Addressing transfer apparatus and addressing transfer method

Abstract

This invention provides an addressing transfer device and an addressing transfer method. The device includes: a light-emitting component and an adhesion component; the light-emitting component includes: a transfer substrate; a driving substrate disposed on one side of the transfer substrate; a plurality of de-adhesion light sources disposed at intervals on the side of the driving substrate away from the transfer substrate, the plurality of de-adhesion light sources being electrically connected to the driving substrate, the driving substrate being used to illuminate or de-illuminate a target de-adhesion light source among the plurality of de-adhesion light sources; and an adhesive layer disposed on the side of the driving substrate away from the transfer substrate and covering the plurality of de-adhesion light sources, the light-emitting component adhering to the adhesion component through the adhesive layer; the adhesion component includes: an adhesion substrate; and a photo-adhesion transfer head disposed on one side of the adhesion substrate, the photo-adhesion transfer head being used to adhere microelectronic components and release the corresponding microelectronic components to a target substrate under the irradiation of the target de-adhesion light source.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to an address transfer device and an address transfer method. Background Technology

[0002] Micro-LED (Micro light-emitting diode) display technology boasts advantages such as high brightness, high response speed, low power consumption, and long lifespan, making it a hot research topic in the pursuit of next-generation display technologies. Currently, Micro-LEDs are difficult to grow directly on glass substrates and require transfer techniques to transfer them from a carrier substrate to the glass substrate. Commonly used transfer techniques include stamp transfer and laser transfer. However, stamp transfer can only perform fixed-position transfers and cannot handle mass repairs of random defects. Laser transfer requires point-by-point transfer and cannot perform selective transfers, resulting in lower transfer efficiency and yield. Summary of the Invention

[0003] Therefore, in order to overcome at least some of the defects and deficiencies in the prior art, embodiments of the present invention provide an addressing transfer device and an addressing transfer method.

[0004] Specifically, in one aspect, an addressing and transfer device provided by an embodiment of the present invention includes: a light-emitting component and an adhesion component; wherein, the light-emitting component includes: a transfer substrate; a driving substrate disposed on one side of the transfer substrate; a plurality of de-adhesion light sources disposed at intervals on the side of the driving substrate away from the transfer substrate, the plurality of de-adhesion light sources being electrically connected to the driving substrate, the driving substrate being used to illuminate or de-illuminate a target de-adhesion light source among the plurality of de-adhesion light sources; and an adhesive layer disposed on the side of the driving substrate away from the transfer substrate and covering the plurality of de-adhesion light sources, the light-emitting component adhering to the adhesion component through the adhesive layer; the adhesion component includes: an adhesion substrate; and a photo-adhesion transfer head disposed on one side of the adhesion substrate, the photo-adhesion transfer head being used to adhere microelectronic components and release the corresponding microelectronic components to a target substrate under the irradiation of the target de-adhesion light source.

[0005] In one specific embodiment of the present invention, the photoadhesive transfer head includes a plurality of first protrusions spaced apart from each other, and the plurality of first protrusions correspond one-to-one with the plurality of adhesive dissolution light sources.

[0006] In one specific embodiment of the present invention, the adhesive layer includes a plurality of second protrusions spaced apart from each other, and the plurality of second protrusions correspond one-to-one with the plurality of debonding light sources.

[0007] In one specific embodiment of the present invention, the distance between two adjacent microelectronic components on the target substrate is an integer multiple of the distance between two adjacent debonding light sources.

[0008] In a specific embodiment of the present invention, the light emission angle α of each of the adhesive dissolution light sources is: α<90°-arcsin(1 / n), where α is the light emission angle and n is the refractive index of the photodissolution transfer head.

[0009] In one specific embodiment of the present invention, the plurality of adhesive dissolving light sources are infrared LED light sources, and the photoadhesive dissolving transfer head is an infrared photoadhesive dissolving transfer head.

[0010] In one specific embodiment of the present invention, the plurality of adhesive dissolution light sources are ultraviolet LED light sources, and the photo-dissolution transfer head is an ultraviolet photo-dissolution transfer head.

