Non-contact large-vibration ultrasonic surgical knife testing system and method

Abstract

The present invention relates to the field of ultrasonic scalpel technology, and discloses a non-contact, high-vibration ultrasonic scalpel testing system and method. The system comprises a laser sensor module, a positioning plate, and a stage. The laser sensor module comprises an integrated optical chip, a laser diode, a detector array, and an optical lens. The positioning plate is positioned between the laser sensor module and the stage, at the focal point of the laser sensor module, and is provided with a positioning hole. The ultrasonic scalpel to be tested is placed on the stage, and the part to be tested of the ultrasonic scalpel is placed in the positioning hole and passes through the positioning plate. The laser sensor module uses an optical interferometer method to measure the vibration of the part to be tested, and performs amplitude calibration and frequency measurement through advanced phase differential signal analysis. The present invention can rapidly measure the time-varying amplitude, frequency, and phase information of key points of the ultrasonic scalpel, obtaining complete time-varying spectrum information.

Description

Technical Field

[0001] The present invention relates to the technical field of ultrasonic surgical knives, and in particular to a non-contact large-vibration ultrasonic surgical knife testing system and method. Background Art

[0002] The ultrasonic scalpel is a high-frequency electrosurgical device primarily used for procedures such as cutting biological tissue and sealing blood vessels. It boasts minimal bleeding, minimal damage to surrounding tissue, and rapid postoperative recovery. The ultrasonic scalpel can both cut and seal human tissue. No electrical current flows through the blade during operation, preventing side effects such as tissue drying and burns. It is widely used in operating rooms and is known as a bloodless scalpel.

[0003] The ultrasonic scalpel waveguide rod is composed of a proximal gain structure, a distal gain structure, an intermediate structure and a frequency adjustment structure. The ultrasonic scalpel waveguide rod and the waveform generated along the waveguide rod in the prior art (patent publication number CN105962996B) are as follows: Figure 1 As shown. Among them, the proximal gain structure and the intermediate structure are connected by a proximal gain step at a position close to the antinode of the longitudinal vibration of the waveguide rod, and the distal gain structure and the intermediate structure are connected by a distal gain step at a position close to the antinode of the longitudinal vibration of the waveguide rod. The intermediate structure is composed of multiple gain holding structures, and there is a frequency adjustment structure on the gain holding structure. The waveguide rod can make the ultrasonic scalpel not only have a large blade amplitude, but also operate at a stable and appropriate vibration frequency, so that the ultrasonic scalpel can efficiently cut human tissue. It can be seen that a good performance scalpel design requires accurate amplitude calibration and frequency measurement of various parts of the scalpel, especially the amplitude calibration and frequency measurement of the blade part.

[0004] At present, the commonly used methods for detecting various parts of the scalpel are as follows:

[0005] 1) Measure from the scalpel drive source, that is, obtain the feedback signal through analysis from the ultrasonic scalpel drive circuit (patent publication number CN106021174A). This method can quickly track the changing resonant frequency of the piezoelectric transducer system through the signal processing unit of the drive circuit, thereby ensuring that the piezoelectric transducer system is in a resonant frequency state. However, this method is an indirect measurement scheme and requires the impedance matching model of the ultrasonic scalpel to be obtained in advance. The impedance matching model is sometimes unknown, such as during the development of the ultrasonic scalpel. Moreover, this method can only obtain the frequency signal, and cannot obtain the actual amplitude signal, which is the only criterion for measuring the actual energy output of the scalpel.

[0006] 2) Imaging method: The imaging method (patent publication number CN208672134U) uses an imaging device to directly measure the position of the ultrasonic scalpel, and obtains the limit of the ultrasonic scalpel's movement position by analyzing the position change of the ultrasonic scalpel in the image. However, the measurement of the imaging method is heavily dependent on the position calibration of the imaging device. If the object to be measured moves a large distance or leaves the calibration area, the error of the result cannot be controlled. At the same time, this method can only obtain the upper and lower limits of the movement position, and cannot obtain the actual signal output by the transducer, including amplitude, spectrum, and phase information. The measured signal has only a limited reference function and has no calibration effect on the actual working state of the ultrasonic scalpel.

