Single crystal nut heat sink assembly lock screw device

Abstract

The application discloses a single crystal nut heat sink fin assembling screw locking device, which comprises a bearing table, a nut placing module, a reverse surface crystal placing module, a heat sink paste printing module, a heat sink placing module and a locking module. A jig is installed on the bearing table. A limiting part for placing nuts is arranged on the jig. A transportation assembly is arranged on each module. The bearing table is placed on one of the transportation assemblies. Each module is sequentially spliced so that the bearing table moves between the modules under the driving of the transportation assemblies. The technical scheme simplifies the production and processing technology of the transistor and improves the processing efficiency of the transistor.

Description

Technical Field

[0001] This invention relates to the field of electronic component processing equipment technology, and in particular to a screw-locking device for assembling a single crystal heat sink with a nut. Background Technology

[0002] A transistor is a solid-state semiconductor device with multiple functions, including detection, rectification, amplification, switching, voltage regulation, and signal modulation. As a variable current switch, a transistor can control the output current based on the input voltage. It generates heat during operation, therefore a heat sink is needed to enhance its heat dissipation.

[0003] The existing method of installing heat sinks on transistors involves numerous steps and has low installation efficiency, which cannot meet the needs of current mass production. Summary of the Invention

[0004] The main objective of this invention is to provide a screw-locking device for assembling a single crystal with a nut and heat sink, which aims to simplify the manufacturing process and improve the processing efficiency of transistors.

[0005] To achieve the above objectives, the present invention proposes a screw-locking device for assembling a single crystal heat sink with a nut, comprising:

[0006] A support platform, on which a fixture is mounted, and the fixture is provided with a limiting part;

[0007] The nut placement module includes pneumatic fingers for gripping and placing a nut onto the limiting portion;

[0008] A reverse crystal module is placed for placing transistors on the nut;

[0009] A thermal paste printing module includes a thermal paste storage component, a transfer component, and a printing head mounted on the transfer component. The transfer component drives the printing head to move to print thermal paste from the thermal paste storage component onto the transistor.

[0010] A heat sink module for placing a heat sink on the transistor; and

[0011] The fastening module includes a feeding mechanism and an electric screwdriver. The feeding mechanism is connected to the electric screwdriver and is used to supply screws to the electric screwdriver. The electric screwdriver is used to fasten the transistor to the heat sink by the cooperation of the screws and the nut.

[0012] Each of the nut placement module, the reverse crystal placement module, the thermal paste application module, the heat sink placement module, and the locking module is equipped with a transport component. The support platform is placed on one of the transport components, and the modules are sequentially spliced ​​together so that the support platform moves between the modules under the drive of the transport component.

[0013] Optionally, it also includes a material handling module, which is equipped with the transport component and is connected downstream of the locking module to package the processed transistors.

[0014] Optionally, the transport component includes an upper transport component and a lower transport component installed below the upper transport component. The upper transport component is used to drive the carrier platform to move between modules to complete the functions of the corresponding modules, and the lower transport component is used to drive the carrier platform to move to complete the reuse of the carrier platform.

[0015] It also includes a front lifting module located at the head end of the single crystal nut-heat sink assembly screw-locking device and a rear lifting module located at the tail end of the single crystal nut-heat sink assembly screw-locking device. The front lifting module is used to transport the carrier platform located in the lower transport component to the upper transport component, and the rear lifting module is used to transport the carrier platform located in the upper transport component to the lower transport component so that the carrier platform can be reused.

[0016] Optionally, the limiting part is a limiting groove.

[0017] Optionally, the reverse crystal module includes a transistor storage mechanism, which further includes a belt pushing mechanism, a storage rack, and multiple storage tubes stacked on the storage rack. The storage tubes store multiple transistors, and the pushing mechanism pushes the transistors in the storage tubes to move towards the next station.

[0018] Optionally, the transistor storage mechanism further includes a vibration cylinder mounted on the storage rack to vibrate the storage tube being pushed.

[0019] Optionally, the thermal paste printing module further includes a lifting assembly installed below its transport assembly. The lifting assembly includes a lifting frame and a lifting cylinder mounted on the lifting frame. When the carrier platform is transported to the thermal paste printing location, the lifting cylinder drives its piston rod to lift the carrier platform to a position detached from the transport assembly.