[0011] On the other hand, an addressing transfer method provided by an embodiment of the present invention includes: adhering a first adhesion component to a light-emitting component; providing a carrier substrate on which a first microelectronic element is disposed; adhering the first microelectronic element from the carrier substrate to a photoadhesive transfer head of the first adhesion component; using a driving substrate of the light-emitting component to illuminate a target deadhesive light source among a plurality of deadhesive light sources on the light-emitting component; releasing the first microelectronic element corresponding to the photoadhesive transfer head to the target substrate after being irradiated by the target deadhesive light source; and separating the first adhesion component from the light-emitting component.

[0012] In one specific embodiment of the present invention, the addressing transfer method further includes: performing performance testing on the first microelectronic component on the target substrate to obtain the defect location on the target substrate; determining the corresponding redundant location based on the defect location; using the light-emitting component to adhere a second adhesion component; and using the light-emitting component and the second adhesion component to transfer the second microelectronic component on the carrier substrate to the redundant location.

[0013] In a specific embodiment of the present invention, the light emission angle α of each of the adhesive dissolution light sources is: α<90°-arcsin(1 / n), where α is the light emission angle and n is the refractive index of the photodissolution transfer head.

[0014] As can be seen from the above, the embodiments of the present invention, by setting a driving substrate, multiple debonding light sources, and a photo-debonding transfer head on the addressing and transfer device, control the lighting or turning off of the target debonding light source among the multiple debonding light sources through the driving substrate. When the target debonding light source is lit, it illuminates the photo-debonding transfer head to release the corresponding microelectronic components, thereby achieving selective transfer of microelectronic components, improving transfer efficiency and yield, enabling selective defect repair, reducing the number of repairs and repair time, saving chip usage, and reducing process costs and materials. In addition, by setting the light-emitting component and the adhesion component separately, the adhesion component can be quickly replaced after the microelectronic component transfer is completed, avoiding the need to re-fabricate the addressing and transfer device when the viscosity of the photo-debonding transfer head is poor, saving resources while further improving transfer efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the address transfer device provided in an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the structure of the light-emitting component provided in the embodiments of this application;

[0018] Figure 3 This is a schematic diagram of the structure of the adhesion component provided in the embodiments of this application;

[0019] Figures 4A-4F This is a schematic diagram of the addressing transfer process;

[0020] Figure 5 A flowchart illustrating the address transfer method provided in an embodiment of this application;

[0021] Figure 6 This is a partial flowchart illustrating the address transfer method provided in an embodiment of this application. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments described in the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0023] It should be noted that all directional indicators (such as up, down, left, right, front, back, top, and bottom) in the embodiments of this invention are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figures). If the specific posture changes, the directional indicator will also change accordingly. Furthermore, the term "vertical" in the embodiments and claims refers to an angle of 90° between two components or a deviation of -5° to +5°, and the term "parallel" refers to an angle of 0° between two components or a deviation of -5° to +5°.

[0024] In the embodiments of this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0025] [First Embodiment]

[0026] See Figure 1 The first embodiment of the present invention provides an addressing and transfer device, which may include, for example, a light-emitting component 10 and an adhesion component 20, wherein the light-emitting component 10 and the adhesion component 20 together form the addressing and transfer device. The light-emitting component 10 includes a transfer substrate 100, a driving substrate 200, a plurality of de-adhesion light sources 300, and an adhesive layer 400. The adhesion component 20 includes an adhesion substrate 500 and a photo-de-adhesion transfer head 600.

[0027] Specifically, the light-emitting component 10 includes a transfer substrate 100, a driving substrate 200, a plurality of debonding light sources 300, and an adhesive layer 400. The transfer substrate 100 can be, for example, a substrate of a rigid material, such as a glass substrate, polymer substrate, sapphire substrate, or ceramic substrate. The driving substrate 200 can be, for example, a TFT array substrate (i.e., an active switching array substrate) or a CMOS (Complementary Metal Oxide Semiconductor) array substrate, and is disposed on one side of the transfer substrate 100. The plurality of debonding light sources 300 can be, for example, an LED light-emitting array, specifically, an infrared LED light source or an ultraviolet LED light source. The plurality of debonding light sources 300 are spaced apart and disposed on the side of the driving substrate 200 away from the transfer substrate 100. The plurality of debonding light sources 300 are electrically connected to the driving substrate 200, and the driving substrate 200 can selectively control any one of the plurality of debonding light sources 300, for example, by turning it on or off. The target debonding light source among the multiple debonding light sources 300 can be one or more debonding light sources, depending on the location of the microelectronic component to be transferred. The microelectronic component can be, for example, a Micro-LED, or other microelectronic devices. This embodiment of the invention is not limited to this. The adhesive layer 400 can be, for example, PDMS (Polydimethylsiloxane) adhesive material, or other adhesive materials. The adhesive layer 400 is disposed on the side of the driving substrate 200 away from the transfer substrate 100 and covers the multiple debonding light sources 300.

