Display panel, manufacturing method thereof and display device

Abstract

The application discloses a display panel, a manufacturing method thereof and a display device. The color resistance structure of the display panel comprises a first color resistance layer, a second color resistance layer and a third color resistance layer. The first color resistance layer comprises a first color resistance unit and a first block. The second color resistance layer comprises a second color resistance unit and a second block. The third color resistance layer comprises a third color resistance unit and a third block. In the direction perpendicular to the plane where the array substrate is located, the first color resistance unit at least partially overlaps with the first light emitting element, the first block at least partially overlaps with the non-opening area, the second color resistance unit at least partially overlaps with the second light emitting element, the second block at least partially overlaps with the non-opening area, the third color resistance unit at least partially overlaps with the third light emitting element, and the third block at least partially overlaps with the non-opening area. At least two of the first block, the second block and the third block are stacked to form a light shielding structure in the direction perpendicular to the plane where the array substrate is located.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, and more particularly to a display panel, a manufacturing method thereof, and a display device. BACKGROUND

[0002] With the continuous progress of science and technology, more and more display devices are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable important tool for people today.

[0003] The main component for a display device to realize a display function is a display panel. The display panel includes a display array having a plurality of light emitting elements for image display. A patterned black matrix is provided on a light exit side of the display array, and the black matrix has a hollow region corresponding to a region of the light emitting elements for setting a color resistance unit. The color resistance unit can transmit light of a color corresponding to the light emitting element and block light of other colors.

[0004] In the existing display panel, the black matrix is generally provided on the surface of the planarization layer. Since the black matrix and the planarization layer are different materials, the material properties are different, and there is a dispersion compatibility problem between the black matrix and the planarization layer, which causes the interface between the black matrix and the planarization layer to easily expand and warp or even separate, affecting the image display quality and service life of the display panel. SUMMARY

[0005] Therefore, the present application provides a display panel, a manufacturing method thereof, and a display device, and the scheme is as follows.

[0006] In a first aspect, the present application provides a display panel, which includes:

[0007] An array substrate including a plurality of opening regions and non-opening regions between adjacent opening regions;

[0008] A display array located on one side of the array substrate, the display array including at least first, second, and third light emitting elements having different light emitting colors, the first, second, and third light emitting elements being located in corresponding opening regions, respectively;

[0009] An encapsulation layer covering the display array;

[0010] A touch electrode layer located on a side of the encapsulation layer away from the array substrate;

[0011] A first planarization layer covering the touch electrode layer;

[0012] A color resistance structure located on a side of the first planarization layer away from the display array, the color resistance structure including first, second, and third color resistance layers.

[0013] The first color resist layer comprises a first color resist unit and a first block; in a direction perpendicular to a plane where the array substrate is located, the first color resist unit at least partially overlaps the first light emitting element, and the first block at least partially overlaps the non-opening area;

[0014] The second color resist layer comprises a second color resist unit and a second block; in a direction perpendicular to a plane where the array substrate is located, the second color resist unit at least partially overlaps the second light emitting element, and the second block at least partially overlaps the non-opening area;

[0015] The third color resist layer comprises a third color resist unit and a third block; in a direction perpendicular to a plane where the array substrate is located, the third color resist unit at least partially overlaps the third light emitting element, and the third block at least partially overlaps the non-opening area;

[0016] At least two of the first block, the second block and the third block are stacked to form a light shielding structure in a direction perpendicular to a plane where the array substrate is located.

[0017] In the display panel provided by the technical scheme, the blocks of different color resist layers that overlap in the non-opening area are used as light shielding structures, so that the display panel does not need to be provided with a black matrix, thereby solving the problem of interlayer warping or even separation of the black matrix and the underlying planarization layer due to different material properties in the existing display panel, and ensuring the image quality and service life of the display panel.

[0018] In a second aspect, the technical scheme also provides a display device, which comprises the display panel.

[0019] Since the display device adopts the display panel, the problem of interlayer warping or even separation of the black matrix and the underlying planarization layer due to different material properties in the existing display panel is solved, the image quality and service life of the display panel are ensured, and the image display quality and service life of the display device are improved.

[0020] In a third aspect, the technical scheme also provides a manufacturing method of the display panel, which comprises the following steps.

[0021] An array substrate is provided, which comprises a plurality of opening areas and non-opening areas between adjacent opening areas;

[0022] A display array is prepared on one side of the array substrate, and the display array comprises at least first, second and third light emitting elements with different light emitting colors; the first, second and third light emitting elements are respectively located in corresponding opening areas;

[0023] On the side of the display array away from the array substrate, an encapsulation layer covering the display array, a touch electrode layer, and a first planarization layer covering the touch electrode layer are formed sequentially.

[0024] A color resist structure is formed on the side of the first planarization layer opposite to the display array; the color resist structure includes: a first color resist layer, a second color resist layer and a third color resist layer;

[0025] The first color resist layer includes: a first color resist unit and a first block; in a direction perpendicular to the plane of the array substrate, the first color resist unit at least partially overlaps with the first light-emitting element, and the first block at least partially overlaps with the non-opening area;

[0026] The second color resist layer includes: a second color resist unit and a second block; in a direction perpendicular to the plane of the array substrate, the second color resist unit at least partially overlaps with the second light-emitting element, and the second block at least partially overlaps with the non-opening area;

[0027] The third color resist layer includes: a third color resist unit and a third block; in a direction perpendicular to the plane of the array substrate, the third color resist unit at least partially overlaps with the third light-emitting element, and the third block at least partially overlaps with the non-opening area.

[0028] The first block, the second block, and the third block are stacked together in a direction perpendicular to the plane of the array substrate to form a light-shielding structure.

