Display module, electronic device and method for manufacturing display module

Abstract

The application discloses a display module, an electronic device and a preparation method of the display module. The display module comprises a display panel and further comprises a support configured to support the display panel, a grounding net configured on the support, the grounding net and the display panel being located on two sides of the support which are opposite to each other, the grounding net comprising a plurality of meshes, and a connecting adhesive, the connecting adhesive being located in the meshes, and the meshes being fixed to the support through the connecting adhesive.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a display module, an electronic device, and a method for manufacturing the display module. Background Technology

[0002] Currently, large-sized foldable screen phones on the market generally face the problems of being heavy and thick when folded, which seriously affects consumers' impression of foldable screen phones and limits their further popularization.

[0003] In related technologies, such as Figure 1 As shown, copper foil 2' is attached to the back of the support 1', and the copper foil 2' and the support 1' are bonded together using adhesive 3'. However, attaching copper foil 2' increases the weight and thickness of the foldable screen display module. Furthermore, the edges of copper foil 2' are prone to warping during the die-cutting process after attachment. Summary of the Invention

[0004] This application aims to provide a display module, an electronic device, and a method for manufacturing the display module, at least solving the problems of large weight and thickness of the display module.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application propose a display module, including a display panel, and further including: a support member for supporting the display panel; a grounding grid disposed on the support member, the grounding grid and the display panel being located on opposite sides of the support member, the grounding grid including multiple grids; and a connecting adhesive located within the grids, the grids being fixed to the support member by the connecting adhesive.

[0007] Secondly, embodiments of this application provide an electronic device, including: a display module as described in any of the first aspects.

[0008] Thirdly, embodiments of this application propose a method for manufacturing a display module for use in any of the first aspects of the display module. The method includes: placing a grounding grid on one side of a support member, such that the side of the grounding grid closest to the support member abuts against the support member; and dripping adhesive into the grid to fix the grid to the support member through the adhesive.

[0009] In the embodiments of this application, the display module includes a display panel, a support member, a grounding grid, and adhesive. The support member supports the display panel. The grounding grid is located on the side of the support member away from the display panel. The grounding grid includes multiple meshes, reducing the overall weight of the display module. Adhesive is placed within the meshes, allowing the meshes to be fixed to the support member, thus connecting the support member and the grounding grid. This eliminates the need to glue the grounding grid to the support member via a backing adhesive, reducing the thickness of the display module and consequently contributing to a reduction in the overall thickness of the electronic device. Furthermore, the adhesive within the meshes prevents the edges of the grounding grid from warping during subsequent die-cutting.

[0010] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0011] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0012] Figure 1 This is a structural diagram of a display module in related technologies.

[0013] Figure label:

[0014] Related technologies: 1' Support component, 2' Copper foil, 3' Connecting adhesive.

[0015] Figure 2 This is a schematic diagram of the structure of a display module according to an embodiment of this application;

[0016] Figure 3 This is one of the structural schematic diagrams of a display module according to an embodiment of this application;

[0017] Figure 4 This is a second schematic diagram of the structure of a display module according to an embodiment of this application;

[0018] Figure 5 This is a third schematic diagram of the structure of a display module according to an embodiment of this application;

[0019] Figure 6 This is a fourth schematic diagram of the structure of a display module according to an embodiment of this application;

[0020] Figure 7 This is one of the structural schematic diagrams of a display module according to another embodiment of this application;

[0021] Figure 8 This is a second schematic diagram of the structure of a display module according to another embodiment of this application;

[0022] Figure 9 This is a third schematic diagram of the structure of a display module according to another embodiment of this application;

[0023] Figure 10 This is a fourth schematic diagram of the structure of a display module according to another embodiment of this application;

[0024] Figure 11 This is one of the structural schematic diagrams of a display module according to another embodiment of this application;

[0025] Figure 12 This is a second schematic diagram of the structure of a display module according to another embodiment of this application;

[0026] Figure 13 This is a third schematic diagram of the structure of a display module according to another embodiment of this application;

[0027] Figure 14 This is a fourth schematic diagram of the structure of a display module according to another embodiment of this application;

[0028] Figure 15 This is the fifth schematic diagram of the structure of a display module according to another embodiment of this application;

[0029] Figure 16 This is the sixth schematic diagram of the structure of a display module according to another embodiment of this application.

