PCB separating method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- WUXI GREATECH MICROELECTRONICS TECH CO LTD
- Filing Date
- 2023-02-13
- Publication Date
- 2026-05-29
AI Technical Summary
In existing technologies, the pre-cutting line cannot be accurately positioned during PCB panel separation, resulting in quality problems such as warping and rough edges, which affects the yield and production cost of PCB panels.
A PCB separation method is adopted, in which the PCB panel is placed on the lower plate with positioning components, so that the pre-cut line coincides with the axis of the hinge component. The lower plate is pressed by the cover plate and folded in half to separate it into individual boards. The positioning components and hinge components are used to accurately position and separate the boards.
It improves the quality of PCB boards, reduces defect rates and production costs, ensures accurate positioning of pre-cutting lines during the board separation process, and reduces damage to PCB boards.
Smart Images
Figure CN116321728B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of PCB depaneling technology, and more specifically, to a PCB depaneling method. Background Technology
[0002] A PCB (printed circuit board) is a crucial component in the electronics industry. Almost every electronic device, containing integrated circuits or other electronic components, requires a PCB for electrical interconnection. The PCB manufacturing process involves first producing PCB panels, and then separating these panels into individual boards.
[0003] However, in the existing technology, when separating PCB panels, quality problems such as warping and rough edges often occur, resulting in low yield of the obtained PCB single boards and increased production costs. Summary of the Invention
[0004] The inventors of this application have discovered through research that the warping and rough edge quality problems that occur during PCB separation are closely related to the separation methods in related technologies. The separation methods used in related technologies cannot accurately locate the V-CUT lines (pre-cut lines) on the PCB panel, resulting in uneven stress at the separation point, which in turn affects the quality of the PCB panels after separation.
[0005] The main purpose of this application is to provide a PCB depaneling method, which aims to solve the technical problem in the prior art that the pre-cutting lines on the PCB panel cannot be accurately located, thus affecting the quality of the PCB single board after depaneling.
[0006] To achieve the above objectives, this application provides a PCB depaneling method, the method comprising:
[0007] The PCB panel is placed on a lower plate equipped with a positioning element; wherein, the lower plate includes a first lower plate and a second lower plate, the first lower plate and the second lower plate are connected by a hinge, and the positioning element is used to position the PCB panel so that the pre-cut line of the PCB panel coincides with the axis of the hinge.
[0008] The PCB panel is pressed onto the first lower plate and the second lower plate by the first cover plate and the second cover plate; wherein, the first cover plate corresponds to the first lower plate and the second cover plate corresponds to the second lower plate;
[0009] The first lower plate and the second lower plate are folded along the pre-cut line of the PCB panel to divide the PCB panel into at least two PCB boards.
[0010] In one possible implementation, both the first lower plate and the second lower plate are provided with hinge angles, and the hinge element includes a hinge pin connected between the hinge angles of the first lower plate and the second lower plate to hinge the first lower plate and the second lower plate; the positioning element includes a positioning post.
[0011] The step of placing the PCB panel onto the first lower plate and the second lower plate, which are equipped with positioning components, includes:
[0012] The PCB panel is placed on the first lower plate and the second lower plate, which are equipped with positioning posts; wherein the positioning posts are used to position the PCB panel so that the pre-cut line of the PCB panel coincides with the axis of the hinge pin.
[0013] In one possible implementation, both the first lower plate and the second lower plate are provided with mounting grooves, and the positioning post is disposed in the mounting groove.
[0014] The step of placing the PCB panel on the lower plate equipped with positioning components includes:
[0015] Place the PCB panel into the mounting slot of the lower plate, which has positioning posts.
[0016] In one possible implementation, the first lower plate is connected to the first cover plate via a first flipping member, and the second lower plate is connected to the second cover plate via a second flipping member; both the first lower plate and the second lower plate are equipped with locking components.
[0017] The step of pressing the PCB panel onto the first lower plate and the second lower plate using the first cover plate and the second cover plate includes:
[0018] Flip the first cover plate around the first flipping component toward the PCB panel;
[0019] Flip the second cover plate around the second flipping component toward the PCB panel;
[0020] The locking assembly locks the first cover plate to the first lower plate and the second cover plate to the second lower plate, thereby pressing the PCB panel together.
[0021] In one possible implementation, the locking assembly includes a movable pin and a movable latch, the movable latch being positioned near the hinge; the movable pin is mounted on the first cover plate / second cover plate by fastening screws, the movable latch is mounted on the first lower plate / second lower plate by a locking pivot pin, a locking torsion spring is mounted on the locking pivot pin, and a latch is provided on the movable latch;
[0022] The step of locking the first cover plate to the first lower plate and the second cover plate to the second lower plate using the locking assembly to press the PCB panel together includes:
[0023] The movable pin is engaged in the latch, and a locking force is applied to the movable pin by the locking torsion spring located in the latch; wherein the locking force is used to lock the first cover plate and the first lower plate, and the second cover plate and the second lower plate respectively, so as to press the PCB panel together.
