heat storage mechanism
By using a combination of heat pipes and solid-liquid phase change heat transfer medium in the thermal storage mechanism, the problem of uneven heating of the thermal storage medium is solved, achieving uniform heating and improved safety of the thermal storage medium, and increasing the heat storage capacity and power density.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FENSHIPU CO LTD
- Filing Date
- 2023-04-28
- Publication Date
- 2026-05-19
AI Technical Summary
In thermal storage devices, the low thermal conductivity of the storage medium leads to uneven heating, which can easily cause sintering and reduce safety during use.
By combining heat pipes and solid-liquid phase change heat transfer medium, heat is uniformly transferred to the heat storage medium through the heat pipes. The high thermal conductivity and large latent heat of phase change of the solid-liquid phase change heat transfer medium are utilized to achieve uniform heating of the heat storage medium.
It improves the uniformity of heat distribution of the heat storage medium and the safety of the heat storage mechanism, and enhances the heat storage capacity and power density.
Smart Images

Figure CN116358330B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chemical energy storage technology, and in particular to a thermal storage mechanism. Background Technology
[0002] Thermal storage devices store heat by using a thermal storage medium. For example, a thermochemical thermal storage / release medium stores and releases thermal energy through a reversible chemical reaction. For instance, Ca(OH)2 is decomposed by heat to generate CaO and H2O, storing heat and converting thermal energy into chemical energy; and then releasing heat through its reverse reaction, converting chemical energy into thermal energy.
[0003] Traditional thermal storage mechanisms directly transfer heat from high-flux sunlight or other heat sources such as electric heating to the heat-absorbing surface of the storage mechanism, thereby heating the internal thermal storage medium. However, due to uneven light and heat intensity or heat absorption in different areas of the storage mechanism, the thermal storage medium in areas with high light and heat intensity or greater heat absorption may become excessively hot, leading to sintering and reducing the safety of the thermal storage mechanism. Furthermore, because the thermal storage medium has a low thermal conductivity, the lateral and longitudinal heat diffusion is hindered after localized heating, resulting in uneven heating of the thermal storage medium.
[0004] Therefore, how to improve the safety of thermal storage mechanisms and the uniformity of heating of the thermal storage medium is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention
[0005] The purpose of this invention is to provide a thermal storage mechanism that improves the safety of use and the uniformity of heating of the thermal storage medium.
[0006] To achieve the above objectives, the present invention provides a heat storage mechanism, including a heat charging device and a heat storage medium, wherein the heat charging device includes:
[0007] A heat-filling chamber, the inner cavity of which is used to hold the heat storage medium; and
[0008] A heat transfer device includes a heat pipe, a heat buffer box for absorbing heat from a heat source, and a solid-liquid phase change heat transfer medium located in the inner cavity of the heat buffer box for absorbing heat from the heat buffer box. The evaporation heat absorption section of the heat pipe extends into the heat buffer box, and the condensation heat release section of the heat pipe extends into the heat storage box, so as to conduct the heat from the solid-liquid phase change heat transfer medium to the heat storage medium.
[0009] Optionally, in the above-mentioned heat storage mechanism, the bottom surface of the heat buffer box is provided with a solar spectrum selective absorption coating for heat absorption, and the heat charging box is located at the top of the heat buffer box.
[0010] Optionally, in the above-mentioned heat storage mechanism, the top end of the heat buffer box and the bottom end of the heat charging box are attached to form a heat exchange surface to conduct the heat of the heat transfer device to the heat storage medium.
[0011] Optionally, in the above-mentioned heat storage mechanism, the condensation and heat release section of the heat pipe is inserted into the inner cavity of the heat charging box, and the condensation and heat release section of the heat pipe can come into contact with the heat storage medium.
[0012] Optionally, in the above-mentioned heat storage mechanism, the heat-filling box has a bottom opening and a hollow heat-conducting column sleeved outside the condensation and heat release section of the heat pipe. The inner cavity of the hollow heat-conducting column is isolated from the inner cavity of the heat-filling box. The condensation and heat release section of the heat pipe is in contact with the hollow heat-conducting column. The condensation and heat release section of the heat pipe is inserted into the heat-filling box and is detachably connected. The heat-filling box and the heat buffer box abut against each other for heat conduction.
