Antenna and electronic device

Abstract

The present disclosure relates to an antenna and an electronic device. The antenna comprises a metal component and a circuit board. The circuit board and / or the metal component is provided with a side edge conductive part. The metal component, the side edge conductive part and the circuit board enclose a cavity with an opening, thereby forming a cavity antenna with an opening. The antenna satisfies the radiation performance requirements of a product, reduces the risk of uncertain electrical connections, and maintains the sealing of the cavity, thereby increasing the performance of the entire antenna cavity, improving the performance of the antenna, and reducing costs and the risk of mass production without the need for additional components.

Description

Technical Field

[0001] This disclosure relates to the field of antenna design technology, and more particularly to an antenna and electronic device. Background Technology

[0002] With the continuous development of communication technology, mobile phones and other electronic devices have evolved from carrying simple functions to supporting rich media such as voice, data, music, and video. They can also be expanded to install a variety of applications (APPs) to meet people's various needs.

[0003] Meanwhile, manufacturing processes are constantly improving, and consumers are paying increasing attention to factors such as the aesthetics and cost of mobile phones. Mobile phones are continuously evolving towards miniaturization, intelligence, thinness, and narrow bezels. Therefore, antenna design is frequently influenced by factors such as the phone's shape, structure, circuit board layout, and metal components, making development increasingly difficult. Summary of the Invention

[0004] This disclosure provides an antenna and an electronic device to address the shortcomings of related technologies.

[0005] In a first aspect, embodiments of this disclosure provide an antenna, comprising:

[0006] Metal components and circuit boards;

[0007] The circuit board and / or the metal assembly are provided with side conductive portions; the metal assembly, the side conductive portions, and the circuit board enclose a cavity with an opening.

[0008] Optionally, the metal component and the side conductive part are an integral structure, and the side conductive part abuts against the circuit board.

[0009] Optionally, the integrated structure formed by the metal component and the side conductive part is a shield.

[0010] Optionally, the side conductive part is a spring contact assembly, which is disposed on the circuit board and abuts against the metal component.

[0011] Optionally, the metal component is the metal housing of an electronic device.

[0012] Optionally, the projection of the cavity onto the circuit board or the metal assembly is rectangular, and the side conductive portion is disposed on the circuit board and / or the metal assembly along at least one side of the projection.

[0013] Optionally, the side conductive portion is disposed along three sides of the projection on one of the circuit board and the metal assembly, and abuts against the other; or

[0014] The metal assembly includes a metal housing, the metal housing including a bottom wall and a side wall connected to the bottom wall, and a side conductive portion disposed on one of the circuit board and the bottom wall along two adjacent sides of the projection and abutting against the other, the bottom wall, the side wall, the side conductive portion, and the circuit board enclosing to form the cavity; or

[0015] The metal assembly includes a metal housing and a metal plate. The metal housing includes a bottom wall and a side wall connected to the bottom wall. The side conductive portion is disposed on one of the circuit board and the metal plate along two adjacent sides arranged along the projection and abuts against the other. The metal plate, the side wall, the side conductive portion, and the circuit board enclose the cavity; or

[0016] The side conductive portion is disposed on one of the circuit board and the metal assembly along two opposite sides of the projection, and abuts against the other; or

[0017] The metal assembly includes a metal housing, the metal housing including a bottom wall and a side wall connected to the bottom wall, the side conductive portion being disposed along the side edge with the projection furthest from the side wall on one of the circuit board and the bottom wall and abutting against the other, the bottom wall, the side wall, the side conductive portion, and the circuit board enclosing to form the cavity; or

[0018] The metal components are the metal housing and metal plate of the electronic device. The metal housing includes a bottom wall and a side wall connected to the bottom wall. The side conductive part is disposed on one of the circuit board and the metal plate along the side edge with the projection distance farthest from the side wall and abuts against the other. The metal plate, the side wall, the side conductive part and the circuit board enclose the cavity.

[0019] Optionally, a conductive layer is laid on the surface of the circuit board, and the conductive layer has a cutout. The cutout surrounds the outside of the projection of the cavity on the circuit board; the conductive layer, the side conductive portion, and the metal shell located within the projection enclose the cavity.

[0020] Optionally, the circuit board includes a first surface and a second surface disposed opposite to each other, the first surface being disposed away from the metal housing relative to the second surface, and the side conductive portion being disposed on the second surface;

[0021] The first surface is covered with a first conductive layer, and the first conductive layer has a first cutout, which surrounds the outside of the projection.

