Camera module with gimbal

Abstract

The present application relates to a kind of camera module with cloud platform, it includes: module body, it includes lens assembly and photosensitive component;And cloud platform structure, it includes the outer frame being arranged in the module body outside, the SMA wire that the module body is hung in the outer frame inside, and the driving device being arranged on the outer frame and the module body;Wherein, in non-anti-shake mode, the SMA wire is in first state to support the module body;And in anti-shake mode, the SMA wire is powered to induce shape memory effect by heating, so that the SMA wire is changed from first state to second state, and compared with the first state, the SMA wire in the second state can reduce the resistance that the driving device drives the module body moves.This application can realize the anti-shake of large stroke, so that the photo in motion scene and dark light scene is clearer;And miniaturization of cloud platform anti-shake structure can be realized.

Description

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 202010678999.0, filed on July 15, 2020, entitled "Camera Module with Gimbal"; and to Chinese Patent Application No. 202010691362.5, filed on July 17, 2020, entitled "Camera Module with Gimbal", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to the field of camera module technology, and more specifically, to a camera module with a gimbal. Background Technology

[0004] With the widespread adoption of mobile electronic devices, the technology behind camera modules—used to help users acquire images (such as videos or pictures)—has developed and progressed rapidly. In recent years, camera modules have been widely used in numerous fields, including medical, security, and industrial production. Currently, in the consumer electronics field (such as mobile phones), image stabilization has become a common feature of camera modules.

[0005] Image stabilization technology was first applied to cameras. Standard focal length or wide-angle lenses, due to their short focal lengths and light weight, can generally be used handheld for shooting. However, in telephoto and macro shooting, with a fixed aperture, sufficient exposure time is required. Handheld shooting in these situations easily leads to camera shake. Especially with the limited aperture of current smartphones, the amount of light entering the camera is limited. To obtain a sufficiently sharp image, a long exposure time is needed, which is where image stabilization technology comes in. Specifically, when taking photos with a smartphone, hand shake causes a slight tilt of the camera (generally within + / - 0.5 degrees). This tilt changes the lens's viewing angle. From the lens's perspective, this is equivalent to the object being photographed moving. Therefore, the image formed will also shift relative to its original position on the image sensor, resulting in an unstable image due to hand shake. Thus, image stabilization technology is necessary.

[0006] Currently, image stabilization technology in mobile phones primarily involves internal design within the phone module. Common stabilization methods fall into two main categories: Optical Image Stabilization (OIS) and Electronic Image Stabilization (EIS). Optical image stabilization requires a motor structure to drive the lens. However, as the overall lens structure has become larger, the required driving force has also increased, making the design of the driving structure (such as the motor) more complex and increasing the cost of stabilization. Furthermore, because the motor drives the lens to move relative to the sensor, a misalignment occurs between the lens's optical axis and the sensor's center during shooting, resulting in a decrease in image quality. On the other hand, current trends are leading to changes in lens structure; for example, all or part of the lens elements may be replaced with glass elements, increasing the lens's weight. This will change the required driving force, and insufficient driving force from the original motor will also affect the accuracy of shake correction. As for electronic image stabilization, this stabilization solution usually affects the image quality itself, so it is generally only used in conjunction with optical image stabilization or only in low-end products.

[0007] On the other hand, image stabilization can also be achieved by using an external gimbal device on a smart device (such as a mobile phone). Gimbal stabilization effectively compensates for various problems caused by camera shake during shooting by driving the entire module to move. Using gimbal-driven stabilization can overcome the loss of image quality caused by electronic image stabilization. Furthermore, because gimbal stabilization can drive the entire module to move, the positions of the lens and image sensor can remain relatively consistent during stabilization, resulting in minimal changes to image quality and no significant degradation in image edge sharpness. Gimbal stabilization also facilitates stabilization over a long range of motion, making photos clearer in moving and low-light conditions. However, external gimbal devices themselves are bulky and extremely inconvenient to carry, and the cost of equipping gimbals is very high, making widespread adoption difficult.

[0008] Based on the above problems, there is an urgent need for a miniaturized solution that can integrate gimbal stabilization into mobile phones or other smart terminal devices.

[0009] Figure 1 A schematic diagram of a gimbal stabilization structure in the prior art is shown. In this prior art solution, a fixed frame 2 is fixed to the edge of the base plate 3 of the mobile phone camera module. A magnet 6 is installed on this fixed frame 2, and a coil 7 is installed at the corresponding position of the optical lens 1. The entire module is suspended in the fixed frame 2 by a spring or spring 8. Figure 1 The module includes an optical lens 1 and a photosensitive component. The photosensitive component includes a circuit board 4, a photosensitive chip 5, etc. The circuit board 4 may include a PCB board 12, an FPC board 10, and a connector 11, wherein the two ends of the FPC board 10 are respectively connected to the PCB board and the connector 11. The PCB board 12 can also be electrically connected to the base plate 3 via a second FPC board 9. Further, Figure 1 The optical axis ax of the module is also shown in the image. Figure 2 It shows Figure 1 The diagram shows a three-dimensional appearance of the gimbal stabilization structure. In this solution, when the mobile phone camera module shakes and tilts, current is supplied to the coil 7 installed on the optical lens 1 based on the information fed back by the detection system. Due to the magnetic force between the coil 7 and the magnet 6, the entire lens can be driven to tilt in the opposite direction of the shaking, thereby compensating for the original shaking of the lens and improving the image quality. Although this existing solution can drive the entire module to move for stabilization, it has several problems: (1) The driving force between the magnet and the coil is limited. As the number of lenses in the mobile phone lens increases, the weight of the lens also gradually increases, and the driving force provided by the magnet and the coil is insufficient. (2) The spring or spring sheet needs to suspend the entire module structure on the fixed frame. At the same time, it is also necessary to energize the coil installed on the lens through the spring. This places high demands on the spring, which increases the overall design difficulty and cost. (3) The circuit board and the photosensitive chip bonded to the circuit board need to be energized through a flexible circuit board, and the connection point (or connector) on the flexible circuit board will be fixed to the motherboard of the terminal device (such as a mobile phone). During the process of the drive device driving the entire module to move, the connection between the circuit board body (i.e., rigid board) and the flexible board will be frequently subjected to force, which will cause poor contact between the flexible board and the circuit board body. Sometimes, the connection between the flexible board and the circuit board body will even break, which will seriously affect the normal operation of the module. Summary of the Invention

[0010] The purpose of this invention is to overcome the shortcomings of the prior art and provide a miniaturized camera module gimbal stabilization solution.

[0011] To address the aforementioned technical problems, the present invention provides a camera module with a gimbal, comprising: a module body including a lens assembly and a photosensitive assembly; and a gimbal structure including an outer frame disposed outside the module body, an SMA cable suspending the module body inside the outer frame, and a driving device disposed on the outer frame and the module body; wherein, in non-stabilized mode, the SMA cable is in a first state to support the module body; and in stabilized mode, the SMA cable is energized and heated to induce a shape memory effect, causing the SMA cable to change from the first state to a second state, and, compared to the first state, the SMA cable in the second state can reduce the resistance of the driving device in moving the module body.

[0012] The driving device includes a coil disposed inside the outer frame and a magnet or coil disposed outside the module body.

[0013] The two ends of the SMA line are respectively connected to the outer frame and the module body, and the end of the SMA line connected to the outer frame is higher than the end connected to the module body.

[0014] From a top-down view, the two ends of the SMA line are respectively connected to the midpoint of the side of the outer frame and the midpoint of the side of the module body.

[0015] From a top-down perspective, both the outer frame and the module body are rectangular in shape. The two ends of the SMA line connect the first vertex of the outer frame and the second vertex of the module body, respectively. The second vertex is the adjacent vertex of the first vertex at the corresponding vertex of the module body.

