Substrate packaging structure and method of manufacturing the same

Abstract

The application provides a substrate packaging structure and a preparation method thereof, and relates to the technical field of semiconductor packaging. The substrate packaging structure comprises a substrate, a first heat dissipation support layer, a first chip, a first plastic package and external solder balls. The first heat dissipation support layer is attached to the surface of the substrate and plays a role of structural support, thereby preventing the substrate from warping. A heat dissipation layer is arranged in the substrate and connected with the first heat dissipation support layer, so that the heat generated in the substrate can be transmitted to the first heat dissipation support layer, thereby achieving heat dissipation. Compared with the prior art, the substrate packaging structure provided by the application can effectively solve the problem of substrate warping, effectively prevent the substrate from warping during the mounting operation and plastic packaging, ensure the structural stability of the device, and simultaneously achieve good heat dissipation function and improve the heat dissipation performance of the device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically, to a substrate packaging structure and its preparation method. Background Technology

[0002] With the rapid development of the semiconductor industry, the choice of packaging substrate materials is becoming thinner and thinner. Core-less substrates are usually used to reduce the substrate thickness, which means removing the internal core board to achieve the purpose of thinning the substrate. However, with the removal of the core board, the substrate has poor support and is prone to deformation, resulting in excessive warping of the substrate package. Its packaging structure defects are reflected in problems such as flip chip solder ball bridging and delamination between the molded body and the substrate.

[0003] Traditional packaging processes can utilize carriers to support substrate mounting operations and address substrate warpage during reflow or baking. However, this issue cannot be resolved during molding. Typically, a more suitable material with a suitable coefficient of thermal expansion is chosen to address post-molding warpage, but the results are often unsatisfactory. Furthermore, conventional substrate structures have poor heat dissipation, making it difficult to transfer internal heat to the outside. Summary of the Invention

[0004] The objectives of this invention include, for example, providing a substrate packaging structure that can effectively solve the problem of substrate warping, effectively prevent substrate warping during mounting and molding processes, ensure the structural stability of the device, and simultaneously achieve good heat dissipation function, thereby improving the heat dissipation performance of the device.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, the present invention provides a substrate packaging structure, comprising:

[0007] A substrate having a mounting area;

[0008] A first heat dissipation support layer is disposed on the substrate and surrounds the mounting area.

[0009] A first chip, wherein the first chip is mounted in the mounting area;

[0010] A first molding compound is disposed in the mounting area and covers the first chip;

[0011] External solder balls are disposed on the surface of the substrate away from the first chip.

[0012] The first heat dissipation support layer is attached to the surface of the substrate to prevent the substrate from warping. The substrate has a circuit layer and a heat dissipation layer. The circuit layer is electrically connected to the first chip and the external solder balls. The heat dissipation layer is connected to the first heat dissipation support layer to transfer the heat generated in the substrate to the first heat dissipation support layer.

[0013] In an optional embodiment, the mounting area is provided with connection pads, and the first chip is flip-mounted in the mounting area and connected to the connection pads.

[0014] In an optional embodiment, the substrate is further provided with a heat dissipation pad, the heat dissipation pad is connected to the heat dissipation layer, and the first heat dissipation support layer covers the heat dissipation pad.

[0015] In an optional embodiment, the first heat dissipation support layer is a metal layer, and a marking groove is provided on the side surface of the metal layer away from the substrate.

[0016] In an optional embodiment, the height of the metal layer relative to the substrate is equal to the height of the first molding compound relative to the substrate, so that the metal layer and the first molding compound are flush.

[0017] In an optional embodiment, the height of the metal layer relative to the substrate is greater than the height of the first molding compound relative to the substrate, and a coating layer is provided on the side of the first molding compound away from the substrate, the coating layer being made of a material that can transmit electromagnetic waves.

[0018] In an optional embodiment, an antenna pattern is provided on the metal layer and an antenna layer is formed thereon. A grounding pad is also provided on the substrate, and the antenna layer is connected to the grounding pad.

[0019] In an optional embodiment, the first heat dissipation support layer is a ceramic layer, and an antenna layer is disposed on the substrate. An antenna opening is formed on the ceramic layer to expose the antenna layer.