[0022] The second surface is covered with a second conductive layer, and the second conductive layer has a second cutout and a third cutout that are spaced apart. The second cutout is disposed corresponding to the first cutout, and the third cutout is disposed corresponding to the first conductive layer located within the projection. The side conductive portion is disposed on the second conductive layer located between the second cutout and the third cutout.

[0023] The cavity is formed by the first conductive layer, the side conductive portion, and the metal shell located within the projection.

[0024] Optionally, the circuit board further includes a conductive connector disposed on the second conductive layer located outside the projection; and / or

[0025] The circuit board is also provided with a signal impedance line, which is connected to the first conductive layer located within the projection.

[0026] Optionally, the circuit board includes a first surface and a second surface disposed opposite to each other, the first surface being disposed away from the metal component relative to the second surface, and the side conductive portion being disposed on the second surface;

[0027] The first surface is provided with a conductive material layer, and the conductive material layer, the side conductive part, and the metal component surround to form the cavity.

[0028] Optionally, the projection of the cavity onto the circuit board is located at the edge of the circuit board, and the opening of the cavity is located at the edge of the circuit board.

[0029] Optionally, the circuit board is provided with the side conductive portion, which includes a plurality of metal springs, and the plurality of metal springs are arranged circumferentially along the projection of the cavity on the circuit board.

[0030] Optionally, the spacing between two adjacent metal springs is no more than 6 mm.

[0031] Optionally, an insulating support assembly is provided between the metal component and the circuit board to support the metal component.

[0032] In a second aspect, embodiments of this disclosure provide an electronic device including an antenna as described in the first aspect.

[0033] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0034] As can be seen from the above embodiments, the antenna disclosed herein has a circuit board with a side conductive part. The circuit board, the side conductive part, and the metal shell are used to form an open cavity, thereby constituting an open cavity antenna. This meets the radiation performance requirements of the product, reduces the risk of uncertain electrical connections, and can maintain the sealing of the cavity, thereby increasing the overall performance of the antenna cavity and improving the antenna performance. It does not require the addition of additional components, reducing costs and mass production risks.

[0035] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0037] Figure 1 This is a partial schematic diagram of an electronic device according to an exemplary embodiment.

[0038] Figure 2 This is a partial cross-sectional view of an electronic device according to an exemplary embodiment.

[0039] Figure 3 This is a partial schematic diagram of a circuit board according to an exemplary embodiment.

[0040] Figure 4 This is a schematic diagram of the first surface of a circuit board according to an exemplary embodiment.

[0041] Figure 5 This is a schematic diagram of the second surface of a circuit board according to an exemplary embodiment.

[0042] Figures 6 to 9 This is a partial schematic diagram of an antenna according to different exemplary embodiments.

[0043] Figure 10 and Figure 11 The diagram shows S11 and efficiency plot of an antenna obtained through simulation according to an exemplary embodiment. Detailed Implementation

[0044] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0045] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0046] To facilitate understanding of the technical solutions of this disclosure, the antenna and electronic equipment of this disclosure will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments and implementations can be combined with each other.

[0047] This disclosure provides an antenna applicable to electronic products such as mobile phones, tablets, laptops, smart glasses, smartwatches, smart bracelets, and wearable devices. The antenna may include a metal component and a circuit board. The circuit board and / or the metal component have side conductive portions. The metal component, the side conductive portions, and the circuit board enclose an open cavity, thereby constituting an open resonant cavity antenna. This meets the radiation performance requirements of the product, reduces the risk of uncertain electrical connections, and maintains the cavity's airtightness, thus increasing the overall antenna cavity performance and improving antenna performance. It eliminates the need for additional components, reducing costs and mass production risks, simplifying the structure, and improving structural consistency.

[0048] It should be noted that the circuit board and / or the metal assembly are provided with side conductive portions, and the metal assembly, the side conductive portions, and the circuit board together form a cavity with an opening, which may include the following situations:

[0049] (1) The metal component and the side conductive part are an integral structure, and the side conductive part abuts against the circuit board. It is understood that in this embodiment, the metal component can be a metal plate, and the metal component is provided with a side conductive part. One implementation is that the metal component and the side conductive part form an integral shield, that is, the shield can have its own side. The side conductive part can be directly soldered onto the circuit board, or it can be connected to the circuit board by spring contacts, foam, or other methods to achieve electrical connection between the shield and the circuit board; another implementation is that the metal plate is connected to one side of the side conductive part by spring contacts, foam, conductive cloth, or soldering, and the other side of the side conductive part is connected to the circuit board by spring contacts, foam, conductive cloth, or soldering. This solution is hereinafter referred to as the shield solution.

