Contact positioning method and device, probe station and storage medium
By acquiring and repairing the contact image and using the minimum square bounding box and ratio calculation method to accurately locate the contacts, the problems of poor test quality and wafer damage caused by inaccurate probe positioning are solved, and high-quality wafer testing is achieved.
Patent Information
- Application Number
- CN202310326770.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-27
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2043-03-27
AI Technical Summary
During wafer testing, existing technologies have difficulty accurately locating the positions of probes and contacts, resulting in poor test quality or wafer damage.
By acquiring the contact image, repairing and judging whether the contact shape conforms to the known shape, the contact position is determined using the minimum square bounding box and ratio calculation to ensure that the probe accurately penetrates the contact.
Improves wafer test quality, prevents probes from piercing the outside of the contacts and damaging the wafer, and ensures test accuracy.
Smart Images
Figure CN116358411B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of wafer detection, and particularly relates to a contact positioning method and device, a probe station and a storage medium. BACKGROUND
[0002] After wafer manufacturing is completed, wafer testing is a very important process, and a probe station, as a main wafer testing device, is widely used in the testing of the semiconductor industry, the photoelectric industry, integrated circuits and packaging. Through a probe card as a testing interface, the probe station connects a testing machine and a chip to transmit signals and test chip parameters.
[0003] In the testing process, the positions of probes on the probe card and test contacts (pads) on the wafer are first positioned, and after the positions of the probes and the contacts in a world coordinate system are determined, the probes are then driven into the contacts for testing. However, in actual testing, even if the positions of the probes and the contacts in the world coordinate system are determined, the testing quality is often poor or the wafer is damaged. SUMMARY
[0004] The application aims to provide a contact positioning method and device, a probe station and a storage medium to improve wafer testing quality and prevent wafer damage.
[0005] According to a first aspect of an embodiment of the application, a contact positioning method can include:
[0006] obtaining a contact image of a target contact and obtaining a known shape of the target contact;
[0007] repairing the target contact in the contact image to obtain a complete target contact binary image;
[0008] determining whether an actual shape of the target contact conforms to the known shape according to the target contact binary image;
[0009] positioning a coordinate of the target contact when the actual shape of the target contact conforms to the known shape.
[0010] In some optional embodiments of the application, determining whether the actual shape of the target contact conforms to the known shape according to the target contact binary image can include:
[0011] obtaining a minimum square bounding box of a target contact contour from the target contact binary image;
[0012] determining overlapping areas of the target contact and four sides of the minimum square bounding box;
[0013] calculating a ratio of a length of each overlapping area to a length of a corresponding side of the minimum square bounding box to obtain a first ratio, a second ratio, a third ratio and a fourth ratio.
[0014] In some embodiments of the present application, after calculating the ratio of each length of the overlapping region to the corresponding length of the side of the minimum square enclosing frame, determining whether the actual shape of the target contact point conforms to the known shape can further include:
[0015] When the first ratio, the second ratio, the third ratio, and the fourth ratio are all greater than the first ratio threshold, it is determined that the actual shape of the target contact point is a rectangle.
[0016] In some embodiments of the present application, after calculating the ratio of each length of the overlapping region to the corresponding length of the side of the minimum square enclosing frame, determining whether the actual shape of the target contact point conforms to the known shape can further include:
[0017] When the first ratio, the second ratio, the third ratio, and the fourth ratio are all less than the second ratio threshold, it is determined that the actual shape of the target contact point is a circle.
[0018] In some embodiments of the present application, after calculating the ratio of each length of the overlapping region to the corresponding length of the side of the minimum square enclosing frame, determining whether the actual shape of the target contact point conforms to the known shape can further include:
[0019] When the second ratio and the fourth ratio are less than the third ratio threshold and greater than the fourth ratio threshold, the first ratio and the third ratio are less than the fifth ratio threshold, or when the first ratio and the third ratio are less than the third ratio threshold and greater than the fourth ratio threshold, the second ratio and the fourth ratio are less than the fifth ratio threshold, it is determined that the actual shape of the target contact point is a hexagon.
[0020] In some embodiments of the present application, after calculating the ratio of each length of the overlapping region to the corresponding length of the side of the minimum square enclosing frame, determining whether the actual shape of the target contact point conforms to the known shape can further include:
[0021] When the first ratio, the second ratio, the third ratio, and the fourth ratio are all less than the sixth ratio threshold and greater than the seventh ratio threshold, it is determined that the actual shape of the target contact point is an octagon.
[0022] In some embodiments of the present application, obtaining the contact point image of the target contact point can include:
[0023] Obtaining a die image and a search region;
[0024] Cutting the die image according to the search region to obtain the contact point image of the target contact point.
