An apparatus for lifting a wafer from within a wafer processing chamber

Abstract

To solve the technical problem that wafers are easily bounced or damaged when being lifted up due to static electricity residue in the prior art, the embodiment of the present application provides a device for lifting wafers from a wafer processing chamber, comprising: a control device, a power device and at least one lifting device; each lifting device comprises: a lifting rod, one end of which is used to contact a wafer on an electrostatic chuck to lift the wafer from the electrostatic chuck; a permanent magnet, one end of which is used to connect the other end of the lifting rod; an electromagnet, one end of which is used to magnetically connect the other end of the permanent magnet; and a distance sensor, which is arranged at one end of the electromagnet and is used to sense the distance between the other end of the permanent magnet and one end of the electromagnet; the power device is used to connect the other end of the electromagnet to drive one end of the electromagnet to move towards or away from the other end of the permanent magnet; and the control device is used to connect the distance sensor, the power device and the electromagnet.

Description

Technical Field

[0001] This invention relates to an apparatus for lifting a wafer from a wafer processing chamber. Background Technology

[0002] The first step in transferring wafers from the wafer processing chamber to the outside requires lifting the wafers held in place by electrostatic chucks (ESCs). At this point, the wafers must be destaticated to ensure even force distribution. However, for various reasons, static electricity may remain. If the wafer is forcefully lifted while still retaining static electricity, it may be bounced away or broken due to excessive localized force. Therefore, a device is needed to prevent the wafer from being bounced away or broken due to excessive localized force when static electricity remains. Summary of the Invention

[0003] To address the technical problem in the prior art where wafers are easily bounced away or damaged when being lifted upwards due to residual static electricity, embodiments of the present invention provide a device for lifting wafers from a wafer processing chamber.

[0004] The embodiments of the present invention are achieved through the following technical solutions:

[0005] In a first aspect, embodiments of the present invention provide an apparatus for lifting a wafer from a wafer processing chamber, comprising: a control device, a power device, and at least one lifting device; each lifting device comprising:

[0006] A lifting rod, one end of which is used to contact the wafer on the electrostatic chuck to lift the wafer off the electrostatic chuck;

[0007] A permanent magnet, one end of which is used to connect to the other end of the lifting rod;

[0008] An electromagnet, one end of which is magnetically connected to the other end of a permanent magnet; and

[0009] A distance sensor is located at one end of an electromagnet and is used to sense the distance between the other end of the permanent magnet and one end of the electromagnet.

[0010] A power unit is used to connect to the other end of the electromagnet to drive one end of the electromagnet to move closer to or further away from the other end of the permanent magnet; when one end of the electromagnet moves closer to the other end of the permanent magnet, the polarity of one end of the electromagnet and the other end of the permanent magnet are the same.

[0011] A control device for connecting to a distance sensor, a power unit, and an electromagnet.

[0012] Furthermore, the control device is also used to: generate a distance feedback value based on the distance feedback signal from the distance sensor;

[0013] If the distance feedback value is less than or equal to the safe distance value, the power device is controlled to stop the lifting action; or the power device is used to drive one end of the electromagnet to move away from the other end of the permanent magnet.

[0014] Furthermore, the safety distance value is the distance between one end of the permanent magnet and one end of the electromagnet when the wafer is free of static electricity and is being lifted.

[0015] Furthermore, it also includes an alarm device; the alarm device is connected to a control device; the control device is also used to control the alarm device to sound an alarm when the distance feedback value is less than the safe distance value.

[0016] Furthermore, the control device is also used to control the direction and magnitude of the current flowing into the electromagnet in order to control the magnitude and polarity of the electromagnet's magnetic force.

[0017] Furthermore, each lifting device also includes: a mounting chamber; one end of the mounting chamber has a through hole for the lifting rod to pass through; the other end of the lifting rod passes through the through hole and is connected to one end of a permanent magnet; the permanent magnet is slidably connected to the inner wall of the mounting chamber; the other end of the mounting chamber is open, and an electromagnet is located at the other end of the mounting chamber, and the electromagnet is slidably connected to the inner wall of the mounting chamber; the electromagnet has a through mounting hole; and a distance sensor is located in the mounting hole of the electromagnet.

[0018] Furthermore, the sensing end of the distance sensor protrudes from the mounting hole near the permanent magnet.

[0019] Furthermore, it also includes mounting components; the number of jacking devices is at least two; all jacking devices are mounted on one side of the mounting components, and the other side of the mounting components is connected to the output end of the power unit via a drive shaft.