[0020] Optionally, the lifting frame includes a first lifting frame and a second lifting frame. The lifting cylinder is installed on the first lifting frame, and the piston rod end of the lifting cylinder is installed on the second lifting frame. The second lifting frame is provided with at least one limiting post on the side facing the support platform, and the support platform is provided with at least one limiting hole on the side facing the second lifting frame. The lifting cylinder drives the second lifting frame to lift so that one of the limiting posts is limited within one of the limiting holes.

[0021] Optionally, the heat sink module is equipped with a detector for detecting the heat sink; and / or the heat sink module is equipped with a safety light curtain for safety protection.

[0022] Optionally, the feeding mechanism is provided with a receiving cavity for accommodating the insulating particles and the screw. The insulating particles are sleeved on the outer wall of the screw so that when the electric screwdriver locks the screw to the heat sink, the insulating particles are sandwiched between the screw and the transistor.

[0023] The technical solution of this invention uses pneumatic fingers to place a nut within the limiting part of a fixture, then places a transistor on the nut. Further, a thermal paste printing module applies thermal paste to the transistor, and then a heat sink is placed on the transistor, with the thermal paste sandwiched between the transistor and the heat sink. Finally, a locking module uses an electric screwdriver to pass a screw through the heat sink and transistor and lock it in place with the nut, thus achieving a locking connection between the heat sink and the transistor. Each production module is equipped with a transport component. When the modules are assembled, their transport components are also assembled together, allowing the carrier platform to move between the modules. This simplifies the transistor manufacturing process and allows the modules to cooperate with each other through the transport components, thereby improving the transistor processing efficiency. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the nut-laying module in one embodiment of the single-crystal heat sink assembly screw-locking device of the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the reverse-side crystal module in one embodiment of the single-crystal heat sink assembly screw locking device of the present invention;

[0027] Figure 3 This is a schematic diagram of the transistor storage mechanism in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0028] Figure 4 This is a schematic diagram of the chamfered drive assembly structure in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0029] Figure 5This is a schematic diagram of the crystal handling mechanism in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0030] Figure 6 This is a schematic diagram of the thermal paste printing module in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0031] Figure 7 This is a schematic diagram of the thermal paste storage component in one embodiment of the single-crystal heat sink assembly screw locking device of the present invention;

[0032] Figure 8 This is a schematic diagram of the lifting component in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0033] Figure 9 This is a schematic diagram of the structure of the heat sink module in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0034] Figure 10 This is a schematic diagram of the locking module in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0035] Figure 11 This is a schematic diagram of the material handling module in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0036] Figure 12 This is a schematic diagram of the front lifting module in one embodiment of the single crystal heat sink assembly screw locking device of the present invention;

[0037] Figure 13 This is a schematic diagram of the rear lifting module in one embodiment of the single crystal heat sink assembly screw locking device of the present invention.

[0038] Explanation of icon numbers:

[0039]

[0040] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0042] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0043] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the term "and / or" throughout the text includes three solutions; taking A and / or B as an example, it includes technical solution A, technical solution B, and a technical solution that simultaneously satisfies A and B. Furthermore, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0044] Reference Figures 1 to 11 This invention proposes a screw-locking device for assembling a single-crystal heat sink with a nut, comprising:

[0045] A support platform 10, on which a fixture 11 is mounted, and a limiting part is provided on the fixture 11;

[0046] Nut placement module 20 includes a pneumatic finger 21 for clamping and placing a nut toward the limiting portion;

[0047] A reverse crystal module 30 is placed for placing transistor 12 onto the nut;

[0048] The thermal paste printing module 40 includes a thermal paste storage component 41, a transfer component 42, and a printing head mounted on the transfer component 42. The transfer component 42 drives the printing head to move so as to print the thermal paste in the thermal paste storage component 41 onto the transistor 12.

[0049] Heat sink module 50, used for placing heat sink 13 on transistor 12; and

[0050] The fastening module 60 includes a feeding mechanism 61 and an electric screwdriver 62. The feeding mechanism 61 is connected to the electric screwdriver 62 and is used to supply screws to the electric screwdriver 62. The electric screwdriver 62 is used to fasten the transistor 12 to the heat sink 13 by the cooperation of the screw and the nut.