[0016] When the module body jitters in the direction of rotation around the z-axis, the current magnitude of the SMA line is changed to extend or contract the SMA line, thereby driving the module body to move in the direction of rotation around the z-axis to compensate for the jitter of the module body; wherein the z-axis is parallel to the optical axis direction of the camera module body.

[0017] The SMA wire is rigid at room temperature; and when the current flowing through the SMA wire exceeds a preset threshold, the SMA wire undergoes an austenitic phase transformation and is in a relaxed state in the austenitic phase.

[0018] The SMA line has a rigid mode, a stretching mode, and a softening mode; in the rigid mode, the SMA line is rigid; in the stretching mode, the SMA line can achieve controlled stretching based on the current magnitude; and in the softening mode, the SMA line is softened.

[0019] In the softening mode, the current supplied to the SMA line is greater than the current supplied to the SMA line in the stretching mode; in the stretching mode, the current supplied to the SMA line is greater than the current supplied to the SMA line in the rigid mode.

[0020] The outer frame includes a base plate and a fixed frame fixed to the edge region of the base plate, the fixed frame surrounding the module body.

[0021] The base plate and the bottom surface of the module body have a damping structure or damping material.

[0022] The base plate is a PCB board.

[0023] The photosensitive component includes a circuit board, a photosensitive chip mounted on the circuit board, a lens mount mounted on the circuit board and disposed around the photosensitive chip, and a filter mounted on the lens mount and located above the photosensitive chip.

[0024] The circuit board includes a circuit board body and a flexible connecting strip connected to the circuit board body. The outer frame has a through hole on its side, and the flexible connecting strip passes through the through hole.

[0025] The flexible connecting strip has a hollow structure; wherein the hollow structure is a strip-shaped slit, and the length direction of the strip-shaped slit is consistent with the length direction of the flexible connecting strip.

[0026] The flexible connecting strip is bent and folded.

[0027] The circuit board body is a PCB board, and the flexible connecting strip is an FPC board.

[0028] The lens assembly includes an optical lens and a motor, wherein the optical lens is mounted inside the motor, and the motor is adapted to move the optical lens in the z-axis direction to achieve focusing.

[0029] During the image stabilization process, the coil mounted on the outer frame is energized to apply electromagnetic force to the corresponding magnet or coil mounted on the module body, thereby driving the module body to move in the direction of rotation around the x-axis and / or around the y-axis to correct the jitter of the module body. The x-axis and the y-axis are two coordinate axes perpendicular to the optical axis of the camera module, and the x-axis and the y-axis are perpendicular to each other.

[0030] Compared with the prior art, this application has at least one of the following technical effects:

[0031] 1. This application can achieve large-stroke image stabilization, making photos clearer in sports scenes and low-light scenes.

[0032] 2. In some embodiments of this application, SMA lines are used instead of the suspension structure (e.g., the suspension wire in a traditional OIS system) in the traditional image stabilization structure. By passing a set current through the SMA lines, the SMA lines can undergo a shape memory effect and change from a first state to a second state, thereby effectively reducing the resistance of the suspension structure to the image stabilization movement. This helps to achieve a large stroke image stabilization effect with a smaller electromagnetic driving force, and thus realizes the miniaturization of the gimbal image stabilization structure.

[0033] 3. In some embodiments of this application, the overall movement of the module body can be achieved quickly and accurately.

[0034] 4. In some embodiments of this application, the SMA line can provide a portion of the auxiliary driving force (e.g., provide a portion of the auxiliary driving force for the electromagnetic drive device), thereby increasing the total driving force in one or more directions of movement and helping to achieve a large-stroke anti-shake effect.

[0035] 5. In some embodiments of this application, the SMA line can provide driving force in one or more directions of movement, thereby simplifying the gimbal structure and miniaturizing the gimbal stabilization structure.

[0036] 6. In some embodiments of this application, the gimbal stabilization structure is simple and less susceptible to interference from external magnetic fields.

[0037] 7. In some embodiments of this application, a structure is provided to effectively overcome the resistance between the rigid and flexible circuit boards, reduce the motion resistance of the overall module structure, thereby reducing the driving force requirement for moving the module body and helping to achieve miniaturization of the gimbal stabilization structure.

[0038] 8. In some embodiments of this application, a damping structure or damping material can be provided between the base plate and the module body. The damping structure or damping material can play an auxiliary support role for the module body, thereby suspending the module body in the fixed frame. A certain amount of space can be left between the fixed frame and the module body, so that the module body can perform correction work inside its fixed frame. Attached Figure Description

[0039] Figure 1 A schematic diagram of a gimbal stabilization structure in the prior art is shown;

[0040] Figure 2 It shows Figure 1 A three-dimensional schematic diagram of the gimbal stabilization structure shown;

[0041] Figure 3 A schematic diagram of a camera module with a gimbal in one embodiment of this application is shown;

[0042] Figure 4a This invention provides a schematic diagram showing the positional relationship between the module body, the fixed frame, and the SMA line from a top-down perspective in one embodiment of the present application.

[0043] Figure 4b This invention provides a schematic diagram showing the positional relationship between the module body, the fixed frame, and the SMA line from a top-down perspective in another embodiment of the present application.

[0044] Figure 5 A schematic diagram of the module body in one embodiment of this application is shown;

[0045] Figure 6 A schematic diagram showing the position and connection method between the outer frame and the module body in one embodiment of this application is provided.

[0046] Figure 7 A perspective view of an improved flexible printed circuit board (FPCB) camera module according to an embodiment of this application is shown;

[0047] Figure 8 This illustration shows a schematic diagram of a gimbal structure used to correct the jitter of the module body when tilting left and right in one embodiment of this application.

[0048] Figure 9a A schematic diagram of a gimbal structure using an SMA cable as a drive device, according to another embodiment of this application, is shown.

[0049] Figure 9b This illustrates the arrangement of four SMA lines in a top-down view in yet another embodiment of this application;

[0050] Figure 10a A schematic diagram of an SMA wire and connector according to one embodiment of this application is shown;

[0051] Figure 10b A schematic diagram of a curved SMA line in another embodiment of this application is shown;

[0052] Figure 11 A perspective view of a camera module with a gimbal structure according to one embodiment of this application is shown;

[0053] Figure 12 A schematic diagram of the bending of the flexible connecting strip in another embodiment of this application is shown;

[0054] Figure 13a A comparative example of a flexible connecting strip design is shown;

[0055] Figure 13b An improved version of the flexible connecting strip in yet another preferred embodiment of this application is shown. Detailed Implementation

[0056] To better understand this application, various aspects of this application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of this application and are not intended to limit the scope of this application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0057] It should be noted that in this specification, the terms "first," "second," etc., are used only to distinguish one feature from another and do not imply any limitation on the features. Therefore, without departing from the teachings of this application, the first subject discussed below may also be referred to as the second subject.

[0058] In the accompanying drawings, the thickness, size, and shape of the objects have been slightly exaggerated for ease of illustration. The drawings are for illustrative purposes only and are not drawn to scale.

[0059] It should also be understood that the terms "comprising," "including," "having," "containing," and / or "comprising," when used in this specification, indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed feature, not individual elements in the list. Additionally, when describing embodiments of this application, the word "may" is used to mean "one or more embodiments of this application." And the term "exemplary" is intended to refer to an example or illustration.

[0060] As used herein, the terms “basically,” “approximately,” and similar terms are used as terms of approximation rather than terms of degree, and are intended to describe inherent biases in measured or calculated values ​​that will be recognized by those skilled in the art.

