Chamber x-ray camera for vacuum environment

Abstract

The present application relates to a kind of gas chamber type X-ray camera for vacuum environment, to solve the technical problems that the prior art has complex structure and low heat conduction efficiency.The gas chamber type X-ray camera includes first sealing plate, refrigeration block, imaging circuit board unit, second sealing plate, connecting unit, camera shell, X-ray chip unit mounted on the first sealing plate and water cooling block sealedly installed on the first sealing plate and connected with the connecting unit.The first sealing plate and the second sealing plate are sealedly installed at both ends of the camera shell, and form a gas chamber structure with the water cooling block;The refrigeration block is tightly attached to the X-ray chip unit and the water cooling block at both ends respectively;The imaging circuit board unit located in the gas chamber structure includes first imaging circuit board and second imaging circuit board electrically connected with X-ray chip unit and connecting unit respectively, first mounting plate and second mounting plate tightly installed on the water cooling block, and first imaging circuit board and second imaging circuit board are installed on the first mounting plate and the second mounting plate correspondingly.

Description

Technical Field

[0001] This invention relates to X-ray cameras, and more particularly to gas chamber X-ray cameras for use in vacuum environments. Background Technology

[0002] X-ray cameras are used to acquire X-ray images. Typically, due to limitations in image acquisition, X-ray cameras need to operate in a vacuum environment. When an X-ray camera is working, its cooling unit and imaging circuit board used for image processing generate heat. However, since heat cannot be transferred in a vacuum, prolonged heating of the imaging circuit board can severely impact the performance of the X-ray camera. Therefore, cooling of the heated imaging circuit board is necessary. Currently, metal heat conduction or air cooling are commonly used to cool the imaging circuit board, transferring heat to the outside through contact with the circuit board. However, this contact cooling method requires a large contact surface area, resulting in a complex overall structure, large space occupation, and low thermal conductivity, thus affecting the lifespan of the X-ray camera. Therefore, there is a need to design an X-ray camera with a gas chamber structure and high cooling efficiency. Summary of the Invention

[0003] The purpose of this invention is to solve the technical problems of existing X-ray cameras having complex structures and low thermal conductivity, which affect their service life, and to provide a gas chamber type X-ray camera for use in a vacuum environment.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A chamber-type X-ray camera for use in a vacuum environment is characterized by comprising an X-ray chip unit, a first sealing plate, a cooling block, an imaging circuit board unit, a second sealing plate, a connecting unit, a camera housing, and a water-cooling block sealed and mounted on the first sealing plate.

[0006] The first sealing plate and the second sealing plate are respectively sealed and installed at both ends of the camera housing; the first sealing plate, the water-cooling block, the second sealing plate and the camera housing form an air chamber structure; the X-ray chip unit is installed on the outside of the first sealing plate; the first sealing plate is provided with a first through hole; the cooling block is located in the first through hole, and one end is tightly attached to the X-ray chip unit, and the other end is tightly attached to the end of the water-cooling block located outside the air chamber structure;

[0007] The imaging circuit board unit is located within the air chamber structure; the imaging circuit board unit includes a first imaging circuit board, a second imaging circuit board, a first mounting plate, and a second mounting plate; the first mounting plate and the second mounting plate are respectively mounted in close contact with two opposite sides of the water-cooled block, and the lengths of the first mounting plate and the second mounting plate along the axial direction of the water-cooled block are both greater than the axial length of the water-cooled block; the first imaging circuit board is mounted on the first mounting plate; the second imaging circuit board is mounted on the second mounting plate; the X-ray chip unit is electrically connected to the first imaging circuit board and the second imaging circuit board respectively; the connecting unit is mounted on the second sealing plate, and the connecting unit is electrically connected to the first imaging circuit board, the second imaging circuit board, and the internal water pipes of the water-cooled block respectively.

[0008] Furthermore, the heat-generating components on the first imaging circuit board are located between the first imaging circuit board and the first mounting plate, and correspond to the position of the water-cooling block; the heat-generating components on the second imaging circuit board are located between the second imaging circuit board and the second mounting plate, and correspond to the position of the water-cooling block; insulating thermally conductive pads are provided between the gaps between the first imaging circuit board and the first mounting plate, and between the second imaging circuit board and the second mounting plate, which can achieve a high thermal conductivity effect.

