Display device, display panel and preparation method thereof

Abstract

The present disclosure provides a display device, a display panel and a preparation method thereof. The display panel comprises a substrate, one or more partition structures arranged on one side of the substrate and located in the partition region, wherein the partition structure comprises two oppositely arranged barrier walls, one end of any barrier wall away from the substrate is provided with a protruding part protruding towards the other barrier wall, and the two protruding parts are arranged in a spaced manner in the protruding direction of the protruding part; the opening region is located on one side of the barrier wall; and a luminescent material layer covers the display region and the partition structure, and the luminescent material layer is arranged in a broken manner between the two protruding parts. The present disclosure can improve the service life of the display panel.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display device, a display panel, and a method for manufacturing the same. Background Technology

[0002] Organic electroluminescent display (OLED) panels have gradually become the mainstream in the display field due to their superior performance, such as low power consumption, wide viewing angle, thinness, and flexibility, and can be widely used in terminal products such as smartphones, tablets, and televisions. However, this display panel still needs further improvement. Summary of the Invention

[0003] The purpose of this disclosure is to provide a display device, a display panel, and a method for manufacturing the same, which can improve the service life of the display panel.

[0004] According to one aspect of this disclosure, a display panel is provided, the display panel including a display area, an opening area, and a partition area adjacent to the display area and the opening area, the display panel comprising:

[0005] Substrate;

[0006] One or more partition structures are disposed on one side of the substrate and located in the partition area. The partition structure includes two opposing baffles. One end of each baffle away from the substrate has a protrusion that protrudes toward the other baffle, and the two protrusions are spaced apart in the extending direction of the protrusions. The opening area is located on one side of the baffle.

[0007] A light-emitting material layer covers the display area and the partition structure, and the light-emitting material layer is disconnected between the two protrusions.

[0008] Furthermore, the display panel also includes an encapsulation material layer that covers the partition structure;

[0009] Each of the protrusions has a recessed area on the side facing the other protrusion, and the encapsulation material layer fills the recessed area; and / or, each of the protrusions has a protrusion on the side facing the other protrusion, and the encapsulation material layer covers the protrusion.

[0010] Furthermore, the display panel includes a metal film, and the barrier and / or the protrusion is formed by a portion of the metal film.

[0011] Further, the metal film includes a first metal layer, a second metal layer, and a third metal layer stacked together. The orthographic projection of the portion of the second metal layer located at the protrusion on the substrate is located within the orthographic projection area of ​​the portion of the first metal layer located at the protrusion on the substrate, and the end of the first metal layer extends beyond the end of the second metal layer. The orthographic projection of the portion of the second metal layer located at the protrusion on the substrate is located within the orthographic projection area of ​​the portion of the third metal layer located at the protrusion on the substrate, and the end of the third metal layer extends beyond the end of the second metal layer.

[0012] Furthermore, the display panel includes:

[0013] A gate electrode structure is disposed on one side of the substrate;

[0014] A first source / drain electrode layer is disposed on the side of the gate electrode structure away from the substrate; a metal film is disposed on the side of the first source / drain electrode layer away from the substrate, and another portion of the metal film is electrically connected to the first source / drain electrode layer.

[0015] An anode is disposed between the metal film and the light-emitting material layer, and a portion of the metal film electrically connected to the first source / drain electrode layer is electrically connected to the anode.

[0016] Furthermore, the first metal layer and the third metal layer are made of titanium, and the second metal layer is made of aluminum.

[0017] According to one aspect of this disclosure, a method for manufacturing a display panel is provided, the method comprising:

[0018] Provide substrate;

[0019] A first planarization layer is formed on one side of the substrate;

[0020] The portion of the first planarization layer located in the partition area is patterned to form one or more support strips;

[0021] A metal film is formed covering the top and sides of the support strip;

[0022] A strip-shaped opening is formed on the portion of the metal film covering the top surface of the support strip, exposing the support strip, and the extending direction of the strip-shaped opening is the same as the extending direction of the support strip;

[0023] After removing the support strip, the portion of the metal film covering the side of the support strip forms a retaining wall, and the portion of the metal film covering the top surface of the support strip forms a protrusion.

[0024] Furthermore, before removing the support strip, the preparation method further includes:

[0025] An anode is formed, which covers the strip-shaped opening;

[0026] The anode is patterned using a wet etching process, forming a recessed area on the sidewall of the strip-shaped opening.

