Wafer pre-alignment method, device, equipment and wafer detection system

Abstract

The application relates to a wafer pre-alignment method, device, equipment and wafer detection system, which comprises the following steps: receiving linear data collected by a sensor, determining a notch position of a wafer according to the linear data; the linear data is obtained by collecting data of the edge of the wafer by the sensor when a rotating platform drives the wafer to rotate; analyzing the notch position of the wafer and preset parameters to determine the eccentric coordinates of the wafer; and adjusting the notch position of the wafer to a target position according to the eccentric coordinates of the wafer. When the rotating platform drives the wafer to rotate, the linear data is obtained by collecting data of the edge of the wafer by the sensor, then the notch position of the wafer is determined according to the linear data collected by the sensor, and then the notch position of the wafer and the preset parameters are combined to analyze and determine the eccentric coordinates of the wafer, and the notch position of the wafer is adjusted to the target position according to the eccentric coordinates of the wafer, so that secondary data collection and processing are not needed, and the wafer pre-alignment efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of computer control technology, and in particular to a wafer pre-alignment method, apparatus, device and wafer inspection system. Background Technology

[0002] Wafer pre-alignment is a crucial function of wafer testing equipment. Before probe testing or optical inspection, wafers undergo pre-alignment to check the center position and notch direction, adjusting the wafer's position and angle to ensure it meets requirements when placed at the testing station. Since data from the wafer notch cannot be processed as data from the normal edge, it's necessary to find ways to avoid the notch data's influence on the overall wafer shape.

[0003] Traditional wafer pre-alignment methods involve acquiring images of the wafer via a camera and transmitting them to a host computer. The host computer first performs a coarse rotational scan of the wafer to determine the notch location, then performs a second, more precise rotational scan to pinpoint the notch location. Data near the notch is removed, and the remaining data is then fitted into a circle to determine the notch and offset positions. Because this requires a second data scan and processing, it is time-consuming and suffers from low pre-alignment efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide a wafer pre-alignment method, apparatus, equipment, and wafer inspection system that can improve wafer pre-alignment efficiency in response to the above problems.

[0005] The first aspect of this application provides a wafer pre-alignment method, comprising:

[0006] The system receives linear data collected by a sensor and determines the notch position of the wafer based on the linear data. The linear data is obtained by the sensor collecting data on the edge of the wafer when the rotating platform drives the wafer to rotate.

[0007] The eccentric coordinates of the wafer are determined by analyzing the notch position and preset parameters.

[0008] The notch position of the wafer is adjusted to the target position based on the wafer's eccentric coordinates.

[0009] In one embodiment, determining the eccentric coordinates of the wafer based on the notch position and preset parameters includes:

[0010] Establish a coordinate system with the rotation center of the rotating platform as the origin;

[0011] The eccentric coordinates of the wafer in the coordinate system are calculated by combining the preset parameters and the notch position of the wafer.

[0012] In one embodiment, determining the notch location of the wafer based on the linear data includes:

[0013] The linear data collected by the sensor during one revolution of the rotating platform are subtracted one by one to obtain the adjacent data difference array;

[0014] The notch distance sensor angle of the wafer in the coordinate system is determined based on the peak and valley values ​​in the adjacent data difference array; the notch position of the wafer includes the notch distance sensor angle of the wafer.

[0015] In one embodiment, establishing a coordinate system with the rotation center of the rotating platform as the origin includes:

[0016] The coordinate system is established by taking the rotation center of the rotating platform as the origin and the deflection angle of the line connecting the rotation center and the notch of the wafer as the positive direction of the X-axis.

[0017] In one embodiment, the preset parameters include the correspondence between the rotation angle of the rotating platform and the light-shielding distance measured by the sensor; the calculation of the eccentric coordinates of the wafer in the coordinate system by combining the preset parameters and the notch position of the wafer includes:

[0018] Based on the set angle, the angle between the wafer notch and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor, the eccentric coordinates of the wafer in the coordinate system are determined.

[0019] In one embodiment, adjusting the notch position of the wafer to the target position based on the wafer's eccentric coordinates includes:

[0020] The eccentricity of the wafer is calculated based on its eccentric coordinates.

[0021] If the eccentricity of the wafer is within a preset range, the rotating platform is controlled to rotate, and the notch position of the wafer is adjusted to the target angle.

[0022] In one embodiment, after calculating the eccentricity of the wafer based on its eccentric coordinates, the method further includes:

[0023] If the eccentricity of the wafer is not within the preset range, the wafer is moved so that its center coincides with the rotation center, and the linear data collected by the receiving sensor is returned. The notch position of the wafer is then determined based on the linear data.

[0024] In one embodiment, moving the wafer to align its center with the rotation center includes:

[0025] Based on the eccentric coordinates of the wafer, determine the angle by which the positive eccentric direction of the wafer is rotated to the sensor direction;

[0026] Based on the angle at which the wafer rotates from the positive eccentric direction to the sensor direction, the rotation platform is controlled to rotate so that the line connecting the center of the wafer and the rotation center is in the same direction as the movement direction of the transport mechanism.

[0027] The eccentricity is used to control the transport mechanism to move the wafer so that the center of the wafer coincides with the rotation center.

[0028] In one embodiment, determining the angle by which the positive eccentricity direction of the wafer is rotated to the sensor direction based on the eccentricity coordinates of the wafer includes:

[0029] If the abscissa of the eccentricity coordinate of the wafer is zero, then the angle of rotation of the wafer from the positive eccentricity direction to the sensor direction is obtained by summing the set angle and the angle of the wafer notch distance from the sensor.

[0030] If the abscissa of the eccentric coordinate of the wafer is not zero, the arctangent value is calculated based on the arctangent coordinate of the wafer, and the arctangent value, the set angle, and the angle between the notch of the wafer and the sensor are summed to obtain the angle at which the positive eccentric direction of the wafer rotates to the sensor direction.

