Preparation method of splitter and splitter processing equipment

Abstract

The present invention discloses a method for manufacturing a shunt and shunt processing equipment. The method comprises the following steps: placing the shunt body and the circuit board in a processing environment, wherein the processing environment is a vacuum and constant temperature environment; obtaining surface information on the circuit board and locating a pressing area based on the surface information; and simultaneously welding the facing surfaces of the circuit board and the shunt body while pressing the pressing area of ​​the circuit board to bring it close to and squeeze the shunt body. The technical solution of this application can improve the current detection accuracy of the shunt.

Description

Technical Field

[0001] The present invention relates to the field of flow dividers, and in particular to a preparation method of a flow divider and flow divider processing equipment. Background Art

[0002] A shunt is an instrument used to measure DC current. It's designed based on the principle that voltage is generated across a resistor when DC current flows through it. In the electronic metering industry, DC shunts are used for current limiting, current return, and current balancing in power systems such as battery management systems, electronic equipment, communications systems, and automated control systems.

[0003] However, with the rapid development of some industries, the requirements for the detection accuracy of shunts are also increasing. For example, in the BMS (Battery Management System) in new energy vehicles, the current detection requirements for shunts are relatively high, but the shunts currently on the market still have the problem of not meeting the requirements for high-precision current detection. Summary of the Invention

[0004] The main purpose of the present invention is to provide a method for preparing a shunt. During the production process of the copper busbar, due to problems with the production process, the surface of the copper busbar may be uneven, or there may be a certain gap between the circuit board of the shunt and the copper busbar when the two are welded. The uneven surface and / or gap may cause bubbles to be generated between the circuit board and the copper busbar when they are welded. The purpose of the present invention is to eliminate the generation of bubbles between the circuit board and the copper busbar, avoid the influence of bubbles on the impedance of the shunt, and thus improve the current detection accuracy of the shunt.

[0005] To achieve the above-mentioned object, the present invention provides a method for preparing a shunt, wherein the shunt includes a shunt body and a circuit board, and the method for preparing the shunt includes the following steps:

[0006] Placing the diverter body and the circuit board in a processing environment, wherein the processing environment is a vacuum and constant temperature environment;

[0007] Acquiring surface information on the circuit board, and locating a pressing area according to the surface information;

[0008] While welding the surfaces of the circuit board and the diverter body facing each other, the pressing area of ​​the circuit board is pressed to make it approach and squeeze the diverter body.

[0009] Optionally, the diverter processing equipment is provided with an identification device, and the step of obtaining the upper surface information of the circuit board and locating the pressing area according to the surface information includes:

[0010] Controlling the identification device to obtain surface information of the circuit board facing the diverter body, wherein the surface information includes identification information and / or position setting information of components;

[0011] determining at least one pressure point according to the surface information;

[0012] determining a priority of the at least one pressure point according to an information type of the surface information;

[0013] The pressing area is determined according to the pressing point with the highest priority.

[0014] Optionally, the diverter processing equipment is provided with a pressing device, and the step of pressing the pressing area of ​​the circuit board to make it close to and squeeze the diverter body while welding the surfaces of the diverter body facing the circuit board includes:

[0015] Determining a pressing and moving sequence of the diverter body and the circuit board;

[0016] While welding the surfaces of the diverter body and the circuit board facing each other, the pressing device is controlled to press the pressing area of ​​the circuit board according to the pressing movement sequence to make it close to and squeeze the diverter body.

[0017] Optionally, while welding the surfaces of the diverter body facing the circuit board, the step of pressing the pressing area of ​​the circuit board to make it approach and squeeze the diverter body comprises:

[0018] determining a preset pressing force and a preset pressing time according to the position information of the pressing area;

[0019] While welding the surfaces of the diverter body and the circuit board facing each other, the pressing area of ​​the circuit board is pressed according to a preset pressing force and a preset pressing time to make it approach and squeeze the diverter body.

[0020] Optionally, before the step of pressing the pressing area of ​​the circuit board while welding the surfaces of the circuit board facing the diverter body, the method further includes:

[0021] Acquiring position information of the pressing area on the circuit board;

[0022] The step of pressing the pressing area of ​​the circuit board while welding the surfaces of the circuit board facing the diverter body includes:

[0023] If the position information of the pressing area is a preset position of the circuit board, determining a pressing force variation curve corresponding to the pressing area, wherein the pressing force decreases as the pressing time increases after a preset time point in the pressing force variation curve;

[0024] determining the pressing force and the corresponding pressing time according to the pressing force variation curve;

[0025] While welding the surfaces of the circuit board and the diverter body facing each other, the pressing area of ​​the circuit board is pressed according to the pressing force and the pressing time.

[0026] Optionally, the diverter processing equipment is provided with a pressing device, the pressing device is provided with pressing members of different sizes, and the step of pressing the pressing area of ​​the circuit board while welding the surfaces of the circuit board facing the diverter body includes:

[0027] determining a target pressing member matching the pressing area according to the area size of the pressing area;

[0028] While welding the surfaces of the circuit board and the diverter body facing each other, the target pressing member is controlled to press the pressing area of ​​the circuit board.

[0029] Optionally, while welding the surfaces of the circuit board facing the diverter body, the step of controlling the target pressing member to press the pressing area of ​​the circuit board includes:

[0030] determining the pressing force of the target pressing member according to the area size of the pressing area;

[0031] While welding the surfaces of the diverter body facing the circuit board, the target pressing member is controlled to press the pressing area of ​​the circuit board according to the pressing force.

[0032] Optionally, after the step of pressing the pressing area of ​​the circuit board to bring it close to and squeeze the diverter body while welding the surfaces of the circuit board facing the diverter body, the method further includes:

[0033] Acquire welding information and write the welding information into a QR code corresponding to the diverter, wherein the welding information includes at least one of welding time, welding temperature, and pressing area;

[0034] Obtaining a welding test result of the diverter;

[0035] If the yield of the shunt fabrication determined according to the welding detection result is less than a preset threshold, an adjustment working parameter of the shunt processing equipment is determined according to the welding detection result and the welding information.

[0036] Optionally, after the step of pressing the pressing area of ​​the circuit board while welding the surfaces of the circuit board facing the diverter body, the method further comprises:

[0037] Vibrate either the circuit board or the diverter body according to preset vibration parameters.