[0030] Figure label:

[0031] 1 Support component, 10 Folding area, 12 Non-folding area, 2 Grounding mesh, 20 Mesh, 22 Opening, 24 Mesh strip, 240 First mesh strip segment, 242 Second mesh strip segment, 244 First strip section, 246 Second strip section, 26 Cavity, 3 Connecting adhesive, 4 Display panel. Detailed Implementation

[0032] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this application, it should be understood that the terms "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] The following is combined Figures 2-16 This application describes a display module and an electronic device according to embodiments thereof.

[0037] like Figure 2 , Figure 3 and Figure 16 As shown, a display module according to some embodiments of this application includes a display panel 4, and further includes: a support member 1 for supporting the display panel 4; a grounding grid 2 disposed on the support member 1, the grounding grid 2 and the display panel 4 being located on opposite sides of the support member 1, the grounding grid 2 including a plurality of grids 20; and a connecting adhesive 3 located within the grids 20, the grids 20 being fixed to the support member 1 by the connecting adhesive 3.

[0038] In the embodiments of this application, the display module includes a display panel 4, a support member 1, a grounding grid 2, and a connecting adhesive 3. The support member 1 supports the display panel 4. The grounding grid 2 is located on the side of the support member 1 facing away from the display panel 4. The grounding grid 2 includes multiple meshes 20, which reduces the overall weight of the display module. Simultaneously, the connecting adhesive 3 is provided within the meshes 20, allowing the meshes 20 to be fixed to the support member 1 by the connecting adhesive 3. This achieves the connection between the support member 1 and the grounding grid 2, eliminating the need to glue the grounding grid 2 to the support member 1 via a back-attachment method, thus reducing the thickness of the display module and consequently contributing to a reduction in the overall thickness of the electronic device. Furthermore, the connecting adhesive 3 within the meshes 20 also prevents the edges of the grounding grid 2 from warping during subsequent die-cutting.

[0039] In specific applications, the display module includes a foldable display module, the display panel 4 is a flexible screen, and the support member 1 includes a folding area 10 and a non-folding area 12. The support member 1 is folded or unfolded through the folding area 10. The grounding grid 2 is set in the non-folding area 12.

[0040] It is understandable that when the support member 1 is in a folded state, the non-folded areas 12 on both sides of the folded area 10 are arranged opposite each other, and the grounding grids 2 on both sides of the folded area 10 are arranged opposite each other or back to back.

[0041] Furthermore, the grounding grid 2 consists of at least two pieces, with at least one grounding grid 2 provided in each non-folded area 12.

[0042] In specific applications, the bonding adhesive 3 includes solid adhesive or liquid adhesive.

[0043] Furthermore, the adhesive 3 includes a liquid adhesive. When the adhesive 3 is in a liquid state, it is injected into the mesh 20. After the adhesive 3 solidifies, the mesh 20 is connected to the support member 1.

[0044] Furthermore, the adhesive 3 is injected into the grid 20 by means of inkjet printing or other methods.

[0045] like Figure 3 As shown, according to one embodiment of this application, the adhesive 3 is away from the surface of the support member 1 and is lower than the top of the grid 20. The grounding grid 2 is in contact with the support member 1 on the side close to the support member 1. The grounding grid 2 is fixed to the support member 1 by the adhesive 3 located inside the grid 20.

