Communication module and communication device

Abstract

The application provides a communication module and a communication device, and relates to the technical field of antennas. The communication module comprises a substrate, an antenna and a dielectric resonator. The substrate comprises a first area and a second area connected with the first area, the antenna is arranged in the first area, and the second area is configured to be connected with a radio frequency chip. At least part of the dielectric resonator is located in the first area in the orthographic projection of the substrate. The dielectric resonator comprises a dielectric material. The resonant frequency of the communication module can be a target resonant frequency, and the performance is better.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and more particularly to a communication module and a communication device. Background Technology

[0002] With the rapid development of the Internet of Things (IoT), communication modules are being used more and more widely. In practical applications, after a communication module is installed inside a product, the spatial layout within the product can affect the communication module, causing a shift in the resonant frequency of the antenna within the communication module, which in turn leads to a decrease in the performance of the communication module. Summary of the Invention

[0003] Embodiments of this application provide a communication module and a communication device, wherein the resonant frequency of the communication module can be a target resonant frequency, resulting in better performance.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] On one hand, a communication module is provided, including a substrate, an antenna, a radio frequency chip, and a dielectric resonator; the substrate includes a first region and a second region connected to the first region, the antenna is disposed in the first region, the radio frequency chip is disposed in the second region, and the radio frequency chip is connected to the feed terminal of the antenna; at least a portion of the dielectric resonator is located within the first region in the orthographic projection of the substrate; the dielectric resonator includes a dielectric material.

[0006] In some embodiments, the dielectric resonator's orthographic projection onto the substrate covers part or all of the first region.

[0007] In some embodiments, the first region includes a first sub-region covered by the antenna and a second sub-region connected to the first sub-region, wherein at least a portion of the dielectric resonator is located within the second sub-region in the orthographic projection of the substrate.

[0008] In some embodiments, the dielectric resonator is projected onto the substrate within the second sub-region.

[0009] In some embodiments, the orthogonal projection of the dielectric resonator onto the substrate is located at the edge of the antenna.

[0010] In some embodiments, a portion of the dielectric resonator is projected onto the substrate within the first sub-region, and a portion of the dielectric resonator is projected onto the substrate within the second sub-region.

[0011] In some embodiments, the dielectric resonator is connected to the side of the substrate facing the antenna or the side of the substrate away from the antenna.

[0012] In some embodiments, the dielectric resonator is movably connected to the substrate so that the position of the dielectric resonator's orthographic projection on the substrate can be changed by moving the dielectric resonator.

[0013] In some embodiments, the dielectric resonator is slidably connected to the substrate in a direction parallel to the substrate.

[0014] In some embodiments, the substrate is provided with a slide rail, and the dielectric resonator is connected to the slide rail.

[0015] In some embodiments, the slide rail includes a limiting wall and two connecting walls. The limiting wall is parallel to and spaced apart from the substrate. The two connecting walls are parallel to and spaced apart. One end of each connecting wall is connected to the substrate, and the other end of at least one connecting wall is connected to the limiting wall. The limiting wall, the two connecting walls, and the substrate form a sliding path, and the dielectric resonator is slidably disposed within the sliding path.

[0016] In some embodiments, the antenna is a planar antenna.

[0017] On the other hand, a communication device, an RF chip, and the aforementioned communication module are provided, wherein the RF chip is connected to a second region of the communication module.

[0018] The communication module and communication device provided in this application include a substrate, an antenna, and a dielectric resonator. The substrate includes a first region and a second region connected to the first region. The antenna is disposed in the first region, and an RF chip is disposed in the second region, with the RF chip connected to the feed terminal of the antenna. At least a portion of the dielectric resonator's orthographic projection onto the substrate lies within the first region. Because the antenna is disposed within the first region, and at least a portion of the dielectric resonator's orthographic projection onto the substrate lies within the first region, the distance between the dielectric resonator and the antenna is relatively short, allowing electromagnetic waves radiated by the antenna to enter the dielectric resonator. The dielectric resonator has a dielectric resonant cavity. After the electromagnetic waves radiated by the antenna enter the dielectric resonant cavity, resonance is formed within the dielectric resonant cavity, thereby adjusting the resonant frequency of the antenna and enabling the communication module to operate at a target resonant frequency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a communication device is shown.

[0021] Figure 2 A schematic front view of a communication module is shown.

