Apparatus for processing a substrate and method for processing a substrate

Abstract

An apparatus for processing a substrate and a method for processing a substrate are disclosed. The apparatus for processing a substrate includes a liquid processing chamber for liquid processing a substrate by supplying a processing liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a transfer unit for transferring the substrate between the liquid processing chamber and the drying chamber, and a backside cleaning unit for cleaning a backside of the substrate, wherein the backside cleaning unit can clean the backside of the substrate while the substrate is being transferred from the liquid processing chamber to the drying chamber.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean patent applications filed on December 24, 2021, with application number 10-2021-0186949, and on February 15, 2022, with application number 10-2022-0019254, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to an apparatus for processing a substrate, and more specifically, to a substrate processing apparatus and a substrate processing method for liquid processing of a substrate by supplying liquid to the substrate. Background Technology

[0004] Generally speaking, in order to manufacture semiconductor devices, various processes such as photolithography, etching, ion implantation, and deposition are performed.

[0005] During the various processes of semiconductor manufacturing, various foreign substances, such as particles, organic contaminants, and metallic impurities, are generated. These foreign substances can lead to defects in the substrate and act as factors directly affecting the performance and yield of semiconductor devices. Therefore, cleaning processes are performed before and after the semiconductor device manufacturing process to remove foreign substances remaining on the substrate.

[0006] The cleaning process includes using chemicals to remove foreign matter remaining on the substrate, using cleaning liquids such as deionized water (DIW) to remove chemicals remaining on the substrate, using organic solvents with a surface tension lower than that of the cleaning liquid to remove cleaning liquid remaining on the substrate, and drying organic solvent remaining on the surface of the substrate.

[0007] The various liquids used in the cleaning process are fluid. Therefore, a problem arises where the liquid supplied to the substrate separates from it during the substrate transfer for the drying step. Additionally, when excess liquid is supplied to the substrate to remove particles remaining on it, the liquid also separates from the substrate. This separated liquid remains in the chamber where the substrate transfer process or subsequent processes are performed, serving as a source of contamination for subsequent substrates. Summary of the Invention

[0008] This invention aims to provide a substrate processing device and a substrate processing method that can effectively clean substrates.

[0009] The present invention also aims to provide a substrate processing apparatus and substrate processing method that can effectively remove liquid residues on the rear surface of a substrate.

[0010] This invention also aims to provide a substrate processing apparatus and method that can effectively remove liquid residues on the rear surface of the substrate while transferring the substrate.

[0011] Other objects of the invention are not limited thereto, and other objects not mentioned above will become apparent to those skilled in the art from the following description.

[0012] An exemplary embodiment of the present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate includes a liquid processing chamber for liquid processing the substrate by supplying a processing liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a transfer unit for transferring the substrate between the liquid processing chamber and the drying chamber, and a rear surface cleaning unit for cleaning the rear surface of the substrate, wherein the rear surface cleaning unit can clean the rear surface of the substrate while transferring the substrate from the liquid processing chamber to the drying chamber.

[0013] According to an exemplary embodiment, the transfer unit may include a transfer robot that moves within a transfer frame for providing transfer space and has a transfer hand on which the substrate is placed.

[0014] According to an exemplary embodiment, the rear surface cleaning unit may include a contact member that contacts the rear surface of the substrate to remove processing liquid remaining on the rear surface of the substrate.

[0015] According to an exemplary embodiment, the contact member may be disposed on the transfer robot arm.

[0016] According to an exemplary embodiment, the contact member may be located below the transfer hand and come into contact with the rear surface of the substrate by the vertical movement of the transfer hand on which the substrate is placed.

[0017] According to an exemplary embodiment, a plurality of holes penetrating the upper and lower ends of the contact member can be formed in the contact member, and these holes can be spaced apart from each other along the longitudinal direction of the contact member.

[0018] According to an exemplary embodiment, a rear surface cleaning frame with a groove can be provided inside the transfer frame. The rear surface cleaning frame can be located between the liquid processing chamber and the transfer frame, and the contact member can be provided inside the rear surface cleaning frame, with the substrate placed on the groove.

[0019] According to an exemplary embodiment, during the process of transferring a substrate placed on a transfer hand to a rear surface cleaning frame, a contact member may be disposed at a position that contacts the rear surface of the substrate.

[0020] According to an exemplary embodiment, the rear surface cleaning unit may include a non-contact component spaced apart from the rear surface of the substrate, thereby removing the processing liquid remaining on the rear surface of the substrate in a non-contact manner.

[0021] According to an exemplary embodiment, a non-contact component can provide a decontamination source for removing processing liquid toward the rear surface of the substrate, and the decontamination source can be provided by heat or airflow.

[0022] According to an exemplary embodiment, a non-contact component may be mounted on a transfer robot arm.

[0023] According to an exemplary embodiment, a rear surface cleaning frame with a groove can be provided inside the transfer frame. The rear surface cleaning frame can be located between the liquid processing chamber and the transfer frame, and a non-contact component can be provided inside the rear surface cleaning frame, with the substrate placed on the groove.

[0024] According to an exemplary embodiment, the drying chamber may include a support for supporting a substrate, and the support may support the edge region of the rear surface of the liquid-treated substrate.

[0025] Another embodiment of the present invention provides a method for processing a substrate. The method for processing a substrate may include a liquid treatment step of supplying a processing liquid to the substrate, a transfer step of transferring the liquid-treated substrate, and a drying step of drying the substrate by supplying a process fluid to the liquid-treated substrate, wherein in the transfer step, processing liquid remaining on the rear surface of the substrate may be removed when transferring the liquid-treated substrate.

[0026] According to an exemplary embodiment, in the transfer step, the processing liquid remaining on the rear surface of the substrate can be removed by mutual contact between the liquid-treated substrate and the contact member (which contacts the rear surface of the substrate).

[0027] According to an exemplary embodiment, the transfer step can be performed by a transfer robot for transferring the liquid-treated substrate, and a contact member can be provided on the transfer robot to contact the rear surface of the substrate while the transfer robot is transferring the liquid-treated substrate.

[0028] According to an exemplary embodiment, a contact member may be disposed in a rear surface cleaning frame, which is disposed in a transfer space for transferring a liquid-treated substrate in a transfer step. The transfer step may include a first transfer step, a rear surface cleaning step, and a second transfer step after the rear surface cleaning step. In the first transfer step, a liquid-treated substrate that has undergone a liquid treatment step in a liquid treatment chamber in which a liquid treatment step is performed is transferred to the rear surface cleaning frame. In the rear surface cleaning step, the rear surface of the substrate is cleaned in the rear surface cleaning frame. In the second transfer step, the substrate is transferred to a drying chamber in which a drying step is performed.

[0029] According to an exemplary embodiment, in the transfer step, the processing liquid remaining on the rear surface of the liquid-treated substrate can be removed from the substrate in a non-contact manner by a non-contact component, the non-contact component being used to supply a decontamination source for removing the processing liquid toward the rear surface of the substrate.

[0030] According to an exemplary embodiment, a non-contact component may be disposed in a transfer manipulator for transferring a liquid-treated substrate in a transfer step, and / or in a rear surface cleaning frame disposed in a transfer space for transferring a liquid-treated substrate in a transfer step.

[0031] Another embodiment of the present invention provides an apparatus for processing a substrate. The apparatus may include a liquid processing chamber for liquid processing the substrate by supplying a processing liquid to the upper surface of the substrate, a drying chamber for drying the substrate by supplying a supercritical fluid to the substrate, a transfer unit for transferring the substrate between the liquid processing chamber and the drying chamber, and a rear surface cleaning unit for cleaning the rear surface of the substrate. The drying chamber may include a housing having an internal space and a support unit for the edge region of the rear surface of the substrate that has been liquid-processed in the supporting internal space. The rear surface cleaning unit may remove processing liquid remaining on the rear surface of the substrate by cleaning the rear surface of the substrate using contact and / or non-contact methods while the substrate is being transferred from the liquid processing chamber to the drying chamber.

[0032] According to an exemplary embodiment of the present invention, it is possible to effectively clean the substrate.

[0033] Furthermore, according to an exemplary embodiment of the present invention, it is possible to effectively remove liquid residues on the rear surface of the substrate.

[0034] Furthermore, according to an exemplary embodiment of the present invention, it is possible to effectively remove liquid remaining on the rear surface of the substrate while transferring the substrate.

[0035] The effects of the present invention are not limited to those described above. Those skilled in the art will clearly understand any effects not mentioned from this specification and the accompanying drawings. Attached Figure Description

[0036] Figure 1 This is a schematic diagram illustrating an exemplary embodiment of the substrate processing apparatus of the present invention.

[0037] Figure 2 It is a schematic diagram. Figure 1 A schematic diagram of an exemplary embodiment of a liquid handling chamber.

[0038] Figure 3 It is a schematic diagram. Figure 1A schematic diagram of an exemplary embodiment of the drying chamber.

[0039] Figure 4 It is a schematic diagram. Figure 1 A perspective view of the transfer unit and the subsequent surface cleaning unit.

[0040] Figures 5 to 7 It is a schematic diagram. Figure 4 A perspective view of another embodiment of the rear surface cleaning unit.

[0041] Figure 8 This is a flowchart of a substrate processing method according to an exemplary embodiment of the present invention.

[0042] Figure 9 It is a schematic diagram based on Figure 8 A schematic diagram of the state of the substrate being processed in the liquid processing step of an exemplary embodiment.

[0043] Figure 10 and Figure 11 It is based on the sequential diagram. Figure 8 A schematic diagram of an exemplary embodiment of the substrate being liquid-treated in the transfer step, located at the post-surface cleaning position.

[0044] Figures 12 to 13 It is based on the sequential diagram. Figure 8 A schematic diagram of the substrate in the drying step of an exemplary embodiment.

[0045] Figure 14 It is a schematic diagram. Figure 4 A perspective view of another embodiment of the rear surface cleaning unit.

[0046] Figure 15 This is a schematic diagram when viewed from the top. Figure 14 A schematic diagram of an exemplary embodiment of the rear surface cleaning unit.

[0047] Figure 16 The diagram is based on the view from the front. Figure 14 A schematic diagram of the state of the rear surface of the substrate being cleaned by the rear surface cleaning unit of an exemplary embodiment.

[0048] Figure 17 It is a schematic diagram. Figure 1 A schematic diagram of another embodiment of the substrate processing equipment.

[0049] Figure 18 It is a schematic diagram. Figure 17 A perspective view of an exemplary embodiment of the rear surface cleaning frame.

[0050] Figure 19This is a flowchart of a substrate processing method according to another embodiment of the present invention.

[0051] Figure 20 The diagram is based on Figure 19 A schematic diagram of the state of the rear surface of the substrate after cleaning in the rear surface cleaning step of an exemplary embodiment.

[0052] [Symbol Explanation]

[0053] 1: Substrate processing equipment; 2: First direction; 4: Second direction; 6: Third direction

[0054] 10: Index module; 20: Processing module; 30: Controller; 120: Load port

[0055] 140: Index frame; 142: Index track; 144: Index robot; 146: Index hand.