[0031] A second aspect of this application provides a wafer pre-alignment apparatus, comprising:

[0032] The data receiving module is used to receive linear data collected by the sensor and determine the notch position of the wafer based on the linear data; the linear data is obtained by the sensor collecting data on the edge of the wafer when the rotating platform drives the wafer to rotate;

[0033] The data processing module is used to analyze the notch position of the wafer and preset parameters to determine the eccentric coordinates of the wafer.

[0034] The pre-alignment module is used to adjust the notch position of the wafer to the target position according to the eccentric coordinates of the wafer.

[0035] A third aspect of this application provides a wafer pre-alignment device, including a memory and a controller, wherein the memory stores a computer program, and the controller executes the computer program to implement the steps of the method described above.

[0036] A fourth aspect of this application provides a wafer inspection system, including a sensor, a rotating platform, a transport mechanism, and the aforementioned wafer pre-alignment device, wherein the controller is connected to the sensor, the rotating platform, and the transport mechanism.

[0037] The aforementioned wafer pre-alignment method, apparatus, equipment, and wafer inspection system, when the rotating platform drives the wafer to rotate, use sensors to collect linear data from the edge of the wafer, determine the notch position of the wafer based on the linear data collected by the sensors, and then analyze the notch position of the wafer with preset parameters to determine the eccentric coordinates of the wafer. Based on the eccentric coordinates of the wafer, the notch position of the wafer is adjusted to the target position, eliminating the need for secondary data acquisition and processing, thus improving the wafer pre-alignment efficiency. Attached Figure Description

[0038] Figure 1 This is a diagram illustrating the application environment of a wafer pre-alignment method in one embodiment;

[0039] Figure 2 This is a schematic flowchart of a wafer pre-alignment method in one embodiment;

[0040] Figure 3 This is a flowchart illustrating the process of determining the notch location of a wafer based on linear data in one embodiment.

[0041] Figure 4 This is a flowchart illustrating how the wafer's eccentric coordinates are determined by analyzing the wafer's notch position and preset parameters in one embodiment.

[0042] Figure 5 This is a flowchart illustrating how the notch position of a wafer is adjusted to the target position based on the wafer's eccentric coordinates in one embodiment.

[0043] Figure 6 This is a schematic diagram of the process of moving the wafer to make the center of the wafer coincide with the center of rotation in one embodiment;

[0044] Figure 7 This is a flowchart illustrating the wafer pre-alignment method in one embodiment;

[0045] Figure 8 This is an example diagram of linear data collected by a sensor in one embodiment;

[0046] Figure 9 This is an example diagram of the adjacent data difference array in one embodiment;

[0047] Figure 10 This is a schematic diagram illustrating the principle of calculating the eccentric coordinates of a wafer in one embodiment;

[0048] Figure 11 This is an example diagram illustrating the calculation of wafer eccentricity coordinates in one embodiment;

[0049] Figure 12 This is a schematic diagram illustrating the principle of moving the wafer to make the center of the wafer coincide with the center of rotation in one embodiment.

[0050] Figure 13 This is a structural block diagram of a wafer pre-alignment device in one embodiment;

[0051] Figure 14 This is an internal structural diagram of a wafer pre-alignment device in one embodiment. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0053] The wafer pre-alignment method provided in this application embodiment can be applied to, for example... Figure 1 In the application environment shown, wafer 3 is transported from the wafer storage mechanism to the rotating platform 2 via the transport mechanism 4, ensuring that the edge of wafer 3 is within the working area of ​​the linear sensor 1. The rotating platform 2 rotates wafer 3, while the linear sensor 1 activates to acquire data, uploading the acquired linear data to the controller. The controller determines the notch position of wafer 3 based on the linear data, and then analyzes and determines the wafer's eccentric coordinates based on the notch position and preset parameters. Based on the eccentric coordinates, the notch position of the wafer is adjusted to the target position without the need for secondary data acquisition and processing, ensuring efficient wafer pre-alignment.

[0054] In one embodiment, such as Figure 2 As shown, a wafer pre-alignment method is provided, including steps S100 to S300, wherein:

[0055] Step S100: Receive linear data collected by the sensor and determine the notch position of the wafer based on the linear data.

[0056] The linear data is obtained by sensors collecting data from the edges of the wafer as the rotating platform drives it to rotate. Linear sensors can be used to acquire data, which can be directly processed before being sent to the controller. This effectively reduces data transmission time and improves pre-alignment efficiency. Specifically, the controller connects the linear sensor and the rotating platform. The controller controls the rotating platform to rotate the wafer, while the linear sensor collects data from the wafer's edges and notches, outputting linear data to the controller. The controller then calculates and determines the notch position on the wafer based on this linear data.

[0057] It is understandable that the specific method for determining the wafer notch position based on linear data is not unique. For example, it could be to establish a coordinate system with the rotation center of the rotating platform as the origin, and then determine the wafer notch coordinates in the coordinate system using the collected linear data as the wafer notch position; or it could be to determine the angle of the wafer notch relative to the sensor in the coordinate system as the wafer notch position. In one embodiment, such as... Figure 3 As shown, step S100 determines the notch location of the wafer based on linear data, including steps S120 and S140.

[0058] Step S120: Subtract the linear data collected by the sensor one by one during one rotation of the rotating platform to obtain an array of adjacent data differences. Specifically, the controller controls the rotating platform to rotate one revolution and receives the linear data collected by the linear sensor. Since there is a deviation between the center of the wafer and the rotation center of the rotating platform, the length of the wafer edge under the linear sensor will change periodically when the rotating platform rotates the wafer one revolution. Assuming that the linear sensor collects i data points during one revolution of the rotating platform, i.e., each data point corresponds to an angle of 360 / i, subtract the i data points one by one to obtain an array of adjacent data differences.

[0059] Step S140: Determine the angle between the wafer notch and the sensor in the coordinate system based on the peak and valley values ​​in the adjacent data difference array. The wafer notch position includes the angle between the wafer notch and the sensor. Correspondingly, the controller subtracts the collected i data points one by one to obtain the adjacent data difference array, and then determines the angle α between the wafer notch and the linear sensor based on the peak and valley values ​​in the array.