[0024] In one possible implementation, the latch is provided with a limiting surface, which is used to limit the position of the locking torsion spring, thereby limiting the positions of the first cover plate and the second cover plate.
[0025] In one possible implementation, both the first cover plate and the second cover plate are provided with rubber pads, which are used to fill the gap between the first cover plate / second cover plate and the movable buckle.
[0026] In one possible implementation, the movable pin has a slotted hole through which the fastening screw passes and is movable along the length of the slotted hole; the movable pin includes a wedge-shaped structure for clamping PCB panels of different thicknesses.
[0027] In one possible implementation, the first flipping member includes a first flipping pin mounted on the first lower plate and a first flipping torsion spring mounted on the first flipping pin; the second flipping member includes a second flipping pin mounted on the second lower plate and a second flipping torsion spring mounted on the second flipping pin.
[0028] The step of flipping the first cover plate around the first flipping member toward the PCB panel includes:
[0029] The first cover plate is flipped around the first flip pin toward the PCB panel by the flipping force applied to the first cover plate by the first flipping torsion spring.
[0030] The step of flipping the second cover plate around the second flipping member toward the PCB panel includes:
[0031] The second cover plate is flipped around the second flip pin toward the PCB panel by the flipping force applied to the second cover plate by the second flipping torsion spring.
[0032] In one possible implementation, a limiting force-bearing component is provided between the first lower plate and the second lower plate, the limiting force-bearing component being used to prevent the first lower plate and the second lower plate from misaligning;
[0033] The limiting force-bearing component includes a limiting force-bearing groove and a limiting force-bearing protrusion that are interlocked with each other. The limiting force-bearing groove is opened on the side of the first lower plate, and the limiting force-bearing protrusion is disposed on the side of the second lower plate.
[0034] Compared with the prior art, this application has the following beneficial effects:
[0035] This application proposes a PCB panel separation method, in which a PCB panel is placed on a lower plate equipped with a positioning member; wherein the lower plate includes a first lower plate and a second lower plate, which are connected by a hinge; the positioning member is used to position the PCB panel so that the pre-cut line of the PCB panel coincides with the axis of the hinge; the PCB panel is pressed onto the first lower plate and the second lower plate by a first cover plate and a second cover plate; wherein the first cover plate corresponds to the first lower plate and the second cover plate corresponds to the second lower plate; the first lower plate and the second lower plate are folded along the pre-cut line of the PCB panel to separate the PCB panel into at least two PCB boards.
[0036] In other words, when it is necessary to divide a PCB panel into several PCB boards, the PCB panel is first placed on the first lower plate and the second lower plate. Positioning devices on the first and second lower plates are used to align the pre-cut line of the PCB panel with the axis of the hinge. Then, the first and second cover plates are used to press the PCB panel together. Finally, the first and second lower plates are folded in half to divide the PCB panel into individual PCB boards. Because the positioning devices on the first and second lower plates align the pre-cut line of the PCB panel with the axis of the hinge, when a folding force is applied to the first and second lower plates, this force is applied precisely to the axis of the hinge, and also to the pre-cut line of the PCB panel, thus allowing for more accurate positioning of the pre-cut line on the PCB panel. Since the folding force is applied precisely at the pre-cut line of the PCB panel, a relatively smaller force is required to divide the PCB panel into individual PCB boards. At the same time, the folding force applied outside the pre-cut line of the PCB panel is relatively smaller, thus reducing damage to the PCB board caused by the folding force and preventing defects such as warping and burrs on the individual PCB boards. This improves the quality of the divided PCB boards, reduces the defect rate, and lowers production costs. Attached Figure Description
[0037] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0038] Figure 1 A flowchart illustrating a PCB depaneling method provided in an embodiment of this application;
[0039] Figure 2 An exploded view of the board separation tooling for implementing the PCB board separation method provided in the embodiments of this application;
[0040] Figure 3 A three-dimensional structural diagram showing that the first cover plate and the second cover plate are not in contact with the first lower plate and the second lower plate, respectively, according to an embodiment of this application.
[0041] Figure 4 A three-dimensional structural diagram showing the first cover plate and the second cover plate in contact with the first lower plate and the second lower plate, respectively, according to an embodiment of this application.
[0042] Figure 5 A three-dimensional structural diagram of the first and second lower plates folded in half, provided in an embodiment of this application;
[0043] Figure 6 A schematic diagram of the bottom three-dimensional structure of the panel splitting tooling provided in an embodiment of this application;
[0044] Figure 7 A partial three-dimensional structural diagram of a positioning post set in the mounting groove provided in an embodiment of this application;
[0045] Figure 8 This is a three-dimensional structural diagram of the movable buckle provided in the embodiments of this application;
[0046] Figure 9 This is a three-dimensional structural diagram of the movable pin provided in an embodiment of this application.
