A process for improving etching quality stability

By encoding each production board and calculating in the database, the copper thickness can be detected before etching and the etching speed can be automatically adjusted. This solves the problem of unstable etching quality, achieves stability in etching quality and control of production speed, and is suitable for multi-variety, small-batch production.

CN116347780BActive Publication Date: 2026-06-30珠海杰赛科技有限公司 +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
珠海杰赛科技有限公司
Filing Date
2023-03-15
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

In existing technologies, the difference in etched copper thickness affects the guidance of the first board adjustment, making it difficult to measure and identify the copper thickness of the product. Manual operation is not conducive to multi-variety, small-batch production, resulting in unstable etching quality.

Method used

By coding each production board individually, detecting and recording the copper thickness before etching, and using a database to calculate the optimal etching speed, automatic closed-loop control across production steps is achieved, automatically adjusting the etching speed to ensure consistent product quality.

Benefits of technology

It has achieved improved stability in etching quality and stable control of etching speed, reduced reliance on manual operation, and met the needs of multi-variety, small-batch production.

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Abstract

This invention discloses a process for improving the stability of etching quality, relating to the field of PCB processing technology. It enables automatic closed-loop control across multiple processes, ensuring that products in the same batch can automatically use the correct production parameters under different etching copper thickness results, achieving consistent product quality. The process for improving etching quality stability includes the following steps: encoding each production board individually → setting up a code reader before each process → database establishment → drilling → copper plating → board plating → copper thickness measurement → external light imaging → pattern electroplating → alkaline etching → drying → line width detection → data feedback. By encoding each production board individually, detecting copper thickness before etching, and detecting line width after etching and recording the data in a database, the optimal etching production speed is calculated through rules, and the etching speed of subsequent production boards is adjusted. This achieves data accumulation while further improving the stable control of the etching production speed.
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