[0013] Optionally, in the above-mentioned heat storage mechanism, the inner cavity of the heat-filling box is a closed cavity, and the heat storage medium is filled in the inner cavity of the heat-filling box.
[0014] Optionally, in the above-mentioned heat storage mechanism, the cross-sectional area of the condensation and heat release section of the heat pipe gradually decreases from top to bottom, or the heat pipe is a straight pipe with the same cross-sectional area from top to bottom.
[0015] Optionally, the above-mentioned heat storage mechanism further includes a thermometer, a pressure measuring device, and an exhaust valve. The exhaust valve is installed at the exhaust port position on the heat charging box. The thermometer is used to measure the temperature of the heat storage medium inside the heat charging box. The pressure measuring device is used to measure the internal pressure of the heat charging box. The heat storage medium is a thermochemical heat storage medium.
[0016] Optionally, the above-mentioned heat storage mechanism further includes a heat storage tank and a gas conveying device for charging and discharging gas into the heat storage tank. The heat storage tank has a material conveying position connected to the heat storage tank and a material fixing position isolated from the heat storage tank. The gas conveying device is used for the heat storage medium in the material conveying position to flow in the heat storage tank and the heat storage tank.
[0017] Optionally, in the above-mentioned heat storage mechanism, the heat storage box and the gas delivery device are located on opposite sides of the heat charging box, and a filter screen for isolating the heat storage medium is provided at the connection position between the gas delivery device and the heat charging box.
[0018] Optionally, in the above-described heat storage mechanism, the heat storage tank and / or the gas delivery device are detachably connected to the heat charging tank.
[0019] Optionally, in the above-mentioned thermal storage mechanism, the solid-liquid phase change thermal conductive medium is a metal phase change medium.
[0020] In the above technical solution, the heat storage mechanism provided by the present invention includes a heat charging device and a heat storage medium. The heat charging device includes a heat transfer device and a heat charging box. The heat transfer device includes a heat pipe, a heat buffer box for absorbing heat from a heat source, and a solid-liquid phase change heat transfer medium located in the inner cavity of the heat buffer box for absorbing heat from the heat buffer box. The inner cavity of the heat charging box is used to place the heat storage medium. The evaporation heat absorption section of the heat pipe extends into the heat buffer box, and the condensation heat release section of the heat pipe extends into the heat charging box to conduct the heat from the solid-liquid phase change heat transfer medium to the heat storage medium.
[0021] As described above, in the heat storage mechanism provided by the present invention, the heat from the heat source is first transferred to the solid-liquid phase change heat storage medium. Because the solid-liquid phase change heat transfer medium has a high phase change temperature, a large latent heat of phase change, and a high thermal conductivity, its internal temperature hardly changes with the input and output power after reaching the phase change temperature. This allows for a uniform and constant temperature at the heat release location. The heat is then uniformly transferred to the heat storage medium located in the inner cavity of the heat-filling box through heat pipes, thereby ensuring that the heat storage medium in the inner cavity of the heat-filling box is uniformly heated. This avoids the heat storage medium from being overheated locally and sintering. Therefore, the heat storage mechanism provided by the present invention has improved safety in use.
[0022] This invention achieves longitudinal heat transfer by incorporating heat pipes inserted into the heat storage medium. Due to the high thermal conductivity of the heat pipes, the problem of low thermal conductivity and uneven heating of the heat storage medium is effectively solved. Simultaneously, because the heat pipes can rapidly transfer heat energy over long distances, more heat storage medium can be heated at once, increasing the amount of heat transferred per unit time and thus improving the heat storage capacity and power density of the heat storage mechanism. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of a heat storage mechanism provided in an embodiment of the present invention;
[0025] Figure 2 This is a schematic diagram of the heat transfer device provided in an embodiment of the present invention;
[0026] Figure 3 This is a schematic diagram of the connection position between the heat transfer device and the heat charging box provided in an embodiment of the present invention;
[0027] Figure 4 This is a schematic diagram illustrating the assembly and disassembly process of the heat pipe and the heat-charging box provided in an embodiment of the present invention;
[0028] Figure 5 This is a schematic diagram of the structure of the heat storage mechanism provided in the embodiment of the present invention, in which the heat storage medium is located in the heat storage box.
[0029] Figure 6 This is a schematic diagram of the structure of the heat storage mechanism provided in the embodiment of the present invention, in which the heat storage medium is located in the heat charging box.
