Packaging substrate electroplating uniformity detection device, electroplating device and detection method

Abstract

The present invention provides a package substrate electroplating uniformity detection device, an electroplating device, and a method for use, comprising: an electroplating tank, a guide rail, a hanger, n anode meshes, a rectifier, and a shunt; n is a natural number greater than 1; the electroplating tank is divided into n electroplating units, each of which is provided with an anode mesh; the guide rail is insulated and arranged above the electroplating tank; the guide rail is divided into a first section and a second section that are insulated from each other; the second section of the guide rail is located above the mth electroplating unit, where m is a natural number greater than or equal to 2; the hanger clamps the package substrate and hangs it on the guide rail; the negative electrode of the rectifier is connected to the first section of the guide rail, and the positive electrode is respectively connected to the corresponding anode mesh in each electroplating unit; the first end of the shunt is electrically connected to an end of the first section of the guide rail close to the second section, and the second end is electrically connected to an end of the second section of the guide rail close to the first section. The present invention can detect the current and electroplating performance of the package substrate, and realize the detection of package substrates with abnormal electroplating.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit manufacturing, and in particular to a packaging substrate electroplating uniformity detection device, an electroplating device and a detection method. Background Art

[0002] In the semiconductor manufacturing process, electroplating is a crucial process technology. It requires immersing the semiconductor substrate in a plating solution. The chemical reaction properties of copper ions are then used to cause the plating solution to react on the chip surface to form a copper structure, thus completing the entire electroplating process. During the electroplating process, various factors can lead to uneven plating on the surface of the semiconductor substrate. For example, air attached to the chip surface can generate bubbles when in contact with the plating solution, preventing the copper ions from reacting properly on the chip surface to form a smooth copper structure, resulting in copper pit defects. There are also other reasons, such as insufficient contact between the semiconductor substrate and the plating solution.

[0003] Existing technology relies on manual on-site inspections using clamp meters to control the uniformity and stability of electroplating. Manually operating a clamp meter to check the uniformity of each plating rack is time-consuming and labor-intensive. Furthermore, since the racks on the plating tanks are constantly moving during production, manual testing of plating uniformity presents safety risks. Furthermore, manual measurement can introduce errors in the data obtained, reducing its accuracy. Furthermore, the data cannot be transmitted and recorded in real time, which can also lead to issues with the real-time nature of data collection. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a packaging substrate electroplating uniformity detection device, an electroplating device and a detection method, which are used to solve the problems in the prior art of errors and safety hazards in manual operation and the inability to detect the electroplating process in real time.

[0005] To achieve the above-mentioned and other related purposes, the present invention provides a device for detecting electroplating uniformity of a package substrate, comprising: an electroplating tank, a guide rail, a rack, n anode nets, a rectifier, and a shunt; n is a natural number greater than 1;

[0006] The electroplating tank is divided into n electroplating units, each of which is provided with an anode mesh; the guide rail is insulated and arranged above the electroplating tank; and electroplating liquid is provided in the electroplating tank;

[0007] The guide rail is divided into a first section and a second section that are insulated from each other; the second section of the guide rail is located above the mth electroplating unit, where m is a natural number greater than or equal to 2; the hanger clamps the package substrate and hangs it on the guide rail;

[0008] The negative electrode of the rectifier is connected to the first section of the guide rail, and the positive electrode is connected to the corresponding anode network in each electroplating unit;

[0009] The first end of the shunt is electrically connected to one end of the first section of the guide rail close to the second section, and the second end is electrically connected to one end of the second section of the guide rail close to the first section, for detecting the current of the packaging substrate 9 hung on the second section of the guide rail.

[0010] Optionally, each electroplating unit is provided with at least two anode meshes, which are respectively arranged on both sides of the packaging substrate and respectively opposite to the plane of the packaging substrate.

[0011] Optionally, the packaging substrate detection device is also provided with an ammeter; the positive pole of the ammeter is connected to the first end of the shunt, and the negative pole is connected to the second end of the shunt, for displaying the current of the packaging substrate hung on the second section of the guide rail.

[0012] Optionally, the packaging substrate detection device is further provided with an alarm; the alarm is connected in series with the shunt to sound an alarm when the current in the shunt exceeds a threshold value.

[0013] Optionally, the package substrate electroplating uniformity detection device further includes a sensing trigger; the sensing trigger is arranged at an end of the first section of the guide rail away from the second section, and is used to record the moment when each package substrate enters the electroplating tank.

