A semiconductor package die bonding system and method

Abstract

This invention discloses a semiconductor packaging die bonding system and method, including a control system. The output of the control system is connected to a feeding mechanism and a conveying mechanism. The output of the feeding mechanism is connected to the die bonding system, which is sequentially connected to the outside of the conveying mechanism. A receiving box is connected to the output of the die bonding system. This semiconductor packaging die bonding system and method utilizes a bonding head composed of multiple linear motors and voice coil motors, achieving high speed, high precision, and advantages such as force control protection during pickup and release, and high-temperature protection. Eight different temperature zones are set in the conveyor track, allowing for separate feeding of process products according to different temperatures, preventing material damage due to temperature differences. The dispensing mechanism, die bonding mechanism, soldering mechanism, and chip mounting mechanism are linked and coordinated, enabling all semiconductor packaging die bonding operating devices to operate together on the conveying mechanism, forming an assembly line and improving work efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a semiconductor packaging die bonding system and method. Background Technology

[0002] Die bonding, also known as die bonding or die attaching, is a process in which a chip is bonded to a designated area of ​​a support using an adhesive (usually conductive or insulating adhesive for LEDs) to create a thermal or electrical path, thus providing the conditions for subsequent wire bonding.

[0003] For example, patent CN101567324B discloses a method for processing silicon-based wafers. The silicon-based wafer has a first surface and a second surface, and a glass carrier is disposed on the second surface of the silicon-based wafer using an ultraviolet-irradiated adhesive tape. The method for processing the silicon-based wafer includes at least: holding the silicon-based wafer with a vacuum holder, wherein the vacuum holder acts on the first surface of the silicon-based wafer; irradiating the ultraviolet-irradiated adhesive tape with an ultraviolet beam through the glass carrier to release the ultraviolet-irradiated adhesive tape and thereby remove the glass carrier from the silicon-based wafer; flipping the silicon-based wafer; placing the silicon-based wafer on a vacuum substrate; securing the silicon-based wafer to the vacuum substrate using the vacuum effect acting on the vacuum substrate; and removing the vacuum holder from the silicon-based wafer. This invention also provides a method for packaging semiconductor devices and a system for processing silicon-based wafers. Thereby, a vacuum substrate is used to provide the necessary rigidity for the silicon-based wafer after the glass carrier is removed, thereby reducing damage to the interposer layer penetrating the silicon interposer window.

[0004] In practice, most semiconductor die bonding devices are connected as separate machines, making it impossible to run them on the same machine in a production line. Furthermore, it is impossible to distinguish between thermally processed and non-thermally processed products, resulting in higher costs.

[0005] It is evident that the aforementioned problems with existing technologies urgently need to be addressed. Summary of the Invention

[0006] In view of the above-mentioned problems in the prior art, one aspect of the present invention is to provide a semiconductor packaging die bonding system and method to solve the problems that most semiconductor die bonding devices cannot be operated on the same machine in a production line, cannot distinguish between thermal process products and non-thermal process products, and have high costs.

[0007] To achieve the above objectives, the present invention provides a semiconductor packaging die bonding system and method, including a control system, the output end of which is connected to a feeding mechanism and a conveying mechanism, the output end of which is connected to the die bonding system, the die bonding system being sequentially connected to the outside of the conveying mechanism, and the output end of the die bonding system being connected to a receiving box.

[0008] The method of the semiconductor packaging die bond system is as follows:

[0009] Step S1. The material is clamped to the front end of the conveying mechanism by the feeding mechanism;

[0010] Step S2. Push the material to the dispensing mechanism for visual inspection;

[0011] Step S3. Divide the materials into thermal process products and non-thermal process products. Non-thermal process products are fed by clamping through a combination of linear motor and voice coil motor, so that the bracket completes the dotting adhesive process in a stepping manner.

[0012] Step S4. Send the product to the hot track, set a certain temperature according to the product, and feed the solder wire by a specific transmission mechanism to perform soldering / drawing / pressing according to the product.

[0013] Step S5. Both thermally processed and non-thermally processed products are fed to the die bonding mechanism via a clamp linear motor. The chip is then rotated to a designated position using vision and a specific algorithm, and the chip is independently lifted and separated.

