固化速率可调节的超分子主客体光引发剂和环氧胶粘剂
By using supramolecular host-guest photoinitiators to create a delayed curing window in UV epoxy adhesives, the problem of curing UV epoxy adhesives on low UV transmittance substrates is solved, enabling flexible control of the curing rate and improvement of bond strength.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- STEADYCHEM (SHANGHAI) CO LTD
- Filing Date
- 2025-08-21
- Publication Date
- 2026-07-17
AI Technical Summary
Existing UV epoxy adhesives cannot be effectively cured on substrates that cannot be penetrated by ultraviolet light, and existing delayed curing solutions lack universality, making it difficult to meet the delay effects and process requirements of various formulations.
A supramolecular host-guest photoinitiator is used, in which the guest photoinitiator is encapsulated by the supramolecular host compound to form a delayed curing window. An adjustable delayed window is provided by adjusting the macrocyclic size of the host compound and the type of initiator. Reactive functional groups are combined to enhance adhesion and moisture barrier properties.
It enables delayed curing on low UV transmission components, provides flexible curing rate control, solves the curing problem of low UV transmission components, and improves construction convenience and bonding strength.
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