[0027] Furthermore, the etching solution used in the wet etching process includes acetic acid, nitric acid, and phosphoric acid.

[0028] According to one aspect of this disclosure, a display device is provided, including the aforementioned display panel.

[0029] The display device, display panel and manufacturing method disclosed herein include a partition structure comprising two opposing baffles. Each baffle has a protrusion at its end away from the substrate that protrudes toward the other baffle, and the two protrusions are spaced apart. The light-emitting material layer is disconnected between the two protrusions, preventing water and oxygen in the air from entering the display area through the partition area, thereby improving the service life of the display panel. Attached Figure Description

[0030] Figure 1 This is a plan view of the display panel according to an embodiment of the present disclosure.

[0031] Figure 2 This is a schematic diagram of the partition area and the opening area of ​​the display panel according to an embodiment of the present disclosure.

[0032] Figure 3 yes Figure 1 A schematic diagram of the cross-section A-A1 of the structure shown.

[0033] Figure 4 yes Figure 3 A partial schematic diagram of the structure shown.

[0034] Figure 5 and Figure 3 Another partial schematic diagram of the structure shown.

[0035] Figure 6 yes Figure 5 A schematic diagram of the partition structure shown.

[0036] Figure 7 This is a schematic diagram showing the strip opening formed in the method for manufacturing a display panel according to an embodiment of the present disclosure.

[0037] Figure 8 This is a schematic diagram showing the display panel after the support strip has been removed in the manufacturing method of the display panel according to the embodiments of this disclosure.

[0038] Figure 9This is a schematic diagram of the display panel fabrication method according to an embodiment of the present disclosure after the formation of the light-emitting material layer.

[0039] Explanation of reference numerals in the attached drawings: 1. Partition structure; 101. Protrusion; 102. Barrier; 2. Substrate; 3. First active layer; 4. First gate insulating layer; 5. First gate electrode layer; 6. Second gate insulating layer; 7. Second gate electrode layer; 8. First interlayer insulating layer; 9. Second active layer; 10. Third gate insulating layer; 11. Third gate electrode layer; 12. Second interlayer insulating layer; 13. First source / drain electrode layer; 14. First planarization layer; 15. Metal film; 151. First metal layer; 152. Second metal layer; 153. Third metal layer; 16. Second planarization layer; 17. Pixel defining layer; 18. Anode; 19. Light-emitting material layer; 20. Cathode; 21. Encapsulation material layer; 22. Recessed area; 23. Support strip; 24. Strip opening; 100. Display area; 200. Partition area; 300. Opening area. Detailed Implementation

[0040] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses consistent with some aspects of this disclosure as detailed in the appended claims.

[0041] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in this disclosure should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “a” or “one,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. “A plurality” or “several” indicates two or more. Unless otherwise stated, the terms “front,” “rear,” “lower,” and / or “upper,” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The terms “comprising,” “including,” and similar terms mean that the elements or objects preceding “comprising,” encompass the elements or objects listed following “comprising,” and their equivalents, and do not exclude other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. The singular forms “a,” “the,” and “the” used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0042] This disclosure provides a display panel. For example... Figure 1 As shown, the display panel includes a display area 100, an opening area 300, and a partition area 200 adjacent to the display area 100 and the opening area 300. Figure 2 , Figure 3 as well as Figure 4 As shown, the display panel may include a substrate 2, one or more partition structures 1, and a light-emitting material layer 19, wherein:

[0043] The partition structure 1 is disposed on one side of the substrate 2 and located in the partition area 200. The partition structure 1 includes two opposing baffles 102, each baffle 102 having a protrusion 101 protruding toward the other baffle 102 at its end away from the substrate 2, and the two protrusions 101 are spaced apart in the protruding direction of the protrusions 101. The opening area 300 is located on one side of the baffles 102. The light-emitting material layer 19 covers at least a portion of the display area 100 and the partition structure 1, and the light-emitting material layer 19 is discontinuously disposed between the two protrusions 101.

[0044] The display panel of this embodiment includes a partition structure 1 comprising two opposing baffles 102. Each baffle 102 has a protrusion 101 protruding toward the other baffle 102 at one end away from the substrate 2, and the two protrusions 101 are spaced apart. The light-emitting material layer 19 is disconnected between the two protrusions 101, so that water and oxygen in the air cannot enter the display area 100 through the partition area 200, thereby improving the service life of the display panel.

