Display panel

Abstract

Disclosed is a display panel including a cover window, an ink layer on a rear surface of the cover window and having a multi-layer structure, an intermediate frame directly bonded to the ink layer, and an adhesive layer disposed on the rear surface of the cover window and overlapping the ink layer, wherein at least one layer of the multi-layer structure of the ink layer can include a conductive material. Charges generated through the cover window are distributed to the intermediate frame via the ink layer, and are released through the intermediate frame to prevent a shift phenomenon, a green phenomenon, or a shift phenomenon and a green phenomenon in the display panel.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0187965, filed on December 27, 2021, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0003] The present invention relates to a display panel, and more specifically (but not exclusively), to a display panel in which an ink layer having a multi-layer structure comprising conductive material is disposed below a cover window, and an intermediate frame and a black matrix are directly bonded to the display panel. Background Technology

[0004] Examples of conventional display devices include liquid crystal displays (LCDs), field-emitting diode (FED) displays, electrowetting displays (EWD) displays, and organic light-emitting diode (OLED) displays.

[0005] Such a display device may include a cover window to protect the display panel from external impacts. However, there are several drawbacks, including: charge accumulation in the cover window caused by friction between the cover window and external objects or generated from the outside. Furthermore, charge can transfer from one side of the display panel to a panel layer located inside the display panel. This charge transfer can cause a shift in the panel layer, resulting in a deviation in the threshold voltage of the driving thin-film transistors mounted inside the display layer.

[0006] If the threshold voltage driving the thin-film transistor is offset higher due to the offset phenomenon, as described above, the display panel emits light with a voltage higher than expected. As a result, a "green" phenomenon occurs where the ends or sides of the display panel emit brighter light than other areas, leading to image quality degradation. This brighter area may appear as a "greenish" color to the user. Alternatively, if the threshold voltage driving the thin-film transistor is lowered due to the offset phenomenon, the display panel emits light with a signal lower than expected. This situation can also lead to the aforementioned green phenomenon, where a portion of the display panel emits brighter light than other areas, resulting in degraded image quality. Summary of the Invention

[0007] In embodiments of the present invention, the display device prevents the thin-film transistor from shifting and causing the green phenomenon by preventing charges generated due to friction in the cover window from entering the display panel.

[0008] In some non-limiting examples, a display panel according to the present application can include: a cover window; an ink layer formed with a multi-layer structure on a rear surface of the cover window and directly adhered to an intermediate frame; and an adhesive layer disposed on the rear surface of the cover window and overlapping the ink layer, wherein at least one layer of the ink layer can include a conductive material.

[0009] A display panel according to the present application can include: a cover window; an ink layer on a rear surface of the cover window and having a multi-layer structure; an intermediate frame directly bonded to the ink layer; and an adhesive layer disposed on the rear surface of the cover window and overlapping the ink layer, wherein at least one layer of the multi-layer structure of the ink layer includes a conductive material.

[0010] A display panel according to the present application can include: a cover window; an ink layer on a rear surface of the cover window, the ink layer including a plurality of individual layers; a conductive layer disposed as one of the plurality of individual layers of the ink layer; a frame member directly connected to the ink layer; and an adhesive layer disposed on the rear surface of the cover window and overlapping the ink layer.

[0011] According to the present application, with the display panel having the above structure, the charge generated in the cover window can be prevented from entering the panel layer, because the charge generated in the cover window is discharged to the intermediate frame via the conductive material in the ink layer. As a result, the charge from the cover window does not enter the inside of the display panel, thereby not causing the shift phenomenon described herein.

[0012] Thus, according to at least some embodiments of the present application, the transistors inside the panel layer can be prevented from being shifted at least due to the charge generated by the cover window.

[0013] According to one or more embodiments of the present application, the appearance of the green phenomenon of the display panel caused at least due to the shift of the transistors in the panel layer can be prevented.

[0014] According to further embodiments of the present application, by changing the length of each layer of the ink layer inwardly protruding with respect to the cover window, the adhesive layer can be prevented from delaminating from the cover window.

[0015] According to at least some embodiments of the present application, the heat spreader located at the peripheral edge can be omitted locally.

[0016] The above description is non-limiting, and additional features and advantages of the present application will be understood with reference to the following description and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a block diagram of a display panel according to embodiments of the present application.

[0018] Figure 2 This is according to an embodiment of the present invention. Figure 1 The circuit diagram of the sub-pixels of the display panel.

[0019] Figure 3 This is according to an embodiment of the present invention. Figure 1 The top view of the panel layer of the display panel.

[0020] Figure 4 It is along Figure 3 The line I-I' intercepted Figure 3 A cross-sectional view of the panel layer of the display panel.

[0021] Figure 5 It is along Figure 3 The line II-II' intercepted Figure 3 A cross-sectional view of the panel layer of the display panel.

[0022] Figure 6 This is according to an embodiment of the present invention. Figure 1 A perspective view of the flexible substrate of the display panel.

[0023] Figure 7 It is in a bent position according to an embodiment of the present invention. Figure 6 A perspective view of the flexible substrate.

[0024] Figure 8 This illustrates an embodiment of the invention incorporated into a display panel. Figure 7 Top view of the flexible curved substrate.

[0025] Figure 9 It is according to the embodiments of the present invention. Figure 8 The line A-A' intercepts Figure 8 A cross-sectional view of the display panel.

[0026] Figures 10 to 12 It is according to one or more embodiments of the present invention. Figure 9 A magnified view of region C.

[0027] Figure 13 It is according to the embodiments of the present invention. Figure 8 The line B-B' intercepts Figure 8 A cross-sectional view of the display panel.

[0028] Figures 14 to 16 It is according to one or more embodiments of the present invention. Figure 13 A magnified view of region D.

[0029] Figure 17 It is according to the embodiments of the present invention. Figure 8 The line B-B' interceptsFigure 8 A cross-sectional view of the display panel.

[0030] Figure 18 It is according to the embodiments of the present invention. Figure 8 The line A-A' intercepts Figure 8 A cross-sectional view of the display panel.

[0031] Figure 19 It is according to the embodiments of the present invention. Figure 8 The line B-B' intercepts Figure 8 A cross-sectional view of the display panel. Detailed Implementation

[0032] In the following description, embodiments will be illustrated with reference to the accompanying drawings. When an element (or region, layer, portion, etc.) is described as being "on" or "connected to" or "joined to" another element, the element may be directly connected to or joined to the other element, or there may be a third intermediate element between them.

[0033] Similar reference numerals in the accompanying drawings refer to similar elements. Furthermore, the thickness, scale, and dimensions of elements have been enlarged in the drawings for ease of description. The term "and / or" includes any and all combinations of one or more of the related listed items.

[0034] Various components are described using terms such as "first" or "second," but these components are not limited by these terms. These terms are used only to distinguish one component from others. For example, without departing from the scope of the various embodiments of the invention, a first component may be referred to as a second component; similarly, a second component may also be referred to as a first component. The singular forms expressed herein are intended to include the plural forms as well, unless the context indicates otherwise.

[0035] Terms such as “lower part,” “below,” “above,” and “upper part” are used to describe the positional relationship of the parts shown in the figures. These terms are relative concepts and do not limit the invention to the specific illustrated or described locations, but rather provide the context of the inventive features based on the orientation indicated in the figures.

[0036] It should be understood that terms such as “comprising” or “having” are used only to indicate the presence of a feature, quantity, step, operation, component, part or combination thereof, but these terms do not exclude the presence or addition of one or more other features, quantities, steps, operations, components, parts or combinations thereof.

[0037] For ease of description, the present invention will be described with reference to an organic light-emitting display panel as a non-limiting example. However, it will be appreciated that the concept of the present invention is not limited to organic light-emitting display panels, and can be applied in the same manner to other types of display panels such as liquid crystal display panels, mini LED display panels, etc.

[0038] Figure 1 This is a block diagram of a display panel 100 according to an embodiment of the present invention.

[0039] Reference Figure 1 The display panel 100 may include an image processor 151, a timing controller 152, a data driver 153, a gate driver 154, and a panel layer 110.

[0040] Image processor 151 may output a data enable signal DE and a data signal DATA using a data signal DATA provided from an external source. In addition to the data enable signal DE, in some embodiments, image processor 151 may also output one or more additional signals such as a vertical sync signal, a horizontal sync signal, a clock signal, or any combination thereof.