[0050] (2) The side conductive part is a spring contact assembly, which is disposed on the circuit board and abuts against the metal assembly. It is understood that in this embodiment, the circuit board has a side conductive part, and the metal assembly can be the metal casing of the electronic device. The side conductive part can be directly soldered to the metal casing, or it can be connected to the metal casing through other means such as a metal plate or foam to achieve electrical connection between the circuit board and the metal casing. This solution is hereinafter referred to as the metal casing solution.

[0051] (3) A first side conductive portion can be formed on a metal component, and a second side conductive portion can be formed on a circuit board. The metal component, the first side conductive portion, the second side conductive portion, and the circuit board enclose the cavity, with the first and second side conductive portions located on different sides of the cavity. That is, the cavity is formed by mutually enclosing a portion of side conductive portions on both the metal component and the circuit board. The first side conductive portion can be soldered to the circuit board, or connected to the circuit board by other means such as a metal plate, spring, or foam. The second side conductive portion can be soldered to the metal component, or connected to the metal component by other means such as a metal plate, spring, or foam, thereby realizing the electrical connection between the metal component and the circuit board.

[0052] It should be noted that the antenna configuration of the metal component with a side conductive portion can be similar to that of the antenna configuration of the circuit board with a side conductive portion. The antenna of this disclosure will be described in detail below with reference to the accompanying drawings, taking the circuit board with a side conductive portion as an example.

[0053] See Figures 1 to 5 As shown, the antenna may include a metal component and a circuit board 20. The metal component may be the metal housing 10 of an electronic device, and the circuit board 20 may be disposed within the metal housing 10. The circuit board 20 has a side conductive portion 21, which abuts against the metal housing 10. The metal housing 10, the side conductive portion 21, and the circuit board 20 enclose a cavity 40 with an opening 41 (the area shown by the dashed box in the figure). Optionally, the metal housing 10 may be an aluminum shell. The circuit board 20 may be a printed circuit board (PCB). The circuit board 20 may be fixedly connected to the metal housing 10 by fasteners such as screws 29.

[0054] As can be seen from the above embodiments, the antenna disclosed herein has a circuit board 20 with a side conductive part 21. The circuit board 20, the side conductive part 21, and the metal housing 10 enclose a cavity 40 with an opening 41, thereby constituting a resonant cavity antenna with an opening 41. This meets the radiation performance requirements of the product, reduces the risk of uncertain electrical connections, and maintains the airtightness of the cavity 40, thereby increasing the overall performance of the antenna cavity 40 and improving antenna performance. It eliminates the need for additional components, reducing costs and mass production risks, simplifying the structure, and improving structural consistency. It can be applied to WIFI antennas and Sub6G antennas in electronic devices such as PADs (tablet computers) or mobile phones with seamless all-metal back covers under extreme stacking.

[0055] In some optional embodiments, the projection of the cavity 40 onto the circuit board 20 (hereinafter referred to as the cavity projection) is rectangular, that is, the projection includes four sides. The side conductive parts 21 are disposed on the circuit board 20 along at least one side of the cavity projection to enclose and form the cavity 40. The side of the cavity projection without the side conductive parts 21 can serve as the opening 41 of the cavity 40, thereby forming a resonant cavity antenna with the opening 41.

[0056] The side conductive portion 21 may include multiple metal springs 22, which are spaced apart circumferentially along the cavity projection. The metal springs 22 can be designed using existing metal springs on the circuit board 20, resulting in almost zero cost. Thus, without the need for additional structural components, the cavity is sealed around the perimeter using the metal springs 22, ensuring the cavity's airtightness and enabling the formation of a cavity 40 enclosed by the side conductive portion 21, the circuit board 20, and the metal housing 10 within a confined space. Furthermore, it connects the conductive path between the circuit board 20 and the metal housing 10. The metal springs 22 abut against the metal housing 10 and possess a certain elastic force, ensuring the structural stability of the antenna. In this embodiment, the cavity projection is rectangular, and the multiple metal springs 22 are spaced apart on the circuit board 20 along at least one side of the cavity projection.

