A microwave power detector

By placing the probe body in a sealed space and shielding it from external electromagnetic signals in the microwave power detector, the problem of probe body oxidation is solved, the probe's service life is extended, and the detection accuracy is improved.

CN116243049BActive Publication Date: 2026-06-02JIHUA LAB

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIHUA LAB
Filing Date
2023-04-04
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

In existing microwave power detectors, contact between the probe body and the air inside the waveguide causes material oxidation, affecting detection accuracy and shortening the probe's lifespan.

Method used

The probe body is placed inside the adjustment cavity of the bushing, and the adjustment cavity is sealed by the bushing tightly adhering to the probe base to prevent the probe body from contacting the air inside the waveguide. At the same time, the adjustable probe is wrapped inside by the shielding cover and the circuit board to shield against external electromagnetic interference.

Benefits of technology

It effectively avoids probe oxidation, extends probe lifespan, improves detection accuracy, reduces external electromagnetic interference, and enhances the locking effect between the probe and the circuit board.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of microwave power detection, and particularly provides a microwave power detector, which comprises a waveguide tube, a plurality of probe assemblies fixed equidistantly on the waveguide tube, the probe assemblies each comprising a bushing and an adjustable probe, the adjustable probe comprising a probe base and a probe needle body, the probe base being in threaded connection with the probe needle body, the bushing being provided with an adjusting cavity, the probe needle body being located in the adjusting cavity, and the bushing being tightly attached to the probe base to seal the adjusting cavity; and an upper cover installed on the waveguide tube and used for sealing the plurality of probe assemblies; the detector can effectively solve the problem of oxidation of the probe needle body caused by contact of the probe needle body with air in the waveguide tube.
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Description

Technical Field

[0001] This application relates to the field of microwave power detection technology, and more specifically, to a microwave power detector. Background Technology

[0002] Microwave power detectors are essential microwave devices in microwave transmission systems, and their detection accuracy determines the output power accuracy of the microwave generator. Existing microwave power detectors utilize multiple equidistant adjustable probes for microwave power detection (i.e., using the equidistant voltage extraction method). During use, the probes come into contact with air inside the waveguide, leading to material oxidation. This oxidation alters the coupling degree of the adjustable probes, and since the coupling degree is directly related to the detection accuracy of the microwave power detector—meaning that probe material oxidation reduces accuracy—current technology requires adjusting the insertion depth of the adjustable probes to change the coupling degree and improve detection accuracy. However, due to prolonged use and subsequent oxidation, current technology necessitates frequent adjustments to the insertion depth. These frequent adjustments result in probe wear and a shortened lifespan.

[0003] There is currently no effective technical solution to the above problems. Summary of the Invention

[0004] The purpose of this application is to provide a microwave power detector that can effectively solve the problem of oxidation of the probe material caused by contact between the probe body and the air inside the waveguide.

[0005] This application provides a microwave power detector, which includes:

[0006] waveguide;

[0007] Multiple probe assemblies are fixed at equal intervals on the waveguide. Each probe assembly includes a bushing and an adjustable probe. The adjustable probe includes a probe base and a probe body. The probe base and the probe body are threadedly connected. The bushing has an adjustment cavity. The probe body is located in the adjustment cavity. The bushing is tightly attached to the probe base to seal the adjustment cavity.

[0008] The top cover, mounted on the waveguide, is used to seal multiple probe assemblies.

[0009] This application provides a microwave power detector in which the probe body is placed inside the adjustment cavity of a bushing, and the adjustment cavity is sealed by the bushing tightly adhering to the probe base. Since the microwave power detector of this application is equivalent to placing the probe body in a sealed space, the detector can prevent the probe body from contacting the air inside the waveguide. Therefore, the detector can effectively solve the problem of probe body material oxidation caused by contact between the probe body and the air inside the waveguide. This effectively avoids the need for frequent adjustment of the insertion depth of the adjustable probe due to the oxidation of the probe body material after long-term use, thereby effectively avoiding wear of the adjustable probe due to frequent adjustment and thus effectively extending the service life of the adjustable probe.

[0010] Optionally, the probe assembly is fixed to the waveguide via a probe mounting base, and the top cover is fixedly connected to the probe mounting base.