[0022] Figure 3 For about Figure 2 The right view;

[0023] Figure 4 The resonant characteristics of a communication module without a dielectric resonator are shown in the diagram.

[0024] Figure 5 To set the resonant characteristic diagram of the communication module with dielectric resonator;

[0025] Figure 6 Resonance characteristic diagrams of communication modules with dielectric resonators of different thicknesses;

[0026] Figure 7 A schematic right view of another communication module is shown;

[0027] Figure 8 A schematic front view of a communication module is shown.

[0028] Figure 9 for Figure 7 The resonant characteristic diagram of the communication module shown is presented.

[0029] Figure 10 A schematic front view of a communication module is shown.

[0030] Figure 11 for Figure 10 The resonant characteristic diagram of the communication module shown is presented.

[0031] Figure 12 A schematic front view of a communication module is shown.

[0032] Figure 13 for Figure 12 The resonant characteristic diagram of the communication module shown is presented.

[0033] Figure 14 A schematic front view of a communication module is shown.

[0034] Figure 15 for Figure 14 The resonant characteristic diagram of the communication module shown is presented.

[0035] Figure 16 A schematic front view of a communication module is shown.

[0036] Figure 17 for Figure 16 The resonant characteristic diagram of the communication module shown is presented.

[0037] Figure 18 A schematic front view of a communication module is shown.

[0038] Figure 19 for Figure 18 The resonant characteristic diagram of the communication module shown is presented.

[0039] Figure 20 A rear view of a communication module is schematically shown;

[0040] Figure 21 For about Figure 20 The left view;

[0041] Figure 22 for Figure 21 A magnified view of the area at point I.

[0042] Figure label:

[0043] 1000-Communication devices;

[0044] 110-Substrate;

[0045] 111 - Resonant arm;

[0046] 112-Feeder arm;

[0047] 113 - Short-circuit arm;

[0048] 110a - Zone 1;

[0049] 110b - Second Zone;

[0050] 120-antenna;

[0051] 130-Dielectric resonator;

[0052] 140 - Radio Frequency Chip;

[0053] 151-Connecting wall;

[0054] 152 - Limiting wall. Detailed Implementation

[0055] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0056] In the embodiments of this application, the terms "first", "second", "third", "fourth" are used to distinguish the same or similar items with essentially the same function and effect, only for the purpose of clearly describing the technical solution of the embodiments of this application, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0057] In the embodiments of this application, "multiple" means two or more, and "at least one" means one or more, unless otherwise explicitly defined.

[0058] In the embodiments of this application, the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0059] This application provides a communication module, which is a wireless communication module. The communication module can be installed in a communication device, enabling the communication device to achieve wireless communication with external devices through the communication module.

[0060] The following is combined Figures 2 to 22 The communication module in the embodiments of this application will be described in detail.

[0061] Figure 2 The diagram schematically shows a front view of a communication module. Figure 3 For about Figure 2 The right view. For example... Figure 2 and Figure 3 As shown, the communication module includes a substrate 110 and an antenna 120 connected to the substrate 110. Exemplarily, the communication module also includes a radio frequency (RF) chip 140 disposed on the substrate 110, and the RF chip 140 is connected to the feed terminal of the antenna 120. During operation, the RF chip 140 sends RF signals to the antenna 120, and the antenna 120 radiates the RF signals outward in the form of electromagnetic waves; alternatively, the antenna 120 receives electromagnetic waves propagating in space, converts the electromagnetic waves into RF signals, and sends the RF signals to the RF chip 140 for processing.

[0062] The radio frequency (RF) chip 140 primarily functions to transmit and receive RF signals. During operation, the RF chip 140 converts electrical signals into RF signals and sends the RF signals to the antenna 120; alternatively, it receives and processes RF signals from the antenna 120.

[0063] For example, the radio frequency chip 140 includes a filter, a power amplifier (PA), a radio frequency switch, a low noise amplifier (LNA), and a duplexer and a diplexer.

[0064] Antenna 120 can radiate radio frequency signals from radio frequency chip 140 into space as electromagnetic waves; or, it can receive electromagnetic waves propagating in space and convert them into radio frequency signals. Antenna 120 can be a planar antenna. Exemplarily, antenna 120 can be a planar inverted F-shaped antenna (PIFA), a planar inverted L-shaped antenna, etc. In this embodiment, antenna 120 is described as a PIFA.