[0030] in Figure 1-6 middle:
[0031] Thermal storage tank 1, first inlet / outlet 101, first valve 102;
[0032] 2. Heat charging device, 201. Solid-liquid phase change heat transfer medium, 202. Heat pipe, 203. Inner cavity of the box, 204. Second inlet and outlet port, 205. Filter screen, 206. Heat charging box, 207. Exhaust valve, 208. Pressure measuring device, 209. Thermometer, 210. Solar spectrum selective absorption coating, 211. Heat exchange surface, 212. Evaporation heat absorption section, 213. Condensation heat release section, 214. Gas channel, 215. Second valve, 216. Third valve, 217. Heat buffer box, 218. Hollow heat-conducting column;
[0033] Gas conveying device 3;
[0034] Thermal storage medium 4. Detailed Implementation
[0035] The core of this invention is to provide a heat storage mechanism that improves the safety of use and the uniformity of heating of the heat storage medium.
[0036] In the description of the embodiments of the present invention, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. "And / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of the present invention, "multiple" refers to two or more than two.
[0037] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
[0038] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
[0039] Please refer to Figures 1 to 6 .
[0040] In one specific embodiment, the heat storage mechanism provided by the present invention includes a heat charging device 2 and a heat storage medium 4. The heat storage medium 4 can be a thermochemical heat storage material, specifically Ca(OH)2.
[0041] The heat charging device 2 includes a heat transfer device and a heat charging chamber 206. The heat transfer device includes heat pipes 202, a heat buffer chamber 217 for absorbing heat from the heat source, and a solid-liquid phase change heat transfer medium 201 located inside the heat buffer chamber 217 for absorbing heat from the heat buffer chamber 217. Considering the volume expansion of the solid-liquid phase change heat transfer medium 201 after heating, it is preferable that the solid-liquid phase change heat transfer medium 201 does not completely fill the inner cavity of the heat buffer chamber 217 when not heated, thereby improving the functional safety of the heat charging device 2. Preferably, the heat pipes 202 are arranged in an array and installed on the heat buffer chamber 217, and the heat pipes 202 are specifically fixedly connected to the heat buffer chamber 217. The inner cavity of the heat charging chamber 206 is used to place the heat storage medium 4. Preferably, the solid-liquid phase change heat transfer medium 201 is a metal phase change medium with a melting point of 600℃-900℃, such as aluminum or aluminum-silicon alloys.
[0042] The evaporation heat absorption section 212 of the heat pipe 202 extends into the heat buffer box 217. Specifically, the evaporation heat absorption section 212 of the heat pipe 202 extends into the inner cavity of the heat buffer box 217, and the condensation heat release section 213 of the heat pipe 202 extends into the inner cavity of the heat charging box 206, so as to conduct the heat of the solid-liquid phase change heat transfer medium 201 to the heat storage medium 4. The evaporation heat absorption section 212 of the heat pipe 202 absorbs the heat in the heat buffer box 217. Because of its high thermal conductivity, it can quickly transfer the heat to the condensation heat release section 213 at the top of the heat pipe 202.
[0043] Heat pipe 202, as a heat transfer device with excellent thermal conductivity, utilizes a specific working fluid enclosed within the pipe to repeatedly undergo physical phase changes or chemical reactions to transfer heat. Based on temperature, it can be classified into low-temperature heat pipes (-270~0℃), normal-temperature heat pipes (0~200℃), medium-temperature heat pipes (200~600℃), and high-temperature heat pipes (above 600℃). In this invention, heat pipe 202 is preferably a high-temperature heat pipe, which uses liquid metal (sodium, potassium, etc.) as the working medium, possesses good thermal stability and very low saturated vapor pressure, and uses stainless steel or other heat-resistant steel as the pipe shell, enabling it to operate in high-temperature flue gas above 1100℃.
[0044] In one specific embodiment, the heat buffer box 217 and the heat charging box 206 can be two independent boxes or one box (the box is isolated into two independent cavities that can transfer heat but not mass to each other by a heat-conducting plate).
[0045] like Figure 1 As shown, the condensation and heat release section 213 of the heat pipe 202 is inserted into the inner cavity of the heat-filling box 206, and the condensation and heat release section 213 of the heat pipe 202 is in contact with the heat storage medium 4. At this time, the heat pipe 202 is fixed relative to the heat-filling box 206. Specifically, the heat pipe 202 is directly inserted into the inner cavity 203 of the heat-filling box 206, where the inner cavity 203 serves as a filling cavity that can be filled with the heat storage medium 4, thereby facilitating the timely transfer of heat to the heat storage medium 4.