[0041] The image processor 151 provides a data signal DATA and one or more drive signals, including a data enable signal DE, a vertical sync signal, a horizontal sync signal, and a clock signal, to the timing controller 152. The timing controller 152 may output a gate timing control signal GDC for controlling the operating timing of the gate driver 154 and a data timing control signal DDC for controlling the operating timing of the data driver 153, based on the drive signals.

[0042] In response to the data timing control signal DDC provided from the timing controller 152, the data driver 153 can convert the data signal DATA into a gamma reference voltage through sampling and latching processing, and then output the gamma reference voltage. The data driver 153 can output the data signal DATA via data lines DL1 to DLn.

[0043] The gate driver 154 can output a gate signal while shifting the level of the gate voltage in response to the gate timing control signal GDC provided by the timing controller 152. The gate driver 154 can output the gate signal via gate lines GL1 to GLm.

[0044] Panel layer 110 can display an image when sub-pixels P emit light in response to data signals DATA and gate signals provided by data driver 153 and gate driver 154. (See reference...) Figures 2 to 5 The structure of a sub-pixel P according to at least some embodiments of the present invention is described.

[0045] Figure 2is a circuit diagram of one sub-pixel P included in the display panel 100 according to the embodiment of the present application.

[0046] Referring to Figure 2 The sub-pixel P included in the display panel 100 can include a switching transistor ST, a driving transistor DT, a compensation circuit 135, and a light emitting element 130.

[0047] The light emitting element 130 can operate to emit light using a driving current formed by the driving transistor DT.

[0048] The switching transistor ST can operate to switch so that a data signal provided via the data line 117 in response to a gate signal provided via the gate line 116 can be saved as a data voltage in a capacitor.

[0049] The driving transistor DT can operate to flow a regular driving current between a high potential power line VDD and a low potential power line GND corresponding to the data voltage saved in the capacitor.

[0050] The compensation circuit 135 compensates for a threshold voltage or the like of the driving transistor DT, and the compensation circuit 135 can include one or more thin film transistors and a capacitor. The configuration of the compensation circuit 135 can vary significantly depending on a compensation method. For example, Figure 2 The sub-pixel P is configured as a 2T1C (two transistors and one capacitor) structure including the switching transistor ST, the driving transistor DT, the capacitor, and the light emitting element 130. However, if the compensation circuit 135 is added, the sub-pixel P can be configured differently, such as a 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, 7T2C, or the like, where "T" generally refers to a transistor and "C" generally refers to a capacitor, so that 3T1C refers to three transistors and one capacitor, and so on.

[0051] Figure 3 is a top plan view of the panel layer 110 of the display panel 100 according to the embodiment of the present application.

[0052] Figure 3 An example of a state in which the panel layer 110 of the display panel 100 is not bent is shown.

[0053] Referring to Figure 3 The panel layer 110 can include an active area AA in which a plurality of pixels that emit light through thin film transistors and light emitting elements are disposed on the flexible substrate 111, and a non-active area NA which is a bezel area surrounding an edge of the active area AA.

[0054] In the non-active area NA of the flexible substrate 111, a circuit such as a gate drive circuit 154 for driving the panel layer 110, and various signal wirings such as a scan line SL, can be provided.

[0055] The circuit for driving the panel layer 110 can be provided on the flexible substrate 111 in a gate-in-panel (GIP) manner, or can be connected to the flexible substrate 111 in a tape carrier package (TCP) or a chip on film (COF) manner.

[0056] Figure 3 It is further shown that a plurality of pads 155 (herein can be referred to as pads 155) of the metal pattern can be provided on the upper or top side 111U of the four sides of the flexible substrate 111. The pads 155 are metal patterns on the flexible substrate 111 to be bonded to an external module. In the present disclosure, among the four sides shown in the state after the flexible substrate 111 is bent, the side on which the pads 155 are formed is referred to as the pad edge PE. In other words, based on Figure 3 , a virtual line from which the bending starts in the bending area BA can be defined as the pad edge PE. The virtual line is exemplified as a dashed line in Figure 3 , which is located at a position where the bending starts to appear in the flexible substrate 111, or at an interface between a flat portion of the flexible substrate (i.e., a line in the orientation of Figure 3 below) and the bending area BA. Further, among the four sides of the flexible substrate 111, the remaining side on which no pad is formed is referred to as the non-peripheral edge NPE in the present disclosure. Based on Figure 3 , in some embodiments, the non-peripheral edge can be the left side 111L, the right side 111R, and the lower or bottom side 111B of the flexible substrate 111. Other configurations are also possible, such as in one or more embodiments, the pad edge PE is any one of the left side 111L, the right side 111R, and the bottom side 111B, and the non-peripheral edge NPE is the remaining side. Additional details of the pad edge PE and the non-peripheral edge NPE will be provided later, at least with reference to Figure 8 .

[0057] The bending area BA can be formed on one side of the non-active area NA. The bending area BA can refer to a region of the flexible substrate 111 configured to bend in the direction represented by the arrow A. Although the arrow A and the description below only indicate one bending direction, in some embodiments, the flexible substrate 111 can also bend in the opposite direction to return the flexible substrate 111 to the flat state shown in Figure 3 , and it is also possible to bend in other directions.

[0058] In the non-active area NA of the flexible substrate 111, a driving circuit and a wiring for driving the screen are provided. Since an image is not displayed in the non-active area NA, the non-active area NA does not need to be visible to a user from the front surface of the flexible substrate 111. Therefore, by bending some regions of the non-active area NA of the flexible substrate 111, an area for placing the wiring and the driving circuit can be secured while reducing the size of the bezel or the non-active area NA.

[0059] Various wirings can be formed on the flexible substrate 111. The wirings can be formed in the active area AA or the non-active area NA of the flexible substrate 111. The circuit wiring 140 is formed of a conductive material, and can be formed of a conductive material having superior flexibility so as to reduce the likelihood of breakage occurring when the flexible substrate 111 is bent. The circuit wiring 140 can be formed of a conductive material having superior flexibility such as gold (Au), silver (Ag), aluminum (Al), or the like, or any combination or alloy thereof. Alternatively, the circuit wiring 140 can be formed of an alloy of magnesium (Mg), silver (Ag), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), and other materials. The circuit wiring 140 can be formed as a multi-layer structure including various conductive materials, for example, in some embodiments, can be formed as a three-layer structure including titanium (Ti), aluminum (Al), and titanium (Ti) in that order.

[0060] The circuit wiring 140 formed in the bending area BA is under tension when bent. The circuit wiring 140 extending in the same direction as the bending direction in the flexible substrate 111 can receive the greatest tension. Therefore, some of the circuit wiring 140 provided in the bending area BA can be formed to extend in a diagonal direction different from the bending direction, to reduce the local concentration of tension in the bending direction (thereby reducing the local area of high stress and strain).

[0061] Figure 4 is a cross-sectional view of the panel layer 110 taken along the line I-I' of Figure 3

[0062] Figure 5 is a cross-sectional view of the panel layer 110 taken along the line II-II' of Figure 3

[0063] The panel layer 110 according to the present application will be described with reference to Figure 4 and 5

[0064] More specifically, Figure 4 is a cross-sectional view showing the structure of the panel layer 110 in the active area AA according to one or more embodiments of the present application. Reference will be made to Figure 4 ​​​The flexible substrate 111 is a plate-shaped structure disposed at the bottom of the panel layer 110 and serves to support and protect other components disposed on the flexible substrate 111 in the panel layer 110. The flexible substrate 111 can be formed of glass or plastic and other appropriate materials. For example, the flexible substrate 111 can be formed of a film including one of a set consisting of a polyester polymer, a silicone polymer, an acrylic polymer, a polyolefin polymer, and copolymers thereof.

[0065] A buffer layer (not shown) can be further disposed on the flexible substrate 111. The buffer layer prevents moisture or impurities from penetrating into the flexible substrate 111 from the outside, and can also planarize the upper surface of the flexible substrate 111. The buffer layer is not an essential structure and can be omitted depending on the type of the thin film transistor 120 disposed in the flexible substrate 111.

[0066] The thin film transistor 120 is disposed in the flexible substrate 111 and can include a gate 121, a source 122, a drain 123, and a semiconductor layer 124. The semiconductor layer 124 can be formed of amorphous silicon or polysilicon. The semiconductor layer 124 can be formed of an oxide semiconductor. The semiconductor layer 124 can include a source region and a drain region having p-type or n-type impurities, and a channel region present between the source region and the drain region. In addition, the semiconductor layer 124 can further include a lightly doped region in the source region or the drain region adjacent to the channel region.