[0014] Optionally, the package substrate electroplating uniformity detection device further includes n positioners; the n positioners are arranged on the guide rail and correspond one-to-one to each electroplating unit, and are used to monitor the real-time position of each package substrate.

[0015] Optionally, the package substrate electroplating uniformity detection device further includes a driving module; the driving template drives the hanger to move the package substrate from the first section of the guide rail to the second section of the guide rail.

[0016] Optionally, the packaging substrate detection device is further provided with a control module, which generates a control signal according to the analog signal transmitted by the sensing trigger, the locator, and the diverter, so as to perform a removal step on the packaging substrate detected to be abnormal based on the control signal.

[0017] To achieve the above-mentioned and other related purposes, the present invention provides an electroplating device, comprising: a pretreatment module and an electroplating module;

[0018] The pre-treatment module is arranged at the front end of the electroplating module, and is used to perform a pre-treatment process on the packaging substrate before electroplating;

[0019] The electroplating module includes the packaging substrate electroplating uniformity detection device as described above.

[0020] To achieve the above-mentioned purpose and other related purposes, the present invention provides a method for detecting the electroplating uniformity of a packaging substrate, which is implemented using the above-mentioned packaging substrate electroplating uniformity detection device, including: S1) obtaining the current of the packaging substrate hung on the second section of the guide rail by detecting the current flowing from the second end of the shunt to the first end: when the detected current of the packaging substrate is consistent with the preset current value, the packaging substrate is determined to be normal; when the detected current of the packaging substrate is inconsistent with the preset current value, an error reporting step is executed.

[0021] Optionally, before step S1), step S2) speed monitoring is further provided; the speed monitoring includes: hanging each packaging substrate on a hanger, each hanger drives the corresponding packaging substrate to move, and recording the moment when each packaging substrate enters the electroplating tank; immersing each packaging substrate in the plating liquid in the electroplating tank to electroplate the packaging substrate; detecting the real-time position of each packaging substrate: when the real-time position reaching time of each packaging substrate is consistent with the preset time, the electroplating process of each packaging substrate is normal; when the real-time position reaching time of each packaging substrate is inconsistent with the preset time, the electroplating process of each packaging substrate is abnormal, and an error reporting step is executed.

[0022] Optionally, in step S1) or / and step S2), the error reporting step includes: marking each abnormal package substrate, and removing each abnormal package substrate after it is moved out of the package substrate electroplating uniformity detection device.

[0023] As described above, the package substrate electroplating uniformity detection device, electroplating device, and detection method of the present invention have the following beneficial effects:

[0024] 1. The packaging substrate electroplating uniformity detection device, electroplating apparatus, and detection method of the present invention have economic benefits. The device of the present invention has a simple structure, a simple method, simple cleaning, and easy maintenance. This reduces labor costs, improves operational safety, and enhances technical safety and stability, thereby saving production costs. Furthermore, it improves the electroplating yield of the packaging substrate, increases the product yield, and improves the production efficiency of the integrated circuit electroplating process.

[0025] 2. The packaging substrate electroplating uniformity detection device, electroplating device and use method of the present invention have technical beneficial effects. The present invention can automatically measure the current of the packaging substrate during the electroplating process on the electroplating line without affecting the normal operation of the electroplating line, thereby improving the convenience of measuring the current. The current is automatically detected. During the production process, not only can the electroplating performance be detected by measuring the current of the packaging substrate, but abnormal signals can also be fed back to detect abnormal packaging substrates, thereby improving the timeliness and accuracy of the current data and enhancing the stability of the current. The present invention realizes real-time monitoring of the electroplating transmission process, and timely screens out electroplated products with poor effects based on the monitoring results, thereby improving the detection efficiency of the products and facilitating the management of product safety and uniformity.

[0026] 3. The packaging substrate electroplating uniformity detection device, electroplating device, and detection method of the present invention have socially beneficial effects. The present invention improves production efficiency, reduces the use of chemicals in the electroplating process, and helps save energy and resources, thereby reducing environmental pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Shown is a structural schematic diagram of a packaging substrate detection device.

[0028] Figure 2 Shown is a side view of the package substrate inspection device during electroplating.

[0029] Figure 3 Shown is a side view of the current sensing module.

[0030] Figure 4 Shown is a schematic structural diagram of the electroplating device.