[0065] The substrate 110 serves as the framework of the communication module, supporting and connecting the antenna 120 and the radio frequency chip 140 disposed on the substrate 110. The substrate 110 can be a rigid substrate or a flexible substrate. When the substrate 110 is a rigid substrate, it can be a printed circuit board (PCB); when the substrate 110 is a flexible substrate, it can be a flexible printed circuit (FPC). For ease of description, the following description will only use a PCB as an example.

[0066] When antenna 120 is a PIFA (Peripherally Integrated Facade), antenna 120 includes a resonant arm 111 and a feed arm 112 and a short-circuit arm 113 vertically connected to the resonant arm 111, with the feed arm 112 and short-circuit arm 113 spaced apart. The end of the feed arm 112 furthest from the resonant arm 111 is the feed terminal of antenna 120, and the feed arm 112 is electrically connected to the RF chip 140 through the feed terminal. The short-circuit arm 113 is electrically connected to the ground terminal.

[0067] For example, the substrate 110 is provided with at least one patterned conductive layer, and the antenna 120 is located within the patterned conductive layer.

[0068] For example, the substrate 110 is provided with a patterned conductive layer, which includes solder pads and traces that electrically connect the solder pads and the feed terminal of the antenna 120. The output pins of the RF chip 140 are soldered to the solder pads. For example, the antenna 120, the solder pads, and the traces are located on the same patterned conductive layer.

[0069] For example, the substrate 110 is also provided with a ground conductive layer, and the short-circuit arm 113 of the antenna 120 is electrically connected to the ground conductive layer.

[0070] The substrate 110 includes a first region 110a and a second region 110b connected to the first region 110a. An antenna 120 is disposed within the first region 110a, and an RF chip 140 is disposed within the second region 110b. The first region 110a includes a first sub-region covered by the antenna 120 and a second sub-region extending outward from the first sub-region by a certain distance. The outward extension distance of the first sub-region can be determined based on the radiation power of the antenna 120; the higher the radiation power of the antenna 120, the greater the extension distance can be. Furthermore, the outward extension distance of the first sub-region at different locations can be the same or different.

[0071] Zone 110a and Zone 110b can be divided into virtual regions.

[0072] For example, such as Figure 2 As shown, antenna 120 is a PIFA antenna. The dividing line is the straight line where the ends of the feed arm 112 and the short-circuit arm 113 of antenna 120 are far away from the resonant arm 111. The area on the side of the dividing line facing antenna 120 is the first region 110a, and the area on the side of the dividing line facing RF chip 140 is the second region 110b.

[0073] For example, the antenna 120 is a PIFA antenna. The first dividing line is the straight line where the ends of the feed arm 112 and the short-circuit arm 113 of the antenna 120 are far away from the resonant arm 111. The second dividing line is formed after the first dividing line is offset by a preset distance toward the antenna 120. The area between the first dividing line and the second dividing line is the first region 110a, and the area on the side of the first dividing line toward the RF chip 140 is the second region 110b.

[0074] The first region 110a and the second region 110b can also be regions divided according to the material of the substrate 110.

[0075] For example, the portion of the substrate 110 located in the second region 110b is a PCB, and the portion of the substrate 110 located in the first region 110a is a dielectric substrate made of dielectric material, and the dielectric substrate is connected to the PCB.

[0076] With the development of the Internet of Things (IoT), more and more products are equipped with communication modules to enable communication with other products. Communication modules are typically standardized, allowing them to be integrated into different products, reducing costs and shortening product development cycles. For example, communication modules can be WiFi modules, Bluetooth modules, etc. WiFi or Bluetooth modules can be integrated into televisions to enable communication between the television and other products (e.g., communication between a television and a router), or they can be integrated into air conditioners to enable communication between the air conditioner and other products (e.g., communication between an air conditioner and a router).

[0077] The performance of a communication module during operation is affected by the structure and layout of the product in which it is integrated (for example, the product's casing, driving components, etc., can easily affect the antenna 120 in the communication module, causing the resonant frequency of the antenna 120 to shift). Since different products have different structures and layouts, the performance of the communication module varies in different products.

[0078] Therefore, in this embodiment, the communication module is further provided with a dielectric resonator 130. The dielectric resonator 130 includes a dielectric material, which forms a dielectric resonant cavity. After the electromagnetic waves radiated by the antenna 120 enter the dielectric resonant cavity, they resonate within the dielectric resonant cavity, thereby adjusting the resonant frequency of the antenna 120 so that the communication module operates at the target resonant frequency.