[0067] The source region or the drain region is heavily doped with impurities, and the source 122 and the drain 123 of the thin film transistor 120 can be connected to the source region and the drain region, respectively.

[0068] The channel region of the semiconductor layer 124 can be doped with n-type or p-type impurities, according to the structure of the thin film transistor of n-channel metal oxide semiconductor (NMOS) logic or p-channel metal oxide semiconductor (PMOS) logic.

[0069] The first insulating layer 115a can be formed as a single layer or a plurality of layers composed of silicon oxide (SiOx) or silicon nitride (SiNx). The first insulating layer 115a can be disposed so that current flowing through the semiconductor layer 124 does not flow to the gate 121. The term "plurality of layers" used herein includes a layer or material having a plurality of individual layers, which can be referred to as a "layer" and functionally serve as one layer, but is composed of a plurality of different layers. The gate 121 can serve as a switch that turns on or off the thin film transistor 120 based on an electrical signal transmitted from an external source via a gate line. The source 122 and the drain 123 are connected to a data line and can transmit an electrical signal from an external source to the light emitting element 130 from the thin film transistor 120.

[0070] A second insulating layer 115b can be formed on the first insulating layer 115a and the gate 121. The second insulating layer 115b can be formed of a single layer or multiple layers of silicon oxide or silicon nitride to insulate the gate 121, the source 122, and the drain 123 from each other.

[0071] First and second planarization layers 115c and 115d can be provided on the second insulating layer 115b. The first and second planarization layers 115c and 115d can be a configuration for protecting the thin film transistor 120 and planarizing a step formed by the thin film transistor 120. The first and second planarization layers 115c and 115d can be formed of one or more materials among an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, an unsaturated polyester resin, a polystyrene resin, a polyphenylene sulfide resin, and a benzene propyl cyclobutene.

[0072] The intermediate electrode 125 can be connected to the thin film transistor 120 via a contact hole formed in the first planarization layer 115c. The intermediate electrode 125 can electrically connect the anode 131 to the drain 123 of the thin film transistor 120.

[0073] The light emitting element 130 can be provided on the second planarization layer 115d. The light emitting element 130 can include the anode 131, the light emitting part 132, and the cathode 133.

[0074] The anode 131 is provided on the second planarization layer 115d and can serve to supply holes to the light emitting part 132. The anode 131 can contact the intermediate electrode 125 through a contact hole formed to penetrate the second planarization layer 115d. The anode 131 can be formed of indium zinc oxide, indium tin oxide, or the like as a transparent conductive material.

[0075] A bank 115e can be provided on the anode 131 and the second planarization layer 115d. The bank 115e can define a sub-pixel by dividing an area in which light is actually emitted. A spacer 115f can be provided on the bank 115e to prevent damage due to contact with a deposition mask.

[0076] The light emitting part 132 can be provided on the anode 131. The light emitting part 132 can serve to emit light. The light emitting part 132 can include an organic light emitting material that emits light by itself by an electric signal. The light emitting part 132 can include an organic light emitting material that emits colors such as red, green, blue, and white.

[0077] The cathode 133 can be provided on the light emitting part 132. The cathode 133 can serve to supply electrons to the light emitting part 132. The cathode 133 can be formed of a metal material such as magnesium (Mg), an alloy of silver and magnesium, or the like. In addition, the cathode 133 can be formed of a series of transparent conductive oxides such as tin oxide, indium zinc oxide, indium tin oxide, indium tin zinc oxide, zinc oxide, or the like.

[0078] A packaging layer 115g can be disposed on the cathode 133. The packaging layer 115g can function to prevent damage due to oxidation of components located thereunder after moisture, oxygen, or impurities introduced from the outside permeate. The packaging layer 115g can be formed by layering a plurality of barrier films. The packaging layer 115g can be formed of aluminum oxide or silicon nitride as inorganic substances.

[0079] Figure 5 is a cross-sectional view illustrating a structure of the panel layer 110 in the bending area BA according to at least some embodiments of the present application. In describing Figure 5 the above-mentioned description will be omitted.

[0080] Referring to Figure 5 , the panel layer 110 of the display panel 100 according to the present application can include a first wire 141 and a second wire 142 configured as a double-layer structure in the non-active area NA including the bending area BA.

[0081] Specifically, in the flexible substrate 111, the first wire 141 can be formed. In other words, the first wire 141 is disposed on the flexible substrate 111, and in some non-limiting examples, can be disposed directly on the flexible substrate 111. On the first wire 141, the first planarization layer 115c can be formed. In the first planarization layer 115c, the second wire 142 can be formed. In other words, the second wire 142 can be disposed on the first planarization layer 115c, and in some non-limiting examples, can be disposed directly on the first planarization layer 115c. On the second wire 142, the second planarization layer 115d can be formed. On the second planarization layer 115d, a micro-coating layer 145 can be formed, or the micro-coating layer 145 can be disposed on the second planarization layer 115d.

[0082] The first wire 141 and the second wire 142 are configured to connect the panel layer 110 and the pad area PA. The first wire 141 and the second wire 142 can be formed of a conductive material having excellent flexibility such as silver, gold, aluminum, etc. Alternatively, the first wire 141 and the second wire 142 can be formed of an alloy of molybdenum, chromium, titanium, nickel, neodymium, copper, silver, etc.

[0083] When the flexible substrate 111 is bent, stress is applied to the bending area BA. Due to this stress, a break can occur in the layer in which the wiring is wound in a conventional display device. Further, when the wiring is formed in a single layer, a larger space for arranging the wiring is used. As such in the embodiment of the application, by configuring the wiring 141, 142 in the bending area BA as a multi-layer structure, the stress that occurs in the layer in which the wiring is wound can be reduced, and the space used by the wiring can be reduced. As a result, according to the embodiment of the flexible substrate 111 and the wiring 141, 142 of the application, a break that can be formed in the bending area BA can be significantly reduced.

[0084] Figure 6 is a perspective view of the flexible substrate 111 according to the embodiment of the application.

[0085] Figure 7 is a perspective view of the flexible substrate 111 in a bent position according to the embodiment of the application.

[0086] Figure 8 is a top plan view showing the bent flexible substrate 111 incorporated into the display panel 100 according to the embodiment of the application.

[0087] Referring to Figures 6 to 8 , the flexible substrate according to the application will be described.

[0088] Referring to Figure 6 , the flexible substrate 111 can be divided into an active area AA and a non-active area NA surrounding the edge of the active area AA. The non-active area NA includes a pad area PA in which pads 155 (see Figure 3 ) are provided. In the active area AA, a plurality of sub-pixels P are provided. The sub-pixels P can be divided by gate lines and data lines that cross each other.

[0089] The circuit element 161 can be a configuration that is connected to the pads 155 (see Figure 3 ) in the pad area PA of the flexible substrate 111. The circuit element 161 can include a bump or a step. The bump of the circuit element 161 can be connected to the pads 155 (see Figure 3 ) of the pad area PA via an anisotropic conductive film. The circuit element 161 can be a chip on film (COF) in which a driver IC is mounted in a flexible film. Further, the circuit element 161 can be directly bonded to the pads 155 (see Figure 3 ) via a chip on glass (COG) process. Further, the circuit element 161 can be a flexible circuit such as a flexible printed circuit (FPC). The application will be described based on an example in which a COF is employed as the circuit element 161.

[0090] As explained above, among the four sides of the flexible substrate 111 or panel layer 110, there are pad areas PA and pads 155 (see...). Figure 3 One side of the pad is defined as the PE edge, where no pad is formed (see [reference]). Figure 3 One side of the flexible substrate 111 is defined as the peripheral edge NPE. In other words, assuming the flexible substrate 111 is square, one side is the pad edge PE, and the other three sides can be referred to as the peripheral edge NPE. Figure 8 In the top view shown, the lower side of the flexible substrate 111 (on this side, where the driver IC 165 and circuit element 161 are bent) is the pad edge PE, and the other three sides (left, right, and top) can be the peripheral edge NPE. The pad edge PE... Figure 8 The flexible substrate 111 is folded below its main body, and is therefore shown as a dashed line. Figure 8 The tangent A-A' is a cut made through the edge PE of the pad, and the tangent B-B' is a cut made through one of the outer edges NPE. This will be described later. Figures 9 to 12 and Figure 18 This shows a cross-section of the pad edge PE taken along line A-A' according to one or more embodiments of the present invention. Furthermore, Figures 13 to 17 and Figure 19 The diagram shows a cross-section of the peripheral edge NPE taken along line B-B' according to one or more embodiments of the present invention.