[0028] As described above, the adhesion assembly 20 includes an adhesion substrate 500 and a photoadhesive transfer head 600. The adhesion substrate 500 may be, for example, a light-transmitting substrate, specifically, a glass substrate, a polymer substrate, a sapphire substrate, etc., but this embodiment of the invention is not limited thereto. The photoadhesive transfer head 600 may be, for example, an infrared photoadhesive transfer head or an ultraviolet photoadhesive transfer head. The type of the photoadhesive transfer head 600 corresponds to the type of the debonding light source 300. For example, when the debonding light source 300 is an infrared LED light source, the photoadhesive transfer head 600 is an infrared photoadhesive transfer head; when the debonding light source 300 is an ultraviolet LED light source, the photoadhesive transfer head 600 is an ultraviolet photoadhesive transfer head. The photoadhesive transfer head 600 is disposed on one side of the adhesion substrate 500 and is used to adhere to or release the microelectronic component to be transferred.

[0029] The light-emitting component 10 is adhered to the adhesive substrate 500 via the adhesive layer 400 to form an addressing transfer device. The de-adhesion light source 300 of the light-emitting component 10 can emit near-infrared light or near-ultraviolet light under the control of the driving substrate 200. The light emitted by the de-adhesion light source 300 passes through the adhesive layer 400 and the adhesive substrate 500 to illuminate the photo-de-adhesion transfer head 600. Under the illumination of the light source emitted by the de-adhesion light source 300, the viscosity of the photo-de-adhesion transfer head 600 is reduced, thereby enabling the release of the microelectronic component to be transferred. In this way, by selectively illuminating the de-adhesion light source 300 through the driving substrate 200, the viscosity of the photo-adhesive transfer head 600 at the corresponding position decreases, allowing the corresponding microelectronic components to be released. This achieves selective transfer of microelectronic components, improving transfer efficiency. Furthermore, defective microelectronic components can be left unreleased during release, further improving transfer yield. Selective defect repair is also possible through selective transfer, reducing repair frequency and time, saving chip usage, and lowering process costs and materials. Moreover, separating the light-emitting component 10 and the adhesion component 20 avoids the need to re-fabricate the addressing transfer device when the viscosity of the photo-adhesive transfer head 600 decreases or becomes unusable. After transferring the microelectronic components, a new adhesion component 20 can be quickly replaced, saving resources and further improving transfer efficiency.

[0030] In one specific embodiment of the present invention, the adhesive layer 400 may be, for example, as shown below. Figure 1 The planar structure described above can also be, for example, as follows: Figure 2The illustration includes a plurality of mutually spaced second protrusions 410 extending toward the side away from the driving substrate 200. The plurality of second protrusions 410 may, for example, be arranged at intervals and correspond one-to-one with a plurality of debonding light sources 300. For example, the adhesive layer 400 may include, for instance, an adhesive planar layer 420 and a plurality of second protrusions 410. The adhesive planar layer 420 is disposed on the side of the driving substrate 200 away from the transfer substrate 100 and covers the plurality of debonding light sources 300. The plurality of second protrusions 410 are arranged at intervals on the side of the adhesive planar layer 420 away from the driving substrate 200 and extend toward the side away from the driving substrate 200. The adhesive layer 400 may also be, for instance, a plurality of second protrusions 410, which correspondingly cover the plurality of debonding light sources 300 and extend toward the side away from the driving substrate 200. Of course, this is merely an example, and the embodiments of the present invention are not limited thereto. By configuring the adhesive layer 400 to include a plurality of second protrusions 410 spaced apart from each other, an air layer is formed between the second protrusions 410 and the second protrusions 410. This reduces crosstalk from the light source irradiation when the adhesive layer 300 is irradiated, thereby improving the reliability of microelectronic component transfer.