[0079] Specifically, the dielectric resonator 130 can be studied by referring to the resonance principle of a metal resonator. The tangential component of the electric field on the electric wall and the normal component of the magnetic field on the electric wall are both zero, and the incident electromagnetic wave is completely reflected by the electric wall. Therefore, electromagnetic waves incident at a certain frequency into a closed cavity composed of ideal electric walls are reflected back and forth by the electric walls, thus generating resonance. The magnetic wall can be equivalent to a dielectric interface with a high dielectric constant. If the cavity is composed of magnetic walls, due to the duality between the magnetic wall and the electric wall, it can be used as a dielectric resonator, that is, the dielectric resonator is formed of a dielectric material with a high dielectric constant.

[0080] Dielectric materials can be one or more of the following: ceramics, dielectric substrates, polymers, high-resistivity semiconductors, flexible dielectrics, and liquid dielectrics. Electromagnetic waves radiated through dielectric materials exhibit no metal loss or surface wave loss, high radiation efficiency, easy impedance matching, and low sensitivity to dimensional errors.

[0081] When the dielectric material is solid (e.g., ceramic, dielectric substrate, polymer, high-resistivity semiconductor), the dielectric resonator 130 may include a dielectric block made of the dielectric material. When the dielectric material is liquid or flexible, the dielectric resonator 130 may include a housing with a cavity formed inside, and the dielectric material disposed within the cavity.

[0082] For example, the relative permittivity of the dielectric material can be less than or equal to 30.

[0083] Since the antenna 120 is located in the first region 110a, at least a portion of the dielectric resonator 130 is projected onto the substrate 110 in the first region 110a, making the distance between the dielectric resonator 130 and the antenna 120 relatively close, so that the electromagnetic waves radiated by the antenna 120 can enter the dielectric resonant cavity formed by the dielectric resonator 130.

[0084] Figure 4 This is the resonance characteristic diagram of a communication module without the dielectric resonator 130. Figure 5 This is a diagram showing the resonant characteristics of the communication module with dielectric resonator 130. The horizontal axis represents frequency in GHz, and the vertical axis represents the return loss of antenna 120 in dB. Figure 5 The three curves in the figure represent the resonance characteristic curves of three different dielectric resonators 130 in the communication module. The dielectric materials included in the three different dielectric resonators 130 have the same shape and thickness, and the placement of the dielectric resonators 130 is also the same. The difference lies in the relative permittivity of the dielectric materials. Curve 1 represents the resonance characteristic curve of the dielectric resonator 130 with a relative permittivity of 8, curve 2 represents the resonance characteristic curve of the dielectric resonator 130 with a relative permittivity of 15, and curve 3 represents the resonance characteristic curve of the dielectric resonator 130 with a relative permittivity of 25.

[0085] Depend on Figure 4 It can be seen that without the dielectric resonator 130, the resonant frequency of the communication module is approximately 2.88 GHz, and the return loss is approximately -14 dB. From... Figure 5 As shown in curve 3, after setting the dielectric resonator 130, the resonant frequency of the communication module is approximately 2.58 GHz, and the return loss is approximately -30 dB. Therefore, setting the dielectric resonator 130 changes the resonant frequency of the communication module, allowing it to operate at the target resonant frequency. Furthermore, setting the dielectric resonator 130 also improves the resonant amplitude and reduces the return loss, thus enhancing the performance of the communication module.

[0086] Furthermore, by Figure 5 It can be seen that, when the shape and thickness of the dielectric material are the same and the placement position of the dielectric resonator 130 is the same, the larger the relative permittivity of the dielectric material, the higher the resonant frequency and the smaller the return loss.

[0087] Figure 6 The diagram shows the resonant characteristics of communication modules with dielectric resonators of different thicknesses. The horizontal axis represents the frequency in GHz, and the vertical axis represents the return loss of antenna 120 in dB. Figure 6 The three curves in the figure represent the resonance characteristic curves when the communication module is equipped with three different dielectric resonators 130. The three different dielectric resonators 130 contain the same dielectric material with the same shape and relative permittivity, and the dielectric resonators 130 are also placed in the same position. The difference lies in the thickness of the dielectric material. Curve 1 represents the resonance characteristic curve of dielectric resonator 130 with a thickness of 0.5 mm, curve 2 represents the resonance characteristic curve of dielectric resonator 130 with a thickness of 1 mm, and curve 3 represents the resonance characteristic curve of dielectric resonator 130 with a thickness of 1.5 mm.