[0045] The following is a detailed description of each part of the display panel according to the embodiments of this disclosure:

[0046] like Figure 3 As shown, the substrate 2 can be a flexible substrate. This flexible substrate can be a PET (Polyethylene terephthalate) substrate, a PEN (Polyethylene naphthalate twoformic acid glycol ester) substrate, or a PI (Polyimide) substrate. Furthermore, a buffer layer (not shown) may be provided on the substrate 2.

[0047] like Figure 3As shown, the display panel may further include a first active layer 3, a first gate insulating layer 4, a second gate insulating layer 6, a first interlayer insulating layer 8, a second active layer 9, a third gate insulating layer 10, a second interlayer insulating layer 12, a first source / drain electrode layer 13, and a gate electrode structure disposed on the substrate 2. The gate electrode structure may include a first gate electrode layer 5, a second gate electrode layer 7, and a third gate electrode layer 11. The first active layer 3 may be disposed on the side of the buffer layer away from the substrate 2. The material of the first active layer 3 may include polysilicon. The first gate insulating layer 4 may be disposed on the side of the first active layer 3 away from the substrate 2. The first gate electrode layer 5 may be disposed on the side of the first gate insulating layer 4 away from the substrate 2. The second gate insulating layer 6 may be disposed on the side of the first gate electrode layer 5 away from the substrate 2. The second gate electrode layer 7 may be disposed on the side of the second gate insulating layer 6 away from the substrate 2. The first interlayer insulating layer 8 may be disposed on the side of the second gate electrode layer 7 away from the substrate 2. The second active layer 9 can be disposed on the side of the first interlayer insulating layer 8 away from the substrate 2. The material of the second active layer 9 can be an oxide, such as indium gallium zinc oxide (IGZO). The third gate insulating layer 10 can be disposed on the side of the second active layer 9 away from the substrate 2. The third gate electrode layer 11 can be disposed on the side of the third gate insulating layer 10 away from the substrate 2. The second interlayer insulating layer 12 can be disposed on the side of the third gate electrode layer 11 away from the substrate 2. The first source / drain electrode layer 13 can be disposed on the side of the second interlayer insulating layer 12 away from the substrate 2. The first source / drain electrode layer 13 and the isolation region 200 can be spaced apart in a direction parallel to the substrate 2. Furthermore, the display panel of this disclosure may also include a first planarization layer 14. The first planarization layer 14 can cover the first source / drain electrode layer 13 and the second interlayer insulating layer 12. The first planarization layer 14 and the isolation region 200 can be spaced apart in a direction parallel to the substrate 2.

[0048] like Figure 2 and Figure 3 As shown, the partition structure 1 is disposed on one side of the substrate 2 and located in the partition area 200. The partition structure 1 can be strip-shaped and surround the aforementioned opening area 300. Taking the partition area 200 surrounding the opening area 300 and the display area 100 surrounding the partition area 200 as an example, the partition structure 1 can be annular and surround the opening area 300. The number of partition structures 1 can be one, two, three, four or more. Taking the number of partition structures 1 as an example, multiple partition structures 1 can be arranged at intervals.

[0049] like Figure 3 and Figure 4As shown, the partition structure 1 includes two opposing baffles 102. The height direction of the baffle 102 can be the same as the thickness direction of the substrate 2, and the thickness direction of the baffle 102 can be parallel to the substrate 2. The height of the baffle 102 can be 2 μm, but this disclosure is not limited to this. In the direction parallel to the substrate 2, the baffle 102 can be strip-shaped and surround the aforementioned opening area 300. Taking the aforementioned partition structure 1 as an annular example, the baffle 102 can also be annular. Each baffle 102 has a protrusion 101 at its end away from the substrate 2, protruding towards the other baffle 102. That is, each baffle 102 has a protrusion 101 at its end away from the substrate 2, and the protrusion direction of the protrusion 101 is the same as the thickness direction of the baffle 102. The protrusion 101 can be strip-shaped, and the extension direction of the protrusion 101 is the same as the extension direction of the strip-shaped baffle 102. Furthermore, two protrusions 101 are provided on the two opposing retaining walls 102 at intervals, wherein the two protrusions 101 are spaced apart in the protruding direction of the protrusions 101. For each of the two protrusions 101 provided on the two opposing retaining walls 102, a recessed area 22 is provided on the side of each protrusion 101 facing the other protrusion 101 (see...). Figure 6 The recessed area 22 can also be strip-shaped, and the extending direction of the recessed area 22 can be the same as the extending direction of the strip-shaped partition structure 1. In another embodiment, a protrusion (not shown) is provided on the side of any protrusion 101 facing the other protrusion 101. This protrusion can also be strip-shaped, and the extending direction of the protrusion can be the same as the extending direction of the strip-shaped partition structure 1.