[0031] In one specific embodiment of the present invention, the photopolymerization adhesive transfer head 600 may be, for example, as shown below. Figure 1 The planar structure shown, namely the photoadhesive transfer head 600, is a photoadhesive planar layer disposed on one side of the adhesion substrate 500; the photoadhesive transfer head 600 may also include, for example, a planar layer of photoadhesive disposed on one side of the adhesion substrate 500. Figure 3The plurality of first protrusions 610 shown extend away from the adhesive substrate 500. These first protrusions 610 may be spaced apart from each other and correspond one-to-one with a plurality of de-adhesion light sources. For example, the photo-adhesion transfer head 600 may include a photo-adhesion planar layer 620 and a plurality of first protrusions 610. The photo-adhesion planar layer 620 is disposed on one side of the adhesive substrate 500, and the plurality of first protrusions 610 are spaced apart from each other on the side of the photo-adhesion planar layer 620 away from the adhesive substrate 500 and extend away from the adhesive substrate 500. The photo-adhesion transfer head 600 may also be, for example, a plurality of first protrusions 610 extending away from the adhesive substrate 500 and corresponding one-to-one with a plurality of de-adhesion light sources 300. Of course, this is merely an example, and the embodiments of the present invention are not limited thereto. By configuring the photoadhesive transfer head 600 with a structure including multiple first protrusions 610 spaced apart from each other, an air layer is formed between the first protrusions 610 and the first protrusions 610. This reduces heat transfer between adjacent first protrusions 610 of the photoadhesive transfer head 600 or crosstalk from the light source 300 to adjacent first protrusions 610 when irradiated by the adhesive dissolving light source 300, thereby improving the reliability of microelectronic component transfer.

[0032] When the photoadhesive transfer head 600 has a structure including multiple first protrusions 610 and the adhesive layer 400 has a structure including multiple second protrusions 410, the positions of the multiple first protrusions 610 and the multiple second protrusions 410 correspond to each other. Preferably, the multiple first protrusions 610 and the multiple second protrusions 410 are the same in size and shape, and their positions correspond one-to-one. In this way, the illumination range of the deadhesive light source 300 is more accurate, avoiding crosstalk of the light source and further ensuring the reliability of the transfer of microelectronic components.

[0033] Preferably, the light emission angle α of each debonding light source 300 is: α < 90° - arcsin(1 / n), where α is the light emission angle and n is the refractive index of the photodebonding transfer head. This avoids the light source 300 illuminating an excessively large area, which could affect the viscosity of the photodebonding transfer head 600 at locations other than the target location, thereby further improving the reliability of microelectronic component transfer.

[0034] See Figures 4A to 4F , Figure 4A For the light-emitting component 10, through Figure 4A The light-emitting component 10 is attached to the adhesive component 20 to form a shape as shown. Figure 4B The address transfer device shown is described in the following document. Figure 4CA plurality of microelectronic components 710 to be transferred are disposed on the carrier substrate 700. The plurality of microelectronic components 710 are disposed on the carrier substrate 700 at intervals. The distance between two adjacent debonding light sources 300 on the light-emitting component 10 can be, for example, equal to the distance between adjacent microelectronic components 710 on the carrier substrate 700. Of course, the specific settings can be made according to the actual situation, and the embodiments of the present invention are not limited thereto. Figure 4D As shown, the addressing and transfer device adheres the microelectronic component 710 to be transferred via the photoadhesive transfer head 600 on the adhesion assembly 20. The microelectronic component 710 can, for example, be adhered to the position on the photoadhesive transfer head 600 corresponding to the de-adhesive light source 300. Figure 4E As shown, for example, if it is necessary to transfer a microelectronic component 710 to a target position on a target substrate 800, the corresponding target debonding light source 300 is illuminated by the driving substrate 200 of the light-emitting component 10. After the target debonding light source 300 is illuminated, under the illumination of the light source, the viscosity at the position of the photoadhesive transfer head 600 corresponding to the target debonding light source 300 decreases, and the microelectronic component 710 adhered to the corresponding position of the photoadhesive transfer head 600 is released to the target position on the target substrate 800, thus completing the transfer of the microelectronic component 710. Preferably, the distance between two adjacent microelectronic components 710 on the target substrate 800 is an integer multiple of the distance between two adjacent debonding light sources 300 on the light-emitting component 10, so as to... Figure 4E For example, the distance between two adjacent microelectronic components 710 on the target substrate 800 can be, for example, three times the distance between two adjacent debonding light sources 300 on the light-emitting component 10. That is, there is a redundant position on the target substrate 800 where the microelectronic components 710 are located. Two more microelectronic components 710 can be placed in the redundant position. In this way, when the microelectronic components 710 placed on the target substrate 800 have defects, new microelectronic components 710 can be replaced in the redundant position by the addressing transfer device to ensure the quality of the microelectronic components on the target substrate 800 and further improve the transfer yield.