[0046] like Figure 4 As shown, the heat-filling chamber 206 has a bottom opening and a hollow heat-conducting column 218 fitted outside the condensation and heat-dissipating section 213 of the heat pipe 202. The condensation and heat-dissipating section 213 of the heat pipe 202 is in contact with the hollow heat-conducting column 218. The heat pipe 202 can be a strip-shaped tube with its centerline perpendicular to the horizontal plane, and the condensation and heat-dissipating section 213 of the heat pipe 202 is inserted into the heat-filling chamber 206. Preferably, the heat pipe 202 and the heat-filling chamber 206 are detachably connected, and the heat-filling chamber 206 abuts against the heat buffer chamber 217 for heat conduction. During the charging process, the charging box 206 is placed on the heat buffer box 217, and the heat pipe 202 is inserted into the inner cavity of the hollow heat-conducting column 218 in the charging box 206. Specifically, the inner cavity of the hollow heat-conducting column 218 is isolated from the inner cavity 203 of the charging box 206. That is, the heat pipe 202 exchanges heat with the heat storage medium 4 in the inner cavity 203 of the box through the hollow heat-conducting column 218. The hollow heat-conducting column 218 is a blind hole structure with a closed top. At the same time, the heat absorption surface of the charging box 206 is in contact with the heat release surface of the heat buffer box 217 to form a heat exchange surface 211, thereby achieving efficient heat transfer.
[0047] like Figure 3 and Figure 4 As shown, the inner cavity 203 of the heat-filling chamber 206 can be a closed cavity. The heat storage medium 4 is filled in the inner cavity 203 of the heat-filling chamber 206, meaning that the heat storage medium 4 cannot be poured out of the inner cavity 203. In use, the heat-filling chamber 206 is directly pulled out from the heat pipe 202. That is, the heat pipe 202 is inserted into the heat-filling chamber 206 during heat filling and pulled out from the heat-filling chamber 206 after heat filling is complete.
[0048] As described above, in the heat storage mechanism provided in the specific embodiment of the present invention, the heat from the heat source is first transferred to the solid-liquid phase change medium. Because the solid-liquid phase change heat transfer medium has a high phase change temperature, a large latent heat of phase change, and a high thermal conductivity, its internal temperature hardly changes with the input and output power after reaching the phase change temperature. This allows for a uniform and constant temperature on the heat release surface. The heat can then be uniformly transferred to the heat storage medium 4 located in the inner cavity of the heat-filling box 206 through the heat pipe 202. This ensures that the heat storage medium 4 located in the inner cavity of the heat-filling box 206 is uniformly heated, preventing the heat storage medium 4 from being overheated locally and sintering. Therefore, the safety of the heat storage mechanism provided by the present invention is improved.
[0049] The bottom surface of the heat buffer box 217 is provided with a solar selective absorption coating 210, and the heat-filling box 206 is located at the top of the heat buffer box 217. That is, the heat storage mechanism provided by this invention is solar-powered. In practical use, a reflective surface is provided below the heat buffer box 217 for heat absorption by the solar selective absorption coating. Specifically, light can be reflected to the solar selective absorption coating 210 using a reflective device. The thickness and shape of the solar selective absorption coating 210 are determined according to actual needs, and this invention does not impose specific limitations.
[0050] During assembly, preferably, the heat buffer box 217 is supported by a support frame with a hollowed-out lower end, which facilitates the heat absorption of the solar spectrum selective absorption coating 210.
[0051] To improve heat transfer efficiency, preferably, the top of the heat buffer box 217 and the bottom of the heat-filling box 206 are fitted together to form a heat exchange surface 211, so as to conduct the heat from the heat transfer device to the heat storage medium 4. This invention uses a solid-liquid phase change heat transfer medium to diffuse the input heat laterally, allowing the heat buffer box 217 to output heat at a uniform and constant temperature. The heat pipe 202 longitudinally transfers heat to the heat storage medium within the heat-filling box 206, thereby improving the uniformity of heating of the heat storage medium 4.