[0009] Furthermore, to further improve heat dissipation efficiency, the end of the water-cooled block away from the cooling block is provided with two first water channel connectors, and the other two sides of the water-cooled block are designed in a serrated shape; the connection unit includes a power socket disposed on the second sealing plate and one end extending into the air chamber structure, two second water channel connectors, and two optical fiber connectors; the optical fiber connectors, second water channel connectors, and power socket all adopt an airtight structure to ensure the airtightness of the air chamber structure;

[0010] One end of each of the two first water circuit connectors is connected to the inlet and outlet of the water circuit pipe inside the water-cooling block, respectively; one end of each of the two second water circuit connectors located inside the air chamber structure is connected to the other end of each of the two first water circuit connectors, and the other end located outside the air chamber structure is connected to the inlet and outlet of the external water chiller, respectively, to form a circulating water circuit; the two optical fiber connectors are respectively connected to the first imaging circuit board and the second imaging circuit board for image transmission; the power socket is electrically connected to the first imaging circuit board and the second imaging circuit board for power supply.

[0011] Furthermore, the X-ray chip unit includes a chip mounting base, an X-ray chip, a chip circuit board, two pressure plates, and multiple chip support pillars;

[0012] The X-ray chip is mounted on a chip mounting base via two pressure plates; the X-ray chip is provided with a first pin and is mounted on a chip circuit board via the first pin; the chip mounting base is mounted on a first sealing plate via a chip support post passing through the chip circuit board; a vacuum-sintered second pin is provided on the first sealing plate; the chip circuit board is mounted on the first sealing plate and is electrically connected to a first imaging circuit board and a second imaging circuit board via the second pin; a second through hole is provided on the chip circuit board, and one end of a cooling block passes through the second through hole and is in close contact with the X-ray chip between the two pressure plates, for reducing the temperature of the X-ray chip to -8°C to -12°C.

[0013] Furthermore, the first imaging circuit board, the second imaging circuit board, the first mounting plate, and the second mounting plate are parallel to each other and have equal lengths along the axial direction of the water-cooling block.

[0014] Furthermore, in order to protect the components, a first protective housing installed on the outside of the first sealing plate and a second protective housing installed on the outside of the second sealing plate are also included.

[0015] The outer surfaces of the first and second protective housings in the circumferential direction are flush with the outer surface of the camera housing.

[0016] Furthermore, the water-cooled block, the first mounting plate, and the second mounting plate are all made of copper.

[0017] Furthermore, sealing rings are provided between the first sealing plate and the camera housing, between the first sealing plate and the water cooling block, and between the second sealing plate and the camera housing.

[0018] Furthermore, the axes of the X-ray chip, the first through hole, the second through hole, the cooling block, and the water-cooling block coincide, making the overall structure compact and the space layout small.

[0019] The beneficial effects of this invention are:

[0020] 1. This invention provides a chamber-type X-ray camera for use in a vacuum environment, featuring a compact overall structure and convenient installation. Because the first sealing plate, camera housing, and second sealing plate form a chamber structure in a vacuum environment, and the first and second mounting plates are respectively mounted on both sides of a water-cooling block, with the first imaging circuit board mounted on the first mounting plate and the second imaging circuit board mounted on the second mounting plate, the air within the chamber structure, combined with the water-cooling block, effectively transfers heat between the first and second imaging circuit boards, achieving high thermal conductivity and a simple structure, thereby improving the X-ray camera's lifespan and performance.

[0021] 2. In this invention, the high-heat-generating components on the first imaging circuit board are located between the first imaging circuit board and the first mounting plate tightly attached to the water-cooling block. Similarly, the high-heat-generating components on the second imaging circuit board are located between the second imaging circuit board and the second mounting plate tightly attached to the water-cooling block. Combined with the provided thermal pads, this significantly improves heat dissipation efficiency. Furthermore, the remaining two sides of the water-cooling block are designed with a serrated shape, which increases the contact area with the air inside the air chamber structure, thereby achieving better heat dissipation. The water-cooling block, the first mounting plate, and the second mounting plate are all made of copper, which improves thermal conductivity.

[0022] 3. In this invention, the X-ray chip is mounted on the chip mounting base by a pressure plate, and the chip mounting base is mounted on the first sealing plate by a chip support post, which facilitates disassembly and maintenance, and ensures that the position of the X-ray chip will not change during secondary installation, thereby facilitating the calibration of image pixel positions.