[0056] 220: Buffer unit; 240: Transfer frame; 240a: First transfer frame

[0057] 240b: Second transfer frame; 242: Exhaust component; 300: Liquid handling chamber

[0058] 310: Shell; 320: Processing container; 321: Guide wall; 323: First recovery tank

[0059] 323a: First inlet; 323b: First outlet; 323c: Recycling line; 325: Second recycling tank.

[0060] 325a: Second inlet; 325b: Second outlet; 325c: Recycling line; 327: Third recycling tank.

[0061] 327a: Third inlet; 327b: Third outlet; 327c: Recycling line; 330: Support unit.

[0062] 331: Rotary chuck; 333: Support pin; 335: Chuck pin; 337: Rotary shaft

[0063] 339: Driver; 340: Liquid supply unit; 341: Support rod; 342: Arm

[0064] 343: Driver; 344: Liquid supply nozzle; 350: Lifting unit

[0065] 360: Airflow supply unit; 370: Exhaust unit; 400: Drying chamber; 401: Internal space; 410: Shell; 412: First main body; 414: Second main body; 416: Lifting component

[0066] 417: Lifting cylinder; 418: Lifting rod; 419: Heater; 430: Support; 432: Fixing rod; 434: Holder; 450: Fluid supply unit; 451: Main supply line; 452: First branch line; 453: First valve; 454: Second branch line; 455: Second valve; 460: Exhaust line

[0067] 470: Baffle plate; 472: Support component; 500: Transfer unit; 520: Guide rail

[0068] 540: Transfer robot arm; 541: Transfer hand; 541a: Pad; 542: Connector

[0069] 543: Hand actuator; 544: Rotary actuator; 545: Vertical actuator

[0070] 546: Horizontal driver; 547: Extender; 600: Rear surface cleaning unit.

[0071] 620: Contact component; 622: Guide hole; 624: First part; 626: Second part

[0072] 628: Contact pin; 640: Non-contact component; 700: Rear surface cleaning frame; 720: Partition.

[0073] 740: Spare tank; 760: Vent port; F: Container; S10: Liquid handling steps

[0074] S20: Transfer step; S22: First transfer step; S24: Post-surface cleaning step

[0075] S26: Second transfer step; S30: Drying step; W: Substrate Detailed Implementation

[0076] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. Various modifications to the exemplary embodiments of the invention are possible, and the scope of the invention should not be construed as being limited to the following exemplary embodiments. These exemplary embodiments are provided to provide a more comprehensive explanation of the invention to those skilled in the art. Therefore, the shapes of components and the like in the drawings are exaggerated for clarity of description.

[0077] Terms such as "first" and "second" are used to describe various component parts, but the component parts are not limited by these terms. These terms are only used to distinguish one component part from another. For example, without departing from the scope of the invention, a first component part may be named a second component part, and similarly, a second component part may be named a first component part.

[0078] In an exemplary embodiment, a process for liquid treatment of substrate W by supplying a liquid, such as a cleaning liquid, onto substrate W will be described as an example. However, this embodiment is not limited to a cleaning process and can be adapted to various processes for liquid treatment of substrate W, such as etching, ashing, or developing processes.

[0079] The following will be referenced Figures 1 to 20 Exemplary embodiments of the present invention are described in detail below. An exemplary substrate processing apparatus 1 according to the present invention can perform a cleaning process, including a drying process of drying a substrate W using a process fluid.

[0080] Figure 1 This is a schematic plan view of a substrate processing apparatus according to an exemplary embodiment of the present invention. (Reference) Figure 1 The substrate processing apparatus 1 includes an indexing module 10 and a processing module 20. According to an exemplary embodiment, the indexing module 10 and the processing module 20 are arranged in one direction. Hereinafter, the arrangement direction of the indexing module 10 and the processing module 20 is referred to as the first direction 2. When viewed from above, the direction perpendicular to the first direction 2 is referred to as the second direction 4, and the direction perpendicular to the plane including the first direction 2 and the second direction 4 is referred to as the third direction 6.

[0081] The indexing module 10 transfers the substrate W from the container F containing the substrate W to the processing module 20 for processing the substrate W. The indexing module 10 holds the substrate W, which has already been processed in the processing module 20, in the container F. The longitudinal direction of the indexing module 10 is set to the second direction 4. The indexing module 10 has a loading port 120 and an index frame 140.

[0082] A container F containing the substrate W is placed on the loading port 120. The loading port 120 is located on an opposite side of the index-based frame 140 of the processing module 20. Multiple loading ports 120 can be provided. The multiple loading ports 120 can be arranged in a straight line along the second direction 4. The number of loading ports 120 can be increased or decreased depending on the process efficiency and floor space requirements of the processing module 20.

[0083] Multiple slots (not shown) are formed in container F. These slots (not shown) can accommodate substrate W while it is horizontally positioned on the ground. A sealed container such as a front-opening unified pod (FOUP) can be used as container F. Container F can be placed on loading port 120 by means of a transport component (not shown) such as an overhead conveyor, overhead transport vehicle, or automated guided vehicle, or by an operator.

[0084] Index track 142 and indexing robot 144 are disposed inside index frame 140. Index track 142 is disposed in index frame 140 along a second direction 4, which is its longitudinal direction. Indexing robot 144 can transfer substrate W. Indexing robot 144 can transfer substrate W between index module 10 and buffer unit 220 described below.

[0085] The indexing robot 144 may include an indexing hand 146. A base plate W may be placed on the indexing hand 146. The indexing hand 146 may be configured to move along a second direction 4 on an index track 142. Therefore, the indexing hand 146 can move forward and backward along the index track 142. Furthermore, the indexing hand 146 may be configured to rotate in a third direction 6, which serves as an axis. Additionally, the indexing hand 146 may be configured to move vertically in the third direction 6. Multiple indexing hands 146 may be provided. The multiple indexing hands 146 may be spaced apart from each other in the vertical direction. The multiple indexing hands 146 may move forward, backward, and rotate independently.

[0086] The controller 30 controls the substrate processing apparatus 1. The controller 30 may include a process controller consisting of a microcontroller (computer) that performs control of the substrate processing apparatus 1; a user interface consisting of a keyboard for performing command input operations and the like to manage the substrate processing apparatus 1 by an operator, or a display for visualizing and displaying the movement of the substrate processing apparatus 1; and a memory unit storing a control process program for performing the processing. The processing is performed in the substrate processing apparatus 1 under the control of the process controller or program, i.e., a recipe for performing the processing in various configuration units according to various data and processing conditions. Furthermore, the user interface and the memory unit may be connected to the process controller. The processing recipe may be stored in a storage medium in the memory unit, and the storage medium may be a hard disk, a portable disc such as a CD-ROM or DVD, or semiconductor memory such as flash memory.

[0087] The controller 30 can control the substrate processing equipment 1 to perform the substrate processing method described below. For example, the controller 30 can perform the substrate processing method by controlling the components provided to the transfer unit 500 and the post-surface cleaning unit 600.

[0088] The processing module 20 includes a buffer unit 220, a transfer frame 240, a liquid processing chamber 300, a drying chamber 400, a transfer unit 500, and a rear surface cleaning unit 600. The buffer unit 220 provides a buffer space in which the substrate W brought into and taken out of the processing module 20 temporarily rests. The transfer frame 240 provides a transfer space for transferring the substrate W between the buffer unit 220, the liquid processing chamber 300, and the drying chamber 400. Furthermore, the transfer frame 240 provides a rear surface cleaning space for cleaning the rear surface of the substrate W while it is being transferred from the liquid processing chamber 300 to the drying chamber 400 after being liquid-treated in the liquid processing chamber 300.

[0089] The liquid processing chamber 300 and the drying chamber 400 can perform a cleaning process. The cleaning process can be performed sequentially in the liquid processing chamber 300 and the drying chamber 400. The liquid processing chamber 300 performs a liquid processing process on the liquid-treated substrate W by supplying liquid to the substrate W. In the liquid processing chamber 300, a processing liquid can be supplied to the substrate W. For example, the processing liquid can be at least one of chemicals, rinsing liquids, and organic solvents. The drying chamber 400 can perform a drying process to dry the liquid residue on the substrate W. For example, the drying chamber 400 can perform a drying process using supercritical fluid to dry the liquid residue on the substrate W.

[0090] A buffer unit 220 may be arranged between the index frame 140 and the transfer frame 240. The buffer unit 220 may be positioned at one end of the transfer frame 240. A groove (not shown) is provided inside the buffer unit 220 for placing the substrate W. Multiple grooves (not shown) are provided. The multiple grooves (not shown) are spaced apart from each other along a third direction 6. The buffer unit 220 has an open front and a back. The front may be the side facing the index module 10, and the back may be the side facing the transfer frame 240. The indexing robot 144 approaches the buffer unit 220 via the front, and the transfer robot 540 approaches the buffer unit via the back.

[0091] The transfer frame 240 has a transfer space for transferring the substrate W therein. The transfer frame 240 may have a transfer space for transferring the substrate W between the buffer unit 220, the liquid handling chamber 300, and the drying chamber 400. The transfer unit 500 described below may be arranged in the transfer space. For example, the guide rail 520 and the transfer robot 540 described below may be arranged in the transfer space.

[0092] A fan filter unit (not shown) may be disposed on the upper surface of the transfer space of the transfer frame 240 to form a downward airflow entering the transfer space. The fan filter unit (not shown) may include a fan and a filter. The fan filter unit (not shown) supplies outside air into the transfer space. The filter removes impurities contained in the air.

[0093] Exhaust member 242 may be disposed on the lower surface of the transfer space of transfer frame 240. Multiple exhaust members 242 may be disposed. Exhaust member 242 may create negative pressure in transfer space. Exhaust member 242 may discharge various particles and byproducts generated in transfer space to the outside of transfer space. Therefore, particles and similar substances present in transfer space may be discharged to the outside of transfer space via exhaust member 242 together with the downward airflow of transfer space formed by fan filter unit (not shown).

[0094] The longitudinal direction of the transfer frame 240 can be arranged in the first direction 2. The liquid handling chamber 300 and the drying chamber 400 can be arranged on both sides of the transfer frame 240. The liquid handling chamber 300 and the drying chamber 400 can be arranged on the side portion of the transfer frame 240. The transfer frame 240 and the liquid handling chamber 300 can be arranged along the second direction 4. Furthermore, the transfer frame 240 and the drying chamber 400 can be arranged along the second direction 4.