[0031] Component number description

[0032] 1 electroplating tank

[0033] 2 guide rails

[0034] 3 sensor triggers

[0035] 4 racks

[0036] 5. Locator

[0037] 6 Anode mesh

[0038] 7 shunt

[0039] 8. Rectifier

[0040] 9 Package substrate

[0041] 91 First packaging substrate

[0042] 92 second packaging substrate

[0043] 93 Third packaging substrate

[0044] 94 Fourth packaging substrate DETAILED DESCRIPTION

[0045] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0046] See also Figures 1 to 4 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the diagrams only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0047] like Figures 1 to 3 This embodiment provides a packaging substrate electroplating uniformity detection device, including: an electroplating tank 1, a guide rail 2, a rack 4, n anode nets 6, a rectifier and a diverter 7; n is a natural number greater than 1.

[0048] Specifically, the electroplating tank 1 is divided into n electroplating units. In this embodiment, the electroplating tank 1 is composed of several copper cylinders arranged in sequence, with copper bars containing electroplating liquid. The package substrate 9 is electroplated in each of the copper cylinders. In this embodiment, the package substrate 9 is a flip-chip ball grid array substrate. It should be noted that other cylinder materials can also be used for the electroplating tank 1.

[0049] Specifically, each electroplating unit is provided with at least one anode mesh 6. Each electroplating unit is provided with an anode mesh 6. When the package substrate 9 moves to each electroplating unit, electroplating begins on the side of the package substrate 9 facing the anode mesh. In fact, in this embodiment, each electroplating unit can be provided with two anode meshes, which are respectively provided on both sides of the package substrate 9 and respectively opposite to the plane of the package substrate 9, so that electroplating can be performed on both sides of the package substrate 9 at the same time. It should be noted that in this embodiment, the anode mesh 6 is set to a titanium mesh, and can also be set to other anode materials for electroplating, which will not be described in detail here.

[0050] Specifically, the guide rail 2 is insulated and arranged above the electroplating tank. The guide rail 2 is arranged above the electroplating tank 1 and is used to hang the rack 4 and then move the packaging substrate 9.

[0051] Furthermore, the guide rail 2 is divided into a first section and a second section which are insulated from each other. Figure 3As shown, the first section and the second section of the guide rail are disconnected and are located in different electroplating units. The second section of the guide rail 2 is located above the mth electroplating unit, where m is a natural number greater than or equal to 2. In this embodiment, the value of m is equal to the value of n, that is, the nth electroplating unit (i.e., the last electroplating unit among the n electroplating units) is located below the second section of the guide rail. In this embodiment, as shown in FIG. Figure 3 As shown, the first section of the guide rail is hung with a third package substrate 93, and the second section of the guide rail is hung with a fourth package substrate 94. The third package substrate 93 and the fourth package substrate 94 are respectively placed in different electroplating units, that is, they are separated in the middle. That is, the third package substrate 93 and the fourth package substrate 94 are respectively immersed in the plating solution of different electroplating units, and the third package substrate 93 and the fourth package substrate 94 do not rely on the plating solution of the electroplating unit for conduction. It should be noted that each electroplating unit can simultaneously accommodate multiple package substrates and process multiple package substrates.

[0052] In this embodiment, the package substrate electroplating uniformity detection device further includes a sensor trigger 3 for labeling each package substrate 9 entering the electroplating tank 1 and recording the time when each package substrate 9 enters the electroplating tank 1. The sensor trigger 3 is arranged at the end of the first section of the guide rail 2 away from the second section (in this embodiment, such as Figure 1 As shown, the first section of the guide rail is on the left, and the second section of the guide rail is on the right. The sensor trigger 3 is provided on the leftmost side of the guide rail 2 to record the time when each package substrate 9 enters the electroplating tank, facilitating tracking of each package substrate 9. In this embodiment, each package substrate 9 is also provided with a recording chip for recording various data of the package substrate 9 for digitized display.

[0053] In this embodiment, the package substrate electroplating uniformity detection device further includes n positioners 5, each positioner 5 being disposed on the guide rail 2 and corresponding to each electroplating unit, for monitoring the real-time position of each package substrate 9. It should be noted that the number of positioners 5 may be greater than n, but at least each electroplating unit must be provided with a corresponding positioner to facilitate monitoring the moving position of each package substrate 9. The time interval between adjacent positioners 5 can be used to calculate the moving speed of each package substrate 9 in that link, that is, the time spent electroplating in that electroplating unit.