[0091] Return to reference Figure 7 The flexible substrate 111 can be bent in the rearward direction, so that the side in contact with the pad area PA can have a predetermined curvature. As the flexible substrate 111 bends, the pad area PA can overlap with the active area AA in the rearward direction. At the front of the display panel 100, the circuit element 161 or driver IC 165 may not be made visible, but rather located in... Figure 7 Below the flat portion of the flexible substrate 111 shown. To enable bending, the flexible substrate 111 can be formed of a flexible material. For example, the flexible substrate 111 can be formed of a plastic material such as polyimide. In other words, a portion of the flexible substrate 111 including the wiring circuit 140 and the pad area PA can be bent below the flat portion of the flexible substrate 111 including the active area AA, as shown. Figure 7 As shown. At this curved position, one side or portion of the flexible substrate 111, extending between the flat portion of the flexible substrate 111 containing the active region AA and the pad region PA, has a predetermined curvature or radius of curvature. For example... Figure 7 As shown, the pad edge PE is disposed at the interface between the boundary of the active region AA and the curved portion of the flexible substrate 111, wherein in Figure 7In the orientation, the area located at the left side of the pad edge PE is flat, the area located at the right side of the pad edge PE is curved, and the area disposed under and overlapping at least a portion of the active area AA is flat.

[0092] Referring to Figure 8 On the surface (such as the front surface or the top surface) of the curved flexible substrate 111, a cover window 164 can be bonded. The cover window 164 is formed to be larger than the curved flexible substrate 111, so that the cover window 164 can accommodate the flexible substrate 111 inside the cover window 164.

[0093] Further, on the other surface (such as the rear surface or the bottom surface) of the curved flexible substrate 111, a back plate 101 can be bonded. The back plate 101 can be used to maintain the rigidity of the display panel 100, prevent foreign substances from adhering to the bottom of the display panel 100, and absorb external impact. The back plate 101 can be implemented as a plastic film made of polyimide. It is appropriate that the back plate 101 is not formed in the bending area BA. As will be described later, the back plate 101 can include a first back plate 101a and a second back plate 101b.

[0094] Figure 9 is a cross-sectional view of the display panel 100 taken along the line A-A' of Figure 8 according to an embodiment of the present application.

[0095] Figures 10 to 12 is an enlarged view of the area C of Figure 9 according to an embodiment of the present application.

[0096] Referring to Figures 9 to 12 , a display panel 100 according to an embodiment of the present application will be described below.

[0097] As described above, Figure 9 is a cross-sectional view taken along the line A-A' of Figure 8 in more detail, a pad area PA including a pad 155 (see Figure 3 ) of the display panel 100 and a pad edge PE.

[0098] Referring to Figure 9 , the display panel 100 can include a cover window 164 as the uppermost layer, an adhesive layer 163 disposed under the cover window 164, a polarizer 162 disposed under the adhesive layer 163, and a panel layer 110 disposed under the polarizer 162. As described with reference to Figure 4 , the panel layer 110 can include a flexible substrate 111, and can be curved in the bending area BA. Figure 7 A curved panel layer 110 including the flexible substrate 111 in a curved state is exemplified.

[0099] The cover window 164 is disposed on the uppermost layer of the display panel 100, and can be formed of glass or plastic. The cover window 164 serves as a protective layer that protects internal elements of the display panel 100, and forms an external surface of the display panel 100. Accordingly, during an operation in which an electric charge can be generated due to friction, the cover window 164 is contacted by a user's finger. An electric charge can also be generated by contact between the cover window 164 and other substances such as fibers. The electric charge generated by friction or the like can be transferred along a side of the cover window and into the interior of the display panel in a conventional display apparatus.

[0100] The adhesive layer 163 is disposed below the cover window 164, and serves to adhere or bond the cover window 164 to the polarizer 162. The adhesive layer 163 can be, for example, an optical clear adhesive (OCA) or a pressure sensitive adhesive (PSA), and can be made of a transparent material.

[0101] The polarizer 162 can be formed of a film having a polarizing property. The polarizer 162 can suppress reflection of external light and reduce light reflectance when viewed from the outside of the display panel 100. The polarizer 162 can be disposed in the active area AA.

[0102] The panel layer 110 can be a layer in which pixels are formed, and the above-described transistor including a gate, a source, a drain, and a semiconductor layer is formed inside or as a part of the panel layer 110. Further, the panel layer 110 can be a layer in which light emitting diodes or the like such as an anode, a light emitting layer, and a cathode are formed. If a frictional electric charge enters the interior of the panel layer of a conventional display apparatus, a shift phenomenon can occur in the transistor, and then screen quality can be deteriorated due to the green phenomenon described herein.

[0103] The first back plate 101a is a firm structure disposed below the panel layer 110 and can serve to reinforce the rigidity of the panel layer 110. The back plate 101 can be formed of a plastic film.

[0104] The support member 170 can be configured as a three-layer structure composed of an adhesive 171, a cushion tape 172, and a heat dissipation sheet 173. The adhesive 171 can be formed on the rear surface of the first back plate 101a. The adhesive 171 can include an embosses pattern. The embosses pattern can prevent the occurrence of air bubbles. When an external impact is applied to the cushion tape 172, the cushion tape 172 can be pressed and used to absorb the impact. The cushion tape 172 can be formed on the rear surface of the adhesive 171. The heat dissipation sheet 173 can be disposed under the cushion tape 172. The heat dissipation sheet 173 can be used to dissipate heat generated in the driver IC 165 or the circuit element 161, etc. In addition, the heat dissipation sheet 173 can be used as a ground to release the electric charge transferred along the propagation path formed by the anti-static solution.

[0105] The black matrix 167 can be formed in some regions on the panel layer 110. The black matrix 167 can be formed along the edges of the panel layer 110 in some embodiments. The black matrix 167 can be formed of black ink.

[0106] The micro-coating layer 145 can be disposed on the outer surface of the panel layer 110 in the bending area BA. The micro-coating layer 145 can be used to protect the wiring extending from the pad 155 (see Figure 3 ) disposed in the pad area PA. The micro-coating layer 145 can be formed of an acrylic material such as an acrylate polymer.

[0107] The adhesive tape 168 can be disposed between the heat dissipation sheet 173 and the second back plate 101b. The adhesive tape 168 can be used to reduce the curvature of the bending area BA by having a predetermined thickness. In addition, since the adhesive tape 168 can increase the thickness of the cushion tape 172, the adhesive tape 168 can be used to absorb the impact due to external force.

[0108] The second back plate 102b is a strong structure disposed under the heat dissipation sheet 173 and can be used to reinforce the rigidity of the panel layer 110 at the end of the bending area BA.

[0109] The driver IC 165 and the circuit element 161 can be connected to each other. The circuit element 161 can be a flexible printed circuit board (FPCB). The driver IC 165 can be an IC such as a data driver, a timing controller, etc.

[0110] According to at least some embodiments of the present application, an ink layer 180 can be formed on the rear surface 164R of the cover window 164. The ink layer 180 can be configured as a multi-layer structure, and can be directly adhered to the middle frame 190. In addition, the ink layer 180 can overlap the adhesive layer 163. For example, the ink layer 180 having a multi-layer structure can be formed on the rear surface 164R of the cover window 164, and the adhesive layer 163 can be formed on the rear surface of the cover window 164. The adhesive layer 163 is a flexible material such as OCA or PSA, and thus the adhesive layer 163 can be in contact with a portion of the ink layer 180 while the adhesive layer 163 is formed. One of the plurality of layers constituting the multi-layer structure of the ink layer 180 can include a conductive material.

