Method for manufacturing electronic component and electronic component

Abstract

In a method for manufacturing an electronic component having a housing in which terminals are embedded, the terminal has a tapered portion with a width that tapers to a point and an extension portion extending from the front end of the narrower side of the tapered portion. The mold constituting the cavity includes an upper mold and a sliding mold. After the extension portion is positioned in a groove formed on one side of the sliding mold, the sliding mold is slid relative to the extension portion, and the end edges of the two sides of the groove facing the cavity are abutted against the two sides of the tapered portion. By making the upper mold and one side tightly connected, and by using the bottom surface of the groove and the upper mold to clamp a portion of the tapered portion and the extension portion located in the groove, the remaining portion of the tapered portion is formed in a state where it is in the cavity. A connecting portion protruding from the housing is formed by the portion of the tapered portion and the extension portion.

Description

Technical Field

[0001] The present invention relates to electronic components having a housing in which terminals are embedded and a method thereof. Background Technology

[0002] Figure 1 (a) An existing example of such an electronic component is the connector 10 disclosed in Patent Document 1 (Japanese Patent Application Publication No. 10-264163). Figure 1 (b) Its cross-section is shown in magnification. The connector 10 is configured such that the contact 11 is embedded in the housing (referred to as the insulator in Patent Document 1) 12. Figure 1 In the diagram, 11a shows the lead-out portion of contact 11, and 11b shows the fitting portion of contact 11.

[0003] Figure 2 The diagram shows a contact component 15 inserted into a mold, with a plurality of contacts 11 arranged in a comb-like pattern via slits between the lead-out side plate 16 and the fitting side plate 17.

[0004] Figure 3 The diagram shows the molded state when the embedded mold structure is closed. In the figure, 21 represents the middle mold plate, 22 represents the base plate integrally protruding from the middle mold plate 21, and 23 represents a pair of sliding mold plates that can freely contact and separate from the two sides of the middle mold plate 21 and can move on the base plate 22. In addition, 24 represents a movable mold plate, and 25 represents a cavity.

[0005] like Figure 4 As shown, the sliding template 23 is provided with a first protrusion group 26 for easy access to the slit of the fitting portion 11b of the contact member 15, and a second protrusion group 27 for easy access to the slit of the lead-out portion 11a of the contact member 15. The contact member 15 is positioned by these first protrusion groups 26 and second protrusion groups 27. During mold closing, the lead-out side plate 16 is pressed and fixed by the movable template 24, and the fitting side plate 17 is pressed and fixed by the sliding template 23. Figure 3 The middle contact component 15 is shown in thick lines.

[0006] After resin is injected into the cavity 25 to form the connector, the mold is opened and the connector is removed. The lead-out part 11a and the fitting part 11b are then cut and folded to a specified length, thus becoming... Figure 1 Connector 10 is shown. Summary of the Invention

[0007] As described above, in the connector 10, where terminals are embedded in an electronic component molded into a housing, the terminals need to be positioned during molding to ensure they are in a specified position. In Patent Document 1, a first protrusion group 26 and a second protrusion group 27 are provided in the sliding template 23, and the contact 11 is inserted into the groove between these protrusion groups for positioning.

[0008] However, in this case where a groove is set in the mold and the terminal is inserted and positioned, if the gap between the terminal and the groove is set too narrow in the groove width direction, the insertion performance of the terminal into the groove will deteriorate, for example, the mold and the terminal may interfere, causing damage to the terminal. Therefore, it is necessary to widen the gap between the terminal and the groove to a certain extent. In this case, resin leakage from the gap between the terminal and the groove may occur during molding.

[0009] Leaked resin forms resin burrs that adhere to the portion of the terminal protruding from the housing. Therefore, in cases where this portion of the terminal protrudes from the housing, for example, is a solder joint where it is soldered to a pad on the substrate, the presence of these resin burrs may result in insufficient solder quality and strength. Furthermore, in cases where this portion of the terminal protrudes from the housing, for example, is a contact portion that contacts a terminal of an adjacent electronic component, the presence of these resin burrs may impair contact quality, or the resin burrs may be scraped off during contact, creating debris.

[0010] In view of the above circumstances, the present invention aims to provide a method for manufacturing electronic components that can suppress the generation of resin burrs that adversely affect quality, and to provide electronic components that can be manufactured using such a method.

[0011] According to an embodiment of the present invention, in a method for manufacturing an electronic component having a housing in which terminals are embedded, the terminals have a tapered portion with a width that tapers to a point, and an extension portion extending from the front end of the narrower side of the tapered portion. The mold constituting the cavity for forming the housing includes a first mold and a second mold. After the extension portion is positioned in a groove formed on one side of the second mold, the second mold is slid relative to the extension portion, and the end edges of the two sides of the groove facing the cavity are abutted against the two sides of the tapered surface constituting the tapered portion. The remaining portion of the tapered portion is formed in a state where the first mold and one side are in close contact, and the bottom surface of the groove and the first mold clamp a portion of the tapered portion and the extension portion located in the groove, and the remaining portion of the tapered portion is positioned in the cavity. A connecting portion protruding from the housing is formed by the portion of the tapered portion and the extension portion.