[0020] In an optional embodiment, a second heat dissipation support layer is provided on the surface of the substrate away from the first chip, and the second heat dissipation support layer surrounds the external solder ball.

[0021] In an optional embodiment, both the first heat dissipation support layer and the second heat dissipation support layer are metal layers, and the surface of the second heat dissipation support layer away from the substrate is provided with an identification groove.

[0022] Secondly, embodiments of the present invention provide a method for preparing a substrate packaging structure, used to prepare the aforementioned substrate packaging structure, the preparation method comprising:

[0023] Provide a substrate;

[0024] A protective film layer is provided in the mounting area of ​​the substrate;

[0025] A first heat dissipation support layer is formed in a region on the substrate where the protective film layer is not provided, so that the first heat dissipation support layer surrounds the mounting area.

[0026] Remove the protective film layer;

[0027] The first chip is mounted in the mounting area;

[0028] A first molding compound is formed in the mounting area, and the first molding compound covers the first chip;

[0029] Balls are placed on the side of the substrate away from the first chip to form external solder balls;

[0030] The first heat dissipation support layer is attached to the surface of the substrate to prevent the substrate from warping. The substrate has a circuit layer and a heat dissipation layer. The circuit layer is electrically connected to the first chip and the external solder balls. The heat dissipation layer is connected to the first heat dissipation support layer to transfer the heat generated in the substrate to the first heat dissipation support layer.

[0031] The beneficial effects of the embodiments of the present invention include, for example:

[0032] The substrate packaging structure and its fabrication method provided in this invention involve setting a first heat dissipation support layer around the mounting area of ​​the substrate, mounting a first chip on the mounting area, molding the chip in the mounting area to form a first encapsulated body, and finally attaching solder balls to the back of the substrate. The first heat dissipation support layer is attached to the surface of the substrate, providing structural support and preventing substrate warping. Furthermore, a heat dissipation layer is provided in the substrate and connected to the first heat dissipation support layer, transferring heat generated in the substrate to the first heat dissipation support layer for heat dissipation. Compared to existing technologies, the substrate packaging structure provided by this invention effectively solves the problem of substrate warping, effectively preventing warping during mounting and molding processes, ensuring the structural stability of the device, and achieving good heat dissipation, thus improving the device's heat dissipation performance. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the substrate packaging structure provided in the first embodiment of the present invention;

[0035] Figures 2 to 8 A process flow diagram of the method for fabricating the substrate packaging structure provided in the first embodiment of the present invention;

[0036] Figure 9 This is a schematic diagram of the substrate packaging structure provided in the second embodiment of the present invention;

[0037] Figure 10 This is a schematic diagram of the substrate packaging structure provided in the third embodiment of the present invention;

[0038] Figure 11 This is a schematic diagram of the substrate packaging structure provided in the fourth embodiment of the present invention;

[0039] Figure 12 This is a schematic diagram of the substrate packaging structure provided in the fifth embodiment of the present invention;

[0040] Figure 13 This is a schematic diagram of the substrate packaging structure provided in the sixth embodiment of the present invention;

[0041] Figure 14 This is a schematic diagram of the substrate packaging structure provided in the seventh embodiment of the present invention;

[0042] Figure 15 This is a schematic diagram of the substrate packaging structure provided in the eighth embodiment of the present invention;

[0043] Figure 16 This is a schematic diagram of the substrate packaging structure in another preferred embodiment of the present invention.

[0044] Figure label:

[0045] 100 - Substrate packaging structure; 110 - Substrate; 111 - Circuit layer; 113 - Heat dissipation layer; 115 - Connection pad; 117 - Heat dissipation pad; 119 - Ground pad; 120 - First heat dissipation support layer; 121 - Identification groove; 123 - Antenna layer; 125 - Antenna opening; 130 - First chip; 140 - First molding compound; 141 - Coating layer; 150 - External solder ball; 160 - Second heat dissipation support layer; 170 - Stacked module; 171 - Multilayer circuit board; 173 - Second chip; 175 - Second molding compound; 177 - Connection solder ball. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0048] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0049] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0050] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0051] As disclosed in the background section, existing substrate structures typically rely solely on carrier structures to ensure low warpage. This approach is complex, requiring additional bonding and peeling processes, and fails to address the warpage issue after molding. Specifically, the process after carrier peeling cannot guarantee that the warpage is within a reasonable range, thus affecting the overall device structural stability. Furthermore, conventional substrate structures often have an internal dielectric layer, making heat transfer difficult and resulting in poor heat dissipation.