[0020] Furthermore, the power source is a motor.

[0021] Furthermore, all the jacking devices are evenly distributed at the edges of the mounting components.

[0022] Compared with the prior art, the embodiments of the present invention have the following advantages and beneficial effects:

[0023] This invention discloses a device for lifting a wafer from a wafer processing chamber. Through a control device, a power device, and a lifting device, and via the magnetic connection of an electromagnet and a permanent magnet, the device prevents a sudden increase in stress on the wafer when the lifting rod acts on it, thus avoiding the wafer from bouncing away or being damaged due to sudden force. Furthermore, by controlling the distance between the electromagnet and the permanent magnet through a distance sensor and the control device, the device not only avoids wafer damage but also determines whether static electricity remains on the wafer based on the distance between the magnet and the permanent magnet. This facilitates timely processing of wafers with static electricity residue, thereby solving the technical problem in the prior art where wafers are easily bounced away or damaged during upward lifting due to static electricity residue. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of a device that lifts a wafer from the wafer processing chamber.

[0026] Figure 2 for Figure 1 A magnified schematic diagram of part A in the diagram.

[0027] The attached diagram shows the markings and corresponding component names:

[0028] 1-Wafer, 2-Electrostatic chuck, 3-Drive shaft, 4-Motor, 5-Ejector pin, 6-Mounting cavity, 7-Permanent magnet, 8-Distance sensor, 9-Electromagnet. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0030] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that these specific details are not necessary to practice the invention. In other embodiments, well-known structures, circuits, materials, or methods have not been specifically described in order to avoid obscuring the invention.

[0031] Throughout this specification, references to "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of the invention. Therefore, the phrases "an embodiment," "an example," "an example," or "an example" appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Furthermore, specific features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. Moreover, those skilled in the art will understand that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] In the description of this invention, the terms "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this invention.

[0033] Example

[0034] Currently, the method for lifting wafers in wafer processing equipment involves installing one or more lifting motors or lifting chucks below an electrostatic chuck, and connecting one or more lifting rods or lifting rings to the upper shaft to control the lifting and lowering of the wafer.

[0035] To address the technical problem in existing technologies where wafers are easily bounced away or damaged during upward lifting due to residual static electricity, reference is made to... Figure 1 and 2 As shown, this embodiment of the invention provides an apparatus for lifting a wafer from a wafer processing chamber, comprising: a control device, a power device, and at least one lifting device; each lifting device includes: a lifting rod, one end of which is used to contact the wafer on an electrostatic chuck to lift the wafer 1 from the electrostatic chuck 2; a permanent magnet 7, one end of which is connected to the other end of the lifting rod; an electromagnet, one end of which is magnetically connected to the other end of the permanent magnet; a distance sensor 8, disposed at one end of the electromagnet, for sensing the distance between the other end of the permanent magnet and one end of the electromagnet 9; a power device, connected to the other end of the electromagnet, for driving one end of the electromagnet to move closer to or away from the other end of the permanent magnet; when one end of the electromagnet moves closer to the other end of the permanent magnet, the polarity of one end of the electromagnet and the other end of the permanent magnet are the same; and a control device, connected to the distance sensor, the power device, and the electromagnet.

[0036] Optionally, the upper end of the lifting rod contacts the lower part of the wafer on the electrostatic chuck, lifting the wafer from the electrostatic chuck 2. The upper end of the permanent magnet is connected to the lower end of the lifting rod; the lower end of the permanent magnet is magnetically connected to the upper end of the electromagnet; and the lower end of the electromagnet is connected to the power device. Optionally, when one end of the electromagnet moves away from the other end of the permanent magnet, the polarity of one end of the electromagnet is opposite to that of the other end of the permanent magnet.

[0037] Therefore, this embodiment of the invention, through the control device, power device, and lifting device, and the magnetic connection between the electromagnet and the permanent magnet, ensures that when the lifting rod acts on the wafer, a sudden increase in stress is not generated on the wafer, thereby avoiding the wafer from bouncing away or being damaged due to sudden force. Furthermore, by controlling the distance between the electromagnet and the permanent magnet through the distance sensor and the control device, damage to the wafer is avoided on the one hand, and the distance between the magnet and the permanent magnet can be used to determine whether there is static electricity remaining on the wafer. This facilitates timely processing of wafers with static electricity residue, thereby solving the technical problem in the prior art where wafers are easily bounced away or damaged when being lifted upwards due to static electricity residue.

[0038] Optionally, the lifting rod is a mold release ejector 5.