[0029] The manufacturing method provided in this application embodiment can manufacture the above-mentioned display panel. It reuses the overlapping blocks in the non-opening area of ​​different color resist layers as a light-shielding structure. There is no need to set a black matrix in the display panel. This solves the problem of interlayer warping or even separation caused by the different material properties of the black matrix and the underlying planarization layer in the existing display panel, thus ensuring the image quality and service life of the display panel. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0031] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0032] Figure 1 A top view of a display panel provided in an embodiment of this application;

[0033] Figure 2 for Figure 1 The image shows a cross-sectional view of the display panel along the A-A' direction;

[0034] Figure 3 A cross-sectional view of a display panel provided in an embodiment of this application;

[0035] Figure 4 A cross-sectional view of another display panel provided in an embodiment of this application;

[0036] Figure 5 A cross-sectional view of another display panel provided in an embodiment of this application;

[0037] Figure 6 A cross-sectional view of another display panel provided in an embodiment of this application;

[0038] Figure 7 A cross-sectional view of another display panel provided in an embodiment of this application;

[0039] Figure 8 A cross-sectional view of another display panel provided in an embodiment of this application;

[0040] Figure 9 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0041] Figure 10 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0042] Figure 11 A cross-sectional view of the structure obtained after performing step S11 in a method for manufacturing a display panel according to an embodiment of this application;

[0043] Figure 12 A cross-sectional view of the structure obtained after performing steps S12 and S13 in a method for manufacturing a display panel according to an embodiment of this application;

[0044] Figure 13 A cross-sectional view of each structure after the formation of the first color resist layer in a method for manufacturing a display panel according to an embodiment of this application;

[0045] Figure 14 A cross-sectional view of each structure after forming the second color resist layer in a method for manufacturing a display panel according to an embodiment of this application;

[0046] Figure 15A cross-sectional view of each structure after the formation of the third color resist layer in a method for manufacturing a display panel according to an embodiment of this application;

[0047] Figure 16 A cross-sectional view of each structure after forming the second planarization layer and cover plate in a method for manufacturing a display panel according to an embodiment of this application;

[0048] Figure 17 The transmittance curves of different color resist layers in the visible light band are shown. Detailed Implementation

[0049] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0050] Organic Light-Emitting Diode (OLED) display panels are currently one of the mainstream display panel types. To reduce the reflection of ambient light by certain metal layers in OLED display panels, one design approach is to place a polarizer on the light-emitting side of the light-emitting element. While this design reduces ambient light reflection, it directly reduces display brightness by 50%.

[0051] To reduce ambient light reflection while maintaining the display brightness of the OLED panel, another design approach is to place a color resist unit on the light-emitting side of the light-emitting element, replacing the polarizer. This method not only effectively reduces ambient light reflection but also significantly reduces the absorption of light emitted from the light-emitting element compared to using a polarizer, thereby improving display brightness.

[0052] The design using color resist cells requires a planarization layer on the light-emitting side of the light-emitting element. A black matrix with multiple cutout areas is then formed on the surface of this planarization layer to create color resist cells within these cutout areas. However, the black matrix and the planarization layer are formed from materials with different properties. The organic resin molecules, dispersants, and viscosities of these two materials differ, which can lead to dispersion compatibility issues at the interface between the black matrix and the planarization layer. This can result in expansion, warping, or even separation at the interface.

[0053] In view of this, the technical solution of this application reuses the overlapping blocks of different color resist layers in the non-opening area as a light-shielding structure, so that the display panel does not need to set a black matrix, thereby solving the problem of interlayer warping or even separation caused by the different material properties of the black matrix and the underlying planarization layer in the existing display panel, and ensuring the image quality and service life of the display panel.

[0054] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0055] refer to Figure 1 and Figure 2 As shown, Figure 1 This is a top view of a display panel provided in an embodiment of this application. Figure 2 for Figure 1 The diagram shows a cross-sectional view of the display panel along the A-A' direction. The display panel includes:

[0056] The array substrate 11 includes a plurality of open regions K1 and non-open regions K2 located between adjacent open regions K1.

[0057] Display array 12 is located on one side of array substrate 11. Display array 12 includes at least a first light-emitting element 121, a second light-emitting element 122, and a third light-emitting element 123 with different light-emitting colors. The first light-emitting element 121, the second light-emitting element 122, and the third light-emitting element 123 are respectively located in the corresponding opening area K1.

[0058] Encapsulation layer 13 covers display array 12;

[0059] Touch electrode layer 14, the touch electrode layer 14 is located on the side of the encapsulation layer 13 away from the array substrate 14;

[0060] The first planarization layer 15 covers the touch electrode layer 14;

[0061] Color resist structure 16 is located on the side of the first planarization layer 15 away from the display array 12; color resist structure 16 includes: a first color resist layer 21, a second color resist layer 22 and a third color resist layer 23.

[0062] The first color resist layer 21 includes: a first color resist unit S1 and a first block Q1; in a direction perpendicular to the plane of the array substrate 11, the first color resist unit S1 at least partially overlaps with the first light-emitting element 121, and the first block Q1 at least partially overlaps with the non-opening area K2.

[0063] The second color resist layer 22 includes: a second color resist unit S2 and a second block Q2; in a direction perpendicular to the plane of the array substrate 11, the second color resist unit S2 at least partially overlaps with the second light-emitting element 122, and the second block Q2 at least partially overlaps with the non-opening area K2.

[0064] The third color resist layer 23 includes: a third color resist unit S3 and a third block Q3; in a direction perpendicular to the plane of the array substrate 11, the third color resist unit S3 overlaps at least partially with the third light-emitting element 123, and the third block Q3 overlaps at least partially with the non-opening region K2.

[0065] Among them, at least two of the first block Q1, the second block Q2 and the third block Q3 are stacked in a direction perpendicular to the plane of the array substrate 11 to form a light-shielding structure.

[0066] Each color resist unit can transmit light emitted from its corresponding light-emitting element below it and block the transmission of other colors of light. For example, the first light-emitting element 121, the second light-emitting element 122, and the third light-emitting element 123 can be a red sub-pixel R emitting red light, a green sub-pixel G emitting green light, and a blue sub-pixel B emitting blue light, respectively. That is, the first light-emitting element 121, the second light-emitting element 122, and the third light-emitting element 123 correspond to emitting red light, green light, and blue light, respectively. The first color resist unit S1 can transmit red light and block the transmission of other colors of light. The second color resist unit S2 can transmit green light and block the transmission of other colors of light. The third color resist unit S3 can transmit blue light and block the transmission of other colors of light.