[0052] Furthermore, most packaged products need to meet radio frequency functions. The thinner the coreless substrate, the fewer the number of wiring layers there are. This makes it difficult to design antenna lines inside the substrate, or causes electromagnetic interference between antenna lines and other wiring layers or between chips, which is a common problem for various companies.

[0053] Meanwhile, in conventional module electromagnetic shielding manufacturing methods, after forming metal pillars by wire bonding on the same substrate, metal wire bonding is carried out again. The adhesive coating of the metal pillars can cause conductive adhesive to overflow into the effective area of ​​the chip pad on the substrate, resulting in chip soldering failure. At the same time, the substrate surface needs to be designed with two rows of metal pillars and two rows of grounding rings, which greatly increases the design space on the substrate surface and makes the device size larger, which is not conducive to the miniaturization of the device.

[0054] To address the aforementioned problems, this invention provides a substrate packaging structure and its fabrication method. It should be noted that, unless otherwise specified, the features in the embodiments of this invention can be combined with each other.

[0055] First Embodiment

[0056] See Figure 1 The present invention provides a substrate packaging structure 100, which can effectively solve the problem of substrate 110 warping. It can effectively prevent substrate 110 warping during mounting and molding processes, ensuring the structural stability of the device, while achieving good heat dissipation function and improving the heat dissipation performance of the device.

[0057] The substrate packaging structure 100 provided in this embodiment includes a substrate 110, a first heat dissipation support layer 120, a first chip 130, a first molding compound 140, and external solder balls 150. The substrate 110 has a mounting area; the first heat dissipation support layer 120 is disposed on the substrate 110 and surrounds the mounting area; the first chip 130 is mounted in the mounting area; the first molding compound 140 is disposed in the mounting area and covers the first chip 130; the external solder balls 150 are disposed on the surface of the substrate 110 away from the first chip 130. The first heat dissipation support layer 120 is attached to the surface of the substrate 110 to prevent warping of the substrate 110. The substrate 110 has a circuit layer 111 and a heat dissipation layer 113. The circuit layer 111 is electrically connected to both the first chip 130 and the external solder balls 150. The heat dissipation layer 113 is connected to the first heat dissipation support layer 120 to transfer heat generated in the substrate 110 to the first heat dissipation support layer 120.

[0058] In this embodiment, a first heat dissipation support layer 120 is disposed around the mounting area of ​​the substrate 110. Then, a first chip 130 is mounted on the mounting area, and a first encapsulation body 140 is formed in the mounting area. Finally, solder balls are formed on the back side of the substrate 110. The first heat dissipation support layer 120 is attached to the surface of the substrate 110, providing structural support and preventing warping of the substrate 110. Furthermore, a heat dissipation layer 113 is disposed in the substrate 110, connected to the first heat dissipation support layer 120, which transfers heat generated in the substrate 110 to the first heat dissipation support layer 120, thereby achieving heat dissipation.

[0059] It is worth noting that in this embodiment, after the first chip 130 is mounted in the mounting area, it can be directly electrically connected to the circuit layer 111, and the external solder pads are also connected to the circuit layer 111, thereby realizing the device's outward output point. In particular, to avoid electrical connection between the circuit layer 111 and the first heat dissipation support layer 120, the heat dissipation layer 113 can be electrically isolated from the circuit layer 111.

[0060] It should be noted that in this embodiment, the first heat dissipation support layer 120 not only serves as a support but also as a heat dissipation layer. The first encapsulation body 140 is not covered by the first heat dissipation support layer 120, allowing heat to escape directly from the first heat dissipation support layer 120, thereby achieving a good heat dissipation effect.