[0054] As an example, the rack 4 clamps the package substrate 9 and is hung on the guide rail 2, and the package substrate electroplating uniformity detection device also includes a driving module (not shown in the figure). The driving module drives the rack to move the package substrate 9 from the first section of the guide rail 2 to the second section of the guide rail 2. In this embodiment, the driving template drives the rack 4 to clamp the package substrate 9 and move along the first direction (X direction in the figure). By driving the package substrate 9 to move in the electroplating tank 1 by the driving module, the electroplating time of the package substrate 9 can be adjusted: if the rack 4 drives the package substrate 9 to move faster, the shorter the time it stays in each electroplating unit of the electroplating tank 1, the thinner the electroplating layer thickness will be; conversely, if the rack 4 drives the package substrate 9 to move slower, the longer the time it stays in each electroplating unit of the electroplating tank 1, the thicker the electroplating layer thickness will be. That is, by adjusting the movement speed of the rack 4, the electroplating layer thickness of the package substrate 9 can be adjusted.

[0055] Specifically, if Figure 2 As shown, the negative pole of the rectifier 8 is connected to the first section of the guide rail, and the positive pole is connected to the corresponding anode network in each electroplating unit (not shown in the figure), and the package substrate 9 is arranged opposite to the anode network. Each anode network is used as an anode, the guide rail 2 is used as a cathode, and the electroplating solution is used as a conductive medium. Since the rack 4 is hung on the guide rail and electrically connected to the guide rail 2, it is equivalent to the rack 4 and the package substrate 9 on the rack 4 as a cathode. At this time, the voltage is applied through the rectifier 8 to form a complete electroplating circuit, and the package substrate 9 is electroplated. As shown Figure 2 As shown, the first packaging substrate 91 and the second packaging substrate 92 share the guide rail 2 as the cathode, the first packaging substrate 91 is used as the anode in the electroplating net of the corresponding first electroplating unit (not shown in the figure), and the second packaging substrate 92 is used as the anode in the electroplating net of the corresponding second electroplating unit, forming a circuit for electroplating.

[0056] Specifically, if Figure 3As shown, the first end of the shunt 7 is electrically connected to the end of the first section of the guide rail 2 close to the second section (in this embodiment, the third packaging substrate 93 and the fourth packaging substrate 94 are respectively arranged on the first section and the second section of the guide rail and the first section and the second section are disconnected, that is, the first end of the shunt 7 is electrically connected to the first section of the guide rail 2, and the connection node is at the end of the third packaging substrate 93 close to the fourth packaging substrate 94), and the second end is electrically connected to the end of the second section of the guide rail 2 close to the first section (in this embodiment, that is, the second end of the shunt 7 is electrically connected to the second section of the guide rail 2, and the connection node is at the end of the fourth packaging substrate 94 close to the third packaging substrate 93), so as to detect the current of the packaging substrate hung on the second section of the guide rail 2. In this embodiment, the third packaging substrate 93 is hung on the first section, and the fourth packaging substrate 94 is hung on the second section. The current flows out of the positive electrode of the rectifier 8 and passes through the packaging substrate 94, the second end of the shunt 7, the first end of the shunt 7, the third packaging substrate 93, and then returns to the negative electrode of the rectifier 8, thereby detecting the current of the third packaging substrate 93 and the fourth packaging substrate 94. The shunt can detect the third packaging substrate 93 and the fourth packaging substrate 94 at the same time, but in this embodiment, only the electroplating current of the fourth packaging substrate 94 needs to be detected. It should be noted that a gap is set between the second section and the first section of the guide rail 2, and air is used for insulation separation. In fact, insulating material can also be directly set to isolate and segment the guide rail 2. In addition, the guide rail 2 can also be set to be greater than or equal to 3 sections, and the packaging substrate electroplating uniformity detection device can be set between any two sections, and the current of the packaging substrate 9 on the latter section can be tested. However, in this design, the packaging substrate 9 will not be electroplated at the position of the guide rail 2 in the latter section, and the other positions of the guide rail 2 are used as electroplating areas. The electroplating areas are separated by the packaging substrate electroplating uniformity detection device, which may cause uneven electroplating in different areas.

[0057] In this embodiment, the package substrate detection device further includes an ammeter that displays the current value on the shunt. The ammeter has a positive electrode connected to the first end of the shunt and a negative electrode connected to the second end of the shunt, and is used to display the current of the package substrate 9 hung on the second section of the guide rail.