[0067] Along the direction perpendicular to the plane where the array substrate 11 is located, the light-shielding structure is a stacked structure including at least two of the first block Q1, the second block Q2 and the third block Q3. Since the blocks of different color resist layers transmit different colors, the stacked structure consisting of at least two of the first block Q1, the second block Q2 and the third block Q3 will theoretically completely block visible light and have the same light-shielding effect as the black matrix.

[0068] Understandably, using a light-blocking structure as a black matrix between two adjacent color resist units can isolate the light emitted from two adjacent light-emitting elements, preventing crosstalk between them. It can also block and absorb incident ambient light, reducing the display panel's reflection of ambient light and improving display quality. Compared to designs using polarizers to reduce ambient light reflection, theoretically, this approach results in no loss of display brightness and does not affect the display panel's brightness.

[0069] Furthermore, the first planarization layer 15 in the display panel is made of optical adhesive material, and the color resist layer is made of photoresist material. Compared with the materials used in conventional black matrix, photoresist material and optical adhesive material have similar material properties, resulting in a higher degree of dispersion and curing of photoresist material and optical adhesive material. In this way, the contact surface between the first planarization layer 15 and the color resist layer on its surface has good stability, and there will be no problems such as expansion, warping, or even separation.

[0070] As can be seen, in this embodiment, the stacked structure formed by blocks of different color resist layers can play a good role in blocking light and can be reused as a black matrix. Therefore, it is not necessary to set a black matrix in the display panel, avoiding warping or even interlayer separation between the black matrix and the planarization layer below it. Moreover, the contact surface between the first planarization layer 15 and the color resist layer on its surface has good stability and will not cause expansion, warping or even separation problems.

[0071] like Figure 2 As shown, the first block Q1 and the adjacent first color resist unit S1 are integrally structured; the second block Q2 and the adjacent second color resist unit S2 are integrally structured; and the third block Q3 and the adjacent third color resist unit S3 are integrally structured. In this way, for the same color resist layer, the color resist unit and the adjacent block are integrally structured, which not only allows for fabrication using the same process but also avoids the separation of the color resist unit and the adjacent block within the same color resist layer, thus preventing light leakage problems.

[0072] Optionally, the first color resist unit S1 and the second color resist unit S2 are adjacent; the light-shielding structure includes a first light-shielding structure. Figure 2 The light-blocking structure shown in the dashed box is the first light-blocking structure. This first light-blocking structure is located between the first color resist unit S1 and the second color resist unit S2, and includes a first block Q1 and a second block Q2. The first light-blocking structure can be formed between the first color resist unit S1 and the second color resist unit S2 by stacking the first block Q1 and the second block Q2. This first light-blocking structure is reused as a black matrix between the first color resist unit S1 and the second color resist unit S2. A good light-blocking effect can be achieved by stacking blocks of two different color resist layers, and the implementation method is simple.

[0073] like Figure 2As shown, the two adjacent color resist units on both sides of the first light-blocking structure are the first color resist unit S1 and the second color resist unit S2. The first color resist unit S1 and the second color resist unit S2 correspond to the red sub-pixel R and the green sub-pixel G, respectively. The first color resist unit S1 and the second color resist unit S2 can transmit red light and green light, respectively. In the first light-blocking structure, the first block Q1 and the second block Q2 can transmit red light and green light, respectively. Therefore, when ambient light is incident on the first light-blocking structure, the ambient light first passes through the second block Q2. Green light can pass through the second block Q2, while other colors of visible light are blocked and absorbed by the second block Q2. The green light that passes through the second block Q2 and is incident on the first block Q1 is blocked and absorbed by the first block Q1, thereby achieving the blocking and absorption of ambient light.

[0074] exist Figure 2 In the illustrated configuration, the light-shielding structure between two adjacent light-emitting elements is a stacked structure of any two of the first block Q1, the second block Q2, and the third block Q3.

[0075] refer to Figure 3 As shown, Figure 3 This is a cross-sectional view of a display panel provided in an embodiment of this application. In this configuration, the first color resist unit S1 and the second color resist unit S2 are adjacent, and the light-shielding structure includes a second light-shielding structure. Figure 3 The light-shielding structure shown in the dashed box is the second light-shielding structure. This second light-shielding structure is located between the first color resist unit S1 and the second color resist unit S2, and includes a first block Q1 and a third block Q3. This method forms the second light-shielding structure between the first color resist unit S1 and the second color resist unit S2 based on the stacked structure of the first block Q1 and the third block Q3. The second light-shielding structure is reused as a black matrix between the first color resist unit S1 and the second color resist unit S2. A good light-shielding effect can be achieved by stacking blocks of two different color resist layers, and the implementation method is simple.

[0076] like Figure 3 As shown, the two adjacent color resist units on both sides of the second light-shielding structure are the first color resist unit S1 and the second color resist unit S2, respectively. The first color resist unit S1 and the second color resist unit S2 correspond to the red sub-pixel R and the green sub-pixel G, respectively. The first color resist unit S1 and the second color resist unit S2 can transmit red light and green light, respectively. The first block Q1 and the third block Q3 in the second light-shielding structure can transmit red light and blue light, respectively. Therefore, when ambient light is incident on the second light-shielding structure, the ambient light first passes through the third block Q3. Blue light can pass through the third block Q3, while other colors of visible light are blocked and absorbed by the third block Q3. The blue light that passes through the third block Q3 and is incident on the first block Q1 is blocked and absorbed by the first block Q1, thereby achieving the blocking and absorption of ambient light.

[0077] In this embodiment, when the light-shielding structure is a block stacking structure of two different color resist layers, the stacking method of the blocks in the light-shielding structure within the area corresponding to the non-opening region K2 is not limited to the following: Figure 2 and Figure 3 As shown, the light-shielding structure can be set to be a stacked structure of any two of the first block Q1, the second block Q2, and the third block Q3.

[0078] Optional, such as Figure 2 and Figure 3 As shown, the first color resist unit S1, the second color resist unit S2, and the third color resist unit S3 can be configured to have the same first thickness; the light-shielding structure has a second thickness, which is no greater than the first thickness. Setting the second thickness to be no greater than the first thickness avoids the need for thicker additional film layers above the color resist structure 16 due to a larger second thickness, thus allowing the display panel to have a thinner thickness. Other film layers include the second planarization layer described below.