[0061] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms (e.g., those defined in common dictionaries) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0062] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0063] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0064] Figure 3 A schematic diagram of a camera module with a gimbal is shown in one embodiment of this application. In this embodiment, the camera module with a gimbal includes a gimbal structure and a module body 18, which can be a common, existing camera module. (Reference) Figure 3The module body 18 may include an optical lens 1 and a photosensitive component. The photosensitive component may include a circuit board 4, a photosensitive chip 5 mounted on the circuit board 4, a lens mount 19 mounted on the circuit board 4 and disposed around the photosensitive chip 5, and a filter 15 (e.g., an IR filter) mounted on the lens mount 19 and located above the photosensitive chip 5. The bottom surface of the optical lens 1 may be mounted on the top surface of the lens mount 19, thereby assembling the optical lens 1 and the photosensitive component together to form the module body. It should be noted that in another embodiment of this application, the lens mount 19 may include a color filter mount and a lens mount that are independent of each other, wherein the color filter mount is used to mount a color filter, and the lens mount is used to mount an optical lens. The bottom of the lens mount may surround the outer periphery of the color filter mount, and the bottom surface of the lens mount may be directly mounted on the surface of the circuit board 4. Further, in this embodiment, the gimbal structure includes an outer frame disposed outside the module body, an SMA wire 13 (SMA is an abbreviation for shape memory alloy) suspending the module body inside the outer frame, and coils 7 and magnets 6 respectively disposed inside the outer frame and outside the module body. The magnet 6 can be a permanent magnet. The outer frame may include a base plate 3 and a fixed frame 2 mounted on the edge of the base plate 3. The fixed frame 2 surrounds the module body 18 and has a certain gap with the module body 18. The two ends of the SMA wire 13 are respectively connected to the fixed frame 2 and the module body 18. The base plate 3 can be a PCB board. The bottom surface of the base plate 3 can be provided with a metal contact array, and the base plate 3 can contact and electrically connect with the motherboard of a terminal device (e.g., a mobile phone). The interior of the base plate 3 can have electronic circuitry (its manufacturing method is similar to that of the circuit board in the module body 18, for example, it can be manufactured using PCB board manufacturing processes). The internal circuitry of the base plate 3 can supply current to the coils to generate the required magnetic field. In this embodiment, the base plate 3 is connected to the terminal device via a metal contact array at its bottom. Of course, the invention is not limited to the contact array connection method; for example, in other embodiments, flexible circuit boards or metal wires can also be used to connect the base plate to the terminal device to supply the coil's operating current. In this embodiment, the fixing frame 2 is connected to the edge of the base plate 3, and can be fixed by adhesive bonding or by molding. In this embodiment, the main function of the fixing frame 2 is to fix the driving device and simultaneously house the driving device and module body 18 within it, thus providing protection. The fixing frame 2 is generally hollow, with its lower surface directly fixed to the edge area of ​​the base plate 3. The size of the opening at the bottom of the fixing frame 2 is adapted to the area of ​​the base plate 3. The top of the fixing frame 2 has an opening adapted to the aperture size of the optical lens 1; this opening can be square.Furthermore, a cover plate 14 can be installed at the opening at the top of the fixing frame 2. The area of ​​this cover plate 14 is adapted to the area of ​​the square opening so that the cover plate 14 can be accommodated in the square opening and completely cover it. The main function of the cover plate 14 is to protect the optical lens of the module body, and it is also used to transmit light. Therefore, when selecting the material for making the cover plate, a transparent material with high hardness and good light transmittance is generally chosen. It should be noted that the shape of the opening at the top of the fixing frame is not limited to square, as long as the shape of the opening matches the shape of the lens.

[0065] Furthermore, in one embodiment of this application, a coil structure is fixed to the inner side of the fixed frame 2. This structure consists of a metal core and metal wires wound around it. Corresponding circuitry is provided inside the fixed frame 2, allowing energization of the coil 7 at the connection point with the coil structure to ensure the normal operation of the coil 7. This coil structure can be located at the center of the inner side of the fixed frame 2 or on the side of the fixed frame, depending on the actual design. The fixed frame 2 is also connected to an SMA line 13, which is also energized through circuitry inside the fixed frame 2. One end of the SMA line 13 is connected to the inner side of the fixed frame 2, and the other end is connected to the optical lens of the module body. The SMA line 13 suspends the module body 18, overcoming its own weight, and also reduces the power required by the drive device when the entire module moves. Furthermore, to drive the module body 18 to move as a whole, a corresponding coil structure is configured on the outside of the module body 18. The SMA wire 13 can be connected to the coil structure to provide the working current to the coil structure. Due to its inherent characteristics, the SMA material's hardness decreases due to temperature changes when energized. Therefore, during the movement of the module body 18, the resistance of the SMA wire itself to the movement of the module body 18 can be significantly reduced. Further, in this embodiment, a permanent magnet can be installed on the outer surface of the module body 18. This permanent magnet matches the coil installed on the inner surface of the fixed frame. When currents of different magnitudes and directions pass through the coil, electromagnetic forces of different magnitudes and directions can be applied to the permanent magnet, thereby driving the module body to move a corresponding distance in a set direction, achieving jitter correction and thus achieving anti-shake effect. Specifically, in one embodiment, four permanent magnets can be fixed around the module body 18, respectively positioned at the front, back, left, and right. Correspondingly, four coil structures can be fixed to the fixed frame 2. These four coil structures are respectively positioned in the front, back, left, and right directions, and correspond to the four permanent magnets. In this way, by adjusting the magnitude and direction of the current in the four coil structures, electromagnetic forces of different magnitudes and directions can be applied to the four permanent magnets, thereby driving the module body to move a corresponding distance in the set direction.

[0066] Furthermore, in the above embodiments, the SMA wire can possess a certain rigidity at room temperature, allowing it to replace the springs or suspension wires in traditional OIS devices (such as voice coil motors used to drive lens movement) and provide support for the module body. When gimbal stabilization is activated, the SMA wire can be energized, causing its temperature to rise and inducing a shape memory effect. This results in a high-temperature austenitic phase transformation, causing the SMA wire to stretch and relax. Specifically, the SMA wire has a martensitic and austenitic phase. During SMA wire processing, the SMA material can be processed into a second state (or second shape) under the high-temperature austenitic phase, and then processed into a first state (or first shape) under the relatively low-temperature (e.g., room temperature) martensitic phase, thus forming an SMA wire with a certain rigidity. In this way, at room temperature, the camera module can be in non-stabilized mode, where the SMA wire is in the first state to support the module body. In image stabilization mode, the SMA wires are energized and heated, inducing a shape memory effect that causes them to transition from a first state to a second state. By making the SMA wires in the second state more flexible than those in the first state during SMA material processing, the resistance to movement of the module body can be reduced. For example, when the electromagnetic force generated by the interaction of the coil and magnet drives the module body, the resistance from the SMA wires to the electromagnetic driving force during image stabilization movement is significantly weakened due to the softening of the SMA material. Therefore, with the same electromagnetic driving force, the above embodiment can achieve a greater image stabilization stroke. Conversely, with the same image stabilization stroke, the volume of the coil and magnet can be reduced because the required electromagnetic driving force is smaller, thus helping to miniaturize the camera module. In contrast, in traditional motors (such as voice coil motors used to drive lens movement), the carrier or lens is typically suspended in an outer frame (such as the motor housing) using springs or springs. In this approach, during image stabilization, as the lens moves, the electromagnetic driving force needs to overcome the resistance generated by the deformation of the springs or springs, thus requiring a larger driving force from the drive device.

[0067] It should be noted that while the above embodiments utilize austenitic phase transformation to change the SMA line from the first state to the second state, this method is not unique. For example, in another embodiment of this application, the stretching effect of the SMA line in the martensitic phase can be used to reduce the resistance to module body movement. In the martensitic phase, the SMA line contracts as the temperature rises and stretches as the temperature falls. Therefore, when the camera module is in image stabilization mode, the temperature of the SMA line can be increased by energizing it, inducing a shape memory effect and causing the SMA line to contract, thereby controlling the movement of the module body to a certain extent. When the direction of SMA line contraction is consistent with the driving direction of the electromagnetic drive device, the resistance to module body movement can be reduced. In this embodiment, the non-image stabilization mode is at room temperature. At this time, the SMA line with the first length can be understood as the first state of the SMA line, and the state after the SMA line contracts due to energization and heating can be understood as the second state of the SMA line. By utilizing the stretching effect of the SMA line in the martensitic phase to cause the SMA line to change from the first state to the second state, the resistance to module body movement can be reduced, thereby reducing the driving force required by the electromagnetic drive device.