[0039] Furthermore, the control device is also used to: generate a distance feedback value based on the distance feedback signal from the distance sensor;

[0040] If the distance feedback value is less than or equal to the safe distance value, the power device is controlled to stop the lifting action; or the power device is used to drive one end of the electromagnet to move away from the other end of the permanent magnet.

[0041] If the distance feedback value is greater than the safe distance value, the control device controls the power device to move the upper end of the electromagnet closer to the lower end of the permanent magnet until the wafer is lifted when the distance feedback value is greater than the safe distance value.

[0042] Furthermore, the safety distance value is the distance between one end of the permanent magnet and one end of the electromagnet when the wafer is free of static electricity and is being lifted.

[0043] The specific work process is as follows:

[0044] refer to Figure 1 and 2 As shown, motor 4 drives drive shaft 3 to move up and down, drive shaft 3 drives mounting parts to move up and down, thereby causing ejector pin 5 to move upward to lift the wafer, and ejector pin moves downward to wait for the next upward lifting motion of the wafer.

[0045] When the ejector pin moves upward to lift the wafer, the upper end of the ejector pin 5 contacts the lower end of the wafer. If there is no static electricity residue on the wafer, the wafer is normally lifted by the ejector pin if the distance between the upper end of the electromagnet and the lower end of the permanent magnet is greater than the safe distance value. If there is static electricity residue on the wafer, after the upper end of the ejector pin 5 contacts the lower end of the wafer, the distance between the upper end of the electromagnet and the lower end of the permanent magnet gradually decreases over time until the distance between the upper end of the electromagnet and the lower end of the permanent magnet is less than the safe distance value. During this process, the control device receives the distance feedback signal from the distance sensor and generates a distance feedback value based on the distance feedback signal. The distance feedback value is compared with the safe distance value. If the distance feedback value is less than or equal to the safe distance value, the control device stops the lifting action; or the control device controls one end of the electromagnet to have the opposite polarity to the other end of the permanent magnet, and the power device drives one end of the electromagnet to move away from the other end of the permanent magnet.

[0046] If the distance feedback value is greater than the safe distance value, the control device controls one end of the electromagnet to have the same polarity as the other end of the permanent magnet. The power device then drives one end of the electromagnet to move closer to the other end of the permanent magnet until the wafer is safely lifted. This prevents the ejector pin from bouncing away or damaging the wafer with residual static electricity under the action of the power device.

[0047] Furthermore, it also includes an alarm device; the alarm device is connected to a control device; the control device is also used to control the alarm device to sound an alarm when the distance feedback value is less than the safe distance value.

[0048] To facilitate the subsequent processing of wafers with residual static electricity, the device of this invention is also equipped with an alarm device. When the distance feedback value is less than the safe distance value, the alarm device will sound an alarm to promptly notify the staff to remove the wafer with residual static electricity.

[0049] Furthermore, the control device is also used to control the direction and magnitude of the current flowing into the electromagnet, thereby controlling the magnitude and polarity of the electromagnet's magnetic force. When the electromagnet is configured with a permanent magnet and the electromagnet facing each other, they can maintain a certain distance due to the repulsive force between the two magnets, which have the same polarity on their surfaces. Optionally, when the upper end of the permanent magnet is the S pole and the lower end is the N pole, the upper end of the electromagnet is the N pole and the lower end is the S pole.

[0050] The control device can control the polarity of the electromagnet and its interaction force with the permanent magnet by changing the direction and magnitude of the current flowing into the electromagnet.

[0051] Furthermore, each lifting device also includes: a mounting chamber; one end of the mounting chamber 6 is provided with a through hole for the lifting rod to pass through; the other end of the lifting rod passes through the through hole and is connected to one end of a permanent magnet; the permanent magnet is slidably connected to the inner wall of the mounting chamber; the other end of the mounting chamber is open, and an electromagnet is located at the other end of the mounting chamber, and the electromagnet is slidably connected to the inner wall of the mounting chamber; the electromagnet has a through mounting hole; a distance sensor is located in the mounting hole of the electromagnet.

[0052] refer to Figure 2 As shown, the mounting chamber is a rectangular structure with an opening on one side. The upper end of the mounting chamber is closed and has a through hole; the lower end of the lifting rod passes through the through hole and connects to the upper end of the permanent magnet inside the mounting chamber; the side wall of the permanent magnet is slidably connected to the inner side wall of the mounting chamber; the electromagnet is slidably connected to the inner side wall of the mounting chamber; the lower end of the electromagnet is connected to the power device through a mounting component. The electromagnet is connected to the control device. A mounting hole penetrating the center of the electromagnet is provided in the middle of the electromagnet for mounting a distance sensor. This facilitates the distance sensor sensing the force between the upper end of the electromagnet and the lower end of the permanent magnet.