[0060] Step S200: Analyze the wafer notch position and preset parameters to determine the wafer's eccentric coordinates. After determining the wafer notch position, the controller further analyzes the notch position and preset parameters to determine the wafer's eccentric coordinates. It is understood that the specific calculation method for the eccentric coordinates is not unique; the type of preset parameters will vary depending on the calculation method. In one embodiment, such as... Figure 4 As shown, step S200 includes steps S220 and S240.

[0061] Step S220: Establish a coordinate system with the rotation center of the rotating platform as the origin. Specifically, the controller can use the rotation center of the rotating platform as the origin, and the line connecting the rotation center and the sensor as the X-axis to establish the coordinate system; alternatively, the controller can use the rotation center of the rotating platform as the origin, and deflect the line connecting the rotation center and the wafer notch by a certain angle as the X-axis to establish the coordinate system. In this embodiment, step S220 includes: establishing a coordinate system with the rotation center of the rotating platform as the origin, and deflecting the line connecting the rotation center and the wafer notch by a set angle as the positive direction of the X-axis. The value of the set angle γ is not unique; for example, it can be 36 degrees or other angles. By establishing a coordinate system with the line connecting the rotation center and the wafer notch deflected by a set angle γ as the positive direction of the X-axis, the wafer notch position can be avoided.

[0062] Step S240: Calculate the eccentric coordinates of the wafer in the coordinate system by combining preset parameters and the wafer notch position. Correspondingly, after establishing the coordinate system, the controller can calculate the eccentric coordinates of the wafer in the coordinate system by combining the angle α between the wafer notch and the sensor, and the preset parameters. In this embodiment, the preset parameters include the correspondence between the rotation angle of the rotating platform and the light-shielding distance measured by the sensor; Step S240 includes: determining the eccentric coordinates of the wafer in the coordinate system based on the set angle, the angle between the wafer notch and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor.

[0063] Specifically, we can assume that the distance from the rotation center of the rotating platform to the linear sensor is L, and the light-blocking distance measured by the sensor when the rotating platform rotates by an angle θ is M(θ). Then, the distance from the edge of the wafer to the rotation center of the rotating platform is RA(θ) = L + M(θ). Here, the light-blocking distance measured by the sensor when the rotating platform rotates by an angle θ refers to the distance of the wafer under the sensor when the rotating platform rotates by an angle θ. This distance can be expressed by the linear data set A[i] collected by the sensor.

[0064] The controller receives voltage signals from the sensors and obtains the shading distance corresponding to each voltage signal by using a pre-stored linear relationship between voltage and distance. The linear data set A[i] consists of data continuously recorded by the linear sensors as the rotating platform rotates, and therefore corresponds to the angle θ. M(θ) can be expressed as a linear function, specifically:

[0065] M(θ) = k × A[i] + b

[0066] Here, k represents the relationship between the voltage value and the distance, and b is the voltage value output by the linear sensor when no wafer is placed. Under stable hardware conditions of the linear sensor, k and b are constant values. k, as a characteristic data of the linear sensor, can be obtained by analyzing a specific set of linear data A[i] obtained in advance.

[0067] After establishing a coordinate system with a deflection angle γ along the line connecting the rotation center and the notch of the wafer, the center coordinates O'(X, Y) of the wafer are the eccentric coordinates, calculated as follows:

[0068] Y=RA(α+γ+90)-RA(α+γ+270)=M(α+γ+90)-M(α+γ+270)

[0069] X=RA(α+γ)-RA(α+γ+180)=M(α+γ)-M(α+γ+180)

[0070] Where α is the angle between the wafer notch and the linear sensor, and γ is the set angle.

[0071] Step S300: Adjust the notch position of the wafer to the target position based on the wafer's eccentric coordinates. Correspondingly, after determining the wafer's eccentric coordinates, the controller analyzes the distance between the wafer's center and the rotation center of the rotating platform, i.e., the eccentricity, based on the eccentric coordinates. The controller combines the calculated eccentricity with the set conditions to analyze whether eccentricity adjustment is needed. If no eccentricity adjustment is needed, the wafer's notch position is adjusted to the target position, completing the wafer pre-alignment.

[0072] In one embodiment, such as Figure 5 As shown, step S300 includes steps S320 and S340.

[0073] Step S320: Calculate the wafer eccentricity based on the wafer's eccentric coordinates. Specifically, the eccentricity Dr = (X, Y) can be calculated from the wafer's eccentric coordinates (X, Y). 2 +Y 2 ) 1 / 2 .

[0074] Step S340: If the wafer's eccentricity is within a preset range, control the rotating platform to rotate and adjust the wafer's notch position to the target angle. The specific values ​​for the preset range and target angle are not unique and can be set according to actual needs. The preset range can be the range between two set values, or it can be a range less than a certain set value. In this embodiment, after calculating the eccentricity Dr, the controller compares Dr with the set value. If the wafer's eccentricity Dr is less than the set value, it is considered that Dr is within the preset range, and the rotating platform is controlled to rotate, adjusting the wafer's notch position to the target angle, thus completing the wafer pre-alignment.

[0075] Furthermore, in one embodiment, reference continues to... Figure 5 Following step S320, step S300 further includes step S360: if the wafer's eccentricity is not within a preset range, the wafer is moved so that its center coincides with the rotation center, and the process returns to step S100. Specifically, the controller is also connected to a transport mechanism. If the wafer's eccentricity Dr is not within a preset range, the controller controls the transport mechanism to move the wafer so that its center coincides with the rotation center, and again uses a linear sensor to collect data to determine the wafer's notch position.

[0076] It is understandable that the method of moving the wafer to make its center coincide with the rotation center is not unique. In one embodiment, such as... Figure 6 As shown, step S360 includes steps S362 to S366.