[0023] 4. The first protective shell and the second protective shell in this invention can effectively protect each component. In addition, the optical fiber connector, the second water channel connector and the power socket all adopt an airtight structure to ensure the airtightness of the air chamber structure. Attached Figure Description

[0024] Figure 1 This is a half-section three-dimensional structural schematic diagram of an embodiment of the gas chamber type X-ray camera for use in a vacuum environment according to the present invention;

[0025] Figure 2 yes Figure 1 A partial structural diagram of the cross-section;

[0026] Figure 3 This is a three-dimensional structural schematic diagram of the first imaging circuit board in an embodiment of the present invention;

[0027] Figure 4 This is a three-dimensional structural diagram of the X-ray chip unit in an embodiment of the present invention (the chip circuit board and chip support pillars are not shown).

[0028] Figure 5 This is a three-dimensional structural diagram of the water-cooled block in an embodiment of the present invention;

[0029] Figure 6 yes Figure 5 A schematic diagram of a half-section three-dimensional structure;

[0030] Figure 7 This is a three-dimensional structural schematic diagram of an embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of the installation structure of the X-ray chip unit in an embodiment of the present invention.

[0032] Icon labels:

[0033] 1-X-ray chip unit, 11-Chip mounting base, 12-X-ray chip, 121-First pin, 13-Pressure plate, 14-Chip circuit board, 141-Second through hole, 15-Chip support post, 2-First sealing plate, 21-First through hole, 22-Second pin, 3-Cooling block, 4-Water cooling block, 41-First water channel connector, 5-Imaging circuit board unit, 51-First imaging circuit board, 52-Second imaging circuit board, 53-First mounting plate, 54-Second mounting plate, 55-Thermal conductive pad, 6-Second sealing plate, 7-Connection unit, 71-Fiber optic connector, 72-Second water channel connector, 73-Power socket, 8-Camera housing, 9-First protective housing, 10-Second protective housing. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, the feature defining "first" or "second" may explicitly or implicitly include one or more of that feature.

[0036] like Figures 1-3 and Figures 7-8As shown, a chamber-type X-ray camera for use in a vacuum environment includes an X-ray chip unit 1, a first sealing plate 2, a cooling block 3, an imaging circuit board unit 5, a second sealing plate 6, a connecting unit 7, a camera housing 8, a water-cooling block 4 sealed and mounted on the first sealing plate 2, a first protective housing 9 mounted on the outside of the first sealing plate 2, and a second protective housing 10 mounted on the outside of the second sealing plate 6. Specifically, the first sealing plate 2 and the second sealing plate 6 are respectively sealed and mounted at both ends of the camera housing 8. The first sealing plate 2, the water-cooling block 4, the second sealing plate 6, and the camera housing 8 form a chamber structure. In this embodiment, sealing rings are provided between the first sealing plate 2 and the camera housing 8, between the first sealing plate 2 and the water-cooling block 4, and between the second sealing plate 6 and the camera housing 8. The imaging circuit board unit 5 is located inside the chamber structure and includes a first imaging circuit board 51, a second imaging circuit board 52, a first mounting plate 53, and a second mounting plate 54. The first mounting plate 53 and the second mounting plate 54 are respectively mounted tightly against two opposite sides of the water-cooled block 4, and the lengths of the first mounting plate 53 and the second mounting plate 54 along the axial direction of the water-cooled block 4 are both greater than the axial length of the water-cooled block 4, for effective heat transfer. The first imaging circuit board 51 is mounted on the first mounting plate 53. High-heat-generating components on the first imaging circuit board 51 are located between the first imaging circuit board 51 and the first mounting plate 53, corresponding to the position of the water-cooled block 4. The second imaging circuit board 52 is mounted on the second mounting plate 54. High-heat-generating components on the second imaging circuit board 52 are located between the second imaging circuit board 52 and the second mounting plate 54, corresponding to the position of the water-cooled block 4. Insulating thermally conductive pads 55 are provided between the gaps between the first imaging circuit board 51 and the first mounting plate 53, and between the second imaging circuit board 52 and the second mounting plate 54. See details... Figures 1-3 The first imaging circuit board 51, the second imaging circuit board 52, the first mounting plate 53, and the second mounting plate 54 are parallel to each other and have equal lengths along the axial direction of the water-cooling block 4. The first mounting plate 53 and the second mounting plate 54 are both made of copper to improve heat conduction efficiency. Furthermore, the first protective housing 9 and the second protective housing 10 protect the X-ray chip unit 1 and the connecting unit 7. The circumferential outer surfaces of the first protective housing 9 and the second protective housing 10 are flush with the outer surface of the camera housing 8. The first protective housing 9 has threaded holes for mounting other external structures. See details... Figures 7-8 .