[0095] According to one embodiment, liquid processing chambers 300 are arranged on both sides of transfer frame 240, and drying chambers 400 are also arranged on both sides of transfer frame 240. Liquid processing chambers 300 may be arranged relatively closer to buffer unit 220 than drying chambers 400. Liquid processing chambers 300 may be arranged on one side of transfer frame 240 in an A x B matrix (where A and B are both natural numbers of 1 or greater than 1) along a first direction 2 and a third direction 6, respectively. Here, A represents the number of liquid processing chambers 300 arranged in a straight line along the first direction 2, and B represents the number of liquid processing chambers 300 arranged in a straight line along the third direction 6. For example, when four liquid processing chambers 300 are arranged on one side of transfer frame 240, the liquid processing chambers may be arranged in a 2 x 2 matrix. The number of liquid processing chambers 300 may be increased or decreased. Unlike the above, the liquid processing chamber 300 may be disposed on only one side of the transfer frame 240, and only the drying chamber 400 may be disposed on the opposite side facing the first side. Furthermore, the liquid processing chamber 300 and the drying chamber 400 may be disposed in a single layer on one and both sides of the transfer frame 240.

[0096] Liquid processing chamber 300 performs liquid processing processes on substrate W. For example, liquid processing chamber 300 may be a chamber that performs a cleaning process to remove process byproducts adhering to substrate W. Depending on the type of process used to process substrate W, liquid processing chamber 300 may have different structures. Alternatively, each of the liquid processing chambers 300 may have the same structure as the others.

[0097] Figure 2 It is a schematic diagram. Figure 1 A schematic diagram of an exemplary embodiment of a liquid handling chamber. (Reference) Figure 2 The liquid handling chamber 300 may include a housing 310, a handling container 320, a support unit 330, and a liquid supply unit 340.

[0098] The housing 310 has an internal space. The housing 310 is configured in a generally rectangular parallelepiped shape. An opening (not shown) is formed in one side of the housing 310. The opening (not shown) serves as an inlet through which the substrate W is brought into or out of the internal space of the housing 310 by the transfer robot 540 described below. The processing container 320, the support unit 330, and the liquid supply unit 340 are arranged in the internal space of the housing 310.

[0099] The processing container 320 has a processing space with an open upper portion. The processing container 320 may be a bowl with a processing space. The processing container 320 may be configured to surround the processing space. The processing space of the processing container 320 may be configured as a space in which the support unit 330 supports and rotates the substrate W. The processing container is configured as a space in which the liquid supply unit 340 supplies liquid to the substrate W to process the substrate W.

[0100] According to an embodiment, the processing container 320 may have a guide wall 321 and a plurality of recovery tanks (323, 325, and 327). Each recovery tank (323, 325, and 327) separates and collects different liquids from the liquid used to process the substrate W. The recovery tanks (323, 325, and 327) have recovery spaces for recovering the liquid used to process the substrate W.

[0101] The guide wall 321 and the recovery tanks (323, 325, and 327) are arranged in an annular shape around the support unit 330. When liquid is supplied to the substrate W, the liquid scattered by the rotation of the substrate W can be introduced into the recovery space through the following inlets (323a, 325a, and 327a) of each recovery tank (323, 325, and 327). Different types of liquids can be introduced into each recovery tank (323, 325, and 327).

[0102] The processing container 320 has a guide wall 321, a first recycling tank 323, a second recycling tank 325, and a third recycling tank 327. The guide wall 321 is arranged in an annular shape around the support unit 330. The first recycling tank 323 is arranged in an annular shape around the guide wall 321. The second recycling tank 325 is arranged in an annular shape around the first recycling tank 323. The third recycling tank 327 is arranged in an annular shape around the second recycling tank 325.

[0103] The space between the guide wall 321 and the first recovery tank 323 serves as a first inlet 323a through which liquid is introduced. The space between the first recovery tank 323 and the second recovery tank 325 serves as a second inlet 325a through which liquid is introduced. The space between the second recovery tank 325 and the third recovery tank 327 serves as a third inlet 327a through which liquid is introduced. The second inlet 325a may be located above the first inlet 323a, and the third inlet 327a may be located above the second inlet 325a. The liquid introduced into the first inlet 323a, the liquid introduced into the second inlet 325a, and the liquid introduced into the third inlet 327a may be of different types.

[0104] The space between the lower end of the guide wall 321 and the first recovery tank 323 serves as the first outlet 323b, through which the flue gas and gas flow generated from the liquid are discharged. The space between the lower end of the first recovery tank 323 and the second recovery tank 325 serves as the second outlet 325b, through which the flue gas and gas flow generated from the liquid are discharged. The space between the lower end of the second recovery tank 325 and the third recovery tank 327 serves as the third outlet 327b, through which the flue gas and gas flow generated from the liquid are discharged. The flue gas and gas flow discharged from the first outlet 323b, the second outlet 325b, and the third outlet 327b are discharged to the outside of the liquid processing chamber 300 via the exhaust unit 370.

[0105] Vertically downward-extending recovery lines 323c, 325c, and 327c connect to the bottom surfaces of the respective recovery tanks (323, 325, and 327). Each recovery line 323c, 325c, and 327c discharges the liquid introduced through the respective recovery tanks (323, 325, and 327). The discharged treated liquid can be reused via an external liquid recycling system (not shown).

[0106] The support unit 330 can support and rotate the substrate W in the processing space. The support unit 330 may include a rotary chuck 331, a support pin 333, a chuck pin 335, a rotation shaft 337, and a driver 339.

[0107] When viewed from above, the rotary chuck 331 has an upper surface that is configured in a generally circular shape. The upper surface of the rotary chuck 331 may have a diameter greater than that of the substrate W.

[0108] Multiple support pins 333 are provided. The support pins 333 are arranged on the upper surface of the rotary chuck 331. The support pins 333 are arranged at regular intervals on the edge portion of the upper surface of the rotary chuck 331. The support pins 333 are arranged to protrude upwards from the upper surface of the rotary chuck 331. The support pins 333 are arranged in a ring shape by combining with each other. The support pins 333 support the edge region of the rear surface of the substrate W, such that the substrate W is spaced apart from the upper surface of the rotary chuck 331 by a predetermined distance.

[0109] Multiple chuck pins 335 are provided. The chuck pins 335 are arranged relatively away from the center of the rotary chuck 331 compared to the support pins 333. The chuck pins 335 are arranged to project upwards from the upper surface of the rotary chuck 331. When the substrate W is rotated, the chuck pins 335 support the side portion of the substrate W, thus preventing deviation from their original position in the lateral direction. The chuck pins 335 are configured to move linearly between a standby position and a supported position along the radial direction of the rotary chuck 331. The standby position is defined as the position of the chuck pins 335 when the substrate W is received from the transfer robot 540 or when the substrate W is transferred to the transfer robot 540. The supported position is defined as the position of the chuck pins 335 when a process is performed on the substrate W. In the supported position, the chuck pins 335 are in contact with the side portion of the substrate W. The standby position is set relatively away from the center of the rotary chuck 331 compared to the supported position.

[0110] A rotating shaft 337 is coupled to a rotating chuck 331. The rotating shaft 337 is coupled to the lower surface of the rotating chuck. The rotating shaft 337 can be configured such that its longitudinal direction faces the third direction 6. The rotating shaft 337 is configured to be rotatable by receiving power from a driver 339. The rotating shaft is rotated by the driver 339, and the rotating chuck 331 rotates via the rotating shaft 337. The driver 339 rotates the rotating shaft 337. The driver 339 can change the rotational speed of the rotating shaft 337. The driver 339 can be a motor for providing driving force. However, the invention is not limited thereto, and various modifications can be made to known devices for providing driving force.

[0111] Liquid supply unit 340 supplies liquid to substrate W. Liquid supply unit 340 supplies processing liquid to substrate W supported by support unit 330. The processing liquid supplied to the substrate by liquid supply unit 340 can be of various types. According to an embodiment, the processing liquid can be at least one of chemicals, rinsing liquid, and organic solvent.

[0112] The liquid supply unit 340 may include a support rod 341, an arm 342, an actuator 343, and a liquid supply nozzle 344. The support rod 341 is located within the interior space of the housing 310. The support rod 341 may be located on one side of the processing container 320 within the interior space. The support rod 341 may be rod-shaped, such that its longitudinal direction faces the third direction 6.

[0113] Arm 342 is coupled to the upper end of support rod 341. Arm 342 extends vertically from the longitudinal direction of support rod 341. The longitudinal direction of arm 342 may be formed in a third direction 6. The liquid supply nozzle 344 described below may be fixedly coupled to one end of arm 342.

[0114] Arm 342 can be configured to move forward and backward in the longitudinal direction. Arm 342 can be oscillatingly moved via support rod 341 by rotating support rod 341 via drive 343. By rotating arm 342, liquid supply nozzle 344 can also oscillate between process position and standby position.

[0115] The process position can be the position where the liquid supply nozzle 344 faces the substrate W supported by the support unit 330. According to an embodiment, the process position can be the position where the center of the liquid supply nozzle 344 faces the center of the substrate W supported by the support unit 330. The standby position can be a position where the liquid supply nozzle 344 is outside the process position.

[0116] A driver 343 is coupled to a support rod 341. The driver 343 may be disposed on the bottom surface of the housing 310. The driver 343 provides driving force for rotating the support rod 341. The driver 343 may be configured as a motor for providing driving force.

[0117] Liquid supply unit 340 supplies liquid to substrate W. Liquid supply unit 340 can supply processing liquid to substrate W supported by support unit 330. For example, the processing liquid can be a liquid used to remove film or foreign matter remaining on substrate W. According to an embodiment, the first liquid can be a chemical containing acid or base, such as sulfuric acid (H2SO4), nitric acid (HNO3), or hydrochloric acid (HCl). In addition, the processing liquid can be a liquid that is readily soluble in supercritical fluid used in the drying chamber 400 described below. According to an embodiment, the processing liquid according to an exemplary embodiment can be any of pure water and alcohol such as isopropanol (IPA).

[0118] The liquid supply nozzle 344 according to the exemplary embodiment of the present invention described above is provided in a single form as an example, but is not limited thereto. For example, multiple liquid supply nozzles 344 may be provided, and each liquid supply nozzle 344 may supply different processing liquids to the substrate W. According to an embodiment, each of the liquid supply nozzles 344 may independently supply chemicals, pure water, and isopropanol to the substrate W, and the chemicals, pure water, and isopropanol may be supplied to the substrate W in sequence.

[0119] Furthermore, all of the plurality of liquid supply nozzles 344 can be coupled to the arm 342. Optionally, each of the plurality of liquid supply nozzles 344 may independently have an arm, a support rod, and an actuator, and independently swing and move forward and backward to move between a process position and a standby position.

[0120] A lifting unit 350 is arranged within the internal space of the housing 310. The lifting unit 350 controls the relative height between the processing container 320 and the support unit 330. The lifting unit 350 linearly moves the processing container 320 in a third direction 6. As a result, since the height of the recovery tanks (323, 325, and 327) for recovering liquid changes according to the type of liquid supplied to the substrate W, the liquid can be recovered separately. Unlike the above, where the processing container 320 is fixedly installed, the lifting unit 350 moves the support unit 330 up and down to change the relative height between the support unit 330 and the processing container 320.

[0121] Airflow supply unit 360 supplies airflow to the interior space of housing 310. Airflow supply unit 360 can supply downflow to the interior space. Airflow supply unit 360 can be configured as a fan filter unit. Airflow supply unit 360 can be mounted on housing 310. The gas supplied to the interior space of housing 310 via airflow supply unit 360 forms downflow in the interior space. Byproducts and similar substances generated in the processing space during the process are discharged to the outside of housing 310 via exhaust unit 370 through the downflow formed in the interior space and processing space.