[0046] In this embodiment, the surface of the adhesive 3 facing away from the support member 1 is lower than the top of the grid 20. This ensures that the support member 1 is connected to the grid 20, while preventing the adhesive 3 from being higher than the grid 20, thus avoiding an increase in the overall thickness of the display module and preventing the adhesive 3 from overflowing.

[0047] Specifically, such as Figure 4 , Figure 5 and Figure 6 As shown, the shape of grid 20 can be a triangle, a square, or a hexagon.

[0048] It is understandable that one side of the grid 20 is attached to the support 1, and the side of the grid 20 that is attached to the support 1 and the top of the grid 20 are the opposite sides of the grid 20.

[0049] like Figures 7 to 10 As shown, according to some embodiments of this application, the mesh 20 is provided with at least one opening 22, two adjacent meshes 20 are connected through the opening 22, and the connecting adhesive 3 in the two adjacent meshes 20 is connected through the opening 22.

[0050] In this embodiment, at least one opening 22 is provided on the grid 20, and adjacent grids 20 are connected through the opening 22, so that the connecting adhesive 3 in adjacent grids 20 can be connected through the opening 22, thereby making the connecting adhesive 3 in adjacent grids 20 flatter, improving the flatness of the attachment, and ensuring good grounding of the grounding grid 2.

[0051] It should be noted that the adhesive 3 has a first state and a second state. In the first state, the adhesive 3 can flow, and in the second state, the adhesive 3 is cured to achieve the bonding between the mesh 20 and the support 1.

[0052] Specifically, after injecting the adhesive 3 into the grid 20, the adhesive 3 in the first state can flow to the adjacent grid 20 through the opening 22, thereby enabling the adhesive 3 to flow between at least some of the grids 20, improving the flatness of the adhesion, while ensuring good grounding.

[0053] It is understandable that the first state is liquid and the second state is solid.

[0054] In practical applications, all the grids 20 of the grounding grid 2 can be connected through the openings 22, allowing the liquid adhesive 3 to flow within all the grids 20, thus making the adhesive 3 within all the grids 20 smoother. This also reduces the difficulty of spraying the adhesive 3.

[0055] Furthermore, at least some of the grids 20 have multiple openings 22 to enable connectivity between the multiple grids 20.

[0056] Specifically, such as Figure 8 , Figure 9 and Figure 10 As shown, the shape of grid 20 can be a triangle, a square, or a hexagon.

[0057] like Figure 8 , Figure 9 and Figure 10 As shown, according to one embodiment of this application, the grounding grid 2 includes multiple columns of grids 20. Each of the multiple grids 20 located in the same column is provided with at least one opening 22. The multiple grids 20 located in the same column are connected through the openings 22, so that the connecting adhesive 3 in the multiple grids 20 located in the same column is connected through the openings 22.

[0058] In this embodiment, multiple grids 20 are arranged in multiple columns, and each of the multiple grids 20 in the same column is provided with at least one opening 22, so that the connecting adhesive 3 in the multiple grids 20 in the same column can be connected through the opening 22, which further improves the flatness of the connecting adhesive 3 in the grid 20, thereby ensuring the reliability of the connection between the grounding grid 2 and the support member 1, so that the grounding grid 2 has good grounding performance.

[0059] Furthermore, in any column of grid 20, at least one grid 20 is connected to a grid 20 in an adjacent column. Specifically, in any column of grid 20, at least one grid 20 has two openings 22, allowing multiple grids 20 in adjacent columns to be connected, thereby connecting the adhesive 3 within the adjacent grids 20.

[0060] Furthermore, all grids 20 are connected through openings 22, and the adhesive 3 within all grids 20 is connected through openings 22. Specifically, in each column of grids 20, multiple grids 20 are connected through openings 22, meaning that multiple grids 20 in each column are interconnected, allowing the adhesive 3 to flow in each column of grids 20. Furthermore, in any column of grids 20, at least one grid 20 is connected to a grid 20 in an adjacent column, thereby enabling multiple grids 20 in adjacent columns to connect, thus connecting multiple columns of grids and allowing the adhesive 3 to flow in all grids 20.