[0077] Step S362: Determine the angle from the positive eccentricity of the wafer to the sensor direction based on the wafer's eccentric coordinates. After determining the wafer's eccentric coordinates (X, Y), the controller calculates the angle W from the positive eccentricity of the wafer to the sensor direction based on the eccentric coordinates (X, Y). In this embodiment, step S362 includes: if the abscissa of the wafer's eccentric coordinates is zero, then summing the angle based on the set angle and the distance between the wafer's notch and the sensor to obtain the angle from the positive eccentricity of the wafer to the sensor direction; if the abscissa of the wafer's eccentric coordinates is not zero, then calculating the arctangent based on the wafer's eccentric coordinates to obtain the arctangent value, and summing the arctangent value, the set angle, and the distance between the wafer's notch and the sensor to obtain the angle from the positive eccentricity of the wafer to the sensor direction.

[0078] Specifically, when X = 0:

[0079] If Y=0, W=0;

[0080] If Y>0, W=90+α+γ;

[0081] If Y < 0, W = -90 + α + γ;

[0082] When X>0: W=arctan(Y / X)+α+γ;

[0083] When X<0: W=arctan(Y / X)+180+α+γ.

[0084] Step S364: Based on the angle W from the positive eccentricity of the wafer to the sensor direction, control the rotating platform to rotate so that the line connecting the center of the wafer and the rotation center is in the same direction as the movement direction of the transport mechanism. After calculating the angle W from the positive eccentricity of the wafer to the sensor direction, the controller rotates the rotating platform so that the line connecting the center of the wafer and the rotation center of the rotating platform is in the same direction as the movement direction of the transport mechanism, so that the wafer can be moved in subsequent steps.

[0085] Step S366: Control the transport mechanism to move the wafer according to the eccentricity, so that the center of the wafer coincides with the rotation center. After adjusting the direction of the line connecting the center of the wafer and the rotation center of the rotating platform, the controller controls the transport mechanism to pick up the wafer and move the wafer by the eccentricity Dr, so that the center of the wafer coincides with the rotation center of the rotating platform. Then, the notch position of the wafer is determined again by collecting data through the linear sensor.

[0086] The aforementioned wafer pre-alignment method, when the rotating platform drives the wafer to rotate, uses sensors to collect linear data from the edge of the wafer. Based on the linear data collected by the sensors, the notch position of the wafer is determined. Then, combined with the notch position and preset parameters, the wafer's eccentric coordinates are determined. Based on the eccentric coordinates of the wafer, the notch position of the wafer is adjusted to the target position. No secondary data collection and processing is required, thus improving the wafer pre-alignment efficiency.

[0087] To facilitate a better understanding of the above wafer pre-alignment method, a detailed explanation is provided below with reference to specific embodiments.

[0088] Current wafer pre-alignment algorithms require an initial coarse rotation scan to determine the wafer notch position, followed by a second, more precise rotation scan to pinpoint the notch location. Data near the notch is then removed, and the remaining data is fitted into a circle to determine the notch and eccentricity positions. Alternatively, wafer eccentricity can be determined by detecting data before and after translation, using a three-point method. Current notch handling methods are overly cumbersome, and the second scan is time-consuming. Neither the translation nor the three-point method effectively avoids the influence of notch data, resulting in shortcomings in efficiency and accuracy. Therefore, this application provides a wafer pre-alignment method that uses a linear sensor to collect linear data while the wafer rotates on a rotating platform, and determines the wafer eccentricity coordinates using a four-point crosshair method. This method effectively avoids the influence of notch data and eliminates the need for a second scan, achieving high efficiency and accuracy.

[0089] Specifically, such as Figure 1 and Figure 7 As shown, the wafer pre-alignment method flow is as follows:

[0090] S1: The wafer is transferred to the rotating platform. Specifically, the wafer 3 is transferred from the wafer storage mechanism to the rotating platform 2 via the transfer mechanism 4. At this time, the edge of the wafer is in the working area of ​​the linear sensor 1.

[0091] S2: The rotating platform rotates, and the linear sensor acquires data. Specifically, the rotating platform 2 drives the wafer 3 to rotate, while the linear sensor 1 is activated. Due to the deviation between the wafer's center and the rotation center of the rotating platform 2, when the rotating platform 2 rotates the wafer 3 one revolution, the length of the edge of the wafer 3 under the linear sensor 1 will change periodically. The linear sensor 1 obtains corresponding data based on the periodic change in length. The coordinates of the wafer's center relative to the rotation center can be obtained by analyzing the data obtained by the linear sensor 1. Assume that the linear sensor 1 collects i data points in one revolution, that is, each data point corresponds to an angle of 360 / i.

[0092] S3: The controller analyzes the signal to obtain the data required for adjustment. The steps in S3 are as follows:

[0093] S31: Subtract the data one by one, and determine the location of the wafer notch based on the peak and valley values ​​in the data. Specifically, with i as the horizontal axis and the linear data group A[i] corresponding to the angle of i as the vertical axis, take the i value in the middle of the peak and valley values ​​to locate the angle α between the wafer notch and the linear sensor 1.

[0094] like Figure 8 As shown, a measurement coordinate system O1 can be established, and points within coordinate system O1 are represented by polar coordinates (RA(θ), θ). Through the linear relationship between voltage and distance, the shading distance corresponding to each voltage signal output by linear sensor 1 can be obtained. In this embodiment, the rotating platform takes 800 voltage signals per revolution, and each signal corresponds to an angle of 360 / 800, or 0.45°. Subtracting the previous data from each data point (the last data point minus the first data point) yields a new set of data, i.e., the adjacent data difference array. Then, a graph is plotted with the data sequence number as the horizontal axis, as shown below. Figure 9 As shown. Since the edge of the wafer is circular except for the notch, the distance between adjacent signal acquisition points and the rotation center will not differ significantly. Therefore, the maximum and minimum values ​​of the adjacent data difference array are the notch positions of the wafer. Specifically, multiplying the x-coordinate of the point closest to 0 between the maximum and minimum values ​​by 0.45° yields the angle α of the wafer notch.

[0095] S32: Let L be the distance from the rotation center of the rotating platform 2 to the linear sensor 1, and M(θ) be the distance of the wafer under the linear sensor 1 when the rotating platform 2 rotates by θ. From this, the distance RA(θ) from the edge of the wafer 3 to the rotation center can be calculated as L + M(θ).

