Cooling device for an image sensor chip

Abstract

The application relates to the field of camera sensor cooling, in particular to a cooling device for an image sensor chip, which comprises a mounting shell, a mounting plate mounted in the mounting shell and a sensor chip mounted on the mounting plate, a semiconductor refrigeration device is mounted in the mounting shell, the semiconductor refrigeration device is located on the side of the sensor chip away from the mounting plate, a water cooling system is also mounted in the mounting shell, the water cooling system is located on the side of the semiconductor refrigeration device away from the sensor chip, and the heat of the sensor chip is dissipated through the semiconductor refrigeration device and the water cooling system in sequence. The application can improve the refrigeration efficiency of the sensor chip, meet the high imaging refrigeration requirement of the sensor chip when working in a high-temperature environment, and simultaneously realize various cooling modes such as air cooling, normal-temperature water cooling and low-temperature water cooling through one cooling device, so that the use is more flexible.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of camera sensor cooling, in particular to a cooling device for image sensor chip. BACKGROUND

[0002] The image sensor chips used in the existing cameras or astronomical telescopes mainly have two types of SMOS image sensors and CCD image converters, both of which use photodiodes for photoelectric conversion to convert images into digital data, and the main difference is the different ways of digital data transmission.

[0003] However, when using CMOS sensors or CCD image converters for image conversion, the temperature of the image sensor chip will rise and generate heat when working for a long time, causing thermal noise and thus interfering with image formation. Therefore, the CMOS image sensor or the CCD image converter needs to be cooled during use, and the better the cooling effect, the smaller the interference with image formation.

[0004] At present, when cooling the image sensor chip, the commonly used cooling method is semiconductor cooling, which can meet the cooling requirements of the image sensor chip in a low temperature environment. However, when the image sensor chip works in a high temperature environment, the effect of semiconductor cooling cannot meet the high imaging requirements. SUMMARY

[0005] In order to improve the cooling efficiency of the sensor chip and meet the high imaging cooling requirements of the sensor chip working in a high temperature environment, the present application provides a cooling device for image sensor chip.

[0006] The cooling device for image sensor chip provided by the present application adopts the following technical scheme:

[0007] A cooling device for image sensor chip, comprising a mounting shell, a mounting plate mounted in the mounting shell, and a sensor chip mounted on the mounting plate, a semiconductor cooling device is mounted in the mounting shell, the semiconductor cooling device is located on the side of the sensor chip away from the mounting plate, a water cooling system is also mounted in the mounting shell, the water cooling system is located on the side of the semiconductor cooling device away from the sensor chip, and the heat of the sensor chip is dissipated through the semiconductor cooling device and the water cooling system in turn.

[0008] By adopting the technical scheme, when used in a low-temperature environment, only the semiconductor refrigeration device can be used to cool the sensor chip, energy can be saved while the cooling requirement is met. When used in an indoor high-temperature environment or an outdoor high-temperature environment, the water cooling system can be started to cool the semiconductor refrigeration device, so that the heat on the semiconductor refrigeration device is taken away, the refrigeration efficiency of the semiconductor refrigeration device is improved, and the refrigeration efficiency of the sensor chip is improved, thereby meeting the high imaging refrigeration requirement of the sensor chip when working in a high-temperature environment. Since the water cooling system can be started and stopped according to requirements, the use is more flexible, energy can be saved while the sensor chip is cooled.

[0009] Optionally, a separation plate is fixedly connected to the inner wall of the mounting shell, the separation plate is sleeved on the semiconductor refrigeration device and fixedly connected with the semiconductor refrigeration device, and a closed placement cavity for placing the sensor chip is formed between the separation plate and the end of the mounting shell close to the sensor chip.

[0010] By adopting the technical scheme, the sensor chip can be protected, and pollution of the sensor chip by external dust is avoided.