[0068] Furthermore, Figure 4a This diagram illustrates the positional relationship between the module body 18, the fixed frame 2, and the SMA13 line from a top-down view in one embodiment of this application. (Reference) Figure 4a In this embodiment, the module body 18 is suspended inside the fixed frame 2 by an SMA line 13. One end of the SMA line 13 is connected to the middle position of the side of the fixed frame 2 (the side of the fixed frame can be the side of the top surface of the fixed frame), and the other end is connected to the module body. From a top-down view, the SMA line connects to the midpoint of the side of the module body. Further, in this embodiment, the end of the SMA line 13 connected to the fixed frame 2 can be higher than the end connected to the module body 18, so that the SMA line 13 suspends the module body 18 inside the fixed frame 2. From a front-view view, the connection end of the SMA line 13 to the module body can be located at the top of the module body 18 (e.g., refer to...). Figure 3The SMA line 13 can be located on the shoulder of the module body 18 or at other positions on the module body 18, as long as the connection position between the SMA line 13 and the module body 18 is lower than the connection position between the SMA line 13 and the fixed frame 2. Since the SMA line 13 suspends the module body 18 inside the fixed frame 2, when the module shakes or tilts during shooting, the coil installed on the same side of the SMA line 13 and the coil (or magnet) installed on the module body can work together to drive the module body 18 to move in the opposite direction, correcting the module's position and effectively improving the module's image quality. This connection method can correct the tilt angle of the module body 18. The correction of the tilt angle of the module body 18 includes left-right tilt correction and pitch tilt correction. For ease of description, a three-dimensional rectangular coordinate system (xyz) is established. The z-axis is parallel to the optical axis of the camera module, i.e., the z-axis direction is... Figure 3 The vertical direction in the diagram refers to the direction of the axis ax. The x-axis and y-axis are two coordinate axes perpendicular to the z-axis, and they are mutually perpendicular. In this embodiment, rotation around the x-axis is for pitch adjustment, and rotation around the y-axis is for lateral tilt adjustment. Further details will be provided below. Figure 8 The corresponding embodiments further describe the correction of the tilt angle of the module body.

[0069] Figure 4b This diagram illustrates the positional relationship of the module body 18, the fixed frame 2, and the SMA line 13 from a top-down view in another embodiment of this application. (See reference) Figure 4b In this embodiment, one end of the SMA line 13 is fixed to the first vertex A of the fixed frame 2 (i.e., the junction of the two sides of the upper surface of the fixed frame), and the other end is fixed to the second vertex B of the module body 18 (the junction of the two sides of the module body shell). The second vertex B is the adjacent vertex of the first vertex A in the module body to its corresponding vertex A'. In this application, for the module body 18 and the fixed frame 2, which have a rectangular top view, any vertex in the rectangle has two adjacent vertices and one diagonal vertex. In this embodiment, the second vertex is not the corresponding vertex of the first vertex in the module body, but rather an adjacent vertex. Further, in this embodiment, the end of the SMA line connected to the fixed frame can be higher than the end connected to the module body, so that the SMA line suspends the module body inside the fixed frame. Figure 3 A spatial rectangular coordinate system is established with the axis ax in the middle and the Z-axis in the middle. This connection method not only allows for the adjustment of the module body's left, right, and pitch, but also enables the correction of rotation around the Z-axis. The Z-axis is parallel to the optical axis of the camera module, and the optical axis direction is... Figure 3The axis in the diagram is ax. The x-axis and y-axis are two coordinate axes perpendicular to the z-axis, and they are mutually perpendicular. In this embodiment, the rotation direction around the x-axis is for pitch adjustment, and the rotation direction around the y-axis is for left and right tilt adjustment. In this embodiment, when the SMA line contracts, the SMA line can drive the module body to rotate around the z-axis, thereby achieving anti-shake correction in this rotation direction. As for the rotation correction angle, it can be adjusted by controlling the current flowing through the SMA line, which will not be elaborated here. SMA material has good fatigue resistance and can be stretched multiple times without changing its material properties. Therefore, the frequent contraction and expansion of this alloy material will not affect its correction accuracy.

[0070] Furthermore, in one embodiment of this application, based on such Figure 4b The structure and SMA wire connection shown allow for multiple operating modes to be set for the SMA wire. For example, rigid mode, telescopic mode, and softening mode can be set. In rigid mode, no current can be supplied to the SMA wire, or only a small current can be supplied, giving the SMA wire a certain rigidity to support the module body. In telescopic mode, a working current can be supplied to the SMA wire, allowing the SMA wire to expand and contract in a controlled manner based on the current magnitude, thereby driving the module body to rotate around the z-axis to compensate for jitter in that direction. The working current is typically greater than the current in rigid mode. In softening mode, a large current can be supplied to the SMA wire, causing it to undergo a high-temperature austenitic phase transformation. The SMA wire can stretch and soften, thus putting it in a relaxed state. In this state, due to the significantly reduced resistance of the SMA wire, the coil and magnet can drive the module body to move a large distance.

[0071] It should be noted that the SMA line in this application is not limited to Figure 4a and Figure 4b These are the two connection methods shown. In other embodiments of this application, the SMA line can also be selected with other different connection methods, and different connection methods can achieve different functions. Those skilled in the art can choose to use them according to the actual design.

[0072] Furthermore, Figure 5 A schematic diagram of the module body in one embodiment of this application is shown. (Reference) Figure 5 In this embodiment, the module body 18 includes a circuit board 4, a photosensitive chip 5, a filter 15, a bracket (i.e., a lens mount 19), and an optical lens assembly 1a. The optical lens assembly 1a may include a voice coil motor for driving lens focusing and an optical lens mounted within the motor. Figure 5(The specific structure of the optical lens assembly 1a is not shown in the diagram). To further reduce the height and weight of the camera module, in this embodiment, the bracket is preferably formed using a molding process. Specifically, the bracket can be a molded bracket directly molded onto the surface of the circuit board 4. When installing the filter 15, the gold wire 19a of the photosensitive chip 5 and the circuit board 4 can be directly molded into its bracket (i.e., the lens mount 19), thereby protecting components such as the gold wire 19a. At the same time, directly molding the bracket for mounting the filter 15 onto the surface of the circuit board can also effectively reduce the height of the module; it can also solve various problems that arise during the installation process of traditional pre-molded brackets, such as bracket tilting and glue cracking. It should be noted that in another embodiment of this application, the lens mount 19 can include a color filter mount and a lens mount that are independent of each other, wherein the color filter mount is used to install the color filter, and the lens mount is used to install the optical lens. The bottom of the lens mount can surround the outer periphery of the color filter mount, and the bottom surface of the lens mount can be directly mounted on the surface of the circuit board 4. Furthermore, in this embodiment, the module body 18 itself can achieve focusing. Specifically, the optical lens can be fixed together with the motor carrier, and can achieve focusing under the drive of the motor. During the shooting process, the motor can drive the lens to move in the vertical direction (that is, in the same direction as the optical axis), making the module's image clearer, thereby effectively improving the module's image quality.

[0073] In this embodiment, the gimbal stabilization structure uses an electromagnetic drive device fixed to the outside of the module body 18. When the coil inside the fixed frame is energized, an interaction force is generated between the coil and the magnet 6 (which can also be replaced by a coil) installed on the outer side of the module body 18. The adjustment direction can be adjusted as needed, and the direction and magnitude of the current flowing into the coil can be changed. With the cooperation of the coil in the external frame, the position correction of the module body in different directions can be achieved.