[0088] Depend on Figure 6 It can be seen that dielectric resonators of different thicknesses have different resonant frequencies and different return losses.

[0089] The communication module provided in this application embodiment includes a substrate 110, an antenna 120, and a dielectric resonator 130. The substrate 110 includes a first region 110a and a second region 110b connected to the first region 110a. The antenna 120 is disposed in the first region 110a, and an RF chip 140 is disposed in the second region 110b, with the RF chip 140 connected to the feed terminal of the antenna 120. At least a portion of the dielectric resonator 130, when projected onto the substrate 110, lies within the first region 110a. Because the antenna 120 is disposed within the first region 110a, and at least a portion of the dielectric resonator 130, when projected onto the substrate 110, lies within the first region 110a, the distance between the dielectric resonator 130 and the antenna 120 is relatively short, allowing electromagnetic waves radiated by the antenna 120 to enter the dielectric resonator 130. The dielectric resonator 130 is provided with a dielectric resonant cavity. After the electromagnetic waves radiated by the antenna 120 enter the dielectric resonant cavity, they resonate within the dielectric resonant cavity, thereby adjusting the resonant frequency of the antenna 120 so that the communication module operates at the target resonant frequency.

[0090] in, Figure 2 and Figure 3 In the example shown, the dielectric resonator 130 is disposed on the side of the substrate 110 away from the antenna 120. Figure 7 The diagram schematically shows a right view of another communication module, which can be understood as follows: Figure 7 As shown, the dielectric resonator 130 can also be disposed on the side of the substrate 110 facing the antenna 120. When the dielectric resonator 130 is disposed on the side of the substrate 110 facing the antenna 120, the distance between the dielectric resonator 130 and the antenna 120 is smaller. Furthermore, when the RF chip 140 is disposed on the side of the substrate 110 facing the antenna 120, the RF chip 140 and the dielectric resonator 130 are disposed on the same side, which can reduce the thickness of the communication module along the direction perpendicular to the substrate 110.

[0091] The orthographic projection of the dielectric resonator 130 onto the substrate 110 can be located within the first region 110a. That is, the entire region of the dielectric resonator 130 is located within the first region 110a when projected onto the substrate 110. Since the antenna 120 is located within the first region 110a, the distance between the dielectric resonator 130 and the antenna 120 can be brought closer, thereby making it easier for the electromagnetic waves radiated by the antenna 120 to enter the dielectric resonant cavity in the dielectric resonator 130.

[0092] Alternatively, a portion of the dielectric resonator 130 can be projected onto the substrate 110 within the first region 110a. This is achieved by ensuring that a portion of the dielectric resonator 130 is close to the antenna 120, allowing the electromagnetic waves radiated by the antenna 120 to enter the dielectric resonant cavity and form a standing wave.

[0093] The orthographic projection of the dielectric resonator 130 onto the substrate 110 can cover a portion or the entire area of ​​the first region 110a. When the orthographic projection of the dielectric resonator 130 onto the substrate 110 covers a portion of the first region 110a, the resonant frequency of the communication module can be adjusted by changing the position of the dielectric resonator 130 in the first region 110a, thereby expanding the adjustable range of the communication module's resonant frequency. The smaller the area covered by the orthographic projection of the dielectric resonator 130 onto the substrate 110, the larger the adjustable position range of the dielectric resonator 130.

[0094] For example, the shape, size, placement, relative permittivity, etc. of the dielectric resonator 130 can be determined by simulation, and then the dielectric resonator 130 can be fabricated based on the simulation results and connected to the substrate 110.

[0095] When the antenna 120 is working, it radiates electromagnetic waves into the surrounding space. At least part of the structure of the dielectric resonator 130 is located in the second sub-region in the orthogonal projection of the substrate 110, which makes it easier for the electromagnetic waves radiated by the antenna 120 to enter the dielectric resonator cavity, thereby forming a standing wave.

[0096] The orthogonal projection of the dielectric resonator 130 onto the substrate 110 can be located within the second sub-region. Figure 8 The diagram schematically shows a front view of a communication module, exemplarily, such as... Figure 8 As shown, the dielectric resonator 130 has a rectangular projection onto the substrate 110 and is located within the second sub-region. The dielectric resonator 130 has a relative permittivity of 8 for its dielectric material and a thickness of 0.5 mm perpendicular to the substrate 110.