[0096] S33: As Figure 10 As shown, with the rotation center of the rotating platform 2 as the origin, the rotation center is connected to the wafer notch and deflected by γ degrees (to avoid the notch). A coordinate system O is established as the positive direction of the X-axis. Let the notch be E, the linear sensor be F, the wafer center be O', and the intersection points of the wafer edge and the coordinate system be ABCD. The coordinates of the center O' (X, Y) are the required eccentric coordinates.

[0097] S34: Because ABCD is a point on the edge of the circle,

[0098] Y = (|OB| - |OD|) / 2

[0099] X = (|OA| - |OC|) / 2

[0100] because

[0101] OA=RA(α+γ), OB=RA(α+γ+90)

[0102] OC=RA(α+γ+180), OD=RA(α+γ+270)

[0103] From this, the specific values ​​of X and Y can be obtained:

[0104] Y=RA(α+γ+90)-RA(α+γ+270)=M(α+γ+90)-M(α+γ+270)

[0105] X=RA(α+γ)-RA(α+γ+180)=M(α+γ)-M(α+γ+180)

[0106] S35: From the coordinates (X, Y) of the center of the circle above, we can calculate:

[0107] Eccentricity: Dr = (X 2 +Y 2 ) 1 / 2

[0108] The angle of rotation from the positive eccentric direction to the linear sensor direction: W

[0109] When X = 0:

[0110] If Y=0; W=0;

[0111] If Y>0; W=90+α+γ;

[0112] If Y < 0; W = -90 + α + γ;

[0113] When X>0; W=arctan(Y / X)+α+γ;

[0114] When X<0; W=arctan(Y / X)+180+α+γ.

[0115] In addition, the center coordinates (X, Y) can also be calculated using polar coordinates. For example... Figure 11 As shown, a computational coordinate system O2 is established with the angle of the wafer notch plus 36° (it is only necessary to ensure that the wafer notch is not on the coordinate axis of the coordinate system; here, γ is taken as 36°) as the positive direction of the X-axis. Points within coordinate system O2 can be represented by polar coordinates (RB(θ), θ). Where RB(θ) = RA(θ + 36° + α), the coordinates of the center (X, Y) can be obtained by extracting four data points.

[0116] X = [RB(0) – RB(180)] / 2;

[0117] Y = [RB(90) – RB(270)] / 2.

[0118] S4: Determine if eccentricity adjustment is needed. Based on the eccentricity Dr calculated in S3, determine if eccentricity adjustment is needed. If adjustment is needed, proceed to S5; otherwise, jump to S7.

[0119] S5: The rotating platform rotates so that the line connecting the wafer center and the rotation center is aligned with the direction of the transport mechanism's movement. Specifically, as follows... Figure 12 As shown, given that the angle between the eccentric coordinate and the linear sensor is W, the angle between the eccentric coordinate and the motion direction of the conveying mechanism 4 can be calculated. The rotation of the rotating platform 2 is controlled so that the direction of the line connecting the center of the wafer 3 and the rotation center of the rotating platform 2 is the same as the motion direction of the conveying mechanism 4 (the dashed line represents the state of the wafer after adjustment).

[0120] S6: The transport mechanism 4 picks up the wafer and moves the wafer 3 by an eccentricity Dr, so that the center of the wafer coincides with the rotation center, and jumps to S1.

[0121] S7: At this point, the eccentricity has been adjusted. The rotating platform 2 drives the wafer 3 to rotate, adjusting the positioning notch to the target angle.

[0122] The more data collected using the above-mentioned wafer pre-alignment method, the more accurate the notch angle can be. In terms of data processing, the four-point cross method is used to effectively avoid the impact of notch data on calculations, and no secondary data collection is required, thus achieving efficient and accurate acquisition of wafer alignment information.

[0123] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0124] Based on the same inventive concept, this application also provides a wafer pre-alignment apparatus for implementing the wafer pre-alignment method described above. The solution provided by this apparatus is similar to the solution described in the above method; therefore, the specific limitations in one or more wafer pre-alignment apparatus embodiments provided below can be found in the limitations of the wafer pre-alignment method described above, and will not be repeated here.

[0125] In one embodiment, such as Figure 13 As shown, a wafer pre-alignment device is provided, comprising: a data receiving module 100, a data processing module 200, and a pre-alignment module 300, wherein:

[0126] The data receiving module 100 is used to receive linear data collected by the sensor and determine the notch position of the wafer based on the linear data; the linear data is obtained by the sensor collecting data on the edge of the wafer when the rotating platform drives the wafer to rotate.

[0127] The data processing module 200 is used to analyze the wafer's notch position and preset parameters to determine the wafer's eccentric coordinates.

[0128] The pre-alignment module 300 is used to adjust the notch position of the wafer to the target position according to the wafer's eccentric coordinates.

[0129] In one embodiment, the data receiving module 100 subtracts the linear data collected by the sensor one by one when the rotating platform rotates one revolution to obtain an adjacent data difference array; based on the peak and valley values ​​in the adjacent data difference array, the angle between the wafer notch and the sensor in the coordinate system is determined; the wafer notch position includes the angle between the wafer notch and the sensor.

[0130] In one embodiment, the data processing module 200 establishes a coordinate system with the rotation center of the rotating platform as the origin; and calculates the eccentric coordinates of the wafer in the coordinate system by combining preset parameters and the notch position of the wafer.

[0131] In one embodiment, the data processing module 200 establishes a coordinate system by taking the rotation center of the rotating platform as the origin and the deflection angle of the line connecting the rotation center and the notch of the wafer as the positive direction of the X-axis.

[0132] In one embodiment, the data processing module 200 determines the eccentric coordinates of the wafer in the coordinate system based on the set angle, the angle between the wafer notch and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor.

[0133] In one embodiment, the pre-alignment module 300 calculates the eccentricity of the wafer based on the eccentric coordinates of the wafer; if the eccentricity of the wafer is within a preset range, the rotating platform is controlled to rotate, and the notch position of the wafer is adjusted to the target angle.

