Element substrate and method for manufacturing the same

Abstract

A component substrate and a method for manufacturing the same are disclosed. The component substrate includes a circuit substrate, a first side trace, a package structure, and a second side trace. The first side trace extends from a first surface of the circuit substrate along a side surface of the circuit substrate to a second surface of the circuit substrate. The package structure is located on the first surface and covers the first side trace on the first surface. The second side trace extends from the package structure to the first side trace located on the side surface of the circuit substrate and the second surface.

Description

Technical Field

[0001] This invention relates to a component substrate and its manufacturing method. Background Technology

[0002] In existing display panels, to reduce the bezel width, some chips and circuitry are typically located on the back of the panel. Generally, the driver chip is integrated onto a flexible circuit board using thin-film flip-chip packaging, and then the flexible circuit board is bonded to the front pads of the pixel array substrate. The flexible circuit board can be bent to the back of the pixel array substrate, thereby placing the driver chip on the back of the pixel array substrate. However, even when the flexible circuit board is bent to the back of the pixel array substrate, it cannot completely conform to the sides of the pixel array substrate after bending, resulting in the final display panel still retaining a certain bezel width. Summary of the Invention

[0003] This invention provides a component substrate and its manufacturing method, which can improve the problem caused by damage to side traces.

[0004] At least one embodiment of the present invention provides a component substrate. The component substrate includes a circuit board, a first side trace, a package structure, and a second side trace. The first side trace extends from a first surface of the circuit board along a side surface of the circuit board to a second surface of the circuit board. The package structure is located on the first surface and covers the first side trace on the first surface. The second side trace extends from the package structure to the first side trace located on the side surface of the circuit board and the second surface.

[0005] At least one embodiment of the present invention provides a method for manufacturing a component substrate, comprising the following steps: forming a first side trace on a circuit substrate, wherein the first side trace extends from a first surface of the circuit substrate along a side surface of the circuit substrate to a second surface of the circuit substrate; forming a package structure on a first surface, wherein the package structure covers the first side trace on the first surface, and wherein the first side trace is damaged before or after the formation of the package structure; forming a second side trace to repair the damaged first side trace, wherein the second side trace extends from the package structure to the first side trace located on the side surface and the second surface.

[0006] At least one embodiment of the present invention provides a method for manufacturing a component substrate, comprising the following steps: forming a plurality of first side traces on a circuit substrate, wherein the first side traces extend from a first surface of the circuit substrate along a side surface of the circuit substrate to a second surface of the circuit substrate; forming a package structure on a first surface; the package structure covering the first side traces on the first surface; forming shorting bars on the first side traces; and partially extending the shorting bars from the package structure to the first side traces located on the side surface and the second surface. The shorting bars are laser-cut to form a plurality of mutually separated second side traces, each of the second side traces being electrically connected to the first side traces.

[0007] Based on the above, the bezel width of the component substrate can be reduced by using the first side trace. Furthermore, the damaged first side trace can be repaired by using the second side trace, thereby mitigating the problems caused by damaged side traces. Attached Figure Description

[0008] Figures 1A to 1E This is a perspective view of a method for manufacturing a component substrate according to an embodiment of the present invention.

[0009] Figures 2A to 2E They are Figures 1A to 1E A cross-sectional view at line A-A'.

[0010] Figures 3A to 3E This is a side view of a method for manufacturing a component substrate according to an embodiment of the present invention.

[0011] Figures 4A to 4E They are Figures 3A to 3E A schematic diagram of the cross section at line B-B'.

[0012] Explanation of reference numerals in the attached figures:

[0013] 1,2: Component substrate

[0014] 10: Circuit board

[0015] 12: First Page

[0016] 12a: Active region

[0017] 12b: Surrounding Area

[0018] 14: Second page

[0019] 16,314: Side view

[0020] 100: Connecting pad

[0021] 200: First side wiring

[0022] 202: Crack

[0023] 300: Package structure

[0024] 310: Mold sealing film

[0025] 312: Bottom surface

[0026] 320: Side sealing adhesive

[0027] 400, 400C: Second side wiring

[0028] 400A: Short circuit pole

[0029] 400B: Conductive rod

[0030] 402: Key Cadre

[0031] 404: Branch Office

[0032] 500: Overlay

[0033] A-A',B-B': line

[0034] D,X: Distance

[0035] E1: First Direction

[0036] E2: Second Direction

[0037] L: Light-emitting element

[0038] LS: Laser Cutting Detailed Implementation

[0039] Figures 1A to 1E This is a perspective view of a method for manufacturing a component substrate 1 according to an embodiment of the present invention. Figures 2A to 2E They are Figures 1A to 1E A cross-sectional view at line A-A'. Figures 1E to 2E The circuit layout in the circuit board 10 is not shown, but can be adjusted according to actual needs. Specifically, the circuit board 10 includes, for example, a substrate (not shown) and a circuit structure (not shown) located on the substrate, wherein the circuit structure includes multiple conductive layers and multiple insulating layers. In some embodiments, the aforementioned circuit structure also includes active elements.

[0040] Please refer to Figure 1A and Figure 2AThe circuit board 10 has a first surface 12 and a second surface 14 facing each other, and a side surface 16 connects the first surface 12 and the second surface 14. The first surface 12 of the circuit board 10 includes an active region 12a and a peripheral region 12b. In some embodiments, a plurality of light-emitting elements L are disposed on the active region 12a. The light-emitting elements L are, for example, organic light-emitting diodes, inorganic light-emitting diodes, or other suitable light-emitting elements, but the present invention is not limited thereto. In other embodiments, other types of electronic components may be disposed on the active region 12a. For example, the active region 12a may include photosensitive elements, touch elements, or other types of electronic components.

[0041] The circuit board 10 includes a plurality of pads 100 disposed in the peripheral region 12b. In some embodiments, some of the pads 100 are electrically connected to the light-emitting element L. In this embodiment, the pads 100 do not extend to the edge of the circuit board 10, and the pads 100 are spaced apart from the edge of the circuit board 10 by a distance D, but the invention is not limited thereto. In other embodiments, the pads 100 are flush with the edge of the circuit board 10. In some embodiments, the edge of the circuit board 10 includes rounded corners (chamfers), thereby reducing the probability of the edge of the circuit board 10 being damaged by external forces.

[0042] Please refer to Figure 1B and Figure 2B Multiple first side traces 200 are formed on the circuit board 10. The first side traces 200 are separated from each other. The first side traces 200 are formed on the pads 100 and extend from the first surface 12 of the circuit board 10 along the side surface 16 of the circuit board 10 to the second surface 14 of the circuit board 10.

[0043] In some embodiments, the first side trace 200 includes, for example, conductive adhesive (e.g., silver paste), metal (e.g., copper), or other suitable conductive material. In some embodiments, the method of forming the first side trace 200 includes printing, inkjet printing, or sputtering.

[0044] Please refer to Figure 1C and Figure 2C An encapsulation structure 300 is formed on the first surface 12 and the side surface 16 of the circuit board 10, and the encapsulation structure 300 covers the first side trace 200 on the first surface 12 and a portion of the first side trace 200 on the side surface 16. In this embodiment, the encapsulation structure 300 includes a molding film 310 and a side encapsulating adhesive 320. The molding film 310 is attached to the first surface 12 of the circuit board 10. In some embodiments, the molding film 310 covers the active region 12a and the peripheral region 12b of the circuit board 10, and covers the light-emitting element L on the first surface 12 and the first side trace 200.

[0045] In this embodiment, a portion of the molding film 310 extends beyond the side surface 16 of the circuit board 10, such that a portion of the bottom surface 312 of the molding film 310 does not contact the first surface 12 of the circuit board 10. In this embodiment, the molding film 310 also extends laterally beyond the first side trace 200 located on the side surface 16, and the distance X of the extension is 10 micrometers to 200 micrometers, but the present invention is not limited thereto.

[0046] Side encapsulant 320 covers a portion of the first side trace 200 on the side surface 16 of the circuit board 10, and exposes another portion of the first side trace 200 on the side surface 16. The side encapsulant 320 is formed on the side surface 16 of the circuit board 10, for example, by dispensing, coating, inkjet printing, or other suitable methods. In some embodiments, the molding film 310 and the side encapsulant 320 comprise different materials. In this embodiment, the side encapsulant 320 is formed at the angle between a portion of the bottom surface 312 of the molding film 310 and the first side trace 200, thereby allowing the side encapsulant 320 to be more securely fixed to the first side trace 200.