[0097] Figure 9 for Figure 8 The diagram shows the resonant characteristic curves of the communication module. The horizontal axis represents frequency in GHz, and the vertical axis represents the return loss of antenna 120 in dB. Figure 9 As shown, the resonant frequency of the communication module is about 3.3 GHz, and the return loss is about -32 dB.

[0098] When the orthographic projection of the dielectric resonator 130 onto the substrate 110 can be located within the second sub-region, the orthographic projection of the dielectric resonator 130 onto the substrate 110 is located at the edge of the antenna 120, making the distance between the antenna 120 and the dielectric resonator 130 closer, thereby making it easier for the electromagnetic waves radiated by the antenna 120 to enter the dielectric resonator 130.

[0099] The orthogonal projection of a portion of the dielectric resonator 130 onto the substrate 110 is located in the first sub-region, and the orthogonal projection of a portion of the dielectric resonator 130 onto the substrate 110 is located in the second sub-region.

[0100] Figure 10 The diagram schematically shows a front view of a communication module, exemplarily, such as... Figure 10 As shown, the dielectric resonator 130, in its orthographic projection onto the substrate 110, covers a portion of the right side of the resonant arm 111 of the antenna 120, with the upper edge of the orthographic projection aligned with the upper edge of the first region 110a and the lower edge aligned with the lower edge of the first region 110a. The dielectric resonator 130 has a relative permittivity of 8 for its dielectric material and a thickness of 0.5 mm perpendicular to the substrate 110.

[0101] Figure 11 for Figure 10 The diagram shows the resonant characteristic curves of the communication module. The horizontal axis represents frequency in GHz, and the vertical axis represents the return loss of antenna 120 in dB. Figure 11 As shown, the resonant frequency of the communication module is about 2.8 GHz, and the return loss is about -12.5 dB.

[0102] Figure 12 The diagram schematically shows a front view of a communication module, exemplarily, such as... Figure 12 As shown, the orthographic projection of the dielectric resonator 130 onto the substrate 110 covers the feed arm 112 and short-circuit arm 113 of the antenna 120, as well as the left-hand portion of the resonant arm 111. The upper edge of the orthographic projection is aligned with the upper edge of the first region 110a, and the lower edge of the orthographic projection is aligned with the lower edge of the first region 110a. The dielectric resonator 130 has a relative permittivity of 8 for its dielectric material and a thickness of 0.5 mm perpendicular to the substrate 110.

[0103] Figure 13 for Figure 12 The diagram shows the resonant characteristic curves of the communication module. The horizontal axis represents frequency in GHz, and the vertical axis represents the return loss of antenna 120 in dB. Figure 13 As shown, the resonant frequency of the communication module is about 3.35 GHz, and the return loss is about -25 dB.

[0104] Figure 14 The diagram schematically shows a front view of a communication module, exemplarily, such as... Figure 14 As shown, the left edge of the orthographic projection of the dielectric resonator 130 onto the substrate 110 is aligned with the left edge of the first region 110a, the right edge of the orthographic projection is aligned with the right edge of the first region 110a, the lower edge of the orthographic projection is aligned with the lower edge of the first region 110a, and the upper edge of the orthographic projection is located in the middle region of the first region 110a, such that the orthographic projection covers the lower portion of the feed arm 112 and the short-circuit arm 113 of the antenna 120, as well as the lower half of the second sub-region. The dielectric resonator 130 has a relative permittivity of 8 for its dielectric material and a thickness of 0.5 mm perpendicular to the substrate 110.

[0105] Figure 15 for Figure 14 The diagram shows the resonant characteristic curves of the communication module. The horizontal axis represents frequency in GHz, and the vertical axis represents the return loss of antenna 120 in dB. Figure 15 As shown, the resonant frequency of the communication module is about 3.1 GHz, and the return loss is about -12.5 dB.

[0106] Figure 16 The diagram schematically shows a front view of a communication module, exemplarily, such as... Figure 16 As shown, the left edge of the orthographic projection of the dielectric resonator 130 onto the substrate 110 is aligned with the left edge of the first region 110a, the right edge of the orthographic projection is aligned with the right edge of the first region 110a, the upper edge of the orthographic projection is aligned with the upper edge of the first region 110a, and the lower edge of the orthographic projection is located in the middle region of the first region 110a, such that the orthographic projection covers the resonant arm 111 of the antenna 120, as well as the upper half of the feed arm 112 and the short-circuit arm 113. The dielectric resonator 130 has a relative permittivity of 8 for its dielectric material and a thickness of 0.5 mm perpendicular to the substrate 110.