[0052] When the heat source is sunlight, the heat flux in different areas of the light spot after the solar spectrum selective absorption coating 210 is not uniform. In order to make the thermochemical heat storage complete, the low flux area must reach the chemical reaction temperature. At this time, the temperature in the high flux area is too high, causing the heat storage material in that area to sinter, affecting the material's cycle stability; increasing heat loss to the environment; and easily causing the light-absorbing coating to ablate, increasing the resistance to photothermal conversion.
[0053] Meanwhile, due to the significant fluctuations in the spatiotemporal distribution of direct solar radiation across different seasons and time periods throughout the year, when the power of the charging device 2 is determined based on the weighted average power, the heat storage material near the heat-absorbing surface of the device will overheat and sinter when the solar radiation exceeds the charging power. If the temperature is controlled by cutting off the light source, the high-flux solar energy is wasted. Specifically, in practical use, the solar-spectrum selective absorption coating 210 at the bottom of the heat buffer box 217 absorbs solar radiation. Due to the uneven solar radiation flux, the metal phase change medium utilizes its high thermal conductivity and high latent heat of phase change to uniformly stabilize the entire heat buffer box 217 at the phase change temperature. This ensures that the output flux of different areas of the upper surface of the heat buffer box 217 and the charging box 206, as well as different heat pipes 202, is approximately the same. In other words, this invention solves the above problems by combining the solar-spectrum selective absorption coating 210, the solid-liquid phase change thermal conductive medium 201, and the heat pipes 202.
[0054] In a heat pipe 202 structure, the cross-sectional area of the condensation and heat release section 213 of the heat pipe 202 gradually increases from top to bottom. That is, the condensation and heat release section 213 of the heat pipe 202 can be a conical structure with a pointed top and a thick bottom. Specifically, the condensation and heat release section 213 is a conical structure.
[0055] In another heat pipe 202 structure, the heat pipe 202 is a straight pipe with the same cross-sectional area from top to bottom. Specifically, in this case, the heat pipe 202 is preferably a hollow cylindrical structure. Of course, in actual manufacturing, the cross-section of the heat pipe 202 along the horizontal direction can be square, elliptical, etc.
[0056] The heat transfer device also includes a thermometer 209, a pressure measuring device 208, and an exhaust valve 207. The exhaust valve 207 is installed at the exhaust port on the heat-filling chamber 206. The thermometer 209 is used to measure the temperature of the heat storage medium 4 inside the heat-filling chamber 206, and the pressure measuring device 208 is used to measure the pressure inside the heat-filling chamber 206. Specifically, the thermometer 209 is installed on the heat-filling chamber 206, allowing the user to directly obtain the temperature from it. Alternatively, the thermometer 209 includes a temperature sensor and a remote display module connected to the temperature sensor, with the temperature sensor located inside the heat-filling chamber 206 for remote monitoring. Similarly, the pressure measuring device 208 can also be directly installed on the heat-filling chamber 206, allowing the user to read the pressure value from it, or the pressure value from the pressure measuring device 208 can be remotely transmitted to the display module for remote monitoring. Based on the temperature and pressure values, the user can choose whether to open the exhaust valve 207, allowing the vapor from the thermochemical heat storage material reaction to be discharged through the exhaust valve 207.
[0057] like Figure 5 and Figure 6 As shown, based on the above schemes, preferably, the heat storage mechanism further includes a heat storage box 1 and a gas conveying device 3 for charging and discharging gas into the charging box 206. The heat storage box 1 has a material conveying position connected to the charging box 206 and a material fixing position isolated from the charging box 206. The gas conveying device 3 is used to realize the flow of the heat storage medium 4 in the material conveying position within the heat storage box 1 and the charging box 206.
[0058] To prevent the heat storage medium 4 located inside the heat storage box 1 from dissipating heat, preferably, the wall of the heat storage box 1 is provided with a heat insulation layer.
[0059] In one specific embodiment, in order to facilitate the flow of the heat storage medium 4 between the heat charging box 206 and the heat storage box 1, preferably, the heat storage box 1 and the gas conveying device 3 are located on opposite sides of the heat charging box 206. Specifically, the heat storage box 1 and the gas conveying device 3 can both be fixedly connected to the heat charging box 206, and the three become a whole after assembly.