[0122] Exhaust unit 370 discharges process byproducts, such as fumes and gases, generated in the processing space. Process byproducts (such as fumes and gases) generated during liquid processing of substrate W are discharged through a pressure-reducing unit (not shown) disposed in exhaust unit 370. Exhaust unit 370 may be coupled to the bottom surface of processing container 320. For example, exhaust unit 370 may be arranged in the space between rotating shaft 337 and the inner wall of processing container 320.

[0123] The drying chamber 400 uses a process fluid to remove residual liquid from the substrate W. According to an exemplary embodiment, the drying chamber 400 uses a supercritical fluid to remove residual processing liquid from the substrate W. In the drying chamber 400, supercritical processes are performed using the properties of the supercritical fluid. Representative embodiments include supercritical drying processes and supercritical etching processes. The supercritical process will be described below based on the supercritical drying process. However, since this is only for ease of description, the drying chamber 400 may perform other supercritical processes besides supercritical drying. According to an exemplary embodiment, supercritical carbon dioxide (scCO2) can be used as the supercritical fluid.

[0124] Figure 3 It is a schematic diagram. Figure 1 A schematic diagram of an exemplary embodiment of a drying chamber. (Reference) Figure 3 The drying chamber 400 may include a housing 410, a support 430, a fluid supply unit 450, an exhaust line 460, and a baffle plate 470. The housing 410 provides an internal space 401 in which the drying process is performed on the substrate W. The housing 410 may include a first body 412, a second body 414, and a lifting member 416.

[0125] The first body 412 and the second body 414 are combined to provide an interior space 401. The first body 412 can be positioned on top of the second body 414. The position of the first body 412 is fixed, while the second body 414 can be lifted by the lifting member 416.

[0126] When the second body 414 descends and separates from the first body 412, the internal space 401 opens. When the internal space 401 is open, the substrate W can be brought into or taken out of the internal space 401. The substrate W brought into the internal space 401 may be a substrate W that has been liquid-treated in the liquid treatment chamber 300. According to an exemplary embodiment, the treatment liquid may remain on the upper surface of the substrate W brought into the internal space 401.

[0127] When the second body 414 rises and comes into close contact with the first body 412, the internal space 401 closes. When the internal space 401 is closed, a drying process can be performed on the substrate W by supplying processing fluid.

[0128] Lifting member 416 lifts the second body 414. Lifting member 416 may include lifting cylinder 417 and lifting rod 418. Lifting cylinder 417 may be coupled to the second body 414. Lifting cylinder 417 overcomes the critical pressure or higher pressure of the internal space 401 while performing the drying process on the substrate W, and can seal the internal space 401 by bringing the first body 412 into contact with the second body 414.

[0129] The lifting rod 418 generates a lifting force in the vertical direction. For example, the lifting rod 418 can generate a force for movement in a third direction 6. The longitudinal direction of the lifting rod 418 can be formed in the vertical direction. One end of the lifting rod 418 can be inserted into the lifting cylinder 417. The other end of the lifting rod 418 can be coupled to the first body 412. The second body 414 can be moved in the vertical direction by the relative lifting motion between the lifting cylinder 417 and the lifting rod 418. When the second body 414 moves in the vertical direction, the lifting rod 418 prevents the first body 412 and the second body 414 from moving in the horizontal direction. The lifting rod 418 guides the vertical movement direction of the second body 414. The lifting rod 418 can prevent the first body 412 and the second body 414 from deviating from their original positions.

[0130] According to the embodiments of the present invention described above, the second body 414 is moved in the vertical direction to seal the internal space 401, but this is not a limitation. For example, the first body 412 and the second body 414 may each move in the vertical direction. Furthermore, the first body 412 may move in the vertical direction, while the position of the second body 414 may be fixed.

[0131] Unlike the embodiments described above, a single housing 410 may be provided with an opening (not shown), through which the substrate W is brought into and out of one side of the housing 410. A door (not shown) may be provided in the housing 410. The door (not shown) may be movable in the vertical direction to open and close the opening (not shown) and keep the housing 410 in a sealed state.

[0132] A heater 419 may be disposed within the housing 410. According to an embodiment, the heater 419 may be embedded within the wall of at least one of the first body 412 and the second body 414. The heater 419 may heat the process fluid supplied to the internal space 401 to a critical temperature or higher to maintain the heated process fluid in a supercritical fluid phase, or to heat the process fluid to return it to a supercritical fluid phase when the process fluid is liquefied.

[0133] The support member 430 supports the base plate W within the internal space 401. The support member 430 can be fixedly disposed on the lower surface of the first body 412. The support member 430 may have a fixing rod 432 and a retainer 434.

[0134] A fixing rod 432 is fixedly disposed to the first body 412, thereby protruding downward from the bottom surface of the first body 412. The longitudinal direction of the fixing rod 432 is disposed in the vertical direction. Multiple fixing rods 432 may be disposed. The multiple fixing rods 432 are spaced apart from each other. When the substrate W is brought into or out of the space surrounded by the multiple fixing rods 432, the multiple fixing rods 432 are arranged in a position that will not interfere with the substrate W. A retainer 434 is coupled to each of the fixing rods 432.

[0135] The retainer 434 extends from the fixing rod 432. The retainer 434 may extend from the lower end of the fixing rod 432 toward the space surrounded by the fixing rod 432. The retainer 436 supports the edge region of the rear surface of the substrate W. According to an embodiment, the rear surface of the substrate W may be an unpatterned surface, while the upper surface of the substrate W may be a patterned surface. Due to the above structure, the edge region of the substrate W brought into the internal space 401 can be placed on the retainer 434. Furthermore, the entire upper surface region of the substrate W, the central region of the lower surface of the substrate W, and a portion of the edge region of the lower surface of the substrate W can be exposed to the process fluid supplied to the internal space 401.

[0136] The fluid supply unit 450 supplies process fluid to the internal space 401. According to an embodiment, the process fluid can be supplied to the internal space 401 in a supercritical state. However, the invention is not limited thereto; the process fluid can be supplied to the internal space 401 in a gaseous state and undergo a phase change to a supercritical state within the internal space 401. The fluid supply unit 450 may have a main supply line 451, a first branch line 452, and a second branch line 454.

[0137] One end of the main supply line 451 is connected to a supply source (not shown) in which process fluid is stored. The other end of the main supply line 451 branches into a first branch line 452 and a second branch line 454. The first branch line 452 is connected to the upper surface of the housing 410. According to an embodiment, the first branch line 452 may be connected to a first body 412. For example, the first branch line 452 may be coupled to the center of the first body 412. The first branch line 452 may be located in the upper central region of the substrate W placed on the support 430. A first valve 453 may be installed in the first branch line 452. The first valve 453 may be configured as an on / off valve. Process fluid may be selectively supplied to the internal space 401 according to the opening and closing of the first valve 453.

[0138] The second branch line 454 is connected to the lower surface of the housing 410. According to an embodiment, the second branch line 454 may be connected to the second body 414. For example, the second branch line 454 may be coupled to the center of the second body 414. The second branch line 454 may be positioned vertically downward from the central region of the substrate W placed on the support 430. A second valve 455 may be disposed in the second branch line 454. The second valve 455 may be configured as an on / off valve. Process fluid may be selectively supplied to the internal space 401 according to the opening and closing of the second valve 455.

[0139] Exhaust unit 370 can exhaust the atmosphere from the interior space 401. Exhaust line 460 can be coupled to the second body 414. According to an embodiment, when viewed from above, exhaust line 460 can be displaced from the center of the lower surface of the second body 414. Supercritical fluid flowing in the interior space 401 is discharged to the outside of the housing 410 via exhaust line 460.

[0140] A baffle plate 470 is disposed within the internal space 401. The baffle plate 470 may be configured to overlap with the outlet of the second branch line 454 and the inlet of the exhaust line 460 when viewed from above. The baffle plate 470 can prevent damage to the substrate W by directly discharging the process fluid supplied via the second branch line 454 toward the substrate W.

[0141] The baffle plate 470 may be spaced apart from the bottom surface of the housing 410 at a predetermined distance from the top. For example, the baffle plate 470 may be supported by a support member 472 to be spaced apart from the lower surface of the housing 410 in the upward direction. The support member 472 may be provided in a rod-like form. Multiple support members 472 may be provided. The multiple support members 472 are spaced apart from each other at a predetermined distance.

[0142] Figure 4 It is a schematic diagram. Figure 1 A perspective view of an exemplary embodiment of the transfer unit and the post-surface cleaning unit. Reference will be made below. Figure 4 The transfer unit and cleaning unit according to exemplary embodiments of the present invention are described in detail.

[0143] The transfer unit 500 is disposed in the transfer space inside the transfer frame 240. The transfer unit 500 can transfer the substrate W in the transfer space. The transfer unit 500 can transfer the substrate W between the buffer unit 220, the liquid processing chamber 300, and the drying chamber 400. For example, the transfer unit 500 can transfer the substrate W from the buffer unit 220 to the liquid processing chamber 300, and transfer the liquid-treated substrate W from the liquid processing chamber 300 to the drying chamber 400.

[0144] The transfer unit 500 includes a guide rail 520 and a transfer robot 540. The guide rail 520 is disposed in the transfer space of the transfer frame 240. For example, the guide rail 520 may be disposed on the lower surface of the transfer frame 240. The guide rail 520 may be disposed parallel to the longitudinal direction of the transfer frame 240. For example, the longitudinal direction of the guide rail 520 may be formed in a direction toward the second direction 4. The transfer robot 540 is disposed on the guide rail 520 and moves linearly along the longitudinal direction of the guide rail 520.

[0145] A transfer robot 540 transfers a substrate W. The transfer robot 540 may include a transfer hand 541, a hand actuator 543, a rotary actuator 544, a vertical actuator 545, a horizontal actuator 546, and an extender 547. The hand actuator 543, rotary actuator 544, vertical actuator 545, and horizontal actuator 546, according to an exemplary embodiment of the invention, can be provided using known motors that transmit electricity.

[0146] A transfer hand 541 supports a substrate W. A pad 541a may be provided on the upper surface of the transfer hand 541. The pad 541a supports the lower surface of the substrate W. Multiple pads 541a may be provided. According to an exemplary embodiment, three pads 541a may be provided to support the lower surface of the substrate W at three points.

[0147] Multiple transfer handles 541 can be provided. The number of transfer handles 541 can be increased or decreased according to process requirements, etc. The multiple transfer handles 541 can be spaced apart from each other in the vertical direction. The multiple transfer handles 541 can move forward, backward and rotate independently. For example, when multiple transfer handles 541 are provided, some of the transfer handles 541 can be used to transfer the substrate W from the buffer unit 220 to the liquid processing chamber 300, and some of the transfer handles 541 can be used to transfer the substrate W that has been liquid-treated in the liquid processing chamber 300 to the drying chamber 400.