[0007] 3) Laser Triangulation: The triangulation sensor consists of a semiconductor laser, a transmitting and focusing lens, a receiving lens assembly, and a receiving CCD array. After reflecting off the surface of the object being measured, the measuring laser signal is focused onto the CCD array by the receiving optical lens. When the position of the object being measured changes, the reflection angle changes, and thus the position reflected on the CCD array changes. By strictly calibrating the CCD position, the position change of the object being measured can be inferred. However, triangulation also measures the upper and lower limits of the moving position. As mentioned above, the measured signal has only a limited reference value and has no effect on the actual working state of the ultrasonic scalpel. Furthermore, to achieve sufficient accuracy when measuring ultrasonic transducers, the triangulation sensor performs a cumulative measurement, deriving the peak-to-peak value from the maximum pixel spacing of the CCD receiving the reflected light. Due to the relatively high vibration frequency of the ultrasonic sensor, this is equivalent to a historical accumulation of measurements, resulting in a result that is significantly larger than the instantaneous peak-to-peak value. In addition, the return light of the triangulation sensor is of a certain diameter. The triangulation sensor needs to determine the actual displacement by determining the maximum point. However, the vibration frequency of the ultrasonic transducer is relatively high, and there is crosstalk between pixels. This also interferes with the measurement results, and the measured value is higher than the actual value. In this way, even if the peak-to-peak value is measured, the result of the triangulation sensor is Inaccurate Finally, the scalpel tip location has irregular and narrow geometry, and triangulation relies on positional variations in the reflected light spot, so no measurement signal can be obtained at these locations. Summary of the Invention

[0008] To this end, the technical problem to be solved by the present invention is to overcome the deficiencies in the prior art and provide a non-contact large-vibration ultrasonic scalpel testing system and method, which can quickly measure the time-varying amplitude, frequency and phase information of key points of the ultrasonic scalpel and obtain complete time-varying spectrum information.

[0009] In order to solve the above technical problems, the present invention provides a non-contact large-vibration ultrasonic scalpel testing system, comprising a laser sensor module, a positioning plate and a stage.

[0010] The laser sensor module includes an integrated optical chip, a laser diode, a detector array and an optical lens. The positioning plate is located between the laser sensor module and the stage. The positioning plate is located at the focal position of the laser sensor module and is provided with a positioning hole.

[0011] The ultrasonic surgical knife to be tested is placed on the stage, and the part to be tested of the ultrasonic surgical knife to be tested is placed in the positioning hole and passes through the positioning plate. The laser sensing module uses an optical interference method to measure the vibration amount of the part to be tested, and performs amplitude calibration and frequency measurement through phase advanced differential signal analysis.

[0012] In one embodiment of the present invention, the integrated optical chip, laser diode, detector array and optical lens are integrated into a package to form the laser sensor module.

[0013] In one embodiment of the present invention, the integrated optical chip includes an optical substrate, and the optical substrate includes a plurality of optical elements, and the optical elements include a laser, a modulator, a photodetector, and a filter.

[0014] In one embodiment of the present invention, it further comprises a movable guide rail and an optical adjustment frame.

[0015] The laser sensor module and the stage are respectively moved on the movable guide rails by the optical adjustment frame, and the optical adjustment frame has a six-axis adjustment capability.

[0016] In one embodiment of the present invention, the shape and size of the positioning hole is greater than or equal to 4 times the diameter of the focal spot of the laser sensor module.

[0017] The present invention also provides a non-contact large-vibration ultrasonic scalpel testing method, comprising:

[0018] A laser sensor module, a positioning plate and a stage are provided. The laser sensor module includes an integrated optical chip, a laser diode, a detector array and an optical lens. The positioning plate is located between the laser sensor module and the stage and is located at the focal position of the laser sensor module. The positioning plate is provided with a positioning hole.