[0038] In order to achieve the above-mentioned objectives, the present invention provides a diverter processing device, which includes a memory, a processor, and a diverter preparation program stored in the memory and executable on the processor. When the diverter preparation program is executed by the processor, the various steps of the diverter preparation method described above are implemented.

[0039] The preparation method of the technical solution of the present invention places the shunt body and the circuit board in a processing environment, obtains the pressing area of ​​the circuit board, and then, when the shunt body and the circuit board are soldered, presses the pressing area of ​​the circuit board against the circuit board to drive the two toward each other. In this way, bubbles generated in the gap between the circuit board and the shunt body can be eliminated during the squeezing process, thereby reducing the impact of bubbles on the impedance of the shunt. Furthermore, the technical solution of the present invention can effectively improve the shunt's current detection accuracy through the preparation method without modifying the shunt structure, thereby meeting the industry's demand for high-precision shunt detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0041] Figure 1 Schematic diagram of the structure of a flow splitter according to an embodiment of the present invention;

[0042] Figure 2 This is a schematic flow chart of a first embodiment of a method for preparing a flow splitter according to the present invention;

[0043] Figure 3 This is a schematic flow chart of a second embodiment of a method for preparing a flow splitter according to the present invention;

[0044] Figure 4 This is a schematic flow chart of a third embodiment of a method for preparing a flow splitter according to the present invention;

[0045] Figure 5 This is a schematic flow chart of a fourth embodiment of a method for preparing a flow splitter according to the present invention;

[0046] Figure 6 This is a schematic flow chart of a fifth embodiment of a method for preparing a flow splitter according to the present invention;

[0047] Figure 7 This is a schematic flow chart of a sixth embodiment of a method for preparing a flow splitter according to the present invention;

[0048] Figure 8 It is a structural schematic diagram of an embodiment of the diverter processing equipment of the present invention.

[0049] Description of Figure Numbers:

[0050]

[0051]

[0052] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0054] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0055] In addition, the descriptions of "first", "second", etc. in the present invention are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0056] A shunt is an instrument used to measure DC current. It is made based on the principle that a voltage is generated across a resistor when a DC current passes through it. In the electronic measurement technology industry, DC shunts can be used to perform current limiting, backflow, and current balancing on the power supply of battery management systems, electronic equipment, communication systems, and automation control systems. However, with the rapid development of some industries, the requirements for the detection accuracy of shunts are also increasing. For example, the BMS (Battery Management System) in new energy vehicles has high requirements for current detection by shunts, but the shunts currently on the market still cannot meet the requirements for high-precision current detection.

[0057] At present, shunt manufacturers have basically made improvements in the following aspects to improve the detection accuracy of shunts in order to solve the problem of poor current detection accuracy of shunts:

[0058] (1) Improve the material of the shunt itself. For example, to address the problem of uneven material of the copper busbar of the shunt, the shunt manufacturer improves the material uniformity of the copper busbar to improve the detection accuracy of the shunt;

[0059] (2) Improvements have been made to the connection between the sampling connector and the copper busbar. For example, to address the problem of poor contact between the sampling connector and the copper busbar, the manufacturer of the shunt has increased the detection accuracy of the shunt by adding detection points on the shunt.

[0060] (3) Improve the use environment of the shunt. For example, in order to solve the problem of the poor use environment of the shunt, the shunt manufacturer improves the use environment of the shunt, such as avoiding excessive temperature changes in the use environment of the shunt, avoiding excessive humidity in the use environment, or avoiding vibration of the shunt, so as to improve the detection accuracy of the shunt;

[0061] (4) Improve the detection accuracy of the shunt's ADC (Analog to Digital Converter), for example, by improving the ADC's detection accuracy to improve the shunt's detection accuracy.

[0062] However, during the research and development process, the inventors of this application discovered that despite improving the aforementioned factors that generally affect the current detection accuracy of the shunt, the current detection accuracy of the shunt was still poor. Therefore, through repeated experimental tests, they discovered that there were other problems that affected the current detection accuracy of the shunt. Specifically, they discovered that during the production process, the copper busbar had uneven surfaces due to production process problems, or that there was a certain gap between the shunt circuit board and the copper busbar when they were welded. The uneven surfaces and / or gaps caused bubbles to form between the circuit board and the copper busbar when they were welded. Testing revealed that the bubbles generated therein affected the impedance of the shunt body, thereby affecting the current detection accuracy of the shunt body.

[0063] As for the method of eliminating bubbles, the inventor of this application not only improves the structure of the copper busbar itself, but also eliminates bubbles through process steps during the welding process between the circuit board and the copper busbar. That is, the technical solution of this application is the above-mentioned preparation method for eliminating bubbles through process during the welding process between the circuit board and the copper busbar.

[0064] The present invention provides a method for preparing a diverter.

[0065] It is understandable that the reasons why bubbles are generated between the shunt body 10 and the circuit board 30 during welding include but are not limited to the following two reasons: one reason is that during the production and processing of the copper busbar 11 of the shunt body 10, due to the influence of existing production process factors, there will be some raised areas or recessed areas on the surface of the copper busbar 11, which will cause the copper busbar 11 of the shunt body 10 and the circuit board 30 to be unable to fit tightly during welding, thereby causing bubbles to be generated that affect the current detection accuracy of the shunt 100; the other reason is that during welding, the welding material cannot be evenly distributed between the shunt body 10 and the circuit board 30, for example, the solder cannot be evenly distributed between the copper busbar 11 of the shunt body 10 and the circuit board 30, which causes the copper busbar 11 and the circuit board 30 to always be unable to fit tightly during welding, and there is a certain gap, and this gap will cause bubbles to be generated that affect the current detection accuracy of the shunt 100.

[0066] Reference Figures 1 to 2 , Figure 2 This is a first embodiment of a method for preparing a flow splitter according to the present invention. The method for preparing a flow splitter comprises the following steps:

[0067] In step S10 , the diverter body 10 and the circuit board 30 are placed in a processing environment, wherein the processing environment is a vacuum and constant temperature environment.

[0068] Optionally, the method for preparing the diverter is applied to a diverter processing device.