[0061] In this embodiment, a mounting area is provided with a connection pad 115. The first chip 130 is flip-chip mounted on the mounting area and connected to the connection pad 115. Specifically, the connection pad 115 is connected to the circuit layer 111. The bottom side of the first chip 130 is provided with microbumps, which are connected to the connection pad 115 through the microbumps, thereby realizing the electrical connection between the first chip 130 and the circuit layer 111. Of course, in other preferred embodiments of the present invention, the first chip 130 can also adopt a top-mount structure, that is, the back side of the first chip 130 is mounted on the mounting area, and the first chip 130 is electrically connected to the connection pad 115 by wire bonding. The mounting method of the first chip 130 is not specifically limited here.

[0062] In this embodiment, a heat dissipation pad 117 is also provided on the substrate 110. The heat dissipation pad 117 is connected to the heat dissipation layer 113, and the first heat dissipation support layer 120 covers the heat dissipation pad 117. Specifically, both the heat dissipation layer 113 and the heat dissipation pad 117 can be made of a metal with good thermal conductivity. The heat dissipation layer 113 can directly transfer heat to the first heat dissipation support layer 120 through the heat dissipation pad 117, achieving good heat dissipation function. Of course, the heat dissipation layer 113 can also be made of ceramic material. By combining ceramic material with the metal heat dissipation pad 117, good heat dissipation capability can also be achieved.

[0063] In this embodiment, the first heat dissipation support layer 120 is a metal layer, and a marking groove 121 is provided on the surface of the metal layer away from the substrate 110. Specifically, the first heat dissipation support layer 120 can be made of copper, aluminum, or gold, etc., using the metal layer to enhance the structural strength of the substrate 110, thereby reducing package warpage. Furthermore, the material of the first heat dissipation support layer 120 can be the same as the material of the heat dissipation pad 117, which facilitates the fabrication of the first heat dissipation support layer 120 and improves the heat dissipation of the package structure. In addition, the marking groove 121 can be an engraving or a directional mark. Since the first heat dissipation support layer 120 is an exposed structure, during the laser marking stage, characters can be directly engraved on the surface of the first heat dissipation support layer 120 to form the marking groove 121. By engraving on the metal layer, the problem of easily penetrating the plastic package to the chip surface when engraving on the surface of the plastic package in traditional processes can be avoided, effectively protecting the first chip 130. Furthermore, engraving the marking groove 121 on the surface of the metal layer can reduce the proportion of the metal layer, thereby reducing the local thickness of the metal layer and reducing the overall weight.

[0064] It is worth noting that the heat dissipation pad 117 can be formed together with the connecting pad 115, and there is no electrical connection between the connecting pad 115 and the heat dissipation pad 117. By setting the heat dissipation pad 117, heat dissipation can be achieved on the one hand, and on the other hand, the bonding force during sputtering can be improved when the first heat dissipation support layer 120 is formed, thus avoiding delamination between the first heat dissipation support layer 120 and the substrate 110.

[0065] In this embodiment, the height of the first molding compound 140 relative to the substrate 110 is greater than the height of the first heat dissipation support layer 120 relative to the substrate 110, allowing the first molding compound 140 to protrude and ensuring that the first heat dissipation support layer 120 is relatively thin, thus reducing the overall weight. Furthermore, the first heat dissipation support layer 120 covers the first molding compound 140 and joins the gap between the first heat dissipation support layer 120 and the substrate 110, thereby effectively improving the bonding force between the first molding compound 140 and the substrate 110 and preventing delamination of the molding compound.

[0066] In this embodiment, the first heat dissipation support layer 120 can effectively reduce the stress impact of the injection molding machine mold on the substrate 110 during molding, reduce the risk of substrate 110 breakage, and effectively mitigate the warping problem of substrate 110. The metal layer can be combined with the sidewall of the molding compound to improve the bonding force between the first molding compound 140 and the substrate 110, thereby preventing the delamination problem between the molding compound and the substrate 110 in traditional processes. Furthermore, the first heat dissipation support layer 120 can reduce the fluidity of the molding compound, making it easier to form a stable first molding compound 140.

[0067] This embodiment also provides a method for fabricating a substrate packaging structure 100, which includes the following steps:

[0068] S1: Provide a substrate 110.

[0069] Specifically, see Figure 2 First, a substrate 110 with wiring pads set can be provided. The substrate 110 has a circuit layer 111 and a heat dissipation layer 113. The surface of the substrate 110 has a mounting area with a connection pad 115, and a heat dissipation pad 117 is provided outside the mounting area.