[0019] The ultrasonic surgical knife to be tested is placed on the stage, the part to be tested of the ultrasonic surgical knife to be tested is placed in the positioning hole and passes through the positioning plate, the vibration amount of the part to be tested is measured by the laser sensing module using an optical interference method, and the amplitude calibration and frequency measurement are performed through phase advanced differential signal analysis.

[0020] In one embodiment of the present invention, when the vibration amount of the measured part is measured by the laser sensing module using an optical interference method, the vibration model of the scalpel to be measured is completely obtained by measuring the normal vibration information through the dual-channel laser sensing module, and the vibration model includes the longitudinal vibration antinode and peak information of the waveguide rod.

[0021] In one embodiment of the present invention, the vibration model of the scalpel to be tested is completely obtained by measuring the normal vibration information through the dual-channel laser sensor module, specifically:

[0022] The laser sensor modules are respectively arranged in three orthogonal directions of XYZ, and the three laser sensor modules measure the amplitude of the part to be measured in the three directions of XYZ;

[0023] Combining the angles formed by the projections of the three laser sensor modules on the XY plane and the X-axis, the vibration signals in the vertical and horizontal directions for the same measurement point are calculated as follows:

[0024]

[0025] Where d1, d2, and d3 are the displacement values ​​measured by the three laser sensor modules, and v x 、v y 、v z is the three-dimensional vibration displacement value of the part to be measured; θ x1 ,θ x2 ,θ x3 ,θ y1 ,θ y2 ,θ y3 ,θ z1 ,θ z2 ,θ z3 are the angles between the three laser sensor modules and the X-axis, Y-axis, and Z-axis respectively;

[0026] The displacement values ​​measured by the three laser sensor modules and the three-dimensional vibration displacement value of the measured part are obtained according to the angles between the three laser sensor modules and the X-axis, Y-axis and Z-axis.

[0027] In one embodiment of the present invention, when the vibration amount of the part to be measured is measured by the laser sensor module using an optical interference method, the laser sensor module is used to perform array-type multi-point measurement on the part to be measured.

[0028] In one embodiment of the present invention, the amplitude calibration and frequency measurement are performed by performing phase advanced differential signal analysis, specifically:

[0029] The original phase signal is filtered and preprocessed, and the phase signal after filtering and preprocessing is subjected to high-order differential continuity analysis. The analyzed phase signal is expanded and amplitude calibration and frequency measurement are performed in combination with a phase frequency detector.

[0030] The above technical solution of the present invention has the following advantages over the prior art:

[0031] The present invention realizes the positioning of the part to be tested of the ultrasonic scalpel through the positioning hole, greatly weakens the dependence on the position calibration of the imaging device, and realizes the rapid positioning measurement of the ultrasonic surgical scalpel head in production; designs and uses a miniaturized laser sensor module with an integrated optical chip to perform optical interference measurement of the part to be tested, and combines it with the phase advanced differential signal analysis method to quickly measure the time-varying amplitude, frequency and phase information of the key points of the ultrasonic scalpel in a non-contact manner, and obtains complete time-varying spectrum information. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings, wherein:

[0033] Figure 1 It is the ultrasonic surgical knife waveguide rod and the waveform generated along the waveguide rod.

[0034] Figure 2 It is a structural diagram of the present invention,

[0035] Figure 3 It is a structural diagram of the system of the present invention,

[0036] Figure 4 This is a schematic diagram of the structure of the discrete optical components in the laser sensor module of the present invention.

[0037] Figure 5 is a schematic diagram of the integrated laser sensor module of the present invention,

[0038] Figure 6 It is a schematic diagram of the structure of the mechanical positioning groove provided on the stage in the system of the present invention.

[0039] Figure 7 This is a schematic diagram of the principle of using a multi-channel sensor to fully obtain the vibration model of a scalpel in the present invention.