[0134] In one embodiment, the pre-alignment module 300 is further configured to move the wafer so that the center of the wafer coincides with the rotation center when the wafer's eccentricity is not within a preset range, and control the data receiving module 100 to receive the linear data collected by the sensor again, and determine the notch position of the wafer based on the linear data.

[0135] In one embodiment, the pre-alignment module 300 determines the angle by which the positive eccentricity of the wafer rotates to the sensor direction based on the wafer's eccentricity coordinates; based on the angle by which the positive eccentricity of the wafer rotates to the sensor direction, it controls the rotating platform to rotate so that the line connecting the center of the wafer and the rotation center is in the same direction as the movement direction of the transport mechanism; based on the eccentricity, it controls the transport mechanism to move the wafer so that the center of the wafer coincides with the rotation center.

[0136] In one embodiment, the pre-alignment module 300 is used to calculate the angle of rotation of the wafer from the positive eccentricity direction to the sensor direction by summing the set angle and the notch distance of the wafer to the sensor when the abscissa of the wafer's eccentricity coordinate is zero; and when the abscissa of the wafer's eccentricity coordinate is not zero, it calculates the arctangent value by performing arctangent calculation based on the wafer's eccentricity coordinate, and calculates the angle of rotation of the wafer from the positive eccentricity direction to the sensor direction by summing the arctangent value, the set angle, and the notch distance of the wafer to the sensor.

[0137] Each module in the aforementioned wafer pre-alignment device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the corresponding operations of each module.

[0138] In one embodiment, a wafer pre-alignment device is provided. This wafer pre-alignment device can be a terminal, and its internal structure diagram can be as follows: Figure 14As shown, the wafer pre-alignment device includes a processor, memory, communication interface, display screen, and input device connected via a system bus. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a wafer pre-alignment method. The display screen can be an LCD screen or an e-ink screen. The input device can be a touch layer covering the display screen, buttons, a trackball, or a touchpad mounted on the wafer pre-alignment device casing, or an external keyboard, touchpad, or mouse.

[0139] Those skilled in the art will understand that Figure 14 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the wafer pre-alignment to which the present application is applied. Specific wafer pre-alignment may include more or fewer components than shown in the figure, or combine certain components, or have different component arrangements.

[0140] In one embodiment, a wafer pre-alignment device is provided, including a memory and a controller. The memory stores a computer program, and the controller executes the computer program to perform the following steps: receiving linear data collected by a sensor, and determining the notch position of the wafer based on the linear data; the linear data is obtained by the sensor collecting data on the edge of the wafer when the rotating platform drives the wafer to rotate; analyzing the notch position of the wafer and preset parameters to determine the eccentric coordinates of the wafer; and adjusting the notch position of the wafer to the target position based on the eccentric coordinates of the wafer.

[0141] In one embodiment, when the processor executes the computer program, it further performs the following steps: establishing a coordinate system with the rotation center of the rotating platform as the origin; and calculating the eccentric coordinates of the wafer in the coordinate system by combining preset parameters and the notch position of the wafer.

[0142] In one embodiment, when the processor executes the computer program, it further performs the following steps: subtracting the linear data collected by the sensor one by one when the rotating platform rotates one revolution to obtain an adjacent data difference array; determining the angle between the wafer notch and the sensor in the coordinate system based on the peak and valley values ​​in the adjacent data difference array; the wafer notch position includes the angle between the wafer notch and the sensor.

[0143] In one embodiment, when the processor executes the computer program, it further implements the following steps: taking the rotation center of the rotating platform as the origin, and deflecting the line connecting the rotation center and the notch of the wafer by a set angle as the positive direction of the X-axis of the coordinate system, and establishing a coordinate system.

[0144] In one embodiment, when the processor executes the computer program, it further performs the following steps: determining the eccentric coordinates of the wafer in the coordinate system based on the set angle, the angle between the wafer notch and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor.

[0145] In one embodiment, when the processor executes the computer program, it also performs the following steps: calculating the eccentricity of the wafer based on the eccentric coordinates of the wafer; if the eccentricity of the wafer is within a preset range, controlling the rotating platform to rotate and adjusting the notch position of the wafer to the target angle.

[0146] In one embodiment, when the processor executes the computer program, it further implements the following steps: if the eccentricity of the wafer is not within a preset range, the wafer is moved so that the center of the wafer coincides with the rotation center, and the linear data collected by the receiving sensor is returned, and the notch position of the wafer is determined based on the linear data.

[0147] In one embodiment, when the processor executes the computer program, it further performs the following steps: determining the angle by which the positive eccentricity of the wafer rotates to the sensor direction based on the wafer's eccentricity coordinates; controlling the rotating platform to rotate so that the line connecting the wafer's center and the rotation center is in the same direction as the movement direction of the transport mechanism based on the angle by which the wafer's positive eccentricity rotates to the sensor direction; and controlling the transport mechanism to move the wafer based on the eccentricity distance so that the wafer's center coincides with the rotation center.

[0148] In one embodiment, when the processor executes the computer program, it further implements the following steps: if the abscissa of the eccentric coordinate of the wafer is zero, then the angle of rotation of the wafer from the positive eccentric direction to the sensor direction is obtained by summing the set angle and the notch distance of the wafer to the sensor; if the abscissa of the eccentric coordinate of the wafer is not zero, then the arctangent value is obtained by calculating the arctangent value based on the eccentric coordinate of the wafer, and the angle of rotation of the wafer from the positive eccentric direction to the sensor direction is obtained by summing the arctangent value, the set angle, and the notch distance of the wafer to the sensor.

[0149] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, it performs the following steps: receiving linear data collected by a sensor, and determining the notch position of the wafer based on the linear data; the linear data is obtained by the sensor collecting data on the edge of the wafer when the rotating platform drives the wafer to rotate; analyzing the notch position of the wafer and preset parameters to determine the eccentric coordinates of the wafer; and adjusting the notch position of the wafer to the target position based on the eccentric coordinates of the wafer.