[0070] S2: A protective film layer is provided in the mounting area of ​​the substrate 110.

[0071] Specifically, see Figure 3 A protective film layer is applied using a laminating machine to cover the connection pads 115 on the substrate 110 and to completely cover the mounting area.

[0072] S3: A first heat dissipation support layer 120 is formed in a region on the substrate 110 where no protective film layer is provided, so that the first heat dissipation support layer 120 surrounds the mounting area.

[0073] Specifically, see Figure 4 Using a sputtering process, metal is sputtered onto an unshielded area of ​​the substrate 110 to form a first heat dissipation support layer 120, which covers the heat dissipation pads 117. During sputtering, the presence of the heat dissipation pads 117 increases the bonding strength of the metal materials and facilitates heat dissipation. The first heat dissipation support layer 120 is attached to the surface of the substrate 110 to prevent warping of the substrate 110.

[0074] S4: Remove the protective film layer.

[0075] Specifically, see Figure 5 The protective film layer can be removed using chemical cleaning or physical methods to form a substrate 110 with a first heat dissipation support layer 120. The area not covered by the first heat dissipation support layer 120 is the mounting area. The first heat dissipation support layer 120 formed on the substrate 110 can improve the strength of the substrate 110 and prevent warping problems caused by the inconsistency of thermal expansion coefficients of various materials in the subsequent reflow or baking process.

[0076] S5: Mount the first chip 130 in the mounting area.

[0077] Specifically, see Figure 6Using surface mount technology, the first chip 130 is flip-chip mounted on the mounting area. The microbumps on the bottom of the first chip 130 are connected to the connection pads 115 in the mounting area, enabling the first chip 130 to be electrically connected to the circuit layer 111. After mounting the first chip 130, it can be fixed by reflow.

[0078] S6: A first molding compound 140 is formed in the mounting area, and the first molding compound 140 covers the first chip 130.

[0079] Specifically, see Figure 7 The molding process can be used, specifically selective molding, to encapsulate the mounting area. The mold avoids the position of the first heat dissipation support layer 120, and the molding compound is molded onto the first chip 130. It is important to note that the metal layer effectively reduces the stress exerted on the substrate 110 by the injection molding machine mold during molding, reducing the risk of substrate 110 breakage and warping. The enclosure of the first heat dissipation support layer 120 effectively reduces liquid spillage during molding.

[0080] S7: Place balls on the side of the substrate 110 away from the first chip 130 and form external solder balls 150.

[0081] Specifically, see Figure 8 After the molding process is completed, laser engraving can be used to print text on the surface of the first heat dissipation support layer 120. Then, a ball-mounting process is performed on the back side to form external solder balls 150, which can be solder balls. After ball mounting, a cutting process is used. A first cut is made using a soft rubber cutter, cutting through the metal layer down to the substrate 110. A second cut is then performed using a metal cutter to separate the substrate 110 into individual balls. Please refer to [link to relevant documentation]. Figure 1 Of course, laser cutting can also be used to cut the material in one go.

[0082] The circuit layer 111 is electrically connected to both the first chip 130 and the external solder ball 150, and the heat dissipation layer 113 is connected to the first heat dissipation support layer 120 to transfer the heat generated in the substrate 110 to the first heat dissipation support layer 120.

[0083] In summary, this embodiment provides a substrate packaging structure 100 and its fabrication method. A first heat dissipation support layer 120 is disposed around the mounting area of ​​a substrate 110. A first chip 130 is then mounted on the mounting area, followed by molding to form a first encapsulated body 140. Finally, solder balls are formed on the back side of the substrate 110. The first heat dissipation support layer 120 is attached to the surface of the substrate 110, providing structural support and preventing warping of the substrate 110. Furthermore, a heat dissipation layer 113 is disposed in the substrate 110, connected to the first heat dissipation support layer 120, which transfers heat generated in the substrate 110 to the first heat dissipation support layer 120, thereby achieving heat dissipation. Compared to existing technologies, the substrate packaging structure 100 provided in this embodiment effectively solves the problem of substrate 110 warping, effectively preventing warping during mounting and molding processes, ensuring the structural stability of the device, and achieving good heat dissipation, thus improving the device's heat dissipation performance.