[0040] Figure 8 is a flow chart of phase demodulation in the present invention,

[0041] Figure 9 1 is a diagram illustrating measurement results of an ultrasonic surgical knife according to an embodiment of the present invention.

[0042] Explanation of the accompanying drawings in the specification: 1. Laser sensor module; 2. Stage; 3. Positioning plate; 4. Moving guide rail; 5. Optical adjustment frame; 6. Ultrasonic surgical knife to be tested; 7. Positioning hole. DETAILED DESCRIPTION

[0043] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0044] Example 1

[0045] like Figure 2-Figure 3 As shown, the present invention discloses a non-contact, high-vibration ultrasonic scalpel testing system, comprising a laser sensor module 1, a positioning plate 3, and a stage 2. The laser sensor module 1 comprises an integrated optical chip, a laser diode, a detector array, and an optical lens. The positioning plate 3 is positioned between the laser sensor module 1 and the stage 2, at the focal point of the laser sensor module 1. The positioning plate 3 is provided with a positioning hole 7. An ultrasonic scalpel 6 to be tested is placed on the stage 2, with the part to be tested of the ultrasonic scalpel 6 positioned in the positioning hole 7 and passing through the positioning plate 3. The laser sensor module 1 uses optical interferometry to measure the vibration of the part to be tested, performing amplitude calibration and frequency measurement through advanced phase differential signal analysis.

[0046] This invention utilizes an optical interferometer vibration Doppler sensor for contactless measurement. The laser sensor module 1, based on an integrated optical chip, reduces the sensor's size a thousandfold, making online integrated testing of optical interferometer methods possible. In terms of implementation, an innovative algorithm addresses the difficulty of measuring the large vibration of the ultrasonic scalpel's blade tip. Advanced phase differential signal analysis enables real-time adjustment of the dynamic range. In system implementation, the use of pre-positioned optical positioning holes 7 enables rapid measurement.

[0047] In this embodiment, the integrated optical chip, laser diode, detector array and optical lens are integrally packaged to form the miniaturized laser sensor module 1, so that an optical interferometer with different delay lines can be implemented on the integrated optical chip.

[0048] In this embodiment, Figure 4-Figure 5 As shown, the integrated optical chip includes an optical substrate containing dozens to hundreds of optical elements, including lasers, modulators, photodetectors, and filters. The present invention utilizes an optical interferometer-type vibration Doppler sensor to achieve non-contact measurement. Laser sensor module 1 is the core component of the present invention. Conventional laser interferometers are rarely used in ultrasonic knife measurement due to their bulk and high price. Laser sensor module 1, based on an integrated optical chip, reduces the sensor's size by a thousand times, significantly reducing its price. Simultaneously, chip integration allows for more complex designs and expanded functionality, making miniaturized instrument measurement and online measurement possible.

[0049] In this embodiment, a movable guide rail 4 and an optical adjustment frame 5 are also included. The laser sensor module 1 and the stage 2 can be set on the optical adjustment frame 5, or they can be calibrated in advance and do not need to be set on the optical adjustment frame 5. The laser sensor module 1 and the stage 2 are respectively moved on the movable guide rail 4 by the optical adjustment frame 5. The optical adjustment frame 5 has an adjustment capability of up to six axes of X / Y / Z, row / yaw / pitch, which is used to adjust to suit the measurement of different parts of the ultrasonic knife. In the automatic measurement solution, all adjustment platforms can be electrically controlled and connected to the host computer through the control port. The host computer is also connected to the sensor through the communication port to achieve automatic measurement.