[0111] The middle frame 190 can be a support frame surrounding the display panel 100 and forming a lower or bottom boundary of the display panel 100 in some embodiments. The middle frame 190 can include a vertical portion 191 and a horizontal portion 192. The middle frame 190 can form an appearance of the display panel 100. The middle frame 190 preferably has rigidity and can be formed of a metal material. The middle frame 190 can include a vertical portion 191 extending vertically in an orientation of the display panel 100 and a horizontal portion 192 extending horizontally. Figure 9 The middle frame 190 can be directly adhered to the ink layer 180. As shown in FIG. 1, the vertical portion 191 of the middle frame 190 can be directly adhered to the ink layer 180. Such a middle frame 190 can be configured to provide a propagation path for discharging a charge generated by friction or the like on the front or top surface 164F of the cover window 164 and to prevent the occurrence of the shift and green phenomena described herein, as described below. Figure 9 The middle frame 190 can be directly adhered to the ink layer 180. As shown in FIG. 1, the vertical portion 191 of the middle frame 190 can be directly adhered to the ink layer 180. Such a middle frame 190 can be configured to provide a propagation path for discharging a charge generated by friction or the like on the front or top surface 164F of the cover window 164 and to prevent the occurrence of the shift and green phenomena described herein, as described below.

[0112] Referring to Figure 10 A specific structure of the ink layer 180 according to at least one embodiment will be described.

[0113] The ink layer 180 may, for example, include four layers in some embodiments. Specifically, a first layer 181 adhered to the rear surface 164R of the cover window 164 can be configured such that one end thereof (i.e., the end of the first layer 181 adhered to the rear surface 164R of the cover window 164) is in contact with the adhesive layer 163, and the other end thereof is in contact with the second layer 182. Figure 10formed to penetrate into and through the gap G formed between the end of the first layer 181 and the end 164P of the cover window 164. Thus, one end of the second layer 182 can directly contact the back surface 164R of the cover window 164. The third layer 183 can be a layer formed below the second layer 182 and in some embodiments can be disposed directly on the second layer 182. The third layer 183 can be formed to be spaced apart from the end 164P of the cover window 164 by the gap G. The fourth layer 184 can be a layer formed below the third layer 183 and in some embodiments can be disposed directly on the third layer 183. The fourth layer 184 can not be spaced apart from the end 164P of the cover window 164 by the gap G. Thus, one end of the fourth layer 184 can be formed to penetrate into and through at least a portion of the gap G formed between the end of the third layer 183 and the end of the cover window 164. Thus, one end of the fourth layer 184 can contact the back surface 182R of the second layer 182. For example, the gap G can be 0.5 mm wide, or greater or lesser, in some embodiments. The display panel 100 according to at least some embodiments in this structure can form a propagation path of electric charges. The propagation path of electric charges will be described later with reference to FIG. 3. Figure 11 The description is provided.

[0114] For example, the first layer 181 can have a height of 4 pm (micrometers). The second layer 182 can have a height of 4 pm. The height of the portion of the second layer 182 that penetrates into the gap G to contact the cover window 164 can be 8 pm (i.e., the combination of the thicknesses of the first layer 181 and the second layer 182). The third layer 183 can have a height of 4 pm. The fourth layer 184 can have a height of 4 pm. The height of the portion of the fourth layer 184 that penetrates into the gap G to contact the second layer 182 can be 8 pm (i.e., the combination of the thicknesses of the third layer 183 and the fourth layer 184). As a result, the total height of the ink layer 180 can be 16 pm in some non-limiting examples. Other configurations of the layers 181, 182, 183, 184 are also encompassed herein, including the layers 181, 182, 183, 184 having the same or different heights or thicknesses from each other, or having greater or lesser amounts than the amounts described above.

[0115] Further, the other end of the first layer 181 (i.e., the left end in the orientation of FIG. 2) can be further inwardly convex relative to the cover window 164 than the other end of the second layer 182. Here, in the orientation of FIG. 2, Figure 10 the other end of the first layer 181 (i.e., the left end in the orientation of FIG. 2) can be further inwardly convex relative to the cover window 164 than the other end of the second layer 182. Here, in the orientation of FIG. 2, Figure 10In the middle, the term "inward" refers to a direction toward the center of the display panel 100, and refers to a direction toward the line A. For example, the other end of the first layer 181 can be further projected by a distance d1 than the other end of the second layer 182. The other end of the second layer 182 can be further projected inward than the other end of the third layer 183. For example, the other end of the second layer 182 can be further projected inward by a distance d2 than the other end of the third layer 183. The other end of the third layer 183 can be further projected inward than the other end of the fourth layer 184. For example, the other end of the third layer 183 can be further projected inward by a distance d3 than the other end of the fourth layer 184. For example, the length of each of d1 to d3 can be 0.4 mm in some embodiments. Each of the distances d1, d2, d3 can be the same or different, and can be greater or less than 0.4 mm. Such a structure can prevent delamination of the adhesive layer 163, which will be described later with reference to FIG. 6. Figure 12 This will be described.

[0116] Referring to Figure 11 A propagation path of an electric charge according to one or more embodiments will be described.

[0117] According to embodiments of the present application, the second layer 182 and the fourth layer 184 can include a conductive material, or all or any combination of the layers 181, 182, 183, 184 can include a conductive material. The conductive material can include a conductive ball or a conductive wire. For example, each of the layers 181, 182, 183, 184 of the ink layer 180 can be formed of one or more materials of an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and a benzocyclobutene. The conductive ball included in each of the layers 181, 182, 183, 184 can be a conductive ball on which a conductive film is formed by pre-treating a ball formed of a polymer-based material and sputtering on an outer shell of the polymer ball. The conductive wire can be a silver nanowire formed of silver (Ag). The conductive wire is divided into a conductive section and an insulating section, and the conductive wire is irregularly disposed through the corresponding layer 181, 182, 183, 184. The conductive ball or the conductive wire is an example capable of making each of the ink layers 181, 182, 183, 184 have conductivity, and other types of conductive layers having conductivity or other methods for providing conductivity to the layers 181, 182, 183, 184 can be used.

[0118] In a non-limiting example, if the second layer 182 and the fourth layer 184 include conductive balls, the conductive balls are preferably formed in a ratio of 20% to 30% over the volume of the layers 182, 184. Further, each conductive ball can have a diameter of 10 pm. Further, each conductive ball can have a blue series color. Each conductive ball can have a surface resistance of 104to 109ohms per square meter. Other configurations are also possible, including larger or smaller diameter balls formed in different volume percentages with respect to the layers 182, 184.

[0119] For example, if the second layer 182 and the fourth layer 184 include conductive lines, the conductive lines are preferably formed in a ratio of 10% to 20% over the volume. Further, each conductive line can be 25 pm long and can have a diameter of 25 nm (i.e., nanometer). Further, each conductive line can have a gray series color. Each conductive line can have a surface resistance of 20 to 80 ohms per square meter. Other configurations are also possible for the conductive lines in addition to the conductive balls.

[0120] Reference Figure 11 The illustrated charge propagation path can generate a charge on the front or top surface 164F of the cover window 164. Since the front or top surface 164F of the cover window 164 is exposed to the outside environment, a charge can be generated by a user’s touch or contact with an external surface or material, etc. The charge generally moves in a bottom direction along the outer surface of the cover window 164 as indicated by the arrow B; if the charge moves to the display panel, more specifically, to the inside of the panel layer, a transistor provided inside the panel layer of a conventional display device can be offset, which will result in a green phenomenon, thereby degrading the screen quality. Some conventional display devices include a method of forming a charge propagation path to release a charge by applying an anti-static solution to the side of the adhesive layer, polarizer, panel layer, etc. toward the heat sink. Such a method has the following problems: the anti-static solution is not properly applied, and the applied anti-static container can be removed after completion of the application, especially, it is difficult to apply the anti-static solution to the lower portion of the pad edge due to the curved structure of the panel layer.

[0121] According to embodiments of the present application, by directly adhering the ink layer 180 having electrical conductivity to the middle frame 190 including a metal material, a charge can move to the middle frame 190 via the ink layer 180. The transmitted charge can be released via the middle frame 190. In particular, the second layer 182 is formed to penetrate into the first layer 181 and can include a conductive material. Further, the fourth layer 184 is formed to penetrate into the third layer 183 and can include a conductive material. By the penetration, the fourth layer 184 directly contacts the second layer 182. Accordingly, on the rear surface 164R of the cover window 164, a charge propagation path along the second layer 182, the fourth layer 184, and the middle frame 190 can be formed asFigure 11 The circle indicates the region C.

[0122] Referring to Figure 12 , the improvement of the delamination of the adhesive layer 163 according to the embodiment of the present application will be explained.