[0025] In some embodiments of the present application, repairing the target contact point in the contact point image to obtain a complete target contact point binary image can include:
[0026] Performing grayscale processing on the contact point image to obtain a grayscale image of the target contact point;
[0027] Threshold segmentation is performed on the gray image to obtain an initial binary image of the target contact point;
[0028] A convex hull contour of the target contact point is extracted from the initial binary image;
[0029] A morphological closing operation is performed on the initial binary image to obtain a gap-removed image;
[0030] A connected domain of a target pixel area is screened from the gap-removed image;
[0031] A convex hull contour of the connected domain is extracted.
[0032] In some optional embodiments of the present application, before the connected domain of the target pixel area is screened from the gap-removed image, the contact point positioning method can further include:
[0033] Bursa on the edge of the target contact point is removed.
[0034] In some optional embodiments of the present application, according to the target contact point binary image, whether the actual shape of the target contact point conforms to the known shape can further include:
[0035] According to the judgment rule of the known shape, it is searched whether a shape conforming to the judgment rule exists in the target contact point binary image.
[0036] According to the second aspect of the embodiments of the present application, a contact point positioning device is provided, which can include:
[0037] An acquisition module is configured to acquire a contact point image of a target contact point and acquire a known shape of the target contact point;
[0038] A repair module is configured to repair the target contact point in the contact point image to obtain a complete target contact point binary image;
[0039] A judgment module is configured to judge, according to the target contact point binary image, whether an actual shape of the target contact point conforms to the known shape;
[0040] A positioning module is configured to position a position coordinate of the target contact point when the actual shape of the target contact point conforms to the known shape.
[0041] In some optional embodiments of the present application, the judgment module can include:
[0042] A bounding box acquisition unit is configured to acquire a minimum square bounding box of a target contact point contour from the target contact point binary image;
[0043] An overlapping area determination unit is configured to determine an overlapping area of the target contact point and four edges of the minimum square bounding box;
[0044] a proportion calculation unit configured to calculate a ratio of a length of each of the overlapping regions to a corresponding side length of the minimum bounding box, to obtain a first proportion, a second proportion, a third proportion, and a fourth proportion.
[0045] In some embodiments of the present application, the determining module can further include:
[0046] a rectangle determining subunit configured to determine that the actual shape of the target contact point is a rectangle when the first proportion, the second proportion, the third proportion, and the fourth proportion are all greater than a first proportion threshold.
[0047] In some embodiments of the present application, the determining module can further include:
[0048] a circle determining subunit configured to determine that the actual shape of the target contact point is a circle when the first proportion, the second proportion, the third proportion, and the fourth proportion are all less than a second proportion threshold.
[0049] In some embodiments of the present application, the determining module can further include:
[0050] a hexagon determining subunit configured to determine that the actual shape of the target contact point is a hexagon when the second proportion and the fourth proportion are less than a third proportion threshold and greater than a fourth proportion threshold, or when the first proportion and the third proportion are less than a fifth proportion threshold, or when the first proportion and the third proportion are less than the third proportion threshold and greater than the fourth proportion threshold, and the second proportion and the fourth proportion are less than the fifth proportion threshold.
[0051] In some embodiments of the present application, the determining module can further include:
[0052] an octagon determining subunit configured to determine that the actual shape of the target contact point is an octagon when the first proportion, the second proportion, the third proportion, and the fourth proportion are all less than a sixth proportion threshold and greater than a seventh proportion threshold.
[0053] In some embodiments of the present application, the obtaining module can include:
[0054] an image and region obtaining unit configured to obtain a die image and a search region;
[0055] a contact point image intercepting unit configured to intercept the die image according to the search region to obtain a contact point image of the target contact point.
[0056] In some embodiments of the present application, the repairing module can include:
[0057] a gray-scale processing unit configured to perform gray-scale processing on the contact point image to obtain a gray-scale image of the target contact point.
[0058] a threshold segmentation unit configured to perform threshold segmentation on the gray-scale image to obtain an initial binary image of the target contact point.
[0059] a contour extraction unit configured to extract a convex hull contour of the target contact point from the initial binary image;
[0060] a morphological closing operation unit configured to perform a morphological closing operation on the initial binary image to obtain a gap-removed image;
[0061] a screening unit configured to screen a connected domain of the target pixel area from the gap-removed image;
[0062] a connected domain contour extraction unit configured to extract a convex hull contour of the connected domain.
[0063] In some optional embodiments of the present application, the repairing module can further include:
[0064] a burr removing unit configured to remove burrs of the edge of the target contact point.