[0050] In this embodiment, the shape and size of the positioning hole 7 is at least four times larger than the focal spot diameter of the laser sensor module 1, and is also suitable for the blade size or other vibration position of the ultrasonic surgical knife 6 to be measured. If the object to be measured is known, the stage 2 can also be simplified. The ultrasonic surgical knife blade only needs to be positioned on the positioning hole 7 to complete the measurement. The measurement steps are as follows:

[0051] Step 1: The object to be measured passes through Figure 6 The mechanical positioning slot loading shown;

[0052] Step 2: The positioning hole 7 defines the position of the tool head at the measuring point of the laser sensor, that is, the 1 / 2 mechanical structure ensures the rapid replacement of the object to be measured, while ensuring that the tool head is positioned at the measuring point calibrated by the laser sensor;

[0053] Step 3: An additional photoelectric sensor can be installed in the positioning hole 7 to automatically notify the host computer to prepare for measurement;

[0054] Step 4: The host computer activates the ultrasonic scalpel drive signal, and the laser vibrometer simultaneously collects and analyzes the signal. The test process is non-contact, achieving high-speed and accurate measurement.

[0055] Example 2

[0056] The present invention also discloses a non-contact large-vibration ultrasonic scalpel testing method, comprising:

[0057] A laser sensing module, a positioning plate and a stage are provided, wherein the laser sensing module includes an integrated optical chip, a laser diode, a detector array and an optical lens, the positioning plate is located between the laser sensing module and the stage, the positioning plate is located at the focal position of the laser sensing module, and a positioning hole is provided on the positioning plate; the ultrasonic scalpel to be tested is placed on the stage, the part to be tested of the ultrasonic scalpel to be tested is placed in the positioning hole and passes through the positioning plate, the vibration amount of the part to be tested is measured by the laser sensing module using an optical interference method, and amplitude calibration and frequency measurement are performed through phase advanced differential signal analysis.

[0058] In this embodiment, when the vibration amount of the measured part is measured by the laser sensing module using an optical interference method, the vibration model of the scalpel to be measured can be fully obtained by measuring the normal vibration information through the dual-channel laser sensing module, and the vibration model includes the longitudinal vibration antinode and peak information of the waveguide rod.

[0059] In this embodiment, the vibration model of the scalpel to be tested is completely obtained by measuring the normal vibration information through the dual-channel laser sensor module, specifically:

[0060] like Figure 7 As shown, the laser sensor modules are respectively arranged in the three orthogonal directions of XYZ, and the three laser sensor modules are used in combination to measure the amplitude of the measured part in the three directions of XYZ; the three laser sensor modules are perpendicular to each other to form a cube, the diagonal lines of the cube coincide with the Z axis, and the angles between them are known.

[0061] Combining the angles formed by the projections of the three laser sensor modules on the XY plane and the X-axis, the vibration signals in the vertical and horizontal directions for the same measurement point are calculated as follows:

[0062]

[0063] In formula (1), d1, d2, and d3 are the displacement values ​​measured by the three laser sensor modules, and v x 、v y 、v z is the three-dimensional vibration displacement value of the part to be measured; θ x1 ,θ x2 ,θ x3 ,θ y1 ,θ y2 ,θ y3 ,θ z1 ,θ z2 ,θ z3 are the angles between the three laser sensor modules and the X-axis, Y-axis, and Z-axis respectively;

[0064] Obtain the angles between the three laser sensor modules and the X-axis, Y-axis, and Z-axis and substitute them into formula (1) to obtain the displacement values ​​measured by the three laser sensor modules and the three-dimensional vibration displacement value of the measured part.

[0065] In this embodiment, all variables are positive and negative. The projections of the three laser sensor modules on the XY plane are 0°, 120°, and -120° with the X axis, respectively. Substituting them into formula (1) yields:

[0066]

[0067] In this embodiment, while the laser sensor module uses optical interferometry to measure the vibration of the target area, a miniaturized laser sensor module can also be used to perform array-based multi-point measurements of the target area. In this embodiment, 16 different locations on the target area are simultaneously measured using a 4x4 array. The miniaturization of the chip-based sensor module allows for the advantages of complex design and functionality, enabling dozens or even hundreds of measurement channels on a single fiber optic sensor. This allows for real-time 3D vibration imaging of the localized, subtle neighborhood of the ultrasonic knife waveguide, supporting more complex testing.