[0012] Invention Effects

[0013] According to the method for manufacturing electronic components according to embodiments of the present invention, resin leakage can be prevented when the terminals are embedded and molded into the housing, thus eliminating the problem of resin burrs caused by resin leakage at the connection portion of the terminals protruding from the housing.

[0014] Furthermore, the electronic component according to the embodiments of the present invention has a structure that allows for the application of the manufacturing method of the electronic component according to the embodiments of the present invention, thus enabling the production of an electronic component without resin burrs at the connection portion protruding from the housing at the terminal. Attached Figure Description

[0015] Figure 1 (a) is a perspective view of an existing connector, and (b) is an enlarged cross-sectional view of it.

[0016] Figure 2 It is shown that it is used for Figure 1 (a) is a perspective view of the contact components of the connector being manufactured.

[0017] Figure 3 (a) is used to explain manufacturing Figure 1 (a) is a diagram of the mold structure of the connector, and (b) is a partial enlarged view of (a).

[0018] Figure 4 It is shown Figure 3 (a) is a perspective view of the main parts of the sliding template.

[0019] Figure 5 (a) is a perspective view showing a schematic structure of a conventional example of a connector as an electronic component, and (b) is a perspective view of the connector shown in (a) upside down.

[0020] Figure 6 (a) is a perspective view showing the schematic structure of a first embodiment of a connector, which is an example of an electronic component in this embodiment, and (b) is a perspective view of the connector shown in (a) upside down.

[0021] Figure 7 This is a diagram illustrating a manufacturing method of embedding terminals into a housing.

[0022] Figure 8 (a) is shown Figure 5 (b) shows a partially enlarged perspective view of the connector, and (b) is a diagram illustrating the manufacturing method of the connector shown in (a).

[0023] Figure 9 (a) is shown Figure 6 (b) shows a partially enlarged perspective view of the connector, and (b) is a diagram illustrating the manufacturing method of the connector shown in (a).

[0024] Figure 10 (a) is a perspective view showing a second embodiment of the connector as an electronic component of this embodiment, (b) is a perspective view with the connector shown in (a) upside down, (c) is a partially enlarged view of (b), and (d) is a partially enlarged plan view of (c).

[0025] Figure 11 (a) is a perspective view showing the end of the connector, which is an electronic component of this embodiment, in a third embodiment; (b) is a partially enlarged side view of (a) viewed from the direction of arrow a; and (c) is a partially enlarged front view of (a) viewed from the direction of arrow b.

[0026] Figure 12 (a) is a perspective view showing a fourth embodiment of a connector as an electronic component in this embodiment, and (b) is a partially enlarged side view of (a). Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be compared and described with reference to the accompanying drawings.

[0028] Figure 5 And 6 respectively show the schematic structure of a connector, which is an example of an electronic component subject to this embodiment. Figure 6 The connector 40 of this embodiment is shown. Figure 5 Showing with Figure 6 In contrast, connector 30 with an existing structure is shown. These connectors 30, 40 are one side of forming a substrate-to-substrate connector, and are surface-mount connectors on the substrate.

[0029] The connector 30 consists of a resin housing 31 and six terminals 32 arranged in two rows. The housing 31 is rectangular in shape and has a recess 33 formed on its upper surface 31a. One end of each terminal 32 is embedded in the sidewall 34 of the recess 33 around the sidewall 34, while the other end is located on the bottom surface 31b of the housing 31 and protrudes from the housing 31. The portion of the terminal 32 protruding from the housing 31 forms a connecting portion 35. In the connector 30, including the connecting portion 35, the portion of the terminal 32 located on the bottom surface 31b of the housing 31 is simply square in shape.

[0030] On the other hand, the connector 40 of this embodiment is the same as the connector 30, consisting of a resin housing 41 and six terminals 42 arranged in two rows. Similar to the connector 30, one end of each terminal 42 is embedded in a sidewall 44 that is clamped by a recess 43 formed on the upper surface 41a of the rectangular housing 41, and the other end is located on the bottom surface 41b of the housing 41 and protrudes from the housing 41. However, the shape of the part of the terminal 42 located on the bottom surface 41b of the housing 41 is different from that of the connector 30.