[0107] Figure 17 for Figure 16 The diagram shows the resonant characteristic curves of the communication module. The horizontal axis represents frequency in GHz, and the vertical axis represents the return loss of antenna 120 in dB. Figure 17 As shown, the resonant frequency of the communication module is about 3.2 GHz, and the return loss is about -60 dB.

[0108] Figure 18 The diagram schematically shows a front view of a communication module, exemplarily, such as... Figure 18 As shown, the orthographic projection of the dielectric resonator 130 onto the substrate 110 is circular, with the upper half of the circle covering a portion of the right side of the resonant arm 111 of the antenna 120, and the lower half of the circle covering a portion of the second sub-region. The dielectric resonator 130 has a relative permittivity of 8 for its dielectric material and a thickness of 0.5 mm perpendicular to the substrate 110.

[0109] Figure 19 for Figure 18 The diagram shows the resonant characteristic curves of the communication module. The horizontal axis represents frequency in GHz, and the vertical axis represents the return loss of antenna 120 in dB. Figure 19 As shown, the resonant frequency of the communication module is about 3.3 GHz, and the return loss is about -32 dB.

[0110] It should be noted that, Figures 8 to 19 The example only shows that the orthographic projection of the dielectric resonator 130 onto the substrate 110 is a circle or a rectangle. However, the orthographic projection of the dielectric resonator 130 onto the substrate 110 can also be a sector, other polygons, or irregular shapes. This application does not limit the specific shape.

[0111] Furthermore, the thickness of the dielectric material in the dielectric resonator 130 can be less than 0.5 mm or greater than 0.5 mm. For example, the thickness of the dielectric material can be greater than or equal to 0.4 mm and less than or equal to 1.6 mm. Examples of dielectric material thicknesses include 0.4 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, and 1.6 mm.

[0112] Depend on Figures 8 to 19 It is known that when dielectric materials of the same thickness and material are placed in different positions, the resonant frequency and return loss of the communication module will differ. To enable the communication module to be compatible with different products, the dielectric resonator 130 is movably connected to the substrate 110, so that the position of the dielectric resonator 130's orthogonal projection onto the substrate 110 can be changed by moving the dielectric resonator 130. For example, the dielectric resonator 130 is movably connected to the substrate 110 along a direction parallel to the substrate 110. When the communication module is integrated into different products, the resonant frequency and return loss of the communication module can be adjusted by moving the position of the dielectric resonator 130 on the substrate 110.

[0113] There are various ways in which the dielectric resonator 130 can be movably connected to the substrate 110. For example, the substrate 110 is provided with a plurality of snap-fit ​​holes at intervals, and the dielectric resonator 130 includes a snap-fit ​​and a dielectric block connected to the snap-fit. The position of the dielectric resonator 130 can be adjusted along the direction parallel to the substrate 110 by snapping the snap-fit ​​into different snap-fit ​​holes.

[0114] Alternatively, the dielectric resonator 130 can be slidably connected to the substrate 110 along a direction parallel to the substrate 110. Because the dielectric resonator 130 is slidably connected to the substrate 110, its position can be adjusted by sliding the dielectric resonator 130. Adjustment by sliding is more convenient than using snap-fit ​​or locking holes.

[0115] A slide rail may be provided on the substrate 110, and the dielectric resonator 130 is connected to the slide rail. During adjustment, the position of the dielectric resonator 130 can be adjusted by moving the slide rail. The slide rail can have various structures, as long as it can enable the position adjustment of the dielectric resonator 130 along a direction parallel to the substrate 110.

[0116] Figure 20 A rear view of a communication module is schematically shown; Figure 21 For about Figure 20 The left view; Figure 22 for Figure 21 A magnified view of a portion of point I in the image. For example, as shown... Figures 20 to 22 As shown, the slide rail includes a limiting wall 152 and two connecting walls 151. The limiting wall 152 is parallel to and spaced apart from the substrate 110. The two connecting walls 151 are parallel to and spaced apart. One end of the connecting wall 151 is connected to the substrate 110, and the other end of at least one connecting wall 151 is connected to the limiting wall 152. The limiting wall 152, the two connecting walls 151, and the substrate 110 form a sliding path. The dielectric resonator 130 is slidably disposed within the sliding path.