[0061] Furthermore, such as Figure 8 , Figure 9 and Figure 10 As shown, multiple grids 20 are arranged in a column along the first direction. Multiple columns of grids 20 are distributed along the second direction, so that the multiple grids 20 are set into a multi-column, multi-row structure.

[0062] like Figure 11 As shown, according to one embodiment of this application, the mesh 20 includes multiple mesh strips 24, which enclose a cavity 26, and the connecting adhesive 3 is disposed within the cavity 26; at least one mesh strip 24 includes a first mesh strip segment 240 and a second mesh strip segment 242 stacked together, the first mesh strip segment 240 is disposed on the support member 1, and the second mesh strip segment 242 is disposed on the side of the first mesh strip segment 240 facing away from the support member 1; wherein, the surface of the first mesh strip segment 240 facing away from the support member 1 is lower than the surface of the connecting adhesive 3, and the surface of the second mesh strip segment 242 facing away from the support member 1 is higher than the surface of the connecting adhesive 3.

[0063] In this embodiment, the grounding grid 2 includes multiple mesh strips 24, which enclose a cavity 26 for accommodating the bonding adhesive 3. Wherein, as... Figure 12 , Figure 13 and Figure 14 As shown, at least one mesh strip 24 includes a first mesh strip segment 240 and a second mesh strip segment 242. The first mesh strip segment 240 and the second mesh strip segment 242 are stacked together, and the first mesh strip segment 240 is lower than the surface of the adhesive 3. Therefore, the adhesive 3 can flow through the top of the first mesh strip segment 240 to the adjacent mesh 20, making multiple meshes 20 interconnected, thereby improving the flatness of the adhesive 3 bonding. At the same time, the adhesive 3 can cover the top of the first mesh strip segment 240, increasing the contact area between the adhesive 3 and the mesh 20, thereby improving the connection strength between the mesh 20 and the support member 1. In addition, the second mesh strip segment 242 is higher than the surface of the adhesive 3, which can prevent the adhesive 3 from overflowing and also prevent increasing the thickness of the display module.

[0064] Furthermore, there are multiple second mesh segments 242, which are spaced apart on the side of the first mesh segment 240 away from the support member 1.

[0065] It is understandable that the surface of the adhesive 3 is the side of the adhesive 3 that is away from the support member 1.

[0066] In one possible design, such as Figure 15 As shown, the mesh strip 24 includes a first strip portion 244 and a second strip portion 246. The second strip portion 244 and the first strip portion 246 are arranged along the width direction of the mesh strip 24. The second strip portion 246 is located on both sides of the first strip portion 244. The first strip portion 244 is lower than the liquid surface of the adhesive 3, and the second strip portion 246 is higher than the liquid surface of the adhesive 3. That is, in the cross-section perpendicular to the length direction of the mesh strip 24, the mesh strip 24 has a convex structure with a high middle and low sides, thereby increasing the contact area between the adhesive 3 and the mesh strip 24 through the first strip portion 244.

[0067] According to one embodiment of this application, the second mesh segment 242 is located at the intersection of multiple mesh segments 24, and the connecting adhesive 3 in adjacent meshes 20 is connected through the top of the first mesh segment 240.

[0068] In this embodiment, the second mesh segment 242 is disposed at the intersection of multiple mesh segments 24. That is, the height of the intersection of the mesh segments 24 is set relatively high, which ensures the strength of the mesh 20 and increases the contact area between the adhesive 3 and the mesh 20. The adhesive 3 in adjacent meshes 20 is connected through the top of the first mesh segment 240, ensuring the flatness of the adhesive 3 in adjacent meshes 20, thereby ensuring the grounding performance of the grounding grid 2.