[0065] In some optional embodiments of the present application, the judging module can further include:
[0066] a shape judging unit configured to search whether a shape conforming to the judging rule exists in the binary image of the target contact point according to the judging rule of the known shape.
[0067] According to a third aspect of the embodiments of the present application, a probe station is provided, which can use the contact point positioning method according to any one of the first aspect to detect a wafer.
[0068] According to a fourth aspect of the embodiments of the present application, a storage medium is provided, when instructions in the storage medium are executed by a processor of an information processing device or a server, the information processing device or the server implements the contact point positioning method according to any one of the embodiments of the first aspect.
[0069] The above technical solutions of the present application have the following beneficial technical effects:
[0070] The embodiments of the present application can determine the position of the contact point by repairing the contact point image and judging the shape of the contact point in the repaired contact point image, and if the judging result conforms to the known shape, the position of the contact point can be determined. After the position of the probe and the contact point is determined, the probe is inserted into the contact point for testing. The probe can be accurately inserted into the contact point, and the wafer can be prevented from being damaged by the probe inserted into the outside of the contact point, and the quality of wafer testing is greatly improved. BRIEF DESCRIPTION OF DRAWINGS
[0071] Figure 1 is a flowchart of a contact point positioning method in an exemplary embodiment of the present application;
[0072] Figure 2 is a schematic diagram of a contact point shape judging rule in an exemplary embodiment of the present application;
[0073] Figure 3 is a schematic diagram of rectangular contact point determination in an exemplary embodiment of the present application;
[0074] Figure 4 is a schematic diagram of circular contact point determination in an exemplary embodiment of the present application;
[0075] Figure 5 is a schematic diagram of hexagonal contact point determination in an exemplary embodiment of the present application;
[0076] Figure 6 is a schematic diagram of hexagonal contact point determination in another exemplary embodiment of the present application;
[0077] Figure 7 is a schematic diagram of octagonal contact point determination in an exemplary embodiment of the present application;
[0078] Figure 8 is a contact point image in an exemplary embodiment of the present application;
[0079] Figure 9 is a gray scale image of a contact point search area in an exemplary embodiment of the present application;
[0080] Figure 10 is a binary image of a contact point search area in an exemplary embodiment of the present application;
[0081] Figure 11 is a closed operation image of a contact point search area in an exemplary embodiment of the present application;
[0082] Figure 12 is a contact point contour bulge image in an exemplary embodiment of the present application;
[0083] Figure 13 is a complete contact point binary image in an exemplary embodiment of the present application;
[0084] Figure 14 is a schematic diagram of a contact point positioning device structure in an exemplary embodiment of the present application. DETAILED DESCRIPTION
[0085] In order to make the objects, technical solutions and advantages of the present application clearer, further detailed description will be given below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present application. In addition, in the following description, the description of well-known structures and techniques is omitted to avoid unnecessary confusion of the concepts of the present application.
[0086] The layer structure schematic diagrams according to the embodiments of the present application are shown in the drawings. The drawings are not drawn to scale, in which some details are enlarged for the purpose of clarity, and some details can be omitted. The shapes of various regions, layers, and the relative size and position relationship therebetween shown in the drawings are only exemplary, and in actuality, there can be deviations due to manufacturing tolerances or technical limitations, and regions / layers with different shapes, sizes, and relative positions can be additionally designed by a person skilled in the art according to actual needs.
[0087] Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments in the present application without creative labor fall within the scope of protection of the present application.
[0088] In the description of the present application, it should be noted that the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0089] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as there is no conflict.
[0090] It is found through research that, due to the various shapes of the contacts on the crystal grains, the positions of the pins also need to be distinguished for different shapes of the contacts, otherwise the pins may be pierced to the outside of the contacts and damage the wafer. Therefore, the present application provides a contact positioning method, device, probe station and storage medium.
[0091] The contact positioning method provided by the embodiments of the present application will be described in detail below in combination with the drawings, specific embodiments and application scenarios.
[0092] As shown in FIG. 1, in a first aspect of the embodiments of the present application, a contact positioning method is provided, which can include: Figure 1
[0093] S110: acquiring a contact image of a target contact and acquiring a known shape of the target contact;
[0094] S120: repairing the target contact in the contact image to obtain a complete target contact binary image;
[0095] S130: judging whether an actual shape of the target contact conforms to the known shape according to the target contact binary image;
[0096] S140: positioning a position coordinate of the target contact when the actual shape of the target contact conforms to the known shape.