[0047] In this embodiment, before or after the formation of the package structure 300, a portion of the first side trace 200 may be damaged and develop a crack 202. For example, when moving the circuit board 10 to different process chambers or during processing within a process chamber, a portion of the first side trace 200 may be damaged due to impact or friction. In some embodiments, the damaged first side trace 200 extends continuously or discontinuously from the first surface 12 of the circuit board 10 along the side surface 16 of the circuit board 10 to the second surface 14 of the circuit board 10. In other words, the crack 202 may or may not cause the first side trace 200 to break.

[0048] Next, please refer to Figure 1D and Figure 2D A second side trace 400 is formed to repair the damaged first side trace 200. In some embodiments, a second side trace 400 is formed on both the damaged and undamaged first side trace 200. In other words, a corresponding second side trace 400 is formed on each first side trace 200. The second side trace 400 extends from the encapsulation structure 300 to the first side trace 200 located on the side surface 16 and the second surface 14, and the second side trace 400 fills the crack 202 of the first side trace 200. In this embodiment, the side encapsulant 320 is located between the first side trace 200 and the second side trace 400. In this embodiment, the second side trace 400 contacts the side surface 314 of the molding film 310, and the second side trace 400 partially covers the side encapsulant 320.

[0049] In some embodiments, the second side trace 400 includes, for example, conductive adhesive (e.g., silver paste), metal (e.g., copper), or other suitable conductive material. In some embodiments, the method of forming the second side trace 400 includes printing, inkjet printing, or sputtering.

[0050] Please refer to Figure 1E and Figure 2E A cover layer 500 is formed on the second side trace 400. The second side trace 400 is located between the cover layer 500 and the first side trace 200. In some embodiments, the cover layer 500 includes an insulating material and is used to protect the second side trace 400.

[0051] At this point, the component substrate 1 is largely complete. The component substrate 1 includes a circuit substrate 10, a light-emitting element L, a first side trace 200, a package structure 300, a second side trace 400, and a cover layer 500. In some embodiments, a chip (not shown) is electrically connected to the first side trace 200 and / or the second side trace 400 on the second surface 14 of the circuit substrate 10. For example, a thin-film flip-chip package structure containing a driver chip is disposed on the second surface 14 of the circuit substrate 10 and connected to the first side trace 200 and / or the second side trace 400 on the second surface 14. In some embodiments, the second surface 14 of the circuit substrate 10 also includes other conductors (not shown), wherein the first side trace 200 and the second side trace 400 electrically connect the pad 100 to the conductors on the second surface 14, and the thin-film flip-chip package structure is bonded to the conductors on the second surface 14.

[0052] Figures 3A to 3E This is a side view of a method for manufacturing a component substrate according to an embodiment of the present invention. Figures 4A to 4E They are Figures 3A to 3E A cross-sectional view at line B-B'. It must be noted here that... Figures 3A to 4E The embodiments follow Figures 1A to 2E The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.

[0053] Please refer to Figure 3A and Figure 4A Multiple first side traces 200 are formed on the circuit board 10. The first side traces 200 are separated from each other. The first side traces 200 are formed on the pads 100 and extend from the first surface 12 of the circuit board 10 along the side surface 16 of the circuit board 10 to the second surface 14 of the circuit board 10.

[0054] Please refer to Figure 3B and Figure 4BAn encapsulation structure 300 is formed on the first surface 12 and the side surface 16 of the circuit board 10, and the encapsulation structure 300 covers the first side trace 200 on the first surface 12 and a portion of the first side trace 200 on the side surface 16. In this embodiment, the encapsulation structure 300 includes a molding film 310 and a side encapsulating adhesive 320. The molding film 310 is attached to the first surface 12 of the circuit board 10. In some embodiments, the molding film 310 covers the active area and the peripheral area of ​​the circuit board 10, and covers the light-emitting element and the first side trace 200 on the first surface 12. The side encapsulating adhesive 320 covers a portion of the first side trace 200 on the side surface 16.