[0057] Optionally, the spacing between two adjacent metal springs 22 is no greater than 6 mm. It is understood that the number of metal springs 22 and the spacing between them can be adjusted according to actual needs. For example, when a low-frequency antenna function is required, the number of metal springs 22 can be increased, and the spacing between them can be decreased. The side conductive part 21 may also include conductive foam, conductive silicone, etc.

[0058] It should be noted that when the metal component is provided with a side conductive part, the projection of the cavity on the metal component can also be rectangular, and the side conductive part is disposed on the metal component along at least one side of the projection.

[0059] In some alternative embodiments, the cavity projection is located at the edge of the circuit board 20, and the opening 41 of the cavity 40 is located at the edge of the circuit board 20. Thus, the formed resonant cavity antenna is located at the edge of the circuit board 20, which better avoids other structural components inside the metal housing 10, reducing the impact on antenna performance. It should be noted that when the metal assembly has a side conductive portion, the projection of the cavity onto the metal assembly can also be located at the edge of the metal assembly, and the opening of the cavity can be located at the edge of the metal assembly.

[0060] The first enclosure method for the antenna: The side conductive parts are disposed on one of the circuit board and the metal assembly along the three sides of the projection, and abut against the other. The metal assembly, the side conductive parts, and the circuit board enclose a cavity that is closed on three sides and open on one side. This embodiment is applicable to both the shielding cover scheme and the metal housing scheme described above. That is, the metal plate or metal housing is provided with three side conductive parts, and the metal plate or metal housing, the three side conductive parts, and the circuit board enclose a cavity. Alternatively, the circuit board is provided with three side conductive parts, and the circuit board, the three side conductive parts, and the metal plate or metal housing enclose a cavity.

[0061] A second enclosure method for the antenna: The side conductive parts are disposed on one of the circuit board and the metal assembly along two opposite sides of the projection, and abut against the other. The metal assembly, the side conductive parts, and the circuit board enclose a cavity that is closed on two sides and open on two sides. This embodiment is applicable to both the shielding cover scheme and the metal housing scheme described above. That is, the metal plate or metal housing is provided with two oppositely arranged side conductive parts, and the metal plate or metal housing, the two oppositely arranged side conductive parts, and the circuit board enclose a cavity. Alternatively, the circuit board is provided with two oppositely arranged side conductive parts, and the circuit board, the two oppositely arranged side conductive parts, and the metal plate or metal housing enclose a cavity.

[0062] A third enclosure method for the antenna: The metal assembly includes a metal housing, which includes a bottom wall and side walls connected to the bottom wall. Two adjacent side conductive portions along the projection are disposed on one of the circuit board and the bottom wall, and abut against the other. Thus, the bottom wall, side walls, two side conductive portions, and the circuit board can also enclose a cavity that is closed on three sides and open on one side. This embodiment is applicable to the metal housing scheme described above. That is, the bottom wall has two side conductive portions, and the bottom wall, side walls, two side conductive portions, and the circuit board enclose a cavity. Alternatively, the circuit board has two side conductive portions, and the circuit board, two side conductive portions, the bottom wall, and the side walls enclose a cavity.

[0063] A fourth enclosure method for the antenna: The metal assembly includes a metal housing and a metal plate. The metal housing includes a bottom wall and side walls connected to the bottom wall. Two adjacent side conductive parts are disposed along the projection of the antenna and are disposed on one of the circuit board and the metal plate, abutting against the other. In this way, the metal plate, side walls, two side conductive parts, and the circuit board can also enclose a cavity that is closed on three sides and open on one side. This embodiment is applicable to the shielding scheme described above. That is, the metal plate is provided with two side conductive parts, and the metal plate, side walls, two side conductive parts, and the circuit board enclose a cavity. Alternatively, the circuit board is provided with two side conductive parts, and the circuit board, two side conductive parts, the metal plate, and the side walls enclose a cavity.

[0064] A fifth enclosure method for the antenna: In some optional embodiments, the metal assembly includes a metal housing, which includes a bottom wall and a side wall connected to the bottom wall. A side conductive portion is disposed on one of the circuit board and the bottom wall along the side edge with the projection distance furthest from the side wall, and abuts against the other. The bottom wall, side wall, single-sided side conductive portion, and circuit board enclose the cavity. This embodiment is applicable to the metal housing scheme described above. That is, the bottom wall is provided with a single-sided side conductive portion, and the bottom wall, side wall, single-sided side conductive portion, and circuit board enclose the cavity. Alternatively, the circuit board is provided with a single-sided side conductive portion, and the circuit board, single-sided side conductive portion, bottom wall, and side wall enclose the cavity.

