Double-sided water-cooled negative pressure clamp

Abstract

The present application relates to a kind of double-sided water-cooled negative pressure clamp, including clamp and device to be tested, device to be tested is clamped in clamp, clamp includes clamp seat, probe seat, water connector, clamp seat includes upper clamp seat, lower clamp seat, device support plate is located between upper clamp seat and lower clamp seat, upper clamp seat and lower clamp seat have water cooling channel respectively, probe seat includes front probe seat and rear probe seat, front probe seat is installed at the front end of clamp seat, rear probe seat is installed at the rear end of clamp seat, negative pressure water connector is connected with the water cooling channel in upper clamp seat and lower clamp seat respectively, the negative pressure water connector is connected with external negative pressure water cooling equipment.The clamp is good in heat conduction, and the cooling efficiency is improved by using double-sided cooling mode, temperature sensor is installed in the center of heat conduction plate, directly contacts the high temperature point of device shell, to ensure the accuracy of measured temperature;Device installation positioning is reliable, water cooling waterway is safe, and there is no water leakage hidden danger.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic component testing devices, in particular to a double-sided water-cooled negative pressure clamp. BACKGROUND

[0002] With the development of new energy, electric vehicles and other industries, IGBT modules are increasingly widely used and play an increasingly important role in power devices. At the same time, the localization of IGBT modules and the in-depth research of the third generation of semiconductor chips represented by SiC, high voltage, high temperature and high frequency are the direction of their application and research, and the thermal reliability problem is becoming more and more prominent. In order to obtain accurate thermal characteristic parameters and conduct related test experiments, a test clamp capable of achieving rapid clamping and accurate temperature control is indispensable.

[0003] The existing test clamps are in the form of air cooling or high-pressure water cooling, and have defects such as poor reliability, inconvenience to use, etc. If the clamp is not sealed well or the sealing ring is aged, leakage is easy to occur, which brings safety hazards. SUMMARY

[0004] In order to solve the problem of poor reliability of the clamp in the prior art and the safety hazards caused by leakage, a double-sided water-cooled negative pressure clamp is provided.

[0005] A double-sided water-cooled negative pressure clamp, comprising a clamp and a device under test, the device under test being clamped in the clamp, the clamp comprising a clamp seat, a probe seat and a water joint, the clamp seat comprising an upper clamp seat and a lower clamp seat, a device support plate being located between the upper clamp seat and the lower clamp seat, the device under test being located on the device support plate, the upper clamp seat and the lower clamp seat each having a water cooling channel, the probe seat comprising a front probe seat and a rear probe seat, the front probe seat being mounted at the front end of the clamp seat, the rear probe seat being mounted at the rear end of the clamp seat, the negative pressure water joint being connected with the water cooling channels in the upper clamp seat and the lower clamp seat respectively, and the negative pressure water joint being connected with an external negative pressure water cooling device. The clamp is a water-cooled clamp designed for a customized device under test, the device under test generates heat on both sides, the double-sided water-cooled clamp is designed, water cooling is used for heat dissipation on the upper and lower clamps, and negative pressure is provided in the sealed space of the upper and lower clamps. By using the negative pressure double-sided water cooling method, it is ensured that there is no risk of water leakage in the entire clamp.

[0006] Further, the upper clamp seat comprises an upper heat dissipation plate and an upper heat dissipation cover plate, the lower clamp seat comprises a lower heat dissipation plate and a lower heat dissipation cover plate, the upper heat dissipation plate and the lower heat dissipation plate are provided with parallel heat dissipation fins, the upper heat dissipation cover plate and the lower heat dissipation cover plate are recessed into water cooling grooves, the upper heat dissipation plate and the upper heat dissipation cover plate and the lower heat dissipation plate and the lower heat dissipation cover plate are sealed by O-shaped sealing rings, the upper heat dissipation cover plate and the lower heat dissipation cover plate are provided with water inlets, the water inlets are provided with water diversion joints, and the water diversion joints and the upper heat dissipation cover plate and the lower heat dissipation cover plate are provided with O-shaped sealing rings. The upper and lower clamps form a sealed negative pressure space, the upper heat dissipation plate and the lower heat dissipation plate are provided with parallel heat dissipation fins, the heat dissipation area is increased, the water fully contacts the heat dissipation fins in the water cooling channel, the water flows along the heat dissipation fins, the heat exchange efficiency is improved, and the heat dissipation efficiency is improved; the water diversion joint changes the direction of the water pipe, facilitating the operation of the clamp, especially in an automatic production line.