[0051] Each of the nut placement module 20, the reverse crystal placement module 30, the thermal paste application module 40, the heat sink placement module 50, and the locking module 60 is equipped with a transport component. The support platform 10 is placed on one of the transport components, and the modules are sequentially spliced ​​together so that the support platform 10 moves between the modules under the drive of the transport component.

[0052] The technical solution of this invention uses a pneumatic finger 21 to place a nut within the limiting part of a fixture 11, then places a transistor 12 on the nut. Further, a thermal paste printing module 40 prints thermal paste onto the transistor 12, and then a heat sink 13 is placed on the transistor 12, with the thermal paste sandwiched between the transistor 12 and the heat sink 13. Finally, a locking module 60 uses an electric screwdriver 62 to pass a screw through the heat sink 13 and the transistor 12 and lock it with the nut, thus achieving a locking connection between the heat sink 13 and the transistor 12. Each production module is equipped with a transport component. When the modules are assembled, their transport components are also assembled together, allowing the support platform 10 to move between the modules. This simplifies the manufacturing process of the transistor 12, enabling the modules to cooperate with each other through the transport components, thereby improving the processing efficiency of the transistor 12.

[0053] In this embodiment, the transport component includes an upper transport component 81 and a lower transport component 82 installed below the upper transport component 81. The upper transport component 81 drives the carrier platform 10 to move between modules to complete the functions of the corresponding modules. The lower transport component 82 drives the carrier platform 10 to move to complete the reuse of the carrier platform 10. After the carrier platform 10 flows through the upper transport component 81 to each module to complete the functions of the corresponding modules, the carrier platform 10 is then transported to the lower transport component 82. This allows the carrier platform 10 to move back and forth between the upper transport component 81 and the lower transport component 82, thereby improving the utilization rate of the carrier platform 10, reducing manual operation, and improving production efficiency.

[0054] Reference Figure 12 and Figure 13Furthermore, the single-crystal heat sink assembly and screw-locking device also includes a front lifting module 91 located at the beginning of the single-crystal heat sink assembly and screw-locking device and a rear lifting module 92 located at the end of the single-crystal heat sink assembly and screw-locking device. The front lifting module 91 is used to transport the support platform 10 located on the lower transport component 82 to the upper transport component 81, and the rear lifting module 92 is used to transport the support platform 10 located on the upper transport component 81 to the lower transport component 82, so that the support platform 10 can be reused. The front lifting module 91 transports the support platform 10 on the lower transport component 82 to the upper transport component 81, and then performs corresponding module processing operations on the heat sink 13 and transistor 12 on the fixture 11 of the support platform 10, and then takes out the processed heat sink 13 and transistor 12. Then, the rear lifting module 92 transports the support platform 10 and fixture 11 to the lower transport component 82, and so on, so that the support platform 10 and fixture 11 can be automatically reused.

[0055] Reference Figure 1 Specifically, both the upper transport assembly 81 and the lower transport assembly 82 include a transport motor, two drive wheels 83, two driven wheels, and two transmission chains 84. The two drive wheels 83 are connected by a transmission shaft 85. One transmission chain 84 is mounted on one drive wheel 83 and one driven wheel. The support platform 10 is placed on the two transmission chains 84. The output shaft of the transport motor is connected to the drive motor of one of the drive wheels 83 to drive the two transmission chains 84 to move in the same direction, thereby enabling the support platform 10 to move in the same direction. Platform 10 moves with the transmission chain 84; further, in this embodiment, after adjacent modules are spliced, since the corners of the transmission chain 84 are arc-shaped when it is driven, in order to facilitate the transport of the platform 10 from one transport component to an adjacent transport component, a buffer wheel 86 is provided at the corner of the transmission chain 84 in this embodiment. The buffer wheel 86 prevents the platform 10 or the fixture 11 from overturning due to excessive span when the platform 10 is transported from one transport component to its adjacent transport component, thereby increasing the stability of the platform 10.