[0011] Optionally, the water cooling system comprises a plate-shaped heat exchange sheet, a heat exchange channel for flowing liquid is formed in the heat exchange sheet, and a water inlet pipe and a water outlet pipe in communication with the heat exchange channel are fixedly connected to the heat exchange sheet.

[0012] By adopting the technical scheme, liquid can be delivered into the heat exchange channel through the water inlet pipe to cool the semiconductor refrigeration device, so that the liquid passing through the semiconductor refrigeration device can take away the high temperature at the semiconductor refrigeration device to cool the semiconductor refrigeration device.

[0013] Optionally, an air cooling system is installed in the mounting shell, and the air cooling system is located on the side of the water cooling system away from the semiconductor refrigeration device.

[0014] By adopting the technical scheme, when the user needs to perform air cooling, the air cooling system can be started to cool the semiconductor refrigeration device, at this time, the water cooling device mainly functions as heat transfer, thereby improving the cooling of the semiconductor refrigeration device on the sensor chip. The user can select semiconductor refrigeration device + water cooling system for cooling or semiconductor refrigeration device + air cooling system for cooling according to requirements, and the use is more flexible.

[0015] Optionally, the air cooling system comprises a heat dissipation sheet located on the side of the water cooling system away from the mounting plate and a fan installed on the side of the heat dissipation sheet away from the water cooling system.

[0016] By adopting the technical scheme, the fan can provide flowing air flow, and the heat dissipation fin can guide the air flow.

[0017] Optionally, the heat dissipation fin comprises a plurality of parallel fins and a connecting plate connected to one end of the fins away from the fan, an air flow channel for air flow is formed between two adjacent fins, and the two ends of the air flow channel are respectively communicated with the outside.

[0018] By adopting the technical scheme, the connecting plate can connect the plurality of fins as a whole, and the air flow channel is provided for the air flow to pass through, so that the liquid cooled by the water cooling system can be directly discharged to the outside to discharge the hot air emitted by the sensor chip to the outside.

[0019] Optionally, a sliding assembly is arranged in the mounting shell to drive the air cooling system to move so as to abut or separate the air cooling system from the water cooling system, and one side of the sliding assembly extends out of the mounting shell.

[0020] By adopting the technical scheme, during use, the water cooling system can be supplied with normal temperature liquid or low temperature liquid as needed, and when the water cooling system is supplied with low temperature liquid, the sliding assembly can be operated to drive the air cooling system to slide so as to separate the air cooling system from the water cooling system, so as to avoid that the air cooling system takes away the cold air in the low temperature liquid.

[0021] Optionally, an isolation sleeve is fixedly connected to the outer wall of the water cooling system, one end of the isolation sleeve is fixedly connected to the semiconductor refrigeration device, the end of the isolation sleeve facing the air cooling system forms a mounting cavity for embedding the air cooling system, and the air cooling system is slidingly installed in the mounting cavity.

[0022] By adopting the technical scheme, the isolation sleeve can protect the water cooling system, heat insulation of the water cooling system can be achieved, the cold air of the water cooling system is prevented from being emitted to the outside, so that the frost on the surface of the external components condenses into water to damage the internal components of the camera, and the sliding cooperation with the air cooling system can also be achieved.

[0023] Optionally, a sealing ring is arranged between the air cooling system and the inner wall of the isolation sleeve.

[0024] By adopting the technical scheme, the sealing between the air cooling system and the isolation sleeve can be increased, and the cold air of the water cooling system is prevented from being emitted to the outside from between the air cooling system and the isolation sleeve to damage the external components.