[0007] Further, the device supporting plate is provided with a device positioning groove on the upper surface, is provided with a high-voltage protection tooth groove on the side surface, and is provided with a heat conduction plate in the center. The heat conduction plate is made of red copper material, the heat conduction plate increases the contact area and reduces the thermal resistance of the heat dissipation plate, and the high-voltage protection tooth groove on the side surface of the device supporting plate separates the device pins, thereby improving the reliability.

[0008] Further, the heat conduction plate is provided with a temperature measuring sensor in the center, and the temperature measuring sensor is fixed by a temperature measuring sensor pressing plate. The temperature measuring sensor AD590 is installed in the center of the heat conduction plate and directly contacts the high-temperature point of the device shell, so as to ensure the accuracy of the measured temperature; at the same time, the waterway can also be monitored. When the temperature measuring sensor detects that the temperature rises, it means that the waterway is abnormal, there is no water in the water cooling channel, and the equipment will be powered off and stopped, thereby ensuring the safety of the clamp.

[0009] Further, the device supporting plate is provided with positioning mounting holes at four corners, is fixed on the lower heat dissipation plate by positioning screws, and the inside of the positioning screws is provided with a positioning spring. The device supporting plate is positioned and installed by the positioning spring and the positioning screw, so as to be in a floating mode. The device supporting plate is positioned and installed by the positioning spring and the positioning screw, so as to be in a floating mode. The device supporting plate can be shaken according to the actual installation condition to ensure the flatness of the device installation, and the floating device supporting plate can also protect the probe from being damaged by external force when the device is placed.

[0010] Further, the water diversion joint is connected with a negative pressure water joint, and a waterproof gasket is arranged between the water diversion joint and the negative pressure water joint for assembly sealing.

[0011] Further, the water connector of the negative pressure water connector is connected with the spring water pipe, and an elastic steel sleeve is arranged between the water connector and the spring water pipe, and the inside of the connection between the water connector and the spring water pipe is provided with a waterproof O-shaped sealing ring. The negative pressure water connector can quickly suck away water flow and will not cause water retention, thereby greatly reducing the risk of penetration. The inside of the connection between the water connector and the spring water pipe is provided with a waterproof O-shaped sealing ring, which is pressed and sealed by an outward force from the inside. The conventional method of bundling from the outside of the spring water pipe is broken through. In order to make the sealing bundle tighter, it is easier to cause the spring water pipe to break and leak. The waterproof O-shaped sealing ring is used at this place, and the inside is sealed. When the water pipe is filled with water, the water pressure causes the waterproof O-shaped sealing ring to have an outward force to the water pipe to press and seal tightly. The greater the water pressure, the tighter the sealing, so that it is not easy to leak and achieve good sealing effect.

[0012] Further, the upper heat dissipation plate of the upper clamp seat and the lower heat dissipation plate of the lower clamp seat are respectively provided with mounting holes and positioning holes at two ends, and a positioning pin is arranged in the positioning hole, and the upper heat dissipation plate and the lower heat dissipation plate are fixed by means of the mounting hole and a non-loose screw.

[0013] Further, the probe seat comprises a probe plate and a probe group, the probe group comprises a probe and a probe sleeve, the probe sleeve is fastened in the hole of the probe plate, the probe can be pulled out of the probe sleeve, and the tail of the probe sleeve is welded with a lead wire.

[0014] Further, the device to be tested is an AHPM15-CEA horizontal device or an AHPM15-CEA vertical device. The AHPM15-CEA horizontal device and the AHPM15-CEA vertical device are customized devices, which can generate heat on both sides. At present, there is no clamp for the device on the market.