[0148] The transfer hand 541 can be coupled to the connector 542. The connector 542 can be disposed in the hand actuator 543 described below. For example, the connector 542 can be inserted into a track groove formed in the hand actuator 543. The connector 542 can move horizontally along the track groove formed in the hand actuator 543. The transfer hand 541 can be moved horizontally via the connector 542 through the hand actuator 541.

[0149] The hand actuator 543 moves the connector 542. The hand actuator 543 moves the transfer hand 541 via the connector 542. The hand actuator 543 can move the transfer hand 541 horizontally. According to an embodiment, the transfer hand 541 is positioned above the hand actuator 543, and a track groove for guiding the horizontal movement of the transfer hand 541 may be provided on the side surface of the hand actuator 543.

[0150] Rotary actuator 544 moves hand actuator 543. Rotary actuator 544 can rotate and move hand actuator 543 based on an axis on a third direction 6. Hand actuator 543 can be disposed on rotary actuator 544. According to an embodiment, rotary actuator 544 can be coupled to the lower surface of hand actuator 543. Hand actuator 543 rotates according to the rotation of rotary actuator 544, and transfer hand 541 coupled to the upper portion of hand actuator 543 can be rotated via hand actuator 543.

[0151] A vertical actuator 545 may be disposed below a rotary actuator 544. The vertical actuator 545 is coupled to the rotary actuator 544 to move the rotary actuator 544. For example, the vertical actuator 545 may move the rotary actuator 544 along a third direction 6. The vertical positioning of the transfer hand 541 and the hand actuator 543 may be changed. Therefore, the transfer hand 541 may move vertically along a third direction 6.

[0152] A horizontal actuator 546 may be disposed below a vertical actuator 545. The horizontal actuator 546 may be coupled to a guide rail 520. The horizontal actuator 546 may move along the guide rail 520. Therefore, the transfer hand 541 may move forward and backward along the guide rail 520. For example, the horizontal actuator 546 may move linearly along a first direction 2. As the horizontal actuator 546 moves, the substrate W placed on the transfer hand 541 may be transferred between the liquid processing chamber 300 and the drying chamber 400.

[0153] The extender 547 can extend from the horizontal actuator 546. For example, the extender 547 can extend from the horizontal actuator 546 along the second direction 4. The contact member 620 can be provided on the upper surface of the extender 547.

[0154] The aforementioned hand actuator 543, rotary actuator 544, and vertical actuator 545 can move the substrate W placed on the transfer hand 541 to the rear surface cleaning position. The rear surface cleaning position can be the position where the rear surface cleaning unit 600 can remove liquid remaining on the rear surface of the substrate W. For example, the rear surface cleaning position can be the position where the contact member 620 provided on the extender 547 contacts the rear surface of the substrate W. For example, the rear surface cleaning position can be the position where, when viewed from above, the contact member 620 contacts the edge area of ​​the substrate W placed on the transfer hand 541. Furthermore, the rear surface cleaning position can be the height at which the rear surface of the substrate W placed on the transfer hand 541 and the upper surface of the contact member 620 correspond to each other when viewed from the front. For example, the rear surface cleaning position can be the height at which, when viewed from the front, the rear surface of the substrate W placed on the transfer hand 541 and the upper surface of the contact member 620 overlap.

[0155] The rear surface cleaning unit 600 cleans the substrate W. According to an exemplary embodiment, the rear surface cleaning unit 600 can clean the rear surface of the substrate W while transferring the substrate W. For example, the rear surface cleaning unit 600 can clean the rear surface of the substrate W while transferring the substrate W, which has been liquid-treated in the liquid processing chamber 300, to the drying chamber 400. That is, the rear surface cleaning unit 600 can clean the rear surface of the substrate W while transferring the substrate W within the transfer space inside the transfer frame 240.

[0156] The rear surface cleaning unit 600 may include a contact member 620. The contact member 620 may contact the rear surface of the substrate W. The contact member 620 may contact the rear surface of the substrate W to remove liquid residue on the edge areas of the rear surface of the substrate W. For example, the contact member 620 may contact the rear surface of the substrate W to remove processing liquid residue on the edge areas of the rear surface of the substrate W. The contact member 620 may be provided with a material that will not damage the substrate W. Furthermore, the contact member 620 may be provided with a material capable of easily absorbing liquid. According to an embodiment, the upper region of the contact member 620 may be provided with a material capable of easily absorbing liquid. For example, the upper end of the contact member 620 may be provided with a synthetic resin material, such as a sponge, which is an embodiment of a porous material.

[0157] The contact member 620 may be positioned so as not to interfere with the transfer hand 541, connector 542, and hand actuator 543. According to an exemplary embodiment, the contact member 620 may be disposed on the upper surface of the extender 547. The contact member 620 has a predetermined height and a predetermined thickness. When the substrate W placed on the transfer hand 541 is in the rear surface cleaning position, the contact member 620 may have a thickness that is stretched from the end of the substrate W toward the center of the substrate W by a predetermined distance.

[0158] For example, the set height can be a height corresponding to the height from the lower end of the hand actuator 543 to the rear surface of the substrate W placed on the transfer hand 541. Therefore, when the substrate W placed on the transfer hand 541 moves to the rear surface cleaning position, the substrate W placed on the transfer hand 541 can move in the third direction 6 without interfering with the contact member 620. Therefore, the rear surface of the substrate W placed on the transfer hand 541 can contact the upper surface of the contact member 620.

[0159] The contact member 620 may be formed as a bend. According to an embodiment, the contact member 620 may have a bend shape with a cut portion. When viewed from above, the cut portion of the contact member 620 may overlap with a portion of the transfer hand 541 on which the substrate W is placed at the rear surface cleaning position.

[0160] The following describes in detail the mechanism by which substrate W is transferred by transfer robot 540 while contacting component 620 to clean the rear surface of substrate W.

[0161] A component capable of wiping and removing the treatment liquid, such as a brush or a wiper, may be further provided on the upper surface of the contact member 620 according to the above embodiment. When the brush or wiper is further provided on the upper surface of the contact member 620, when the substrate W is in the rear surface cleaning position, the treatment liquid remaining on the rear surface of the substrate W can be removed by the brush or wiper while the rear surface of the substrate W is in contact with the brush or wiper.

[0162] Figures 5 to 7 It is a schematic diagram. Figure 4 A perspective view of another embodiment of the rear surface cleaning unit. Reference will be made below. Figures 5 to 7 A modified embodiment of the rear surface cleaning unit of the present invention is described in detail below. Unless otherwise described, the rear surface cleaning unit according to the following exemplary embodiments is substantially the same as or similar to the rear surface cleaning unit described above; therefore, repeated descriptions will be omitted.

[0163] refer to Figure 5 A guide hole 622 may be formed in the contact member 620 according to the embodiment. Multiple guide holes 622 may be provided. The multiple guide holes 622 may be arranged along the circumferential direction of the contact member 620. The multiple guide holes 622 may be regularly spaced apart from each other. The guide hole 622 may be configured as a through hole penetrating from the upper end to the lower end of the contact member 620.

[0164] When the substrate W placed on the transfer hand 541 is in the rear surface cleaning position, the rear surface of the substrate W and the upper surface of the contact member 620 can make surface contact with each other. Due to the contact between the substrate W and the contact member 620, the processing liquid remaining on the rear surface of the substrate W can flow to the upper surface of the contact member 620. The processing liquid flowing to the upper surface of the contact member 620 can flow along the guide hole 622 in the direction toward the lower end of the contact member 620 according to capillary action.

[0165] Unlike the embodiments described above, the contact member 620 may not have guide holes 622 penetrating its upper and lower ends. According to an embodiment, a groove may be formed on the side surface of the contact member 620. The groove may be formed from the upper end to the lower end of the contact member 620. Processing liquid remaining on the rear surface of the substrate W flows to the upper surface of the contact member 620, and the processing liquid flowing to the upper surface of the contact member 620 can be removed from the substrate W via the groove formed on the contact member 620.

[0166] refer to Figure 6 According to an embodiment, the contact member 620 may have a first portion 624 and a second portion 626. The first portion 624 and the second portion 626 may be disposed on the upper surface of the extender 547. The first portion 624 and the second portion 626 may be combined with each other to have a generally circular shape. The first portion 624 and the second portion 626 may be combined with each other to correspond to the edge region of the substrate W located at the rear surface cleaning position when viewed from top. The first portion 624 and the second portion 626 may be positioned facing each other. The first portion 624 and the second portion 626 may be symmetrically positioned with each other and have a symmetrical shape.

[0167] Part 624 and Part 626 are configured with the same or similar structures. Therefore, Part 624 will be described primarily below.

[0168] The first portion 624 may be formed to be curved. The first portion 624 may be formed to be curved relative to the center of the substrate W when the substrate W is in the rear surface cleaning position. When the substrate W is in the rear surface cleaning position, the upper surface of the first portion 624 may contact the rear surface of the substrate W. When the substrate W is in the rear surface cleaning position, the upper surface of the first portion 624 may contact the edge region of the rear surface of the substrate W. The upper surface of the first portion 624 may be provided with a material that will not damage the substrate W. Furthermore, the first portion 624 may be provided with a material capable of easily absorbing liquid. According to an embodiment, the upper region of the first portion 624 may be provided with a material capable of easily absorbing liquid. For example, the upper end of the first portion 624 may be provided with a porous material.

[0169] The first portion 624 can be positioned so as not to interfere with the transfer hand 541, connector 542, and hand actuator 543. For example, when the substrate W placed on the transfer hand 541 is in the rear surface cleaning position, portions of the transfer hand 541, connector 542, and hand actuator 543 can be positioned in the space between the first portion 624 and the second portion 626.

[0170] refer to Figure 7 According to the embodiment, the contact member 620 may be configured with a rod-shaped contact pin 628. The contact pin 628 may be coupled to the upper surface of the extender 547. A plurality of contact pins 628 may be provided. When the substrate W is in the rear surface cleaning position, the plurality of contact pins 628 are configured to be spaced apart from each other at a predetermined distance, thereby corresponding to the edge region of the substrate W when viewed from above. One end of the contact pin 628 may protrude in a direction toward the rear surface of the substrate W. The contact pin 628 with the protruding end may minimize damage to the rear surface of the substrate W when in contact with the rear surface of the substrate W in the rear surface cleaning position. Processing liquid remaining on the rear surface of the substrate W may flow along the contact pin 628 in contact with the rear surface of the substrate W.

[0171] In the above exemplary embodiments, it has been described that the contact member 620 is disposed on the upper surface of the extender 547 as an example, but this is not a limitation. The extender 547 may not be disposed in the transfer robot 540 according to the exemplary embodiment, and the contact member 620 may be disposed on the upper surface of the horizontal actuator 546. Optionally, the contact member 620 may be disposed on the upper surface of the hand actuator 543 to contact the rear surface of the substrate W.