[0025] In summary, the present application includes at least one of the following beneficial technical effects:

[0026] 1. The present application sets up a water cooling system, so that when used in high temperature conditions, the sensor chip can be cooled by the water cooling system and the semiconductor refrigeration device at the same time, and when used in low temperature environment, only the semiconductor refrigeration device can be used to cool the sensor chip, which is more flexible to use;

[0027] 2. The present application sets up a wind cooling system to further increase the refrigeration efficiency of the sensor chip, and the user can choose to use the semiconductor refrigeration device + normal temperature water cooling system; semiconductor refrigeration device + wind cooling system; or semiconductor refrigeration device + low temperature water cooling system according to the needs, which has better refrigeration effect and meets the needs of different situations, and is suitable for higher environment, and is more flexible to use;

[0028] 3. The setting of the sliding assembly makes the wind cooling system slide relative to the water cooling system through the sliding assembly, so that the wind cooling system and the water cooling system are in abutment to cool the semiconductor refrigeration device through the wind cooling system, or the abutment relationship between the wind cooling system and the water cooling system is released, so as to avoid the wind cooling system taking away the cold temperature of the water cooling system when the water cooling system is connected with low temperature liquid; At the same time, when the water cooling system is connected with low temperature liquid, the wind cooling system is prevented from directly contacting with the water cooling system to make the side of the wind cooling system away from the water cooling system frost and condense into water droplets falling in the camera, which causes damage to the internal parts of the camera. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is the overall structure schematic diagram of the present application.

[0030] Figure 2 is the cutaway schematic diagram made for the internal structure of the present application.

[0031] Figure 3 is the structure schematic diagram after hiding the mounting shell.

[0032] Figure 4 is the schematic diagram made for the heat exchange channel structure.

[0033] Explanation of reference signs: 1, mounting shell; 12, isolation plate; 121, first plate; 122, second plate; 13, heat dissipation hole; 2, sensor chip; 3, mounting plate; 4, semiconductor refrigeration device; 41, semiconductor refrigeration sheet; 5, water cooling system; 51, heat exchange sheet; 511, heat exchange channel; 52, water inlet pipe; 53, water outlet pipe; 54, connecting pipe; 55, heat transfer plate; 6, air cooling system; 61, heat dissipation sheet; 611, fin; 612, connecting plate; 6121, fixing plate; 6122, sliding rod; 6123, sealing ring; 613, air flow channel; 614, clamping groove; 62, fan; 7, isolation sleeve; 71, mounting cavity; 8, sliding assembly; 81, driving plate; 82, fixing member; 821, fixing ring; 822, driving bolt; 823, guide rod; 83, abutting plate. DETAILED DESCRIPTION

[0034] The following will be described in detail with reference to the accompanying drawings. Figures 1-4 The present application is further described in detail.

[0035] The present application discloses a cooling device for image sensor chip. Referring to Figure 1 and Figure 2 , the cooling device for image sensor chip comprises a cylindrical mounting shell 1 with both ends closed, a sensor chip 2 is mounted in the mounting shell 1, a mounting plate 3 for fixing the sensor chip 2 is mounted in the mounting shell 1, and the sensor chip 2 is located at one end of the mounting plate 3. The mounting plate 3 can be a circuit board, and the sensor chip 2 is plugged into the circuit board. A semiconductor refrigeration device 4 for refrigerating the sensor chip 2 is mounted at the end of the sensor chip 2 away from the mounting plate 3.

[0036] Referring to Figure 2 , the semiconductor refrigeration device 4 comprises a plurality of semiconductor refrigeration sheets 41 connected in series. In this application, three semiconductor refrigeration sheets 41 are taken as an example to realize three-stage cooling. The semiconductor refrigeration sheets 41 can be selected from existing thermoelectric refrigerators on the market. Each semiconductor refrigeration sheet 41 has its heat absorption side facing the sensor chip 2 and its heat release side facing away from the sensor chip 2. The semiconductor refrigeration sheet 41 closest to the sensor chip 2 absorbs the heat generated by the sensor chip 2 during operation, and the absorbed heat is released from the side of the semiconductor refrigeration sheet 41 away from the sensor chip 2. The heat released by the first semiconductor refrigeration sheet 41 is absorbed by the semiconductor refrigeration sheet 41 located in the middle, and the process is repeated in sequence until the heat is dissipated from the side of the third semiconductor refrigeration sheet 41 away from the sensor chip 2. Therefore, the refrigeration efficiency of the semiconductor refrigeration device 4 depends on the heat dissipation speed of the semiconductor refrigeration sheet 41 farthest from the sensor chip 2.