[0055] Before or after the formation of the package structure 300, a portion of the first side trace 200 may be damaged and develop cracks 202. For example, when moving the circuit board 10 to different process chambers or during processing within a process chamber, a portion of the first side trace 200 may be damaged due to impact or friction. In some embodiments, the damaged first side trace 200 extends continuously or discontinuously from the first surface 12 of the circuit board 10 along the side surface 16 of the circuit board 10 to the second surface 14 of the circuit board 10.

[0056] Please refer to Figure 3C and Figure 4C A shorting rod 400A is formed to repair the damaged first side trace 200. In some embodiments, the shorting rod 400A is formed on both the damaged and undamaged first side traces 200. The shorting rod 400A electrically connects a plurality of first side traces 200 and electrically connects a plurality of pads 100 through the plurality of first side traces 200.

[0057] A shorting rod 400A extends from the encapsulation structure 300 onto a first side trace 200 located on the side surface 16 and the second surface 14, and the shorting rod 400A fills the crack 202 of the first side trace 200. In this embodiment, side encapsulant 320 is located between the first side trace 200 and the shorting rod 400A. In this embodiment, the shorting rod 400A contacts the side surface 314 of the molding seal 310, and the shorting rod 400A partially covers the side encapsulant 320. In some embodiments, the shorting rod 400A includes a main stem 402 extending along a first direction E1 and a plurality of branches 404 extending along a second direction E2. The main stem 402 connects the plurality of branches 404 together, and each branch 404 covers a corresponding first side trace 200. In some embodiments, the first direction E1 is perpendicular to the second direction E2.

[0058] In some embodiments, the shorting rod 400A comprises, for example, conductive adhesive (e.g., silver paste), metal (e.g., copper), or other suitable conductive material. In some embodiments, the method of forming the shorting rod 400A includes printing, inkjet printing, or sputtering.

[0059] Please refer to Figure 3D and Figure 4D The shorting rod 400A is laser-cut to form multiple separate second side traces 400C and conductive rods 400B. The laser cutting prevents the multiple pads 100 from being electrically connected to each other through the shorting rod 400A. The laser cutting forms a laser cut LS on the encapsulation structure 300. For example, the laser cut LS is located on the side encapsulant 320 and extends along the first direction E1. The laser cut LS is located between the conductive rod 400B and the second side traces 400C. The second side traces 400C are electrically connected to the first side traces 200 and can repair cracks 202 in the first side traces 200.

[0060] Please refer to Figure 3E and Figure 4E A cover layer 500 is formed on the second side trace 400. The second side trace 400C is located between the cover layer 500 and the first side trace 200. In some embodiments, the cover layer 500 includes an insulating material and is used to protect the second side trace 400C.

[0061] At this point, the component substrate 2 is largely complete. The component substrate 2 includes a circuit board 10, a light-emitting element (not shown), a first side trace 200, a packaging structure 300, a second side trace 400C, a conductive rod 400B, and a cover layer 500.

Claims

1. A component substrate, comprising: A circuit board; A first side trace extends from a first surface of the circuit board along a side surface of the circuit board to a second surface of the circuit board; An encapsulation structure is located on the first surface and covers a portion of the first surface and the first side trace on the first surface; as well as A second side trace extends from the package structure to the first side trace located on the side and the second surface, such that a portion of the package structure lies between the first side trace and the second side trace. The packaging structure includes: A molding film covers the first side trace on the first surface and a light-emitting element on the first surface. The molding film extends from the first surface to the side surface, with a portion of the bottom surface of the molding film not contacting the first surface. The molding film also extends laterally beyond the first side trace located on the side surface, with the extension distance ranging from 10 micrometers to 200 micrometers. A side encapsulating adhesive covers a portion of the first side trace on that side, wherein the side encapsulating adhesive is located between the first side trace and the second side trace, the side encapsulating adhesive is formed at the angle between a portion of the bottom surface of the molded film and the first side trace, wherein the second side trace contacts the side of the molded film and the second side trace partially covers the side encapsulating adhesive.