[0011] Optionally, the probe mount includes a circuit board, and the microwave power detector also includes a shielding cover mounted on the circuit board, which cooperates with the circuit board to enclose the adjustable probe.

[0012] Because the shielding cover of this technical solution works in conjunction with the circuit board to enclose the adjustable probe, the shielding cover acts as a shield against electromagnetic signals from the external environment. Therefore, this technical solution can effectively reduce the interference of electromagnetic signals from the external environment on the detection results of the microwave power detector, thereby effectively improving the detection accuracy of the microwave power detector. Furthermore, because the shielding cover of this technical solution can enhance the locking degree between the adjustable probe and the probe mounting base, the circuit board and the adjustable probe fixed on the circuit board are less prone to vibration. Therefore, this technical solution can effectively reduce the occurrence of vibration of the circuit board and the adjustable probe, changes in the insertion depth of the adjustable probe, and changes in the coupling degree of the adjustable probe caused by external vibration, thereby further improving the detection accuracy of the microwave power detector.

[0013] Optionally, the shielding cover includes multiple shielding cavities, the number of shielding cavities being greater than or equal to the number of probe assemblies. The shielding cover cooperates with the circuit board to separate the adjustable probes in each shielding cavity, and the top of the shielding cavity is provided with an adjustment hole for adjusting the insertion depth of the adjustable probe.

[0014] This technical solution is equivalent to isolating multiple adjustable probes from each other. Since the shielding cavity can shield electromagnetic interference from the external environment and signal crosstalk between adjacent probes, this technical solution can further improve the detection accuracy of microwave power detectors.

[0015] Optionally, the probe base includes a probe flange located on the side of the probe base near the probe body, and the probe flange is fixedly connected to the circuit board.

[0016] This technical solution can effectively increase the contact area of ​​the solder, thereby effectively improving the welding strength and the tightness between the adjustable probe and the circuit board.

[0017] Optionally, the probe mounting base also includes a circuit board holder, on which the circuit board is fixed. The bushing has a bushing flange located on the side of the bushing closest to the probe base. The circuit board holder has a countersunk through hole, the depth of which is the same as the height of the bushing flange.

[0018] Because the bushing has a bushing flange and the circuit board mounting base has a countersunk through hole with the depth of the countersunk through hole being the same as the height of the bushing flange, the countersunk through hole acts as a limit for the bushing flange, thereby effectively preventing the adjustable probe that is in close contact with the bushing from shifting due to bushing displacement, and thus avoiding changes in the coupling degree of the adjustable probe.

[0019] Optionally, the circuit board is provided with a positioning pin insertion hole, and the circuit board mounting base is provided with a positioning pin mounting hole that is directly opposite the positioning pin insertion hole.

[0020] Since the circuit board can be fixed on the circuit board mounting base after the positioning pin is inserted into the positioning pin mounting hole and the positioning pin extends into the positioning pin insertion hole, the technical solution can effectively improve the convenience of fixing the circuit board on the circuit board mounting base.

[0021] Optionally, the waveguide is provided with a groove for mounting a circuit board holder, and the top cover is fixedly connected to the circuit board holder. The circuit board holder and the top cover cooperate to completely enclose the circuit board, probe assembly and shielding cover.

[0022] Optionally, the circuit board has signal traces, and the shielding cover has trace clearance grooves corresponding to the signal traces.

[0023] Optionally, the adjustment hole is aligned with the probe base.

[0024] Since the adjustment hole is directly opposite the probe base, this technical solution only requires inserting the adjustment component into the adjustment hole to adjust the insertion depth of the adjustable probe, thereby effectively improving the convenience of adjusting the insertion depth of the adjustable probe.

[0025] As can be seen from the above, the microwave power detector provided in this application places the probe body in the adjustment cavity of the bushing and seals the adjustment cavity by tightly fitting the bushing against the probe base. Since the microwave power detector of this application is equivalent to placing the probe body in a sealed space, the detector can prevent the probe body from contacting the air in the waveguide. Therefore, the detector can effectively solve the problem of probe body material oxidation caused by contact between the probe body and the air in the waveguide. This effectively avoids the situation where the probe body material needs to be frequently adjusted for insertion depth due to oxidation after long-term use, thereby effectively avoiding wear of the adjustable probe due to frequent adjustment and thus effectively extending the service life of the adjustable probe. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a microwave power detector provided in an embodiment of this application.