[0074] Figure 6 This diagram illustrates the position and connection method between the outer frame and the module body in one embodiment of this application. Unlike existing gimbal structures, in this embodiment, a damping structure (e.g., [missing information]) can be provided between the base plate 3 and the circuit board 4 (mainly referring to the rigid board 12 that forms the main body of the circuit board 4; the rigid board 12 can be a PCB board). Figure 6 The spring 16 in the middle mainly functions to reduce module vibration, and also supports the module body 18 and reduces the impact on the SMA line 13 (refer to the reference). Figure 3The tension of the SMA cable 13 is used to provide a damping effect. In this embodiment, an elastic element can be used as a damping structure. This elastic element can be a spring 16. A spring 16 with a suitable elastic coefficient can provide a certain auxiliary support for the module body 18. In addition, by using the spring 16 to separate the bottom of the module body 18 and the top surface of the base plate 3 by a certain space, the module will not be obstructed by the base plate when it moves. In this embodiment, by using the tension of the SMA cable 13 and the auxiliary support of the spring 16, the module body 18 can be suspended in the fixed frame 2, and a certain amount of space can be left between the fixed frame 2 and the module body 18, so that the module body 18 can perform correction work inside its fixed frame 2. Furthermore, due to the auxiliary support of the spring 16, the requirements for the rigidity of the SMA cable itself or the support or driving force provided by the SMA cable can be reduced, making it easier for the SMA cable to enter the softened working state, thereby reducing the resistance formed by the SMA cable 13 to the electromagnetic drive in the electromagnetic drive mode. In traditional optical image stabilization designs, springs or springs 8 (see reference) are often used. Figure 1 The module body (or optical lens) is suspended within the outer frame. However, the deformation of the spring or spring itself generates a counterforce that resists this deformation. This counterforce sometimes acts in the opposite direction to the electromagnetic force used to drive the module body (or optical lens) to move, thus hindering the correction of the module body (or optical lens). In this embodiment, since the SMA line 13 can be softened or relaxed, the resistance generated by the electromagnetic drive is significantly reduced. Furthermore, because the resistance to the electromagnetic drive can be greatly reduced, the module body 18 is essentially suspended within the fixed frame 2. The electromagnetic drive device applies less driving force to the module body 18 to achieve its movement, thus simplifying the structural design of the drive device. In this embodiment, the spring 16, as a damping structure, only needs to separate the module body from the base plate. The spring 16 itself does not require complex materials; existing springs can meet the design requirements, thus effectively reducing the cost of the gimbal structure. It should be noted that in other embodiments, the damping structure may be implemented in a manner other than a spring, or the damping structure may be replaced by a flexible material or other types of damping material.

[0075] Furthermore, in one embodiment of this application, Figure 7 A perspective view of an improved flexible printed circuit board (FPCB) camera module according to one embodiment of this application is shown. (Reference) Figure 7 The circuit board 4 of the module body 18 (refer to the reference) Figure 5 and Figure 6The circuit board 10 can include a rigid board 12, a flexible board 10, and a connector 11. The rigid board 12 can be a PCB (or PCB board), and the flexible board 10 can be an FPC (or FPC board). The flexible board can act as a flexible connecting strip to lead the circuitry out of the external frame and connect to the motherboard of the terminal device (e.g., a mobile phone) via the connector 11, thereby enabling the photosensitive chip and the circuit board to achieve circuit connection with the motherboard of the terminal device and provide current for the module to operate. In this embodiment, a through hole 17 is provided on the side of the fixed frame corresponding to the flexible board of the circuit board. The flexible board 10 of the circuit board 4 can pass through this through hole 17, and the width of this through hole 17 is greater than the width of the flexible board 10 of the circuit board 4, so that when the rigid board 12 of the circuit board 4 moves, the flexible board 10 connected to it will not hinder its movement or the resistance caused by the flexible board 10 can be significantly reduced. For example, when the rigid board 12 is tilted, the flexible board 10 will twist relative to the rigid board 12, thereby forming a reverse torque. In particular, if the width of the through hole 17 is too small, the torsional deformation of the flexible board 10 will be concentrated in a small section between the through hole 17 and the rigid board 12, thus generating a larger torque and creating greater resistance to the pitch and tilt adjustment of the rigid board 12. Therefore, the width of the through hole 17 is greater than the width of the flexible board 10 of the circuit board 4, which can significantly reduce or eliminate the resistance of the flexible board 10 to the movement of the rigid board 12.

[0076] Furthermore, in this embodiment, the flexible plate 10 may have a gap 10a in the middle, that is, a gap 10a can be formed by hollowing out the center of the flexible plate 10. The length direction of the gap 10a can be substantially parallel to the long side direction of the flexible plate 10. This design can reduce the resistance formed by the flexible plate 10 to the movement of the module body 18. For example, when the rigid plate 12 is adjusted for pitch, the flexible plate 10 will twist relative to the rigid plate 12, thereby forming a reverse torque. By providing a gap 10a in the middle of the flexible plate 10, the torque formed by the flexible plate 10 when the rigid plate 12 is adjusted for pitch can be reduced, thereby significantly weakening or eliminating the resistance of the flexible plate 10 to the movement of the rigid plate 12. It should be noted that in other embodiments of this application, the gap 10a can also be replaced by a hollow structure of other shapes.

[0077] Furthermore, in one embodiment, the flexible printed circuit boards (FPCBs) can be stacked to reduce the resistance they create to the movement of the module body. Stacking design refers to bending and folding the FPCBs (see reference...). Figure 7 This design avoids the flexible circuit board's ends from being pulled and stretched by the rigid circuit board and the motherboard connection points, thus leaving more free space for the module body to move. The folding points of the flexible circuit board have smooth, natural transition sections to prevent poor contact at the folding points.

[0078] In the above embodiments of this application, the provided gimbal stabilization structure utilizes the tensile effect of SMA metal wires and the damping structure between circuit boards. A common driving device can be used to drive the movement of a relatively large module. Furthermore, due to the elasticity of the selected spring, the module body can return to its initial position after the correction action is completed. This solution adds a fixed external frame in the horizontal direction of the module, and the driving action is achieved through the cooperation of components located on the sides of the external frame and the module body. This simplifies the design and does not significantly affect the overall height of the camera module, thus offering the advantage of miniaturization.

[0079] Furthermore, Figure 8 This diagram illustrates a method for correcting the left-right tilt of the module body using a gimbal structure in one embodiment of this application. (See reference) Figure 8 In this embodiment, the y-axis direction is perpendicular to the plane of the paper. The left and right tilting directions are rotations around the y-axis direction, which can be denoted as the Ry direction. Figure 8 Part (a) shows a schematic diagram of module body jitter, indicating that the module body jitters counterclockwise around the y-axis. To ensure the module's imaging quality is not affected, compensation needs to be applied to the module body in the opposite direction of the jitter; therefore, the force applied by the driving device is as follows: Figure 8 As shown in section (b), the magnet fixed to the left side of the module body experiences an upward force (F1), while the magnet fixed to the right side of the module body 18 experiences a downward force (F2), causing the module body to rotate clockwise around the y-axis. Note that... Figure 8 Part (b) is schematic and is only used to show the direction of the driving force required by the drive unit and the rotation direction of the module body. When the corresponding current is passed through the coil, the module body can be subjected to... Figure 8 The forces in part (b) are directed as shown, and occur as follows: Figure 8 The adjustment of the direction shown in part (b) ultimately achieves the correction of left and right tilt during shooting. Furthermore, Figure 8 Part (c) shows the state after correction. The above briefly introduced the correction of jitter in the Ry direction. The principle of position adjustment in the Rx direction is the same as that of Ry direction adjustment. When the module body is jittered and tilts in the pitch direction (i.e., the Rx direction), a corresponding current is passed through the coil driving the Rx direction, so that the magnets on the front and rear sides of the module body are subjected to a force opposite to the Rx jitter direction, thus correcting the jitter and improving the imaging quality of the module body.