[0123] Figure 12 Fig. (a) in Figure 8 is a detailed view of the region C of Figure 12 Fig. (b) in

[0124] Referring to Figure 12 (a), as explained above, in the step-down configuration of the successive layers 181, 182, 182, 184, each layer of the ink layer 180 can be further protruded inwardly relative to the cover window 164 and / or the display panel 100 than the layer disposed thereunder. In particular, the first layer 181 can be further protruded by a distance d1 than the second layer 182, the second layer 182 can be further protruded by a distance d2 than the third layer 183, and the third layer 183 can be further protruded by a distance d3 than the fourth layer 184 (see Figure 10 ). Due to the step-up configuration of the ink layer 180, the ink layer 180 can have an overall inclined structure. Referring to Figure 12 Fig. (b), each of the ink layer 180 has the same degree of protrusion as the other layers disposed thereunder. In other words, each of the layers 181, 182, 182, 184 of Fig. (b) has the same width and does not have the step-up or step-down configuration in Fig. (a). As a result, in Fig. (b) of Figure 12 , the ink layer 180 does not have an inclined structure. The adhesive layer 163 is OCA or PSA, and can be made of a flexible material. Therefore, if the adhesive layer 163 contacts the cover window 164 (where the ink layer 180 is formed on the rear surface 164R of the cover window 164), the adhesive layer 163 can lift up and can cover a portion of the ink layer 180. Thereafter, during the curing of the adhesive layer 163, the adhesive layer 163 shrinks and moves inwardly by a certain distance. As shown in Figs. (a) and (b) of Figure 12 , as a result of the shrinkage of the adhesive layer 163 during the curing, spaces H1, H2 are formed between the cover window 164 and the adhesive layer 163. If the spaces H1, H2 are formed to be large, the adhesive layer 163 can be easily delaminated from the cover window 164. In Figure 12 Fig. (a) of Figure 12space H2, and can be smaller than the space H2by several orders of magnitude (i.e., at least two times, three times, or more smaller). That is, according to the embodiment of the present application, the space H1formed between the cover window 164 and the adhesive layer 163 can be minimized due to the structure of the ink layer 180. Accordingly, the structure of the ink layer 180 according to the present application can improve the delamination problem occurring between the cover window 164 and the adhesive layer 163. Figure 12 The structure of FIG. (a) can be a particularly advantageous embodiment, while the concept of FIG. (b) represents a useful improvement due to the ink layer 180, and can be preferred in some applications.

[0125] Figure 13 is a cross-sectional view of the display panel 100 taken along the line B-B' of FIG. Figure 8

[0126] Figures 14 to 16 is an enlarged view of the area D of FIG. Figure 13

[0127] In FIG. Figures 13 to 16 , the features denoted by the same reference numerals as described above are the same features having the same functions, and thus the description of the repeated features will be omitted.

[0128] As described above, Figure 13 is a cross-sectional view of the peripheral edge NPE of the display panel 100 which does not contact the pad area PA.

[0129] Referring to Figure 13 , the display panel 100 can include a cover window 164 as the uppermost layer, an adhesive layer 163 disposed below the cover window 164, a polarizer 162 disposed below the adhesive layer 163, and a panel layer 110 disposed below the polarizer 162.

[0130] The cover window 164 is disposed as the uppermost layer of the display panel 100, and can be formed of glass or plastic. If friction occurs on the cover window in a conventional display device, an electric charge can be generated by the friction, and the electric charge can be transferred along one side of the cover window and into the inside of the display panel.

[0131] The adhesive layer 163 can be disposed below the cover window 164, and can be made of a flexible material such as OCA or PSA.

[0132] The polarizer 162 can be formed of a film having a polarizing property.

[0133] ​​The panel layer 110 can be a layer in which pixels are formed, and a transistor or the like is formed inside the panel layer 110. If a frictional charge enters the inside of the panel layer in a conventional device, a shift phenomenon can occur in the transistor, and screen quality can be deteriorated due to the green phenomenon described herein.

[0134] The first back plate 101a can be a strong structure disposed below the panel layer 110.

[0135] The support member 170 can include an adhesive 171, a cushion tape 172, and a heat sink 173. In particular, the heat sink 173 can be formed of a metal material such as copper so as to dissipate heat. Further, the heat sink 173 can function as a ground terminal to discharge a charge transferred along a propagation path formed by an antistatic solution in some existing schemes.

[0136] The black matrix 167 can be formed in some areas on the panel layer 110.

[0137] According to one or more embodiments of the present application, an ink layer 180 can be formed on a rear surface 164R of the cover window 164. The ink layer 180 can be configured as a multi-layer structure, and can be directly adhered to the middle frame 190. Further, the ink layer 180 can overlap the adhesive layer 163. For example, the ink layer 180 having a multi-layer structure can be formed on the rear surface 164R of the cover window 164, and the adhesive layer 163 can be formed on the rear surface 164R of the cover window 164. The adhesive layer 163 is a flexible material such as OCA or PSA, and can be in contact with a portion of the ink layer 180 while the adhesive layer 163 is formed. One of the plurality of layers constituting the ink layer 180 can include a conductive material.

[0138] The middle frame 190 can include a vertical portion 191 and a horizontal portion 192. The middle frame 190 can form an appearance of the display panel 100. The middle frame 190 preferably has rigidity and can be formed of a metal material. The middle frame 190 can include a vertically extending vertical portion 191 and a horizontally extending horizontal portion 192. The middle frame 190 can be directly adhered to the ink layer 180. As Figure 13 shown, the vertical portion 191 of the middle frame 190 can be directly adhered to the ink layer 180. Such a middle frame 190 can be configured to provide a charge propagation path for discharging a charge generated by friction or the like on the top surface of the cover window 164, as described below.

[0139] Referring Figure 14 to FIG. 6, a specific structure of the ink layer 180 according to an embodiment of the present application will be described.

[0140] For example, the ink layer 180 can include four layers. Specifically, a first layer 181 adhered to the rear surface of the cover window 164 can be formed in such a manner that one end thereof is spaced apart from the end portion of the cover window 164 by a gap G. A second layer 182 can be a layer formed below the first layer 181. The second layer 182 can not be spaced apart from the end portion of the cover window 164 by the gap G. Thus, one end of the second layer 182 can be formed to penetrate into the gap G formed between the end portion of the first layer 181 and the end portion of the cover window 164. Thus, one end of the second layer 182 can contact the rear surface of the cover window 164. A third layer 183 can be a layer formed below the second layer 182. The third layer 183 can be formed to be spaced apart from the end portion of the cover window 164 by the gap G. A fourth layer 184 can be a layer formed below the third layer 183. The fourth layer 184 can not be spaced apart from the end portion of the cover window 164 by the gap G. Thus, one end of the fourth layer 184 can be formed to penetrate into the gap G formed between the end portion of the third layer 183 and the end portion of the cover window 164. Thus, one end of the fourth layer 184 can contact the rear surface of the second layer 182. For example, the gap G can be 0.5 mm. The display panel 100 according to one or more embodiments in this structure can form a charge propagation path similar to the above. This will be described later with reference to FIGS. 6A and 6B. Figure 15 A description thereof is provided.

[0141] For example, the first layer 181 can have a height of 4 μm. The second layer 182 can have a height of 4 μm. The height of the portion of the second layer 182 penetrating into the first layer 181 can be 8 μm. The third layer 183 can have a height of 4 μm. The fourth layer 184 can have a height of 4 μm. The height of the portion of the fourth layer 184 penetrating into the third layer 183 can be 8 μm. As a result, the total height of the ink layer 180 can be 16 μm.

[0142] Further, the other end of the first layer 181 can be further protruded inward than the other end of the second layer 182. Here, in Figure 10 the term "inward" refers to a direction toward the center of the display panel 100, and refers to a direction toward the line A. For example, the other end of the first layer 181 can be further protruded by a distance d1 than the other end of the second layer 182. The other end of the second layer 182 can be further protruded inward than the other end of the third layer 183. For example, the other end of the second layer 182 can be further protruded inward by a distance d2 than the other end of the third layer 183. The other end of the third layer 183 can be further protruded inward than the other end of the fourth layer 184. For example, the other end of the third layer 183 can be further protruded inward by a distance d3 than the other end of the fourth layer 184. For example, each of d1 to d3 can have a length of 0.4 mm. This structure can prevent delamination of the adhesive layer 163, which will be described later with reference to Figure 16 This will be described.

[0143] Reference will be made toFigure 15 A charge propagation path according to an embodiment of the present application will be described.