[0079] It should be noted that, in this embodiment, the thickness is the dimension of the film layer in the direction perpendicular to the plane of the array substrate 11. Figure 2 and Figure 3 The illustrated method uses an example where the second thickness is less than the first thickness. The display panel can also be configured as follows: Figure 4 As shown, the second thickness is set to be equal to the first thickness.

[0080] refer to Figure 4 As shown, Figure 4 A cross-sectional view of another display panel provided in an embodiment of this application, in Figure 3 Based on the method shown, Figure 4 In the display panel shown, the second thickness is equal to the first thickness.

[0081] Optionally, the second thickness is set to be equal to the first thickness. This can make the surface of the color resist structure 16 facing away from the array substrate 11 have better flatness, thereby minimizing the thickness of other film layers required on its upper surface, so that the display panel has a smaller thickness.

[0082] In the embodiments of this application, the light-shielding structure is not limited to... Figures 2-4 The configuration shown is formed by stacking two of the first block Q1, the second block Q2, and the third block Q3. A light-shielding structure can also be provided, such as... Figure 5 As shown.

[0083] refer to Figure 5 As shown, Figure 5 A cross-sectional view of another display panel provided in an embodiment of this application, and... Figures 2-4 The difference shown is that, Figure 5The light-shielding structure shown includes a first block Q1, a second block Q2, and a third block Q3. The light-shielding structure is a stacked structure of three blocks with different light-transmitting colors, which can better block the transmission of visible light, better isolate the light emitted from adjacent light-emitting elements, and reduce ambient light reflection.

[0084] When the light-shielding structure includes a first block Q1, a second block Q2, and a third block Q3, as described above, a second thickness not greater than the first thickness can also be set so that the surface of the color resist structure 16 facing away from the array substrate 11 has better flatness, thereby reducing the thickness of other film layers on the surface of the color resist structure 16, and thus making the display panel have a thinner thickness.

[0085] In this embodiment, the first color resist unit S1, the second color resist unit S2, and the third color resist unit S3 are configured to have the same first thickness, and the first block Q1, the second block Q2, and the third block Q3 are all configured to have the third thickness, so as to facilitate the preparation of each color resist layer and thereby simplify the fabrication process of the color resist structure 16.

[0086] When the light-shielding structure includes a first block Q1, a second block Q2, and a third block Q3, and the thicknesses of the first block Q1, the second block Q2, and the third block Q3 are all the third thickness, in order to ensure that the second thickness is not greater than the first thickness, the third thickness can be set to be no greater than one-third of the first thickness.

[0087] Optionally, the third thickness is set to be one-third of the first thickness. In this way, the second thickness is equal to the first thickness, which can make the surface of the color resist structure 16 facing away from the array substrate 11 have better flatness, thereby reducing the thickness of other film layers on the surface of the color resist structure 16.

[0088] like Figure 4 As shown, when the light-shielding structure includes any two of the first block Q1, the second block Q2, and the third block Q3, the thickness of the first block Q1, the second block Q2, and the third block Q3 are all set to a fourth thickness, which is equal to half the first thickness. This also allows the second thickness to be equal to the first thickness, resulting in better flatness on the surface of the color resist structure 16 facing away from the array substrate 11, thereby reducing the thickness of other film layers on the surface of the color resist structure 16.

[0089] like Figures 2-5 As shown, a pixel definition layer 18 is provided on the array substrate 11; the pixel definition layer 18 has multiple pixel openings, and the first light-emitting element 121, the second light-emitting element 122 and the third light-emitting element 123 are respectively located in the corresponding pixel openings.

[0090] In this configuration, the orthographic projection of the first light-emitting element 121 onto the array substrate 11 lies within the orthographic projection range of the first color resist unit S1 onto the array substrate 11; the orthographic projection of the second light-emitting element 122 onto the array substrate 11 lies within the orthographic projection range of the second color resist unit S2 onto the array substrate 11; and the orthographic projection of the third light-emitting element 123 onto the array substrate 11 lies within the orthographic projection range of the third color resist unit S3 onto the array substrate 11. By positioning the orthographic projections of each light-emitting element onto the array substrate 11 within the orthographic projection range of its corresponding color resist unit onto the array substrate 11, the color resist unit can achieve a greater degree of light filtering for its corresponding light-emitting element, thereby preventing stray light from passing through the area corresponding to that light-emitting element and reducing interference between different colors of light.

[0091] When the orthographic projection of the light-emitting element on the array substrate 11 is located within the orthographic projection of the corresponding color resist unit on the array substrate 11, the orthographic projection of the light-emitting element on the array substrate 11 can be set to coincide exactly with the orthographic projection of the corresponding color resist unit on the array substrate 11, or the orthographic projection area of ​​the light-emitting element on the array substrate 11 is smaller than the orthographic projection area of ​​the corresponding color resist unit on the array substrate 11.

[0092] refer to Figure 6 As shown, Figure 6 This is a cross-sectional view of another display panel provided in the embodiments of this application, based on the above embodiments. Figure 6 The display panel shown also includes: a second planarization layer 17 covering the color resist structure 16; and a cover plate 19 located on the side of the second planarization layer 17 opposite to the color resist structure 16.

[0093] By providing a second planarization layer 17, surface flatness can be ensured, which facilitates the attachment and fixing of the cover plate 19 to the light-emitting side of the display panel. The cover plate 19 can be a glass cover plate.

[0094] refer to Figure 7 As shown, Figure 7 This is a cross-sectional view of another display panel provided in an embodiment of this application. The hierarchical structure of the encapsulation layer 13 is shown in the diagram to clearly illustrate its structure. Figure 7 The layer structures of the encapsulation layer 13 on the side facing away from the array substrate 11 are not shown in the illustrated configuration. Based on the above embodiment, Figure 7 In the display panel shown, the encapsulation layer 13 includes a first inorganic layer 131, a first organic layer 132, and a second inorganic layer 133, which are sequentially stacked along the direction away from the array substrate 11. The encapsulation layer 13 includes two inorganic layers and an organic layer sandwiched between the two inorganic layers, which can effectively isolate water and oxygen from corroding the structure below the encapsulation layer 13, thereby improving its service life.

