RF testing can be performed without connecting the DUT to the motherboard. The testing process is simple and efficient, and the RF performance of the electronic contact can be accurately obtained. Furthermore, both the grounded electronic contact and the DUT are in a pressed state with the same height after pressing. This not only ensures the stability of the electrical contact between the first and second test paths and between the first and second reference grounds, but also helps to ensure a fixed test height for the DUT, thereby improving the accuracy of the test results. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the radio frequency testing device for electronic contacts in an embodiment of the present invention;

[0025] Figure 2 This is an exploded view of the structure of the radio frequency testing device for electronic contacts in an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of the first substrate in an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the structure of the second substrate in an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the first substrate and the second substrate in an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the installation of the grounding electronic contact and the electronic contact under test in an embodiment of the present invention.

[0030] Figure 7A This is an architectural block diagram showing the connection state during calibration according to the present invention.

[0031] Figure 7B This is an architecture block diagram showing the connection state during testing of this invention.

[0032] Reference numerals: 100, substrate holder; 110, first adjustment mechanism; 120, first fixing mechanism; 130, second fixing mechanism; 140, second adjustment mechanism; 150, scale structure; 200, first substrate; 210, first test path; 211, first pad; 220, test calibration path; 230, test connector; 231, first connector; 232, second connector; 233, third connector; 240, first insulating tape; 250, first reference ground; 300, second substrate; 310, second test path; 311, second pad; 320, fourth connector; 330, second insulating tape; 340, second reference ground; 400, grounding electronic contact; 410, second contact point; 500, electronic contact under test; 510, first contact point; CA, test cable; T, test instrument. Detailed Implementation

[0033] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0034] This application provides an electronic contact radio frequency testing device, which solves the technical problem in the prior art that there is no device for separately testing the radio frequency performance of electronic contacts, and therefore the radio frequency performance of electronic contacts cannot be accurately obtained.

[0035] like Figures 1 to 6 The illustration shows an embodiment of this application: an electronic contact radio frequency testing device, comprising a first substrate 200, a second substrate 300, an electronic contact under test 500, and at least one grounded electronic contact 400. The first substrate 200 has a first test path 210 and a first reference ground 250, and a first pad 211 is disposed on the first test path 210; the second substrate 300 has a second test path 310 and a second reference ground 340, and a second pad 311 is disposed on the second test path 310. It should be noted that the first substrate 200 and the second substrate 300 can move relative to each other; specifically, at least one of the first substrate 200 and the second substrate 300 can move under the action of an external force.

[0036] The electronic contact 500 under test has a first contact point 510 that is elastically movable and used for electrical contact connection, and the electronic contact 500 under test is mounted on the first pad 211; the grounding electronic contact 400 has a second contact point 510 that is elastically movable and used for electrical contact connection, and the grounding electronic contact 400 is mounted on the first reference ground 250 and located beside the first pad 211.

[0037] When the electronic contact 500 under test is in the test state, the first contact point 510 and the second contact pad 311 are electrically connected so that the first test path 210 and the second test path 310 form a signal path of the radio frequency test circuit; the second contact pad 410 and the second reference ground 340 are electrically connected so that the first reference ground 250 and the second reference ground 340 are electrically connected to form the reference ground of the signal path of the radio frequency test circuit; and the electronic contact 500 under test and the grounded electronic contact 400 are both in the pressed state, and the height after pressing is the same. This can ensure the stability of the electrical contact between the first test path 210 and the second test path 310 and the first reference ground 250 and the second reference ground 340, and also helps to ensure that the test height of the electronic contact 500 under test is fixed.