[0015] The present application has the following technical effects:

[0016] (1) Heat conduction temperature control: the clamp positions the device on the device support plate, and water flow cooling is used on the upper and lower surfaces of the device support plate, so that the cooling efficiency is improved. Since the heat conduction effect of water is much better than that of air, the water cooling method has good cooling effect.

[0017] The clamp can clamp two devices with different sizes, is accurate in positioning, convenient to use, and installs a heat-conducting pad between the device and the heat-dissipating plate to reduce the contact thermal resistance; the heat-dissipating plate is made of red copper to reduce the thermal resistance of the heat-dissipating plate; the heat-dissipating plate adopts a structure of heat-dissipating fins to increase the heat-dissipating area of the heat-dissipating plate and improve the heat exchange efficiency; the heat-dissipating fins are embedded in water in a water tank, and the water flows along the heat-dissipating fins to reduce the flow resistance and improve the heat exchange efficiency; the temperature sensor AD590 is installed at the center of the heat-dissipating plate and directly contacts the high-temperature point of the device shell to ensure the accuracy of the measured temperature, the temperature of the device can be accurately controlled, and the device circuit parameters can be tested and collected.

[0018] (2) The device is reliably mounted and positioned. The groove of the device support plate precisely positions the device, and the displacement of the device is limited. The teeth grooves on both sides of the device support plate separate the device pins to improve reliability. The device support plate is floating, and the position can be adjusted according to the size of the test device to ensure that the device is installed flat. The floating device support plate does not contact the probe before clamping to protect the probe from damage caused by external forces during device placement. The device support plate loaded with devices and the probe plate loaded with probes are made of high-insulation and high-temperature-resistant PEEK material to ensure the reliability of the structure.

[0019] (3) Waterway safety: The waterway uses negative pressure water supply, and an external negative pressure water supply device is connected. Therefore, the water cooling channel inside the clamp is supplied with negative pressure water, and the internal pressure of the water cooling channel is low. Even if the sealing ring is aging, water penetration can be avoided due to negative pressure, ensuring no water leakage risk. The heat-dissipating plate is machined as a whole to eliminate assembly gaps. The water joint is designed as a negative pressure water joint, and the waterproof O-ring embedded in the negative pressure water joint can ensure that the joint has no water leakage risk and can quickly drain water from the joint. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a front overall structure schematic diagram of the water-cooled clamp of the present application;

[0021] Figure 2 is a back overall structure schematic diagram of the water-cooled clamp of the present application;

[0022] Figure 3 is a structure schematic diagram of the heat-dissipating cover plate of the water-cooled clamp of the present application;

[0023] Figure 4 is a structure schematic diagram of the heat-dissipating plate of the water-cooled clamp of the present application;

[0024] Figure 5 is a structure schematic diagram of the front probe seat of the water-cooled clamp of the present application;

[0025] Figure 6 is a structure schematic diagram of the rear probe seat of the water-cooled clamp of the present application;

[0026] Figure 7 This is a schematic diagram of the support plate of the water-cooled clamp device of the present invention;

[0027] Figure 8 This is a schematic diagram of the device tray of the water-cooled clamp loading device of the present invention;

[0028] Figure 9 This is a schematic diagram of the negative pressure water connector of the water-cooled clamp of the present invention;

[0029] Figure 10 This is a schematic diagram of the device under test in the water-cooled fixture of the present invention;