[0095] refer to Figure 8 As shown, Figure 8This is a cross-sectional view of another display panel provided in an embodiment of this application. The layered structure of the touch electrode layer 14 is shown to clearly illustrate this. Figure 8 The layer structures of the touch electrode layer 14 on the side facing away from the array substrate 11 are not shown in the illustrated configuration. Based on the above embodiment, Figure 8 In the display panel shown, the touch electrode layer 14 includes a first touch electrode layer 141, an insulating layer 142, and a second touch electrode layer 143, which are sequentially stacked along a direction away from the array substrate 11. This method integrates touch functionality into the display panel by forming the first touch electrode layer 141 on the encapsulation layer 13 and the second touch electrode layer 143 on the first touch electrode layer 141, thereby reducing panel thickness and simplifying the panel structure and manufacturing process.

[0096] In the touch electrode layer 14, both the first touch electrode layer 141 and the second touch electrode layer 143 are patterned conductive layers. The patterned structure of the first touch electrode layer 141 and the second touch electrode layer 143 is set according to requirements to form the desired touch electrode pattern. The embodiments of this application do not specifically limit the patterned structure of the touch electrodes. The first touch electrode layer 141 and the second touch electrode layer 143 can be transparent conductive layers or metal mesh structures.

[0097] Since the patterned structure of the first touch electrode layer 141 and the second touch electrode layer 143 causes the touch electrode layer 14 to be uneven, as shown in the figure above, by providing a first planarization layer 15 on the touch electrode layer 14, flatness can be ensured so as to provide a relatively flat setting surface for the color resist structure 16.

[0098] As described above, in the display panel provided in this application embodiment, at least two of the first block Q1, the second block Q2, and the third block Q3 are stacked to form a light-shielding structure located in the area corresponding to the non-opening area K2 of the display panel. Theoretically, this light-shielding structure can completely block visible light, thus achieving a light-shielding effect. The light-shielding structure can be reused as a black matrix, eliminating the need for a separate black matrix in the display panel. A light-shielding structure formed by blocks of different color resist layers can replace the conventional black matrix structure. Using a light-shielding structure formed by blocks of different color resist layers as a black matrix for light shielding not only achieves light isolation between different light-emitting elements, preventing crosstalk between different colored display lights, but also avoids warping or even separation between the film layers caused by significant differences in material properties between the black matrix and the planarization layer.

[0099] In this embodiment, the display panel can be an OLED display panel or a micro-LED display panel. In the OLED display panel, the light-emitting element is an OLED device. In the micro-LED display panel, the light-emitting element is a Micro LED device or a MiniLED device. The display panel is not limited to including red, green, and blue sub-pixels; it may also include a fourth light-emitting element. This fourth light-emitting element is used to emit white light for brightness compensation or to emit other visible light for tone compensation.

[0100] It is easy to see that the type of display panel is not limited to OLED display panel or micro LED display panel, but can also be LCD panel, and the light-shielding structure can also replace the black matrix in LCD display panel.

[0101] Based on the display panel provided in the above embodiments, another embodiment of this application also provides a display device, which is as follows: Figure 9 As shown.

[0102] refer to Figure 9 As shown, Figure 9 This is a schematic diagram of a display device provided in an embodiment of the present application. The display device includes a display panel 31 provided in any of the above embodiments.

[0103] The display device provided in this application embodiment can be an electronic product such as a smartphone, tablet computer, all-in-one computer, home appliance with display function, and smart wearable device. By using the display panel 31 in the above embodiment, it is unnecessary to set a black matrix in the display panel 31, thus solving the problem of interlayer warping or even separation between the black matrix and the underlying planarization layer caused by setting a black matrix. This ensures the display effect and lifespan of the display panel, thereby improving the display quality and lifespan of the display device.

[0104] Based on the above embodiments, another embodiment of this application provides a method for manufacturing a display panel, used to prepare a display panel as described in any of the above embodiments, the method being as follows: Figure 10 As shown.

[0105] refer to Figure 10 As shown, Figure 10 A flowchart illustrating a method for manufacturing a display panel, provided in this application embodiment, includes:

[0106] Step S11: Provide an array substrate, the array substrate including a plurality of open regions and non-open regions located between adjacent open regions.

[0107] Step S12: A display array is prepared on one side of the array substrate. The display array includes at least a first light-emitting element, a second light-emitting element, and a third light-emitting element with different light-emitting colors. The first light-emitting element, the second light-emitting element, and the third light-emitting element are respectively located in the corresponding opening areas.

[0108] Step S13: On the side of the display array away from the array substrate, an encapsulation layer covering the display array, a touch electrode layer, and a first planarization layer covering the touch electrode layer are sequentially formed.

[0109] Step S14: A color resist structure is formed on the side of the first planarization layer opposite to the display array. The color resist structure includes a first color resist layer, a second color resist layer, and a third color resist layer. The first color resist layer includes a first color resist unit and a first block. In a direction perpendicular to the plane of the array substrate, the first color resist unit at least partially overlaps with the first light-emitting element, and the first block at least partially overlaps with the non-opening area. The second color resist layer includes a second color resist unit and a second block. In a direction perpendicular to the plane of the array substrate, the second color resist unit at least partially overlaps with the second light-emitting element, and the second block at least partially overlaps with the non-opening area. The third color resist layer includes a third color resist unit and a third block. In a direction perpendicular to the plane of the array substrate, the third color resist unit at least partially overlaps with the third light-emitting element, and the third block at least partially overlaps with the non-opening area. At least two of the first block, the second block, and the third block are stacked in a direction perpendicular to the plane of the array substrate to form a light-shielding structure.

[0110] Based on the manufacturing method provided in the embodiments of this application, the display panel in the above embodiments can be prepared, so that the prepared display panel can reuse the blocks in different color resist layers as light-shielding structures. There is no need to set a black matrix in the display panel, which solves the problem of interlayer warping or even separation caused by the different material properties of the black matrix and the underlying planarization layer in the existing display panel, and ensures the image quality and service life of the display panel.