[0097] The method of the embodiment repairs the contact point image, and judges the shape of the contact point in the repaired contact point image. If the judgment result conforms to the known shape, the position of the contact point can be determined. After the positions of the probe and the contact point are determined, the probe is inserted into the contact point for testing. The probe can be accurately inserted into the contact point, and the wafer can be prevented from being damaged by the probe outside the contact point, thereby greatly improving the wafer testing quality.
[0098] To make the introduction clearer, the above steps are introduced as follows:
[0099] Firstly, step S110 is acquiring a contact point image of a target contact point, and acquiring a known shape of the target contact point.
[0100] In this step, the contact point image can be acquired by a high-power camera. If the area of the contact point image is very large, a specific search area needs to be determined, and the search area is the area where the contact point to be tested is located. The known shape acquired in this step can include a rectangle, a circle, a hexagon, and an octagon.
[0101] Next, step S120 is repairing the target contact point in the contact point image to obtain a complete target contact point binary image.
[0102] The image repair in this step is to obtain a clear and complete target contact point binary image from the contact point image, so that the subsequent judgment process is more accurate.
[0103] Next, step S130 is judging whether the actual shape of the target contact point conforms to the known shape according to the target contact point binary image.
[0104] In this step, the discrimination rule of each shape can be designed according to the common contact point shape, and the discrimination rule is used to judge the target contact point binary image to determine the actual shape of the target contact point.
[0105] Finally, step S140 is positioning the position coordinates of the target contact point when the actual shape of the target contact point conforms to the known shape.
[0106] If the actual shape of the target contact point conforms to the pre-setting, the position coordinates of the contact point in the image can be output. If the actual shape of the target contact point does not conform to the pre-setting, it means that the position of the image acquisition is wrong, and an alarm signal can be sent to reacquire the contact point image.
[0107] In some embodiments, judging whether the actual shape of the target contact point conforms to the known shape according to the target contact point binary image can include:
[0108] acquiring a minimum square bounding box of a target contact point contour from the target contact point binary image;
[0109] determining an overlapping area of the target contact point and four edges of the minimum square bounding box.
[0110] The ratio of the length of each overlapping region to the length of the corresponding side of the minimum bounding box is calculated to obtain a first ratio, a second ratio, a third ratio, and a fourth ratio.
[0111] For example, a minimum bounding box of the contour is first obtained, and then the relationship between the edges in each direction and the minimum bounding box is counted, and then the relationship is used for judgment. Specifically, as shown in Figure 2 The lengths of the intersection regions of the edges in the four directions and the minimum bounding box are first calculated as L1, L2, L3, and L4, and then the lengths of the edges in the four directions of the red box are calculated as D1, D2, D3, and D4, and finally the ratios of the lengths of the intersection regions in the four directions to the lengths of the edges in the four directions of the minimum bounding box are calculated as P1 = L1 / D1, P2 = L2 / D2, P3 = L3 / D3, and P4 = L4 / D4.
[0112] In some embodiments, after calculating the ratio of the length of each overlapping region to the length of the corresponding side of the minimum square bounding box, determining whether the actual shape of the target junction conforms to the known shape can further include:
[0113] When the first ratio, the second ratio, the third ratio, and the fourth ratio are all greater than a first ratio threshold, it is determined that the actual shape of the target junction is a rectangle.
[0114] As shown in Figure 3 Because the ratios (P1, P2, P3, and P4) of the intersection regions of the edges in the four directions of the rectangle and the edges of the minimum bounding box are relatively large and similar, the first ratio threshold can be set to be relatively large, for example, the first ratio threshold can be 0.75, 0.80, 0.85, etc.
[0115] In some embodiments, after calculating the ratio of the length of each overlapping region to the length of the corresponding side of the minimum square bounding box, determining whether the actual shape of the target junction conforms to the known shape can further include:
[0116] When the first ratio, the second ratio, the third ratio, and the fourth ratio are all less than a second ratio threshold, it is determined that the actual shape of the target junction is a circle.
[0117] As shown in Figure 4 Because the ratios (P1, P2, P3, and P4) of the intersection regions of the edges in the four directions of the circle and the edges of the minimum bounding box are relatively small and similar, the second ratio threshold can be set to be relatively small, for example, the second ratio threshold can be 0.25, 0.30, 0.35, etc.
[0118] In some embodiments, after calculating the ratio of the length of each overlapping region to the length of the corresponding side of the minimum square bounding box, determining whether the actual shape of the target joint conforms to the known shape may further include:
[0119] When the second ratio and the fourth ratio are less than the third ratio threshold and greater than the fourth ratio threshold, and the first ratio and the third ratio are less than the fifth ratio threshold, or when the first ratio and the third ratio are less than the third ratio threshold and greater than the fourth ratio threshold, and the second ratio and the fourth ratio are less than the fifth ratio threshold, it is determined that the actual shape of the target joint is a hexagon.