[0038] To address the technical problem in existing technologies where there is no separate device for testing the RF performance of electronic contacts, thus hindering accurate RF performance measurement, this application constructs a first substrate and a second substrate. The first substrate has a first test path with a first pad and a first reference ground. The second substrate has a second test path with a second pad and a second reference ground. The electronic contact under test (DUT) is mounted on the first pad, and the grounded electronic contact is mounted on the first reference ground. When the DUT is under test, the first and second test paths are electrically connected through the DUT to form the signal path of the RF test loop. The first and second reference grounds are electrically connected through the grounded electronic contact to form the reference ground of the signal path of the RF test loop. Together, they form a complete RF test channel. RF testing can be performed without connecting the DUT to the motherboard, making the testing process simple, efficient, and accurate in obtaining the RF performance of the electronic contacts. Furthermore, both the grounding electronic contact and the electronic contact under test are in a pressed state and have the same height after being pressed. This not only ensures the stability of the electrical contact between the first test path and the second test path, as well as between the first reference ground and the second reference ground, but also helps to ensure that the test height of the electronic contact under test is fixed, thereby improving the accuracy of the test results.

[0039] Preferably, there are two grounding electronic contacts 400, which are symmetrically mounted on the first reference ground 250 about the first pad 211, so that the entire area where the grounding electronic contacts 400 and the electronic contact under test 500 are electrically connected to the first substrate 200 and the second substrate 300 respectively forms an impedance matching region. When the electronic contact under test 500 is in the test state, the grounding electronic contacts 400 are located on both sides of the first test path 210 and the second test path 310 respectively, maximizing the area of ​​the first reference ground 250 and the second reference ground 340 that are electrically connected to each other, ensuring that the entire test area forms an impedance matching region, thereby improving the accuracy of the test results.

[0040] Preferably, the first substrate 200 is further provided with a test calibration path 220, and a first insulating strip 240 is provided between the first test path 210 and the first reference ground 250 and between the test calibration path 220 and the second reference ground, and a second insulating strip 330 is provided between the second test path 310 and the second reference ground 340.

[0041] Preferably, the grounding electronic contact 400 is a spring structure, and the length of the spring structure in its natural state is not less than the height of the electronic contact 500 under test after being pressed during testing. That is, when the electronic contact 500 under test is in the test state and is in the pressed state, the grounding electronic contact 400 with the spring structure is also in the pressed state, ensuring the stability of the electrical contact between the first reference ground 250 and the second reference ground 340, forming a complete channel for radio frequency testing, and also helping to ensure the consistency of the pressing height during the testing process, thereby improving the accuracy of the test.

[0042] Preferably, the grounding electronic contact 400 is a spring-loaded structure, and the height of the spring-loaded structure is not less than the height of the electronic contact 500 under test after being pressed during testing. That is, when the electronic contact 500 under test is in the test state and is in the pressed state, the grounding elastic element 400 of the spring-loaded structure is also in the pressed state, ensuring the stability of the electrical contact between the first reference ground 250 and the second reference ground 340, forming a complete channel for radio frequency testing, and also helping to ensure the consistency of the pressing height during the testing process, thereby improving the accuracy of the test.

[0043] Preferably, the grounding electronic contact 400 has the same structure as the electronic contact 500 under test. The grounding electronic contact 400 is selected to be the same model as the electronic contact 500 under test. The grounding electronic contact 400 and the electronic contact 500 under test are pressed synchronously and have the same elasticity, resulting in more accurate and reliable test results. For the specific selection of the structure of the grounding electronic contact 400, one can also refer to the grounding electronic contacts in the actual application environment of the electronic contact 500 under test, selecting grounding electronic contacts with the same or similar structure as those in its application environment for testing. The test results can be directly used to evaluate whether the electronic contact under test meets the actual application requirements without further processing.

[0044] Preferably, the first substrate 200 has a notch structure, the end of the first test passage 210 is located on the sidewall of the notch structure, and the electronic contact 500 to be tested is fixed to one end of the first test passage 210 near the notch structure. Figures 3 to 6 As shown, the first test path 210 is set in the part of the first substrate 200 corresponding to the notch structure. When the electronic contact 500 under test is in the test state, the second substrate 300 is above the notch structure. More specifically, the first substrate 200 and the second substrate 300 can be prepared by cutting and processing a single sheet of material, which not only saves materials but also helps to save test space.