[0068] In this embodiment, the amplitude calibration and frequency measurement are performed by performing phase advanced differential signal analysis, specifically:

[0069] The laser sensing platform in the present invention can provide multiple functions such as instantaneous displacement, vibration and optical phase measurement in laser velocimetry (LDV) through proprietary digital signal processing (DSP) algorithms. Based on the core sensor, the present invention has also achieved innovation in the measurement algorithm. The vibration amount v of the ultrasonic scalpel head is v = πf*A, where f is the vibration frequency and A is the vibration amplitude at this frequency point. Under normal circumstances, the vibration amount v is relatively large. For example, for an 80kHz ultrasonic scalpel, the vibration amplitude of the scalpel head can reach 100 microns, so the vibration amount exceeds 24 meters per second. The usual solution adopts a fixed graded dynamic range solution at the receiving end, which loses accuracy. If the harmonic signal of the object being measured is relatively large, the signal details cannot be detected. The present invention determines the correctness of the unpacked phase when the vibration amount is large by real-time analysis of the high-price differential of the phase signal, and realizes the real-time dynamic analysis of large vibration signals. The principle is as follows:

[0070] 1) The reason why Doppler phase accuracy cannot be maintained is that the displacement information cannot be recovered from the phase, or the recovered phase is limited by the actual sampling rate. As shown in the following formula, when the displacement speed is greater than the wavelength multiplied by the sampling rate, there will be phase ambiguity, that is: Δθ(n) = Δθ + 2kπ; where Δθ is the interval between two phase samples, and k can be any real integer.

[0071] 2) Ideally, ignoring the effects of noise, the excitation signal is a smooth curve, mathematically conforming to the definition of an analytic function: the Taylor series converges within the neighborhood of every point within its domain. Phase ambiguity can be eliminated by analyzing the continuity of higher-order derivatives of the sampled data. Typically, restoring the continuity of derivatives below the second order is sufficient to accurately recover phase information even with large vibrations and low sampling rates.

[0072] 3) In the ideal case, there is still noise, which will affect the analysis of derivative continuity. When higher-order derivatives need to be analyzed, and the higher the signal frequency, the greater the side effect of noise will be. In this case, it is necessary to perform filtering preprocessing on the original phase signal in the interval [-pi, pi]. The filter selection can be based on

[0073] The actual noise source is selected. One option is to set a low-pass or band-pass digital filter, another option is to use a 5-value filter, or other options are available.

[0074] Continuous analysis, expand the analyzed phase signal, and combine with the frequency detector to perform amplitude calibration and frequency measurement. The above process is completed in the digital domain and can be integrated into the algorithm chip. The process is as follows Figure 8 shown.

[0075] Expanding the parsed phase signal yields:

[0076]

[0077] Traditional phase frequency detectors (PFDs) recover information based on their principles. The PFD relies on an internal clock phase-locked loop (PLL) to compare the phase and frequency errors of two input signals. To ensure output stability, the PFD must generate an output even when the two signals have different phases and frequencies. Therefore, thresholds are typically set based on the bandwidth of the input signal, resulting in a loss of accuracy across a graded dynamic range. However, the present invention maintains the same accuracy across a wider dynamic range.

[0078] Compared with the prior art, the present invention has the following advantages:

[0079] 1. The present invention uses positioning holes to locate the part of the ultrasonic scalpel to be tested, greatly reducing the reliance on the position calibration of the imaging device and achieving rapid positioning measurement of the ultrasonic scalpel head in production. A miniaturized laser sensor module with an integrated optical chip is designed and used to perform optical interferometric measurement of the part to be tested. Combined with the advanced phase differential signal analysis method, it can quickly and non-contactly measure the time-varying amplitude, frequency, and phase information of the key points of the ultrasonic scalpel to obtain complete time-varying spectrum information. The present invention has been applied in actual product lines, realizing online automatic measurement of large-scale production. The measurement results in actual applications are shown in the figure below. Figure 9 shown.