[0027] Figure 2 This is a schematic diagram of the exploded structure of a microwave power detector provided in an embodiment of this application.

[0028] Figure 3 This is a schematic diagram of a waveguide structure provided in an embodiment of this application.

[0029] Figure 4 This is a schematic diagram of a circuit board mounting bracket provided in an embodiment of this application.

[0030] Figure 5 This is a schematic diagram of the structure of a shielding cover provided in an embodiment of this application.

[0031] Figure 6 This is a schematic diagram of the structure of an adjustable probe provided in an embodiment of this application.

[0032] Figure 7 This is a schematic diagram of a circuit board structure provided in an embodiment of this application.

[0033] Figure 8 This is a schematic diagram of the structure of a waveguide, probe mounting base, and probe assembly according to an embodiment of this application.

[0034] Figure 9 This is a schematic diagram of the structure of a waveguide, probe mounting base, and shielding cover according to an embodiment of this application.

[0035] Figure 10 for Figure 9 A side view structural diagram.

[0036] Figure 11 For along Figure 10 A schematic diagram of the cross-sectional structure of the AA section line in the diagram.

[0037] Figure 12 for Figure 11 An enlarged structural diagram of part A in the diagram.

[0038] Figure 13 This is a comparative diagram showing the solder on a probe base including the probe flange and the solder on a probe base without the probe flange.

[0039] Reference numerals: 1. Waveguide; 2. Probe assembly; 21. Bushing; 22. Adjustable probe; 221. Probe base; 222. Probe body; 223. Probe flange; 3. Top cover; 4. Shielding cover; 41. Shielding cavity; 42. Adjustment hole; 43. Trace clearance groove; 5. Probe mounting base; 51. Circuit board; 511. Signal trace; 512. Positioning pin insertion hole; 52. Circuit board mounting base; 521. Positioning pin mounting hole; 6. Positioning pin. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0041] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0042] Firstly, such as Figures 1-12 As shown, this application provides a microwave power detector, which includes:

[0043] Waveguide 1;

[0044] Multiple probe assemblies 2 are fixed at equal intervals on the waveguide 1. Each probe assembly 2 includes a bushing 21 and an adjustable probe 22. The adjustable probe 22 includes a probe base 221 and a probe body 222. The probe base 221 and the probe body 222 are threadedly connected. The bushing 21 has an adjustment cavity. The probe body 222 is located in the adjustment cavity. The bushing 21 is tightly attached to the probe base 221 to seal the adjustment cavity.

[0045] The top cover 3 is mounted on the waveguide 1 and is used to seal multiple probe assemblies 2.