[0058] In this embodiment, the package substrate detection device further includes an alarm, which is connected in series with the shunt and generates an alarm when the current in the shunt 7 exceeds a threshold value.

[0059] In this embodiment, the package substrate inspection device further includes a control module (not shown) that generates control signals based on the analog signals transmitted by the sensor trigger, the positioner, and the diverter, and executes the removal step for package substrates 9 that have been detected as abnormal based on the control signals. In this embodiment, the speed at which each package substrate 9 moves between the positioners 5 is determined based on the timing of the sensor trigger and the transmission of each positioner 5. A reference speed and reference time are determined based on the set thickness of the package substrate 9. If the control module determines that the transmission times of the sensor trigger and the positioner 5 do not match, it can issue a control instruction to the drive module to adjust the movement speed to ensure that the total electroplating time meets the preset value; or it can issue an alarm signal to warn a specific package substrate 9 or a batch of package substrates 9, facilitating the control module to execute the removal step for the package substrate 9 that has been detected as abnormal. Simultaneously, the control module determines the current signal of the electroplated layer of the package substrate 9 based on the current signal measured by the diverter 7. This signal is compared with a preset current. If there is a discrepancy, an alarm is issued for the package substrate 9 and the substrate is marked as unqualified. The control module then executes the removal step for the package substrate 9 that has been detected as abnormal. In this embodiment, a robotic arm (not shown in the figure) is further provided behind the electroplating device. After receiving the control signal, the control module moves the abnormal rack and pulls out the rack 4.

[0060] As an example, the control module is also provided with a display screen to facilitate inputting commands and displaying various analog signals. In this embodiment, the display screen is used to display the current data summary interface. The induction trigger 3 can be used to number the racks 4 entering the electroplating tank 1 and record the time when the racks 4 enter the electroplating tank 1. The package substrate on the second section is detected by the package substrate detection device to obtain a measured current, which is compared with the set current. If a certain threshold value (that is, the value set by the alarm) is exceeded, an error is reported. The set value of the current and the value of the alarm setting can be adjusted. If the set current setting value is 100A and the alarm setting value is 5%, it is necessary to determine whether the measured current is within the range of 100A±5%.

[0061] like Figure 4 As shown, this embodiment provides an electroplating device, including: a pretreatment module and an electroplating module.

[0062] Specifically, the pretreatment module is provided at the front end of the electroplating module, and is used to perform a pretreatment process on the package substrate 9 before electroplating. The pretreatment module is provided with at least one of an oil removal device and a micro-etching tank. Figure 4(as shown) includes the aforementioned package substrate electroplating uniformity detection device. It should be noted that in this embodiment, pretreatment processes include, but are not limited to, degreasing processes and micro-etching processes. Depending on the process, devices such as, but not limited to, degreasing devices and micro-etching tanks can be installed in the pretreatment module to perform the corresponding treatments. While the package substrate electroplating uniformity detection device in this embodiment is installed in the electroplating module, this is not limited to the electroplating module and can also be applied to pretreatment modules, such as micro-etching processes.

[0063] This embodiment provides a detection method for an electroplating device, combining Figure 1 The method is described below. The method is implemented using the above-mentioned package substrate electroplating uniformity detection device, and includes:

[0064] S1) By detecting the current flowing from the second end of the shunt to the first end, the current of the packaging substrate 9 hung on the second section of the guide rail is obtained: when the detected current of the packaging substrate 9 is consistent with the preset current value, the packaging substrate 9 is determined to be normal; when the detected current of the packaging substrate 9 is inconsistent with the preset current value, an error reporting step is executed.

[0065] Specifically, the current of the package substrate 9 on the guide rail 2 is detected by the package substrate electroplating uniformity detection device. In this embodiment, the current of the fourth package substrate 94 is detected. At this time, the current flows from the positive pole of the rectifier 8 into the fourth package substrate 94, and then passes through the second section of the guide rail electrically connected to the fourth package substrate 94, enters the shunt 7 from the second end of the shunt, and finally flows out from the first section of the shunt 7 and outputs to the negative pole of the rectifier 8 through the first section of the guide rail 2. It should be noted that due to the influence of factors such as measurement error, when the value of the current of the package substrate 9 to be detected is greater than 95% of the preset current value and less than 105% of the preset current, it is considered that the current of the package substrate 9 to be detected is consistent with the preset current value. If the preset current value is 100A and the value of the package substrate 9 to be detected is 80A, it is determined that the package substrate 9 is abnormal and the error reporting step is executed.