[0037] In order to improve the refrigeration efficiency of the semiconductor refrigeration device 4 and meet the requirement of high imaging of the sensor chip 2 in a high temperature environment, a water cooling system 5 is further arranged at the end of the semiconductor refrigeration device 4 away from the sensor chip 2. The water cooling system 5 can refrigerate one semiconductor refrigeration piece 41 away from the sensor chip 2, so as to quickly take away the heat emitted by the semiconductor refrigeration piece 41 and improve the refrigeration efficiency of the semiconductor refrigeration device 4 on the sensor chip 2.

[0038] With reference to Figure 2 and Figure 3 , the water cooling system 5 includes a plate-shaped heat exchange sheet 51 fixed at the end of the semiconductor refrigeration device 4 away from the sensor chip 2, which can reduce the floor area and realize efficient heat exchange in a limited space. A heat transfer plate 55 is arranged between the heat exchange sheet 51 and the semiconductor refrigeration device 4, and the heat transfer plate 55 is fixed on the heat exchange sheet 51 to realize heat transfer. The heat exchange sheet 51 is fixed in the mounting shell 1, and a heat exchange channel 511 for liquid flow is arranged in the heat exchange sheet 51. An inlet pipe 52 and an outlet pipe 53 are further fixed on the heat exchange sheet 51 and communicate with the heat exchange channel 511. The inlet pipe 52 and the outlet pipe 53 are respectively connected to two ends of the heat exchange channel 511. In use, a water storage tank can be installed in the mounting shell 1, and the inlet pipe 52 and the outlet pipe 53 are respectively connected to the water storage tank. The liquid in the water storage tank is pumped into the heat exchange channel 511 through the water pump on the water storage tank. The liquid in the heat exchange channel 511 flows out of the outlet pipe 53 into the water storage tank, and the liquid flowing through the heat exchange channel 511 contacts the heat releasing side of the semiconductor refrigeration piece 41 away from the sensor chip 2 through the heat exchange sheet 51, so as to take away the heat emitted by the semiconductor refrigeration device 4 and improve the refrigeration efficiency of the semiconductor refrigeration device 4 on the sensor chip 2.

[0039] Of course, the water storage tank can also be installed outside the mounting shell 1. At this time, two connecting pipes 54 for connecting with the external water storage tank are arranged on the mounting shell 1, and the two connecting pipes 54 are arranged to penetrate the mounting shell 1. In use, the ends of the two connecting pipes 54 located outside the mounting shell 1 are directly connected to the water storage tank, and the ends of the two connecting pipes 54 located inside the mounting shell 1 are respectively connected to the inlet pipe 52 and the outlet pipe 53.

[0040] With reference to Figure 4 , the heat exchange channel 511 can be in a continuous S shape to increase the flow area of the liquid and improve the heat exchange efficiency.

[0041] With reference to Figure 2 and Figure 3At the end of the water cooling system 5 away from the semiconductor refrigeration device 4, a wind cooling system 6 is also installed. The heat exchange fin 51 is made of metal material, which is convenient for heat conduction. When the user needs to use the wind cooling system 6 for cooling, the water cooling system 5 can be stopped, and the wind cooling system 6 is started. At this time, the heat on the semiconductor refrigeration device 4 is transmitted to the wind cooling system 6 through the heat exchange fin 51, so as to cool the semiconductor refrigeration device 4 through the wind cooling system 6. Of course, the user can also choose to use the water cooling system 5 and the wind cooling system 6 together to cool the semiconductor refrigeration device 4 according to the need, which is more flexible. At the same time, the cooling efficiency of the semiconductor refrigeration device 4 on the sensor chip 2 is greatly improved.