[0172] Furthermore, in the above embodiments, it has been described that a pad 541a is disposed on the upper surface of the transfer hand 541 to support the lower surface of the substrate W, but this is not a limitation. For example, an adsorption hole (not shown) for providing a vacuum force is formed on the upper surface of the transfer hand 541, and the adsorption hole (not shown) provides a negative pressure toward the lower surface of the substrate W to vacuum adsorb the substrate W.

[0173] The substrate processing method according to an exemplary embodiment of the present invention will be described in detail below. The substrate processing method described below can be performed by a substrate processing apparatus 1. Furthermore, the controller 30 can perform the substrate processing method by controlling the components provided to the transfer unit 500 and the post-surface cleaning unit 600. Hereinafter, for ease of description, the method described in the reference citation will be used. Figures 1 to 4 The described substrate processing apparatus 1 executes an embodiment of a substrate processing method according to an exemplary embodiment of the present invention. However, the present invention is not limited thereto, and it is self-evident that even in Figures 5 to 7 Alternatively, the substrate processing method according to the embodiment can be performed in the same or similar manner.

[0174] Figure 8 This is a flowchart of a substrate processing method according to an exemplary embodiment of the present invention. (Reference) Figure 8 The substrate processing method according to the exemplary embodiment includes a liquid processing step (S10), a transfer step (S20), and a drying step (S30).

[0175] The liquid treatment step (S10), the transfer step (S20), and the drying step (S30) can be performed sequentially. Furthermore, the liquid treatment step (S10), the transfer step (S20), and the drying step (S30) can be collectively defined as a cleaning process.

[0176] Figure 9 It is a schematic diagram based on Figure 8 A schematic diagram illustrating the state of the processed substrate during the liquid processing step of an exemplary embodiment. (Refer to...) Figure 9 The liquid processing step (S10) is performed in the liquid processing chamber 300. In the liquid processing step (S10), the substrate W is liquid-processed by supplying liquid onto the substrate W. According to an embodiment, in the liquid processing step (S10), the substrate W is liquid-processed by supplying liquid onto the substrate W. For example, in the liquid processing step (S10), the substrate W is liquid-processed by supplying at least one of a chemical, a rinsing liquid, and an organic solvent onto the substrate W. For example, in the liquid processing step (S10), the substrate W is liquid-processed by sequentially supplying a chemical, a rinsing liquid, and an organic solvent onto the substrate W.

[0177] Figure 10 and Figure 11It is based on the sequential diagram. Figure 8 A schematic diagram illustrating the state of the substrate, after liquid treatment, positioned at the post-surface cleaning position during the transfer step in an exemplary embodiment. (Refer to...) Figure 10 and Figure 11 The transfer step (S20) is performed by a transfer robot 540. In the transfer step (S20), the transfer robot 540 transfers the substrate W from the liquid processing chamber 300 to the drying chamber 400. In the transfer step (S20), the transfer robot 540 carries the liquid-treated substrate W out of the liquid processing chamber 300. The transfer robot 540 carries the substrate W from the liquid processing chamber 300 into the drying chamber 400 via the transfer space inside the transfer frame 240.

[0178] In the transfer step (S20), when the substrate W is transferred from the liquid processing chamber 300 to the drying chamber 400, the processing liquid remaining on the rear surface of the substrate W can be removed. In the transfer step (S20), when the substrate W is transferred in the transfer space inside the transfer frame 240, the substrate W is positioned at the rear surface cleaning position to remove the processing liquid remaining on the rear surface of the substrate W.

[0179] As described above, the rear surface cleaning position can be the location where the rear surface cleaning unit 600 can remove liquid residue on the rear surface of the substrate W. For example, the rear surface cleaning position can be a position where the transfer robot 540 moves horizontally in a first direction 2 and / or a second direction 4 and downwards in a third direction 6, such that the rear surface of the substrate W placed on the transfer hand 541 and the upper surface of the contact member 620 disposed on the transfer robot 540 can contact each other. Furthermore, the rear surface cleaning position can be the position where the edge area of ​​the substrate W overlaps with the contact member 620 when viewed from above. Additionally, the rear surface cleaning position can be the height at which the rear surface of the substrate W and the upper surface of the contact member 620 coincide when viewed from the front.

[0180] After the substrate W is removed from the liquid processing chamber 300, the transfer robot 540 can change the position of the transfer hand 541. The transfer hand 541 can be moved by the hand actuator 543, the rotary actuator 544, and the vertical actuator 545 to position it at the rear surface cleaning position.

[0181] For example, such as Figure 10 As shown, after the transfer hand 541 carries the liquid-treated substrate W out of the liquid processing chamber 300, the hand actuator 543 and the rotary actuator 544 can move the transfer hand 541 to change the horizontal position of the substrate W placed on the transfer hand 541. The horizontal position can be the position where the edge area of ​​the substrate W placed on the transfer hand 541 overlaps with the contact member 620 when viewed from above.

[0182] When the substrate W placed on the transfer hand 541 is in a horizontal position, such as Figure 11 As shown, the vertical actuator 545 lowers the transfer hand 541 in the third direction 6 for positioning, such that the rear surface of the substrate W placed on the transfer hand 541 contacts the upper surface of the contact member 620. More specifically, the vertical actuator 545 lowers the substrate W in a horizontal position to position the substrate W in a rear surface cleaning position. Therefore, the rear edge region of the rear surface of the substrate W can contact the upper surface of the contact member 620.

[0183] Therefore, during the process of supplying processing liquid from the liquid processing chamber 300 to the substrate W, processing liquid that flows to the rear surface of the substrate W by deviating from the edge region of the substrate W can be removed by the contact member 620. Furthermore, according to an exemplary embodiment of the present invention, during the transfer of the substrate W from the liquid processing chamber 300 to the drying chamber 400, the processing liquid remaining on the rear surface of the substrate W is removed to improve the efficiency of the substrate W processing process. Furthermore, according to an exemplary embodiment of the present invention, since the fan filter unit (not shown) and the exhaust member 242 are disposed inside the transfer frame 240, the processing liquid removed from the transfer space can be discharged from the transfer space in advance without affecting the chamber in which subsequent processes are performed.

[0184] In the transfer step (S20) according to the above embodiment, the process of cleaning the rear surface of the substrate W can be performed while the transfer robot 540 moves in the first direction 2, which is the longitudinal direction of the transfer frame 240, via the horizontal driver 546. In contrast, after the liquid-treated substrate W is carried out of the liquid treatment chamber 300, when the transfer robot 540 stops in the first direction 2, the process of cleaning the rear surface of the substrate W can be performed in the transfer step (S20), while vertical movement is performed only in the third direction 6.

[0185] Figures 12 to 13 It is based on the sequential diagram. Figure 8 A schematic diagram illustrating the state of the dried substrate during the drying step in an exemplary embodiment. (Refer to...) Figure 12 and Figure 13 The drying step (S30) is performed in the drying chamber 400. In the transfer step (S20), the substrate W transferred by the transfer robot 224 is brought into the internal space 401 of the drying chamber 400. In the drying step (S30), the liquid remaining on the substrate W is removed by supplying process fluid to the substrate W brought into the drying chamber 400.

[0186] In the drying step (S30), with the internal space 401 open, the substrate W is transferred to the support member 430. The substrate W transferred to the support member 430 may be a substrate W that has been liquid-treated in the liquid treatment chamber 300 and whose rear surface has been cleaned by the rear surface cleaning unit 600. The substrate W transferred to the internal space 401 of the drying chamber 400 may be dried while its rear surface edge area is supported by the support member 430.

[0187] When the substrate W is placed on the support 430, the first body 412 and the second body 414 are in close contact with each other, thereby sealing the internal space 401 to the outside. For example, when the substrate W is placed on the holder 434 and the edge region of the rear surface of the substrate W is supported, the internal space 401 is sealed. After sealing the internal space 401, the fluid supply unit 450 supplies process fluid to the internal space 401. According to an embodiment, the fluid supply unit 450 may supply supercritical fluid to the internal space 401. The substrate W is dried by supplying process fluid to the internal space 401. That is, the processing liquid remaining on the upper surface of the substrate W is removed by supplying process fluid to the internal space 401.

[0188] After sealing the internal space 401, the process fluid can be supplied to the internal space 401 in advance via the second branch line 454 by opening the second valve 455. After supplying the process fluid to the lower region of the internal space 401, the process fluid can be supplied to the internal space 401 via the first branch line 452 by opening the first valve 453.

[0189] Since the initial drying of the substrate is performed when the internal space 401 is below the critical pressure, the process fluid supplied to the internal space 401 can be liquefied. When the process fluid is supplied to the internal space 401 via the first branch line 452 at the start of substrate drying, the process fluid can be liquefied and fall onto the substrate W by gravity, thereby damaging the substrate W. Therefore, in the drying step (S30) according to an exemplary embodiment of the present invention, the process fluid is supplied to the internal space 401 in advance via the second branch line 454 so that the pressure of the internal space 401 reaches the critical pressure, and then the process fluid is supplied from the first branch line 452 to liquefy the process fluid supplied to the internal space 401, thereby minimizing damage to the substrate W.

[0190] In the latter part of the drying step (S30), the internal atmosphere of the internal space 401 is discharged via the exhaust line 460. When the pressure in the internal space 401 drops below the critical pressure, the process fluid can be liquefied. The liquefied process fluid can be discharged via the exhaust line 460 by gravity.

[0191] Figure 14 It is a schematic diagram. Figure 4A perspective view of another embodiment of the rear surface cleaning unit. Figure 15 This is a schematic diagram when viewed from the top. Figure 14 A schematic diagram of an exemplary embodiment of the rear surface cleaning unit.

[0192] refer to Figure 14 and Figure 15 The rear surface cleaning unit 600 can be configured as a non-contact member 640. The non-contact member 640 can supply a decontamination source toward the rear surface of the substrate W. The non-contact member 640 does not physically contact the rear surface of the substrate W. The non-contact member 640 can be disposed on a transfer robot 540. According to an exemplary embodiment, the non-contact member 640 can be disposed on a hand actuator 543.

[0193] When viewed from above, the non-contact member 640 may be positioned at a location overlapping the edge region of the substrate W placed on the transfer handle 541. Furthermore, when viewed from the front, the non-contact member 640 may be positioned at a location spaced apart from the rear surface of the substrate placed on the transfer handle 541. Therefore, the non-contact member 640 may be positioned at a location spaced apart from the rear surface of the substrate W.

[0194] Multiple non-contact components 640 may be provided. When viewed from above, the multiple non-contact components 640 may be spaced apart from each other in the circumferential direction of the edge region of the substrate W. According to an embodiment, the non-contact component 610 may be configured as an air supply device for supplying air that is a decontamination source. For example, the non-contact component 640 may be provided with an air supply port in which air flows on the upper surface of the hand actuator 543. The air supply port may be connected to an air supply source (not shown) to supply air toward the rear surface of the substrate W.