[0053] Furthermore, the sensing end of the distance sensor protrudes from the mounting hole near the permanent magnet.

[0054] Furthermore, it also includes mounting components; the number of jacking devices is at least two; all jacking devices are mounted on one side of the mounting components, and the other side of the mounting components is connected to the output end of the power unit via the drive shaft 3.

[0055] The number of lifting devices can also be 4 or 8, etc.

[0056] Furthermore, the power unit is motor 4.

[0057] Furthermore, all the jacking devices are evenly distributed at the edges of the mounting components.

[0058] Optionally, the device for lifting a wafer from the wafer processing chamber in this embodiment of the invention further includes a recording device; the recording device is used to connect to the control device; the recording device can measure and record the distance of each action, and the user can confirm its value at any time when needed.

[0059] The control device can also control the strength of the electromagnet's magnetic force by controlling the current flowing into it. Therefore, the interaction between the electromagnet and the permanent magnet can control the magnitude of the force exerted by the lifting rod on the wafer. Optionally, when lifting the wafer upwards, the control device can control the lifting force to be 0.5 kg / cm² using the electromagnet. 3 .

[0060] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An apparatus for lifting a wafer from a wafer processing chamber, characterized in that, include: A control device, a power unit, and at least one jacking device; each jacking device includes: A lifting rod, one end of which is used to contact the wafer on the electrostatic chuck to lift the wafer off the electrostatic chuck; A permanent magnet, one end of which is used to connect to the other end of the lifting rod; An electromagnet, one end of which is magnetically connected to the other end of a permanent magnet; and A distance sensor is located at one end of an electromagnet and is used to sense the distance between the other end of the permanent magnet and one end of the electromagnet. A power unit is used to connect to the other end of the electromagnet to drive one end of the electromagnet to move closer to or further away from the other end of the permanent magnet; when one end of the electromagnet moves closer to the other end of the permanent magnet, the polarity of one end of the electromagnet and the other end of the permanent magnet are the same. Control device for connecting to distance sensor, power unit and electromagnet; The control device is also used to: generate a distance feedback value based on the distance feedback signal from the distance sensor; Determine if the distance feedback value is less than or equal to the safe distance value. If so, control the power device to stop the lifting action; or drive one end of the electromagnet to move away from the permanent magnet through the power device. The safe distance value is the distance between one end of the permanent magnet and one end of the electromagnet when the wafer is free of static electricity and is being lifted.

2. The apparatus for lifting a wafer from a wafer processing chamber as described in claim 1, characterized in that, It also includes an alarm device; the alarm device is connected to a control device; the control device is also used to control the alarm device to sound an alarm when the distance feedback value is less than the safe distance value.

3. The apparatus for lifting a wafer from a wafer processing chamber as described in claim 1, characterized in that, The control device is also used to control the direction and magnitude of the current flowing into the electromagnet in order to control the magnitude and polarity of the electromagnet's magnetic force.

4. The apparatus for lifting a wafer from a wafer processing chamber as described in claim 1, characterized in that, Each lifting device further includes: a mounting chamber; one end of the mounting chamber has a through hole for the lifting rod to pass through; the other end of the lifting rod passes through the through hole and is connected to one end of a permanent magnet; the permanent magnet is slidably connected to the inner wall of the mounting chamber; the other end of the mounting chamber is open, and an electromagnet is located at the other end of the mounting chamber, and the electromagnet is slidably connected to the inner wall of the mounting chamber; the electromagnet has a through mounting hole; a distance sensor is located in the mounting hole of the electromagnet.

5. The apparatus for lifting a wafer from a wafer processing chamber as described in claim 4, characterized in that, The sensing end of the distance sensor protrudes from the mounting hole near the permanent magnet.

6. The apparatus for lifting a wafer from a wafer processing chamber as described in claim 1, characterized in that, It also includes mounting components; the number of jacking devices is at least 2; all jacking devices are mounted on one side of the mounting components, and the other side of the mounting components is connected to the output end of the power unit via a drive shaft.

7. The apparatus for lifting a wafer from a wafer processing chamber as described in claim 1, characterized in that, The power unit is a motor.

8. The apparatus for lifting a wafer from a wafer processing chamber as described in claim 6, characterized in that, All the jacking devices are evenly distributed at the edges of the installation components.

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