[0047] Figure Descriptions: 1. Rubber pad; 2. First cover plate; 3. Movable pin; 31. Strip hole; 32. Wedge structure; 4. Fastening screw; 5. Second cover plate; 6. Second flip pin; 7. Second flip torsion spring; 8. Mounting groove; 9. Second lower plate; 10. Locking torsion spring; 11. Movable buckle; 111. Clamp; 112. Limiting surface; 12. Hinge pin; 13. Hinge angle; 14. Locking pivot pin; 15. First lower plate; 16. First flip pin; 17. First flip torsion spring; 18. Limiting force groove; 19. Limiting force protrusion; 20. Positioning post. Detailed Implementation
[0048] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0049] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0050] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0051] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0052] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0053] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0054] PCB (Printed Circuit Board), or simply PCB, is a crucial component in the electronics industry. The PCB manufacturing process begins with producing PCB panels, which consist of multiple individual PCB boards separated by V-CUT lines (pre-cut lines). After the PCB panels are produced, they are then separated into individual boards. In a Class 1000 cleanroom, PCB separation requires a dust-free, noise-free, lightweight, simple, safe, and fast operation, while also meeting PCB size specifications. However, suitable equipment is currently difficult to find.
[0055] Separating PCB panels requires appropriate tooling. Currently, PCB separation methods primarily utilize three types of tooling: First, chain-guided systems; the guide rail drives a circular blade, which in turn is controlled by a stepper motor for reciprocating cutting motion. The PCB is placed in the cutting area during the process, and this action is repeated. Second, laser cutting; the PCB is secured with tooling or special tape, the power and cutting program are set, and the laser completes the cutting operation. Third, simple tooling; the PCB is clamped using simple tooling and then broken off by hand.
[0056] The above three PCB separation methods can all achieve the separation purpose, but they have obvious drawbacks and are not suitable for certain products. The main disadvantages are: significant dust and noise are present; the cutting operation is dangerous and the machine is heavy; the cost is too high, with a single laser cutter costing hundreds of thousands or even millions of dollars; it is not suitable for PCBs requiring high cutting precision; the PCB warps severely when prying it apart using simple tooling, which can cause components to fall off; the large size and weight make it difficult to operate and move; the bending force point of the device is not placed at the closest point to the V-CUT line, requiring considerable force to pry the board apart; gaps are created in the device after the movable clips hold the left and right cover plates, causing warping and burrs on the PCB during prying, and posing a risk of components warping and falling off.
[0057] In summary, currently, when separating PCB panels, the separation tooling cannot accurately position the V-CUT lines (pre-cut lines) on the PCB panel, thus affecting the quality of the individual PCB boards after separation.
[0058] To address the aforementioned technical problems, this application provides a PCB depaneling method, such as... Figures 1-5 As shown, Figure 1 A flowchart illustrating a PCB depaneling method provided in an embodiment of this application; Figure 2 An exploded view of the board separation tooling for implementing the PCB board separation method provided in the embodiments of this application; Figure 3A three-dimensional structural diagram showing that the first cover plate and the second cover plate are not in contact with the first lower plate and the second lower plate, respectively, according to an embodiment of this application. Figure 4 A three-dimensional structural diagram showing the first cover plate and the second cover plate in contact with the first lower plate and the second lower plate, respectively, according to an embodiment of this application. Figure 5 A three-dimensional structural diagram of the first and second lower plates folded together, provided in an embodiment of this application. The method includes:
[0059] S10: Place the PCB panel on the lower plate equipped with a positioning member; wherein the lower plate includes a first lower plate 15 and a second lower plate 9, the first lower plate 15 and the second lower plate 9 are connected by a hinge member, and the positioning member is used to position the PCB panel so that the pre-cut line of the PCB panel coincides with the axis of the hinge member.
[0060] In the specific implementation process, the PCB panel is cut into multiple PCB individual boards along the pre-cutting line using a panel separation fixture. The panel separation fixture in this application includes a first lower plate 15 and a second lower plate 9 hinged together by hinges. Several positioning elements for positioning the PCB panels are provided on the first lower plate 15 and the second lower plate 9. When separating the PCB panel, the PCB panels are first positioned and installed on the first lower plate 15 and the second lower plate 9 by the positioning elements. Specifically, several grooves corresponding to the positioning elements can be provided on the PCB panel. When the grooves on the PCB panel respectively cooperate with the positioning elements, the pre-cutting line of the PCB panel coincides with the axis of the hinge.
[0061] S11: The PCB panel is pressed onto the first lower plate 15 and the second lower plate 9 by the first cover plate 2 and the second cover plate 5; wherein the first cover plate 2 corresponds to the first lower plate 15, and the second cover plate 5 corresponds to the second lower plate 9.