[0150] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: establishing a coordinate system with the rotation center of the rotating platform as the origin; and calculating the eccentric coordinates of the wafer in the coordinate system by combining preset parameters and the notch position of the wafer.

[0151] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: subtracting the linear data collected by the sensor one by one when the rotating platform rotates one revolution to obtain an adjacent data difference array; determining the angle between the wafer notch and the sensor in the coordinate system based on the peak and valley values ​​in the adjacent data difference array; the wafer notch position includes the angle between the wafer notch and the sensor.

[0152] In one embodiment, when the computer program is executed by the processor, it further implements the following steps: taking the rotation center of the rotating platform as the origin, and deflecting the line connecting the rotation center and the notch of the wafer by a set angle as the positive direction of the X-axis of the coordinate system, and establishing a coordinate system.

[0153] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: determining the eccentric coordinates of the wafer in the coordinate system based on the set angle, the angle between the wafer notch and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor.

[0154] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: calculating the eccentricity of the wafer based on the eccentric coordinates of the wafer; if the eccentricity of the wafer is within a preset range, controlling the rotating platform to rotate and adjusting the notch position of the wafer to the target angle.

[0155] In one embodiment, when the computer program is executed by the processor, it further implements the following steps: if the eccentricity of the wafer is not within a preset range, the wafer is moved so that the center of the wafer coincides with the rotation center, and the linear data collected by the receiving sensor is returned, and the notch position of the wafer is determined based on the linear data.

[0156] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: determining the angle by which the positive eccentricity direction of the wafer rotates to the sensor direction based on the eccentricity coordinates of the wafer; controlling the rotation platform to rotate so that the line connecting the center of the wafer and the rotation center is in the same direction as the movement direction of the transport mechanism based on the angle by which the positive eccentricity direction of the wafer rotates to the sensor direction; and controlling the transport mechanism to move the wafer based on the eccentricity distance so that the center of the wafer coincides with the rotation center.

[0157] In one embodiment, when the computer program is executed by the processor, it further implements the following steps: if the abscissa of the eccentric coordinate of the wafer is zero, then the angle of rotation of the wafer from the positive eccentric direction to the sensor direction is obtained by summing the set angle and the notch distance of the wafer to the sensor; if the abscissa of the eccentric coordinate of the wafer is not zero, then the arctangent value is obtained by calculating the arctangent value based on the eccentric coordinate of the wafer, and the angle of rotation of the wafer from the positive eccentric direction to the sensor direction is obtained by summing the arctangent value, the set angle, and the notch distance of the wafer to the sensor.

[0158] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps: receiving linear data collected by a sensor, and determining the notch position of the wafer based on the linear data; the linear data is obtained by the sensor collecting data on the edge of the wafer when the rotating platform drives the wafer to rotate; analyzing the notch position of the wafer and preset parameters to determine the eccentric coordinates of the wafer; and adjusting the notch position of the wafer to the target position based on the eccentric coordinates of the wafer.

[0159] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: establishing a coordinate system with the rotation center of the rotating platform as the origin; and calculating the eccentric coordinates of the wafer in the coordinate system by combining preset parameters and the notch position of the wafer.

[0160] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: subtracting the linear data collected by the sensor one by one when the rotating platform rotates one revolution to obtain an adjacent data difference array; determining the angle between the wafer notch and the sensor in the coordinate system based on the peak and valley values ​​in the adjacent data difference array; the wafer notch position includes the angle between the wafer notch and the sensor.

[0161] In one embodiment, when the computer program is executed by the processor, it further implements the following steps: taking the rotation center of the rotating platform as the origin, and deflecting the line connecting the rotation center and the notch of the wafer by a set angle as the positive direction of the X-axis of the coordinate system, and establishing a coordinate system.

[0162] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: determining the eccentric coordinates of the wafer in the coordinate system based on the set angle, the angle between the wafer notch and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor.

[0163] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: calculating the eccentricity of the wafer based on the eccentric coordinates of the wafer; if the eccentricity of the wafer is within a preset range, controlling the rotating platform to rotate and adjusting the notch position of the wafer to the target angle.

[0164] In one embodiment, when the computer program is executed by the processor, it further implements the following steps: if the eccentricity of the wafer is not within a preset range, the wafer is moved so that the center of the wafer coincides with the rotation center, and the linear data collected by the receiving sensor is returned, and the notch position of the wafer is determined based on the linear data.

[0165] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: determining the angle by which the positive eccentricity direction of the wafer rotates to the sensor direction based on the eccentricity coordinates of the wafer; controlling the rotation platform to rotate so that the line connecting the center of the wafer and the rotation center is in the same direction as the movement direction of the transport mechanism based on the angle by which the positive eccentricity direction of the wafer rotates to the sensor direction; and controlling the transport mechanism to move the wafer based on the eccentricity distance so that the center of the wafer coincides with the rotation center.

[0166] In one embodiment, when the computer program is executed by the processor, it further implements the following steps: if the abscissa of the eccentric coordinate of the wafer is zero, then the angle of rotation of the wafer from the positive eccentric direction to the sensor direction is obtained by summing the set angle and the notch distance of the wafer to the sensor; if the abscissa of the eccentric coordinate of the wafer is not zero, then the arctangent value is obtained by calculating the arctangent value based on the eccentric coordinate of the wafer, and the angle of rotation of the wafer from the positive eccentric direction to the sensor direction is obtained by summing the arctangent value, the set angle, and the notch distance of the wafer to the sensor.

[0167] In one embodiment, a wafer inspection system is also provided, including a sensor, a rotating platform, a transport mechanism, and the aforementioned wafer pre-alignment device, with a controller connected to the sensor, the rotating platform, and the transport mechanism. The sensor is a linear sensor.