[0111] The following is combined with Figures 11-16 The method for manufacturing the display panel provided in the embodiments of this application will be described in detail. Figure 11 A cross-sectional view of the structure obtained after performing step S11 in a method for manufacturing a display panel according to an embodiment of this application; Figure 12 A cross-sectional view of the structure obtained after performing steps S12 and S13 in a method for manufacturing a display panel according to an embodiment of this application; Figure 13 A cross-sectional view of each structure after the formation of the first color resist layer in a method for manufacturing a display panel according to an embodiment of this application; Figure 14 A cross-sectional view of each structure after forming the second color resist layer in a method for manufacturing a display panel according to an embodiment of this application; Figure 15This is a cross-sectional view of each structure after the formation of the third color resist layer in a method for manufacturing a display panel according to an embodiment of this application.

[0112] In step S11, please refer to Figure 11 An array substrate 11 is provided, the array substrate 11 includes a plurality of opening regions K1 and non-opening regions K2 located between adjacent opening regions K1.

[0113] It is understood that the array substrate 11 has a thin-film transistor (TFT) array for controlling the light-emitting elements to emit light. The TFTs are not shown in the accompanying drawings of the embodiments of this application. The design scheme of the TFTs in the array substrate 11 can adopt the existing circuit layout. The embodiments of this application do not specifically limit this.

[0114] In step S12, please refer to Figure 12 A display array 12 is fabricated on one side of the array substrate 11. The display array 12 includes at least a first light-emitting element 121, a second light-emitting element 122, and a third light-emitting element 123 with different light-emitting colors. The first light-emitting element 121, the second light-emitting element 122, and the third light-emitting element 123 are respectively located in the corresponding opening regions K1.

[0115] Optionally, the first light-emitting element 121 is a red sub-pixel R, the second light-emitting element 122 is a green sub-pixel G, and the third light-emitting element 123 is a blue sub-pixel B.

[0116] Optionally, before fabricating the display array 12, a pixel definition layer 18 can be formed on one side of the array substrate 11. The pixel definition layer 18 has multiple pixel openings. When fabricating the light-emitting element, the light-emitting element can be formed in the pixel openings of the pixel definition layer 18.

[0117] In step S13, please continue reading Figure 12 On the side of the display array 12 away from the array substrate 11, an encapsulation layer 13 covering the display array, a touch electrode layer 14, and a first planarization layer 15 covering the touch electrode layer 14 are sequentially formed.

[0118] Understandably, forming an encapsulation layer 13 on the light-emitting side of the display array 12 can encapsulate and protect the light-emitting elements. A touch electrode layer 14 is formed on the side of the encapsulation layer 13 facing away from the array substrate 11 to integrate touch functionality into the display panel. A first planarization layer 15 is formed on the side of the touch electrode layer 14 facing away from the array substrate 11 to provide a flat surface for subsequent processes to fabricate the color resist structure 16.

[0119] In step S14, please refer to Figures 13-15A color resist structure 16 is formed on the side of the first planarization layer 15 opposite to the display array 12. The color resist structure 16 includes a first color resist layer 21, a second color resist layer 22, and a third color resist layer 23. The first color resist layer 21 includes a first color resist unit S1 and a first block Q1. In a direction perpendicular to the plane of the array substrate 11, the first color resist unit S1 at least partially overlaps with the first light-emitting element 121, and the first block Q1 at least partially overlaps with the non-opening area K2. The second color resist layer 22 includes a second color resist unit S2 and a second block Q2. In a direction perpendicular to the plane of the array substrate 11, the first color resist unit S1 at least partially overlaps with the first light-emitting element 121, and the first block Q1 at least partially overlaps with the non-opening area K2. In the direction perpendicular to the plane of the array substrate 11, the second color resist unit S2 and the second light-emitting element 122 overlap at least partially, and the second block Q2 and the non-opening area K2 overlap at least partially; the third color resist layer 23 includes: the third color resist unit S3 and the third block Q3; in the direction perpendicular to the plane of the array substrate 11, the third color resist unit S3 and the third light-emitting element 123 overlap at least partially, and the third block Q3 and the non-opening area K2 overlap at least partially; wherein, at least two of the first block Q1, the second block Q2 and the third block Q3 are stacked in the direction perpendicular to the plane of the array substrate 11 to form a light-shielding structure.

[0120] In this embodiment of the application, the first color resist layer 21, the second color resist layer 22 and the third color resist layer 23 can be prepared separately. For example, the first color resist layer 21 can be formed first, then the second color resist layer 22 can be formed, and finally the third color resist layer 23 can be formed.

[0121] In some embodiments, the thickness of the first color resist unit S1 is greater than the thickness of the first block Q1, and the first color resist unit S1 and the first block Q1 are formed using a single patterning process; the thickness of the second color resist unit S2 is greater than the thickness of the second block Q2, and the second color resist unit S2 and the second block Q2 are formed using a single patterning process; the thickness of the third color resist unit S3 is greater than the thickness of the third block Q3, and the third color resist unit S3 and the third block Q3 are formed using a single patterning process. Thus, color resist units and blocks that transmit the same visible light are fabricated using the same single patterning process, meaning that the first color resist layer 21, the second color resist layer 22, and the third color resist layer 23 can each be formed using a single patterning process, simplifying the fabrication process.

[0122] In some embodiments, a color resist structure 16 is formed on the side of the first planarization layer 15 opposite to the display array 12, including:

[0123] Based on the halftone mask, the first color resist unit S1 and the first block Q1 are simultaneously formed on the side of the first planarization layer 15 opposite to the display array 12.

[0124] Based on the halftone mask, a second color resist unit S2 and a second block Q2 are simultaneously formed on the side of the first planarization layer 15 opposite to the display array 12.

[0125] Based on the halftone mask, a third color resist unit S3 and a third block Q3 are simultaneously formed on the side of the first planarization layer 15 opposite to the display array 12.

[0126] In this structure, the first block Q1 and the adjacent first color resist unit S1 are integrated; the second block Q2 and the adjacent second color resist unit S2 are integrated; and the third block Q3 and the adjacent third color resist unit S3 are integrated.