[0084] Second Embodiment

[0085] See Figure 9 This embodiment provides a substrate packaging structure 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brevity, any parts not mentioned in this embodiment can be referred to the corresponding content in the first embodiment.

[0086] In this embodiment, the height of the metal layer relative to the substrate 110 is equal to the height of the first molding compound 140 relative to the substrate 110, so that the metal layer and the first molding compound 140 are flush. Specifically, the height of the first heat dissipation support layer 120 is the same as that of the first molding compound 140. During molding, liquid printing can be used for molding, using the first heat dissipation support layer 120 as a support end, and printing molding liquid on the chip to encapsulate the structure and form the first molding compound 140. It should be emphasized here that the first heat dissipation support layer 120 and the molding compound are at the same height, which can greatly improve the bonding force between the first heat dissipation support layer 120 and the first molding compound 140.

[0087] In this embodiment, the thickness of the first heat dissipation support layer 120 is thicker than that of the first embodiment, and the metal layer improves heat dissipation. The liquid stencil printing method is adopted, which has a lower process cost and can avoid the pressing problem caused by the injection molding process.

[0088] Third Embodiment

[0089] See Figure 10 This embodiment provides a substrate packaging structure 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brevity, any parts not mentioned in this embodiment can be referred to the corresponding content in the first embodiment.

[0090] In this embodiment, the height of the metal layer relative to the substrate 110 is greater than the height of the first molding compound 140 relative to the substrate 110, and a coating layer 141 is provided on the side of the first molding compound 140 away from the substrate 110. The coating layer 141 is made of a material that can transmit electromagnetic waves.

[0091] In this embodiment, the height of the first molding compound 140 is less than the height of the first heat dissipation support layer 120, thereby forming a groove on the upper part of the first chip 130, and then pressing a coating layer 141 into the groove. At the same time, a grounding pad 119 is also provided on the substrate 110, and the first heat dissipation support layer 120 is connected to the grounding pad 119 to achieve grounding. The grounding pad 119 can also serve as a heat dissipation pad 117.

[0092] It is worth noting that in this embodiment, a metal layer is used as a fence structure and is connected to the grounding pad 119 on the substrate 110 to achieve an electromagnetic shielding effect. The coating layer 141 can be made of a material that can penetrate electromagnetic waves (such as glass, ABF film, or polymer thermal conductive film), which can reduce the dielectric constant of the material on the upper part of the first chip 130, allowing electromagnetic waves to penetrate and transmit better. The metal layer, as a fence structure, can prevent electromagnetic wave transmission between adjacent chips and play a role in partitioned shielding.

[0093] It should be noted that in this embodiment, there can be two first chips 130. The two first chips 130 can be time-of-flight (TOF) structure chips, which calculate the transmission of electromagnetic waves to the object and then reflect them. For example, the first chip is the chip that emits electromagnetic waves, and the second chip is the structure chip, so that the electromagnetic waves are reflected to the second chip after they touch the object.

[0094] Fourth embodiment

[0095] See Figure 11 This embodiment provides a substrate packaging structure 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brevity, any parts not mentioned in this embodiment can be referred to the corresponding content in the first embodiment.

[0096] In this embodiment, an antenna pattern is provided on the metal layer, and an antenna layer 123 is formed thereon. A grounding pad 119 is also provided on the substrate 110, and the antenna layer 123 is connected to the grounding pad 119. Specifically, the surface of the first heat dissipation support layer 120 is provided with an antenna pattern, and the metal layer is connected to the grounding pad 119 to achieve grounding. The grounding pad 119 can also serve as a heat dissipation pad 117.

[0097] In this embodiment, the antenna is made of a metal layer. An antenna pattern is formed on the metal layer, creating an antenna layer 123. This antenna layer 123 is connected to a feedback point on the substrate 110, serving as a radio frequency signal transmission antenna. By using a metal layer as the antenna layer 123, the proportion of metal material on the surface of the substrate 110 is reduced, resulting in a better match between the thermal expansion coefficients of the metal layer and the packaging structure, thus reducing warpage of the packaging structure. Here, a metal layer is used to reduce warpage, while the antenna structure is placed externally. The antenna transmission utilizes the gain of the metal material.