[0080] It should be noted that in some embodiments of this application, the SMA cable can be used solely to support the module body, replacing the spring clips in a traditional gimbal structure (or motor), thereby helping to increase the stabilization stroke and reduce the size of the gimbal structure. In other embodiments, the SMA cable can not only suspend the module body but also provide some driving force. For example, the SMA material itself can generate corresponding contraction or expansion when energized, thus providing a certain auxiliary effect to the driving device. This makes this application applicable to module bodies with large images or glass lenses, which are of greater mass, in line with the current trend in camera module development.

[0081] Furthermore, the following describes in more detail a series of specific structures of the camera module with gimbal of this application, in conjunction with a series of embodiments.

[0082] According to another embodiment of this application, in the camera module with a gimbal structure, the electromagnetic drive device of the gimbal structure can be eliminated, and the SMA line can be used directly to provide the driving force for the module body. Figure 9a A schematic diagram of a gimbal structure using an SMA cable as a drive device, according to another embodiment of this application, is shown. (Reference) Figure 9aIn this embodiment, the gimbal structure includes a fixed frame, an annular upper connector 20a and a lower connector 20b, and multiple (e.g., four) first SMA lines 13a (or upper SMA lines) connecting the upper connector 20a to the fixed frame 2, and multiple (e.g., four) second SMA lines 13b (or lower SMA lines) connecting the lower connector 20b to the fixed frame 2. The upper connector 20a is used to fix the lens assembly of the module body 18, and its shape can be adapted to the lens assembly. For example, if the top of the lens barrel assembly is circular, then the upper connector 20a can be annular. The lower connector 20b is used to fix the photosensitive assembly of the module body 18, and its shape can be adapted to the photosensitive assembly. For example, if the bottom of the photosensitive assembly is rectangular, then the lower connector 20b can be rectangular. Furthermore, in this embodiment, the upper connector 20a can be attached to the top surface of the lens assembly, and the lower connector 20b can be attached to the outer surface of the photosensitive assembly (in other embodiments, the lower connector can be attached to the bottom surface of the photosensitive assembly, or to both the outer and bottom surfaces of the photosensitive assembly). In this embodiment, the superelasticity of the SMA material can be directly utilized to drive the module body. Specifically, by introducing the SMA wires into the martensitic phase and passing different currents through them, the temperature can be raised to different levels. Based on the superelasticity of the SMA material, the SMA wires can contract as the temperature increases, thereby generating a corresponding tensile force on the module body. In this embodiment, four SMA wires (i.e., upper SMA wires) connecting the outer frame and the upper connector can be set in four different directions. In the initial state, the SMA wires suspend the entire module structure inside the fixed frame, and the module is in a balanced state. When performing image stabilization, current can be applied to one or more SMA lines, causing them to contract and tilt the module body relative to the outer frame at a certain angle to correct camera module shake. Furthermore, by setting an appropriate current magnitude, the tilt direction and angle can be adjusted to accurately move the module body and correct camera module shake. Figure 9b This illustrates the arrangement of four SMA lines in a top-down view in yet another embodiment of this application. Specifically, refer to... Figure 9b In one example, the four SMA lines 13e, 13f, 13g, and 13h can be located in the front, rear, left, and right positions of the upper connector 20a, respectively. Thus, applying current to the left or right SMA lines 13e and 13f will cause them to contract, rotating the module body by a certain angle in the left-right swaying direction (the left-right swaying direction is the direction of rotation around the x-axis, which can be referenced). Figure 3(where the x-axis is a coordinate axis perpendicular to both the y-axis and z-axis); passing current through the front or rear SMA lines 13g and 13h causes them to contract, rotating the module body by a certain angle in the pitch direction (the pitch direction is the direction of rotation around the y-axis, and the direction of the y-axis can be referenced). Figure 3 By appropriately combining multiple SMA lines in different orientations and applying suitable current, the module body can be rotated to the desired angle simultaneously in both left-right and pitch directions, thus correcting camera module shake. Note that... Figure 9b The diagram only shows four upper SMA lines connected to the upper connector. These four upper SMA lines are sufficient to drive the module body to move and adjust its tilt angle. However, to increase the driving force, four lower SMA lines can also be provided. Further, in one embodiment, four SMA lines (i.e., lower SMA lines) connecting the outer frame and the lower connector can be provided in four different locations (e.g., front, rear, left, and right). When performing anti-shake function, the four lower SMA lines in different locations can work in conjunction with the corresponding upper SMA lines to drive the module body to move more quickly. For example, when the lower SMA line on the left and the upper SMA line on the right work simultaneously (i.e., both retract simultaneously), the torque on the rotating module body in the left-right sway direction can be increased, thereby driving the module body to move more quickly. Similarly, the lower SMA line on the right and the upper SMA line on the left can also work simultaneously (i.e., both retract simultaneously) to increase this torque. Furthermore, when the lower SMA line on the front side and the upper SMA line on the rear side work simultaneously (i.e., both contract simultaneously), the torque in the pitch and yaw direction can be increased, thereby driving the module body to move more quickly. The lower SMA line on the rear side and the upper SMA line on the front side can also work simultaneously (i.e., both contract simultaneously) to increase this torque. In this embodiment, the SMA lines can drive the module body to move quickly because the deformation force of the SMA lines is hundreds or even thousands of times greater than that of ordinary suspension wires. Simultaneously, the SMA material also has good fatigue resistance, allowing it to undergo multiple stretching operations without changing its material properties. It should be noted that... Figure 9b In this embodiment, four SMA lines are respectively positioned at the front, rear, left, and right of the connector, but this arrangement is merely illustrative. In other embodiments of this application, multiple SMA lines can also be positioned in multiple different locations as needed. For example, in... Figure 9a In the middle, the four upper SMA lines can be respectively set at the left front, right rear, right front, and left rear positions of the upper connector. By controlling the current magnitude of the upper SMA lines at these four positions, the tilt direction and tilt angle of the module body can also be adjusted, thereby accurately moving the module body and correcting the camera module shake.

[0083] Further, refer to Figure 9aIn one embodiment, the fixing frame may include cylindrical sidewalls fabricated using semiconductor technology. Specifically, the fixing base may have four sidewalls, which can be fabricated using semiconductor technology to arrange circuit structures inside or on the surface of the sidewalls. These circuit structures can be used to provide current to the coils and / or SMA lines. Alternatively, the fixing base may also be fabricated using a lamination process (i.e., a process similar to that used for PCB boards), with corresponding circuit structures inside. These internal circuit structures supply power to the coils and / or SMA lines connected to them, ensuring the normal operation of the drive structure. The top surface 2a of the fixing base may be covered with a transparent cover plate (e.g., a glass cover plate), protecting the module body inside the fixing base 2 while also providing a light-transmitting imaging channel for the module body. The bottom surface 2b of the fixing base 2 may be closed or open. In one embodiment, the bottom surface 2b of the fixing base 2 has a closed base plate, which can be made of semiconductor material. Electronic circuits can be arranged inside the base plate, providing drive current to the SMA lines, i.e., serving as a drive circuit for driving the extension and retraction of the SMA lines. In this embodiment, the base plate of the mounting bracket can be fixed to the surface of the motherboard of the electronic device and electrically connected to the motherboard. Here, the electronic device refers to an electronic device equipped with the camera module, such as a smartphone or tablet computer. The base plate of the mounting bracket can be bonded to the motherboard with an adhesive, or the two can be fixed by welding.