[0127] The color resist structure 16 is formed by using a halftone mask for a three-stage patterning process to create a first color resist layer 21, a second color resist layer 22, and a third color resist layer 23. This process is simple and inexpensive. To facilitate understanding of the process of forming color resist units and blocks based on a halftone mask in the embodiments of this application, the above manufacturing method is described in detail below.

[0128] First, a first color resist layer 21 is prepared. When preparing the first color resist layer 21, an unpatterned first color resist layer 21 is first coated on the first planarization layer 15, and an unpatterned first photoresist layer is formed on the surface of the first color resist layer 21. A first mask is used to pattern the first photoresist layer. The first mask has a first region corresponding to the first color resist unit S1, a second region corresponding to the first block Q1, and a third region corresponding to the second color resist unit S2 and the third color resist unit S3. The exposure rate of the first photoresist layer to the first region, second region, and third region decreases sequentially, thus causing the thickness of the patterned first photoresist layer to decrease sequentially in the first region, second region, and third region. Generally, the thickness of the first photoresist layer in the third region is zero, i.e., there is no photoresist. Thus, when the first color resist layer 21 is patterned based on the patterned first photoresist layer, the first color resist layer 21 in the third region can be completely removed, and the thickness of the first block Q1 is less than the thickness of the first color resist unit S1.

[0129] Then, a second color resist layer 22 is prepared. During the preparation of the second color resist layer 22, an unpatterned second color resist layer 22 is coated, and an unpatterned second photoresist layer is coated on top of the second color resist layer 22. The second color resist layer covers the first color resist layer 21 and the first planarization layer 15. A second mask is used to pattern the second photoresist layer. The second mask has a fourth region corresponding to the second color resist unit S2, a fifth region corresponding to the second block Q2, and a sixth region corresponding to the first color resist unit S1 and the third color resist unit S3. The exposure rate of the second photoresist layer decreases sequentially in the fourth, fifth, and sixth regions, resulting in a sequential decrease in the thickness of the patterned second photoresist layer 22 in the fourth, fifth, and sixth regions. Generally, the thickness of the second photoresist layer in the sixth region is zero, i.e., there is no photoresist. When the second color resist layer 22 is patterned based on the patterned second photoresist layer, the second color resist layer in the sixth region can be completely removed, and the thickness of the second region Q2 can be less than the thickness of the second color resist unit S2.

[0130] Finally, the third color resist layer 23 is prepared. During the preparation of the third color resist layer 23, an unpatterned third color resist layer 23 is coated, and an unpatterned third photoresist layer is coated on top of the third color resist layer 23. The third color resist layer covers the first color resist layer 21, the second color resist layer 22, and the first planarization layer 15. A third mask is used to pattern the third photoresist layer. The third mask has a seventh region corresponding to the third color resist unit S3, an eighth region corresponding to the third block Q3, and a ninth region corresponding to the first color resist unit S1 and the second color resist unit S2. The exposure rate of the third photoresist layer decreases sequentially in the seventh, eighth, and ninth regions, resulting in a sequential decrease in the thickness of the patterned third photoresist layer in the seventh, eighth, and ninth regions. Generally, the thickness of the third photoresist layer in the ninth region is zero, i.e., there is no photoresist. When the third color resist layer 23 is patterned based on the patterned third photoresist layer, the third color resist layer 23 in the ninth region can be completely removed, and the thickness of the third block Q3 can be less than the thickness of the third color resist unit S3.

[0131] It should be noted that, in the embodiments of this application, the formation order of the three color resist layers is not limited to the above-described manner.

[0132] Please see Figure 16 , Figure 16 A cross-sectional view of each structure after forming the second planarization layer and the cover plate in a method for manufacturing a display panel according to an embodiment of this application. In some embodiments, after forming the color resist structure 16 on the side of the first planarization layer 15 opposite to the display array 12, the method for manufacturing the display panel further includes the following steps:

[0133] A second planarization layer 17 is formed on the side of the color resist structure 16 away from the array substrate 11, and a cover plate 19 is formed on the side of the second planarization layer 17 away from the array substrate 11.

[0134] Understandably, a second planarization layer 17 can be formed after the color resist structure 16 is formed to facilitate the bonding and fixing of the cover plate 19.

[0135] In the above-mentioned method for manufacturing a display panel, after the touch layer 14 and the first planarization layer 15 on its surface are prepared, the process step of preparing the black matrix in the conventional manufacturing process is eliminated, and each color resist layer is directly formed. In the area corresponding to the non-opening area K2 of the display panel, a block stacked structure of different color resist layers is used to replace the black matrix.

[0136] Each color resist layer can be formed by coating process and patterned using a halftone mask corresponding to the pattern.

[0137] refer to Figure 17 As shown, Figure 17 The transmittance curves of different color resist layers in the visible light band are shown. Figure 17 The horizontal axis represents wavelength λ, and the vertical axis represents transmittance T. Taking the example of the first color resist layer 21 transmitting red light, the second color resist layer 22 transmitting green light, and the third color resist layer 23 transmitting blue light, curve 31 is the transmittance curve of the first color resist layer 21, curve 32 is the transmittance curve of the second color resist layer 22, and curve 33 is the transmittance curve of the third color resist layer 23. In the visible light band corresponding to the horizontal axis, for the same horizontal axis coordinate, the product of the transmittance of any two curves on the vertical axis does not exceed 30%, while the product of the transmittance of the three curves on the vertical axis is approximately 0. Therefore, the light-shielding structure formed by stacking blocks of two or three different color resist layers has a maximum transmittance of no more than 30%, which meets the low transmittance requirement of the black matrix in the display panel and can be reused as a black matrix.