[0045] Preferably, the electronic contact radio frequency testing apparatus further includes a substrate holder 100, which includes a first fixing mechanism 120 for fixing a first substrate 200 and a second fixing mechanism 130 for fixing a second substrate 300. The substrate holder 100 also includes a first adjustment mechanism 110, which is connected to either the first fixing mechanism 120 or the second fixing mechanism 130, and is used to adjust the distance between the first substrate 200 and the second substrate 300 in a first direction. It should be noted that, generally, the first substrate 200 and the second substrate 300 are arranged opposite to each other, and the first direction refers to the direction in which the second substrate 300 moves closer to or further away from the first substrate 200. For example, the first adjustment mechanism 110 is connected to the second fixing mechanism 130, and adjusting the first adjustment mechanism 110 causes the second fixing mechanism 130 and the second substrate 300 fixed on the second fixing mechanism 130 to move closer to or further away from the first substrate 200.

[0046] The height of the electronic contact under test after being pressed during testing has a certain impact on its radio frequency test results. Preferably, the substrate holder 100 further includes a scale structure 150, which is used to observe the adjustment distance of the first adjustment mechanism 110 along a first direction. For example, as... Figure 1 and Figure 2As shown, the first adjustment mechanism 110 includes a lead screw, a slider, and a slide rail. A scale structure 150 is mounted on the slide rail. By reading the scale on the scale structure 150 corresponding to the lower or upper end of the slider, the moving distance of the first adjustment mechanism 110 along the first direction can be determined. When the second test path 310 just contacts the electronic contact 500 under test, the scale corresponding to a fixed position of the slider on the scale structure 150 is read. Then, the second substrate 300 continues to move down to the test position, and the corresponding scale on the scale structure 150 at that fixed position of the slider is read again. By reading the scale twice, the height that the electronic contact 500 under test needs to be pressed during the test can be determined, which helps to ensure the uniformity of each test and improve the accuracy of the test results. Alternatively, the electronic contact RF test device also includes a standard gauge block, which is movably mounted between the first substrate 200 and the second substrate 300 to determine the height of the electronic contact 500 under test after pressing during the test. Specifically, based on the working application height or other requirements of the electronic contact 500 under test, a standard gauge block of appropriate height is selected. Then, the standard gauge block is placed between the first substrate 200 and the second substrate 300. By adjusting the first adjustment mechanism 110, the distance between the second substrate 300 and the first substrate 200 is made consistent with the thickness of the standard gauge block. Then, the standard gauge block is removed from between the first substrate 200 and the second substrate 300. At this time, the height of the electronic contact 500 under test after being pressed is the specified height, and corresponding tests can be performed. The operation is simple, the uniformity of the test can be guaranteed, and the efficiency and accuracy of the test can be improved.

[0047] Preferably, the substrate holder 100 further includes a second adjustment mechanism 140, which is connected to either the first fixing mechanism 120 or the second fixing mechanism 130, and is used to adjust the distance between the first substrate 200 and the second substrate 300 in a second direction, wherein the first direction and the second direction are perpendicular to each other. Specifically, the first adjustment mechanism 110 and the second adjustment mechanism 140 can be simultaneously connected to either the first fixing mechanism 120 or the second fixing mechanism 130, or the second adjustment mechanism 140 can be connected to the second fixing mechanism 130 when the first adjustment mechanism 110 is connected to the first fixing mechanism 120, or the second adjustment mechanism 140 can be connected to the first fixing mechanism 120 when the first adjustment mechanism 110 is connected to the second fixing mechanism 130. The second adjustment mechanism 140 is used to adjust the relative position of the first substrate 200 and the second substrate 300 so that the first contact point 510 of the electronic contact 500 under test fixed on the first substrate 200 can be directly opposite to the second contact pad 311 on the second substrate 300. When the first adjustment mechanism 110 and the second adjustment mechanism 140 are simultaneously connected to the first fixing mechanism 120 or the second fixing mechanism 130, the first adjustment mechanism 110 and the second adjustment mechanism 140 can be combined into a single adjustment mechanism, such as a micrometer adjustment table.