[0014] Step S6. Then, the wafer is picked up from the blue film by vacuum through the bonding head and placed on the substrate island of the required die bonding. The vision system will inspect each product after bonding.

[0015] Step S7. After the test is completed, perform the solder application / drawing / pressing process again;

[0016] Step S8. After the soldering work is completed, the material is fed to the next placement station through the conveyor mechanism. The placement is carried out by a double feeder. The mounting head picks up the product through vacuum and places it on the product that has been soldered / applied. The process from feeder loading to placement is completed by stepping.

[0017] Step S9. Finally, the completed product is pushed into the material box by the conveyor mechanism, and the receiving device completes the receiving.

[0018] Preferably, the die bonding system specifically includes a dispensing mechanism, a soldering mechanism, a die bonding mechanism, a soldering mechanism, and a chip mounting mechanism.

[0019] Preferably, the output ends of the dispensing mechanism and the soldering mechanism are connected to the die bonding mechanism, the output end of the thermal process product is connected to the soldering mechanism, and the output end of the non-thermal process product is connected to the dispensing mechanism.

[0020] Preferably, the feeding mechanism specifically includes a feeding robot, which is specifically composed of a stepper motor controlling a lead screw assembly.

[0021] Preferably, the end of the loading robot is provided with a number of lifting heads, each of which is composed of multiple linear motors and voice coil motors. The lifting heads are assembled to drive the workpiece to maintain vacuum suction.

[0022] The assembly head, composed of multiple linear motors and voice coil motors, achieves high speed and precision, and features advantages such as force control protection for picking up and releasing materials and high-temperature protection. It adsorbs materials and prevents them from being damaged during the transfer process.

[0023] Preferably, the conveying mechanism specifically includes a conveying track, which is configured with eight different temperature zones.

[0024] With eight different temperature zones set on the transmission track, hot-process products and non-hot-process products can be fed separately according to different temperatures, so as to carry out subsequent work and avoid damage to materials due to temperature differences.

[0025] Preferably, the die bonding mechanism specifically includes a wafer stage, which is assembled to hold wafers of 12 inches or smaller.

[0026] Beneficial effects:

[0027] Compared with the prior art, the semiconductor packaging die bonding system and method provided by the present invention have the following beneficial effects:

[0028] 1. The assembly head is composed of multiple linear motors and voice coil motors, which can achieve high movement speed and high precision. It also has advantages such as force control protection for picking up and releasing and high temperature protection. It can adsorb materials and prevent them from being damaged during the transfer process.

[0029] 2. The eight different temperature zones set on the transmission track can drive hot-process products and non-hot-process products to be fed separately according to different temperatures, so as to carry out subsequent work and avoid damage to materials due to temperature differences.

[0030] 3. By linking and cooperating the dispensing mechanism, die bonding mechanism, soldering mechanism and chip mounting mechanism, the various operating devices for semiconductor packaging die bonding are connected and run together on the conveying mechanism to form an assembly line and improve work efficiency. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0032] Figure 1This is a schematic diagram of the semiconductor packaging die bonding system provided in an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the semiconductor packaging die bonding method provided in an embodiment of the present invention. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0035] like Figure 1-2 As shown, a semiconductor packaging die bonding system and method includes a control system. The output of the control system is connected to a feeding mechanism and a conveying mechanism. The output of the feeding mechanism is connected to the die bonding system. The die bonding system is sequentially connected to the outside of the conveying mechanism. The output of the die bonding system is connected to a receiving box.

[0036] The method for semiconductor packaging die bonding system is as follows:

[0037] Step S1. The material is clamped to the front end of the conveying mechanism by the feeding mechanism;

[0038] Step S2. Push the material to the dispensing mechanism for visual inspection;

[0039] Step S3. Divide the materials into thermal process products and non-thermal process products. Non-thermal process products are fed by clamping through a combination of linear motor and voice coil motor, so that the bracket completes the dotting adhesive process in a stepping manner.

[0040] Step S4. Send the product to the hot track, set a certain temperature according to the product, and feed the solder wire by a specific transmission mechanism to perform soldering / drawing / pressing according to the product.