[0065] The sixth enclosure method for the antenna: The metal assembly is a metal housing and a metal plate of an electronic device. The metal housing includes a bottom wall and a side wall connected to the bottom wall. The side conductive part is disposed on one of the circuit board and the metal plate along the side edge with the projection distance furthest from the side wall and abuts against the other. The metal plate, the side wall, the side conductive part, and the circuit board enclose the cavity. This embodiment is applicable to the above shielding scheme. That is, the metal plate is provided with a single-sided side conductive part, and the metal plate, the side wall, the single-sided side conductive part, and the circuit board enclose the cavity. Alternatively, the circuit board is provided with a single-sided side conductive part, and the circuit board, the single-sided side conductive part, the metal plate, and the side wall enclose the cavity.

[0066] Specifically, taking a circuit board with a side conductive portion as an example, the metal housing 10 may include a bottom wall 11 and a side wall 12 connected to the bottom wall 11. The bottom wall 11 can be understood as the battery back cover of an electronic device, and the side wall 12 can be understood as the mid-frame housing. The bottom wall 11 and the side wall 12 can be integrally formed to create a unibody metal back shell. The cavity 40 may be located in the area of ​​the bottom wall 11 not close to the side wall 12, with the side conductive portion 21 cooperating with the circuit board 20 and the bottom wall 11 to form the cavity 40. The cavity 40 may also be located in the corner area of ​​the bottom wall 11 close to the side wall 12, with the side conductive portion 21 cooperating with the circuit board 20, the bottom wall 11, and the side wall 12 to form the cavity 40. See also Figures 6 to 9 The circuit board 20 is not shown in the diagram. The side conductive part 21 includes a plurality of metal springs 22. Taking the rectangular projection of the cavity as an example, it can include the following situations:

[0067] See Figure 6 As shown, the cavity 40 is located in the area of ​​the bottom wall 11 not near the side wall 12. Side conductive parts 21 are provided on three sides of the circuit board 20 and connected to the bottom wall 11, forming a cavity structure with three sides of conductive parts and one side of the shell. Specifically, the three sides of the side conductive parts 21 projecting along the cavity are provided on the circuit board 20 and abut against the bottom wall 11. The bottom wall 11, the three sides of conductive parts 21, and the circuit board 20 enclose a cavity 40 that is closed on three sides and open on one side.

[0068] See Figure 7 As shown, the cavity 40 is located in the corner area of ​​the bottom wall 11 near the side wall 12. Side conductive portions 21 are provided on both sides of the circuit board 20 and connected to the bottom wall 11, forming a cavity structure with two side conductive portions cooperating with two shell surfaces. Specifically, two adjacent sides of the side conductive portions 21, projected along the cavity, are disposed on the circuit board 20 and abut against the bottom wall 11. The side wall 12 encloses and forms a part of the cavity 40. The bottom wall 11, side wall 12, two side conductive portions 21, and circuit board 20 together form a cavity 40 that is closed on three sides and open on one side.

[0069] See Figure 8 As shown, the cavity 40 is located in the area of ​​the bottom wall 11 not near the side wall 12. Side conductive parts 21 are provided on both sides of the circuit board 20 and connected to the bottom wall 11, forming a cavity structure with two side conductive parts cooperating with a housing. Specifically, the two opposite sides of the side conductive parts 21, projected along the cavity, are disposed on the circuit board 20 and abut against the bottom wall 11. The bottom wall 11, the two side conductive parts 21, and the circuit board 20 enclose a cavity 40 that is closed on two sides and open on two sides.

[0070] See Figure 9As shown, the cavity 40 is located in the corner area of ​​the bottom wall 11 near the side wall 12. A side conductive part 21 is provided on one side of the circuit board 20 and connected to the bottom wall 11, forming a cavity structure with one side conductive part cooperating with two shells. The side conductive part 21 is located on the circuit board 20 with the side furthest from the side wall 12 along the projection of the cavity and abuts against the bottom wall 11. The bottom wall 11, the side wall 12, the side conductive part 21, and the circuit board 20 enclose a cavity 40 that is closed on two sides and open on two sides.