[0031] That is, in this example, the other end of each terminal 42 located on the bottom surface 41b of the housing 41 is composed of a tapered portion 46 with a width that tapers to a point, an extension 47 extending from the front end of the narrower side of the tapered portion 46, and a base 48 continuing to the base end of the wider side of the tapered portion 46. A portion of the tapered portion 46 and the extension 47 protrude from the housing 41, while the remaining portion of the tapered portion 46 and the base 48 are embedded in the housing 41. In this example, the connecting portion 45 protruding from the housing 41 is composed of a portion of the tapered portion 46 and the extension 47.

[0032] In the connector 30 described above, terminal 32 is configured to be embedded in housing 31, and in connector 40, terminal 42 is also configured to be embedded in housing 41. Figure 7 An example of manufacturing connector 30 based on such an embedding molding manufacturing method is shown.

[0033] In this example, the molding die consists of an upper die (first die) 51, a lower die 52 and two sliding dies (second dies) 53. The lower die 52 is housed and supported on the base 54 and protrudes from the base 54. The two sliding dies 53 are able to slide on the base 54. Figure 7 (1) to (3) in the diagram show the state of the embedding molding process in sequence. Figure 7 (b) The diagram shows the state of the upper mold 51 (omitted) and viewed from the direction of the upper mold 51. The connecting portions 35 of the terminals 32 are received on one side (upper surface) of each of the two sliding molds 53, and positioning grooves 55 are formed therein. A stepped portion 56 is formed on the upper surface of the lower mold 52 for mounting the end of the terminal 32 opposite to the connecting portion 35. The embedding molding process will be described below.

[0034] (1) In this state, the sliding molds 53 located on the left and right sides of the lower mold 52 respectively leave the lower mold 52, and the upper mold 51 located above the sliding mold 53 also leaves the sliding mold 53. In this state, the terminal 32 is inserted, and a portion (front end side) of the connecting part 35 is housed and positioned in the groove 55 of the sliding mold 53. It should be noted that the three terminals 32 on each side are supported by the carrier and are integrated, but the illustration of the carrier is omitted in this example.

[0035] (2) The sliding mold 53 is slid to make close contact with the lower mold 52, and the upper mold 51 is lowered to make close contact with the sliding mold 53, thus closing the mold to form a cavity 57. It should be noted that the sliding action of the sliding mold 53 and the lowering action of the upper mold 51 are carried out in a coordinated manner.

[0036] (3) Inject the resin into the cavity 57 and form the shell 31 by injection molding.

[0037] After the above steps are completed, the embedding molding is finished. Then, the connector 30 is completed by opening the mold and cutting and removing the carrier (not shown in the figure).

[0038] Before describing the manufacturing method of the connector 40 in this embodiment, please refer to... Figure 8 This describes a situation where resin leakage occurs and resin burrs are generated at the connection portion 35 of the terminal 32 during the manufacturing of a connector 30 with an existing structure that is embedded and molded as described above.

[0039] Figure 8 (b) shows (1) to (3) in which Figure 8(a) An enlarged view of the portion of connector 30 where the connection portion 35 of one terminal 32 is located, showing the relationship between the connection portion 35 of terminal 32 and the sliding mold 53, and the occurrence of resin leakage. Figure 8 (b) of (1) to (3) and Figure 7 The embedded molding process shown corresponds to steps (1) to (3). It should be noted that in... Figure 8 In (b) of (3), 60 represents the resin that forms the shell 31.

[0040] Even when the sliding mold 53 is in the closed state, a gap c exists between the groove 55 of the sliding mold 53 and the connection portion 35 of the terminal 32. Therefore, resin leakage occurs through this gap c, and the leaked resin forms resin burrs 61 that adhere to and remain on the connection portion 35. It should be noted that... Figure 8 (b) (3) shows the state in which the connecting part 35 is offset (eccentric) relative to the groove 55.

[0041] In contrast, Figure 9 and Figure 8 In comparison, the manufacturing method of connector 40 in this embodiment prevents resin leakage, i.e., prevents the formation of resin burrs. The following will describe the situation in turn. Figure 9 (b) shows the molding process in (1) to (3).

[0042] (1) Insert the terminal 42 into the molding die and position the extension 47 of the terminal 42 in the groove 55 of the sliding die 53.

[0043] (2) The sliding mold 53 is slidable, that is, the sliding mold 53 is slid relative to the extension 47, and the end edges of the two sides 55a, 55b of the groove 55 facing the cavity 57 abut against the two sides 46a, 46b of the conical surface of the conical portion 46 constituting the terminal 42. As the sliding mold 53 slides, the upper mold 51 also descends to the closed state (see reference). Figure 7 (a) of (2), Figure 7 (b) of (2)).