[0080] 2. The present invention can be integrated into surgical instruments to measure the working status of the ultrasonic scalpel in real time during surgery to achieve remote monitoring of surgical results.

[0081] 3. The laser sensor module in this invention is based on an integrated optical chip. It can be multi-channel, acquiring information on the normal vibration of the ultrasonic scalpel waveguide, array-type, acquiring a local 3D vibration image of the ultrasonic scalpel waveguide, or scanning-type, acquiring an end-to-end 3D vibration image of the ultrasonic scalpel waveguide. This offers diverse functionality and a wide range of applications.

[0082] 4. The advanced phase differential signal analysis method used in the present invention supports the signal recovery algorithm for large vibration quantities. By performing real-time fitting analysis on phase differential signals of the first order or above, it avoids detecting phase breakpoints and can achieve measurement of large vibration quantity signals at the same sampling rate.

[0083] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0084] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the steps in the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0085] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0086] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 The steps for the function specified in one or more boxes.

[0087] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A non-contact large-vibration ultrasonic scalpel testing method, characterized in that: include: A laser sensor module, a positioning plate and a stage are provided. The laser sensor module includes an integrated optical chip, a laser diode, a detector array and an optical lens. The positioning plate is located between the laser sensor module and the stage and is located at the focal position of the laser sensor module. The positioning plate is provided with a positioning hole. Placing the ultrasonic surgical knife to be tested on the stage, placing the part to be tested of the ultrasonic surgical knife to be tested in the positioning hole and passing through the positioning plate, measuring the vibration amount of the part to be tested by the laser sensing module using an optical interferometric method, and performing amplitude calibration and frequency measurement by phase advanced differential signal analysis; When the laser sensor module uses an optical interferometric method to measure the vibration amount of the part to be measured, the vibration model of the scalpel to be measured is completely obtained by measuring the normal vibration information through the dual-channel laser sensor module, and the vibration model includes the antinode and crest information of the longitudinal vibration of the waveguide rod; The vibration model of the scalpel to be tested is fully obtained by measuring the normal vibration information through the dual-channel laser sensor module, specifically: The laser sensor modules are respectively arranged in three orthogonal directions of XYZ, and the three laser sensor modules measure the amplitude of the part to be measured in the three directions of XYZ; Combining the angles formed by the projections of the three laser sensor modules on the XY plane and the X-axis, the vibration signals in the vertical and horizontal directions for the same measurement point are calculated as follows: Where d1, d2, and d3 are the displacement values ​​measured by the three laser sensor modules, and v x 、v y 、v z is the three-dimensional vibration displacement value of the part to be measured; θ x1 ,θ x2 ,θ x3 ,θ y1 ,θ y2 ,θ y3 ,θ z1 ,θ z2 ,θ z3 are the angles between the three laser sensor modules and the X-axis, Y-axis, and Z-axis respectively; The displacement values ​​measured by the three laser sensor modules and the three-dimensional vibration displacement value of the measured part are obtained according to the angles between the three laser sensor modules and the X-axis, Y-axis and Z-axis.

2. The non-contact large-vibration ultrasonic surgical knife testing method according to claim 1, characterized in that: When the vibration amount of the part to be measured is measured by the laser sensor module using an optical interference method, the laser sensor module is used to perform array-type multi-point measurement on the part to be measured.

3. The non-contact large-vibration ultrasonic surgical knife testing method according to any one of claims 1-2, characterized in that: The amplitude calibration and frequency measurement are performed by performing phase advanced differential signal analysis, specifically: The original phase signal is filtered and preprocessed, and the phase signal after filtering and preprocessing is subjected to high-order differential continuity analysis. The analyzed phase signal is expanded and amplitude calibration and frequency measurement are performed in combination with a phase frequency detector.

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