[0195] Figure 16 The diagram is based on Figure 14 A schematic diagram illustrating the state of the rear surface of the substrate cleaned by the rear surface cleaning unit of an exemplary embodiment. (Refer to...) Figure 16 The transfer robot 540 transfers the substrate W, which has been liquid-treated in the liquid treatment chamber 300, to the drying chamber 400. As the transfer robot 540 transfers the liquid-treated substrate W, the non-contact member 640, according to the embodiment, supplies air toward the rear surface of the substrate W. The air supplied to the edge region of the rear surface of the substrate W can collide with the rear surface of the substrate W and diffuse radially. Therefore, the treatment liquid remaining on the edge of the substrate W can be pushed and removed outside the rear edge of the substrate W by the air supplied from the non-contact member 640.

[0196] Unlike the embodiment, the decontamination source supplied to the rear surface of the substrate W via the non-contact member 640 can be a heat source. The non-contact member 640 according to the embodiment can be configured as a heating assembly. The heating assembly can be provided using a known heater.

[0197] An on / off switch (not shown) can be connected to the non-contact member 640. The non-contact member 640 can apply heat towards the rear surface of the substrate W while transferring the substrate W, which has been liquid-treated in the liquid treatment chamber 300, to the drying chamber 400. Furthermore, the non-contact member 640 can apply heat towards the rear surface of the substrate W only during the transfer of the liquid-treated substrate W. Due to the heat applied to the rear surface of the substrate W during the transfer, any remaining processing liquid on the rear surface of the liquid-treated substrate W can be removed.

[0198] Unlike the embodiments described above, the non-contact member 640 may be disposed on the upper surface of the horizontal actuator 546. When the non-contact member 640 is disposed on the upper surface of the horizontal actuator 546, after the substrate W placed on the transfer hand 541 moves downward in the third direction 6, the non-contact member 640 supplies air toward the rear surface of the substrate W, thereby removing the processing liquid remaining on the rear surface of the substrate W. Optionally, the transfer unit 500 may further be provided with an extender 547, and the non-contact member 640 may also be disposed on the upper surface of the extender 547.

[0199] Figure 17 It is a schematic diagram. Figure 1 A schematic diagram of another embodiment of the substrate processing apparatus. Apart from the transfer frame 240, the substrate processing apparatus according to the following exemplary embodiment is most similar to the substrate processing apparatus, therefore descriptions of repeated content will be omitted.

[0200] The transfer frame 240 may have a first transfer frame 240a and a second transfer frame 240b. The longitudinal direction of each of the first transfer frame 240a and the second transfer frame 240b may be arranged along a first direction 2. The first transfer frame 240a may be arranged relatively closer to the buffer unit 220 than the second transfer frame 240b. The liquid processing chamber 300 may be arranged on both sides of the first transfer frame 240a. The following rear surface cleaning frame 700 may be arranged between the first transfer frame 240a and the second transfer frame 240b. Therefore, the first transfer frame 240a and the second transfer frame 240b may be arranged symmetrically to each other based on the rear surface cleaning frame 700.

[0201] One side of the first transfer frame 240a may face the front surface of the buffer unit 220. The other side of the first transfer frame 240a may face the front surface of the rear surface cleaning frame 700. One side of the second transfer frame 240b may face the rear surface of the rear surface cleaning frame 700.

[0202] The first transfer frame 240a has a first transfer space in which the substrate W is transferred. The first transfer space serves as a space for transferring the substrate W, which has been liquid-treated in the liquid treatment chamber 300, to the rear surface cleaning frame 700 described below. The second transfer frame 240b has a second transfer space in which the substrate W is transferred. The second transfer space serves as a space for transferring the substrate W, from which the treatment liquid has been removed from the rear surface, from the rear surface cleaning frame 700 to the drying chamber 400.

[0203] The components of the aforementioned transfer unit 500 are respectively arranged on the first transfer frame 240a and the second transfer frame 240b. For example, the aforementioned guide rail 520 and transfer robot 540 may be arranged between the first transfer frame 240a and the second transfer frame 240b. In addition, each of the first transfer frame 240a and the second transfer frame 240b may have a fan filter unit (not shown) provided on its upper surface and an exhaust member 242 provided on its lower surface.

[0204] Figure 18 It is a schematic diagram. Figure 17 A perspective view of an exemplary embodiment of the rear surface cleaning frame. (Reference) Figure 18 The rear surface cleaning frame 700 can remove processing liquid remaining on the rear surface of the substrate W. For example, the rear surface cleaning frame 700 can remove processing liquid remaining on the rear surface of the substrate W that has been liquid-treated in the liquid treatment chamber 300. The rear surface cleaning frame 700 can store the substrate W that has been liquid-treated in the liquid treatment chamber 300. For example, the rear surface cleaning frame 700 can store the substrate W from which processing liquid has been removed from the rear surface. The rear surface cleaning frame 700 can be arranged between the first transfer frame 240a and the second transfer frame 240b.

[0205] The rear surface cleaning frame 700 can be configured as a housing having an open front surface and a rear surface, as well as an internal space. In an embodiment, the rear surface cleaning frame 700 can be provided in a generally hexahedral shape. The substrate W, which has been liquid-treated in the liquid treatment chamber 300, can be located in the internal space of the rear surface cleaning frame 700. The open front surface of the rear surface cleaning frame 700 can face the first transfer frame 240a. The open rear surface of the rear surface cleaning frame 700 can face the second transfer frame 240b. Therefore, the substrate W, which has been liquid-treated from the liquid treatment chamber 300, can be brought into the open front surface of the rear surface cleaning frame 700 by the transfer robot 540. Furthermore, the substrate W, on which a predetermined treatment has been completed in the rear surface cleaning frame 700, can be transferred to the drying chamber 400 via the open rear surface of the rear surface cleaning frame 700.

[0206] The partition 720, spare slot 740, and vent 760 can be disposed within the internal space of the rear surface cleaning frame 700. Furthermore, the aforementioned rear surface cleaning unit 600 can be disposed within the internal space of the rear surface cleaning frame 700. The rear surface cleaning unit 600 disposed within the internal space of the rear surface cleaning frame 700 and the reference... Figures 1 to 16 The exemplary embodiments described are the same or similar. That is, according to the embodiments, contact members 620 or non-contact members 640 may be provided in the rear surface cleaning frame 700. The contact members 620 and non-contact members 610 provided on the rear surface cleaning frame 700 according to the embodiments may be provided on the bottom surface of the rear surface cleaning frame 700.

[0207] The partition 720 may have a mesh structure, allowing air in the interior space to be smoothly discharged through the vent 760. The partition 720 may separate the interior space of the rear surface cleaning frame 700. For example, the partition 720 may divide the interior space of the rear surface cleaning frame 700 into an upper spare area and a lower cleaning area.

[0208] The upper spare area can be configured to provide a space for the spare tank 740 described below. The lower cleaning area can be configured to provide a space for the rear surface cleaning unit 600. According to an embodiment, the upper spare area can be configured as a space in which the substrate W after the processing liquid has been removed from the rear surface is stored. In contrast, the upper spare area can be configured as a space in which the substrate W before the processing liquid has been removed from the rear surface is stored. Hereinafter, for ease of explanation, the upper spare area will be described as a space in which the substrate W is stored after the processing liquid has been removed from the rear surface, as an example.

[0209] A spare slot 740 may be formed on the inner surface of the rear surface cleaning frame 700. Multiple spare slots 740 may be provided. The multiple spare slots 740 may be arranged perpendicularly spaced from each other. The longitudinal direction of the spare slot 740 may be formed along the inner surface of the rear surface cleaning frame 700. The spare slot 740 may be formed to protrude from the inner surface of the rear surface cleaning frame 700. The spare slot 740 may have a generally arcuate shape. However, the spare slot 740 is not limited to this, and when viewed from above, the spare slot 740 may have a rectangular shape. When viewed from above, the spare slot 740 overlaps with the edge region of the substrate W.

[0210] A substrate W that has been liquid-treated in the liquid treatment chamber 300 can be placed on the upper surface of the spare tank 740. The edge region of the substrate W placed on the spare tank 730 can be supported by the spare tank 740. According to an embodiment, the substrate W placed on the spare tank 740 can be a substrate W from which the treated liquid is removed from the rear surface after liquid treatment is completed.

[0211] Vent 780 may be formed on the bottom surface of the rear surface cleaning frame 700. Vent 780 can discharge the atmosphere from the internal space of the rear surface cleaning frame 700. Vent 780 can discharge particles, process byproducts, and the like generated in the process of removing the processing liquid remaining on the rear surface of the substrate W in the lower region of the rear surface cleaning frame 700.

[0212] Figure 19 This is a flowchart of a substrate processing method according to another embodiment of the present invention. Figure 20 The diagram is based on Figure 19 This is a schematic diagram illustrating the state of the rear surface of the substrate during the rear surface cleaning step of an exemplary embodiment of the present invention. Hereinafter, for ease of explanation, an embodiment in which the contact member 620 is disposed within the internal space of the rear surface cleaning frame 700 according to an exemplary embodiment of the present invention will be described. However, the present invention is not limited thereto, and the substrate processing method according to the exemplary embodiment of the present invention can be equally applied even when the non-contact member 640 is disposed within the rear surface cleaning frame 700.

[0213] refer to Figure 19 and Figure 20 According to an exemplary embodiment of the present invention, the substrate processing method includes a liquid processing step (S10), a transfer step (S20), and a drying step (S30). The transfer step (S20) may include a first transfer step (S22), a post-surface cleaning step (S24), and a second transfer step (S26).

[0214] In the first transfer step (S22), the transfer robot 540 can transfer the substrate W, which has completed the liquid treatment step (S10) in the liquid treatment chamber 300, to the internal space of the rear surface cleaning frame 700 via the first transfer space. In the first transfer step (S22), the substrate W, which has completed the liquid treatment step (S10) in the liquid treatment chamber 300, can be transferred to the internal space of the rear surface cleaning frame 700 via the open front surface of the rear surface cleaning frame 700.

[0215] In the rear surface cleaning step (S24), the transfer robot 540 positions the transfer hand 541 in the lower cleaning area of ​​the internal space of the rear surface cleaning frame 700. When the transfer hand 541 is in the lower cleaning area, the transfer robot 540 moves horizontally, causing the rear surface of the substrate W placed on the transfer hand 541 to contact the upper surface of the contact member 620. Figure 20As shown, when viewed from above, the edge region of the rear surface of the substrate W, placed on the transfer hand 541, overlaps with the upper surface of the contact member 620. Therefore, by moving the transfer hand 541 horizontally, the edge region of the rear surface of the substrate W contacts the upper surface of the contact member 620, and in this process, the processing liquid remaining on the edge region of the rear surface of the substrate W can be removed. The processing liquid removed by the contact member 620 can be discharged through the vent 780 provided on the bottom surface of the rear surface cleaning frame 700.

[0216] The substrate W, having completed the surface cleaning step (S24) thereon, is moved horizontally toward the open front surface of the rear surface cleaning frame 700 by the transfer robot 540 and vertically upward to be placed on the spare tank 740.