[0062] In the specific implementation process, the PCB separation fixture of this application also includes a first cover plate 2 and a second cover plate 5, and the first cover plate 2 corresponds to the first lower plate 15. Here, "corresponding" means that when pressing the PCB panel, the first cover plate 2 presses on the first lower plate 15; similarly, the second cover plate 5 corresponds to the second lower plate 9, and here, "corresponding" means that when pressing the PCB panel, the second cover plate 5 presses on the second lower plate 9. Therefore, when separating the PCB panel, the first cover plate 2 is pressed on the first lower plate 15, and the second cover plate 5 is pressed on the second lower plate 9. In this way, at least two unseparated PCB boards are located between the first cover plate 2 and the first lower plate 15, and between the second cover plate 5 and the second lower plate 9, respectively. The pre-cutting lines of the two unseparated PCB boards are located between the first lower plate 15 and the second lower plate 9, which is also between the first cover plate 2 and the second cover plate 5.
[0063] S12: Fold the first lower plate 15 and the second lower plate 9 along the pre-cut line of the PCB panel to divide the PCB panel into at least two PCB boards.
[0064] In the specific implementation process, after the operation of steps S10 and S11, an appropriate folding force is applied to the first lower plate 15 and the second lower plate 9 by manual means or corresponding equipment. Under the application of the folding force, the first lower plate 15 and the second lower plate 9 rotate around the hinge in the direction of the PCB panel. When the first lower plate 15 and the second lower plate 9 rotate to a certain angle, the PCB panel can be divided into at least two PCB boards.
[0065] In summary, in this embodiment, when it is necessary to divide a PCB panel into several PCB individual boards, the PCB panel is first placed on the first lower plate 15 and the second lower plate 9. The positioning elements on the first lower plate 15 and the second lower plate 9 are used to make the pre-cut line of the PCB panel coincide with the axis of the hinge. Then, the first cover plate 2 and the second cover plate 5 are used to press the PCB panel together. Finally, the first lower plate 15 and the second lower plate 9 are folded in half to divide the PCB panel into PCB individual boards. That is, because the positioning elements on the first lower plate 15 and the second lower plate 9 make the pre-cut line of the PCB panel coincide with the axis of the hinge, when a folding force is applied to the first lower plate 15 and the second lower plate 9, the folding force will be applied exactly at the axis of the hinge, and at the pre-cut line of the PCB panel, thus enabling more accurate positioning of the pre-cut line on the PCB panel. Since the folding force is applied precisely at the pre-cut line of the PCB panel, a relatively smaller force is required to divide the PCB panel into individual PCB boards. At the same time, the folding force applied outside the pre-cut line of the PCB panel is relatively smaller, thus reducing damage to the PCB board caused by the folding force and preventing defects such as warping and burrs on the individual PCB boards. This improves the quality of the divided PCB boards, reduces the defect rate, and lowers production costs.
[0066] In one possible implementation, such as Figure 2 As shown, a preferred structure for the hinge and positioning components is provided. Both the first lower plate 15 and the second lower plate 9 are provided with hinge angles 13. The hinge component includes a hinge pin 12, which connects the first lower plate 15 and the second lower plate 9 between the hinge angles 13 to hinge the first lower plate 15 and the second lower plate 9. The positioning component includes a positioning post 20. Placing the PCB panel on the first lower plate 15 and the second lower plate 9 with the positioning components includes: placing the PCB panel on the first lower plate 15 and the second lower plate 9 with the positioning post 20; wherein the positioning post 20 is used to position the PCB panel so that the pre-cut line of the PCB panel coincides with the axis of the hinge pin 12.
[0067] In this embodiment, the positioning component in the board separation fixture is preferably a positioning post 20, and the hinge component is preferably a hinge pin 12. Hinge angles 13 are provided on both sides of the first lower plate 15 and the second lower plate 9. The hinge angles 13 on both sides of the first lower plate 15 and the second lower plate 9 are connected by two hinge pins 12. This creates a certain hinge space between the first lower plate 15, the second lower plate 9, and the hinge angles 13 on both sides. The pre-cut line of the PCB panel is located within this hinge space and coincides with the axis of the hinge pins 12 on both sides. Simultaneously, the sides of the first lower plate 15 and the second lower plate 9 near the hinge pins 12 are provided with inclined surfaces, forming a V-shape at the pre-cut line of the PCB panel. This creates two inclined surfaces at the pre-cut line, which fit snugly against the inclined surfaces on the first lower plate 15 and the second lower plate 9. When the inclined surfaces fit snugly, the pre-cut line of the PCB panel coincides with the axis of the hinge pins 12. Therefore, the inclined surfaces on the first lower plate 15 and the second lower plate 9, which are designed to fit against each other on the PCB panel, can further position the PCB panel, allowing the pre-cutting line of the PCB panel to be more efficiently and accurately aligned with the axis of the hinge pin 12. Simultaneously, when the first lower plate 15 and the second lower plate 9 are folded, the inclined surfaces on the first lower plate 15 and the second lower plate 9 move relative to the inclined surfaces on the PCB panel. Therefore, throughout the folding process, it is easier to consistently apply the folding force primarily to the pre-cutting line of the PCB panel, making it easier to cut the PCB panel into individual PCB boards and improving the quality of the cut PCB boards.