[0069] Alternatively, as Figure 1 As shown, the shunt body 10 includes two copper bars 11 and a resistance alloy 13 arranged at intervals. The two ends of the resistance alloy 13 are respectively welded to the two copper bars 11 and electrically connected to the two copper bars 11. Among them, each copper bar 11 is provided with a measuring terminal. It can be understood that the measuring connection end of one copper bar 11 is the positive connection end, and the measuring connection end of the other copper bar 11 is the negative connection end, so that the measuring current can flow from the positive connection end to the resistance alloy 13, and then from the resistance alloy 13 to the negative connection end, thereby realizing the measurement of the current value, and the current value can be transmitted to the external device by the circuit board 30. Among them, the material of the copper bar 11 can be copper or brass, etc., and the surface of the copper bar 11 can be plated with a protective layer to achieve an anti-oxidation effect on the surface of the copper bar 11, avoiding the problem of poor contact caused by surface oxidation of the copper bar 11, for example, by tin plating, nickel plating or applying an organic solder preservative film, etc., which are not limited here. The material of the resistance alloy 13 can be manganese-copper alloy 13, iron-chromium-aluminum alloy 13 or nickel-chromium alloy 13, etc. When the resistance alloy 13 is manganese-copper alloy 13, it has low resistivity and low temperature coefficient characteristics.

[0070] It is understandable that, since welding is a thermal processing method, the copper busbar 11 will be deformed by heat during the welding process between the copper busbar 11 and the resistance alloy 13. Even if electron beam welding is used, it will still have an impact on the copper busbar 11, resulting in an arc angle formed between the upper surface of the copper busbar 11 and its inner side surface, so that a gap will be formed between the two. Therefore, bubbles will be generated at the position where the copper busbar 11 forms an arc angle when it is welded to the circuit board 30, and the bubbles will affect the impedance of the shunt body 10, thereby affecting the current detection accuracy of the shunt body 10. Of course, in other embodiments, the upper surface of the copper busbar 11 will be directly deformed by heat, resulting in a certain gap between the upper surface of the circuit board 30 and the copper busbar 11, so that when the circuit board 30 and the upper surface of the copper busbar 11 are welded, certain bubbles will also be generated.

[0071] Optionally, before step S10, the diverter body 10 and the circuit board 30 are prepared and pre-assembled. The pre-assembly can include preparing the diverter body 10 and the circuit board 30, securing the circuit board 30, and placing the diverter body 10 on the surface of the circuit board 30 facing the diverter body 10. Alternatively, the pre-assembly can include preparing the diverter body 10 and the circuit board 30, securing the diverter body 10, and placing the circuit board 30 on the surface of the diverter body 10 facing the circuit board 30.

[0072] Optionally, the diverter body 10 and the circuit board 30 are placed in a processing environment. The processing environment can be a vacuum and constant temperature environment. In this way, while ensuring the welding efficiency and welding effect, the effect of eliminating bubbles can be improved to improve the detection accuracy of the diverter 100 for current. In a constant temperature environment, the solder paste used during welding can be made fast and flowing to improve the welding efficiency and welding effect. In a vacuum environment, some bubbles generated during welding can be eliminated, thereby reducing the bubble rate between the two while ensuring the welding effect, thereby reducing the influence of bubbles on the impedance of the diverter 100, so as to improve the detection effect of the diverter 100 for current. Optionally, the preset temperature range value under the constant temperature environment is XX℃ to XX℃. Optionally, the preset vacuum degree under the vacuum environment is greater than XXKPa.

[0073] The processing environment can be a vacuum environment and / or a constant temperature environment. In a constant temperature environment, the solder paste used during welding can be fast and fluid, so as to improve the welding efficiency and welding effect. It should be pointed out that, since the type of solder paste used for the diverter body 10 and the circuit board 30 needs to be selected according to the actual preparation situation during the actual preparation process, and the melting points of different types of solder pastes will be different, this application does not limit the specific temperature range of the constant temperature environment referred to here, as long as it is ensured that the solder paste can melt in the constant temperature environment to achieve good welding. In some exemplary embodiments, when the melting point of the solder paste is 190°C, the temperature of the constant temperature environment can be arbitrarily selected between 190°C and 200°C, so that the solder paste can melt during the welding process, and the workshop can continue to carry out preparation processing under the constant temperature environment to improve the preparation efficiency of the workshop, and at the same time, it can avoid increasing the preparation cost of the workshop in order to reach a higher temperature.

[0074] In a vacuum environment, some bubbles generated during welding can be eliminated, thereby ensuring the welding effect while reducing the bubble rate between the two, thereby reducing the influence of bubbles on the impedance of the diverter 100, and improving the detection effect of the diverter 100 on the current; wherein, the present application does not specifically limit the vacuum degree range in the vacuum environment, as long as it is ensured that the bubble elimination effect can be further improved in the vacuum environment during the preparation process. In some exemplary embodiments, when the preparation is carried out under a preset vacuum degree of the vacuum environment, the bubbles can be eliminated under the influence of the vacuum environment, and the value of the preset vacuum degree will not be too large, for example, it will not reach a vacuum environment close to absolute vacuum, so as to avoid increasing the cost of the workshop for a larger preset vacuum degree, which can be more suitable for the actual preparation of the workshop.

[0075] Step S20 , obtaining surface information of the circuit board 30 , and locating the pressing area according to the surface information.

[0076] Optionally, the diverter processing equipment is provided with an identification device, which controls the identification device to obtain surface information of the circuit board 30 facing the diverter body 10, the surface information including identification information and / or component position setting information; and obtains the pressing area according to the surface information.

[0077] Optionally, at least one pressing point is determined based on the surface information. Optionally, the pressing point can be a point other than identification information and / or component location information, and there is no identification information or component at the position corresponding to the pressing point. The priority of at least one pressing point is determined based on the information type of the surface information. For example, the priority of pressing point a located in the middle of the circuit board is the first priority, and the priority of pressing point b located at the edge of the circuit board is the second priority. The pressing area is determined based on the pressing point with the higher priority. Optionally, with the pressing point as the center, a pressing area with a preset distance from the center and a preset shape is determined, for example, a square area with a preset side length centered on the pressing point.

[0078] Optionally, the identification device 330 can be a CCD device (Charge Coupled Device), which can quickly and accurately identify the surface information of the circuit board 30, or it can be a CMOS (Complementary Metal-Oxide-Semiconductor) device. No specific limitation is made here, and the type of identification device 330 can be selected according to actual identification requirements and actual preparation costs.