[0050] like Figure 3 and Figure 5 As shown, the display panel may further include a metal film 15. The metal film 15 may be disposed on the side of the first source / drain electrode layer 13 away from the substrate 2. The metal film 15 may include a first metal layer 151, a second metal layer 152, and a third metal layer 153 stacked together. The second metal layer 152 may be disposed on the side of the first metal layer 151 away from the substrate 2. The third metal layer 153 may be disposed on the side of the second metal layer 152 away from the substrate 2. The first metal layer 151 and the third metal layer 153 may be made of the same material, and both may be titanium (Ti), but this disclosure does not impose any special limitations on this. The second metal layer 152 may be made of aluminum, but this disclosure does not impose any special limitations on this. A portion of the metal film 15 may be located in the display area 100, and may be located on the side of the first planarization layer 14 away from the substrate 2, and is electrically connected to the first source / drain electrode layer 13. Another portion of the metal film 15 may be located in the isolation area 200, and may be located on the side of the second interlayer insulating layer 12 away from the substrate 2.

[0051] like Figure 3 , Figure 5 as well as Figure 6 As shown, the aforementioned retaining wall 102 can be formed by the portion of the metal film 15 located in the partition area 200, that is, the retaining wall 102 has a layered structure. The aforementioned protrusion 101 can also be formed by the portion of the metal film 15 located in the partition area 200, that is, the protrusion 101 also has a layered structure. The orthographic projection of the portion of the second metal layer 152 located on the protrusion 101 onto the substrate 2 is located within the orthographic projection area of ​​the portion of the first metal layer 151 located on the protrusion 101 onto the substrate 2, and the end of the first metal layer 151 extends beyond the end of the second metal layer 152, meaning that the second metal layer 152 is recessed inward relative to the first metal layer 151. The orthographic projection of the portion of the second metal layer 152 located on the protrusion 101 onto the substrate 2 is located within the orthographic projection area of ​​the portion of the third metal layer 153 located on the protrusion 101 onto the substrate 2, and the end of the third metal layer 153 extends beyond the end of the second metal layer 152, meaning that the second metal layer 152 is recessed inward relative to the third metal layer 153. This arrangement creates the aforementioned recessed area 22 (the second metal layer 152 is recessed inward) on the side of the protrusion 101 facing the other protrusion 101.

[0052] like Figure 3 , Figure 4 as well as Figure 5As shown, the display panel may further include a second planarization layer 16, a pixel defining layer 17, light-emitting units (not shown), and an encapsulation material layer 21. The second planarization layer 16 may be disposed on the side of the metal film 15 away from the substrate 2, and the second planarization layer 16 may be spaced apart from the partition region 200 in a direction parallel to the substrate 2. The pixel defining layer 17 may be disposed on the side of the metal film 15 away from the substrate 2, and the pixel defining layer 17 may be spaced apart from the partition region 200 in a direction parallel to the substrate 2. The pixel defining layer 17 has multiple pixel openings (not shown), and the number of light-emitting units is multiple, with each light-emitting unit corresponding to one of the multiple pixel openings. The light-emitting unit may include a stacked anode 18, a light-emitting material layer 19, and a cathode 20. The anode 18 may be disposed on the second planarization layer 16, and the light-emitting material layer 19 may be disposed on the side of the anode 18 away from the substrate 2, and the anode 18 may be spaced apart from the partition region 200 in a direction parallel to the substrate 2. A portion of the luminescent material layer 19 is located within the aforementioned partition region 200, and the luminescent material layer 19 is discontinuously positioned between the two protrusions 101. A portion of the cathode 20 can also be within the aforementioned partition region 200, and the cathode 20 can also be discontinuously positioned between the two protrusions 101. Alternatively, the cathode 20 can be spaced apart from the partition region 200 in a direction parallel to the substrate 2. The encapsulation material layer 21 can be disposed on the side of the cathode 20 away from the substrate 2. The encapsulation material layer 21 can extend between the two opposing baffles 102 and cover the surface of the baffles 102. Alternatively, the encapsulation material layer 21 can also cover the aforementioned protrusions 101. For example, a recessed region 22 is provided on the side of any protrusion 101 facing the other protrusion 101. Figure 5 As shown, the encapsulation material layer 21 can fill the recessed area 22. Taking a protrusion on the side of any protrusion 101 facing another protrusion 101 as an example, the encapsulation material layer 21 can cover the protrusion. The provided recessed area 22 or protrusion can improve the adhesion of the encapsulation material layer 21 and prevent it from falling off. The encapsulation material layer 21 may include a first inorganic encapsulation layer (not shown), an organic encapsulation layer (not shown), and a second inorganic encapsulation layer (not shown). The first inorganic encapsulation layer may be disposed on the side of the cathode 20 away from the substrate 2, the second inorganic encapsulation layer may be disposed on the side of the first inorganic encapsulation layer away from the substrate 2, and the organic encapsulation layer may cover the spacer between the first and second inorganic encapsulation layers. The organic encapsulation layer may be spaced apart from the partition area 200 in a direction parallel to the substrate 2.