[0068] In one possible implementation, such as Figure 2 and Figure 7 As shown, Figure 7 This is a partial three-dimensional structural diagram of a positioning post set in a mounting slot according to an embodiment of this application. Both the first lower plate 15 and the second lower plate 9 have mounting slots 8, and the positioning post 20 is disposed within the mounting slot 8. Placing the PCB panel on the lower plate with the positioning element includes: placing the PCB panel in the mounting slot 8 of the lower plate with the positioning post 20.
[0069] In this embodiment, mounting slots 8 for accommodating PCB panels are formed on the first lower plate 15 and the second lower plate 9, and positioning posts 20 are placed within the mounting slots 8. The mounting slots 8 facilitate the installation of PCB panels and reduce the weight of the disassembly fixture. To further reduce the weight of the disassembly fixture, calculations show that, while maintaining the strength of the fixture, the first lower plate 15, the second lower plate 9, the first cover plate 2, and the second cover plate 5 are designed with cutouts. This not only allows for observation of whether the internal components of the disassembly fixture are warped or otherwise deformed, but also further reduces the weight of the disassembly fixture.
[0070] In one possible implementation, such as Figure 2 As shown, the first lower plate 15 and the first cover plate 2 are connected by a first flipping member, and the second lower plate 9 and the second cover plate 5 are connected by a second flipping member; locking components are installed on both the first lower plate 15 and the second lower plate 9. The step of pressing the PCB panel onto the first lower plate 15 and the second lower plate 9 using the first cover plate 2 and the second cover plate 5 includes: flipping the first cover plate 2 around the first flipping member toward the PCB panel; flipping the second cover plate 5 around the second flipping member toward the PCB panel; and locking the first cover plate 2 to the first lower plate 15 and the second cover plate 5 to the second lower plate 9 using the locking components to press the PCB panel together.
[0071] In this embodiment, the board separation fixture of this application connects the first lower plate 15 and the first cover plate 2 via a first flipping member, and the first cover plate 2 can rotate around the first flipping member; similarly, the second lower plate 9 and the second cover plate 5 are connected via a second flipping member, and the second cover plate 5 can rotate around the second flipping member. Locking components are provided on both the first lower plate 15 and the second lower plate 9 of this board separation fixture. After the PCB panel is installed on the first lower plate 15 and the second lower plate 9, the first cover plate 2 is flipped around the first flipping member toward the PCB panel, and the second cover plate 5 is flipped around the second flipping member toward the PCB panel. Then, the locking components on the first lower plate 15 lock the first cover plate 2 to the first lower plate 15, and the locking components on the second lower plate 9 lock the second cover plate 5 to the second lower plate 9, ultimately pressing the PCB panel between the first lower plate 15 and the first cover plate 2, and between the second lower plate 9 and the second cover plate 5. This makes it easier and more convenient to press the PCB panel.
[0072] To improve the efficiency of PCB panel separation, in one possible implementation, such as Figure 2 As shown, the first flipping component includes a first flipping pin 16 mounted on the first lower plate 15 and a first flipping torsion spring 17 mounted on the first flipping pin 16; the second flipping component includes a second flipping pin 6 mounted on the second lower plate 9 and a second flipping torsion spring 7 mounted on the second flipping pin 6.
[0073] The step of flipping the first cover plate 2 around the first flipping member toward the PCB panel to the position of the first lower plate 15 includes: using the flipping force applied to the first cover plate 2 by the first flipping torsion spring 17 to flip the first cover plate 2 around the first flipping pin 16 toward the PCB panel to the position of the first lower plate 15.
[0074] The step of flipping the second cover plate 5 around the second flipping member toward the PCB panel to the position of the second lower plate 9 includes: using the flipping force applied to the second cover plate 5 by the second flipping torsion spring 7 to flip the second cover plate 5 around the second flipping pin 6 toward the PCB panel to the position of the second lower plate 9.