[0079] Optionally, the pressing area is obtained based on the surface information. This means that if no component locations are found on the surface of the circuit board 30 facing the copper busbar 11, the corresponding location on the other surface of the circuit board 30 can be used as the pressing area. This allows for automated acquisition of the pressing area, improving the bubble elimination effect of the present application while ensuring that the circuit board 30 is not damaged during the pressing process.

[0080] Optionally, the surface information includes identification information and / or component location information. This ensures bubble elimination while preventing damage to components on the circuit board 30. In this embodiment, the surface information may be identification information, component location information, or both, without specific limitation. The identification information may include pad information and white box information, without specific limitation.

[0081] In some embodiments, on the surface of the circuit board 30 facing the copper bus 11, soldering pads for soldering the copper bus 11 are provided on opposite sides along the center line of the circuit board 30, and no components are provided at these two positions. In this case, the two pressing areas may be the soldering pad positions on opposite surfaces of the circuit board 30. Since the position where the bubbles are generated is roughly the gap between the soldering pad and the circuit board 30, pressing the pressing area can ensure the bubble elimination effect and avoid damage to the components of the circuit board 30.

[0082] In step S30 , while welding the surfaces of the circuit board 30 facing the diverter body 10 , the pressing area of ​​the circuit board 30 is pressed to make it approach and squeeze the diverter body 10 .

[0083] Optionally, the circuit board is arranged on the welding surface of the diverter body.

[0084] Optionally, while welding the circuit board 30 and the copper busbar 11 of the diverter body 10, the two are driven to squeeze close to each other to eliminate the gap between the copper busbar 11 of the diverter body 10 and the circuit board 30, so that the diverter body 10 and the circuit board 30 can fit tightly during welding, ensuring that the generation of bubbles in the gap between the two can be reduced during welding, thereby reducing the bubble rate between the two, and further reducing the influence of bubbles on the impedance of the diverter 100, thereby improving the detection effect of the diverter 100 on current.

[0085] Optionally, determine the pressing movement sequence of the diverter body 10 and the circuit board 30; while welding the surfaces of the diverter body 10 and the circuit board 30 facing each other, control the pressing device to press the pressing area of ​​the circuit board 30 according to the pressing movement sequence, so that it approaches and squeezes the diverter body 10. Optionally, the pressing movement sequence can be to fix the circuit board 30 and drive the copper bus 11 to move close to the circuit board 30, at which time the two can move relative to each other and press. The pressing movement sequence can also be to fix the copper bus 11 and drive the circuit board 30 to move close to the copper bus 11, at which time the two can move relative to each other and press. It can also be that the pressing movement sequence drives the two to move separately so that the two are squeezed close to each other. It is not specifically limited here and can be selected according to the actual production scene and the actual diverter processing equipment 300.

[0086] While soldering the facing surfaces of the circuit board 30 and the diverter body 10, the pressing area of ​​the circuit board 30 is pressed to bring it close to and squeeze the copper busbar 11 of the diverter body 10. This ensures that the pressure is applied at a location with a gap between the copper busbar 11 and the circuit board 30, improving the effectiveness of eliminating bubbles. Furthermore, during the pressing process, the components on the circuit board 30 can be avoided from being pressed and damaged, thus preventing the circuit board 30 from being scrapped during the production process, thereby reducing production costs in the workshop.

[0087] Optionally, welding information is obtained and written into the QR code corresponding to the diverter 100. The welding information includes at least one of the welding time, welding temperature, and pressing area, so that the staff can subsequently query according to the welding information in the QR code; the welding test results of the diverter 100 are obtained; if the yield of the diverter prepared according to the welding test results is less than a preset threshold, the adjustment working parameters of the diverter processing equipment are determined according to the welding test results and the welding information, so as to adjust the diverter processing equipment according to the adjustment working parameters. Optionally, the adjustment working parameters are control parameters of the welding temperature, pressing area, and welding time. Optionally, the welding test results can be determined by irradiating the welding area with radiation or performing a red ink experiment. Optionally, if there are more than a preset number of welding test results that show deformation of the edge of the circuit board, it is necessary to redetermine the pressing area for welding; if there are more than a preset number of welding test results that show burnt circuit boards during welding, it is necessary to redetermine the welding temperature.

[0088] The preparation method of the technical solution of the present invention places the diverter body 10 and the circuit board 30 in a processing environment, obtains the pressing area of ​​the circuit board 30, and then presses the pressing area of ​​the circuit board 30 when welding the diverter body 10 and the circuit board 30 to drive the two to squeeze together. In this way, the diverter body 10 and the circuit board 30 can be tightly fitted during welding, ensuring that the generation of bubbles in the gap between the two can be reduced during welding, thereby reducing the impact of bubbles on the impedance of the diverter 100. Furthermore, the technical solution of the present invention can effectively improve the detection accuracy of the diverter 100 for current through the preparation method without improving the structure of the diverter 100, so as to meet the industry's demand for high-precision detection of the diverter 100.

[0089] Reference Figure 3 , Figure 3 This is a second embodiment of the method for preparing a flow divider according to the present invention. Based on the first embodiment, before step S10, the method further includes:

[0090] Step S40 , preparing the diverter body 10 and the circuit board 30 , and pre-assembling the two.

[0091] Wherein, step S40 includes:

[0092] Step S41, prepare the diverter body 10 and the circuit board 30;

[0093] Step S42, fixing the diverter body 10;

[0094] In step S43 , the circuit board 30 is placed on the surface of the diverter body 10 to be fixed.

[0095] In this embodiment, in the industrial assembly line process, the two copper bars 11 and the resistance alloy 13 are welded to form the shunt body 10 in the previous process. Therefore, when moving from the previous process to the process of this preparation method, in step S41, the main body in the previous process can be directly transported by the conveyor belt, and then the circuit board 30 can be mounted on the main board. In step S42, the shunt 100 is fixed to ensure that the shunt 100 is stable and does not deviate. In step S43, the circuit board 30 is clamped and placed on the surface of the shunt body 10 facing the circuit board 30.

[0096] Optionally, the circuit board 30 can be clamped manually or by an automated device, such as a robotic arm 320 or an electric gripper. For example, the robotic arm 320 can be used to clamp and release the circuit board 30, thereby improving the degree of automated production in the workshop. This embodiment is easy to operate and has a high degree of automation, thereby improving the production efficiency of the workshop.