[0035] In summary, this embodiment of the invention, by setting a driving substrate 200, multiple debonding light sources 300, and a photo-debonding transfer head 600 on the addressing and transfer device, controls the lighting or turning off of a target debonding light source among the multiple debonding light sources 300 through the driving substrate 200. When the target debonding light source is lit, it illuminates the photo-debonding transfer head 600 to release the corresponding microelectronic component 710, thereby achieving selective transfer of microelectronic components, improving transfer efficiency and yield, enabling selective defect repair, reducing the number of repairs and repair time, saving chip usage, and reducing process costs and materials. Furthermore, by separately setting the light-emitting component 10 and the adhesion component 20, the adhesion component can be quickly replaced after the microelectronic component transfer is completed, avoiding the need to re-fabricate the addressing and transfer device when the adhesion of the photo-debonding transfer head is poor, saving resources while further improving transfer efficiency.

[0036] [Second Embodiment]

[0037] See Figure 5 The second embodiment of the present invention provides an address transfer method, which may include, for example, the following steps:

[0038] S10, Adhere the first adhesion component to the light-emitting component;

[0039] S20, a carrier substrate is provided, on which a first microelectronic component is disposed;

[0040] S30, the first microelectronic component is adhered from the carrier substrate to the photodegradable adhesive transfer head of the first adhesion assembly;

[0041] S40, using the driving substrate of the light-emitting component to light up the target debonding light source among the multiple debonding light sources on the light-emitting component, and after being irradiated by the target debonding light source, releasing the first microelectronic component corresponding to the photo-debonding transfer head to the target substrate.

[0042] S50, the first adhesive component is separated from the light-emitting component.

[0043] See Figure 6 The following steps are included after step S50:

[0044] S60, the performance of the first microelectronic component on the target substrate is tested to obtain the defect location on the target substrate;

[0045] S70, determine the corresponding redundant position based on the defect position;

[0046] S80, the second adhesion component is adhered using the light-emitting component;

[0047] S90, using the light-emitting component and the second adhesion component, the second microelectronic component on the carrier substrate is transferred to the redundant position.

[0048] To more clearly illustrate the address transfer method provided in this embodiment, the following is combined with... Figures 4A to 4F The address transfer method of this embodiment will be described in detail.

[0049] Specifically, this embodiment uses Figure 4A The light-emitting component 10 is attached to the adhesive component 20 to form a shape as shown. Figure 4B The addressing and transfer device shown is used to transfer microelectronic components 710 on the carrier substrate 700.

[0050] The light-emitting component 10 includes a transfer substrate 100, a driving substrate 200, multiple debonding light sources 300, and an adhesive layer 400. The transfer substrate 100 can be, for example, a substrate of a rigid material, such as a glass substrate, polymer substrate, sapphire substrate, or ceramic substrate. The driving substrate 200 can be, for example, a TFT array substrate (i.e., an active switching array substrate) or a CMOS (Complementary Metal Oxide Semiconductor) array substrate, and is disposed on one side of the transfer substrate 100. The multiple debonding light sources 300 can be, for example, an LED light-emitting array, specifically, an infrared LED light source or an ultraviolet LED light source. The multiple debonding light sources 300 are spaced apart and disposed on the side of the driving substrate 200 away from the transfer substrate 100. The multiple debonding light sources 300 are electrically connected to the driving substrate 200, and the driving substrate 200 can selectively control any one of the multiple debonding light sources 300. For example, the target debonding light source among multiple debonding light sources 300 can be lit or turned off by driving the substrate 200. The target debonding light source can be one or more debonding light sources, depending on the location of the microelectronic component to be transferred. The microelectronic component can be, for example, a Micro-LED, or other microelectronic devices. This embodiment of the invention is not limited to this. The adhesive layer 400 can be, for example, PDMS (Polydimethylsiloxane) adhesive material, or other adhesive materials. The adhesive layer 400 can be, for example, such as... Figure 1 The planar structure described above can also be, for example, as follows: Figure 2 The diagram shows a plurality of second protrusions 410 spaced apart from each other, an adhesive layer 400 disposed on the side of the driving substrate 200 away from the transfer substrate 100, and covering a plurality of debonding light sources 300.