[0041] Step S5. Both thermally processed and non-thermally processed products are fed to the die bonding mechanism via a clamp linear motor. The chip is then rotated to a designated position using vision and a specific algorithm, and the chip is independently lifted and separated.

[0042] Step S6. Then, the wafer is picked up from the blue film by vacuum through the bonding head and placed on the substrate island of the required die bonding. The vision system will inspect each product after bonding.

[0043] Step S7. After the test is completed, perform the solder application / drawing / pressing process again;

[0044] Step S8. After the soldering work is completed, the material is fed to the next placement station through the conveyor mechanism. The placement is carried out by a double feeder. The mounting head picks up the product through vacuum and places it on the product that has been soldered / applied. The process from feeder loading to placement is completed by stepping.

[0045] Step S9. Finally, the completed product is pushed into the material box by the conveyor mechanism, and the receiving device completes the receiving.

[0046] The main purpose of this semiconductor packaging die bonding system and method is to use a bonding head composed of multiple linear motors and voice coil motors to achieve high speed, high precision, and advantages such as force control protection for pickup and release and high-temperature protection. This allows for the adsorption of materials and prevents damage during the transfer process. Furthermore, eight different temperature zones are set on the transport track, which can drive hot-process products and non-hot-process products to be fed separately according to different temperatures, thereby avoiding damage to materials due to temperature differences. The dispensing mechanism, die bonding mechanism, soldering mechanism, and chip mounting mechanism are linked together to connect the various semiconductor packaging die bonding operating devices, allowing them to operate together on the transport mechanism to form an assembly line and improve work efficiency.

[0047] In one specific embodiment, the die bonding system includes a dispensing mechanism, a soldering mechanism, a die bonding mechanism, a soldering mechanism, and a chip mounting mechanism, which can operate synchronously on the conveyor mechanism to form an assembly line and improve work efficiency.

[0048] Furthermore, the outputs of both the dispensing mechanism and the soldering mechanism are connected to the die bonding mechanism. Thermal process products are soldered through the soldering mechanism before being conveyed to the die bonding mechanism, while non-thermal process products need to be dispensed through the dispensing mechanism before being conveyed to the die bonding mechanism.

[0049] Furthermore, the feeding mechanism specifically includes a feeding robot, which is composed of a stepper motor-controlled lead screw assembly. The robot picks up the material sheet and places it at the front end of the transmission track through vacuum suction. The pushing device then pushes the material sheet to the dispensing workstation for visual inspection.

[0050] Furthermore, the end of the loading robot is equipped with a number of lifting heads, which are composed of multiple linear motors and voice coil motors, achieving high speed, high precision, force control protection devices for picking and releasing, and high temperature protection, which can drive the workpiece to be vacuum-adsorbed.

[0051] Furthermore, the conveying mechanism specifically includes a conveying track, which is set with eight different temperature zones. A certain temperature is set according to the product. The material is fed by a lever and a stepping mechanism. The solder wire is fed by a specific conveying mechanism. The soldering is done by dotting / drawing / pressing according to the hot process products and the non-hot process products. The soldering operation is completed by a linear motor in a stepping manner.

[0052] Furthermore, the die bonding mechanism specifically includes a wafer stage, which can hold wafers of 12 inches and smaller. The wafer stage is rotated to a designated position by vision and a specific algorithm. The wafer separator is controlled by a voice coil to independently lift and separate the chips. Then, the wafer is picked up from the blue film by a vacuum through the bonding head and placed on the substrate island of the required die bonding. The vision system will inspect each product after bonding. After the inspection is completed, the conveyor mechanism controlled by the linear motor will send the product to the soldering station.

[0053] Working principle: First, the material is clamped to the front end of the conveying mechanism by the feeding mechanism, and then pushed to the dispensing mechanism for visual inspection;

[0054] The materials are then divided into thermal process products and non-thermal process products. Non-thermal process products are directly clamped and fed by a combination of linear motor and voice coil motor to complete the dotting / painting process in sequence.

[0055] Hot-process products do not need to go through the above dispensing process. They are directly sent to the hot track, which is set with eight temperature zones according to different product settings. Then, the solder wire is fed by a specific transmission mechanism to perform soldering / drawing / pressing on the product.