[0042] The wind cooling system 6 includes a heat sink 61 located at the side of the water cooling system 5 away from the semiconductor refrigeration device 4, and a fan 62 installed at the side of the heat sink 61 away from the water cooling system 5.

[0043] The heat sink 61 includes a plurality of parallel fins 611 and a connecting plate 612 integrally connected to the ends of the plurality of fins 611 away from the fan 62. The fan 62 can be installed on the side of the fin 611 away from the connecting plate 612 by bolts or the like. The side of the connecting plate 612 away from the fin 611 can abut against the heat exchange fin 51 to take away the heat on the heat exchange fin 51. Adjacent two fins 611 form an air flow passage 613 for air flow. Meanwhile, heat dissipation holes 13 are provided on the opposite sides of the installation shell 1 for the fins 611 to pass through. The two ends of the air flow passage 613 are respectively communicated with the outside through the heat dissipation holes 13 on the two sides of the installation shell 1, so as to discharge heat to the outside.

[0044] Referring to Figure 2 In order to protect and seal the sensor chip 2, an isolation plate 12 is fixed to the inner wall of the installation shell 1. The isolation plate 12 can be sleeved on the water cooling system 5 and fixed to the water cooling system 5. The isolation plate 12 can also be sleeved on the semiconductor refrigeration device 4 and fixed to the semiconductor refrigeration device 4. The present application takes the isolation plate 12 sleeved on the semiconductor refrigeration device 4 and fixed to the side of the water cooling system 5 facing the semiconductor refrigeration device 4 as an example for description. The isolation plate 12 is arranged to form a sealed placement cavity for placing the sensor chip 2 between the isolation plate 12 and the end of the installation shell 1 close to the sensor chip 2.

[0045] The isolation plate 12 includes a first plate 121 fixed to the installation shell 1 and a second plate 122 fixed between the first plate 121 and the water cooling system 5. The side of the second plate 122 away from the first plate 121 is fixed to the heat exchange fin 51.

[0046] In the start of water cooling system 5, can choose to pass into the normal temperature liquid into the heat exchange channel 511 according to the need; of course, also can install the refrigerating machine between the fin 61 and the water storage tank for making the normal temperature liquid into the low temperature liquid, to pass into the low temperature liquid into the heat exchange channel 511 according to the need. Among them, the normal temperature liquid can be 10 degrees to 20 degrees between water, low temperature liquid can be negative 10 degrees to 10 degrees between the liquid, the liquid can be anti-freezing liquid also can be anti-freezing liquid + water mixture, anti-freezing liquid is the existing anti-freezing agent or gas liquid on the market, as long as it has the performance of not freezing below 0 degrees. When the outside air temperature is higher and the refrigeration efficiency is higher, the refrigerating machine and the water cooling system 5 can be started at the same time, at this time the liquid in the water storage tank will be driven by the water pump to pass through the refrigerating machine and reach the heat exchange channel 511, so as to cool the semiconductor refrigeration device 4 by low temperature liquid and improve the cooling efficiency.

[0047] In order to reduce the waste of energy caused by the cold air of water cooling system 5 spreading from the four sides of fin 61 to the outside, and also to reduce the cold air of water cooling system 5 spreading to the remaining parts of the camera, so that the remaining parts become cold, frost and water condensation phenomenon occurs when encountering high temperature gas outside, causing damage to the remaining parts, a isolation sleeve 7 is surrounded around the fin 61, the isolation sleeve 7 is sleeved on the fin 61, the inner wall of one end of the isolation sleeve 7 can be fixedly connected with the outer wall of the semiconductor refrigeration device 4, or can be fixedly connected with the isolation plate 12, and the application takes the isolation sleeve 7 and the second plate 122 as an example to illustrate, the other end of the isolation sleeve 7 forms a mounting cavity 71 for embedding the air cooling system 6, so that the water cooling system 5 is sleeved in the closed placement cavity formed by the isolation sleeve 7 and the mounting shell 1 close to the sensor chip 2, reducing the loss of cold air, also reducing the probability of damage to the remaining parts caused by the remaining parts being affected by cold gas and frost and water condensation when encountering high temperature gas outside. At the same time, the isolation sleeve 7 is provided with a avoiding hole (not shown in the figure) for the water inlet pipe 52 and the water outlet pipe 53.