[0084] Still referencing Figure 9a In another embodiment, the bottom surface 2b of the mounting base 2 can be open, meaning the mounting base 2 can be a cylindrical body without a bottom plate. In this embodiment, the driving circuit for the SMA lines (including the first SMA line 13a and the second SMA line 13b) can be arranged on the side wall of the mounting base (the side wall structure of the mounting base can be formed using the semiconductor process and PCB board process described above). In this embodiment, the bottom of the side wall of the mounting base 2 (i.e., the root of the cylindrical body) can be directly fixed to the surface of the motherboard of the electronic device and electrically connected to the motherboard. Here, the electronic device refers to an electronic device equipped with the camera module, such as a smartphone or tablet computer. The bottom plate of the mounting base can be bonded to the motherboard using an adhesive, or the two can be fixed by welding. In this embodiment, since the mounting base has no bottom plate, it helps to reduce the height required by the camera module and gimbal structure, thereby helping to reduce the thickness of the electronic device (e.g., a smartphone or tablet computer).

[0085] Furthermore, Figure 10a A schematic diagram of an SMA cable and connector according to one embodiment of this application is shown. (Reference) Figure 10aIn this embodiment, the SMA wires can be divided into two groups, namely the first SMA wire 13a and the second SMA wire 13b. One end of the first SMA wire 13a is connected to the upper connector 20a, and the other end is connected to the fixing base 2 through the wiring point 13c (refer to the reference). Figure 9a One end of the second SMA line 13b is connected to the lower connector 20b, and the other end is connected to the mounting base 2 via the connection point 13d. In this embodiment, all SMA lines can be straight. The connection point can be connected to the mounting base to energize the SMA lines and suspend the module body on the mounting base.

[0086] Furthermore, Figure 10b A schematic diagram of a curved SMA line according to another embodiment of this application is shown. (Reference) Figure 10a and Figure 10b In this embodiment, it can be used Figure 10b The SMA line of the shape shown is replaced Figure 10a The SMA line in this embodiment is at least partially curved and folded. Because it has at least a partially curved and folded section, the SMA line contracts more noticeably when energized, making it more suitable for large-stroke drives. The curved and folded shape can be helical or spring-like.

[0087] Furthermore, still referencing Figure 9a In this embodiment, the photosensitive component of the module body 18 includes a circuit board 4, which includes a rigid board 12 and a flexible board 10. The rigid board 12 can be a PCB, and the flexible board 10 can be an FPC. One sidewall of the mounting base 2 may have a through hole 17, which serves as a clearance hole for the flexible board 10, allowing the flexible board 10 to pass through the mounting base 2. One end of the flexible board 10 is connected to the rigid board 12, and the other end can be plugged into the motherboard of an electronic device (e.g., a smartphone, tablet, etc.) via a connector 11, thereby achieving an electrical connection between the module body 18 and the motherboard. The module body can receive power and signals from the motherboard through the flexible board, so that the photosensitive chip and related components in the module body can perform their corresponding functions. Here, the module body includes a photosensitive chip and a lens assembly, and the lens assembly includes an optical lens and a motor located on the periphery of the optical lens. The motor can drive the optical lens to achieve a focusing function. In this embodiment, the motor built into the module body can be dedicated to autofocus and does not participate in image stabilization, thereby better ensuring the image quality of the module body. Furthermore, Figure 11 A perspective view of a camera module with a gimbal structure according to one embodiment of this application is shown. (Refer to reference...) Figure 11 The module body includes a photosensitive component 22 and a lens assembly 21. The photosensitive component 22 includes the circuit board 4, which includes a rigid board 12, a flexible board 10, and a connector 11. Figure 11 The three-dimensional shapes of the flexible circuit board 10 and connector 11 are schematically shown. The flexible circuit board 10 is strip-shaped and flexible. In this embodiment, the first SMA line 13a connects to the upper connector 20a, which is fixed to the top surface of the lens assembly 21. The second SMA line 13b connects to the lower connector 20b, which is fixed to the outer side of the photosensitive assembly 22.

[0088] Furthermore, in one embodiment of this application, the operating current of the internal circuitry of the mounting base can be provided through a contact array connecting the bottom of the mounting base and the main board. In this embodiment, the driving device for the gimbal structure is an SMA driving device, which is implemented by the two sets of SMA lines. The driving current is provided to the corresponding first SMA line and second SMA line. The first SMA line connected to the upper connector and the second SMA line connected to the lower connector can work independently or in combination. (Refer to reference...) Figure 10a When one or more SMA lines in a certain direction (for example, one or more of the four first SMA lines 13a, or one or more of the four second SMA lines 13b) are energized, the energized SMA lines will contract, thereby driving the module body to move in the corresponding direction to correct jitter (see the previous description for details, which will not be repeated here). In this embodiment, the operating current of the SMA lines can be provided by the mounting base, and the operating current of the module body can be provided by its circuit board. In this way, the driving circuit of the gimbal structure and the functional circuit of the photosensitive chip will not interfere with each other, which significantly improves the working efficiency of the entire module structure. Specifically, the driving circuit of the gimbal structure may need to provide a large driving current to the coil or SMA lines, so the driving circuit can have a large linewidth. The operating current of the photosensitive chip is relatively small, so the linewidth of its functional circuit can be smaller than that of the driving circuit of the gimbal structure. By setting the driving circuit of the gimbal structure and the functional circuit of the photosensitive chip separately in the mounting base and the circuit board, mutual interference between the two circuits can be avoided.

[0089] Furthermore, in one embodiment of this application, the flexible circuit board of the circuit board serves as a flexible connecting strip to connect the circuitry of the module body to the motherboard of the electronic device. This flexible connecting strip passes through a clearance hole located on the side wall of the mounting base. The flexible connecting strip can be pre-bent to reduce the resistance to the movement of the module body. Specifically, one end of the flexible circuit board is fixed to the rigid board of the circuit board (e.g., it can be fixed to the outer side of the rigid board), and the other end is fixed to the motherboard of the electronic device (e.g., a mobile phone) via a connector. Since the rigid board of the circuit board will move during the correction process, but the motherboard of the electronic device is fixed, the flexible circuit board connecting the two may generate some resistance to the movement of the rigid board, reducing the accuracy of the module body drive. By pre-bending the flexible circuit board, a certain amount of space can be reserved for the movement of the rigid board, thereby reducing the resistance of the flexible circuit board to the movement of the rigid board, and also avoiding the problem of poor contact between the connector and the motherboard of the electronic device caused by pulling the flexible circuit board when moving the rigid board.

[0090] Furthermore, Figure 12 A schematic diagram of the flexible connecting strip bending in another embodiment of this application is shown. Part (a) is a three-dimensional schematic diagram of the camera module before the flexible connecting strip is bent. Part (b) is a side view of the flexible connecting strip and its surrounding structure after bending. Reference Figure 12 The circuit board 4 may include a rigid board 12, a flexible board 10, and a connector 11. The flexible board 10, also known as a flexible connecting strip, passes through the through hole 17 of the mounting base 2. The flexible connecting strip can be bent, and the bent portion 10b is fixed to the side wall 2c of the mounting base 2. By adopting a design that bends the flexible board, it typically forms a bend. During reliability testing (e.g., drop testing) or when encountering impacts during use, the bend of the flexible board may experience significant displacement, causing it to collide with or scratch other components of the electronic device, increasing the risk of damage to the internal circuitry. In this embodiment, fixing the bend to the side wall (usually the outer side wall) of the mounting base can prevent damage to the internal circuitry of the flexible board and improve the overall reliability of the camera module during reliability testing.

[0091] Furthermore, in one embodiment of this application, the bending of the flexible connecting strip can be achieved using a hot-pressing process. When assembling the module body and the mounting base, the connecting strip can be bent using a hot-pressing process first. By applying adhesive or welding at the bend, the bent portion of the flexible connecting strip is fixed to the mounting base (e.g., fixed to the side wall of the mounting base), thereby solving the problem of frequent module movement affecting power supply. In this embodiment, the connecting strip is first bent using a hot-pressing process. Once the bend is formed (meaning the bend does not easily deform), the bent portion of the connecting strip is fixed to the mounting base. Preferably, the bend of the flexible connecting strip and the mounting base can be in surface contact; that is, the fixing point between the bend of the flexible connecting strip and the mounting base can be replaced by a fixing surface. This fixing surface can better ensure the reliability of the bonding. The hot-pressing process involves first heating the flexible connecting strip (e.g., using a hot air gun) to soften it, then bending it using a tool of appropriate shape, and cooling it to form the desired bend.