[0066] Specifically, before step S1), step S2) speed monitoring is also provided. The speed monitoring includes: S21) hanging each package substrate 9 on a hanger, each hanger drives the corresponding package substrate 9 to move, and records the time when each package substrate 9 enters the electroplating tank.

[0067] Furthermore, a chip is built into rack 4. When rack 4 enters electroplating tank 1, it first passes through sensor trigger 3, which detects rack 4 and transmits information about rack 4 to the control module. The control module numbers each rack 4 and records the current data in a data summary table. The control module also numbers each rack 4 and records the time it entered electroplating tank 1. In subsequent steps, the current and movement speed of package substrate 9 are measured and compared with set values.

[0068] S22) Immerse each package substrate 9 in the plating solution in the plating tank to electroplate the package substrate 9; detect the real-time position of each package substrate 9: when the real-time position of each package substrate 9 reaches a time that is consistent with the preset time, the electroplating process of each package substrate 9 is normal; when the real-time position of each package substrate 9 reaches a time that is inconsistent with the preset time, the electroplating process of each package substrate 9 is abnormal, and an error reporting step is executed.

[0069] Furthermore, each package substrate 9 is immersed in the plating solution in the plating tank to electroplate the package substrate 9; the real-time position of each package substrate 9 is detected: when the real-time position of each package substrate 9 reaches the time that is consistent with the preset time, the electroplating process of each package substrate 9 is determined to be normal; when the real-time position of each package substrate 9 reaches the time that is inconsistent with the preset time, the electroplating process of each package substrate 9 is determined to be abnormal, and an error reporting step is executed. In this embodiment, the rack 4 moves at a constant speed in the plating tank 1. Every time it moves a certain distance, a locator 5 contacts the rack 4, and then the locator 5 transmits the simulation to the control module. The control module continues to record the movement time of each numbered rack 4 in a data summary table, and calculates the speed of the rack 4 between any two locators 5 based on the distance set between each locator 5, and compares it with the preset speed of the rack 4. If they are consistent, it proves that the electroplating process is normal; if they are inconsistent, it means that the speed of the package substrate 9 between the two locators 5 is abnormal, and the electroplating time is too long or too short, and an error is reported for the package substrate 9. In fact, the moving speed of the rack 4 can be adjusted again based on the calculated abnormal results, so that the total electroplating time can be controlled within a preset value, thereby improving the yield rate of the package substrate 9.

[0070] Specifically, in step S1) and / or step S2), the error reporting step includes marking each abnormal package substrate 9 and removing each abnormal package substrate 9 after it has been moved out of the package substrate electroplating uniformity detection device. In this embodiment, a robotic arm (not shown) is further provided behind the electroplating device to move the abnormal rack 4 upon receiving an alarm signal and extract the rack 4.

[0071] In summary, the present invention provides a package substrate electroplating uniformity detection device, an electroplating device, and a method of use, comprising: an electroplating tank, a guide rail, a hanger, n anode meshes, a rectifier, and a shunt; n is a natural number greater than 1; the electroplating tank is divided into n electroplating units, each electroplating unit is provided with an anode mesh; the guide rail is insulated and arranged above the electroplating tank; the guide rail is divided into a first section and a second section that are insulated from each other; the second section of the guide rail is located above the mth electroplating unit, where m is a natural number greater than or equal to 2; the hanger clamps the package substrate and hangs it on the guide rail; the negative pole of the rectifier is connected to the first section of the guide rail, and the positive pole is respectively connected to the corresponding anode mesh in each electroplating unit; the first end of the shunt is electrically connected to an end of the first section of the guide rail close to the second section, and the second end is electrically connected to an end of the second section of the guide rail close to the first section. The present invention can detect the current and electroplating performance of the package substrate and realize the detection of package substrates with abnormal electroplating. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial utilization value.