[0075] In this embodiment, the first flipping component of the board separation fixture includes a first flipping pin 16 mounted on the first lower plate 15 and a first flipping torsion spring 17 conventionally mounted on the first flipping pin 16; the second flipping component includes a second flipping pin 6 mounted on the second lower plate 9 and a second flipping torsion spring 7 conventionally mounted on the second flipping pin 6. When it is necessary to install the PCB panel onto the first lower plate 15 and the second lower plate 9, or to remove the cut PCB board from the first lower plate 15 and the second lower plate 9, the locking assembly is no longer locking the first lower plate 15 and the first cover plate 2, and no longer locking the second lower plate 9 and the second cover plate 5. Thus, due to the characteristics of the torsion spring, the first flipping torsion spring 17 will give the first cover plate 2 a flipping force, under the action of this flipping force, the first cover plate 2 will automatically rotate around the first flipping pin 16 in a direction away from the PCB panel; similarly, the second flipping torsion spring 7 will give the second cover plate 5 a flipping force, under the action of this flipping force, the second cover plate 5 will automatically rotate around the second flipping pin 6 in a direction away from the PCB panel. Therefore, there is no need to spend time specifically removing the first cover plate 2 and the second cover plate 5, which can improve the efficiency of installing PCB panels on the first lower plate 15 and the second lower plate 9, as well as the efficiency of removing PCB boards from the first lower plate 15 and the second lower plate 9, thereby improving the efficiency of PCB panel separation.
[0076] In one possible implementation, such as Figure 2 As shown, the locking assembly includes a movable pin 3 and a movable buckle 11. The movable buckle 11 is located near the hinge. The movable pin 3 is mounted on the first cover plate 2 / second cover plate 5 by fastening screws 4. The movable buckle 11 is mounted on the first lower plate 15 / second lower plate 9 by locking pivot pin 14. A locking torsion spring 10 is mounted on the locking pivot pin 14. The movable buckle 11 has a latch 111.
[0077] The step of locking the first cover plate 2 to the first lower plate 15 and the second cover plate 5 to the second lower plate 9 respectively through the locking assembly to press the PCB panel together includes: engaging the movable pin 3 in the latch 111 and applying a locking force to the movable pin 3 through the locking torsion spring 10 located in the latch 111; wherein the locking force is used to lock the first cover plate 2 to the first lower plate 15 and the second cover plate 5 to the second lower plate 9 respectively to press the PCB panel together.
[0078] In this embodiment, the movable buckle 11 can be an automatic snap-fit of the rebound magnet, a reset spring snap-fit, or a bolt snap-fit, etc. The locking assembly in this panel separation fixture includes a movable pin 3 and a movable buckle 11. The movable pin 3 is mounted on the first cover plate 2 / second cover plate 5 via fastening screws 4, and the movable buckle 11 is mounted on the first lower plate 15 / second lower plate 9 via locking pivot pins 14. That is, movable buckles 11 are installed on both the first lower plate 15 and the second lower plate 9, and movable pins 3 are installed on both the first cover plate 2 and the second cover plate 5 via fastening screws 4. Preferably, movable buckles 11 are provided on both sides of the first lower plate 15 and the second lower plate 9. Therefore, this panel separation fixture preferably has four movable buckles 11 and four corresponding movable pins 3.
[0079] At the same time, such as Figure 8 As shown, Figure 8 This is a three-dimensional structural diagram of the movable buckle provided in this application embodiment. A locking torsion spring 10 is installed on the locking pin 14, and a latch 111 is opened on the movable buckle 11. The latch 111 has a limiting surface 112 inside, which is used to limit the position of the locking torsion spring 10, thereby limiting the position of the first cover plate 2 and the second cover plate 5. When the first cover plate 2 and the second cover plate 5 are pressed down onto the first lower plate 15 and the second lower plate 9 respectively, the first cover plate 2 and the second cover plate 5 naturally push open the four movable buckles 11. Under the action of the locking torsion spring 10, the force point of the movable buckles 11 is transferred to the first cover plate 2 and the second cover plate 5. Because the latch 111 has a limiting surface 112 inside, the first cover plate 2 and the second cover plate 5 are limited in this state, thereby locking the first lower plate 15 with the first cover plate 2 and the second lower plate 9 with the second cover plate 5.
[0080] In addition, the movable buckles 11 on the first lower plate 15 and the second lower plate 9 are both located near the hinge. This ensures that the stress break line (pre-cut line) is in an absolutely compressed state, reducing the damage caused by PCB panel deformation due to the flipping of the panel separation tool, thereby further improving the quality of the cut PCB single board.
[0081] To further improve the quality of PCB boards, in one possible implementation, such as Figure 2 As shown, both the first cover plate 2 and the second cover plate 5 are provided with rubber pads 1, which are used to fill the gap between the first cover plate 2 / the second cover plate 5 and the movable buckle 11.
