Forming method of mobile phone back cover and mobile phone back cover
A mobile phone back cover molding method that forms patterned layers, coating layers, and high-gloss layers on thermoplastic fiberglass sheets has solved the problems of low strength and high cost of mobile phone back covers, and has achieved the production of high-strength and low-cost mobile phone back covers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 江苏恒隆通新材料科技有限公司
- Filing Date
- 2023-03-22
- Publication Date
- 2026-05-12
AI Technical Summary
Existing mobile phone back cover materials are not strong, are fragile, and have high manufacturing costs.
The back cover of a mobile phone is made by using thermoplastic fiberglass board as the substrate, forming a pattern layer by screen printing patterns and transferring textures with thermoplastic UV ink, forming a thermoplastic coating layer by optical coating, and then transferring high-gloss ink on it to form a high-gloss layer. Finally, it is hot-bent to form the back cover of the phone.
This improved the strength and toughness of the phone back cover, reduced production costs, and increased production efficiency and yield.
Abstract
Description
Technical Field
[0001] This invention relates to the field of mobile phone accessory molding technology, and in particular to a molding method for a mobile phone back cover and a mobile phone back cover. Background Technology
[0002] With the development of mobile phones and tablets, users have increasingly higher requirements for the appearance, design, and feel of electronic devices such as mobile phones and tablets.
[0003] To achieve a glossy appearance and smooth feel for the back cover of mobile phones, current back covers are mostly made of PC (Polycarbonate) composite sheets or glass. PC composite sheets have low strength, poor protection, and are relatively soft; glass is brittle and fragile, heavy, and has high manufacturing costs.
[0004] Therefore, there is an urgent need to provide a method for molding a mobile phone back cover and a mobile phone back cover in order to solve the above problems. Summary of the Invention
[0005] Based on the above, one objective of the present invention is to provide a method for molding a mobile phone back cover, so as to solve the problems of low strength, fragility and high manufacturing cost of existing mobile phone back cover materials.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] A method for molding a mobile phone back cover includes the following steps:
[0008] Thermoplastic UV ink is used to screen print patterns and transfer textures on thermoplastic fiberglass boards to form a pattern layer;
[0009] An optical coating is formed on the pattern layer to create a thermoplastic coating layer;
[0010] High-gloss ink is transferred onto the thermoplastic coating layer using thermoplastic UV ink to form a high-gloss layer;
[0011] Thermoplastic fiberglass board, pattern layer, thermoplastic coating layer and high-gloss layer form the substrate of mobile phone back cover;
[0012] The mobile phone back cover substrate is cut into a preset shape, and then the mobile phone back cover substrate cut into the preset shape is hot-bent to obtain the mobile phone back cover.
[0013] Furthermore, the glass fiberboard is impregnated to obtain thermoplastic glass fiberboard.
[0014] Furthermore, obtaining thermoplastic fiberglass board from fiberglass board through impregnation specifically includes the following steps:
[0015] Pre-treat the fiberglass board;
[0016] The pretreated glass fiberboard is impregnated with an impregnation solution to obtain thermoplastic glass fiberboard.
[0017] Furthermore, the pretreatment of the fiberglass board specifically includes the following steps:
[0018] Thermoplastic fiberglass boards are sanded or ultrasonically cleaned to increase surface adhesion.
[0019] Furthermore, the impregnation solution is a modified thermoplastic epoxy resin.
[0020] Furthermore, the thermoplastic UV ink is obtained by modifying epoxy polyacrylate or polyurethane-modified epoxy resin.
[0021] Furthermore, the optical coating material is modified with resin and then formed into a film to obtain a thermoplastic coating layer.
[0022] Furthermore, the thickness of the thermoplastic fiberglass board is 0.1mm-0.4mm.
[0023] Based on the above, another objective of the present invention is to provide a mobile phone back cover that solves the problems of low strength, fragility, and high manufacturing cost of existing mobile phone back cover materials.
[0024] To achieve the above objectives, the present invention adopts the following technical solution:
[0025] A mobile phone back cover, wherein the mobile phone back cover is formed according to the forming method of the mobile phone back cover described in any of the above embodiments.
[0026] Furthermore, the thickness of the phone back cover is 0.4mm-0.45mm.