[0030] The components include: 1. Fixture base; 101. Upper fixture base; 102. Lower fixture base; 103. Upper heat sink; 104. Upper heat sink cover; 105. Lower heat sink; 106. Lower heat sink cover; 107. Heat sink fins; 108. Water cooling tank; 109. O-ring; 2. Probe base; 201. Front probe base; 202. Rear probe base; 203. Probe plate; 204. Probe assembly; 205. Probe; 206. Probe sleeve; 3. Negative pressure water connector; 4. Device support plate; 40 1. Positioning groove; 402. High-pressure protective toothed groove; 403. Heat-conducting plate; 404. Temperature sensor; 405. Temperature sensor pressure plate; 406. Positioning mounting hole; 407. Positioning screw; 408. Positioning spring; 5. Water inlet; 6. Water diversion joint; 601. Waterproof gasket; 602. Water adapter; 603. Spring water pipe; 604. Elastic steel sleeve; 605. Waterproof O-ring seal; 7. Mounting hole; 8. Positioning hole; 9. Positioning pin; 10. Non-removable screw. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0032] like Figures 1 to 10 As shown, a double-sided water-cooled negative pressure fixture includes a fixture and a device under test. The device under test—an AHPM15-CEA horizontal device or an AHPM15-CEA vertical device—is clamped in the fixture. The fixture includes a fixture base 1, a probe base 2, and a negative pressure water connector 3. The fixture base 1 includes an upper fixture base 101 and a lower fixture base 102. A device support plate 4 is located between the upper fixture base 101 and the lower fixture base 102. The upper fixture base 101 and the lower fixture base 102 each have a water-cooling channel. The probe base 2 includes a front probe base 201 and a rear probe base 202. The front probe base 201 is installed at the front end of the fixture base 1, and the rear probe base 202 is installed at the rear end of the fixture base 1. The negative pressure water connector 3 is connected to the water-cooling channels in the upper fixture base 101 and the lower fixture base 102, respectively, and is connected to an external negative pressure water-cooling device.

[0033] The upper clamp base 101 comprises an upper heat dissipation plate 103 and an upper heat dissipation cover plate 104, and the lower clamp base 102 comprises a lower heat dissipation plate 105 and a lower heat dissipation cover plate 106. The upper heat dissipation plate 103 and the lower heat dissipation plate 105 are provided with heat dissipation fins 107. The upper heat dissipation cover plate 104 and the lower heat dissipation cover plate 106 are recessed to form water cooling grooves 108. The upper heat dissipation plate 103 and the upper heat dissipation cover plate 104 and the lower heat dissipation plate 105 and the lower heat dissipation cover plate 106 are sealed by O-shaped sealing rings 109. The upper heat dissipation plate 103 and the upper heat dissipation cover plate 104 and the lower heat dissipation plate 105 and the lower heat dissipation cover plate 106 form water cooling channels. The upper heat dissipation cover plate 104 and the lower heat dissipation cover plate 106 are provided with water inlets 5. The water inlets 5 are provided with water diversion joints 6. The water diversion joints 6 at the water inlets 5 and the upper heat dissipation cover plate 104 and the lower heat dissipation cover plate 106 are provided with O-shaped sealing rings 109. The upper heat dissipation plate 103 and the lower heat dissipation plate 105 adopt the structure of the heat dissipation fins 107 to increase the heat dissipation area of the heat dissipation plate and improve the heat exchange efficiency. The heat dissipation fins 107 are embedded in the water in the water cooling grooves. The water flows along the heat dissipation fins 107 to reduce the resistance of the water flow and improve the heat exchange efficiency.

[0034] The device supporting plate 4 is provided with a device positioning groove 401 on the upper surface. High-voltage protection tooth grooves 402 are arranged on both sides of the device supporting plate 4. A heat conduction plate 403 is arranged at the center of the device supporting plate 4. A temperature measuring sensor 404 is arranged at the center of the heat conduction plate 403. The temperature measuring sensor 404 is fixed by a temperature measuring sensor pressing plate 405. Positioning installation holes 406 are arranged at the four corners of the device supporting plate 4. The device supporting plate 406 is fixed on the lower heat dissipation plate by positioning screws 407. Positioning springs 408 are arranged in the positioning screws 407. The installed device supporting plate is in a floating state. The groove 401 of the device supporting plate 4 precisely positions the device, and the displacement of the device is limited. The high-voltage protection tooth grooves 402 on both sides of the device supporting plate 4 separate the device pins to improve the reliability. The device supporting plate is positioned and installed by the positioning springs and the positioning screws, so that the device supporting plate is in a floating state. The device supporting plate can shake according to the actual installation situation to ensure the flatness of the device installation. The floating device supporting plate can also protect the probe from being damaged by external force when the device is placed. The heat conduction plate 403 made of red copper is arranged between the device and the heat dissipation plate to reduce the contact thermal resistance. The temperature measuring sensor 404 AD590 is arranged at the center of the heat conduction plate 403 and directly contacts the high-temperature point of the device shell to ensure the accuracy of the measured temperature.