[0069] It is understandable that among the multiple mesh strips 24, some mesh strips 24 constitute the edge of the grounding mesh 2. In specific applications, second mesh strip segments 242 are provided on the mesh strips 24 located at the edge of the grounding mesh 2 without intervals, thereby preventing the adhesive 3 from overflowing.

[0070] In practical applications, the mesh strip 24 is an integrated structure.

[0071] According to one embodiment of this application, the support member 1 includes any one of a carbon fiber plate, a titanium alloy plate, and an aluminum alloy plate; and / or, the grounding grid 2 includes a metal mesh; and / or, the connecting adhesive 3 includes optical adhesive or pressure-sensitive adhesive.

[0072] In this embodiment, the support member 1 includes any one of a carbon fiber plate, a carbon alloy plate, and an aluminum alloy plate, which can reduce the overall weight of the display module. The connecting adhesive 3 includes optical adhesive or pressure-sensitive adhesive. The optical adhesive or pressure-sensitive adhesive is dripped into the mesh 20 in a liquid state, and the mesh 20 is connected to the support member 1 after the optical adhesive or pressure-sensitive adhesive solidifies. The grounding mesh 2 includes a metal mesh to ensure the reliability of grounding.

[0073] It is understandable that optical adhesives or pressure-sensitive adhesives have a first state and a second state. When the optical adhesive or pressure-sensitive adhesive is in the first state, it is in a liquid state; when the optical adhesive or pressure-sensitive adhesive is in the second state, it is in a solidified state.

[0074] In practical applications, the support component 1 includes a carbon fiber plate, and the connecting adhesive 3 includes optical adhesive, which can effectively reduce the overall weight of the display module.

[0075] Optical adhesives include optically transparent adhesives.

[0076] According to some embodiments of this application, such as Figure 4 , Figure 5 , Figure 6 , Figure 8 , Figure 9 , Figure 10 , Figure 12 , Figure 13 and Figure 14 As shown, the shape of grid 20 includes any one of square, triangle or hexagon.

[0077] In this embodiment, the shape of the grid 20 can be various shapes, such as square, triangle or hexagon, etc.

[0078] In practical applications, multiple grids 20 in the grounding grid 2 have the same shape to reduce production difficulty.

[0079] According to some embodiments of this application, the adhesive 3 covers the bottom of the mesh 20.

[0080] In this embodiment, the adhesive 3 covers the bottom of the mesh 20, increasing the contact area between the adhesive 3 and the mesh 20, thereby improving the connection strength between the mesh 20 and the support 1.

[0081] According to one embodiment of this application, an electronic device is proposed, including a display module as proposed in any of the above embodiments, and thus has the beneficial effects of the display module proposed in any of the above embodiments, which will not be repeated here.

[0082] According to one embodiment of this application, a method for preparing a display module is also proposed for use in any of the above embodiments. The preparation method includes: placing a grounding grid 2 on one side of a support member 1, so that the side of the grounding grid 2 closest to the support member 1 abuts against the support member 1; dripping a connecting adhesive 3 into the grid 20 so that the grid 20 is fixed to the support member 1 by the connecting adhesive 3.

[0083] In this embodiment, when preparing the display module, the grounding grid 2 is placed on one side of the support member 1 so that the grounding grid 2 abuts against one side of the support member 1. Then, the connecting adhesive 3 is dripped into the grid 20 of the grounding grid 2. After the connecting adhesive 3 solidifies, the grid 20 is fixed on the support member 1, thereby achieving the grounding of the display module.

[0084] Furthermore, adhesive 3 is dripped into the grid 20 using methods such as inkjet printing.

[0085] According to some embodiments of this application, the grid 20 is provided with at least one opening 22, and two adjacent grids 20 are connected through the opening 22; the step of dripping connecting adhesive 3 into the grid 20 to fix the grid 20 to the support member 1 by the connecting adhesive 3 includes: dripping connecting adhesive 3 into the grid 20, the connecting adhesive 3 flowing between multiple grids 20 through the opening 22, and waiting for the connecting adhesive 3 to cure so that the grid 20 is fixed to the support member 1 by the connecting adhesive 3.