[0027] The beneficial effects of this invention are as follows:
[0028] The method for forming a mobile phone back cover provided by this invention includes the following steps: screen printing patterns and transfer textures on a thermoplastic glass fiber board using thermoplastic UV ink to form a pattern layer; optically coating the pattern layer to form a thermoplastic coating layer; transferring high-gloss ink onto the thermoplastic coating layer using thermoplastic UV ink to form a high-gloss layer; the thermoplastic glass fiber board, pattern layer, thermoplastic coating layer, and high-gloss layer form a mobile phone back cover substrate; cutting the mobile phone back cover substrate into a preset shape, and hot-bending the cut mobile phone back cover substrate into the preset shape to obtain a mobile phone back cover. Using a thermoplastic glass fiber board as the substrate, screen printing patterns and a high-gloss layer with thermoplastic UV ink, and optically coating to form a thermoplastic coating layer, results in good thermoplasticity and toughness, facilitating hot bending, improving production efficiency, increasing the strength of the mobile phone back cover, and reducing production costs. Implementation
[0029] The present invention will now be described in further detail with reference to the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present invention are shown, not all of the structures.
[0030] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0031] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0032] The technical solution of the present invention will be further illustrated below through specific embodiments.
[0033] This embodiment provides a method for molding a mobile phone back cover, which includes the following steps:
[0034] Thermoplastic UV ink is used to screen print patterns and transfer textures on thermoplastic fiberglass boards to form a pattern layer;
[0035] An optical coating is formed on the pattern layer to create a thermoplastic coating layer;
[0036] High-gloss ink is transferred onto the thermoplastic coating layer using thermoplastic UV ink to form a high-gloss layer;
[0037] Thermoplastic fiberglass board, pattern layer, thermoplastic coating layer and high-gloss layer form the substrate of mobile phone back cover;
[0038] The mobile phone back cover substrate is cut into a preset shape, and then the mobile phone back cover substrate cut into the preset shape is hot-bent to obtain the mobile phone back cover.
[0039] Using thermoplastic fiberglass board as the substrate, patterns and high-gloss layers are screen-printed with thermoplastic UV ink, and an optical coating is formed to form a thermoplastic coating layer. It has good thermoplasticity and toughness, is easy to hot bend and form, improves production efficiency, increases the strength of mobile phone back covers, and reduces production costs.
[0040] Specifically, the mobile phone back cover is formed by hot bending, which can achieve a production efficiency of over 95% and a yield rate of over 90%.
[0041] Furthermore, the glass fiberboard is impregnated to obtain thermoplastic glass fiberboard.
[0042] Because fiberglass boards have low surface energy and relatively poor adhesion, they are difficult to adhere to resin (the impregnation solution is resin), which is not convenient for subsequent impregnation. Therefore, fiberglass boards need to be pretreated.
[0043] Furthermore, obtaining thermoplastic fiberglass board from fiberglass board through impregnation specifically includes the following steps:
[0044] Pre-treat the fiberglass board;
[0045] The pretreated glass fiberboard is impregnated with an impregnation solution to obtain thermoplastic glass fiberboard.
[0046] Furthermore, the impregnation solution is a modified thermoplastic epoxy resin. Specifically, the concentration of the impregnation solution is adjustable and can be formulated according to production requirements.
[0047] Furthermore, the pretreatment of the fiberglass board specifically includes the following steps:
[0048] Thermoplastic fiberglass boards are sanded or ultrasonically cleaned to increase surface adhesion.
[0049] Furthermore, thermoplastic UV inks are obtained by modifying epoxy resins with epoxy polyacrylate or polyurethane. Thermoplastic UV inks have good thermoplasticity, allowing for color matching and texture overlay, facilitating subsequent hot bending molding, and do not affect the screen-printed pattern.
[0050] Furthermore, the optical coating material is modified with resin and then formed into a film to obtain a thermoplastic coating layer.
[0051] Furthermore, the thickness of the thermoplastic fiberglass board is 0.1mm-0.4mm.
[0052] Furthermore, before screen printing patterns and textures, a base color needs to be screen printed on the thermoplastic fiberglass board to form a base color layer, and then the pattern layer is screen printed on the base color layer.
[0053] Specifically, in the process of screen printing the base color on thermoplastic fiberglass board, when using ink of type 505, the screen density is 90 mesh, the proportion of curing agent in the ink is 10% and the proportion of thinner is 5% by weight, the printing speed is 65 m / s, the squeegee angle is 45°, the squeegee hardness is 75, the printing pressure is 0.4 MPa, the baking time in the oven is 30 minutes, and the baking temperature is 90°. When using ink of type 505, the screen density can also be 200 mesh, the proportion of curing agent in the ink is 10% and the proportion of thinner is 5% by weight, the printing speed is 65 m / s, the squeegee angle is 45°, the squeegee hardness is 75, the printing pressure is 0.4 MPa, the baking time in the oven is 30 minutes, and the baking temperature is 90°.