[0071] In some optional embodiments, a conductive layer is deposited on the surface of the circuit board 20, and the conductive layer has a cutout that surrounds the outside of the cavity projection. Thus, the cutout divides the conductive layer into two parts: a conductive layer located outside the cavity projection and a conductive layer located inside the cavity projection. The conductive layer located inside the cavity projection, the side conductive portion 21, and the metal housing 10 together form the cavity 40. Furthermore, the cutout can also isolate the formed cavity 40 from other conductive devices on the circuit board 20, creating a clear space between the board layers and ensuring the maximum operating height and efficiency of the antenna. Optionally, the conductive layer can be a copper foil layer. It should be noted that this embodiment is applicable to both the shielding cover solution and the metal housing solution described above.

[0072] See you again Figures 2 to 5 As shown, the circuit board 20 includes a first surface 23 and a second surface 24 disposed opposite to each other. The first surface 23 is positioned opposite to the metal housing 10 relative to the second surface 24, and a side conductive portion 21 is disposed on the second surface 24. It can be understood that the first surface 23 is opposite to the bottom wall 11 of the metal housing 10 relative to the second surface 24. It can be understood that the first surface 23 can be understood as the back side of the circuit board 20, and the second surface 24 can be understood as the front side of the circuit board 20, with the side conductive portion 21 disposed on the second surface 24 of the circuit board 20. It should be noted that the conductive layer can be laid on either the first surface 23 or the second surface 24 of the circuit board 20. When the conductive layer is laid on the first surface 23, it can be electrically connected to the side conductive portion 21 located on the second surface 24 by creating vias (metallized vias) on the circuit board 20. When the conductive layer is laid on the second surface 24, it can be directly electrically connected to the side conductive portion 21 located on the second surface 24 by means of soldering or other methods. It should be noted that this embodiment is applicable to both the shielding cover solution and the metal casing solution described above.

[0073] In this embodiment, a first conductive layer 231 is deposited on the first surface 23, and the first conductive layer 231 has a first cutout 232, which surrounds the outside of the cavity projection. It can be understood that the first cutout 232 divides the first conductive layer 231 into two parts: a first conductive layer located outside the cavity projection and a first conductive layer located inside the cavity projection.

[0074] The second surface 24 is covered with a second conductive layer 241, which has a second cutout 242 and a third cutout 243 spaced apart. The second cutout 242 and the third cutout 243 are separated by the second conductive layer 241. The second cutout 242 corresponds to the first cutout 232 and surrounds the outside of the cavity projection. The third cutout 243 corresponds to the first conductive layer 231 located within the cavity projection. The metal spring 22 of the side conductive portion 21 is disposed on the second conductive layer 241 located between the second cutout 242 and the third cutout 243. Thus, the first conductive layer 231 located within the cavity projection, the side conductive portion 21 located between the second cutout 242 and the third cutout 243, and the metal shell 10 enclose and form the cavity 40. The first cutout 232, the second cutout 242, and the third cutout 243 can isolate the formed cavity 40 from other conductive devices on the circuit board 20, forming a clear space between the boards and ensuring the maximum operating height and efficiency of the antenna. It is understood that the first conductive layer 231 located within the cavity projection on the first surface 23 can be connected to the second conductive layer 241 located between the second cutout 242 and the third cutout 243 on the second surface 24 by creating vias (metallized vias) on the circuit board 20 to form a circuit board. The second conductive layer 241 located between the second cutout 242 and the third cutout 243 on the second surface 24 can be electrically connected to the side conductive portion 21 also located on the second surface 24 by means of soldering or other methods. It should be noted that this embodiment is applicable to both the shielding cover scheme and the metal casing scheme described above.

[0075] Optionally, a notch 244 may be formed in the second conductive layer 241 between the second hollow portion 242 and the third hollow portion 243 to allow the second hollow portion 242 to communicate with the third hollow portion 243, which facilitates processing and forming.

[0076] See Figure 2 and Figure 5 As shown, in some optional embodiments, the circuit board 20 may also be provided with conductive connectors 28, which are disposed on the second conductive layer 241 located outside the cavity projection. When the antenna is applied to electronic devices such as mobile phones, the circuit board 20 can be connected to the display screen 30 or metal backplate of the electronic device through the conductive connectors 28, serving as a grounding function, thereby reducing noise, reducing interference to the display screen 30, and improving the efficiency of the antenna. The number of conductive connectors 28 can be one or more, arranged according to the antenna performance requirements.