[0046] Waveguide 1 is an existing device, and its working principle will not be discussed in detail here. Waveguide 1 is used to transmit microwaves. It should be understood that if the length of waveguide 1 is greater than the waveguide wavelength corresponding to the transmitted microwave, the microwave power detector cannot accurately detect the standing wave state of the microwave. Therefore, the length of waveguide 1 needs to be less than or equal to the waveguide wavelength corresponding to the microwave. In this embodiment, the length of waveguide 1 is preferably four-fifths of the waveguide wavelength corresponding to the microwave. It should be understood that since the microwave power detector needs to insert a probe into waveguide 1 to perform microwave power detection, waveguide 1 is provided with multiple adjustable probe mounting holes at equal intervals for the probe body 222 to pass through. Figure 3(a) The microwave power detector of this application uses the equidistant voltage extraction method to detect microwave power. Therefore, the microwave power detector includes multiple probe assemblies 2 equidistantly fixed on the waveguide 1. In this embodiment, the number of probe assemblies 2 is preferably three. The spacing between the adjustable probes 22 in this embodiment is preferably one-sixth of the waveguide wavelength corresponding to the microwave transmitted by the waveguide 1, so that the detection wavelength range of the microwave power detector is within the monotonic range. Specifically, the probe assembly 2 includes a bushing 21 and an adjustable probe 22. The adjustable probe 22 includes a probe base 221 and a probe body 222. The bushing 21 has an adjustment cavity. The probe body 222 is located in the adjustment cavity and can be raised and lowered within the adjustment cavity. The bushing 21 is tightly attached to the probe base 221 to seal the adjustment cavity. That is, in this embodiment, the probe body 222 is placed in a closed space. The probe base 221 and the probe body 222 are threadedly connected. Therefore, in this embodiment, the insertion depth of the adjustable probe 22 can be adjusted by rotating the probe body 222 to adjust the coupling degree of the adjustable probe 22. In this embodiment, the bushing 21 is preferably cylindrical, the probe base 221 is preferably annular, and the probe body 222 is preferably cylindrical. The radius of the inner circle of the probe base 221 is larger than the radius of the probe body 222. Since the bushing 21 needs to be tightly attached to the probe base 221, the radius of the bushing 21 needs to be larger than the radius of the probe body 222 but smaller than the radius of the probe base 221. The top cover 3 is mounted on the waveguide 1, and the top cover 3 seals the multiple probe assemblies 2. That is, this embodiment is equivalent to using the top cover 3 and the waveguide 1 to form a sealed space to seal the multiple probe assemblies 2. It should be understood that since different sizes of adjustable probes 22 are required to detect different levels of microwave power, and the size of the adjustable probe 22 needs to be changed when the size of the adjustable probe 22 changes, the size of the bushing 21 that is tightly attached to the probe base 221 also needs to be changed. Therefore, those skilled in the art can select different sizes of adjustable probes 22 and bushings 21 that match the adjustable probe 22 according to actual needs. It should also be understood that in this embodiment, the probe body 222 is placed in a sealed space. In order to avoid the bushing 21 affecting the signal acquisition of the probe body 222, the bushing 21 is made of a microwave-permeable material (preferably Teflon).

[0047] The working principle of this embodiment is as follows: the probe body 222 is placed in the adjustment cavity of the bushing 21, and the adjustment cavity is sealed by the bushing 21 tightly adhering to the probe base 221. Since the microwave power detector of this application is equivalent to placing the probe body 222 in a sealed space, that is, the detector can prevent the probe body 222 from contacting the air in the waveguide 1. Therefore, the detector can effectively solve the problem of oxidation of the probe body 222 material caused by contact between the probe body 222 and the air in the waveguide 1 after long-term use. This effectively avoids the situation where the insertion depth of the adjustable probe 22 needs to be frequently adjusted due to the oxidation of the probe body 222 material, thereby effectively avoiding the wear of the adjustable probe 22 due to frequent adjustment, and thus effectively extending the service life of the adjustable probe 22.

[0048] The installation process of the microwave power detector in this embodiment is as follows: 1. Place the probe body 222 in the adjustment cavity of the bushing 21, and make the bushing 21 tightly against the probe base 221; 2. Fix the probe assembly 2 on the waveguide 1; 3. Install the top cover 3 on the waveguide 1. It should be understood that if the coupling degree of the adjustable probe 22 changes, this embodiment requires first removing the top cover 3 from the waveguide 1, and then adjusting the insertion depth of the adjustable probe 22 by rotating the probe body 222 to adjust the coupling degree of the adjustable probe 22.

[0049] This application provides a microwave power detector in which the probe body 222 is placed inside the adjustment cavity of the bushing 21, and the adjustment cavity is sealed by the bushing 21 tightly adhering to the probe base 221. Since the microwave power detector of this application is equivalent to placing the probe body 222 in a sealed space, the detector can prevent the probe body 222 from contacting the air inside the waveguide 1. Therefore, the detector can effectively solve the problem of oxidation of the probe body 222 material caused by contact between the probe body 222 and the air inside the waveguide 1. This effectively avoids the situation where the insertion depth of the adjustable probe 22 needs to be frequently adjusted due to the oxidation of the probe body 222 material after long-term use, thereby effectively avoiding the wear of the adjustable probe 22 caused by frequent adjustment, and thus effectively extending the service life of the adjustable probe 22.