[0054] Specifically, during the screen printing process, the screen density is 200 mesh, the ink type is 505-1, the curing agent ratio in the ink is 10% by weight, the thinner ratio is 5%, the printing speed is 65m / s, the squeegee angle is 45°, the squeegee hardness is 75, the printing pressure is 0.4MPa, the baking time in the oven is 30min, and the baking temperature is 90℃.
[0055] Specifically, during the texture transfer process, you can choose to transfer either an external texture or an internal texture. When transferring an external texture, the amount of glue used is 0.15g, the roller pressure is 0.5 MPa, and the exposure time is 8s; when transferring an internal texture, the amount of glue used is 0.1g, the roller pressure is 0.5 MPa, and the exposure time is 6s.
[0056] Specifically, during the transfer of the glossy layer, the screen density is 200 mesh, the ink type is 1200, the curing agent ratio in the ink is 10% by weight, the thinner ratio is 5%, the printing speed is 65m / s, the squeegee angle is 45°, the squeegee hardness is 75, the printing pressure is 0.4MPa, the baking time in the oven is 30min, and the baking temperature is 90℃.
[0057] Furthermore, the mobile phone back cover substrate is cut into a predetermined shape using a CNC machine tool. The CNC machine tool's cutting speed is 4800 r / min.
[0058] Furthermore, the mobile phone back cover is obtained by hot bending the mobile phone back cover substrate cut into a preset shape. This is achieved by using a hot bending machine.
[0059] Specifically, during the hot bending process, the hot bending temperature is 90℃-150℃, preferably 90℃, 100℃, 120℃, 130℃ or 150℃, and the hot bending time is 35s.
[0060] In this embodiment, a mobile phone back cover is also provided, which is formed according to the above-described mobile phone back cover forming method.
[0061] Furthermore, the thickness of the phone back cover is 0.4mm-0.45mm. Compared to the existing phone back cover thickness of 0.8mm, the thickness of the phone back cover is reduced due to the high strength of the thermoplastic fiberglass board, resulting in a better user experience.
[0062] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.
Claims
1. A method for molding a mobile phone back cover, characterized in that, Includes the following steps: Thermoplastic UV ink is used to screen print patterns and transfer textures on thermoplastic fiberglass boards to form a pattern layer; An optical coating is applied to the pattern layer to form a thermoplastic coating layer. The optical coating material is modified with resin and then formed into a film to obtain the thermoplastic coating layer. High-gloss ink is transferred onto the thermoplastic coating layer using thermoplastic UV ink to form a high-gloss layer; Thermoplastic fiberglass board, pattern layer, thermoplastic coating layer and high-gloss layer form the substrate of mobile phone back cover; The mobile phone back cover substrate is cut into a preset shape, and then the mobile phone back cover substrate cut into the preset shape is hot-bent to obtain the mobile phone back cover.
2. The method for forming a mobile phone back cover according to claim 1, characterized in that, Thermoplastic fiberglass board is obtained by impregnation of fiberglass board.
3. The method for forming a mobile phone back cover according to claim 2, characterized in that, Obtaining thermoplastic fiberglass board from fiberglass board through impregnation specifically includes the following steps: Pre-treat the fiberglass board; The pretreated glass fiberboard is impregnated with an impregnation solution to obtain thermoplastic glass fiberboard.
4. The method for forming a mobile phone back cover according to claim 3, characterized in that, The pretreatment of fiberglass boards includes the following steps: Thermoplastic fiberglass boards are sanded or ultrasonically cleaned to increase surface adhesion.
5. The method for forming a mobile phone back cover according to claim 2, characterized in that, The impregnation solution is a modified thermoplastic epoxy resin.
6. The method for forming a mobile phone back cover according to claim 1, characterized in that, Thermoplastic UV inks are obtained by modifying epoxy resins with epoxy polyacrylate or polyurethane.
7. The method for forming a mobile phone back cover according to claim 1, characterized in that, The thickness of thermoplastic fiberglass boards ranges from 0.1mm to 0.4mm.
8. A mobile phone back cover, characterized in that, The mobile phone back cover is formed by the molding method of the mobile phone back cover according to any one of claims 1-7.
9. The method for forming a mobile phone back cover according to claim 8, characterized in that, The thickness of the phone's back cover is 0.4mm-0.45mm.