[0072] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A packaging substrate electroplating uniformity detection device, characterized in that: The packaging substrate electroplating uniformity detection device at least includes: an electroplating tank, a guide rail, a rack, n anode nets, a rectifier and a shunt; n is a natural number greater than 1; The electroplating tank is divided into n electroplating units, each of which is provided with an anode mesh; the guide rail is insulated and arranged above the electroplating tank; and electroplating liquid is provided in the electroplating tank; The guide rail is divided into a first section and a second section that are insulated from each other; the second section of the guide rail is located above the mth electroplating unit, where m is a natural number greater than or equal to 2; the hanger clamps the package substrate and hangs it on the guide rail; The negative electrode of the rectifier is connected to the first section of the guide rail, and the positive electrode is connected to the corresponding anode network in each electroplating unit; The first end of the shunt is electrically connected to one end of the first section of the guide rail close to the second section, and the second end is electrically connected to one end of the second section of the guide rail close to the first section, for detecting the current of the package substrate hung on the second section of the guide rail.

2. The device for detecting uniformity of electroplating of a package substrate according to claim 1, wherein: Each electroplating unit is provided with at least two anode meshes, which are respectively arranged on both sides of the packaging substrate and are respectively opposite to the plane of the packaging substrate.

3. The device for detecting electroplating uniformity of a package substrate according to claim 1, wherein: The packaging substrate detection device is also provided with an ammeter; the positive pole of the ammeter is connected to the first end of the shunt, and the negative pole is connected to the second end of the shunt, for displaying the current of the packaging substrate hung on the second section of the guide rail.

4. The device for detecting electroplating uniformity of a package substrate according to claim 3, wherein: The packaging substrate detection device is further provided with an alarm; the alarm is connected in series with the shunt and issues an alarm when the current in the shunt exceeds a threshold value.

5. The device for detecting electroplating uniformity of a package substrate according to any one of claims 1 to 4, characterized in that: The package substrate electroplating uniformity detection device further includes a sensing trigger; the sensing trigger is arranged at an end of the first section of the guide rail away from the second section, and is used to record the moment when each package substrate enters the electroplating tank.

6. The device for detecting electroplating uniformity of a package substrate according to claim 5, wherein: The package substrate electroplating uniformity detection device further includes n positioners; the n positioners are arranged on the guide rail and correspond one-to-one to each electroplating unit, and are used to monitor the real-time position of each package substrate.

7. The device for detecting uniformity of electroplating of a package substrate according to claim 6, wherein: The package substrate electroplating uniformity detection device further includes a driving module; the driving template drives the rack to move the package substrate from the first section of the guide rail to the second section of the guide rail.

8. The device for detecting electroplating uniformity of a package substrate according to claim 7, wherein: The packaging substrate detection device is further provided with a control module, which generates a control signal according to the analog signal transmitted by the sensing trigger, the locator, and the diverter, so as to perform a removal step on the packaging substrate detected to be abnormal based on the control signal.

9. An electroplating device, characterized in that: The electroplating device comprises at least a pretreatment module and an electroplating module; The pre-treatment module is arranged at the front end of the electroplating module, and is used to perform a pre-treatment process on the packaging substrate before electroplating; The electroplating module includes the packaging substrate electroplating uniformity detection device according to any one of claims 1-8.

10. A method for detecting electroplating uniformity of a package substrate, implemented using the package substrate electroplating uniformity detection device according to any one of claims 1 to 8, characterized in that: The packaging substrate electroplating uniformity detection method comprises: S1) The current of the packaging substrate hung on the second section of the guide rail is obtained by detecting the current flowing from the second end of the shunt to the first end: when the detected current of the packaging substrate is consistent with the preset current value, the packaging substrate is determined to be normal; when the detected current of the packaging substrate is inconsistent with the preset current value, an error reporting step is executed.

11. The method for detecting electroplating uniformity of a package substrate according to claim 10, wherein: Before step S1), step S2) speed monitoring is also provided; the speed monitoring includes: hanging each packaging substrate on a hanger, each hanger drives the corresponding packaging substrate to move, and recording the time when each packaging substrate enters the electroplating tank; immersing each packaging substrate in the electroplating liquid in the electroplating tank to electroplate the packaging substrate; detecting the real-time position of each packaging substrate: when the real-time position reaching time of each packaging substrate is consistent with the preset time, the electroplating process of each packaging substrate is normal; when the real-time position reaching time of each packaging substrate is inconsistent with the preset time, the electroplating process of each packaging substrate is abnormal, and an error reporting step is executed.

12. The method for detecting electroplating uniformity of a package substrate according to claim 11, wherein: In step S1) or / and step S2), the error reporting step includes: marking each abnormal package substrate, and removing each abnormal package substrate after it is moved out of the package substrate electroplating uniformity detection device.

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