[0056] Of course, in other embodiments, the upper transport component 81 and the lower transport component 82 can also be connected by a transport motor, a transport drive wheel 83, a transport driven wheel, and a transport transmission belt. The transport drive wheel 83 is driven and connected to the output shaft of the transport motor. The transmission belt is sleeved on the transport drive wheel 83 and the transport driven wheel. The support platform 10 is placed on the transmission belt. The support platform 10 is moved on each module by the transport transmission belt provided on each module.

[0057] Specifically, the nut-releasing module 20 clamps the nut with a pneumatic finger 21, and then drives the pneumatic finger 21 to move to the limiting part through the material transfer drive assembly. The material transfer drive assembly includes a material transfer frame, a material transfer slide rail set on the material transfer frame, and a material transfer drive component. The material transfer drive component drives the pneumatic finger 21 to slide along the material transfer slide rail. The material transfer drive component can be a cylinder, or it can be achieved through the cooperation between a motor, a drive wheel, a driven wheel, and a transmission belt.

[0058] Furthermore, the limiting part is a limiting groove. The pneumatic finger 21 clamps and moves the nut into the limiting groove to prevent the nut from shifting when placing the transistor 12 or the heat sink 13, or during other process stages, which would prevent it from engaging with the screw to lock the transistor 12 and the heat sink 13. Of course, in other embodiments, the limiting part can also be a magnet to attract the screw to a fixed position, or it can be several protrusions to hold the nut between several protrusions.

[0059] Reference Figure 2 and Figure 3 In this embodiment, the reverse crystal module 30 further includes the transistor storage mechanism 31, which includes a belt push mechanism 311, a storage rack 312, and a plurality of storage tubes 313 stacked on the storage rack 312. The belt push mechanism 311 pushes the transistors 12 in the storage tubes 313 to move toward the next station.

[0060] To prevent the transistor 12 from getting stuck in the storage tube 313 during the pushing process, in this embodiment, the transistor storage mechanism 31 further includes a vibration cylinder 314 installed on the storage rack 312 to vibrate the storage tube 313 being pushed, thereby ensuring the normal operation of the transistor 12 pushing process.

[0061] The transistor storage mechanism 31 also includes a storage cylinder 315 mounted on the storage rack 312. When the transistors 12 in the storage tube 313 are used up, the storage cylinder 315 pushes the lowest storage tube 313 to move horizontally, so that the storage tube 313 above it moves down to continue supplying transistors 12. When the staff needs to add transistors 12, they only need to add storage tubes 313 to the storage rack 312.

[0062] Reference Figure 4The reverse crystal module 30 further includes a chamfering assembly 32, which includes a blade mounting base 322, a chamfering drive assembly, and a blade fixed to the blade mounting base 322. The chamfering drive assembly drives the blade mounting base 322 to move up and down, so that the blade can chamfer the leads of the transistor 12. When the belt pushing mechanism 311 pushes the transistor 12 to a predetermined position, the robotic arm clamps the transistor 12 to the chamfering position, and the chamfering drive assembly drives the blade to move downward to chamfer the leads of the transistor 12.

[0063] The corner-cutting drive assembly may include a corner-cutting motor 321, a corner-cutting drive wheel, a corner-cutting driven wheel, and a corner-cutting transmission belt sleeved on the corner-cutting drive wheel and the corner-cutting driven wheel. The corner-cutting transmission belt drives the blade mounting seat 322 to move up and down, and then the blade 323 performs corner-cutting on the transistor 12. Of course, the corner-cutting drive assembly can also be directly implemented by setting a corner-cutting cylinder, which drives the blade mounting seat 322 to move up and down to achieve corner-cutting on the transistor 12.

[0064] Reference Figure 5 Furthermore, the reverse crystal module 30 also includes a crystal transport mechanism 33, which includes a transport frame 331, a transport slide rail on the transport frame 331, and a sliding motor, a transport drive component, and a gripper all mounted on the transport frame 331. The sliding motor drives the transport frame 331 to slide on the transport slide rail to transport the chamfered transistor 12 to the fixture 11. The transport drive component is used to drive the gripper to clamp or release the transistor 12.