[0050] In some embodiments, the probe assembly 2 is fixed to the waveguide 1 via the probe mounting base 5, and the upper cover 3 is fixedly connected to the probe mounting base 5. Specifically, the probe mounting base 5 is fixed to the waveguide 1 by welding, screw tightening, or snap-fit ​​connection, the probe assembly 2 is fixed to the probe mounting base 5 by welding, screw tightening, or snap-fit ​​connection, and the upper cover 3 is fixed to the probe mounting base 5 by welding, screw tightening, or snap-fit ​​connection.

[0051] In some embodiments, the probe mounting base 5 includes a circuit board 51, and the microwave power detector further includes a shielding cover 4. The shielding cover 4 is mounted on the circuit board 51, and the shielding cover 4 cooperates with the circuit board 51 to enclose the top of the adjustable probe 22. In this embodiment, the probe assembly 2 is fixed on the circuit board 51, and the shielding cover 4 is mounted on the circuit board 51. The shielding cover 4 is a cover made of existing electromagnetic signal shielding material. The shielding cover 4 cooperates with the circuit board 51 to enclose the top of the adjustable probe 22. This embodiment is equivalent to using the shielding cover 4 and the circuit board 51 to form a sealed space, and the top of the adjustable probe 22 is located within this sealed space. Specifically, in this embodiment, the shielding cover 4 is fixed on the circuit board 51 by screws. Since the probe assembly 2 is fixed on the circuit board 51, the screws used to fix the shielding cover 4 and the circuit board 51 will provide a locking force to the circuit board 51. The contact between the shielding cover 4 and the circuit board 51 will increase the locking area of ​​the circuit board 51. Therefore, the shielding cover 4 can increase the locking degree between the adjustable probe 22 and the probe mounting base 5. That is, this embodiment is equivalent to increasing the locking degree between the adjustable probe 22 and the probe mounting base 5 by increasing the locking force and the locking area. Since the shielding cover 4 in this embodiment cooperates with the circuit board 51 to enclose the top of the adjustable probe 22, the shielding cover 4 shields the probe assembly 2 from electromagnetic signals from the external environment. Therefore, this embodiment can effectively reduce the interference of electromagnetic signals from the external environment on the detection results of the microwave power detector, thereby effectively improving the detection accuracy of the microwave power detector. Furthermore, since the shielding cover 4 in this embodiment can enhance the locking degree between the adjustable probe 22 and the probe mounting base 5, the circuit board 51 and the adjustable probe 22 fixed on the circuit board 51 are less prone to vibration. Therefore, this embodiment can effectively reduce the occurrence of vibration of the circuit board 51 and the adjustable probe 22, changes in the insertion depth of the adjustable probe 22, and changes in the coupling degree of the adjustable probe 22 due to external vibration, thereby further improving the detection accuracy of the microwave power detector. In addition, since the shielding cover 4 cooperates with the circuit board 51 to enclose the adjustable probe 22, the shielding cover 4 protects the adjustable probe 22 when subjected to external impact, thereby effectively reducing the possibility of deformation and damage to the adjustable probe 22 due to external impact.

[0052] In some embodiments, the shielding cover 4 includes a plurality of shielding cavities 41, the number of shielding cavities 41 being greater than or equal to the number of probe assemblies 2. The shielding cover 4 cooperates with the circuit board 51 to separate the adjustable probes 22 within each shielding cavity 41. The top of each shielding cavity 41 is provided with an adjustment hole 42 for adjusting the insertion depth of the adjustable probes 22. In this embodiment, the shielding cover 4 includes a plurality of shielding cavities 41, and the number of shielding cavities 41 is greater than or equal to the number of probe assemblies 2, that is, each probe assembly 2 corresponds to at least one shielding cavity 41. The shielding cover 4 cooperates with the circuit board 51 to separate the adjustable probes 22 within each shielding cavity 41. This embodiment is equivalent to isolating the multiple adjustable probes 22 from each other. Since the shielding cavities 41 can shield electromagnetic interference from the external environment and signal crosstalk between adjacent probes, this embodiment can further improve the detection accuracy of the microwave power detector.