[0086] In this embodiment, the grid 20 is provided with at least one opening 22, and adjacent grids 20 are connected through the opening 22, so that the adhesive 3 in adjacent grids 20 can be connected through the opening 22. Thus, the step of dripping adhesive 3 into the grid 20 specifically includes: dripping adhesive 3 into the grid 20, allowing the adhesive 3 to flow through the opening 22 into adjacent grids 20, thereby making the adhesive 3 in adjacent grids 20 more even, improving the flatness of the adhesion, and ensuring good grounding of the grounding grid 2.

[0087] Specifically, the present invention proposes a grounding scheme for the support member 1, which can reduce the thickness and weight of the display module while preventing the edge of the grounding grid 2 from warping and improving the reliability of the grounding of the support member 1.

[0088] Furthermore, the support member 1 includes a carbon fiber plate, and the grounding grid 2 includes a copper mesh.

[0089] In one possible design, such as Figures 2 to 6 As shown, a copper mesh is attached to the non-bending area of ​​the carbon fiber plate. The repeating units of the copper mesh can be composed of polygons such as rectangles, triangles, or regular hexagons. The mesh 20 of the copper mesh is filled with liquid optical clear resin (OCR). The OCR covers the bottom of the mesh 20, with the liquid level slightly lower than the height of the copper mesh, so that the copper mesh can be firmly bonded to the carbon fiber plate while ensuring good grounding performance. The OCR can be dripped into the copper mesh through inkjet printing or other methods.

[0090] The grounding scheme of carbon fiber plate + copper mesh + OCR adhesive proposed in this application has the following advantages: Using copper mesh instead of copper foil as the grounding layer can effectively reduce the weight of the display module and better utilize the advantages of low density and light weight of carbon fiber plate. Adding OCR adhesive to the copper mesh instead of attaching the copper mesh on the adhesive reduces the overall thickness of the display module, which is beneficial for thinning foldable screen phones. The copper mesh is fixed by the OCR adhesive inside the mesh 20, and unlike copper foil, it is less prone to large-scale edge warping during the subsequent die-cutting process of the carbon fiber plate, thus improving the module yield.

[0091] In one possible design, such as Figures 7 to 10 As shown, a copper mesh is attached to the non-bending area of ​​the carbon fiber plate. The repeating units of the copper mesh can be composed of polygons such as rectangles, triangles, or regular hexagons. Liquid OCR is filled into the copper mesh 20, covering the bottom of the mesh 20. The liquid level is slightly lower than the height of the copper mesh. Each repeating unit of the copper mesh has one or more openings 22. The function of the openings 22 is to allow the OCR adhesive to flow between the repeating units before curing, improving the flatness of the attachment and ensuring good grounding performance.

[0092] The grounding scheme of carbon fiber + copper mesh + OCR adhesive proposed in this application has the following advantages: Using copper mesh instead of copper foil as the grounding layer can effectively reduce the weight of the display module and better utilize the advantages of low density and light weight of carbon fiber board. Adding OCR adhesive to the copper mesh instead of attaching it reduces the overall thickness of the display module, which is beneficial for thinning foldable screen phones. The copper mesh is fixed by the OCR adhesive inside the mesh 20, and unlike copper foil attachment, it is less prone to large-scale edge warping during the subsequent die-cutting process of the carbon fiber board, thus improving the module yield.