[0097] Reference Figure 4 , Figure 4 This is a third embodiment of the method for preparing a flow divider according to the present invention. Based on the first or second embodiment, step S30 includes:

[0098] Step S31, determining a preset pressing force and a preset pressing time according to the position information of the pressing area;

[0099] In step S32 , while welding the facing surfaces of the diverter body 10 and the circuit board 30 , the pressing area of ​​the circuit board 30 is pressed according to a preset pressing force and a preset pressing time to make it approach and squeeze the diverter body 10 .

[0100] Optionally, the pressing device is controlled to press the pressing area of ​​the circuit board 30 according to a preset pressing force and a preset pressing time, wherein the pressing device can be a robot device. Optionally, the position information of different pressing areas corresponds to the preset pressing force and the preset pressing time.

[0101] Optionally, the position information of the pressing area may be an edge position or a center position of the circuit board.

[0102] Optionally, the preset pressing force and the preset pressing time when the pressing area is located at the edge of the circuit board are both smaller than the preset pressing force and the preset pressing time when the pressing area is located at the center of the circuit board. Optionally, the preset pressing force when the pressing area is located at the edge of the circuit board is smaller than the preset pressing force when the pressing area is located at the center of the circuit board, and the preset low-pressure time when the pressing area is located at the edge of the circuit board is greater than the preset pressing time when the pressing area is located at the center of the circuit board.

[0103] Optionally, the pressing process can be automated by controlling the robot device 320 to press against the pressing area of ​​the circuit board 30. The robot device 320 can also be controlled to apply a predetermined pressing force and duration to the circuit board 30, ensuring that the circuit board 30 is not damaged while effectively eliminating air bubbles between the circuit board and the robot device 320. In some exemplary embodiments, the robot device 320 can both clamp and press the circuit board 30, allowing a single robot device 320 to perform both functions. This reduces the number of devices and saves space in the workshop, making it adaptable to various workshop environments.

[0104] Here, it should be noted that the present application does not specifically limit the force value of the preset pressing force of the manipulator device 320 on the circuit board 30. The force value of the preset pressing force can be selected and adjusted according to the actual situation of the circuit board 30; for example, the substrate of the circuit board 30 can be an epoxy glass cloth laminate, a ceramic substrate or a metal substrate, and different types of substrates of the circuit board 30 can withstand different preset pressing forces, so the force value of the preset pressing force can be adjusted according to the actual situation of the circuit board 30, as long as it can ensure that the bubbles are eliminated by pressing and the circuit board 30 is not damaged during the pressing process.

[0105] Similarly, this application does not impose any specific restrictions on the length of the preset pressing time, and it can be adjusted according to the actual production conditions of the workshop. In the actual production process, the length of the preset pressing time can be adjusted according to the force value of the preset pressing force. For example, when the force value of the preset pressing force is large, the preset pressing time can be reduced accordingly to improve the production efficiency of the workshop; when the force value of the preset pressing force is small, the preset pressing time can be increased accordingly to ensure the elimination of bubbles. In some other examples, the preset pressing time is also affected by the specific welding conditions. For example, during the welding process of the diverter body 10 with the circuit board 30, it is necessary to avoid the robot device 30 from moving too fast between pressing and not pressing the circuit board 30. The reason is that if the robot device 30 moves too fast, it will cause a severe impact on the circuit board 30, which may easily cause the melted solder material to splash under the severe impact. For example, if the robot device 30 moves too fast, it will cause a severe impact on the melted solder paste, which will cause the risk of solder paste splashing, and then there is a risk of affecting the welding effect and causing harm to the workshop staff. Therefore, the preset pressing time can also be adjusted according to the welding conditions of the workshop, and is not specifically limited here.

[0106] In the technical solution of this embodiment, the preset pressing force and preset pressing time of the pressing device are determined according to the position information of the pressing area of ​​the circuit board, and the diverters 100 corresponding to different preset pressing forces and preset pressing times are prepared, thereby realizing the diversification of the diverters 100 processed by the diverter processing equipment.

[0107] Reference Figure 5 , Figure 5 This is a fourth embodiment of the method for preparing a flow divider according to the present invention, based on any one of the first to third embodiments, and before step S30, further comprising:

[0108] Step S50, obtaining position information of the pressing area on the circuit board 30;

[0109] Step S30 includes:

[0110] Step S33: If the position information of the pressing area is a preset position of the circuit board 30, a pressing force variation curve corresponding to the pressing area is determined, wherein the pressing force decreases as the pressing time increases after the preset time point.

[0111] Step S34, determining the pressing force and its corresponding pressing time according to the pressing force variation curve;

[0112] In step S35 , while welding the surfaces of the circuit board 30 facing the diverter body 10 , the pressing area of ​​the circuit board 30 is pressed according to the pressing force and the pressing time.

[0113] Optionally, the position information of the pressing area on the circuit board 30 is obtained, wherein the position information may be a middle position or an edge position of the circuit board.

[0114] Alternatively, the preset position may be an edge of the circuit board 30. Since the pressing area is located at the edge of the circuit board 30, during the soldering process, uneven force is likely to occur when pressing against the pressing area of ​​the circuit board 30. This can result in higher heat exposure to the circuit board 30 corresponding to the pressing area, potentially causing deformation of the edge of the circuit board 30. Therefore, it is necessary to determine a pressure curve corresponding to the pressing area.

[0115] Optionally, after a preset time point in the pressure change curve, the pressure decreases as the pressure time increases. Optionally, in the pressure change curve, before the preset time point, the pressure area of ​​the circuit board 30 is pressed with a first pressure, and after the preset time point, the pressure area of ​​the circuit board 30 is pressed with a second pressure, wherein the first pressure is greater than the second pressure.

[0116] In the technical solution of this embodiment, by determining the pressure change curve corresponding to the pressing area, different diverters 100 are processed. After the circuit board is pressed for a preset period of time for welding, the pressure of the circuit board 30 is reduced, thereby avoiding uneven heating of the circuit board 30 when the circuit board is pressed at the preset position, resulting in deformation of the edge of the circuit board 30.

[0117] Reference Figure 6 , Figure 6 This is a fifth embodiment of the method for preparing a flow divider according to the present invention, based on any one of the first to fourth embodiments, step S30 includes:

[0118] Step S36, determining a target pressing member matching the pressing area according to the area size of the pressing area;

[0119] Step S37 , while welding the surfaces of the circuit board and the diverter body facing each other, control the target pressing member to press the pressing area of ​​the circuit board.