[0056] Both thermally processed and non-thermally processed products are fed to the die bonding mechanism via a clamp linear motor, and then rotated to the designated position using vision and a specific algorithm to independently lift and separate the chip.

[0057] Afterwards, the bonding head uses a vacuum to pick up the wafer from the blue film and place it on the substrate island where the wafer needs to be bonded. The vision system will inspect each bonded product. After the inspection is completed, the conveyor mechanism controlled by the linear motor will send the product to the soldering station.

[0058] Vision performs dot / tin application inspection, and a linear motor clamping mechanism moves the product to each dot / tin application station in a stepping motion.

[0059] Finally, after the soldering / plating is completed, the linear motor clamping mechanism feeds the material to the next placement station. The placement is carried out by a double feeder, and the mounting head picks up the product through vacuum and places it on the product that has been soldered / plated. The feeding and placement are completed by stepping the feeder. Then, the linear motor pusher pushes the finished product into the material box, and the material collection device completes the material collection.

[0060] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A semiconductor packaging die bonding method, characterized in that, The system includes a control system, the output of which is connected to a feeding mechanism and a conveying mechanism. The output of the feeding mechanism is connected to a die-bonding system. The die-bonding system is sequentially connected to the outside of the conveying mechanism. The output of the die-bonding system is connected to a receiving box. The semiconductor packaging die bonding method is as follows: Step S1. The material is clamped to the front end of the conveying mechanism by the feeding mechanism; Step S2. Push the material to the dispensing mechanism for visual inspection; Step S3. Divide the materials into thermal process products and non-thermal process products. Non-thermal process products are fed by clamping through a combination of linear motor and voice coil motor, so that the bracket completes the dotting adhesive process in a stepping manner. Step S4. Send the hot-process product to the hot track, set a certain temperature according to the hot-process product, and feed the solder wire by a specific transmission mechanism to perform soldering / drawing / pressing according to the hot-process product. Step S5. Both thermally processed and non-thermally processed products are fed to the die bonding mechanism via a clamp linear motor. The chip is then rotated to a designated position using vision and a specific algorithm, and the chip is independently lifted and separated. Step S6. Then, the wafer is picked up from the blue film by vacuum through the bonding head and placed on the substrate island where the wafer needs to be bonded. The vision system will inspect each thermally processed product and non-thermally processed product after bonding. Step S7. After the inspection is completed, perform soldering / plating / pressing work again on the solidified thermal process products and non-thermal process products; Step S8. After the soldering work is completed, the material is fed to the next placement station through the conveyor mechanism. The placement is carried out by a double feeder. The mounting head picks up the product through vacuum and places it on the hot process product and the non-hot process product that has been soldered / applied. The process from feeder loading to placement is completed by stepping. Step S9. Finally, the completed thermal process products and non-thermal process products are pushed into the material box by the conveying mechanism, and the material receiving device completes the material receiving. The die bonding system specifically includes a dispensing mechanism, a soldering mechanism, a die bonding mechanism, a soldering mechanism, and a chip mounting mechanism; The output ends of the dispensing mechanism and the soldering mechanism are connected to the die bonding mechanism, the output end of the thermal process product is connected to the soldering mechanism, and the output end of the non-thermal process product is connected to the dispensing mechanism.

2. The semiconductor packaging die bonding method according to claim 1, characterized in that, The feeding mechanism specifically includes a feeding robot, which is composed of a stepper motor controlling a lead screw assembly.

3. The semiconductor packaging die bonding method according to claim 2, characterized in that, The end of the loading robot is equipped with a number of lifting heads, each of which is composed of multiple linear motors and voice coil motors. The lifting heads are assembled to drive the workpiece to maintain vacuum suction.

4. The semiconductor packaging die bonding method according to claim 3, characterized in that, The conveying mechanism specifically includes a conveying track, which is set with eight different temperature zones.

5. A semiconductor packaging die bonding method according to claim 4, characterized in that, The die bonding mechanism specifically includes a wafer stage, which is assembled to hold wafers of 12 inches and smaller.

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