[0053] This disclosure also provides a method for manufacturing a display panel. This method is used to manufacture the display panel of any of the above embodiments. The manufacturing method of this disclosure may include:

[0054] S10, such as Figure 7 As shown, substrate 2 is provided.

[0055] The substrate 2 can be the same as the substrate 2 of the display panel in any of the above embodiments.

[0056] S20, such as Figure 7 As shown, a first planarization layer 14 is formed on one side of the substrate 2.

[0057] Between the formation of the first planarization layer 14, the present disclosure may form the buffer layer, the first active layer 3, the first gate insulating layer 4, the second gate insulating layer 6, the first interlayer insulating layer 8, the second active layer 9, the third gate insulating layer 10, the second interlayer insulating layer 12, the first source / drain electrode layer 13, and the gate electrode structure on the substrate 2.

[0058] S30, such as Figure 7 As shown, the portion of the first planarization layer 14 located in the partition area 200 is patterned to form one or more support strips 23.

[0059] This disclosure allows for the patterning of the first planarization layer 14 using a photolithography process. The support strip 23 can surround the aforementioned opening area 300 (the opening area 300 has not yet been formed at this step). Taking the aforementioned partition area 200 surrounding the opening area 300 and the display area 100 surrounding the partition area 200 as an example, the support strip 23 can be annular and surround the opening area 300. Multiple support strips 23 extend in the same direction and can be spaced apart.

[0060] S40, such as Figure 7 As shown, a metal film 15 is formed covering the top and side surfaces of the support strip 23. The top surface of the support strip 23 is the surface of the support strip 23 away from the substrate 2. The surface of the support strip 23 near the substrate 2 is the bottom surface of the support strip 23, and the side surfaces of the support strip 23 are the surfaces connecting the top and bottom surfaces of the support strip 23. Further, in step S40, the metal film 15 may cover the two side surfaces of the support strip 23 distributed along the width direction of the support strip 23.

[0061] S50, such as Figure 7 As shown, a strip-shaped opening 24 is formed in the portion of the metal film 15 covering the top surface of the support strip 23, exposing the support strip 23. The extension direction of the strip-shaped opening 24 is the same as the extension direction of the support strip 23.

[0062] The orthographic projection of the strip opening 24 on the substrate 2 is located within the orthographic projection area of ​​the support strip 23 on the substrate 2, and the width of the orthographic projection of the strip opening 24 on the substrate 2 is smaller than the width of the orthographic projection of the support strip 23 on the substrate 2.

[0063] After forming the strip opening 24, the fabrication method may further include: forming a pixel defining layer and an anode, the anode covering the strip opening 24; patterning the anode using a wet etching process, forming recessed areas 22 on the sidewalls of the strip opening 24 (see...). Figure 6 Taking the aforementioned metal film 15, which includes a first metal layer 151, a second metal layer 152, and a third metal layer 153 stacked together, as an example, the first metal layer 151 and the third metal layer 153 are both made of titanium, and the second metal layer 152 is made of aluminum. The etching solution used in the aforementioned wet etching process includes acetic acid, nitric acid, and phosphoric acid. The mixed acid composed of acetic acid, nitric acid, and phosphoric acid can pattern the anode and also etch the second metal layer 152, thereby causing the second metal layer 152 to be recessed inward relative to the first metal layer 151 and the third metal layer 153, thus forming the aforementioned recessed area 22.

[0064] S60, such as Figure 8 As shown, after removing the support strip 23, the portion of the metal film 15 covering the side of the support strip 23 forms a retaining wall 102, and the portion of the metal film 15 covering the top surface of the support strip 23 forms a protrusion 101.