[0120] like Figure 5 As shown, since the intersection area ratios of any two opposite sides of the hexagon with the edge of the minimum bounding box are relatively close (i.e., P1 and P3 are relatively close, and P2 and P4 are relatively close), and the intersection ranges of two of the opposite sides with the edge of the minimum bounding box are slightly larger (i.e., P2 and P4 are slightly larger, and should be between the rectangle ratio threshold and the octagon ratio threshold), and the intersection ranges of the other two edges with the edge of the minimum bounding box are very small (i.e., P1 and P3 are very small), the third ratio threshold needs to be slightly larger, for example, the third ratio threshold can be 0.65, 0.70, 0.75, etc.; the fourth ratio threshold needs to be slightly smaller, for example, 0.25, 0.30, 0.35, etc.; and the fifth ratio threshold needs to be relatively small, for example, 0.15, 0.20, etc.
[0121] In another embodiment, Figure 6 As shown, the upper and lower sides of the hexagon intersect with the minimum bounding box. At this time, the ratio of the intersection area between any two opposite sides and the edge of the minimum bounding box is relatively close (that is, P1 and P3 are closer, and P2 and P4 are closer). However, at this time, the intersection range of the two opposite sides with the edge of the minimum bounding box is slightly larger, namely P1 and P3, and the intersection range of the other two edges with the edge of the minimum bounding box is very small, namely P2 and P4. P1 and P3 are less than the third ratio threshold and greater than the fourth ratio threshold, and P2 and P4 are less than the fifth ratio threshold. At this time, the third ratio threshold can still be 0.65, 0.70, 0.75, etc.; the fourth ratio threshold needs to be slightly smaller, such as 0.25, 0.30, 0.35, etc.; the fifth ratio threshold needs to be relatively small, such as 0.15, 0.20, etc.
[0122] In some embodiments, after calculating the ratio of the length of each overlapping region to the length of the corresponding side of the minimum square bounding box, determining whether the actual shape of the target joint conforms to the known shape may further include:
[0123] When the first ratio, the second ratio, the third ratio, and the fourth ratio are all smaller than the sixth ratio threshold and larger than the seventh ratio threshold, it is determined that the actual shape of the target joint is an octagon.
[0124] like Figure 7As shown, since the intersection areas of the two opposite sides of the octagon with the edge of the minimum bounding box are relatively close (i.e., P1, P2, P3, and P4 are relatively close), the intersection ranges of the four sides with the edge of the minimum bounding box are all slightly larger (P1, P2, P3, and P4 are slightly larger, which should be between the circular proportion threshold and the rectangular proportion threshold). Therefore, the sixth proportion threshold can be slightly larger, for example, 0.65, 0.70, 0.75, etc.; and the seventh proportion threshold can be slightly smaller, for example, 0.25, 0.30, 0.35, etc.
[0125] The above embodiment adopts the multi-shape contact point discrimination method, which discriminates which type of contact point by extracting the minimum bounding box of the contact point and calculating the intersection proportion of the edges of the four directions of the contact point and the minimum bounding box. This method can support common contact point shape recognition and effectively distinguish the contact point shape.
[0126] In some embodiments, obtaining the contact point image of the target contact point can include:
[0127] Obtaining a die image and a search area;
[0128] Obtaining the contact point image of the target contact point by cutting the die image according to the search area.
[0129] As shown in Figure 8 , the area of the contact point image is very large, and a specific search area needs to be determined, and then the area is cut, as shown in Figure 9 , the cut area is the area where the test contact point is located.
[0130] In some embodiments, repairing the target contact point in the contact point image to obtain a complete target contact point binary image can include:
[0131] Performing grayscale processing on the contact point image to obtain a grayscale image of the target contact point;
[0132] Performing threshold segmentation on the grayscale image to obtain an initial binary image of the target contact point;
[0133] Extracting a convex hull contour of the target contact point from the initial binary image;
[0134] Performing morphological closing operation on the initial binary image to obtain a gap-removed image;
[0135] Selecting a connected domain of the target pixel area from the gap-removed image;
[0136] Extracting a convex hull contour of the connected domain.
[0137] This step first performs grayscale processing on the cut contact point image, as shown in Figure 9 , and then performs threshold segmentation on the grayscale image to extract a contact point binary image, as shown in Figure 10As shown, the contact binary image is a black and white image, and the pixel value of each position is only 0 or 255.