[0044] In the closed state, the upper mold 51 is in close contact with the upper surface of the sliding mold 53. The connecting part 45, which consists of a portion of the tapered portion 46 of the terminal 42 located in the groove 55 of the sliding mold 53 and the extension portion 47, is clamped by the bottom surface of the groove 55 and the upper mold 51. The remaining portion of the tapered portion 46 and the base 48 are located in the cavity 57.

[0045] (3) Inject resin 60 into cavity 57 and form. The end edges of the two sides 55a and 55b of the groove 55 facing cavity 57 abut against the two sides 46a and 46b of the cone 46 of terminal 42, so resin 60 stops and resin leakage is not generated, that is, no resin burrs are generated in the connection part 45.

[0046] The above describes this embodiment using connector 40 as an example. Next, refer to... Figures 10-12 An embodiment is further illustrated in which a portion of the tapered portion and the extension portion are used to form a connection portion of the terminal protruding from the housing and to prevent resin leakage during embedding molding and suppress the generation of resin burrs.

[0047] Figure 10 and Figure 6 Similar to connector 40, a surface-mount connector 70 is shown, in which signal terminals 72 and power terminals 73 are embedded in a housing 71, and a reinforcing metal member 74 is also embedded. Terminals 72 and 73, as well as the reinforcing metal member 74, all have connecting portions 72a, 73a, and 74a protruding from the housing 71, which are soldered to pads on the substrate. In this example, these connecting portions 72a, 73a, and 74a have the same shape as the connecting portion 45 of connector 40. Figure 10 In (c) and (d), 72b, 73b, and 74b represent the cone portion, respectively.

[0048] Figure 11 The diagram shows the end of connector 80 where a reinforcing metal member 82 is embedded in a housing 81. The reinforcing metal member 82 has connecting portions 83-86 protruding from the housing 81, which are soldered to pads on a substrate. Connecting portions 83-86 all have the same shape as connecting portion 45 of connector 40. Figure 11 In (b) and (c), 83a and 85a represent the cone portion, respectively.

[0049] Figure 12 The diagram shows connectors 90 with terminals 92 embedded in a housing 91, each end protruding from the housing 91. A connecting portion 93, protruding vertically from the housing 91, engages with the terminals of the opposite connector to form a contact portion. A connecting portion 94, protruding horizontally from the housing 91, forms a solder portion for soldering to pads on the substrate. These connecting portions 93 and 94 have the same shape as the connecting portion 45 of connector 40. Figure 12 In the diagram, 93a and 94a represent the cone portion, respectively.

[0050] The above describes various embodiments, but the electronic components to which this embodiment is applied are not limited to connectors, as long as the terminals are embedded in the housing and the terminals have a connecting portion protruding from the housing.

[0051] The following effects can be obtained from the method for manufacturing electronic components according to this embodiment.

[0052] 1) It can prevent resin leakage when the terminal is embedded in the housing, thus eliminating the occurrence of defects such as resin burrs caused by resin leakage at the connection part of the terminal protruding from the housing.

[0053] 2) The terminal connection portion, having a tapered portion, is such that during the sliding of the sliding mold (when the mold is closed)... Figure 9 As shown, the centering of the groove in the sliding mold can improve the positional accuracy of the connection part and is also conducive to narrowing the pitch.

[0054] 3) When the terminal is inserted into the molding die and the connection part of the terminal is located in the groove of the sliding die, the insertion will not be hindered because the extension part with a large gap between it and the groove is located in the groove of the sliding die.

Claims

1. A method for manufacturing an electronic component, comprising a housing in which terminals are embedded and formed, characterized in that, The terminal has a tapered portion that tapers towards the tip and an extension that extends from the front end of the narrower side of the tapered portion. The mold constituting the cavity for forming the shell includes a first mold and a second mold. After positioning the extension in the groove formed on one side of the second mold, the second mold is slid relative to the extension, and the end edges of the two sides of the groove facing the cavity abut against the two sides of the conical surface constituting the cone. By molding the first mold and the first surface in close contact, and by using the bottom surface of the groove and the first mold to clamp a portion of the cone and the extension located in the groove, while the remaining portion of the cone is located in the cavity, a connecting portion protruding from the housing is formed by the portion of the cone and the extension.

2. The method for manufacturing an electronic component as described in claim 1, characterized in that, The connection portion is either a solder portion that is soldered to the pads of the substrate or a contact portion that contacts the terminals of the electronic components on the other side.

3. An electronic component having a housing in which terminals are embedded and molded, The terminal has a tapered portion that tapers towards the tip and an extension that extends from the front end of the narrower side of the tapered portion. A portion of the cone and the extension protrude from the housing to form a connection. The remaining portion of the cone is embedded in the housing.

4. The electronic component as described in claim 3, characterized in that, The connection portion is either a solder portion that is soldered to the pads of the substrate or a contact portion that contacts the terminals of the electronic components on the other side.

Images