[0048] When using, when the low temperature liquid is passed into the heat exchange channel 511, if the air cooling system 6 is started at this time, the air cooling system 6 will take away the cold air of water cooling system 5, reducing the refrigeration of semiconductor refrigeration device 4 by water cooling system 5, causing waste of energy. At the same time, if the air cooling system 6 and the water cooling system 5 are in contact, it will also lead to frost and water condensation phenomenon on the surface of air cooling system 6 when the air cooling system 6 contacts with high temperature gas, and the water droplets condensed on the surface of air cooling system 6 will fall into the inside of mounting shell 1 and damage the remaining parts in the camera. In order to reduce the probability of the above situation, the application is provided with air cooling system 6 slidingly installed in the mounting cavity 71, so that the air cooling system 6 and the water cooling system 5 are not in contact, reducing the probability of loss of cold air of water cooling system 5 from air cooling system 6, and also reducing the direct contact of cold air of water cooling system 5 with air cooling system 6.

[0049] Specifically, the connecting plate 612 comprises a fixed plate 6121 fixedly connected with the plurality of fins 611 and a sliding rod 6122 fixedly connected at a side of the fixed plate 6121 away from the fins 611, the sliding rod 6122 is slidingly connected in the mounting cavity 71, and the sliding assembly 8 for driving the air cooling system 6 to move in the mounting cavity 71 is arranged in the mounting shell 1, a side of the sliding assembly 8 away from the air cooling system 6 extends out of the mounting shell 1 through the heat dissipation hole 13 to facilitate the operation of people. When the normal-temperature liquid is introduced into the heat exchange channel 511, the staff can choose whether to start the air cooling system 6 according to the needs, at this time, a side of the sliding rod 6122 away from the fixed plate 6121 abuts against the side wall of the fin 61. When the low-temperature liquid is introduced into the heat exchange channel 511, the staff can operate the sliding assembly 8 to drive the water cooling system 5 to slide in the mounting cavity 71 from outside, so that the air cooling system 6 is separated from the water cooling system 5 to reduce the speed of the cold air in the water cooling system 5 being taken away by the sliding rod 6122 directly contacting the fin 61.

[0050] The isolation sleeve 7 can be made of plastic material, or other materials having heat insulation effect, as long as it can protect the water cooling system 5 and reduce the speed of the cold air in the water cooling system 5 being taken away to the outside.

[0051] With reference to Figure 1 and Figure 2 The sliding assembly 8 comprises a driving plate 81 fixedly connected to the connecting plate 612, an end of the driving plate 81 away from the connecting plate 612 is slidingly connected in the heat dissipation hole 13, and the staff directly operates the driving plate 81 to slide in the heat dissipation hole 13 from outside, so as to drive the air cooling system 6 to slide. Meanwhile, a fixing member 82 for fixing the position of the driving plate 81 is arranged between the outer wall of the mounting shell 1 and the driving plate 81, so as to fix the driving plate 81 at a suitable position of the mounting shell 1.

[0052] Of course, in order to facilitate the driving plate 81 to drive the entire air cooling system 6 to slide, the driving plate 81 can be symmetrically provided with two, and the two driving plates 81 are respectively located at opposite sides of the air cooling system 6.

[0053] The fixing member 82 comprises a fixing ring 821 fixedly connected to the mounting shell 1 and a driving bolt 822 threadedly connected to the fixing ring 821, the driving bolt 822 is rotationally connected with the driving plate 81, and when the distance that the driving bolt 822 is screwed on the fixing ring 821 is operated, the distance between the driving plate 81 and the fixing ring 821 can be changed, so as to drive the water cooling system 5 to move.