[0138] For example, the threshold segmentation method can include a local adaptive threshold segmentation method, a Otsu method, a maximum entropy threshold segmentation method, an iterative threshold segmentation method, and a fixed threshold segmentation method. In order to achieve better segmentation effect, the local adaptive threshold segmentation method can be selected.
[0139] Next, morphological closing operation is performed on the contact binary image to eliminate the gap in the contact binary image, as shown in the following formula: Figure 11 As shown, the gap in the image is mostly caused by cracks or needle marks. If the gap is caused by cracks, the contact area can be separated into multiple fragmented areas, resulting in incomplete contact extraction. The process of morphological closing operation can include: first, expanding the image, and then eroding the image. This helps to eliminate or reduce the gap in the white area of the binary image.
[0140] Next, a connected domain with a pixel area greater than a set value is searched in the binary image. The connected domain means: a set of points composed of connected white areas in the binary image. The pixel area means: the number of pixels in the white connected area in the binary image. Then, the connected domain with a pixel area meeting the requirement is searched from the center of the field of view, and the convex hull contour thereof is extracted separately, as shown in the following formula: Figure 12 As shown, the convex hull means: assuming that S is an arbitrary subset of Euclidean space, the smallest convex set containing S is called the convex hull of S.
[0141] Finally, the inside of the convex hull contour is filled to obtain a complete contact binary image, as shown in the following formula: Figure 13
[0142] In some embodiments, before the connected domain with a target pixel area is screened from the de-gapped image, the contact positioning method can further include:
[0143] Removing burrs on the edge of the target contact.
[0144] The burr removal on the edge of the contact in this embodiment can reduce the interference of the protruding burrs on the edge, smooth the edge of the contact, and improve the edge precision.
[0145] In some embodiments, according to the target contact binary image, judging whether the actual shape of the target contact conforms to the known shape can further include:
[0146] According to the judgment rule of the known shape, searching whether there is a shape conforming to the judgment rule in the target contact binary image.
[0147] For example, the present embodiment knows that the contact is a rectangle, and the judgment rule of the rectangle is used to search in the target contact binary image. If there is a rectangular contact, the coordinates of the contact can be output.
[0148] The above embodiment eliminates the gap in the target contact connected domain in the contact image by the closing operation, so as to retrieve the complete contact connected domain, smoothes the edge of the contact connected domain by deburring, eliminates the edge defect of the contact connected domain by the convex hull, and fills the hole in the contact convex hull contour, so as to completely eliminate the hole in the contact, and achieve the maximum repair of the contact.
[0149] It should be noted that the contact positioning method provided in the embodiments of the present application can be executed by a contact positioning device or a control module in the contact positioning device for executing the contact positioning method. The contact positioning method executed by the contact positioning device is taken as an example in the embodiments of the present application to illustrate the contact positioning device provided in the embodiments of the present application.
[0150] As shown in Figure 14 The second aspect of the embodiments of the present application provides a contact positioning device, which can include:
[0151] The acquisition module 1410 is configured to acquire the contact image of the target contact and acquire the known shape of the target contact.
[0152] The repair module 1420 is configured to repair the target contact in the contact image to obtain a complete target contact binary image.
[0153] The judgment module 1430 is configured to judge whether the actual shape of the target contact conforms to the known shape according to the target contact binary image.
[0154] The positioning module 1440 is configured to position the coordinate of the target contact when the actual shape of the target contact conforms to the known shape.
[0155] The device in the embodiment repairs the contact image by the repair module 1420, judges the shape of the contact in the repaired contact image by the judgment module 1430, and determines the position of the contact if the judgment result conforms to the known shape. After the position of the probe and the contact is determined, the probe is inserted into the contact for testing. This can ensure that the probe is accurately inserted into the contact and prevent the probe from damaging the wafer by being inserted into the outside of the contact, thereby greatly improving the wafer testing quality.
[0156] In some embodiments, the judgment module 1430 can include:
[0157] The bounding box acquisition unit is configured to acquire the minimum square bounding box of the target contact contour from the target contact binary image.
[0158] The overlapping area determination unit is configured to determine the overlapping area of the target contact and the four edges of the minimum square bounding box.
[0159] A proportion calculation unit is configured to calculate a ratio of a length of each overlapping region to a corresponding side length of the minimum bounding box to obtain a first proportion, a second proportion, a third proportion, and a fourth proportion.
[0160] In some embodiments, the determining module 1430 can further include:
[0161] A rectangle determining sub-unit is configured to determine that the actual shape of the target contact point is a rectangle when the first proportion, the second proportion, the third proportion, and the fourth proportion are all greater than a first proportion threshold.