[0077] The circuit board 20 may also include a signal impedance line (not shown), which is connected to the first conductive layer 231 located within the cavity projection. Thus, the signal impedance line feeds directly to the copper-plated area on the surface of the circuit board used to form the antenna body (i.e., the first conductive layer 231 located within the cavity projection), serving as the antenna feed point. A metal spring is connected to the metal housing, serving as the antenna ground point. Understandably, in practical applications, the signal impedance line may be inherent to the PCB board based on the layout design. A metal spring and metal housing are placed near the signal impedance line to enclose and form the antenna. This ensures the antenna ground point is close to the feed point, achieving a shorter conductive path and meeting the high-frequency performance requirements of the antenna. Furthermore, in practical applications, the signal impedance line may have bends; the metal springs can be bent and arranged accordingly to achieve the design requirement of proximity grounding.

[0078] In some optional embodiments, the first surface 23 of the circuit board 20 may be provided with a conductive material layer for enclosing the cavity 40 with the metal component. The conductive material layer, the side conductive portion 21, and the metal component (which can be understood as the metal housing 10 of the electronic device) enclose the cavity 40. Forming the cavity through this conductive material layer can further improve the reliability of the cavity. Thus, the second surface 24 of the circuit board 20 may retain the conductive layer or may not have the conductive layer, that is, the conductive layer on the second surface 24 within the cavity projection may be completely removed. Optionally, the conductive material layer may be conductive cloth, FPC (flexible printed circuit board), a metal layer formed by laser LDS (laser forming), silver plating paste, copper foil, or steel sheet, etc. It is understood that the conductive material layer can be electrically connected to the side conductive portion 21 located on the second surface 24 by forming vias (metallized vias) on the circuit board 20. It should be noted that this embodiment is applicable to both the shielding cover solution and the metal housing solution described above.

[0079] In some alternative embodiments, the circuit board 20 can be cut out along the outer periphery of the projection of the cavity 40 onto the circuit board 20, forming a sub-circuit board adapted to the size of the cavity 40. The metal assembly (which can be understood as the metal housing 10 of the electronic device), the side conductive portion 21, and the sub-circuit board enclose the cavity 40 to form an independent structure, so that the cavity portion can exist as an independent component. It should be noted that this embodiment is applicable to both the shielding cover solution and the metal housing solution described above.

[0080] In some optional embodiments, an insulating support assembly may be provided between the metal component and the circuit board 20 to support the metal component and improve the structural strength and stability of the cavity antenna. It should be noted that this embodiment is applicable to both the shielding cover solution and the metal housing solution described above.

[0081] The antenna disclosed herein allows the arrangement of the side conductive portions 21 to determine the size of the cavity 40. The height of the side conductive portions 21 determines the height of the opening 41 of the cavity 40. The spacing between the side conductive portions 21 at the edge of the circuit board 20 determines the length of the opening 41 of the cavity 40. Both the size of the cavity 40 and the size of the opening 41 can be changed according to actual needs by adjusting the size and arrangement of the side conductive portions 21 to match different antenna frequency bands. For example, reducing the area enclosed by the side conductive portions 21 reduces the size of the cavity 40. As the area enclosed by the side conductive portions 21 decreases, the resonant frequency of the antenna changes from low to high. The side conductive portions 21 can be gradually moved closer together near the edge of the circuit board 20, reducing the length of the opening 41. Reducing the height of the side conductive portions 21 reduces the height of the opening 41. Through these methods, the resonant frequency of the antenna can be achieved from 0.5 GHz to 10 GHz.

[0082] See Figure 10 and Figure 11 The diagram shows S11 and efficiency obtained through simulation of the antenna of this disclosure. It can be seen that the resonant cavity antenna of this disclosure can meet the bandwidth requirements of WiFi 5G and N78 bands, and its performance is good, with efficiency comparable to traditional resonant cavity antennas.

[0083] See you again Figure 1 and Figure 2 As shown in the illustration, this disclosure also provides an electronic device, which may be, for example, a mobile phone, tablet computer, laptop computer, wearable device, smart bracelet, smartwatch, smart glasses, or other electronic products. The electronic device includes a display screen 30 and an antenna. It should be noted that the antenna described in the above embodiments and implementations is also applicable to the electronic device of this embodiment. Optionally, the circuit board 20 has a side conductive portion 21, the metal assembly is the metal housing 10 of the electronic device, and the display screen 30 is disposed within the metal housing 10 and connected to the circuit board 20.