[0051] The adhesion assembly 20 includes an adhesion substrate 500 and a photoadhesive transfer head 600. The adhesion substrate 500 may be, for example, a light-transmitting substrate, specifically a glass substrate, a polymer substrate, a sapphire substrate, etc., but this embodiment of the invention is not limited thereto. The photoadhesive transfer head 600 may be, for example, an infrared photoadhesive transfer head or an ultraviolet photoadhesive transfer head. The type of the photoadhesive transfer head 600 corresponds to the type of the debonding light source 300. For example, when the debonding light source 300 is an infrared LED light source, the photoadhesive transfer head 600 is an infrared light source. The adhesive dissolution transfer head, when the dissolution light source 300 is an ultraviolet light source, is a UV-based adhesive dissolution transfer head 600. The adhesive dissolution transfer head 600 can be, for example, a planar structure, meaning it is a planar adhesive dissolution layer disposed on one side of the adhesion substrate 500. The adhesive dissolution transfer head 600 may also include, for example, a plurality of first protrusions 610 extending away from the adhesion substrate 500. The plurality of first protrusions 610 can be, for example, spaced apart from each other and corresponding one-to-one with the plurality of dissolution light sources. The adhesive dissolution transfer head 600 is disposed on one side of the adhesion substrate 500 and is used to adhere or release the microelectronic components to be transferred. When the photoadhesive transfer head 600 has a structure including multiple first protrusions 610 and the adhesive layer 400 has a structure including multiple second protrusions 410, the positions of the multiple first protrusions 610 and the multiple second protrusions 410 correspond to each other. Preferably, the multiple first protrusions 610 and the multiple second protrusions 410 are the same in size and shape, and their positions correspond one-to-one. Preferably, the light emission angle α of each deadhesive light source 300 is: α < 90° - arcsin(1 / n), where α is the light emission angle and n is the refractive index of the photoadhesive transfer head.

[0052] During the addressing transfer process, firstly through Figure 4A The light-emitting component 10 shown is adhered to the adhesion component 20 (e.g., the first adhesion component), forming as shown. Figure 4B The address transfer device shown can be specifically configured such that, for example, the adhesive layer 400 of the light-emitting component 10 is used to adhere the adhesive substrate of the adhesive component 20 to the light-emitting component 10, thereby adhering the adhesive component 20 to the light-emitting component 10 to form an address transfer device.

[0053] As stated above, the following are provided: Figure 4CThe carrier substrate 700 shown has a plurality of microelectronic components 710 to be transferred disposed on it. The microelectronic components 710 may include, for example, a first microelectronic component and a second microelectronic component. The first microelectronic component and the second microelectronic component are only distinguished by name, and they are the same microelectronic component. The microelectronic components 710 may be, for example, Micro-LEDs, or other microelectronic devices. The plurality of microelectronic components 710 are disposed on the carrier substrate 700 at intervals. The distance between two adjacent debonding light sources 300 on the light-emitting component 10 may be, for example, equal to the distance between adjacent microelectronic components 710 on the carrier substrate 700. Of course, the specific settings can be made according to the actual situation, and the embodiments of the present invention are not limited thereto.

[0054] like Figure 4D As shown, the addressing and transfer device uses a photoadhesive transfer head 600 on the adhesion assembly 20 to adhere multiple first microelectronic components 710 to be transferred. The photoadhesive transfer head 600 is a photoadhesive material with viscosity, which can adhere to the microelectronic components 710. For example, multiple first microelectronic components 710 can be adhered to the positions of the photoadhesive transfer head 600 and the de-adhesion light source 300. Taking the photoadhesive transfer head 600 as including multiple first protrusions 610 as an example, multiple first microelectronic components are adhered to multiple first protrusions 610.