[0098] It is worth noting that in this embodiment, when the marking groove 121 is designed on the antenna layer 123, there is no separation between the marking groove 121 and the antenna structure to prevent affecting the antenna structure pattern layer. Alternatively, the marking groove 121 can be designed on the encapsulation.

[0099] Fifth embodiment

[0100] See Figure 12 This embodiment provides a substrate packaging structure 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brevity, any parts not mentioned in this embodiment can be referred to the corresponding content in the first embodiment.

[0101] In this embodiment, the first heat dissipation support layer 120 is a ceramic layer, and an antenna layer 123 is disposed on the substrate 110. An antenna opening 125 is formed on the ceramic layer to expose the antenna layer 123. Specifically, the metal material in the first embodiment is replaced with a ceramic material, which is a non-conductive material. The substrate 110 is designed with an antenna pattern, and the ceramic material serves to enhance antenna transmission and provide anti-interference capabilities. Furthermore, the ceramic material has higher strength. The antenna opening 125 on the first heat dissipation support layer 120 exposes the antenna layer 123 on the substrate 110, and the ceramic material can also enhance structural strength. Moreover, the ceramic material has better heat dissipation, a smaller coefficient of thermal expansion compared to the metal material, and better material matching, resulting in better warpage suppression.

[0102] Sixth Embodiment

[0103] See Figure 13 This embodiment provides a substrate packaging structure 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brevity, any parts not mentioned in this embodiment can be referred to the corresponding content in the first embodiment.

[0104] In this embodiment, a second heat dissipation support layer 160 is provided on the surface of the substrate 110 away from the first chip 130, and the second heat dissipation support layer 160 surrounds the external solder balls 150. Specifically, the second heat dissipation support layer 160 exposes the external solder balls 150 to the outside, thereby avoiding affecting the soldering of the external solder balls 150.

[0105] In this embodiment, both the first heat dissipation support layer 120 and the second heat dissipation support layer 160 are made of metal materials. The structure of the double-sided metal layer can further improve the structural strength, prevent warping, and improve the heat dissipation effect.

[0106] In this embodiment, a marking groove 121 is provided on the side of the second heat dissipation support layer 160 away from the substrate 110. Specifically, the marking groove 121 can be designed on the surface of the second heat dissipation support layer 160. After the external solder balls 150 are soldered, the marking information can be effectively hidden to prevent leakage and wear.

[0107] It should be emphasized that a double-sided structure can be adopted in all five embodiments. When the first heat dissipation support layer 120 is designed with an antenna, the marking groove 121 can also be designed on the second heat dissipation support layer 160, which can effectively improve the utilization rate of the antenna pattern structure.

[0108] Seventh Embodiment

[0109] See Figure 14 This embodiment provides a substrate packaging structure 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brevity, any parts not mentioned in this embodiment can be referred to the corresponding content in the first embodiment.

[0110] Furthermore, in this embodiment, an antenna layer 123 can also be disposed on the first heat dissipation support layer 120 and the second heat dissipation support layer 160, and the antenna layer 123 is grounded through the grounding pad 119. By setting a double-sided antenna layer 123, a better signal transmission effect can be achieved.

[0111] Eighth embodiment

[0112] See Figure 15 This embodiment provides a substrate packaging structure 100, whose basic structure, principle and technical effects are the same as those of the first embodiment or the fifth embodiment. For the sake of brevity, any parts not mentioned in this embodiment can be referred to the corresponding content in the first embodiment or the fifth embodiment.

[0113] In this embodiment, the substrate packaging structure 100 further includes a stacking module 170, which includes a multilayer circuit board 171, a second chip 173, and a second molding compound 175. The multilayer circuit board 171 is disposed on the side of the first molding compound 140 away from the substrate 110. The second chip 173 is mounted on the side of the multilayer circuit board 171 away from the first molding compound 140. The second molding compound 175 is disposed on the side of the multilayer circuit board 171 away from the first molding compound 140 and covers the second chip 173. A connecting solder ball 177 is also provided on the side of the multilayer circuit board 171 near the substrate 110. The connecting solder ball 177 penetrates the first heat dissipation support layer 120 and is connected to the substrate 110.