[0092] Furthermore, Figure 13a A comparative example of a flexible connecting strip scheme is shown. Generally, the flexible connecting strip (i.e., flexible board 10) is in the form of a flat strip, that is, the flexible connecting strip has a certain width. Figure 13b This paper illustrates an improved embodiment of the flexible connecting strip in another preferred embodiment of the present application. In this embodiment, the flexible connecting strip is a flexible plate 10. Preferably, the flexible plate 10 may have a gap 10a in the middle, which penetrates both surfaces (i.e., the upper and lower surfaces) of the strip-shaped flexible plate 10. In specific implementation, the gap 10a can be formed by hollowing out the center of the flexible plate 10. The length direction of the gap 10a can be substantially parallel to the long side direction of the flexible plate 10. This design can reduce the resistance formed by the flexible plate 10 to the movement of the module body 18. For example, when the rigid plate 12 is tilted, the flexible plate 10 will twist relative to the rigid plate 12, thereby forming a reverse torque. By providing the gap 10a in the middle of the flexible plate 10, the torque formed by the flexible plate 10 when the rigid plate 12 is tilted can be reduced, thereby significantly weakening or eliminating the resistance of the flexible plate 10 to the movement of the rigid plate 12. It should be noted that in other embodiments of the present application, the gap 10a can also be replaced by a hollow structure of other shapes.

[0093] Furthermore, still referencing Figure 13b In another embodiment of this application, the connecting strip can be divided into two parts by the bend (i.e., the bend portion). The portion where the bend 10b connects to the module body (i.e., the rigid board 12) is hollowed out (e.g., forming a gap 10a), while the portion from the bend 10b to the main board is not modified, i.e., it is not hollowed out (e.g., ...). Figure 13b(As shown). During the module's movement, the portion from the bend in the connecting strip to the motherboard does not move, so the resistance in this part can be disregarded. This design not only effectively reduces design complexity but also improves the production efficiency of the connecting strip, while simultaneously solving the resistance problem during module movement. Furthermore, in this embodiment, the bend 10b of the connecting strip forms a fixed point (refer to the reference). Figure 12 and Figure 13b This fixing point provides sufficient range of motion for the module body, preventing tearing or partial tearing at the connection between the flexible connecting strip and the module body due to frequent stress. It also prevents the stress at the connection between the flexible connecting strip and the module body from being transmitted to the connection between the flexible connecting strip and the motherboard, thus avoiding tearing or partial tearing at the motherboard connection. For example, when the flexible connecting strip has a hollow structure, and this hollow structure is a gap parallel to the length direction of the connecting strip, a large movement of the module body may create a force that tears the flexible connecting strip along this gap (referring to the force that tears the seamless bend from the motherboard). In this embodiment, the bend is fixed to the outer frame, effectively blocking this force and preventing tearing of the flexible connecting strip from the bend to the motherboard, thereby improving the reliability of the camera module.

[0094] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A camera module with a gimbal, the camera module comprising: The camera module with a gimbal comprises: a module body comprising a lens assembly and a photosensitive assembly; and a gimbal structure comprising an outer frame arranged outside the module body, an SMA wire suspending the module body inside the outer frame, and a driving device arranged on the outer frame and the module body; wherein the outer frame comprises a bottom plate and a fixed frame mounted on the edge of the bottom plate, a damping structure is arranged between the bottom plate and the photosensitive assembly, and the damping structure suspends the module body together with the SMA wire, wherein the damping structure separates the bottom of the module body and the top surface of the bottom plate to prevent the module body from being blocked by the bottom plate when the module body moves.

2. The camera module with a gimbal according to claim 1, wherein the driving device comprises a coil arranged inside the outer frame and a magnet or a coil arranged outside the module body.

3. The camera module with a gimbal according to claim 1, wherein two ends of the SMA wire are connected to the outer frame and the module body respectively, and the end of the SMA wire connected to the outer frame is higher than the end connected to the module body.

4. The camera module with a gimbal according to claim 2, wherein in a top view, the two ends of the SMA wire are connected to the midpoints of the side edges of the outer frame and the side edges of the module body respectively.

5. The camera module with a gimbal according to claim 2, wherein in a top view, the outer shapes of the outer frame and the module body are both rectangular, the two ends of the SMA wire are connected to the first vertex of the outer frame and the second vertex of the module body respectively, and the second vertex is the adjacent vertex of the corresponding vertex of the module body.

6. The camera module with a gimbal according to claim 5, wherein when the module body appears to shake in the direction of rotation around the z-axis, the SMA wire is stretched or contracted by changing the current size of the SMA wire, thereby driving the module body to move in the direction of rotation around the z-axis to compensate for the shaking of the module body; wherein the z-axis is parallel to the optical axis direction of the camera module body.

7. The camera module with a gimbal according to claim 2, wherein the SMA wire is rigid at room temperature; and when the current flowing through the SMA wire exceeds a preset threshold, the SMA wire undergoes austenite phase transformation, and the SMA wire is in a relaxed state in the austenite phase.

8. The camera module with a gimbal according to claim 2, wherein the SMA wire has a rigid mode, an extension mode and a softening mode; in the rigid mode, the SMA wire is rigid, in the extension mode, the SMA wire can realize controlled extension based on the current size, and in the softening mode, the SMA wire is softened.

9. The camera module with a gimbal according to claim 8, wherein The SMA wire is supplied with a current greater in the softening mode than in the stretching mode, and the SMA wire is supplied with a current greater in the stretching mode than in the rigid mode.

10. The camera module with a gimbal according to claim 2, wherein, The outer frame comprises a bottom plate and a fixed frame fixed to the edge area of the bottom plate, and the fixed frame surrounds the module body.

11. The camera module with a gimbal according to claim 10, wherein, The damping structure between the bottom plate and the bottom surface of the module body is a spring or a damping structure made of damping material.

12. The camera module with a gimbal according to claim 10, wherein, The bottom plate is a PCB plate.

13. The camera module with a gimbal according to claim 2, wherein, The light sensing assembly comprises a circuit board, a light sensing chip mounted on the circuit board, a lens seat mounted on the circuit board and arranged around the light sensing chip, and a filter mounted on the lens seat and above the light sensing chip.

14. The camera module with a gimbal according to claim 13, wherein, The circuit board comprises a circuit board body and a flexible connection strip connected to the circuit board body, and the side surface of the outer frame has a through hole, and the flexible connection strip passes through the through hole.

15. The camera module with a gimbal according to claim 14, wherein, The flexible connection strip has a hollow structure; and the hollow structure is a strip-shaped gap, and the length direction of the strip-shaped gap is consistent with the length direction of the flexible connection strip.

16. The camera module with a gimbal according to claim 15, wherein, The flexible connection strip is bent and folded.

17. The camera module with a gimbal according to claim 15, wherein, The circuit board body is a PCB plate, and the flexible connection strip is an FPC plate.

18. The camera module with a gimbal according to claim 1, wherein, The lens assembly comprises an optical lens and a motor, the optical lens is mounted in the motor, and the motor is adapted to move the optical lens in the z-axis direction to achieve focusing.

19. The camera module with a gimbal according to claim 2, wherein, In the process of anti-shake, the coil mounted on the outer frame is electrified to exert electromagnetic force on the corresponding magnet or coil mounted on the module body, thereby driving the module body to move in the direction of rotating around the x-axis and / or the y-axis to correct the shaking of the module body, wherein the x-axis and the y-axis are two coordinate axes perpendicular to the optical axis of the camera module, and the x-axis and the y-axis are perpendicular to each other.

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