[0162] In some embodiments, the determining module 1430 can further include:
[0163] A circle determining sub-unit is configured to determine that the actual shape of the target contact point is a circle when the first proportion, the second proportion, the third proportion, and the fourth proportion are all less than a second proportion threshold.
[0164] In some embodiments, the determining module 1430 can further include:
[0165] A hexagon determining sub-unit is configured to determine that the actual shape of the target contact point is a hexagon when the second proportion and the fourth proportion are less than a third proportion threshold and greater than a fourth proportion threshold, or when the first proportion and the third proportion are less than a fifth proportion threshold, or when the first proportion and the third proportion are less than the third proportion threshold and greater than the fourth proportion threshold, and the second proportion and the fourth proportion are less than the fifth proportion threshold.
[0166] In some embodiments, the determining module 1430 can further include:
[0167] An octagon determining sub-unit is configured to determine that the actual shape of the target contact point is an octagon when the first proportion, the second proportion, the third proportion, and the fourth proportion are all less than a sixth proportion threshold and greater than a seventh proportion threshold.
[0168] In some embodiments, the obtaining module 1430 can include:
[0169] An image and region obtaining unit is configured to obtain a die image and a search region.
[0170] A contact point image intercepting unit is configured to intercept the die image according to the search region to obtain a contact point image of the target contact point.
[0171] In some embodiments, the repairing module 1420 can include:
[0172] A grayscale unit is configured to perform grayscale processing on the contact point image to obtain a grayscale image of the target contact point.
[0173] A threshold segmentation unit is configured to perform threshold segmentation on the grayscale image to obtain an initial binary image of the target contact point.
[0174] a contour extraction unit configured to extract a convex hull contour of the target contact point from the initial binary image;
[0175] a morphological closing operation unit configured to perform a morphological closing operation on the initial binary image to obtain a gap-removed image;
[0176] a screening unit configured to screen a connected domain of the target pixel area from the gap-removed image;
[0177] a connected domain contour extraction unit configured to extract a convex hull contour of the connected domain.
[0178] In some embodiments, the repairing module 1420 can further include:
[0179] a burr removing unit configured to remove a burr of the edge of the target contact point.
[0180] In some embodiments, the judging module 1430 can further include:
[0181] a shape judging unit configured to search whether a shape conforming to a judging rule exists in the binary image of the target contact point according to the judging rule of the known shape.
[0182] The contact positioning apparatus in the embodiments of the present application can be an apparatus, or a component, an integrated circuit, or a chip in a terminal. The apparatus can be a mobile electronic device, or a non-mobile electronic device. Exemplarily, the mobile electronic device can be a probe station, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and the non-mobile electronic device can be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc., and the embodiments of the present application are not limited in this regard.
[0183] The contact positioning apparatus in the embodiments of the present application can be an apparatus having an operating system. The operating system can be an Android operating system, an ios operating system, or other possible operating system, and the embodiments of the present application are not limited in this regard.
[0184] The contact positioning apparatus provided by the embodiments of the present application can implement the method embodiments, and each process of the method embodiments is not repeated here to avoid repetition. Figure 1 The contact positioning apparatus provided by the embodiments of the present application can implement the method embodiments, and each process of the method embodiments is not repeated here to avoid repetition.
[0185] The embodiments of the present application also provide a probe station, which can adopt the contact point positioning method of any one of the first aspect to detect a wafer. The detection process implements each process of the contact point positioning method embodiments and can achieve the same technical effects. To avoid repetition, details are not described here.
[0186] The embodiments of the present application also provide a readable storage medium, which stores a program or instructions, and the program or instructions are executed by a processor to implement each process of the contact point positioning method embodiments and can achieve the same technical effects. To avoid repetition, details are not described here.
[0187] The processor is the processor in the electronic device in the above embodiments. The readable storage medium includes a computer readable storage medium, such as a computer readable memory (Read-Only Memory, ROM), a random access memory (Random Access Memory, RAM), a magnetic disk or an optical disk, etc.
[0188] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative but not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope of protection of the claims.
Claims
1. A contact positioning method, characterized in that: include: Acquire a joint image of a target joint and acquire a known shape of the target joint; Repairing the target joint in the joint image to obtain a complete binary image of the target joint; determining, based on the binary image of the target joint, whether the actual shape of the target joint conforms to the known shape; Determining whether the actual shape of the target joint conforms to the known shape based on the target joint binary image includes: obtaining a minimum square bounding box of the target joint outline from the target joint binary image; determining an overlap area between the target joint and four sides of the minimum square bounding box; calculating a ratio of a length of each overlap area to a length of a corresponding side of the minimum square bounding box to obtain a first ratio, a second ratio, a third ratio, and a fourth ratio; and comparing the first ratio, the second ratio, the third ratio, and the fourth ratio with a ratio threshold to determine the actual shape of the target joint; When the actual shape of the target joint matches the known shape, the position coordinates of the target joint are located.