[0035] The upper heat dissipation plate 103 of the upper clamp base 101 and the lower heat dissipation plate 105 of the lower clamp base 102 are respectively provided with installation holes 7 and positioning holes 8 at both ends. Positioning pins 9 are arranged in the positioning holes 8. The upper heat dissipation plate 103 and the lower heat dissipation plate 105 are fixed by loose screws 10 through the installation holes.

[0036] The water diversion joint 6 is connected with the negative pressure water joint, and a waterproof gasket 601 is arranged between the water diversion joint 6 and the negative pressure water joint. The water diversion joint 602 of the negative pressure water joint is connected with the spring water pipe 603, and an elastic steel sleeve 604 is further arranged between the water diversion joint 602 and the spring water pipe. The inside of the water diversion joint 602 connected with the spring water pipe 603 is provided with a waterproof O-shaped sealing ring 605. The water channel adopts negative pressure water supply, and the water joint is designed as a negative pressure water joint. The waterproof O-shaped gasket embedded in the negative pressure water joint can ensure that the joint has no water leakage hidden danger.

[0037] The front probe seat 201 and the rear probe seat 202 respectively include a probe plate 203 and a probe group 204. The probe group 204 includes a probe 205 and a probe sleeve 206. The probe sleeve 206 is fastened in the hole of the probe plate 203, and the probe 205 can be pulled out of the probe sleeve 206. The tail of the probe sleeve 206 is welded with a lead wire.

[0038] The upper heat dissipation plate 103 and the lower heat dissipation plate 105 are made of red copper material, which can reduce the thermal resistance of the heat dissipation plate. The device support plate 4 is made of PEEK material with high insulation and high temperature resistance. The probe plate 201 is made of PEEK material with high insulation and high temperature resistance.

[0039] Working principle or working process: The device AHPM15-CEA is horizontal, and the device AHPM15-CEA has two types of device sizes, horizontal and vertical. The device is precisely positioned and installed through the groove of the device support plate, and then the device support plate is clamped by the upper and lower clamp seats. The upper heat dissipation plate has heat dissipation fins, and the upper heat dissipation cover plate is concave to form a water tank. The upper heat dissipation plate and the upper heat dissipation cover plate are sealed by a waterproof O-shaped gasket. The water tank is filled with water, and the heat dissipation fins are immersed in the water in the water tank. The water flows along the heat dissipation fins, realizing heat exchange between the upper heat dissipation plate and the water flow, so as to control the temperature of the working surface of the upper heat dissipation plate. The upper clamp seat is connected with the water cooling channel of the upper clamp seat through the water pipe above the upper clamp seat through the water diversion joint. The upper heat dissipation cover plate and the water diversion joint are sealed by a waterproof O-shaped gasket. The water diversion joint changes the direction of the water pipe, facilitating the operation of the clamp, and is particularly suitable for use in an automatic production line. The lower heat dissipation plate has heat dissipation fins. The lower heat dissipation cover plate is concave to form a water tank. The lower heat dissipation plate and the lower heat dissipation cover plate are sealed by a waterproof O-shaped gasket. The lower clamp seat is connected with the water cooling channel of the lower clamp seat through the water pipe below the lower clamp seat through the water diversion joint. The water tank is filled with water, and the heat dissipation fins are immersed in the water in the water tank. The water flows along the heat dissipation fins, realizing heat exchange between the lower heat dissipation plate and the water flow, so as to control the temperature of the working surface of the lower heat dissipation plate. In this way, the upper and lower surfaces of the device are cooled at the same time, so as to improve the cooling efficiency, accurately control the temperature of the device, and test and collect the circuit parameters of the device.

[0040] The temperature measuring sensor in the center of the heat conduction plate is fixed by a temperature measuring sensor pressing plate, the temperature measuring sensor AD590 is installed in the center of the heat conduction plate and directly contacts the high temperature point of the device shell, so that the measured temperature is accurate; meanwhile, the water path can also be monitored, when the temperature sensor monitors that the temperature rises, it means that the water path is abnormal, there is no water in the water cooling channel, the equipment will be powered off and stopped working, so that the safety of the clamp is ensured.