[0065] Reference Figure 6 and Figure 7 Furthermore, in this embodiment, the thermal paste storage assembly 41 includes a thermal paste container 411 for containing thermal paste, a printing motor 412 mounted on the thermal paste container 411, a printing drive wheel on the output shaft of the printing motor 412, and a printing driven wheel that is connected to the printing drive wheel via a printing drive belt 413. The lower part of the printing drive belt 413 contacts the thermal paste, and under the drive of the printing motor 412, the lower part of the printing drive belt 413 carrying thermal paste is moved to the position of the upper part of the printing drive belt 413. In this way, the thermal paste is circulated back and forth between the lower part of the printing drive belt 413 and the upper part of the printing drive belt 413 driven by the printing motor 412.

[0066] To standardize the thickness of the thermal paste applied to the printing conveyor belt 413, in this embodiment, a scraper 414 is movably mounted on the thermal paste box 411. By adjusting the distance between the scraper 414 and the printing conveyor belt 413, thermal paste of different thicknesses can be applied to the printing conveyor belt 413. The width of the scraper 414 is greater than or equal to the width of the printing conveyor belt 413. The scraper 414 has a simple and practical structure, thereby reducing production costs.

[0067] Specifically, the transplanting assembly 42 includes a transplanting slide rail, a transplanting frame slidably connected to the transplanting slide rail, and a transplanting drive and a printing cylinder both mounted on the transplanting frame. The printing head is mounted on the end of the transplanting frame facing the first thermal paste storage assembly 41. The transplanting drive drives the transplanting frame to slide on the slide rail, thereby causing the printing head to move back and forth between the first thermal paste storage assembly 41 and the support platform 10. The printing cylinder drives the printing head to move up and down, so that the printing head can adhere to the thermal paste on the printing conveyor belt 413 and print the thermal paste onto the transistor 12. First, the transplanting drive unit drives the transplanting frame to slide on the transplanting slide rail above the printing conveyor belt 413. Then, the printing cylinder drives the printing head to descend so that the printing head can adhere to the thermal paste on the printing conveyor belt 413. Then, the printing cylinder drives the printing head to rise. When the transplanting drive unit drives the transplanting frame to move on the transplanting slide rail above the transistor 12, the printing cylinder drives the printing head to move downward so that the thermal paste adheres to the transistor 12. Then, the printing cylinder drives the printing head to rise again, and so on, printing thermal paste onto the transistor 12.

[0068] Furthermore, to ensure that the transistor 12 is not picked up or displaced during the printing process, in this embodiment, the transfer assembly 42 includes a pre-pressure cylinder. When the printing head prints the thermal paste onto the transistor 12, the pre-pressure cylinder drives its piston rod to rise and confine the transistor 12 onto the fixture 11. The printing cylinder drives the printing head to move away from the transistor 12. By confining the transistor 12 onto the fixture 11 before the printing cylinder drives the printing head to rise, the transistor 12 can always be confined onto the fixture 11 when the printing head rises, thereby reducing the possibility of it being picked up or displaced during the printing process.

[0069] Reference Figure 8Specifically, in order to prevent the transistor 12 from shifting under the drive of the transport component during the printing process, in this embodiment, the thermal paste printing module 40 further includes a lifting component 43 installed below its transport component. The lifting component 43 includes a lifting frame and a lifting cylinder 433 installed on the lifting frame. When the carrier platform 10 is transported to the thermal paste printing location, the lifting cylinder 433 drives its piston rod to lift the carrier platform 10 to a position detached from the transport component, thereby enhancing the stability of the carrier platform 10.

[0070] Further, the lifting frame includes a first lifting frame 431 and a second lifting frame 432. The lifting cylinder 433 is installed on the first lifting frame 431, and the piston rod end of the lifting cylinder 433 is installed on the second lifting frame 432. The second lifting frame 432 is provided with at least one limiting post 4321 on the side facing the support platform 10, and the support platform 10 is provided with at least one limiting hole on the side facing the second lifting frame 432. The lifting cylinder 433 drives the second lifting frame 432 to lift so that one of the limiting posts 4321 is limited in one of the limiting holes. By setting the limiting post 4321 and the limiting hole, the support platform 10 can be prevented from deviating from its original lifting position under the drive of the transport component during the lifting process. The specific process is as follows: first, the lifting cylinder 433 drives the second lifting frame 432 to lift so that the limiting post 4321 is limited in the corresponding limiting hole, and then the lifting continues so that the support platform 10 is disengaged from the transmission chain 84.