[0082] In this embodiment, when the first cover plate 2 presses against the first lower plate 15 and the second cover plate 5 presses against the second lower plate 9 through the combination of the movable buckle 11 and the movable pin 3, there may be gaps between the contact surfaces of the first cover plate 2 and the second cover plate 5 and the corresponding movable buckles 11. These gaps can create movement space in the PCB panel, causing it to loosen. Folding the first lower plate 15 and the second lower plate 9 may cause deformation of the PCB panel, which could lead to components becoming loose or even falling off, thus affecting the quality of the cut PCB panel. Therefore, rubber pads 1 are provided on both the first cover plate 2 and the second cover plate 5 of the separating fixture. These rubber pads 1 fill the gaps between the contact surfaces of the first cover plate 2 and the second cover plate 5 and the corresponding movable buckles 11, minimizing movement space in the PCB panel and securing it more firmly. Therefore, when folding the first lower plate 15 and the second lower plate 9, the PCB panel is less likely to loosen, resulting in higher quality PCB boards.
[0083] In one possible implementation, such as Figure 2 and Figure 9 As shown, Figure 9 This is a three-dimensional structural diagram of the movable pin provided in an embodiment of this application. The movable pin 3 has a strip-shaped hole 31, through which the fastening screw 4 passes and can move along the length of the strip-shaped hole 31; the movable pin 3 includes a wedge-shaped structure 32, which is used to press PCB panels of different thicknesses.
[0084] In this embodiment, after the rubber pads 1 are placed on the first cover plate 2 and the second cover plate 5, there may still be gaps between the contact surfaces of the first cover plate 2 and the second cover plate 5 and the corresponding movable latches 11. At this time, the fastening screws 4 are loosened, and then the movable pin 3 is moved towards the PCB panel. Since the movable pin 3 includes a wedge-shaped structure 32, and the thickness of the wedge-shaped structure gradually increases from away from the PCB panel to near the PCB panel, moving the movable pin 3 towards the PCB panel can further fill the gaps between the contact surfaces of the first cover plate 2, the second cover plate 5 and the corresponding movable latches 11, thereby further improving the quality of the cut PCB single board. At the same time, since the movable pin 3 includes a wedge-shaped structure 32, the separation fixture can clamp PCB panels of different thicknesses, thereby enabling the separation of PCB panels of different thicknesses.
[0085] In one possible implementation, such as Figure 6 As shown, Figure 6This is a three-dimensional structural diagram of the bottom surface of the panel separation fixture provided in an embodiment of this application. A limiting force-bearing component is provided between the first lower plate 15 and the second lower plate 9, and the limiting force-bearing component is used to prevent the first lower plate 15 and the second lower plate 9 from misaligning.
[0086] The limiting force-bearing component includes a limiting force-bearing groove 18 and a limiting force-bearing protrusion 19 that are interlocked with each other. The limiting force-bearing groove 18 is opened on the side of the first lower plate 15, and the limiting force-bearing protrusion 19 is disposed on the side of the second lower plate 9.
[0087] In this embodiment, a limiting force-bearing component is provided between the first lower plate 15 and the second lower plate 9 in the board splitting fixture of this application. During the process of folding the first lower plate 15 and the second lower plate 9, the limiting force-bearing component corrects the position of the board splitting fixture after the folding operation is completed, preventing excessive force and misalignment when folding the first lower plate 15 and the second lower plate 9. As a result, the PCB panel can be installed in the corresponding position more quickly in the next use.
[0088] Furthermore, for PCB panels that are too large or too small, when using this splitting fixture for panel separation, the first lower plate 15, second lower plate 9, first cover plate 2, and second cover plate 5 can all be made into telescopic structures. The first lower plate 15 and second lower plate 9 are each composed of two merged slide rail structures, one embedded within the other. The two structures can slide telescopically in the X-axis direction. M1.6 pin holes are drilled at the connection point of the two slide rails, and pins are used to secure them when the panel is extended to the appropriate installation size. The first cover plate 2 and second cover plate 5 are also composed of two merged slide rail structures, one embedded within the other. The two structures can slide telescopically in the X-axis direction. M1.6 pin holes are drilled at the connection point of the two slide rails, and pins are used to secure them when the panel is extended to the appropriate installation size. This allows for the separation of PCB panels of different lengths, thus increasing the adaptability of the splitting fixture.
[0089] In summary, this application uses the hinge pins 12 on the first lower plate 15 and the second lower plate 9 to position the PCB panel, thereby more accurately aligning the pre-cut line of the PCB panel with the axis of the hinge. This allows the folding force of the first lower plate 15 and the second lower plate 9 to be applied to the pre-cut line of the PCB panel. Simultaneously, by placing the movable buckle 11 near the hinge, the area around the stressed pre-cut line is pressed tightly. Furthermore, by providing the movable pin 3 and the rubber pad 1, the gaps between the first cover plate 2, the second cover plate 5, and the PCB panel are filled, allowing the PCB panel to be more stably fixed within the separation fixture. Therefore, using this separation fixture allows for the separation of higher-quality PCB boards.