[0055] like Figure 4EAs shown, for example, if it is necessary to transfer the microelectronic component 710 to a target position on the target substrate 800, the driving substrate 200 of the light-emitting component 10 controls the target debonding light source 300 corresponding to the first protrusion 610 on the photo-debonding transfer head 600 corresponding to the target position to be lit. After the target debonding light source 300 is lit, under the illumination of the light source, the viscosity at the position of the photo-debonding transfer head 600 corresponding to the target debonding light source 300 (e.g., the first protrusion 610 corresponding to the target debonding light source) decreases, and the first microelectronic component adhering to the position corresponding to the photo-debonding transfer head 600 is released to the target position on the target substrate 800, thus completing the transfer of the microelectronic component 710. In this way, by selectively illuminating the de-adhesion light source 300 through the driving substrate 200, the viscosity of the photo-adhesion transfer head 600 at the corresponding position is reduced, allowing the corresponding microelectronic components to be released. This achieves selective transfer of microelectronic components, improving the transfer efficiency. Furthermore, during release, defective microelectronic components can be left unreleased, further improving the transfer yield. After all the first microelectronic components 710 adhered to the photo-adhesion transfer head 600 have been transferred, or when the viscosity of the photo-adhesion transfer head 600 on the first adhesion component is too low to adhere the microelectronic components 710 without light source illumination, the adhesion component 20 (i.e., the first adhesion component) can be separated from the light-emitting component 10, for example. Specifically, the force separating the first adhesion component can be greater than the adhesive force between the light-emitting component 10 and the first adhesion component, so that the adhesion component 20 separates from the light-emitting component 10. In this way, by setting up the light-emitting component and the adhesion component separately, the adhesion component can be quickly replaced after the microelectronic component transfer is completed. This avoids the need to remake the addressing transfer device when the viscosity of the photodissolution transfer head is poor, saving resources and further improving transfer efficiency.

[0056] Preferably, the distance between two adjacent microelectronic components 710 (i.e., the first microelectronic component) on the target substrate 800 is an integer multiple of the distance between two adjacent debonding light sources 300 on the light-emitting assembly 10, so as to Figure 4E For example, the distance between two adjacent microelectronic components 710 (first microelectronic components) on the target substrate 800 can be, for example, three times the distance between two adjacent debonding light sources 300 on the light-emitting component 10. That is, there is also a redundant position at the location of the microelectronic component 710 (first microelectronic component) on the target substrate 800, and two more microelectronic components 710 can be placed in the redundant position.

[0057] As described above, performance testing can be performed on the microelectronic component 710 (first microelectronic component) on the target substrate 800, for example, taking a Micro-LED as an example. Specifically, the Micro-LED on the target substrate 800 can be lit to test its performance. Of course, this is only an example, and the embodiments of the present invention are not limited thereto; other testing methods can be selected according to actual conditions. After performance testing, for example, the defect location on the target substrate 800 can be obtained. Then, for example, the corresponding redundant location can be determined based on the defect location. Then, a new addressing and transfer device is formed by attaching a new adhesion component 20 (i.e., a second adhesion component) to the light-emitting component 10, and a new microelectronic component 710 (e.g., a second microelectronic component) is attached to the carrier substrate 700 according to the above method, transferring the second microelectronic component to the redundant location on the target substrate 800. Of course, when not all the first microelectronic components attached to the first adhesion component are transferred, the first microelectronic components can continue to be transferred to the redundant location through the light-emitting component 10 and the first adhesion component attached to the light-emitting component 10. In this way, when the microelectronic component 710 placed on the target substrate 800 has defects, a new microelectronic component 710 can be repositioned at the redundant position through the addressing transfer device to ensure the quality of the microelectronic component on the target substrate 800 and further improve the transfer yield. Through the selective transfer of microelectronic components, selective defect repair can also be achieved, thereby reducing the number of repairs, reducing repair time, saving chip usage, and reducing process costs and materials.