[0093] In one possible design, such as Figures 11 to 14 As shown, a copper mesh is attached to the non-bending area of ​​the carbon fiber plate. The repeating units of the copper mesh can be composed of polygons such as rectangles, triangles, or regular hexagons. The corners of the repeating units of the copper mesh are higher than other edges. The mesh 20 is filled with liquid OCR, which covers the bottom of the mesh 20. The liquid level is higher than the edge height of the copper mesh but slightly lower than the corner height. The height design of the copper mesh can increase the contact area between the OCR and the copper mesh, so that the copper mesh can be firmly bonded to the carbon fiber plate. At the same time, the OCR adhesive can also flow between the meshes 20 before curing, improving the flatness of the attachment and ensuring good grounding performance.

[0094] The grounding scheme of carbon fiber plate + copper mesh + OCR adhesive proposed in this application has the following advantages: Using copper mesh instead of copper foil as the grounding layer can effectively reduce the weight of the screen module and better utilize the advantages of low density and light weight of carbon fiber plate. Adding OCR adhesive to the copper mesh instead of attaching it reduces the overall thickness of the display module, which is beneficial for thinning foldable screen phones. The copper mesh is fixed by the OCR adhesive inside the mesh 20, and unlike copper foil attachment, it is less prone to large-scale edge warping during the subsequent die-cutting process of the carbon fiber plate, thus improving the module yield.

[0095] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0096] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, comprising a display panel, characterized in that, Also includes: A support member for supporting the display panel, the support member including a folding area and a non-folding area, the support member being folded or unfolded through the folding area; A grounding grid is provided in the non-folded area of ​​the support member. The grounding grid and the display panel are located on opposite sides of the support member. The grounding grid includes multiple grids. A connecting adhesive is located within the mesh, and the mesh is fixed to the support member by the connecting adhesive. The surface of the adhesive facing away from the support is lower than the top of the grid. The side of the grounding grid closest to the support abuts against the support. The grounding grid is fixed to the support by the adhesive located inside the grid.

2. The display module according to claim 1, characterized in that, The grid has at least one opening, and two adjacent grids are connected through the opening. The adhesive in two adjacent grids is connected through the opening.

3. The display module according to claim 1, characterized in that, The grounding grid includes multiple columns of grids, and each of the multiple grids in the same column is provided with at least one opening. The multiple grids in the same column are connected through the openings, so that the adhesives in the multiple grids in the same column are connected through the openings.

4. The display module according to claim 1, characterized in that, The mesh comprises multiple mesh strips, which enclose a cavity, and the connecting adhesive is applied inside the cavity. At least one of the mesh strips includes a first mesh strip segment and a second mesh strip segment stacked together, the first mesh strip segment being disposed on the support member, and the second mesh strip segment being disposed on the side of the first mesh strip segment opposite to the support member; In this configuration, the surface of the first mesh segment facing away from the support member is lower than the surface of the connecting adhesive, while the surface of the second mesh segment facing away from the support member is higher than the surface of the connecting adhesive.

5. The display module according to claim 4, characterized in that, The second mesh segment is located at the intersection of the plurality of mesh segments, and the connecting adhesive in adjacent meshes is connected through the top of the first mesh segment.

6. The display module according to any one of claims 1 to 5, characterized in that, The support component includes any one of carbon fiber plate, titanium alloy plate, and aluminum alloy plate; and / or, The grounding grid includes a metal mesh; and / or, The adhesive includes optical adhesive or pressure-sensitive adhesive.

7. An electronic device, characterized in that, include: The display module as described in any one of claims 1 to 6.

8. A method for manufacturing a display module, used in the display module as described in any one of claims 1 to 6, characterized in that, The preparation method includes: Place the grounding grid on one side of the support member, so that the side of the grounding grid closest to the support member abuts against the support member; The adhesive is dripped into the mesh to fix the mesh to the support member.

9. The method for preparing a display module according to claim 8, characterized in that, The grid has at least one opening, and two adjacent grids are connected through the opening; The step of dripping the adhesive into the mesh to fix the mesh to the support member by the adhesive includes: The adhesive is dripped into the mesh and flows between the meshes through the opening. The adhesive is then allowed to cure so that the meshes are fixed to the support member by the adhesive.

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