[0120] Optionally, the diverter processing equipment is equipped with a pressing device, which is equipped with pressing members of different sizes. Optionally, the pressing device is a robotic device. Optionally, the target pressing member is the pressing member corresponding to the current pressing area, wherein the larger the area size of the pressing area, the larger the size of the target pressing member used to press the circuit board; and the smaller the area size of the pressing area, the smaller the size of the target pressing member used to press the circuit board.

[0121] Optionally, the area size of the pressing area may be the area of ​​the pressing area, or information such as the length and width of the pressing area.

[0122] Optionally, the pressing force of the target pressing member is determined according to the area size of the pressing area; while welding the surfaces of the diverter body facing the circuit board, the target pressing member is controlled to press the pressing area of ​​the circuit board according to the pressing force.

[0123] Optionally, different area sizes of the pressing area correspond to different pressing forces of the target pressing part. Optionally, the larger the area size of the pressing area, the greater the pressing force of the target pressing part used to press the circuit board; the smaller the area size of the pressing area, the smaller the pressing force of the target pressing part used to press the circuit board.

[0124] Optionally, when the size of the pressing area falls within a preset first size range, a pressing member corresponding to the preset first size range is obtained as a target pressing member. When the size of the pressing area falls within a preset second size range, a pressing force corresponding to the preset second size range is obtained.

[0125] Optionally, the diverter processing equipment is provided with a detection device, wherein the detection device is used to detect the heating temperature. Optionally, the detection device is a temperature sensor. While controlling the heating device to heat the diverter body 10 on the processing station, the detection device is controlled to detect the temperature value of the heating surface of the diverter body 10; the control device adjusts the heating temperature of the heating device according to the temperature value to change the heating surface of the diverter body 10. Optionally, when the temperature value of the heating surface is higher than a preset first threshold value, the heating power of the heating device is reduced; when the temperature value of the heating surface is lower than a preset second threshold value, the heating power of the heating device is increased.

[0126] Optionally, the heating temperature during welding can be varied. The step of welding the surfaces of the diverter body 10 facing the circuit board 30 includes: obtaining a heating temperature curve of the heating surface of the diverter body 10, the heating temperature curve being determined by the temperature curve variation of the welding surface of the diverter body 10; and controlling a heating device to heat the diverter body 10 at the processing station according to the heating temperature curve.

[0127] Optionally, the heating temperature of the heating surface is correlated with the heating temperature of the welding surface. The higher the heating temperature of the heating surface, the higher the heating temperature of the welding surface; and the lower the heating temperature of the heating surface, the lower the heating temperature of the welding surface. Thus, based on the historical temperature data obtained from the test, a heating temperature curve corresponding to the temperature change curve required for the welding surface of the diverter 100 can be determined. Optionally, the determination of the heating temperature curve is affected by factors such as the material type and thickness of the diverter body 10, and the thickness of the circuit board 30. By controlling the temperature, the circuit board can be prevented from being burned during the welding process, or situations such as the welding temperature not being high enough can be avoided.

[0128] In the technical solution of this embodiment, different shunts are processed through different welding modes, and the heating temperature and heating time are controlled, so that different shunts 100 are processed, avoiding the deformation of the circuit board caused by excessive temperature.

[0129] Reference Figure 7 , Figure 7 This is a sixth embodiment of the method for preparing a flow divider according to the present invention, based on any one of the first to fifth embodiments, and after step S30, further comprising:

[0130] In step S60 , vibrate either the circuit board 30 or the diverter body 10 according to preset vibration parameters.

[0131] In this embodiment, since the squeezing pressure is substantially perpendicular to the surface of the circuit board 30, it does not effectively eliminate bubbles in a direction parallel to the surface of the circuit board 30. Therefore, in order to further improve the effect of eliminating bubbles between the circuit board 30 and the diverter body 10, in step S40, by vibrating either the circuit board 30 or the copper busbar 11 according to preset vibration parameters, bubbles can be further eliminated on the basis of squeezing, and bubbles can be eliminated in a direction parallel to the surface of the circuit board 30, thereby further improving the effect of eliminating bubbles between the circuit board 30 and the copper busbar 11 of the diverter body 10, and further improving the current detection accuracy of the diverter 100.

[0132] Specifically, the diverter body 10 may be vibrated according to preset vibration parameters. For example, a vibration device may be provided in the workbench 310, and the diverter body 10 may be driven to vibrate by the vibration device, or the diverter body 10 may be driven to vibrate by a manipulator device 320. The circuit board 30 may also be vibrated according to preset vibration parameters, which is not specifically limited here.

[0133] Optionally, the welding surface of the diverter body is provided with at least one groove in parallel, and the length of the groove is greater than the width of the welding surface and smaller than the width of the diverter body, so as to discharge bubbles generated during welding.

[0134] Optionally, the robot device 320 is controlled to vibrate either the circuit board 30 or the diverter body 10 according to preset vibration parameters.

[0135] In this embodiment, in step S41, by controlling the manipulator device 320 to vibrate either the circuit board 30 or the diverter body 10 according to preset vibration parameters, the manipulator device 320 can give the circuit board 30 or the diverter body 10 a preset amplitude and a preset vibration time, so that the effect of automated vibration can be achieved, and the preparation efficiency and preparation effect can be improved. In addition, in some exemplary embodiments, the manipulator device 320 can realize the three functions of clamping the circuit board 30, pressing and vibrating. For example, the manipulator device 320 clamps the circuit board 30 and places it on the surface of the copper bus 11 of the diverter body 10, and then controls the manipulator device 320 to press and vibrate the circuit board 30 to eliminate the bubbles between the copper bus 11 of the diverter body 10 and the circuit board 30. In this way, the number of devices can be further reduced, saving the device layout space of the workshop, so that it can be more adaptable to a variety of workshop environments. It should be pointed out that the preset amplitude and preset vibration time of the manipulator device 320 are not specifically limited in this application and can be adjusted according to the actual required bubble elimination effect and the actual preparation process of the workshop. For example, the preset amplitude and the preset vibration time can ensure good bubble elimination while avoiding the preset amplitude being too large and the preset vibration time being too long, thereby ensuring the preparation efficiency of the workshop while avoiding the splashing of welding materials between the diverter body 10 and the circuit board 30 during the vibration process.