[0138] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on its differences from other embodiments, and similar or identical parts between embodiments can be referred to interchangeably. For the apparatuses disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0139] It should be noted that, in the description of this application, the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0140] It should also be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0141] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that, The display panel includes: An array substrate includes multiple open regions and non-open regions located between adjacent open regions; A display array is located on one side of the array substrate, and the display array includes at least a first light-emitting element, a second light-emitting element, and a third light-emitting element with different light-emitting colors; the first light-emitting element, the second light-emitting element, and the third light-emitting element are respectively located in the corresponding opening areas; An encapsulation layer covers the display array; The touch electrode layer is located on the side of the encapsulation layer opposite to the array substrate; A first planarization layer covers the touch electrode layer; A color resist structure is located on the side of the first planarization layer opposite to the display array; the color resist structure includes: a first color resist layer, a second color resist layer, and a third color resist layer; A second planarization layer covers the color resist structure; The first color resist layer includes: a first color resist unit and a first block; in a direction perpendicular to the plane of the array substrate, the first color resist unit at least partially overlaps with the first light-emitting element, and the first block at least partially overlaps with the non-opening area; The second color resist layer includes: a second color resist unit and a second block; in a direction perpendicular to the plane of the array substrate, the second color resist unit at least partially overlaps with the second light-emitting element, and the second block at least partially overlaps with the non-opening area; The third color resist layer includes: a third color resist unit and a third block; in a direction perpendicular to the plane of the array substrate, the third color resist unit at least partially overlaps with the third light-emitting element, and the third block at least partially overlaps with the non-opening area; Wherein, at least two of the first block, the second block and the third block are stacked along a direction perpendicular to the plane of the array substrate to form a light-shielding structure; the first color resist unit, the second color resist unit and the third color resist unit have the same first thickness; the light-shielding structure has a second thickness, the second thickness being less than the first thickness; the first planarization layer is an optical adhesive material.

2. The display panel according to claim 1, characterized in that, The first block and the adjacent first color resist unit are an integral structure; The second block and the adjacent second color resist unit are an integral structure; The third block and the adjacent third color resist unit are an integral structure.

3. The display panel according to claim 1, characterized in that, The first color resist unit is adjacent to the second color resist unit; the light-shielding structure includes a first light-shielding structure; The first light-shielding structure is located between the first color resist unit and the second color resist unit, and the first light-shielding structure includes the first block and the second block.

4. The display panel according to claim 1, characterized in that, The first color resist unit is adjacent to the second color resist unit, and the light-shielding structure includes a second light-shielding structure; The second light-shielding structure is located between the first color resist unit and the second color resist unit, and the second light-shielding structure includes the first block and the third block.

5. The display panel according to claim 1, characterized in that, A pixel definition layer is provided on the array substrate; The pixel definition layer has multiple pixel openings, and the first light-emitting element, the second light-emitting element, and the third light-emitting element are respectively located in the corresponding pixel openings; Wherein, the orthographic projection of the first light-emitting element on the array substrate is located within the orthographic projection range of the first color resist unit on the array substrate; the orthographic projection of the second light-emitting element on the array substrate is located within the orthographic projection range of the second color resist unit on the array substrate; and the orthographic projection of the third light-emitting element on the array substrate is located within the orthographic projection range of the third color resist unit on the array substrate.

6. The display panel according to claim 1, characterized in that, The display panel also includes: The cover plate is located on the side of the second planarization layer opposite to the color resist structure.

7. The display panel according to claim 1, characterized in that, The encapsulation layer includes a first inorganic layer, a first organic layer, and a second inorganic layer, which are sequentially stacked along a direction away from the array substrate.

8. The display panel according to claim 1, characterized in that, The touch electrode layer includes a first touch electrode layer, an insulating layer, and a second touch electrode layer, which are sequentially stacked along a direction away from the array substrate.

9. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 8.

10. A method for manufacturing a display panel, characterized in that, include: An array substrate is provided, the array substrate including a plurality of open regions and non-open regions located between adjacent open regions; A display array is fabricated on one side of the array substrate, the display array including at least a first light-emitting element, a second light-emitting element, and a third light-emitting element with different emitting colors; the first light-emitting element, the second light-emitting element, and the third light-emitting element are respectively located in the corresponding opening areas; An encapsulation layer covering the display array, a touch electrode layer, and a first planarization layer covering the touch electrode layer are sequentially formed on the side of the display array away from the array substrate. A color resist structure is formed on the side of the first planarization layer opposite to the display array; The color resist structure includes: a first color resist layer, a second color resist layer, and a third color resist layer; A second planarization layer is formed on the side of the color resist structure opposite to the array substrate; The first color resist layer includes: a first color resist unit and a first block; in a direction perpendicular to the plane of the array substrate, the first color resist unit at least partially overlaps with the first light-emitting element, and the first block at least partially overlaps with the non-opening area; The second color resist layer includes: a second color resist unit and a second block; in a direction perpendicular to the plane of the array substrate, the second color resist unit at least partially overlaps with the second light-emitting element, and the second block at least partially overlaps with the non-opening area; The third color resist layer includes: a third color resist unit and a third block; in a direction perpendicular to the plane of the array substrate, the third color resist unit at least partially overlaps with the third light-emitting element, and the third block at least partially overlaps with the non-opening area; Wherein, at least two of the first block, the second block and the third block are stacked along a direction perpendicular to the plane where the array substrate is located to form a light-shielding structure; the first planarization layer is an optical adhesive material.

11. The manufacturing method according to claim 10, characterized in that, The thickness of the first color resist unit is greater than the thickness of the first block, and the first color resist unit and the first block are formed using a single patterning process; The thickness of the second color resist unit is greater than the thickness of the second block, and the second color resist unit and the second block are formed using a single patterning process; The thickness of the third color resist unit is greater than the thickness of the third block, and the third color resist unit and the third block are formed using a single patterning process.

12. The manufacturing method according to claim 11, characterized in that, The step of forming a color resist structure on the side of the first planarization layer opposite to the display array includes: Based on the halftone mask, the first color resist unit and the first block are simultaneously formed on the side of the first planarization layer opposite to the display array; Based on the halftone mask, the second color resist unit and the second block are simultaneously formed on the side of the first planarization layer opposite to the display array; Based on the halftone mask, the third color resist unit and the third block are simultaneously formed on the side of the first planarization layer opposite to the display array; The first block and the adjacent first color resist unit are integrated into one structure; the second block and the adjacent second color resist unit are integrated into one structure; and the third block and the adjacent third color resist unit are integrated into one structure.

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