[0060] like Figure 1 and Figure 5 As shown, in another embodiment, the heat storage tank 1 and the charging tank 206 are detachably connected, and the gas conveying device 3 is detachably connected to the charging tank 206. Specifically, the heat storage tank 1 is provided with a first valve 102 at the first inlet / outlet 101, and the charging tank 206 is provided with a second valve 215 at the second inlet / outlet 204. The first valve 102 and the second valve 215 are arranged opposite each other. The isolation and connection between the heat storage tank 1 and the charging tank 206 are achieved by opening and closing the first valve 102 and the second valve 215.
[0061] A filter screen 205 is provided at the connection point between the gas conveying device 3 and the charging chamber 206 to isolate the heat storage medium 4. By providing the filter screen 205, the heat storage medium 4 is prevented from flying out of the charging chamber 206. Specifically, the heat storage medium 4 is preferably in powder form. Specifically, the filter screen 205 can be installed on the charging chamber 206 or the gas conveying device 3. To facilitate isolation between the charging chamber 206 and the gas conveying device 3, a third valve 216 is provided on the gas passage 214 of the gas conveying device 3. The opening and closing of the third valve 216 achieves isolation and conduction between the charging chamber 206 and the gas conveying device 3. Specifically, preferably, the third valve 216 is located between the filter screen 205 and the gas conveying device 3 to prevent the heat storage medium 4 from interfering with the closing of the third valve 216. Specifically, at least one of the first valve 102, the second valve 215, and the third valve 216 is a gate valve.
[0062] In a specific heat charging process, combined with Figure 5 and Figure 6 Explanation:
[0063] First, perform the feeding operation: (e.g.) Figure 5 As shown, the first inlet / outlet 101 of the heat storage tank 1 is connected to the second inlet / outlet 204 of the heat charging tank 206. The gas conveying device 3 is turned on, and the third valve 216 is opened. Under the action of the gas conveying device 3, a negative pressure is formed in the heat charging tank 206. The first valve 102 and the second valve 215 are opened. After the heat storage medium 4 enters the heat charging tank 206, the first valve 102, the second valve 215 and the third valve 216 are closed. The heat storage tank 1 and the gas conveying device 3 are then removed.
[0064] Next, the heat charging operation begins: The exhaust valve 207 is opened, and the bottom surface (heat input surface) of the heat buffer box 217 receives solar energy, converting it into heat energy and storing it in the solid-liquid phase change heat transfer medium 201. The heat is then conducted to the heat storage medium 4 near the heat buffer box 217 from its top surface (heat output surface). Simultaneously, the bottom of the heat pipe 202 (evaporation and heat absorption section 212) inserted inside the heat buffer box 217 is heated, causing the metal inside the heat pipe 202 to undergo a phase change, liquefying and then vaporizing. The gaseous metal rises to the top of the heat pipe 202 (condensation and heat release section 213) and condenses, releasing heat to the heat storage medium 4 away from the heat buffer box 217. The condensed liquid metal flows back to the evaporation and heat absorption section 212 under gravity or capillary force, completing one cycle. Throughout the entire heat charging process, the high-temperature heat pipe 202 continuously repeats the evaporation and condensation cycle until the temperature monitored by the thermometer 209 reaches the set value (determined by the thermochemical reaction temperature), at which point the heat charging is complete.
[0065] Finally, perform the material discharge operation: (e.g.) Figure 6 As shown, install the gas conveying device 3, open the third valve 216, and fill the heat charging box 206 with gas to increase the internal pressure of the heat charging box 206 to reach the discharge set value. Install the heat storage box 1, open the first valve 102 and the second valve 215 to discharge the heat storage medium 4 from the heat charging box 206 and into the heat storage box 1. Finally, close the first valve 102, the second valve 215 and the third valve 216, and remove the filled heat storage box 1 for sealing.
[0066] The thermal storage mechanism provided by this invention is a heat transfer device that combines a heat pipe with a metal solid-liquid phase change thermally conductive medium. The gas-liquid phase change process within the heat pipe 202 achieves extremely high heat absorption and release performance, with a heat transfer coefficient that is tens of times higher than that of a metal fin structure. Applying the high-temperature heat pipe 202 to the charging box 206 of the thermochemical thermal storage material can solve the problems of high spatial thermal resistance and slow heat charging and releasing. Due to the high phase change temperature, large latent heat of phase change, and high thermal conductivity of the metal solid-liquid phase change thermally conductive medium, using it as a buffer charging device can improve the temperature uniformity of the heat output surface of the heat buffer box 217 (heat input surface of the charging box 206), buffer the influence of solar radiation fluctuations at different times of the year, and adapt to reasonable charging power.