[0058] In summary, the addressing transfer method provided by this embodiment of the invention, by setting a driving substrate 200, multiple debonding light sources 300, and a photo-debonding transfer head 600 on the addressing transfer device, controls the lighting or turning off of a target debonding light source among the multiple debonding light sources 300 through the driving substrate 200. When the target debonding light source is lit, it illuminates the photo-debonding transfer head 600 to release the corresponding microelectronic component 710, thereby achieving selective transfer of microelectronic components, improving transfer efficiency and yield, enabling selective defect repair, reducing the number of repairs and repair time, saving chip usage, and reducing process costs and materials. In addition, by setting the light-emitting component 10 and the adhesion component 20 separately, the adhesion component can be quickly replaced after the microelectronic component transfer is completed, avoiding the need to re-fabricate the addressing transfer device when the viscosity of the photo-debonding transfer head is poor, saving resources and further improving transfer efficiency.

[0059] Furthermore, it is understood that the foregoing embodiments are merely illustrative examples of the present invention. Provided that the technical features do not conflict, the structure is not contradictory, and the purpose of the invention is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An addressing transfer device, characterized in that, include: Light-emitting components and adhesive components; The light-emitting component includes: Transfer substrate; A driving substrate is disposed on one side of the transfer substrate; Multiple debonding light sources are disposed at intervals on the side of the driving substrate away from the transfer substrate. These multiple debonding light sources are electrically connected to the driving substrate, which is used to illuminate or deactivate a target debonding light source among the multiple debonding light sources. An adhesive layer is disposed on the side of the driving substrate away from the transfer substrate and covers the plurality of debonding light sources. The light-emitting components are adhered to the adhesive layer. The adhesion component includes: Adhesive substrate; and A photoadhesive transfer head is disposed on one side of the adhesive substrate. The photoadhesive transfer head is used to adhere microelectronic components and release the corresponding microelectronic components to the target substrate under the irradiation of the target adhesive light source. The distance between two adjacent debonding light sources is equal to the distance between two adjacent microelectronic components on the carrier substrate.

2. The addressing and transfer device as described in claim 1, characterized in that, The photo-adhesive transfer head includes a plurality of first protrusions spaced apart from each other, and the plurality of first protrusions correspond one-to-one with the plurality of adhesive dissolution light sources.

3. The addressing and transfer device as described in claim 1 or 2, characterized in that, The adhesive layer includes a plurality of second protrusions spaced apart from each other, and each of the plurality of second protrusions corresponds to one of the plurality of debonding light sources.

4. The addressing and transfer device as described in claim 1, characterized in that, The distance between two adjacent microelectronic components on the target substrate is an integer multiple of the distance between two adjacent debonding light sources.

5. The addressing and transfer device as described in claim 1, characterized in that, The plurality of adhesive dissolving light sources are infrared LED light sources, and the optical adhesive dissolving transfer head is an infrared optical adhesive dissolving transfer head.

6. The addressing and transfer device as described in claim 1, characterized in that, The plurality of adhesive dissolution light sources are ultraviolet LED light sources, and the photo-dissolution transfer head is an ultraviolet photo-dissolution transfer head.

7. An addressing transfer method, characterized in that, The address transfer method is performed using the address transfer device as described in claim 1, and the address transfer method includes: Adhere the first adhesion component to the light-emitting component; A carrier substrate is provided, on which a first microelectronic component is disposed; The first microelectronic component is adhered from the carrier substrate to the photolytic adhesive transfer head of the first adhesion assembly; The target debonding light source among multiple debonding light sources on the light-emitting component is lit by the driving substrate of the light-emitting component. After being irradiated by the target debonding light source, the first microelectronic component corresponding to the photo-debonding transfer head is released to the target substrate. Separate the first adhesive component from the light-emitting component; The distance between two adjacent debonding light sources is equal to the distance between two adjacent microelectronic components on the carrier substrate.

8. The addressing transfer method as described in claim 7, characterized in that, Also includes: The performance of the first microelectronic component on the target substrate is tested to obtain the location of defects on the target substrate; Determine the corresponding redundant location based on the defect location; The second adhesion component is adhered using the light-emitting component; The second microelectronic component on the carrier substrate is transferred to the redundant location using the light-emitting component and the second adhesion component.

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