[0065] This disclosure allows for the removal of the support strip 23 via an etching process, such as a dry etching process. The gas used in this dry etching process may include oxygen, and of course, may also include carbon tetrafluoride, but this disclosure does not specifically limit this. Figure 9 As shown, after removing the support strip 23, the present disclosure can form a light-emitting material layer 19, which is disconnected between the two protrusions 101.

[0066] This disclosure also provides a display device. The display may include the display panel of any of the above embodiments. The display device may be a mobile phone, but it can also be a tablet computer, television, etc.

[0067] The display panel, the method for preparing the display panel, and the display device provided in this disclosure belong to the same inventive concept. The descriptions of related details and beneficial effects can be found in each other and will not be repeated here.

[0068] The above are merely preferred embodiments of this disclosure and are not intended to limit this disclosure in any way. Although this disclosure has been disclosed above with reference to preferred embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.

Claims

1. A display panel, characterized in that, The display panel includes a display area, an opening area, and a partition area adjacent to the display area and the opening area. The display panel includes: Substrate; One or more partition structures are disposed on one side of the substrate and located in the partition area. The partition structure includes two opposing baffles. One of the baffles has a protrusion at the end away from the substrate that protrudes toward the other baffle, and the two protrusions are spaced apart in the protruding direction of the protrusions. The opening area is located on one side of the baffles. One of the baffles has an extension at the end near the substrate that extends away from the other baffle. A light-emitting material layer covers at least a portion of the display area and the partition structure, and the light-emitting material layer is discontinuously disposed between the two protrusions, and the light-emitting material layer covers the extension.

2. The display panel according to claim 1, characterized in that, The display panel further includes an encapsulation material layer that covers the partition structure; Each of the protrusions has a recessed area on the side facing the other protrusion, and the encapsulation material layer fills the recessed area; and / or, each of the protrusions has a protrusion on the side facing the other protrusion, and the encapsulation material layer covers the protrusion.

3. The display panel according to claim 1 or 2, characterized in that, The display panel includes a metal film, and the barrier and / or the protrusion is formed by a portion of the metal film.

4. The display panel according to claim 3, characterized in that, The metal film includes a first metal layer, a second metal layer, and a third metal layer stacked together. The orthographic projection of the portion of the second metal layer located at the protrusion on the substrate is located within the orthographic projection area of ​​the portion of the first metal layer located at the protrusion on the substrate, and the end of the first metal layer extends beyond the end of the second metal layer. The orthographic projection of the portion of the second metal layer located at the protrusion on the substrate is located within the orthographic projection area of ​​the portion of the third metal layer located at the protrusion on the substrate, and the end of the third metal layer extends beyond the end of the second metal layer.

5. The display panel according to claim 3, characterized in that, The display panel includes: A gate electrode structure is disposed on one side of the substrate; A first source / drain electrode layer is disposed on the side of the gate electrode structure away from the substrate; a metal film is disposed on the side of the first source / drain electrode layer away from the substrate, and another portion of the metal film is electrically connected to the first source / drain electrode layer. An anode is disposed between the metal film and the light-emitting material layer, and a portion of the metal film electrically connected to the first source / drain electrode layer is electrically connected to the anode.

6. The display panel according to claim 4, characterized in that, The first and third metal layers are made of titanium, and the second metal layer is made of aluminum.

7. A method for manufacturing a display panel, characterized in that, The preparation method is used to prepare the display panel according to any one of claims 1-6, and the preparation method includes: Provide substrate; A first planarization layer is formed on one side of the substrate; The portion of the first planarization layer located in the partition area is patterned to form one or more support strips; A metal film is formed covering the top and sides of the support strip; A strip-shaped opening is formed on the portion of the metal film covering the top surface of the support strip, exposing the support strip, and the extending direction of the strip-shaped opening is the same as the extending direction of the support strip; After removing the support strip, the portion of the metal film covering the side of the support strip forms a retaining wall, and the portion of the metal film covering the top surface of the support strip forms a protrusion.

8. The method for manufacturing a display panel according to claim 7, characterized in that, Before removing the support strip, the preparation method further includes: An anode is formed, which covers the strip-shaped opening; The anode is patterned using a wet etching process, forming a recessed area on the sidewall of the strip-shaped opening.

9. The method for manufacturing a display panel according to claim 8, characterized in that, The wet etching process uses etching solutions including acetic acid, nitric acid, and phosphoric acid.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-6.

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