[0037] like Figures 1-2 and Figure 4As shown, the X-ray chip unit 1 includes a chip mounting base 11, an X-ray chip 12, a chip circuit board 14, two pressure plates 13, and multiple chip support pillars 15. The X-ray chip 12 is mounted on the chip mounting base 11 via two pressure plates 13. The X-ray chip 12 is provided with a first pin 121, which is installed in a socket on the chip circuit board 14. The chip mounting base 11 is mounted on the first sealing plate 2 via a chip support post 15 passing through the chip circuit board 14. The first sealing plate 2 is provided with a vacuum-sintered second pin 22. The chip circuit board 14 is mounted on the first sealing plate 2 and is electrically connected to the first imaging circuit board 51 and the second imaging circuit board 52 via the second pin 22. The first sealing plate 2 is provided with a first through hole 21, and the chip circuit board 14 is provided with a second through hole 141. The cooling block 3 is located in the first through hole 21, with one end passing through the second through hole 141 and closely attached to the X-ray chip 12 between the two pressure plates 13 to reduce the temperature of the X-ray chip 12 to -8°C to -12°C. The other end is closely attached to the end of the water-cooling block 4 located outside the air chamber structure to transfer heat. In addition, the axes of the X-ray chip 12, the first through hole 21, the second through hole 141, the cooling block 3, and the water cooling block 4 coincide, making the overall structure compact and the space layout small.

[0038] like Figure 1 and Figures 5-6 As shown, the water-cooled block 4 has two first water circuit connectors 41 at the end furthest from the cooling block 3, and the other two sides of the water-cooled block 4 are designed with a toothed shape. The connection unit 7 is mounted on the second sealing plate 6 and includes a power socket 73 located on the second sealing plate 6 with one end extending into the air chamber structure, two second water circuit connectors 72, and two fiber optic connectors 71. One end of each of the two first water circuit connectors 41 is connected to the inlet and outlet of the water circuit pipe inside the water-cooled block 4. The ends of each of the two second water circuit connectors 72 located inside the air chamber structure are connected to the other ends of the two first water circuit connectors 41 via flexible hoses, and the ends located outside the air chamber structure are connected to the inlet and outlet of an external water chiller to form a circulating water circuit. The two fiber optic connectors 71 are connected to the first imaging circuit board 51 and the second imaging circuit board 52 respectively for image transmission. The power socket 73 is electrically connected to the first imaging circuit board 51 and the second imaging circuit board 52 for power supply. In addition, the fiber optic connector 71, the second water channel connector 72, and the power socket 73 all adopt an airtight structure to ensure the airtightness of the air chamber structure. The water-cooling block 4 is welded from copper material, and because copper has high thermal conductivity, it can improve the thermal conductivity of the water-cooling block 4.

[0039] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A gas chamber type X-ray camera for use in a vacuum environment, characterized in that: It includes an X-ray chip unit (1), a first sealing plate (2), a cooling block (3), an imaging circuit board unit (5), a second sealing plate (6), a connecting unit (7), a camera housing (8), and a water-cooled block (4) sealed and mounted on the first sealing plate (2); The first sealing plate (2) and the second sealing plate (6) are respectively sealed and installed at both ends of the camera housing (8); the first sealing plate (2), the water-cooling block (4), the second sealing plate (6) and the camera housing (8) form an air chamber structure; the X-ray chip unit (1) is installed on the outside of the first sealing plate (2); the first sealing plate (2) is provided with a first through hole (21); the cooling block (3) is located in the first through hole (21), and one end is tightly attached to the X-ray chip unit (1), and the other end is tightly attached to the end of the water-cooling block (4) located outside the air chamber structure; The imaging circuit board unit (5) is located inside the air chamber structure; the imaging circuit board unit (5) includes a first imaging circuit board (51), a second imaging circuit board (52), a first mounting plate (53), and a second mounting plate (54); the first mounting plate (53) and the second mounting plate (54) are respectively mounted close to the two opposite sides of the water-cooled block (4), and the length of the first mounting plate (53) and the second mounting plate (54) along the axial direction of the water-cooled block (4) is greater than the axial length of the water-cooled block (4); the first imaging circuit board (51) is mounted on the first mounting plate (53); the second imaging circuit board (52) is mounted on the second mounting plate (54); the X-ray chip unit (1) is electrically connected to the first imaging circuit board (51) and the second imaging circuit board (52) respectively; the connecting unit (7) is mounted on the second sealing plate (6), and the connecting unit (7) is electrically connected to the first imaging circuit board (51) and the second imaging circuit board (52) respectively, and connected to the internal water pipe of the water-cooled block (4).