[0117] like Figure 1 As shown, on the other hand, this application embodiment provides a communication device 1000, which can be a wireless communication device 1000. The communication device 1000 includes a communication module and a radio frequency chip 140 connected to the communication module. The communication device 1000 realizes wireless communication with external devices through the communication module and the radio frequency chip 140. Exemplarily, the communication device 1000 includes a housing with a receiving cavity inside, and the communication module is disposed in the receiving cavity.

[0118] The communication device 1000 can be a home appliance, such as a television, air conditioner, or refrigerator, or it can be other Internet of Things (IoT) devices. Figure 1 The example shown uses the communication device 1000 as an electrode.

[0119] The communication device 1000 provided in this application embodiment includes a communication module comprising a substrate 110, an antenna 120, and a dielectric resonator 130. The substrate 110 includes a first region 110a and a second region 110b connected to the first region 110a. The antenna 120 is disposed in the first region 110a, and a radio frequency chip 140 is disposed in the second region 110b, with the radio frequency chip 140 connected to the feed terminal of the antenna 120. At least a portion of the dielectric resonator 130, when projected onto the substrate 110, lies within the first region 110a. Because the antenna 120 is disposed within the first region 110a, and at least a portion of the dielectric resonator 130, when projected onto the substrate 110, lies within the first region 110a, the distance between the dielectric resonator 130 and the antenna 120 is relatively short, allowing electromagnetic waves radiated by the antenna 120 to enter the dielectric resonator 130. The dielectric resonator 130 is provided with a dielectric resonant cavity. After the electromagnetic waves radiated by the antenna 120 enter the dielectric resonant cavity, they resonate within the dielectric resonant cavity, thereby adjusting the resonant frequency of the antenna 120 so that the communication module operates at the target resonant frequency.

[0120] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A communication module, characterized in that, Includes substrate, antenna, and dielectric resonator; The substrate includes a first region and a second region connected to the first region, the antenna is disposed in the first region, and the second region is configured to be connected to the radio frequency chip; At least a portion of the dielectric resonator is located within the first region when projected onto the substrate; the dielectric resonator comprises a dielectric material; The dielectric resonator is movably connected to the substrate so that the position of the dielectric resonator's orthographic projection on the substrate can be changed by moving the dielectric resonator.

2. The communication module according to claim 1, characterized in that, The dielectric resonator's orthogonal projection onto the substrate covers part or all of the first region.

3. The communication module according to claim 2, characterized in that, The first region includes a first sub-region covered by the antenna and a second sub-region connected to the first sub-region, wherein at least a portion of the dielectric resonator is located within the second sub-region in the orthogonal projection of the substrate.

4. The communication module according to claim 3, characterized in that, The dielectric resonator is projected onto the substrate within the second sub-region.

5. The communication module according to claim 4, characterized in that, The orthogonal projection of the dielectric resonator onto the substrate is located at the edge of the antenna.

6. The communication module according to claim 3, characterized in that, Some of the dielectric resonators are projected onto the substrate in the first sub-region, and some of the dielectric resonators are projected onto the substrate in the second sub-region.

7. The communication module according to any one of claims 1-6, characterized in that, The dielectric resonator is connected to either the side of the substrate facing the antenna or the side of the substrate away from the antenna.

8. The communication module according to claim 1, characterized in that, The dielectric resonator is slidably connected to the substrate in a direction parallel to the substrate.

9. The communication module according to claim 8, characterized in that, The substrate is provided with a slide rail, and the dielectric resonator is connected to the slide rail.

10. The communication module according to claim 9, characterized in that, The slide rail includes a limiting wall and two connecting walls. The limiting wall is parallel to and spaced apart from the substrate. The two connecting walls are parallel to and spaced apart. One end of each connecting wall is connected to the substrate, and the other end of at least one connecting wall is connected to the limiting wall. The limiting wall, the two connecting walls, and the substrate form a sliding path, and the dielectric resonator is slidably disposed within the sliding path.

11. The communication module according to claim 1, characterized in that, The antenna is a planar antenna.

12. A communication device, characterized in that, It includes a radio frequency chip and a communication module as described in any one of claims 1-11, wherein the radio frequency chip is connected to a second region of the communication module.

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