[0048] The following is a specific embodiment of this application, such as Figures 1 to 4 As shown, a first substrate 200 is fixedly mounted on a first fixing mechanism 120 on a substrate holder 100. A first test path 210 with a first pad 211 is provided on one side surface of the first substrate 200. First insulating strips 240 are provided on both sides of the first test path 210. A test calibration path 220 parallel to the first test path 210 is also provided on this side surface, with first insulating strips 240 also provided on both sides of the calibration test path 220. The remaining portion of this side surface serves as a first reference ground 250. A test structure connector 230 for connection to a test device is provided on the first substrate 200. An electronic contact 500 under test is fixed on the first test path 210. A first connector 231 is provided at the end of the first test path 210 that is farther from the electronic contact 500 under test. A second connector 232 and a third connector 233 are provided at both ends of the test calibration path 220, respectively. Two grounding electronic contacts 400 are respectively mounted on the first reference ground 250 near the first insulating strips 240 located on both sides of the first test path 210. The second substrate 300 is fixedly mounted on the second fixing mechanism 130, which is fixedly connected to the first adjusting mechanism 110. Adjusting the first adjusting mechanism 110 can move the second fixing mechanism 130 and the second substrate 300 up and down. Figure 1 As shown, the first adjustment mechanism 110 is a lead screw adjustment mechanism. In other embodiments, the first adjustment mechanism 110 may also adopt other adjustment mechanisms. A second test passage 310 with a second pad 311 is provided on one side surface of the second substrate 300. A second insulating strip 330 is provided on both sides of the second test passage 310. The other part of the side surface is a second reference ground 340. A fourth connector 320 for connecting to a test device is installed and fixed at one end of the second test passage 310, and the other end is used to connect to the electronic contact 500 under test. During test calibration, the second connector 232 and the third connector 233 are electrically connected to the test device. When testing the electronic contact 500 under test, the second substrate 300 is adjusted to a specified position so that the second test path 310 and the first test path 210 are electrically connected through the electronic contact 500 under test, and the first reference ground 250 and the second reference ground 340 are electrically connected through the grounding electronic contact 400, forming a complete channel for radio frequency testing. At this time, the first connector 231 and the fourth connector 320 are electrically connected to the test device to perform radio frequency testing on the electronic contact 500 under test.

[0049] Further reference Figure 7A , 7B To enable rapid and accurate radio frequency testing of electronic contacts, a preferred procedure can be recommended as follows:

[0050] Step 1: Obtain the first substrate and the second substrate. Arrange the test fixture substrate so that the test calibration path (e.g., test calibration path 220) and the test path (e.g., first test path 210, second test path 310) are set on the same substrate according to predetermined design requirements. Then, the first substrate 200 and the second substrate 300 are separated by processes such as slitting. The electrical length of the test calibration path 220 is designed to be the sum of the electrical lengths of the first test path 210 and the second test path 310. In this way, the paths of the paths can be made with the same processing materials and processes, so as to ensure that the channel environment of the calibration path and the test path is almost the same, thereby eliminating the error between the calibration and testing links and ensuring the accuracy of the test.

[0051] Step 2: Calibration. Connect the test instrument (e.g., network analyzer) T to both ends of the test calibration path 220 via the test cable CA as shown in 7A for calibration. Here, one end of the test cable CA is an SMA(m) connector, which is mated and connected with the SMA(f) connector mounted on the first substrate 200.

[0052] Step 3: DUT (Device Under Test) Testing. Following the connection method shown in 7B, connect the first substrate 200 and the second substrate 300 with their front and back facing each other via the substrate holder 100. Figure 7B The support components (not shown) are assembled together, and then the test cable CA of the test instrument (e.g., network analyzer) T is connected to the connection ports of the first substrate 200 and the second substrate 300 respectively for testing.