[0090] The above descriptions are merely various embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A PCB depaneling method, characterized in that, The method includes: A PCB panel is placed on a lower plate equipped with a positioning element; wherein, the lower plate includes a first lower plate and a second lower plate, both of which are provided with hinge angles, and there is a hinge space between the first lower plate, the second lower plate and the hinge angles, the pre-cut line of the PCB panel is located within the hinge space, both the first lower plate and the second lower plate are provided with inclined surfaces that can fit together with the PCB panel, the first lower plate and the second lower plate are connected by a hinge element, and the positioning element is used to position the PCB panel so that the pre-cut line of the PCB panel coincides with the axis of the hinge element; The PCB panel is pressed onto the first lower plate and the second lower plate by the first cover plate and the second cover plate; wherein, the first cover plate corresponds to the first lower plate and the second cover plate corresponds to the second lower plate; The first lower plate and the second lower plate are folded along the pre-cut line of the PCB panel to divide the PCB panel into at least two PCB boards.
2. The method according to claim 1, characterized in that, The hinge component includes a hinge pin, which is connected between the hinge angles of the first lower plate and the second lower plate to hinge the first lower plate and the second lower plate; the positioning component includes a positioning post. The step of placing the PCB panel onto the first lower plate and the second lower plate, which are equipped with positioning components, includes: The PCB panel is placed on the first lower plate and the second lower plate, which are equipped with positioning posts; wherein the positioning posts are used to position the PCB panel so that the pre-cut line of the PCB panel coincides with the axis of the hinge pin.
3. The method according to claim 2, characterized in that, Both the first lower plate and the second lower plate have mounting grooves, and the positioning post is disposed in the mounting groove; The step of placing the PCB panel on the lower plate equipped with positioning components includes: Place the PCB panel into the mounting slot of the lower plate, which has positioning posts.
4. The method according to claim 1, characterized in that, The first lower plate is connected to the first cover plate via a first flipping component, and the second lower plate is connected to the second cover plate via a second flipping component; both the first lower plate and the second lower plate are equipped with locking components. The step of pressing the PCB panel onto the first lower plate and the second lower plate using the first cover plate and the second cover plate includes: Flip the first cover plate around the first flipping component toward the PCB panel; Flip the second cover plate around the second flipping component toward the PCB panel; The locking assembly locks the first cover plate to the first lower plate and the second cover plate to the second lower plate, thereby pressing the PCB panel together.
5. The method according to claim 4, characterized in that, The first flipping component includes a first flipping pin mounted on the first lower plate and a first flipping torsion spring mounted on the first flipping pin; the second flipping component includes a second flipping pin mounted on the second lower plate and a second flipping torsion spring mounted on the second flipping pin. The step of flipping the first cover plate around the first flipping member toward the PCB panel includes: The first cover plate is flipped around the first flip pin toward the PCB panel by the flipping force applied to the first cover plate by the first flipping torsion spring. The step of flipping the second cover plate around the second flipping member toward the PCB panel includes: The second cover plate is flipped around the second flip pin toward the PCB panel by the flipping force applied to the second cover plate by the second flipping torsion spring.
6. The method according to claim 4, characterized in that, The locking assembly includes a movable pin and a movable latch, the movable latch being positioned near the hinge; the movable pin is mounted on the first cover plate / second cover plate by fastening screws, the movable latch is mounted on the first lower plate / second lower plate by locking pivot pins, a locking torsion spring is mounted on the locking pivot pins, and a latch is provided on the movable latch; The step of locking the first cover plate to the first lower plate and the second cover plate to the second lower plate using the locking assembly to press the PCB panel together includes: The movable pin is engaged in the latch, and a locking force is applied to the movable pin by the locking torsion spring located in the latch; wherein the locking force is used to lock the first cover plate and the first lower plate, and the second cover plate and the second lower plate respectively, so as to press the PCB panel together.
7. The method according to claim 6, characterized in that, The latch is provided with a limiting surface, which is used to limit the position of the locking torsion spring, thereby limiting the position of the first cover plate and the second cover plate.
8. The method according to claim 6, characterized in that, Both the first cover plate and the second cover plate are provided with rubber pads, which are used to fill the gap between the first cover plate / second cover plate and the movable buckle.
9. The method according to claim 7, characterized in that, The movable pin has a slotted hole, through which the fastening screw passes and can move along the length of the slotted hole; the movable pin includes a wedge-shaped structure for pressing PCB panels of different thicknesses.
10. The method according to any one of claims 1-9, characterized in that, A limiting force-bearing component is provided between the first lower plate and the second lower plate, and the limiting force-bearing component is used to prevent the first lower plate and the second lower plate from misaligning. The limiting force-bearing component includes a limiting force-bearing groove and a limiting force-bearing protrusion that are interlocked with each other. The limiting force-bearing groove is opened on the side of the first lower plate, and the limiting force-bearing protrusion is disposed on the side of the second lower plate.