[0053] In some embodiments, the probe base 221 includes a probe flange 223, which is located on the side of the probe base 221 near the probe body 222. The probe flange 223 is fixedly connected to the circuit board 51. This embodiment is suitable for cases where the adjustable probe 22 is fixedly connected to the circuit board 51 by soldering. Before the adjustable probe 22 is soldered onto the circuit board 51, there is a gap between the probe flange 223 and the pads on the circuit board 51. When the adjustable probe 22 is soldered onto the circuit board 51, solder is filled into this gap. Therefore, the solder in this embodiment is frustum-shaped (see reference). Figure 13 (See the left image in the figure). Because the solder in this embodiment is frustum-shaped, while the solder in the above embodiment is conical (see reference). Figure 13 (See the right figure in the figure). Therefore, this embodiment can effectively increase the contact area of ​​the solder, thereby effectively improving the soldering strength and the tightness between the adjustable probe 22 and the circuit board 51.

[0054] In some embodiments, the probe mounting base 5 further includes a circuit board mounting base 52, on which the circuit board 51 is fixed. The bushing 21 has a bushing flange located on the side of the bushing 21 near the probe base 221. The circuit board mounting base 52 has a countersunk through hole, the depth of which is the same as the height of the bushing flange. In this embodiment, the probe mounting base 5 consists of a circuit board mounting base 52 and a circuit board 51. The circuit board mounting base 52 is fixed to the waveguide 1 by welding, screw locking, or snap-fit ​​connection. The circuit board 51 is fixed to the circuit board mounting base 52 by welding, screw locking, or snap-fit ​​connection. The shielding cover 4, the circuit board 51, and the circuit board mounting base 52 are all provided with shielding cavity mounting holes. In this embodiment, the shielding cover 4 is fixed to the circuit board 51 by passing screws through the shielding cavity mounting holes on the shielding cover 4, the circuit board 51, and the circuit board mounting base 52 and tightening the screws. Because bushing 21 has a bushing flange and circuit board mounting base 52 has a countersunk through hole with the depth of the through hole being the same as the height of the bushing flange, the countersunk through hole limits the bushing flange, thus effectively preventing the adjustable probe 22, which is in close contact with bushing 21, from shifting due to bushing 21, and thus avoiding a change in the coupling degree of the adjustable probe 22. It should be understood that because the probe body 222 needs to be inserted into the waveguide 1, both circuit board 51 and circuit board mounting base 52 are provided with adjustable probe mounting holes for the probe body 222 to pass through. Figure 4 In the diagram, 'b' refers to the adjustable probe mounting hole on the circuit board mounting base 52. The adjustable probe mounting hole on the circuit board mounting base 52 is a countersunk through hole. Figure 7 In this context, 'e' represents the adjustable probe mounting hole on circuit board 51.

[0055] In some embodiments, the circuit board 51 is provided with a positioning pin insertion hole 512, and the circuit board mounting base 52 is provided with a positioning pin mounting hole 521 directly opposite the positioning pin insertion hole 512. When the positioning pin 6 is inserted into the positioning pin mounting hole 521 and extends into the positioning pin insertion hole 512, the adjustable probe mounting hole on the circuit board 51 is directly opposite the adjustable probe mounting hole on the circuit board mounting base 52. The workflow for fixing the circuit board 51 to the circuit board mounting base 52 in this embodiment is as follows: first, the positioning pin 6 is inserted into the positioning pin mounting hole 521 on the circuit board mounting base 52; then, the positioning pin 6 extends into the positioning pin insertion hole 512 on the circuit board 51; and finally, the circuit board 51 is fixed to the circuit board mounting base 52. Since the circuit board 51 can be fixed to the circuit board mounting base 52 after the positioning pin 6 is inserted into the positioning pin mounting hole 521 and extended into the positioning pin insertion hole 512, this embodiment can effectively improve the convenience of fixing the circuit board 51 to the circuit board mounting base 52.