[0054] Meanwhile, the fixed ring 821 is also fixedly connected with a guide rod 823 for guiding the moving direction of the driving plate 81, and the length direction of the guide rod 823 is consistent with the axis direction of the mounting shell 1. The guide rod 823 penetrates the driving plate 81 and is in sliding fit with the driving plate 81, and when the driving plate 81 is driven to move relative to the fixed ring 821 by rotating the driving bolt 822, the driving plate 81 also moves along the length direction of the guide rod 823 to drive the sliding rod 6122 to slide in the mounting cavity 71.

[0055] With reference to Figure 2 In order to avoid the gap between the water cooling system 5 and the heat dissipation hole 13 when the driving plate 81 drives the water cooling system 5 to slide relative to the mounting shell 1, so that the external dust reaches the mounting shell 1 and pollutes the parts in the mounting shell 1, a clamping groove 614 is arranged on the side of the heat dissipation fin 61 away from the connecting plate 612 for embedding the mounting shell 1, and the clamping groove 614 is arranged on the outer wall of the heat dissipation fin 61 close to the fan 62, and the abutting plate 83 is fixedly connected to the side of the driving plate 81 away from the heat dissipation fin 61, and the abutting plate 83 is in abutment with the inner wall of the mounting shell 1. When the driving plate 81 drives the water cooling system 5 to slide, the positions of the mounting shell 1 on both sides of the heat dissipation hole 13 are in abutment with and slide relative to the clamping groove 614 and the abutting plate 83, respectively.

[0056] With reference to Figure 2 In order to reduce the waste of energy caused by the cold air in the water cooling system 5 reaching the outside from between the inner wall of the mounting cavity 71 and the outer wall of the sliding rod 6122, and also to reduce the phenomenon that the part of the water cooling system 5 in the mounting cavity 71 is covered with frost and water due to the high-temperature gas from the outside reaching the mounting cavity 71, a sealing ring 6123 is arranged between the outer wall of the sliding rod 6122 and the inner wall of the mounting cavity 71, and a mounting groove (not shown in the figure) is arranged on the outer wall of the sliding rod 6122 for embedding the sealing ring 6123, so as to realize the mounting and fixing of the sealing ring 6123.

[0057] It can be understood that in actual use, the water cooling system 5+semiconductor refrigeration device 4 can be selected to refrigerate, at this time the water cooling system 5 can pass in normal temperature liquid or low temperature liquid; or the semiconductor refrigeration device 4+air cooling system 6 can be selected to refrigerate, at this time the air cooling system 6 is in abutment with the water cooling system 5, the water cooling system 5 plays a role of heat conduction, and can transmit the heat on the semiconductor refrigeration device 4 to the air cooling system 6 to cool the semiconductor refrigeration device 4 through the air cooling system 6; of course, the water cooling system 5+semiconductor refrigeration device 4+air cooling system 6 can also be selected to refrigerate, at this time the water cooling system 5 passes in normal temperature liquid. There are many modes for people to choose, and the use range is wider.

[0058] The implementation principle of the cooling device of the image sensor chip embodiment of the present application is as follows: in use, the staff can select whether to cool the sensor chip 2 only by the semiconductor refrigeration device 4, or to select the semiconductor refrigeration device 4+water cooling system 5 and input normal temperature liquid cooling into the water cooling system 5, or to select the semiconductor refrigeration device 4+air cooling system 6 cooling, or to select the semiconductor refrigeration device 4+water cooling system 5 and input low temperature liquid cooling into the water cooling system 5 according to the external weather temperature and the needs. When the water cooling system 5 is input low temperature liquid, the staff can directly rotate the bolt 822 to drive the air cooling system 6 to move, so that the gap is left between the sliding rod 6122 and the cooling fin 61, and the energy waste caused by the cold air on the cooling fin 61 directly transferred to the sliding rod 6122 is reduced. The requirements of different imaging under various temperature conditions of people are met, and the use is more flexible.