2. The component substrate of claim 1, wherein the surface of the package structure includes laser-cut marks, and another portion of the package structure is located between the first side trace and the second side trace on the side of the circuit substrate.

3. The component substrate as described in claim 2, further comprising: A conductive rod is located on the package structure and separated from the second side trace, wherein the laser cut is located between the conductive rod and the second side trace.

4. The component substrate of claim 1, wherein the first side trace includes a crack, and the second side trace fills the crack.

5. The component substrate of claim 1, wherein the first side trace extends continuously from the first surface of the circuit substrate along the side surface of the circuit substrate to the second surface of the circuit substrate.

6. The component substrate of claim 1, wherein the first side trace extends discontinuously from the first surface of the circuit substrate along the side surface of the circuit substrate to the second surface of the circuit substrate.

7. The component substrate as claimed in claim 1, further comprising: A cover layer, wherein the second side trace is located between the cover layer and the first side trace.

8. A method for manufacturing a component substrate, comprising: A first side trace is formed on a circuit board, wherein the first side trace extends from a first surface of the circuit board along a side surface of the circuit board to a second surface of the circuit board. An encapsulation structure is formed on the first surface, wherein the encapsulation structure covers a portion of the first surface and the first side trace on the first surface, and wherein the first side trace is damaged before or after the formation of the encapsulation structure; and A second side trace is formed to repair the damaged first side trace, wherein the second side trace extends from the package structure to the first side trace located on the side and the second surface, such that a portion of the package structure is located between the first side trace and the second side trace. The methods for forming the second side routing include: Forming a short-circuit rod connecting the first side routing; and The shorting rod is laser-cut to form a separated second side trace and a conductive rod, wherein the laser cutting forms a laser cut on the package structure, and the laser cut is located between the conductive rod and the second side trace, wherein the method of forming the package structure includes: A molded seal is formed on the first surface; and A side encapsulation adhesive is formed on the side surface, wherein the encapsulation structure includes the molding film and the side encapsulation adhesive, and the side encapsulation adhesive is located between the first side trace and the second side trace, wherein the shorting rod contacts the side surface of the molding film, and the shorting rod partially covers the side encapsulation adhesive.

9. The method of manufacturing a component substrate as claimed in claim 8, wherein the method of forming the first side trace and the method of forming the second side trace include printing, inkjet printing or sputtering.

10. A method for manufacturing a component substrate, comprising: Multiple first side traces are formed on a circuit board, wherein the first side traces extend from a first surface of the circuit board along a side surface of the circuit board to a second surface of the circuit board. An encapsulation structure is formed on the first surface, wherein the encapsulation structure covers a portion of the first surface and the first side traces on the first surface; A short-circuit bar is formed on the first side traces, wherein a portion of the short-circuit bar extends from the encapsulation structure to the first side traces located on the side and the second surface; and The shorting rod is laser-cut to form multiple separate second side traces, which are electrically connected to the first side traces. A portion of the packaging structure is located between the first side trace and the second side trace. The packaging structure includes: A molding film covers the first side trace on the first surface and a light-emitting element on the first surface. The molding film extends from the first surface to the side surface, with a portion of the bottom surface of the molding film not contacting the first surface. The molding film also extends laterally beyond the first side trace located on the side surface, with the extension distance ranging from 10 micrometers to 200 micrometers. A side encapsulating adhesive covers a portion of the first side trace on that side, wherein the side encapsulating adhesive is located between the first side trace and the second side trace, the side encapsulating adhesive is formed at the angle between a portion of the bottom surface of the molded film and the first side trace, wherein the second side trace contacts the side of the molded film and the second side trace partially covers the side encapsulating adhesive.

11. The method of manufacturing a component substrate as claimed in claim 10, wherein the shorting bar is laser-cut to form mutually separated second side traces and a conductive bar, wherein the laser cutting forms a laser cut on the package structure, and the laser cut is located between the conductive bar and the second side traces, and on the side of the circuit substrate, another portion of the package structure is located between the first side trace and the second side trace.

12. The method of manufacturing a component substrate as claimed in claim 11, wherein the shorting bar includes a main stem extending along a first direction and a plurality of branches extending along a second direction, wherein the main stem connects the branches together and each of the branches covers a corresponding first side trace.

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