[0056] In some embodiments, the waveguide 1 has a groove for mounting the circuit board mounting base 52. The upper cover 3 is fixedly connected to the circuit board mounting base 52, and the circuit board mounting base 52 and the upper cover 3 cooperate to completely enclose the circuit board 51, the probe assembly 2, and the shielding cover 4. Specifically, the circuit board mounting base 52 is installed on the groove of the waveguide 1 by welding, and the upper cover 3 is fixed to the circuit board mounting base 52 by welding, screw locking, or snap-fit ​​connection. The circuit board mounting base 52 and the upper cover 3 cooperate to completely enclose the circuit board 51, the probe assembly 2, and the shielding cover 4. Since the circuit board mounting base 52 and the upper cover 3 cooperate to seal and protect the circuit board 51, the probe assembly 2, and the shielding cover 4, this embodiment can effectively extend the service life of the circuit board 51, the probe assembly 2, and the shielding cover 4.

[0057] In some embodiments, the circuit board 51 is provided with signal traces 511, and the shielding cover 4 is provided with trace clearance grooves 43 corresponding to the signal traces 511. The signal traces 511 in this embodiment are existing circuits, and their operating principles will not be discussed in detail here. The trace clearance grooves 43 on the shielding cover 4 serve to reduce signal interference.

[0058] In some embodiments, the adjustment hole 42 is directly opposite the probe base 221. Specifically, the probe base 221 has an annular structure, the probe body 222 has a cylindrical structure, and a portion of the probe body 222 is located within the inner circle of the probe base 221 (see reference). Figure 12 The top of the probe body 222 is provided with an adjustment groove for rotating the probe body 222 to adjust the insertion depth of the probe body 222 (see reference). Figure 7 Since the adjustment hole 42 is directly opposite the probe base 221, this embodiment only requires inserting the adjustment component (not shown in the figure) into the adjustment hole 42 to adjust the insertion depth of the adjustable probe 22, thereby effectively improving the convenience of adjusting the insertion depth of the adjustable probe 22.

[0059] Example 1

[0060] This embodiment provides a microwave power detector, which includes a waveguide 1, three probe assemblies 2, a top cover 3, a shielding cover 4, a probe mounting base 5, and a positioning pin 6. The probe assembly 2 includes a bushing 21 and an adjustable probe 22. The adjustable probe 22 includes a probe base 221 and a probe body 222. The probe base 221 includes a probe flange 223 located on the side of the probe base 221 near the probe body 222. The bushing 21 has a bushing flange located on the side of the bushing near the probe base 221. The shielding cover 4 includes three shielding cavities 41. The top of each shielding cavity 41 has an adjustment hole 42 for adjusting the insertion depth of the adjustable probe 22, with the adjustment hole facing the adjustable probe 22. The shielding cover 4 has shielding cavity mounting holes (see reference). Figure 5(d) Trace clearance groove 43. The probe mounting base 5 includes a circuit board 51 and a circuit board fixing base 52. The circuit board 51 is provided with signal traces 511, positioning pin insertion holes 512, and adjustable probe mounting holes (see reference). Figure 7 e), Circuit board mounting holes (refer to) Figure 7 (h) and shielding cavity mounting holes (refer to h) Figure 7 f), the circuit board mounting base 52 is provided with a positioning pin mounting hole 521 and an adjustable probe mounting hole (see f). Figure 4 (b) Circuit board mounting holes (refer to) Figure 4 g) and shielding cavity mounting holes (refer to g) Figure 4 (c) The adjustable probe mounting holes on the circuit board mount are countersunk through holes, the depth of which is the same as the height of the bushing flange. The waveguide 1 has a groove for mounting the circuit board mount 52, and three adjustable probe mounting holes are equidistantly arranged in the center of this groove (see reference). Figure 3 (a) in the middle.