[0053] In this embodiment, two grounding electronic contacts 400 are symmetrically arranged on both sides of the electronic contact 500 under test. A pre-test is first performed to measure the VSWR (Standing Wave Ratio) to verify whether the impedance formed by the reference grounding area of ​​the electronic contact 500 under test is matched. Based on experience, if the VSWR curve is abnormal (e.g., a resonant spike appears) or the value is too high (e.g., VSWR greater than 1.5 within the target frequency range), it indicates that an effective impedance matching area has not been formed in the entire test area. In this case, the number, position, or installation spacing of the grounding electronic contacts 400 needs to be increased to meet the channel conditions required for formal testing, ensuring the accuracy of the test results for the electronic contact 500 under test.

[0054] Step 4: Subtract the calibration data obtained in Step 2 from the DUT (Device Under Test) test data obtained in Step 3 to obtain the actual RF performance parameters of the DUT.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely illustrative of implementation methods of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A radio frequency testing device for electronic contacts, characterized in that, include: The first substrate has a first test path having a first pad and a first reference ground; The second substrate is provided with a second test path and a second reference ground having a second pad; The electronic contact under test has a first contact point that is flexible and movable for electrical contact connection. The electronic contact under test is mounted on the first contact pad and is used to electrically connect the first test path and the second test path to form a signal path of radio frequency test circuit. and at least one grounding electronic contact having a second contact point that is resiliently movable for electrical contact connection, the grounding electronic contact being mounted on the first reference ground and located beside the first pad for electrically connecting the first reference ground and the second reference ground to the reference ground of the signal path that forms an RF test loop; When the electronic contact under test is in the test state, both the grounding electronic contact and the electronic contact under test are in the pressed state and have the same height after being pressed.

2. The RF testing device for electronic contacts according to claim 1, characterized in that: The number of grounding electronic contacts is two, which are symmetrically installed on the first reference ground about the first pad, so that the entire area where the grounding electronic contacts and the electronic contacts under test are electrically connected to the first substrate and the second substrate respectively forms an impedance matching region.

3. The RF testing apparatus for electronic contacts according to claim 1 or 2, characterized in that: The first substrate is further provided with a test calibration path, and a first insulating strip is provided between the first test path and the first reference ground and between the test calibration path and the first reference ground; a second insulating strip is provided between the second test path and the second reference ground.

4. The RF testing apparatus for electronic contacts according to claim 1, characterized in that: The grounding electronic contact is a spring structure, and the length of the spring structure in its natural state is not less than the height of the electronic contact under test after it is pressed during testing.

5. The RF testing apparatus for electronic contacts according to claim 1, characterized in that: The grounding electronic contact is a spring-loaded structure, and the height of the spring-loaded structure in its natural state is not less than the height of the electronic contact under test after it is pressed during testing.

6. The RF testing apparatus for electronic contacts according to claim 1, characterized in that: The grounding electronic contact has the same structure as the electronic contact under test.

7. The RF testing apparatus for electronic contacts according to claim 1, characterized in that: The first substrate has a notch structure, and the end of the first test path is located on the sidewall of the notch structure.

8. The RF testing apparatus for electronic contacts according to claim 1, characterized in that: It also includes a substrate holder, which includes a first fixing mechanism for fixing the first substrate and a second fixing mechanism for fixing the second substrate; The substrate holder further includes a first adjustment mechanism, which is connected to the first fixing mechanism or the second fixing mechanism, and is used to adjust the distance between the first substrate and the second substrate in a first direction.

9. The RF testing apparatus for electronic contacts according to claim 8, characterized in that: The substrate holder further includes a scale structure for observing the adjustment distance of the first adjustment mechanism along the first direction; or... It also includes a standard gauge block, which is movably disposed between the first substrate and the second substrate, for quantitatively measuring the height of the electronic contact mounted on the first substrate in the test state.

10. The RF testing apparatus for electronic contacts according to claim 8, characterized in that: The substrate holder further includes a second adjustment mechanism, which is connected to the first fixing mechanism or the second fixing mechanism, and is used to adjust the distance between the first substrate and the second substrate in a second direction, wherein the first direction and the second direction are perpendicular to each other.

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