[0059] The above are the preferred embodiments of the present application, and do not limit the protection scope of the present application, so: all equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A cooling device for an image sensor chip, characterized by: The application relates to a sensor chip mounting device, which comprises a mounting shell (1), a mounting plate (3) mounted in the mounting shell (1) and a sensor chip (2) mounted on the mounting plate (3), wherein a semiconductor refrigerating device (4) is mounted in the mounting shell (1) and located on the side of the sensor chip (2) away from the mounting plate (3), a water cooling system (5) is also mounted in the mounting shell (1) and located on the side of the semiconductor refrigerating device (4) away from the sensor chip (2), and the heat of the sensor chip (2) is dissipated through the semiconductor refrigerating device (4) and the water cooling system (5) in sequence. The mounting shell (1) is provided with an air cooling system (6) located on the side of the water cooling system (5) away from the semiconductor refrigerating device (4). The mounting shell (1) is provided with a sliding assembly (8) for driving the air cooling system (6) to move so as to make the air cooling system (6) abut against or separate from the water cooling system (5), and the sliding assembly (8) extends out of the mounting shell (1) on one side. When the water cooling system (5) is supplied with low-temperature liquid, the sliding assembly (8) drives the air cooling system (6) to separate from the water cooling system (5).

2. The apparatus for cooling an image sensor chip according to claim 1, characterized by: The semiconductor refrigerating device (4) comprises a plurality of semiconductor refrigerating sheets (41) which are sequentially attached, and each semiconductor refrigerating sheet (41) is arranged with the heat absorbing side facing the sensor chip (2), and the semiconductor refrigerating device (4) is clamped between the sensor chip (2) and the water cooling system (5).

3. The apparatus for cooling an image sensor chip according to claim 1, wherein: The mounting shell (1) is provided with an isolation plate (12) fixedly connected to the inner wall of the mounting shell (1), the isolation plate (12) is sleeved on the semiconductor refrigerating device (4) and fixedly connected to the semiconductor refrigerating device (4), and a closed placement cavity for placing the sensor chip (2) is formed between the isolation plate (12) and the end of the mounting shell (1) close to the sensor chip (2).

4. The apparatus for cooling an image sensor chip according to claim 1, wherein: The water cooling system (5) comprises a plate-shaped heat exchange sheet (51) provided with a heat exchange channel (511) for flowing liquid in the interior of the heat exchange sheet (51), and the heat exchange sheet (51) is fixedly connected with a water inlet pipe (52) and a water outlet pipe (53) in communication with the heat exchange channel (511).

5. The apparatus for cooling an image sensor chip according to claim 1, wherein: The air cooling system (6) comprises a heat dissipation sheet (61) located on the side of the water cooling system (5) away from the mounting plate (3) and a fan (62) mounted on the side of the heat dissipation sheet (61) away from the water cooling system (5).

6. The apparatus for cooling an image sensor chip according to claim 5, wherein: The heat dissipation fin (61) comprises a plurality of parallel fins (611) and a connecting plate (612) connected to one end of the fins (611) away from the fan (62), an air flow channel (613) is formed between two adjacent fins (611) for air flow, and the two ends of the air flow channel (613) are respectively communicated with the outside, and the heat of the sensor chip (2) is sequentially dissipated from the two ends of the air flow channel (613) through the semiconductor refrigeration device (4), the water cooling system (5) and the air cooling system (6).

7. The apparatus for cooling an image sensor chip according to claim 1, wherein: An isolation sleeve (7) is fixed to the outer wall of the water cooling system (5), one end of the isolation sleeve (7) towards the air cooling system (6) forms a mounting cavity (71) for embedding the air cooling system (6), and the air cooling system (6) is slidingly installed in the mounting cavity (71).

8. The cooling device for an image sensor chip according to claim 7, wherein: A sealing ring (6123) is arranged between the air cooling system (6) and the inner wall of the isolation sleeve (7).

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