[0136] The present invention provides a diverter processing device, which includes a memory, a processor, and a diverter preparation program stored in the memory and executable on the processor. When the diverter preparation program is executed by the processor, the various steps of the diverter preparation method described in the above embodiment are implemented.

[0137] Please refer to Figure 1 and Figure 8 The present application further proposes a diverter processing device 300, which can be used to implement the diverter preparation method in any of the above embodiments. The diverter processing device 300 includes:

[0138] A first fixing assembly, the first fixing assembly being provided with one of the diverter body 10 and the circuit board 30; and

[0139] The second fixing component is provided with the other of the diverter body 10 and the circuit board 30 . The first fixing component and the second fixing component move relative to each other so that the circuit board 30 and the diverter body 10 are close to and abut against each other.

[0140] In this embodiment, the relative movement between the first fixing component and the second fixing component can be that the first fixing component is fixed and the second fixing component is movable, for example, the first fixing component is a workbench 310 and the second fixing component is a pressing device; or the second fixing component is fixed and the first fixing component is movable, for example, the second fixing component is a workbench 310 and the first fixing component is a pressing device; or both the first fixing component and the second fixing component are movable, for example, both the first fixing component and the second fixing component are pressing devices, which are not specifically limited here. In this way, by bringing the circuit board 30 and the copper busbar 11 of the shunt body 10 close to each other, bubbles between the two can be eliminated and the bubble rate between the two can be reduced, thereby improving the current detection accuracy of the shunt 100.

[0141] Optionally, the first fixing component is a workbench 310, and the workbench 310 is provided with a processing station for placing one of the copper busbar 11 or the circuit board 30;

[0142] The second fixing component is a pressing device, which can be movably arranged above the processing station and is used to press the other of the diverter body 10 or the circuit board 30 to make the circuit board 30 and the diverter body 10 close to and abut against each other.

[0143] In this embodiment, a processing station is provided on the workbench 310. When one of the copper busbar 11 or the circuit board 30 is placed on the processing station and the copper busbar 11 and the circuit board 30 are pre-assembled, a processing environment is provided within the shunt processing equipment 300. Thus, while the circuit board 30 and the copper busbar 11 of the shunt body 10 are being welded, the pressing device can press the other of the copper busbar 11 or the circuit board 30 to bring the circuit board 30 close to and squeeze the copper busbar 11. In this way, the pressing device can press the other of the copper busbar 11 or the circuit board 30 so that the circuit board 30 and the shunt body 10 are close to and squeezed against each other, thereby eliminating bubbles between the two and reducing the bubble rate between the two, thereby improving the current detection accuracy of the shunt 100.

[0144] The shunt processing equipment 300 also includes a welding device (not shown in the figure), which is located above the processing station to weld the circuit board 30 to the copper busbar 11 of the shunt body 10. It is explained here that the pressing device can be a robot device 320 or a weight device. The robot device 320 presses against the other of the shunt body 10 or the circuit board 30, or the weight device presses against the other of the shunt body 10 or the circuit board 30, both of which can bring the circuit board 30 and the shunt body 10 into close contact and contact with each other, and are not specifically limited here.

[0145] Reference Figure 8In one embodiment of the present invention, the pressing device is a robotic arm device 320.

[0146] In this embodiment, it is understood that when the pressing device is a robot device 320, it can automatically abut the copper busbar 11 of the shunt body 10 or the circuit board 30, thereby improving the automation level of the shunt processing equipment 300 and improving the production efficiency of the workshop. Specifically, the robot device 320 can be a multi-axis robot to achieve the functions of flexible movement and abutment.

[0147] Reference Figure 8 In one embodiment of the present invention, the robot device 320 is movably disposed above the processing station, and the robot device 320 is used to press and vibrate the other of the diverter body 10 or the circuit board 30.

[0148] In this embodiment, it can be understood that the robot device 320 can simultaneously realize the functions of pressing and vibrating the copper bus 11 of the diverter body 10 or the circuit board 30, so that the two functions of pressing and vibrating can be realized through the robot device 320. In this way, the number of devices in the diverter processing equipment 300 can be further reduced, saving the workshop's layout space for the diverter processing equipment 300, so that it can be more adaptable to a variety of workshop environments.

[0149] Reference Figure 8 In one embodiment of the present invention, the diverter processing equipment 300 further includes an identification device 330 , which is disposed on the second fixing component and is used to identify the surface of the circuit board 30 facing the diverter body 10 to obtain surface information of the circuit board 30 .

[0150] In this embodiment, the identification device 330 may be a CCD (Charge Coupled Device) device or a CMOS (Complementary Metal-Oxide-Semiconductor) device. When the identification device 330 is a CCD device, it can quickly and accurately identify surface information of the circuit board 30. Furthermore, the surface information may include pad information and / or component location information, and is not specifically limited herein.

[0151] In some exemplary embodiments, the identification device 330 may be installed on the robot device 320 , thereby improving the accuracy of the robot device 320 when performing operations such as gripping, pressing, or vibrating.

[0152] Reference Figure 8 In one embodiment of the present invention, the workbench 310 is a heating platform, which includes a platform body, a heating device, and a control device;

[0153] The heating device and the control device are arranged inside the table body, the processing station is arranged on the surface of the table body, and the control device is connected to the heating device so that the heating device heats one of the diverter body 10 or the circuit board 30 on the processing station.

[0154] In this embodiment, the heating platform may also include a detection device (not shown). After the detection device detects the temperature of the platform's surface, the control device adjusts the heating device's temperature based on the detected temperature value, thereby causing the platform's surface temperature to change. This allows the heating device to heat either the diverter body 10 or the circuit board 30 at the processing station in a constant temperature environment, achieving automated regulation while improving welding effectiveness and efficiency.

[0155] Reference Figure 8 In one embodiment of the present invention, the diverter processing equipment 300 further includes a carrier 340, which is placed on the processing station and is used to carry one of the diverter body 10 or the circuit board 30. The material of the carrier 340 is a thermally conductive material.

