High-voltage gallium nitride power device and method of manufacturing the same

By designing specific structures and electrode layouts in gallium nitride power devices, and utilizing barrier layers and intermediate metal electrodes as communication channels, the problem of low breakdown voltage in existing devices has been solved, and gallium nitride power devices with high withstand voltage and high stability have been realized.

CN116247093BActive Publication Date: 2026-07-07SIRIUS CORE SEMICON (CHENGDU) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SIRIUS CORE SEMICON (CHENGDU) CO LTD
Filing Date
2022-12-21
Publication Date
2026-07-07

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Abstract

The application belongs to the technical field of semiconductors, and provides a high-voltage gallium nitride power device and a preparation method thereof. The high-voltage gallium nitride power device comprises an N-type semiconductor substrate, a first P-type doped region, a second P-type doped region, a buffer layer, a barrier layer, an intermediate metal electrode, a drain electrode, a first gate electrode, a second gate electrode and a source electrode. The drain electrode and the intermediate metal electrode are communicated through the barrier layer. When the drain electrode is connected to a voltage, the voltage is output to the intermediate metal electrode through the barrier layer, and then output to the source electrode through the N-type semiconductor substrate channel between the first P-type doped region and the second P-type doped region. In this way, the barrier layer and the intermediate metal electrode serve as a channel for the drain electrode and the drain electrode to communicate, so that the power device can pass a high-density current when turned on, and can withstand a high voltage when turned off due to the barrier layer, thereby improving the voltage resistance of the power device.
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