[0144] According to at least some embodiments, the second layer 182 and the fourth layer 184 can include a conductive material. The conductive material can include a conductive ball or a conductive wire. For example, each of the layers 181, 182, 183, 184 of the ink layer 180 can be formed of one or more materials of an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and a benzene propyl cyclobutene. The conductive ball included in each of the layers 181, 182, 183, 184 can be a conductive ball on which a conductive film is formed by pre-treating a ball formed of a polymer-based material and sputtering on the outer shell of the polymer ball. The conductive wire can be a silver nanowire formed of silver (Ag). The conductive wire is divided into a conductive section and an insulating section, and the conductive wire is irregularly disposed through the conductive section. The conductive ball or the conductive wire is an example capable of making each of the ink layers 181, 182, 183, 184 have conductivity, and other types of conductive layers having conductivity can be used.

[0145] For example, if the second layer 182 or the fourth layer 184 includes the conductive ball, the conductive ball is preferably formed at a ratio of 20% to 30%. Further, each of the conductive balls has a diameter of 10 μm. Further, each of the conductive balls can have a blue color. Each of the conductive balls can have a surface resistance of 104to 109ohms / square meter.

[0146] For example, if the second layer 182 or the fourth layer 184 has the conductive wire, the conductive wire is preferably formed at a ratio of 10% to 20%. Further, each of the conductive wires can be 25 μm long and can have a diameter of 25 nm. Further, each of the conductive wires can have a gray color. Each of the conductive wires can have a surface resistance of 20 to 80 ohms / square meter.

[0147] Referring to Figure 15 The illustrated charge propagation path, a charge can be generated on the top surface of the cover window 164. Since the cover window 164 is a surface exposed to the outside, a charge can be generated by a user's touch or the like. The charge moves in a bottom direction along the outer surface of the cover window 164; if the charge moves to the display panel 100, more specifically, to the inside of the panel layer 110, a transistor disposed in the inside of the panel layer 110 can be offset, which will cause a green phenomenon, thereby degrading screen quality. The prior art selected a method of forming a charge propagation path to release a charge by coating an antistatic solution on a side of an adhesive layer, a polarizer, a panel layer, or the like facing a heat sink. Such a method has the following problems: the antistatic solution can not be properly coated, and the coated antistatic container can be removed after completion of the coating.

[0148] According to at least one embodiment, by directly adhering the ink layer 180 having electrical conductivity to the intermediate frame (or frame member) 190 including a metallic material, an electric charge can move to the intermediate frame 190 via the ink layer 180. The transmitted electric charge can be released via the intermediate frame 190. In particular, the second layer 182 is formed to penetrate into the first layer 181, and can include an electrically conductive material. Further, the fourth layer 184 is formed to penetrate into the third layer 183, and can include an electrically conductive material. By the penetration, the fourth layer 184 becomes in contact with the second layer 182. Accordingly, on the rear surface of the cover window 164, an electric charge propagation path along the second layer 182, the fourth layer 184, and the intermediate frame 190 can be formed.

[0149] Referring to Figure 16 The improvement of the delamination of the adhesive layer 163 according to the embodiment of the present application will be explained.

[0150] Figure 16 FIG. (a) of Figure 13 is a detailed view of the region D of Figure 16 FIG. (b) of

[0151] Referring to Figure 16 FIG. (a), as described above, each layer of the ink layer 180 can be further convex inwardly than the layer disposed thereunder. In particular, the first layer 181 can be further convex by a distance d1 than the second layer 182, the second layer 182 can be further convex by a distance d2 than the third layer 183, and the third layer 183 can be further convex by a distance d3 than the fourth layer 184 (see Figure 14 ). In comparison, due to the structure of the sequential convexity, the ink layer 180 can have an inclined structure. Referring to Figure 16 FIG. (b), the degree of convexity of each of the ink layer 180 is the same as that of the other layers disposed thereunder. In Figure 16 FIG. (b), the ink layer 180 does not have an inclined structure. The adhesive layer 163 is OCA or PSA, and can be made of a flexible material. Accordingly, if the cover window 164 is contacted in which the ink layer 180 is formed on the rear surface of the cover window 164 with the adhesive layer 163, the adhesive layer 163 can be lifted and can cover a portion of the ink layer 180. Thereafter, during the curing of the adhesive layer 163, the adhesive layer 163 shrinks and moves inwardly by a certain distance. In this case, between the cover window 164 and the adhesive layer 163, spaces H1, H2 can be formed. If the spaces H1, H2 are formed to be large, the adhesive layer 163 can be easily delaminated from the cover window 164. In Figure 16 the space H1 in FIG. (a) is smaller than in Figure 16The space H2 in Figure (b) is shown. That is, according to an embodiment of the invention, the space H1 formed between the cover 164 and the adhesive layer 163 can be minimized. Therefore, the structure according to one or more embodiments can improve the delamination problem that occurs between the cover 164 and the adhesive layer 163.

[0152] Figure 17 It is in accordance with one or more embodiments of the present invention. Figure 8 The sectional view of the display panel 100 is taken by line B-B'.

[0153] Figure 17 The implementation method can be compared to Figure 13 One or more implementations omit the implementation of heat sink 173. Therefore, when describing... Figure 17 In this case, the reference mark that is the same as the reference mark described above refers to a similar construction with the same function. Therefore, the description of the repeated construction will be omitted.

[0154] According to some embodiments, panel layer 110 may be disposed below adhesive layer 163 in the outer edge NPE that does not contact pad area PA. Below panel layer 110, adhesive 171 and buffer strip 172 may be formed sequentially.

[0155] The buffer strip 172 can be adhered to the intermediate frame 190. More specifically, the buffer strip 172 can be adhered to the horizontal portion 192 of the intermediate frame 190.

[0156] exist Figure 17 In this embodiment, the support member 170 does not include a heat sink. As described above, at least one layer of the multilayer structure of the ink layer 180 may include a conductive material. Furthermore, the ink layer 180 may be directly adhered to the intermediate frame 190, which may also include a metallic material. Therefore, the charge generated on the top surface of the cover window 164 can move along the propagation path formed in the conductive ink layer 180 and the intermediate frame 190. The heat sink 173, omitted in at least some embodiments, is like... Figure 13 As in one or more embodiments, it can be used to release charge. However, in Figure 17 Since the intermediate frame 190 is used to discharge electrical charge, the heat sink 173 can be omitted. This reduces the manufacturing cost of the display panel 100 and also reduces its thickness and weight.

[0157] Figure 18 It is in accordance with one or more embodiments of the present invention. Figure 8 The sectional view of the display panel 100 is taken by line A-A'.

[0158] Figure 19 It is in accordance with one or more embodiments of the present invention. Figure 8a cross-sectional view of the display panel 100 taken along line B-B' of FIG. 1.

[0159] Referring to Figure 18 and 19 , a display panel 100 according to at least some embodiments will be described.

[0160] In the embodiments described with reference to Figures 9 to 13 , the ink layer 180 includes four layers 181, 182, 183, 184, but the present disclosure includes a display panel 100 having fewer than four layers. For example, Figure 18 and Figure 19 , the ink layer 180 of the display panel 100 can include only two layers 185 and 186. Hereinafter, the description of the configuration referred to by the same reference numerals will be omitted.

[0161] Referring to Figure 18 and 19 , the ink layer 180 can include a first layer 185 and a second layer 186. The first layer 185 can be disposed on the rear surface 164R of the cover window 164. The first layer 185 can be formed in such a way that one end thereof, for example, the right end, is spaced apart from the end or outer edge of the cover window 164 by a gap G. The second layer 186 can be disposed below the first layer 185. One end of the second layer 186 can be formed to penetrate into the gap G and extend across the height or thickness of the first layer 185 to contact the rear surface 164R of the cover window 164. Accordingly, the second layer 186 can be in direct contact with the cover window 164.

[0162] Further, the second layer 186 can include a conductive material. For example, the conductive material can be a conductive ball or a conductive wire. The middle frame 190 can include a metal material. Accordingly, the electric charge generated by friction or the like on the front surface or top surface 164F of the cover window 164 can move along the propagation path formed in the ink layer 180 and the middle frame 190, and then be discharged.

[0163] Further, the other end of the first layer 185 can be further protruded inwardly than the second layer 186. Here, the term "inwardly" refers to a direction toward the center of the display panel 100, to a direction toward the line A in Figure 18 , or to a direction toward the line B in Figure 19 . Such a protruding structure reduces the space that can be formed between the adhesive layer 163 and the cover window 164. Accordingly, the delamination phenomenon in which the adhesive layer 163 is delaminated from the cover window 164 can be reduced as described herein.