[0156] In this embodiment, the carrier 340 ensures that either the copper busbar 11 of the diverter body 10 or the circuit board 30 is supported and secured. This ensures that when the manipulator 320 presses against the other of the diverter body 10 or the circuit board 30, the copper busbar 11 is relatively secured to the circuit board 30, ensuring a sufficient pressing effect. Furthermore, the carrier 340 can be made of a thermally conductive material, such as metal or silicone, without specific limitation.

[0157] Reference Figure 8 In one embodiment of the present invention, the diverter processing equipment 300 also includes a vacuum cover (not shown in the figure), which is movably arranged above the processing station and is used to cover the diverter body 10, the circuit board 30 and the pressing device, so that the diverter body 10 and the circuit board 30 can be welded in a vacuum environment.

[0158] In this embodiment, when the copper busbar 11 of the diverter body 10 and the circuit board 30 are ready to be welded, the vacuum cover can cover the copper busbar 11, the circuit board 30 and the pressing device, so that the copper busbar 11 of the diverter body 10 and the circuit board 30 are welded in a vacuum environment, and when welding under this environment, the bubbles between the copper busbar 11 and the circuit board 30 will burst due to the vacuum environment, thereby eliminating some of the bubbles between the copper busbar 11 and the circuit board 30, thereby improving the detection accuracy of the current by the diverter 100.

[0159] In addition, the present invention also proposes an industrial production line (not shown in the figure), which includes the diverter processing equipment 300 as described above.

[0160] It should be noted that the detailed structure of the diverter processing equipment 300 can refer to the embodiment of the above-mentioned diverter processing equipment 300, which will not be repeated here; since the above-mentioned diverter processing equipment 300 is used in the industrial assembly line of the present invention, the embodiment of the diverter processing equipment 300 of the present invention includes all technical solutions of all embodiments of the above-mentioned diverter processing equipment 300, and the technical effects achieved are also exactly the same, which will not be repeated here.

[0161] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for preparing a diverter, characterized in that: Applied to a diverter processing device, the diverter includes a diverter body and a circuit board, the diverter processing device is provided with an identification device, and the preparation method of the diverter includes the following steps: Placing the diverter body and the circuit board in a processing environment, wherein the processing environment is a vacuum and constant temperature environment; Controlling the identification device to obtain surface information of the circuit board facing the diverter body, wherein the surface information includes identification information and / or position setting information of components; Determine at least one pressing point according to the surface information, where there is no identification information or components at a position corresponding to the pressing point; determining a priority of the at least one pressure point according to an information type of the surface information; Determining a pressing area according to the pressing point with the highest priority; While welding the surfaces of the circuit board and the diverter body facing each other, the pressing area of ​​the circuit board is pressed to make it approach and squeeze the diverter body.

2. The method for preparing a flow divider according to claim 1, wherein: The diverter processing equipment is provided with a pressing device, and the steps of welding the surfaces of the diverter body and the circuit board facing each other while pressing the pressing area of ​​the circuit board to make it close to and squeeze the diverter body include: Determining a pressing and moving sequence of the diverter body and the circuit board; While welding the surfaces of the diverter body and the circuit board facing each other, the pressing device is controlled to press the pressing area of ​​the circuit board according to the pressing movement sequence to make it close to and squeeze the diverter body.

3. The method for preparing a flow divider according to claim 1, wherein: The step of pressing the pressing area of ​​the circuit board to make it close to and squeeze the diverter body while welding the surfaces of the diverter body facing the circuit board includes: determining a preset pressing force and a preset pressing time according to the position information of the pressing area; While welding the surfaces of the diverter body and the circuit board facing each other, the pressing area of ​​the circuit board is pressed according to a preset pressing force and a preset pressing time to make it approach and squeeze the diverter body.

4. The method for preparing a flow divider according to claim 1, wherein: Before the step of pressing the pressing area of ​​the circuit board while welding the surfaces of the circuit board facing the diverter body, the method further includes: Acquiring position information of the pressing area on the circuit board; The step of pressing the pressing area of ​​the circuit board while welding the surfaces of the circuit board facing the diverter body includes: If the position information of the pressing area is a preset position of the circuit board, determining a pressing force variation curve corresponding to the pressing area, wherein the pressing force decreases as the pressing time increases after a preset time point in the pressing force variation curve; determining the pressing force and the corresponding pressing time according to the pressing force variation curve; While welding the surfaces of the circuit board and the diverter body facing each other, the pressing area of ​​the circuit board is pressed according to the pressing force and the pressing time.

5. The method for preparing a flow divider according to claim 1, wherein: The diverter processing equipment is provided with a pressing device, and the pressing device is provided with pressing pieces of different sizes. The step of pressing the pressing area of ​​the circuit board while welding the surfaces of the circuit board and the diverter body facing each other includes: determining a target pressing member matching the pressing area according to the area size of the pressing area; While welding the surfaces of the circuit board and the diverter body facing each other, the target pressing member is controlled to press the pressing area of ​​the circuit board.

6. The method for preparing a flow divider according to claim 5, wherein: The step of controlling the target pressing member to press the pressing area of ​​the circuit board while welding the surfaces of the circuit board and the diverter body facing each other includes: determining the pressing force of the target pressing member according to the area size of the pressing area; While welding the surfaces of the diverter body facing the circuit board, the target pressing member is controlled to press the pressing area of ​​the circuit board according to the pressing force.

7. The method for preparing a flow divider according to claim 1, wherein: After the step of pressing the pressing area of ​​the circuit board to make it close to and squeeze the diverter body while welding the surfaces of the circuit board facing the diverter body, the method further includes: Acquire welding information and write the welding information into a QR code corresponding to the diverter, wherein the welding information includes at least one of welding time, welding temperature, and pressing area; Obtaining a welding test result of the diverter; If the yield of the shunt fabrication determined according to the welding detection result is less than a preset threshold, an adjustment working parameter of the shunt processing equipment is determined according to the welding detection result and the welding information.

8. The method for preparing a flow divider according to any one of claims 1 to 7, characterized in that: After the step of pressing the pressing area of ​​the circuit board while welding the surfaces of the circuit board facing the diverter body, the method further includes: Vibrate either the circuit board or the diverter body according to preset vibration parameters.

9. A diverter processing equipment, characterized in that, The diverter processing equipment includes a memory, a processor, and a diverter preparation program stored in the memory and executable on the processor. When the diverter preparation program is executed by the processor, the various steps of the diverter preparation method as described in any one of claims 1 to 8 are implemented.

Images