[0067] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0068] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A heat storage mechanism, characterized in that, The device includes a heat charging device (2) and a heat storage medium (4). The heat charging device (2) includes: A heat-filling chamber (206) is provided, the inner cavity of which is used to hold the heat storage medium (4); and A heat transfer device, comprising a heat pipe (202), a heat buffer box (217) for absorbing heat from a heat source, and a solid-liquid phase change heat transfer medium (201) for absorbing heat from the heat buffer box (217) and located in the inner cavity of the heat buffer box (217). The evaporation heat absorption section (212) of the heat pipe (202) extends into the heat buffer box (217), and the condensation heat release section (213) of the heat pipe (202) extends into the heat charging box (206) to conduct heat from the solid-liquid phase change heat transfer medium (201) to the heat storage medium (4). The heat-filling box (206) has a bottom opening and a hollow heat-conducting column (218) sleeved on the outside of the condensation and heat release section (213) of the heat pipe (202). The inner cavity of the hollow heat-conducting column (218) is isolated from the inner cavity (203) of the heat-filling box (206). The condensation and heat release section (213) of the heat pipe (202) is in contact with the hollow heat-conducting column (218). The condensation and heat release section (213) of the heat pipe (202) is inserted into the heat-filling box (206) and is detachably connected. The heat-filling box (206) and the heat buffer box (217) are in contact for heat conduction.
2. The heat storage mechanism according to claim 1, characterized in that, The bottom surface of the heat buffer box (217) is provided with a solar spectrum selective absorption coating (210) for heat absorption, and the heat-filling box (206) is located at the top of the heat buffer box (217).
3. The heat storage mechanism according to claim 1, characterized in that, The top of the heat buffer box (217) and the bottom of the heat charging box (206) are attached to form a heat exchange surface (211) to conduct the heat of the heat transfer device to the heat storage medium (4).
4. The heat storage mechanism according to claim 1, characterized in that, The condensation and heat release section (213) of the heat pipe (202) is inserted into the inner cavity of the heat charging box (206), and the condensation and heat release section (213) of the heat pipe (202) can come into contact with the heat storage medium (4).
5. The heat storage mechanism according to claim 1, characterized in that, The inner cavity (203) of the heat-filling box (206) is a closed cavity, and the heat storage medium (4) is filled in the inner cavity (203) of the heat-filling box (206).
6. The heat storage mechanism according to claim 1, characterized in that, The cross-sectional area of the condensation and heat release section (213) of the heat pipe (202) gradually increases from top to bottom, or the heat pipe (202) is a straight pipe with the same cross-sectional area from top to bottom.
7. The heat storage mechanism according to claim 1, characterized in that, It also includes a thermometer (209), a pressure measuring device (208), and an exhaust valve (207). The exhaust valve (207) is installed at the exhaust port on the heat-filling box (206). The thermometer (209) is used to measure the temperature of the heat storage medium (4) inside the heat-filling box (206). The pressure measuring device (208) is used to measure the pressure inside the heat-filling box (206). The heat storage medium (4) is a thermochemical heat storage medium.
8. The heat storage mechanism according to claim 1, characterized in that, It also includes a heat storage box (1) and a gas conveying device (3) for filling and releasing gas into the heat charging box (206). The heat storage box (1) has a material conveying position and a material fixing position. When the heat storage box (1) is in the material conveying position, the heat storage box (1) is connected to the heat charging box (206). When the heat storage box (1) is in the material fixing position, the heat storage box (1) is isolated from the heat charging box (206). The gas conveying device (3) is used for the heat storage medium (4) in the material conveying position to flow in the heat storage box (1) and the heat charging box (206).
9. The heat storage mechanism according to claim 8, characterized in that, The heat storage box (1) and the gas delivery device (3) are located on opposite sides of the heat charging box (206), and a filter (205) for isolating the heat storage medium (4) is provided at the connection position between the gas delivery device (3) and the heat charging box (206).
10. The heat storage mechanism according to claim 8, characterized in that, The heat storage box (1) and / or the gas delivery device (3) are detachably connected to the heat charging box (206).
11. The heat storage mechanism according to any one of claims 1-10, characterized in that, The solid-liquid phase change thermal conductive medium (201) is a metal phase change medium.