[0071] Reference Figure 9 In this embodiment, the heat sink placement module 50 mainly involves manually placing the heat sink 13 onto the fixture 11. To ensure the safety of workers, in this embodiment, the heat sink placement module 50 is further equipped with a detector for detecting the heat sink 13; and / or the heat sink placement module 50 is equipped with a safety light curtain 51 for safety protection. The detector is used to detect whether the fixture 11 has a heat sink 13, and the safety light curtain 51 is used to detect whether the worker's hand has been removed to a safe area after placing the heat sink 13, so as to reduce personnel injury in industrial production.

[0072] Reference Figure 10 The feeding mechanism 61 is provided with a receiving cavity for accommodating the insulating particles and the screw. The insulating particles are sleeved on the outer wall of the screw so that when the electric screwdriver 62 locks the screw onto the heat sink 13, the insulating particles are sandwiched between the screw and the transistor 12. The feeding mechanism 61 provides the electric screwdriver 62 with the screw and the insulating particles. The insulating particles are sleeved on the screw, and then the electric screwdriver 62 screws the transistor 12 onto the heat sink 13, so that the insulating particles are sandwiched between the screw and the transistor 12.

[0073] ReferenceFigure 11 In this embodiment, the single crystal nut heat sink assembly screw locking device also includes a material picking module 70. The material picking module 70 is provided with the transport component and is spliced ​​downstream of the locking module 60 to package the processed transistor 12.

[0074] Specifically, the material handling module 70 includes a conveyor line 75, material trays 76, a first lifting cylinder 71, a second lifting cylinder 72, a third lifting cylinder 73, a fourth lifting cylinder 74, a first picking motor, a second picking motor, and a picking frame. The first lifting cylinder 71, the second lifting cylinder 72, the third lifting cylinder 73, and the fourth lifting cylinder 74 are all mounted on the conveyor line 75. Several material trays 76 are placed on the conveyor line 75 and moved by the conveyor line 75. The first lifting cylinder 71, the second lifting cylinder 72, the third lifting cylinder 73, and the fourth lifting cylinder 74 are all mounted on the conveyor line 75 and are equipped with… Two cylinders, symmetrically located on both sides of the transport line 75, are used. The first top-loading cylinders 71 move to clamp the second (counting from bottom to top) of a stack of empty material trays 76. Then, the second top-loading cylinder 72 located below the first top-loading cylinder 71 lifts the first top-loading cylinder 71, thereby causing the second and subsequent empty material trays 76 to detach from the first empty material tray 76. This causes the transport line 75 to move the first empty material tray 76 forward. Then, the first top-loading cylinder 71 and the second top-loading cylinder 72 lower the lifted empty material trays 76, thus continuously supplying empty material trays 76 to the transport line 75.

[0075] Specifically, when the tray 76 on the side of the transport component near the material picking module 70 is filled with the processed transistors 12 and heat sinks 13, the third lifting cylinders 73 on both sides clamp the bottommost of the leftmost stacked full tray 76, and then the fourth lifting cylinder 74 located below it lifts the third lifting cylinder 73. Then the transport line 75 drives the tray 76 filled with the processed transistors 12 to move forward. When it moves to the bottom of the lifted tray 76, the tray 76 is lowered by the cooperation of the third lifting cylinder 433 and the fourth lifting cylinder 433. The trays 76 filled with materials are stacked in this way.

[0076] The material handling rack includes a first material handling rack 77 and a second material handling rack 78. The first material handling rack 77 is installed on the transport line 75 and located above the material handling module 70. The material handling rack is provided with a material handling slide rail. The second material handling rack 78 is slidably connected to the first material handling rack 77 through the material handling slide rail. The first material handling motor drives the second material handling rack 78 to slide on the material handling slide rail. The second material handling motor is installed on the second material handling rack 78 and is used to drive the grippers on the second material handling rack 78 to clamp the processed transistor 12, and then transport it to the material tray 76 of the transport line 75 through the first material handling motor.