[0114] Specifically, the first heat dissipation support layer 120 is a ceramic layer, and an antenna layer 123 is disposed on the substrate 110. An antenna opening 125 is formed in the ceramic layer to expose the antenna layer 123. By adopting a stacked structure, and by using a ceramic material for the first heat dissipation support layer 120, the warpage of the stacked structure can be adjusted. Simultaneously, slots can be made in the first heat dissipation support layer 120 to achieve the connection between the solder ball 177 and the substrate 110.

[0115] In this embodiment, the projection of the multilayer circuit board 171 onto the substrate 110 is spaced apart from the antenna opening 125, so that the antenna opening 125 is exposed on the multilayer circuit board 171. Specifically, in the horizontal direction, the width of the multilayer circuit board 171 should be smaller than the width of the line connecting the antenna openings 125 on both sides, so that the antenna opening 125 can be exposed, ensuring the transmission effect of the antenna layer 123.

[0116] Further, see Figure 16 In other preferred embodiments of the present invention, the thickness of the first heat dissipation support layer 120 may also be increased, and the first heat dissipation support layer 120 may be flush with the center of the side wall of the multilayer circuit board 171, thereby providing good protection for the welding structure under the multilayer circuit board 171.

[0117] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A substrate packaging structure, characterized in that, include: A substrate having a mounting area; A first heat dissipation support layer is disposed on the substrate and surrounds the mounting area. A first chip, wherein the first chip is mounted in the mounting area; A first molding compound is disposed in the mounting area and covers the first chip; External solder balls are disposed on the surface of the substrate away from the first chip. The first heat dissipation support layer is attached to the surface of the substrate to prevent the substrate from warping. The substrate is provided with a circuit layer and a heat dissipation layer. The circuit layer is electrically connected to the first chip and the external solder balls. The heat dissipation layer is connected to the first heat dissipation support layer to transfer the heat generated in the substrate to the first heat dissipation support layer. The first heat dissipation support layer is a ceramic layer. An antenna layer is disposed on the substrate, and an antenna opening is formed on the ceramic layer to expose the antenna layer. The substrate packaging structure further includes a stacking module, which includes a multilayer circuit board, a second chip, and a second molding compound. The multilayer circuit board is disposed on the side of the first molding compound away from the substrate. The second chip is mounted on the side of the multilayer circuit board away from the first molding compound. The second molding compound is disposed on the side of the multilayer circuit board away from the first molding compound and covers the second chip. A connecting solder ball is also disposed on the side of the multilayer circuit board near the substrate. The connecting solder ball penetrates the first heat dissipation support layer and is connected to the substrate. The projection of the multilayer circuit board onto the substrate is spaced apart from the antenna opening, so that the antenna opening is exposed on the multilayer circuit board.

2. The substrate packaging structure according to claim 1, characterized in that, The mounting area is provided with connection pads, and the first chip is flip-mounted in the mounting area and connected to the connection pads.

3. The substrate packaging structure according to claim 1, characterized in that, The substrate is further provided with heat dissipation pads, which are connected to the heat dissipation layer, and the first heat dissipation support layer covers the heat dissipation pads.

4. The substrate packaging structure according to any one of claims 1-3, characterized in that, A second heat dissipation support layer is provided on the side of the substrate away from the first chip, and the second heat dissipation support layer surrounds the external solder ball.

5. A method for fabricating a substrate packaging structure, characterized in that, The method for preparing the substrate packaging structure as described in claim 1 includes: Provide a substrate; A protective film layer is provided in the mounting area of ​​the substrate; A first heat dissipation support layer is formed in a region on the substrate where the protective film layer is not provided, so that the first heat dissipation support layer surrounds the mounting area. Remove the protective film layer; The first chip is mounted in the mounting area; A first molding compound is formed in the mounting area, and the first molding compound covers the first chip; Balls are placed on the side of the substrate away from the first chip to form external solder balls; The first heat dissipation support layer is attached to the surface of the substrate to prevent the substrate from warping. The substrate has a circuit layer and a heat dissipation layer. The circuit layer is electrically connected to the first chip and the external solder balls. The heat dissipation layer is connected to the first heat dissipation support layer to transfer the heat generated in the substrate to the first heat dissipation support layer.

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