[0041] Generally, the clamp is safe and reliable, convenient to use, can be manually operated in a single set, and can also be used in an automatic production line.

[0042] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A double-sided water-cooled negative pressure clamp comprising a clamp and a device under test, the device under test being held within the clamp, characterized in that: The clamp comprises a clamp seat, a probe seat and a water joint, the clamp seat comprises an upper clamp seat and a lower clamp seat, a device support plate is located between the upper clamp seat and the lower clamp seat, a device under test is located on the device support plate, the upper clamp seat and the lower clamp seat are respectively provided with water cooling channels, the probe seat comprises a front probe seat and a rear probe seat, the front probe seat is installed at the front end of the clamp seat, the rear probe seat is installed at the rear end of the clamp seat, and the negative pressure water joint is connected with the water cooling channels in the upper clamp seat and the lower clamp seat respectively, and the negative pressure water joint is connected with an external negative pressure water cooling device. The upper clamp seat comprises an upper heat dissipation plate and an upper heat dissipation cover plate, the lower clamp seat comprises a lower heat dissipation plate and a lower heat dissipation cover plate, the upper heat dissipation plate and the lower heat dissipation plate are provided with parallel heat dissipation fins, the upper heat dissipation cover plate and the lower heat dissipation cover plate are recessed to form water cooling grooves, the upper heat dissipation plate and the upper heat dissipation cover plate and the lower heat dissipation plate and the lower heat dissipation cover plate are sealed by O-shaped sealing rings, the water cooling channels are formed between the upper heat dissipation plate and the upper heat dissipation cover plate and between the lower heat dissipation plate and the lower heat dissipation cover plate, the upper heat dissipation cover plate and the lower heat dissipation cover plate are provided with water inlets, the water inlets are provided with water diversion joints, and O-shaped sealing rings are arranged between the water diversion joints and the upper heat dissipation cover plate and the lower heat dissipation cover plate. The upper surface of the device support plate is provided with a device positioning groove, the side surface of the device support plate is provided with a high-voltage protection tooth groove, and the center of the device support plate is provided with a heat conduction plate.

2. The dual-sided water-cooled negative pressure clamp of claim 1, wherein: The center of the heat conduction plate is provided with a temperature measuring sensor, and the temperature measuring sensor is fixed by a temperature measuring sensor pressing plate.

3. The dual-sided water-cooled negative pressure clamp of claim 1, wherein: Four corners of the device support plate are provided with positioning mounting holes, the device support plate is fixed on the lower heat dissipation plate by positioning screws, the inside of the positioning screws is provided with a positioning spring, and the installed device support plate is in a floating mode.

4. The dual-sided water-cooled negative pressure clamp of claim 1, wherein: The negative pressure water joint is connected with the water diversion joint, and a waterproof pad is arranged between the water diversion joint and the negative pressure water joint.

5. A double-sided water-cooled negative pressure clamp according to claim 4, characterized in that: The water diversion joint of the negative pressure water joint is connected with a spring water pipe, an elastic steel sleeve is further arranged between the water diversion joint and the spring water pipe, and a waterproof O-shaped sealing ring is arranged in the inside of the connection between the water diversion joint and the spring water pipe.

6. The dual-sided water-cooled negative pressure clamp of claim 1, wherein: The upper heat dissipation plate of the upper clamp seat and the lower heat dissipation plate of the lower clamp seat are respectively provided with mounting holes and positioning holes at two ends, positioning pins are arranged in the positioning holes, and the upper heat dissipation plate and the lower heat dissipation plate are fixed by loose screws through the mounting holes.

7. A double-sided water-cooled negative pressure clamp according to any one of claims 1-6, characterized in that: The probe seat comprises a probe plate and a probe group, the probe group comprises a probe and a probe sleeve, the probe sleeve is fastened in the hole of the probe plate, the probe can be pulled out of the probe sleeve, and the tail of the probe sleeve is welded with a lead wire.

8. The dual-sided water-cooled negative pressure clamp of claim 1, wherein: The device under test is an AHPM15-CEA horizontal device or an AHPM15-CEA vertical device.

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