[0217] In the second transfer step (S26), the transfer robot 540 located in the second transfer space carries the substrate W out of the rear surface cleaning frame 700 and then transfers the substrate W to the second transfer space. After completing the surface cleaning step (S24) and removing the processing liquid from the rear surface, the substrate W is placed in the standby tank 740 for later use. The transfer robot 540 carries the substrate W transferred to the second transfer space into the drying chamber 400 and places the substrate W on the support member 430 of the drying chamber 400. The drying step (S30) is performed on the substrate W placed on the support member 430 while supporting the edge area of ​​the substrate W.

[0218] When substrate W is processed in liquid processing chamber 300, the processing liquid may separate from the edges of substrate W due to various factors such as process conditions, liquid supply volume, and the like. The processing liquid separated from the edges of substrate W may remain on the rear surface of substrate W. The processing liquid remaining on the rear surface of substrate W can act as a source of contamination for subsequent substrates in subsequent processes.

[0219] Therefore, according to an exemplary embodiment of the present invention, the processing liquid remaining on the edge region of the rear surface of the substrate W is removed in a rear surface cleaning frame 700 having a separate internal space, thereby minimizing contamination of the processing liquid remaining in the chamber for performing subsequent processes and in the transfer space.

[0220] Furthermore, the substrate W that has been liquid-treated in the liquid treatment chamber 300 has a separate first transfer space and is transferred by a transfer robot 540 disposed therein, and the substrate W after the treatment liquid has been removed from its rear surface has a separate second transfer space and can be transferred by a separate transfer robot 540 disposed therein. That is, the substrate W before the treatment liquid is removed from its rear surface and the substrate W after the treatment liquid is removed from its rear surface can be transferred by separate transfer robots 540. Therefore, it is possible to effectively prevent contamination of the rear surface of the substrate W by the treatment liquid remaining therein in the chamber where subsequent processes are performed.

[0221] The above detailed description illustrates the present invention. Furthermore, the foregoing shows and describes exemplary embodiments of the invention, and the invention can be used in various other combinations, modifications, and environments. That is, the foregoing can be modified or corrected within the scope of the inventive concept disclosed in this specification, the equivalent scope of this disclosure, and / or the scope of technology or knowledge in the art. The above exemplary embodiments describe the optimal state for carrying out the technical spirit of the invention, and various changes are possible in specific fields and uses of the invention. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Furthermore, the appended claims should be interpreted as also including other exemplary embodiments.

Claims

1. An apparatus for processing a substrate, comprising: A liquid processing chamber for liquid processing the substrate by supplying processing liquid to the substrate; A drying chamber for drying the substrate by supplying process fluid to the substrate; A transfer unit for transferring the substrate between the liquid processing chamber and the drying chamber; and A rear surface cleaning unit is used to clean the rear surface of the substrate. The rear surface cleaning unit cleans the rear surface of the substrate while transferring the substrate from the liquid processing chamber to the drying chamber. The transfer unit includes a transfer manipulator that moves within a transfer frame providing transfer space and includes a transfer hand, a horizontal actuator, a hand actuator, and an extender. The substrate is placed on the transfer hand. The rear surface cleaning unit includes a contact member that contacts the rear surface of the substrate to remove the processing liquid remaining on the rear surface of the substrate. The contact member is disposed on one of the horizontal actuator, the hand actuator, or the extender.

2. The apparatus for processing a substrate according to claim 1, wherein, The contact member is located below the transfer hand and comes into contact with the rear surface of the substrate by the vertical movement of the transfer hand, the substrate being placed on the transfer hand.

3. The apparatus for processing a substrate according to claim 2, wherein, Multiple holes are formed in the contact member, penetrating the upper and lower ends of the contact member, and The plurality of holes are spaced apart from each other along the longitudinal direction of the contact member.

4. The apparatus for processing a substrate according to claim 1, wherein, The drying chamber includes a support member for supporting the substrate, and The support member supports the edge region of the rear surface of the liquid-treated substrate.

5. An apparatus for processing a substrate, comprising: A liquid processing chamber for liquid processing the substrate by supplying processing liquid to the substrate; A drying chamber for drying the substrate by supplying process fluid to the substrate; A transfer unit for transferring the substrate between the liquid processing chamber and the drying chamber; and A rear surface cleaning unit is used to clean the rear surface of the substrate. The rear surface cleaning unit cleans the rear surface of the substrate while transferring the substrate from the liquid processing chamber to the drying chamber. The transfer unit includes a transfer robot that moves within a transfer frame providing transfer space and has a transfer hand, on which the substrate is placed. The rear surface cleaning unit includes a contact member that contacts the rear surface of the substrate to remove the processing liquid remaining on the rear surface of the substrate. The rear surface cleaning frame with a groove is disposed inside the transfer frame, and the substrate is placed on the groove. The rear surface cleaning frame is located between the liquid treatment chamber and the transfer frame, and The contact member is disposed inside the rear surface cleaning frame.

6. The apparatus for processing a substrate according to claim 5, wherein, During the process of transferring the substrate placed on the transfer hand into the rear surface cleaning frame, the contact member is positioned at a location that contacts the rear surface of the substrate.

7. The apparatus for processing a substrate according to claim 5, wherein, The drying chamber includes a support member for supporting the substrate, and The support member supports the edge region of the rear surface of the liquid-treated substrate.

8. An apparatus for processing a substrate, comprising: A liquid processing chamber for liquid processing the substrate by supplying processing liquid to the substrate; A drying chamber for drying the substrate by supplying process fluid to the substrate; A transfer unit for transferring the substrate between the liquid processing chamber and the drying chamber; and A rear surface cleaning unit is used to clean the rear surface of the substrate. The rear surface cleaning unit cleans the rear surface of the substrate while transferring the substrate from the liquid processing chamber to the drying chamber. The transfer unit includes a transfer manipulator that moves within a transfer frame providing transfer space and includes a transfer hand, a hand actuator, a horizontal actuator, and an extender. The substrate is placed on the transfer hand. The rear surface cleaning unit includes non-contact components spaced apart from the rear surface of the substrate, thereby removing the processing liquid remaining on the rear surface of the substrate in a non-contact manner. The non-contact component is disposed on one of the hand actuator, the horizontal actuator, or the extender.

9. The apparatus for processing a substrate according to claim 8, wherein, The non-contact component supplies a decontamination source for removing the processing liquid towards the rear surface of the substrate, and The decontamination source is provided by heat or airflow.

10. The apparatus for processing a substrate according to claim 8, wherein, The drying chamber includes a support member for supporting the substrate, and The support member supports the edge region of the rear surface of the liquid-treated substrate.

11. An apparatus for processing a substrate, comprising: A liquid processing chamber for liquid processing the substrate by supplying processing liquid to the substrate; A drying chamber for drying the substrate by supplying process fluid to the substrate; A transfer unit for transferring the substrate between the liquid processing chamber and the drying chamber; and A rear surface cleaning unit is used to clean the rear surface of the substrate. The rear surface cleaning unit cleans the rear surface of the substrate while transferring the substrate from the liquid processing chamber to the drying chamber. The transfer unit includes a transfer robot that moves within a transfer frame providing transfer space and has a transfer hand, on which the substrate is placed. The rear surface cleaning unit includes non-contact components spaced apart from the rear surface of the substrate, thereby removing the processing liquid remaining on the rear surface of the substrate in a non-contact manner. The transfer frame includes a rear surface cleaning frame with multiple grooves, and the substrate is placed on the multiple grooves. The rear surface cleaning frame is located between the liquid treatment chamber and the transfer frame, and The non-contact component is disposed inside the rear surface cleaning frame.

12. The apparatus for processing a substrate according to claim 11, wherein, The drying chamber includes a support member for supporting the substrate, and The support member supports the edge region of the rear surface of the liquid-treated substrate.

13. A method for processing a substrate, comprising the following steps: A liquid processing step, which supplies a processing liquid to the substrate; The transfer step involves transferring a substrate that has undergone liquid treatment. and The drying step involves drying the substrate by supplying process fluid to the liquid-treated substrate. In the transfer step, while transferring the liquid-treated substrate, the remaining treatment liquid on the rear surface of the substrate is removed. In the transfer step, the processing liquid remaining on the rear surface of the substrate is removed through mutual contact between the liquid-treated substrate and the contact member, wherein the contact member contacts the rear surface of the substrate. The transfer step is performed by a transfer robot for transferring the liquid-treated substrate, and The contact member is disposed on the transfer manipulator to contact the rear surface of the substrate while the transfer manipulator transfers the liquid-treated substrate.

14. The method for processing a substrate according to claim 13, wherein, The contact member is disposed within a rear surface cleaning frame, which is located within a transfer space for transferring the liquid-treated substrate during the transfer step. The transfer step includes: The first transfer step involves transferring the liquid-treated substrate from the liquid treatment chamber in which the liquid treatment step is performed to the rear surface cleaning frame. A rear surface cleaning step, wherein the rear surface of the substrate is cleaned in the rear surface cleaning frame; and The second transfer step involves transferring the substrate to a drying chamber, where the drying step is performed after the rear surface cleaning step.

15. A method for processing a substrate, comprising the following steps: A liquid processing step, which supplies a processing liquid to the substrate; The transfer step involves transferring a substrate that has undergone liquid treatment. and The drying step involves drying the substrate by supplying process fluid to the liquid-treated substrate. In the transfer step, while transferring the liquid-treated substrate, the remaining treatment liquid on the rear surface of the substrate is removed. In the transfer step, the residual treatment liquid on the rear surface of the liquid-treated substrate is removed from the substrate in a non-contact manner by a non-contact member that supplies a decontamination source for removing the treatment liquid toward the rear surface of the substrate. The non-contact component is disposed in a transfer manipulator for transferring the liquid-treated substrate in the transfer step, and / or disposed in a rear surface cleaning frame in a transfer space for transferring the liquid-treated substrate in the transfer step.

16. An apparatus for processing a substrate, comprising: A liquid processing chamber for liquid processing the substrate by supplying processing liquid to the upper surface of the substrate; A drying chamber for drying the substrate by supplying supercritical fluid to the substrate; A transfer unit for transferring the substrate between the liquid processing chamber and the drying chamber; and A rear surface cleaning unit is used to clean the rear surface of the substrate. The drying chamber comprises: A shell having an internal space; and A support unit for supporting the edge region of the rear surface of the liquid-treated substrate within the internal space. The rear surface cleaning unit removes the processing liquid remaining on the rear surface of the substrate by cleaning the rear surface of the substrate using contact and / or non-contact methods while the substrate is being transferred from the liquid processing chamber to the drying chamber. in, The transfer unit includes a transfer manipulator that moves within a transfer frame providing transfer space and includes a transfer hand, a hand actuator, a horizontal actuator, and an extender. The substrate is placed on the transfer hand. The rear surface cleaning unit includes a contact member that contacts the rear surface of the substrate to remove the processing liquid remaining on the rear surface of the substrate; or a non-contact member that is spaced apart from the rear surface of the substrate to remove the processing liquid remaining on the rear surface of the substrate in a non-contact manner. The contact member and the non-contact member are disposed on one of the hand actuator, the horizontal actuator, or the extender.

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