2. The gas chamber type X-ray camera for vacuum environment according to claim 1, characterized in that: The heat-generating components on the first imaging circuit board (51) are located between the first imaging circuit board (51) and the first mounting plate (53), and correspond to the position of the water-cooling block (4); the heat-generating components on the second imaging circuit board (52) are located between the second imaging circuit board (52) and the second mounting plate (54), and correspond to the position of the water-cooling block (4); insulating thermally conductive pads (55) are provided between the gap between the first imaging circuit board (51) and the first mounting plate (53) and between the second imaging circuit board (52) and the second mounting plate (54).

3. The gas chamber type X-ray camera for vacuum environment according to claim 2, characterized in that: The water-cooled block (4) has two first water circuit connectors (41) at one end away from the cooling block (3), and the other two sides of the water-cooled block (4) are designed as serrated plates; the connection unit (7) includes a power socket (73) set on the second sealing plate (6) and one end extending into the air chamber structure, two second water circuit connectors (72) and two optical fiber connectors (71); the optical fiber connectors (71), the second water circuit connectors (72) and the power socket (73) all adopt an airtight structure; One end of each of the two first water circuit connectors (41) is connected to the inlet and outlet of the water circuit pipe inside the water-cooled block (4); one end of each of the two second water circuit connectors (72) located inside the air chamber structure is connected to the other end of each of the two first water circuit connectors (41), and the other end located outside the air chamber structure is connected to the inlet and outlet of the external water chiller, so as to form a circulating water circuit. The two fiber optic connectors (71) are respectively connected to the first imaging circuit board (51) and the second imaging circuit board (52) for transmitting images; the power socket (73) is electrically connected to the first imaging circuit board (51) and the second imaging circuit board (52) for supplying power.

4. The gas chamber type X-ray camera for a vacuum environment according to claim 1, 2, or 3, characterized in that: The X-ray chip unit (1) includes a chip mounting base (11), an X-ray chip (12), a chip circuit board (14), two pressure plates (13), and multiple chip support pillars (15); The X-ray chip (12) is mounted on the chip mounting base (11) by two pressure plates (13); the X-ray chip (12) is provided with a first pin (121) and is mounted on the chip circuit board (14) by the first pin (121); the chip mounting base (11) is mounted on the first sealing plate (2) through the chip support post (15) passing through the chip circuit board (14); the first sealing plate (2) is provided with a vacuum-sintered second pin (22); the chip circuit board (14) is mounted on the first sealing plate (2) and is electrically connected to the first imaging circuit board (51) and the second imaging circuit board (52) respectively by the second pin (22); the chip circuit board (14) is provided with a second through hole (141), one end of the cooling block (3) passes through the second through hole (141) and is closely attached to the X-ray chip (12) between the two pressure plates (13) to reduce the temperature of the X-ray chip (12) to -8℃ to -12℃.

5. The gas chamber type X-ray camera for vacuum environment according to claim 4, characterized in that: The first imaging circuit board (51), the second imaging circuit board (52), the first mounting plate (53) and the second mounting plate (54) are parallel to each other and have the same length along the axial direction of the water-cooled block (4).

6. The gas chamber type X-ray camera for vacuum environment according to claim 5, characterized in that: It also includes a first protective housing (9) installed on the outside of the first sealing plate (2) and a second protective housing (10) installed on the outside of the second sealing plate (6); The outer surfaces of the first protective housing (9) and the second protective housing (10) in the circumferential direction are flush with the outer surface of the camera housing (8).

7. The gas chamber type X-ray camera for vacuum environment according to claim 6, characterized in that: The water-cooled block (4), the first mounting plate (53) and the second mounting plate (54) are all made of copper.

8. The gas chamber type X-ray camera for a vacuum environment according to claim 7, characterized in that: A sealing ring is provided between the first sealing plate (2) and the camera housing (8), between the first sealing plate (2) and the water cooling block (4), and between the second sealing plate (6) and the camera housing (8).

9. The gas chamber type X-ray camera for a vacuum environment according to claim 8, characterized in that: The axes of the X-ray chip (12), the first through hole (21), the second through hole (141), the cooling block (3), and the water cooling block (4) are aligned.

Images