[0061] The installation process of a microwave power detector provided in this embodiment is as follows: S1, place the circuit board mounting base 52 on the groove of the waveguide 1, and adjust the position of the circuit board mounting base 52 so that the adjustable probe mounting hole of the circuit board mounting base 52 is aligned with the adjustable probe mounting hole of the waveguide 1; S2, solder the circuit board mounting base 52 onto the groove of the waveguide 1; S3, place the bushing 21 into the adjustable probe mounting hole of the circuit board mounting base 52, and insert the positioning pin 6 into the positioning pin mounting hole 521 of the circuit board mounting base 52; S4, insert the probe body 222 of the adjustable probe 22 into the adjustable probe mounting hole of the circuit board 51, and fix the probe flange 223 onto the circuit board 51 by soldering; S5 S6. Place the soldered circuit board 51 above the circuit board mounting base 52, and insert the positioning pin 6 into the positioning pin insertion hole 512 of the circuit board 51; S7. Lock the circuit board 51 onto the circuit board mounting base 52 using the circuit board mounting holes on the circuit board 51 and the circuit board mounting base 52, so that the probe body 222 is located in the adjustment cavity and the bushing 21 is in close contact with the probe base 221; S8. Place the shielding cover 4 above the circuit board 51, and after the shielding cavity mounting hole on the shielding cover 4 is aligned with the shielding cavity mounting hole on the circuit board 51 and the shielding cavity mounting hole on the circuit board mounting base 52, fix the shielding cover 4 onto the circuit board 51 with screws; S9. Lock the upper cover 3 onto the circuit board mounting base 52.

[0062] As can be seen from the above, the microwave power detector provided in this application places the probe body 222 in the adjustment cavity of the bushing 21 and seals the adjustment cavity by tightly fitting the bushing 21 against the probe base 221. Since the microwave power detector of this application is equivalent to placing the probe body 222 in a sealed space, the detector can prevent the probe body 222 from contacting the air in the waveguide 1. Therefore, the detector can effectively solve the problem of oxidation of the probe body 222 material caused by contact between the probe body 222 and the air in the waveguide 1. This effectively avoids the situation where the insertion depth of the adjustable probe 22 needs to be frequently adjusted due to the oxidation of the probe body 222 material after long-term use, thereby effectively avoiding the wear of the adjustable probe 22 caused by frequent adjustment, and thus effectively extending the service life of the adjustable probe 22.

[0063] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0064] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0065] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0066] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A microwave power detector, characterized in that, The microwave power detector includes: waveguide; Multiple probe assemblies are fixed at equal intervals on the waveguide. Each probe assembly includes a bushing and an adjustable probe. The adjustable probe includes a probe base and a probe body. The probe base is threadedly connected to the probe body. The bushing has an adjustment cavity. The probe body is located in the adjustment cavity. The bushing is tightly attached to the probe base to seal the adjustment cavity. The top cover, mounted on the waveguide, is used to seal the plurality of probe assemblies; The probe assembly is fixed to the waveguide by a probe mounting base, and the upper cover is fixedly connected to the probe mounting base; The probe mounting base includes a circuit board, and the microwave power detector also includes a shielding cover. The shielding cover is mounted on the circuit board and cooperates with the circuit board to enclose the adjustable probe. The shielding cover includes multiple shielding cavities, the number of which is greater than or equal to the number of probe assemblies. The shielding cover cooperates with the circuit board to separate the adjustable probes in each shielding cavity. The top of each shielding cavity is provided with an adjustment hole for adjusting the insertion depth of the adjustable probe.

2. The microwave power detector according to claim 1, characterized in that, The probe base includes a probe flange, which is located on the side of the probe base near the probe needle body, and the probe flange is fixedly connected to the circuit board.

3. The microwave power detector according to claim 1, characterized in that, The probe mounting base also includes a circuit board mounting base, on which the circuit board is fixed. The bushing has a bushing flange located on the side of the bushing closest to the probe base. The circuit board mounting base has a countersunk through hole, the depth of which is the same as the height of the bushing flange.

4. The microwave power detector according to claim 3, characterized in that, The circuit board is provided with a positioning pin insertion hole, and the circuit board mounting base is provided with a positioning pin mounting hole that is directly opposite the positioning pin insertion hole.

5. The microwave power detector according to claim 3, characterized in that, The waveguide has a groove for mounting the circuit board mounting base. The upper cover is fixedly connected to the circuit board mounting base. The circuit board mounting base and the upper cover cooperate to completely enclose the circuit board, the probe assembly and the shielding cover.

6. The microwave power detector according to claim 4, characterized in that, The circuit board has signal traces, and the shielding cover has trace clearance grooves corresponding to the signal traces.

7. The microwave power detector according to claim 1, characterized in that, The adjustment hole is directly opposite the probe base.