[0168] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0169] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0170] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer pre-alignment method, characterized in that, include: Receive linear data collected by the sensor, and determine the notch position of the wafer based on the linear data; The linear data is obtained by the sensor collecting data on the edge of the wafer when the rotating platform drives the wafer to rotate; The eccentric coordinates of the wafer are determined by analyzing the notch position and preset parameters. The notch position of the wafer is adjusted to the target position based on the wafer's eccentric coordinates; The step of analyzing the notch position of the wafer and preset parameters to determine the eccentric coordinates of the wafer includes: establishing a coordinate system with the rotation center of the rotating platform as the origin; and calculating the eccentric coordinates of the wafer in the coordinate system by combining the preset parameters and the notch position of the wafer. The preset parameters include the correspondence between the rotation angle of the rotating platform and the light-shielding distance measured by the sensor, the deflection angle of the line connecting the rotation center and the notch of the wafer, and the notch position of the wafer including the angle between the notch and the sensor; the calculation of the eccentric coordinates of the wafer in the coordinate system by combining the preset parameters and the notch position of the wafer includes: Based on the set angle, the angle between the wafer's notch and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor, the eccentric coordinates of the wafer in the coordinate system are determined.

2. The method according to claim 1, characterized in that, Based on the set angle, the angle between the wafer's notch and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor, the eccentric coordinates of the wafer in the coordinate system are determined, including: Calculate the eccentric coordinates (X, Y): Y=RA(α+γ+90)-RA(α+γ+270)=M(α+γ+90)-M(α+γ+270) X=RA(α+γ)-RA(α+γ+180)=M(α+γ)-M(α+γ+180) RA(θ) = L + M(θ); Where RA(θ) is the distance from the edge of the wafer to the rotation center, M(θ) is the light-blocking distance measured by the sensor when the rotating platform rotates by an angle θ, L is the distance from the rotation center of the rotating platform to the linear sensor; α is the angle between the wafer notch and the linear sensor, and γ is the set angle.

3. The method according to claim 2, characterized in that, Determining the notch location of the wafer based on the linear data includes: The linear data collected by the sensor during one revolution of the rotating platform are subtracted one by one to obtain the adjacent data difference array; The angle between the wafer notch and the sensor in the coordinate system is determined based on the peak and valley values ​​in the adjacent data difference array.

4. The method according to claim 3, characterized in that, The establishment of a coordinate system with the rotation center of the rotating platform as the origin includes: The coordinate system is established by taking the rotation center of the rotating platform as the origin and the deflection angle of the line connecting the rotation center and the notch of the wafer as the positive direction of the X-axis.

5. The method according to claim 4, characterized in that, When the rotating platform rotates by an angle θ, the light-blocking distance M(θ) measured by the sensor is k×A[i]+b; A[i] is the linear data set acquired by the sensor, k represents the relationship between the voltage value and the distance length, and b is the voltage value output by the linear sensor when no wafer is placed.

6. The method according to claim 4, characterized in that, The step of adjusting the notch position of the wafer to the target position based on the wafer's eccentric coordinates includes: The eccentricity of the wafer is calculated based on its eccentric coordinates. If the eccentricity of the wafer is within a preset range, the rotating platform is controlled to rotate, and the notch position of the wafer is adjusted to the target angle.

7. The method according to claim 6, characterized in that, After calculating the eccentricity of the wafer based on its eccentric coordinates, the method further includes: If the eccentricity of the wafer is not within the preset range, the wafer is moved so that its center coincides with the rotation center, and the linear data collected by the receiving sensor is returned. The notch position of the wafer is then determined based on the linear data.

8. The method according to claim 7, characterized in that, Moving the wafer to align its center with the rotation center includes: Based on the eccentric coordinates of the wafer, determine the angle by which the positive eccentric direction of the wafer is rotated to the sensor direction; Based on the angle at which the wafer rotates from the positive eccentric direction to the sensor direction, the rotating platform is controlled to rotate so that the line connecting the center of the wafer and the rotation center is in the same direction as the movement direction of the transport mechanism. The eccentricity is used to control the transport mechanism to move the wafer so that the center of the wafer coincides with the rotation center.

9. The method according to claim 8, characterized in that, The step of determining the angle by which the positive eccentricity direction of the wafer is rotated to the sensor direction based on the eccentricity coordinates of the wafer includes: If the abscissa of the eccentricity coordinate of the wafer is zero, then the angle of rotation of the wafer from the positive eccentricity direction to the sensor direction is obtained by summing the set angle and the angle of the wafer notch distance from the sensor. If the abscissa of the eccentric coordinate of the wafer is not zero, the arctangent value is calculated based on the arctangent coordinate of the wafer, and the arctangent value, the set angle, and the angle between the notch of the wafer and the sensor are summed to obtain the angle at which the positive eccentric direction of the wafer rotates to the sensor direction.

10. A wafer pre-alignment device, characterized in that, include: The data receiving module is used to receive linear data collected by the sensor and determine the notch position of the wafer based on the linear data; the linear data is obtained by the sensor collecting data on the edge of the wafer when the rotating platform drives the wafer to rotate; The data processing module is used to analyze the notch position of the wafer and preset parameters to determine the eccentric coordinates of the wafer. The pre-alignment module is used to adjust the notch position of the wafer to the target position according to the eccentric coordinates of the wafer; The data processing module establishes a coordinate system with the rotation center of the rotating platform as the origin; and calculates the eccentric coordinates of the wafer in the coordinate system by combining the preset parameters and the notch position of the wafer. The preset parameters include the correspondence between the rotation angle of the rotating platform and the light-shielding distance measured by the sensor, the deflection angle of the line connecting the rotation center and the notch of the wafer, and the notch position of the wafer including the angle between the notch of the wafer and the sensor. The data processing module determines the eccentric coordinates of the wafer in the coordinate system based on the preset angle, the angle between the notch of the wafer and the sensor, and the correspondence between the rotation angle of the rotation center and the light-shielding distance measured by the sensor.

11. A wafer pre-alignment device, comprising a memory and a controller, wherein the memory stores a computer program, characterized in that, When the controller executes the computer program, it implements the steps of the method according to any one of claims 1 to 9.

12. A wafer inspection system, characterized in that, The device includes a sensor, a rotating platform, a transport mechanism, and the wafer pre-alignment equipment as described in claim 11, wherein the controller is connected to the sensor, the rotating platform, and the transport mechanism.

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