[0077] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A screw-locking device for assembling a single-crystal heat sink with a nut, characterized in that, include: A support platform, on which a fixture is mounted, and the fixture is provided with a limiting part; The nut placement module includes pneumatic fingers for gripping and placing a nut onto the limiting portion; A reverse crystal module is placed for placing transistors on the nut; A thermal paste printing module includes a thermal paste storage component, a transfer component, and a printing head mounted on the transfer component. The transfer component drives the printing head to move to print thermal paste from the thermal paste storage component onto the transistor. A heat sink module is used to place heat sinks on the transistor; as well as The fastening module includes a feeding mechanism and an electric screwdriver. The feeding mechanism is connected to the electric screwdriver and is used to supply screws to the electric screwdriver. The electric screwdriver is used to fasten the transistor to the heat sink by the cooperation of the screws and the nut. Each of the nut placement module, the reverse crystal placement module, the thermal paste application module, the heat sink placement module, and the locking module is equipped with a transport component. The support platform is placed on one of the transport components, and the modules are sequentially spliced ​​together so that the support platform moves between the modules under the drive of the transport component. The reverse crystal module includes a transistor storage mechanism, which further includes a belt pushing mechanism, a storage rack, and multiple storage tubes stacked on the storage rack. Each storage tube stores multiple transistors, and the pushing mechanism pushes the transistors in the storage tubes toward the next station. The transistor storage mechanism also includes a storage cylinder mounted on the storage rack. When the transistors in the storage tube are used up, the storage cylinder pushes the lowest storage tube to move horizontally, so that the storage tube above it moves down to continue supplying the transistors.

2. The single-crystal heat sink assembly screw locking device as described in claim 1, characterized in that, It also includes a material handling module, which is equipped with the transport component and is connected downstream of the locking module to package the processed transistors.

3. The single-crystal heat sink assembly screw locking device as described in claim 1, characterized in that, The transport component includes an upper transport component and a lower transport component installed below the upper transport component. The upper transport component is used to drive the carrier platform to move between modules to complete the functions of the corresponding modules, and the lower transport component is used to drive the carrier platform to move to complete the reuse of the carrier platform. It also includes a front lifting module located at the head end of the single crystal nut-heat sink assembly screw-locking device and a rear lifting module located at the tail end of the single crystal nut-heat sink assembly screw-locking device. The front lifting module is used to transport the carrier platform located in the lower transport component to the upper transport component, and the rear lifting module is used to transport the carrier platform located in the upper transport component to the lower transport component so that the carrier platform can be reused.

4. The single-crystal heat sink assembly screw locking device as described in claim 1, characterized in that, The limiting part is a limiting groove.

5. The single-crystal heat sink assembly screw locking device as described in claim 1, characterized in that, The transistor storage mechanism also includes a vibration cylinder mounted on the storage rack to vibrate the storage tube being pushed.

6. The single-crystal heat sink assembly screw locking device as described in claim 1, characterized in that, The thermal paste printing module also includes a lifting assembly installed below its transport assembly. The lifting assembly includes a lifting frame and a lifting cylinder mounted on the lifting frame. When the carrier platform is transported to the thermal paste printing location, the lifting cylinder drives its piston rod to lift the carrier platform to a position detached from the transport assembly.

7. The single-crystal heat sink assembly screw locking device as described in claim 6, characterized in that, The lifting frame includes a first lifting frame and a second lifting frame. The lifting cylinder is installed on the first lifting frame, and the piston rod end of the lifting cylinder is installed on the second lifting frame. The second lifting frame has at least one limiting post on the side facing the support platform, and the support platform has at least one limiting hole on the side facing the second lifting frame. The lifting cylinder drives the second lifting frame to lift so that one of the limiting posts is limited within one of the limiting holes.

8. The single-crystal heat sink assembly screw locking device as described in claim 1, characterized in that, The heat sink module is equipped with a detector for detecting the heat sink; and / or The heat sink module is equipped with a safety light curtain for safety protection.

9. The single-crystal heat sink assembly screw locking device as described in claim 1, characterized in that, The feeding mechanism is provided with a receiving cavity for accommodating the insulating particles and the screw. The insulating particles are sleeved on the outer wall of the screw so that when the electric screwdriver locks the screw to the heat sink, the insulating particles are sandwiched between the screw and the transistor.

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