2. The contact positioning method according to claim 1, characterized in that: After calculating the ratio of the length of each overlapping region to the length of the corresponding side of the minimum square bounding box, determining whether the actual shape of the target connection point conforms to the known shape further includes: When the first ratio, the second ratio, the third ratio, and the fourth ratio are all greater than a first ratio threshold, it is determined that the actual shape of the target connection point is a rectangle.
3. The contact positioning method according to claim 1, wherein: After calculating the ratio of the length of each overlapping region to the length of the corresponding side of the minimum square bounding box, determining whether the actual shape of the target connection point conforms to the known shape further includes: When the first ratio, the second ratio, the third ratio, and the fourth ratio are all smaller than a second ratio threshold, it is determined that the actual shape of the target joint is a circle.
4. The contact positioning method according to claim 1, wherein: After calculating the ratio of the length of each overlapping region to the length of the corresponding side of the minimum square bounding box, determining whether the actual shape of the target connection point conforms to the known shape further includes: When the second ratio and the fourth ratio are smaller than a third ratio threshold and larger than a fourth ratio threshold, and the first ratio and the third ratio are smaller than a fifth ratio threshold, or when the first ratio and the third ratio are smaller than the third ratio threshold and larger than a fourth ratio threshold, and the second ratio and the fourth ratio are smaller than the fifth ratio threshold, it is determined that the actual shape of the target joint is a hexagon.
5. The contact positioning method according to claim 1, wherein: After calculating the ratio of the length of each overlapping region to the length of the corresponding side of the minimum square bounding box, determining whether the actual shape of the target connection point conforms to the known shape further includes: When the first ratio, the second ratio, the third ratio, and the fourth ratio are all smaller than a sixth ratio threshold and larger than a seventh ratio threshold, it is determined that the actual shape of the target joint is an octagon.
6. The contact positioning method according to any one of claims 1 to 5, characterized in that: The step of obtaining a connection image of a target connection includes: Acquire grain images and search areas; The grain image is intercepted according to the search area to obtain a joint image of a target joint.
7. The contact positioning method according to any one of claims 1 to 5, characterized in that: The repairing of the target joint in the joint image to obtain a complete target joint binary image includes: grayscale processing is performed on the joint image to obtain a grayscale image of the target joint; Performing threshold segmentation on the grayscale image to obtain an initial binary image of the target joint; Extracting the convex hull contour of the target joint from the initial binary image; Performing a morphological closing operation on the initial binary image to obtain a gap-removed image; Filtering out a connected domain of target pixel area from the de-gap map; Extract the convex hull contour of the connected domain.
8. The contact positioning method according to claim 7, characterized in that: Before screening out a connected domain of a target pixel area from the de-gap map, the connection point positioning method further includes: Deburr the edges of target joints.
9. The contact positioning method according to any one of claims 1 to 5, characterized in that: The determining, based on the target joint binary image, whether the actual shape of the target joint conforms to the known shape further includes: According to the known shape discrimination rule, the target joint binary image is searched to see whether there is a shape that meets the discrimination rule.
10. A contact positioning device, characterized in that: include: an acquisition module, configured to acquire a joint image of a target joint and acquire a known shape of the target joint; a repair module, configured to repair the target joint in the joint image to obtain a complete binary image of the target joint; a judgment module for judging, based on the binary image of the target joint, whether the actual shape of the target joint conforms to the known shape; the judgment module is specifically configured to obtain a minimum square bounding box of the target joint outline from the binary image of the target joint; determine an overlap area between the target joint and four sides of the minimum square bounding box; calculate a ratio of the length of each overlap area to the length of the corresponding side of the minimum square bounding box to obtain a first ratio, a second ratio, a third ratio, and a fourth ratio; and compare the first ratio, the second ratio, the third ratio, and the fourth ratio with a ratio threshold to determine the actual shape of the target joint; The positioning module is used to locate the position coordinates of the target joint when the actual shape of the target joint conforms to the known shape.
11. A probe station, characterized in that: The probe station uses the contact positioning method described in any one of claims 1 to 9 to detect wafers.
12. A readable storage medium, characterized in that: The readable storage medium stores a program or instruction, and when the program or instruction is executed by a processor, the steps of the contact positioning method according to any one of claims 1 to 9 are implemented.
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