[0084] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0085] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An antenna, characterized in that, include: Metal components and circuit boards; The circuit board and / or the metal assembly are provided with side conductive portions; the metal assembly, the side conductive portions, and the circuit board enclose a cavity with an opening; A conductive layer is laid on the surface of the circuit board, and the conductive layer has a cutout. The cutout surrounds the outside of the projection of the cavity on the circuit board. The conductive layer, the side conductive portion, and the metal component located within the projection enclose and form the cavity. The circuit board includes a first surface and a second surface disposed opposite to each other, the first surface being disposed away from the metal component relative to the second surface, and the side conductive portion being disposed on the second surface; The first surface is covered with a first conductive layer, and the first conductive layer has a first cutout, which surrounds the outside of the projection. The second surface is covered with a second conductive layer, and the second conductive layer has a second cutout and a third cutout that are spaced apart. The second cutout is disposed corresponding to the first cutout, and the third cutout is disposed corresponding to the first conductive layer located within the projection. The side conductive portion is disposed on the second conductive layer located between the second cutout and the third cutout. The first conductive layer, the side conductive portion, and the metal assembly located within the projection form the cavity.

2. The antenna according to claim 1, characterized in that, The metal component and the side conductive part are an integral structure, and the side conductive part abuts against the circuit board.

3. The antenna according to claim 2, characterized in that, The integrated structure formed by the metal component and the side conductive part is a shield.

4. The antenna according to claim 1, characterized in that, The side conductive part is a spring contact assembly, which is disposed on the circuit board and abuts against the metal component.

5. The antenna according to claim 1, characterized in that, The metal component is the metal casing of the electronic device.

6. The antenna according to claim 1, characterized in that, The projection of the cavity onto the circuit board or the metal assembly is rectangular, and the side conductive portion is disposed on the circuit board and / or the metal assembly along at least one side of the projection.

7. The antenna according to claim 6, characterized in that, The side conductive portion is disposed along the three sides of the projection on one of the circuit board and the metal assembly, and abuts against the other; or The metal assembly includes a metal housing, the metal housing including a bottom wall and a side wall connected to the bottom wall, and a side conductive portion disposed on one of the circuit board and the bottom wall along two adjacent sides of the projection and abutting against the other, the bottom wall, the side wall, the side conductive portion, and the circuit board enclosing to form the cavity; or The metal assembly includes a metal housing and a metal plate. The metal housing includes a bottom wall and a side wall connected to the bottom wall. The side conductive portion is disposed on one of the circuit board and the metal plate along two adjacent sides arranged along the projection and abuts against the other. The metal plate, the side wall, the side conductive portion, and the circuit board enclose the cavity; or The side conductive portion is disposed on one of the circuit board and the metal assembly along two opposite sides of the projection, and abuts against the other; or The metal assembly includes a metal housing, the metal housing including a bottom wall and a side wall connected to the bottom wall, the side conductive portion being disposed along the side edge with the projection furthest from the side wall on one of the circuit board and the bottom wall and abutting against the other, the bottom wall, the side wall, the side conductive portion, and the circuit board enclosing to form the cavity; or The metal components are the metal housing and metal plate of the electronic device. The metal housing includes a bottom wall and a side wall connected to the bottom wall. The side conductive part is disposed on one of the circuit board and the metal plate along the side edge with the projection distance farthest from the side wall and abuts against the other. The metal plate, the side wall, the side conductive part and the circuit board enclose the cavity.

8. The antenna according to claim 1, characterized in that, The circuit board is further provided with conductive connectors, which are disposed on the second conductive layer located outside the projection; and / or The circuit board is also provided with a signal impedance line, which is connected to the first conductive layer located within the projection.

9. The antenna according to claim 1, characterized in that, The circuit board includes a first surface and a second surface disposed opposite to each other, the first surface being disposed away from the metal component relative to the second surface, and the side conductive portion being disposed on the second surface; The first surface is provided with a conductive material layer, and the conductive material layer, the side conductive part, and the metal component surround to form the cavity.

10. The antenna according to claim 1, characterized in that, The projection of the cavity onto the circuit board is located at the edge of the circuit board, and the opening of the cavity is located at the edge of the circuit board.

11. The antenna according to claim 1, characterized in that, The circuit board is provided with the side conductive part, which includes a plurality of metal springs. The plurality of metal springs are arranged circumferentially along the projection of the cavity on the circuit board.

12. The antenna according to claim 11, characterized in that, The distance between two adjacent metal springs is no more than 6 mm.

13. The antenna according to claim 1, characterized in that, An insulating support assembly is provided between the metal component and the circuit board to support the metal component.

14. An electronic device, characterized in that, The antenna includes any one of claims 1-13.

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