[0164] The display device according to the embodiments of the present application can include: a finished product or final product including an LCM such as a laptop, a television, and a computer display, an OLED module, etc.; an automobile display device or an instrument display device for other types of vehicles; and a unit electronics device, or a unit apparatus or unit device such as a mobile electronics device including a smart phone or a mobile tablet.

[0165] The display device according to one or more embodiments of the present application as described above can again be briefly summarized as follows. According to one or more embodiments, a display panel can include: a cover window; an ink layer formed with a multi-layer structure on a rear surface of the cover window and directly adhered to an intermediate frame; and an adhesive layer disposed on the rear surface of the cover window and overlapping the ink layer, wherein at least one layer of the ink layer can include a conductive material.

[0166] The intermediate frame can include a metallic material, and a charge generated on the cover window can be released to the intermediate frame via the ink layer.

[0167] The ink layer can include: a first layer having one end spaced apart from one end of the cover window by a gap; a second layer disposed below the first layer and having one end penetrating into the gap and in contact with the cover window; a third layer disposed below the second layer and having one end spaced apart by the gap; and a fourth layer disposed below the third layer and having one end penetrating into the gap and in contact with the second layer.

[0168] The other end of the first layer can further protrude inward than the other end of the second layer.

[0169] The other end of the second layer can further protrude inward than the other end of the third layer.

[0170] The other end of the third layer can further protrude inward than the other end of the fourth layer.

[0171] The second layer and the fourth layer can include a conductive material.

[0172] The conductive material can include a conductive sphere.

[0173] The conductive sphere can be formed at a ratio of 20% to 30%.

[0174] The conductive material can include a conductive wire.

[0175] The conductive wire can be characterized by silver nanowires.

[0176] The conductive wire can be formed at a ratio of 10% to 20%.

[0177] The intermediate frame can include a metallic material, and a charge generated in the cover window can be released to the intermediate frame via the second layer and the fourth layer.

[0178] The display panel can have a pad area formed with pads, and at a pad edge in contact with the pad area, the display panel can include: a panel layer disposed below the adhesive layer; a circuit element and a driver IC disposed below the panel layer; and an adhesive, a buffer tape, and a heat sink disposed below the panel layer in that order.

[0179] The display panel can have a pad area formed with pads, and at a peripheral edge not in contact with the pad area, the display panel can further include: a panel layer disposed below the adhesive layer; an adhesive, a buffer tape, and a heat sink disposed below the panel layer in that order, wherein the heat sink can be adhered to the intermediate frame.

[0180] The display panel can have a pad area formed with pads, and at a peripheral edge not in contact with the pad area, the display panel can further include: a panel layer disposed below the adhesive layer; an adhesive, and a buffer tape disposed below the panel layer in that order, wherein the buffer tape can be adhered to the intermediate frame.

[0181] The ink layer can include: a first layer having one end spaced apart from one end of the cover window by a gap; and a second layer disposed below the first layer and having one end permeated into the gap and in contact with the cover window.

[0182] The second layer can include a conductive material.

[0183] The intermediate frame can include a metallic material.

[0184] A charge generated in the cover window can be released to the intermediate frame via the second layer.

[0185] The other end of the first layer can be further convex inward than the other end of the second layer.

[0186] The conductive material can include at least one of a conductive ball and a conductive wire.

[0187] Those skilled in the art will understand that the present application can be implemented in other specific forms without changing the technical idea or essential characteristics of the present application. Therefore, it should be understood that the above-described embodiments are exemplary in all aspects and are not limiting the present application. The scope of the present application should be interpreted to include all modifications or variations derived from the meaning and scope of the present application and the appended claims and their equivalent concepts.

[0188] The various embodiments described above can be combined to provide further embodiments. The above description and / or the application data sheet incorporated by reference lists or discusses, among other things, United States patents, United States patent application publications, United States patent applications, foreign patents, foreign patent applications, and non-patent literature publications. The disclosure of each of these documents and / or the entireties of these documents are hereby expressly incorporated by reference. Various aspects of the embodiments can be modified; individual aspects can be employed independently, with or without the use of other aspects. The scope of the disclosure is not limited to the specific embodiments described herein, but only by the claims and their equivalents.

[0189] These and other changes can be made to the embodiments in light of the above descriptions. In general, the described features, structures, or characteristics can be combined in any suitable manner to describe the embodiments, unless the context clearly dictates otherwise. Thus, the claims should not be limited to the features, structures, or characteristics of the preferred embodiments. Rather, the claims should be interpreted as including all possible embodiments that can be explicitly disclosed or inherently recognized by the specification and equivalents thereof.

Claims

1. A display panel, comprising: Cover the windows; An ink layer located on the rear surface of the cover window, the ink layer having a multi-layer structure; The intermediate frame is directly attached to the ink layer; as well as An adhesive layer is disposed on the rear surface of the cover window and overlaps with the ink layer, wherein at least one layer of the multilayer structure of the ink layer contains a conductive material. The multilayer structure of the ink layer further includes: The first layer, one end of which is separated from one end of the cover window by a gap; as well as The second layer is disposed below the first layer and has one end that penetrates into the gap and contacts the cover window.

2. The display panel of claim 1, wherein the intermediate frame comprises a metallic material, and wherein the cover window is configured to generate an electric charge that is released to the intermediate frame via the ink layer.

3. The display panel according to claim 1, wherein the multilayer structure of the ink layer further includes: A third layer, which is disposed below the second layer and has one end separated from the cover window by the gap; as well as A fourth layer is disposed below the third layer and has one end that penetrates into the gap and contacts the second layer.

4. The display panel according to claim 3, wherein the other end of the first layer protrudes further inward relative to the cover window than the other end of the second layer.

5. The display panel according to claim 3, wherein the other end of the second layer protrudes further inward relative to the cover window than the other end of the third layer.

6. The display panel according to claim 3, wherein the other end of the third layer protrudes further inward relative to the cover window than the other end of the fourth layer.

7. The display panel of claim 3, wherein the second layer and the fourth layer comprise conductive materials.

8. The display panel according to claim 7, wherein the conductive material comprises conductive balls.

9. The display panel of claim 8, wherein each of the second and fourth layers comprises conductive spheres formed at a ratio of 20% to 30% in volume and comprising a ratio of 20% to 30%.

10. The display panel according to claim 7, wherein the conductive material comprises conductive wires.

11. The display panel according to claim 10, wherein the conductive lines are silver nanowires.

12. The display panel of claim 10, wherein each of the second and fourth layers comprises conductive spheres formed at a ratio of 10% to 20% in volume and comprising a ratio of 10% to 20%.

13. The display panel of claim 7, wherein the intermediate frame comprises a metallic material, and wherein the cover window is configured to generate an electric charge that is released to the intermediate frame via a second and a fourth layer of the ink layer.

14. The display panel according to claim 1, further comprising: A pad area comprising multiple pads, wherein at the edge of the pads in contact with the pad area on the display panel, the display panel further comprises: A panel layer disposed beneath the adhesive layer; Circuit elements and driver ICs disposed beneath the panel layer; and The adhesive, buffer strip, and heat sink are sequentially arranged below the panel layer.

15. The display panel according to claim 1, further comprising: A pad area comprising multiple pads, wherein at the outer edge of the display panel that does not contact the pad area, the display panel further comprises: A panel layer disposed beneath the adhesive layer; The adhesive, buffer strip, and heat sink are sequentially arranged below the panel layer. The heat sink is attached to the intermediate frame.

16. The display panel according to claim 1, wherein the display panel further comprises: A pad area comprising multiple pads, wherein at the outer edge of the display panel that does not contact the pad area, the display panel further comprises: A panel layer disposed beneath the adhesive layer; The adhesive and cushioning strip are sequentially installed below the panel layer. The buffer strip is attached to the intermediate frame.

17. The display panel of claim 1, wherein the second layer comprises a conductive material.

18. The display panel of claim 17, wherein the intermediate frame comprises a metallic material, and wherein the cover window is configured to generate an electric charge that is released to the intermediate frame via the second layer.

19. The display panel of claim 1, wherein the other end of the first layer protrudes further inward relative to the cover window than the other end of the second layer.

20. The display panel of claim 17, wherein the conductive material comprises at least one of conductive balls and conductive wires.

21. A display panel, comprising: Cover the windows; An ink layer located on the rear surface of the cover window, the ink layer comprising multiple individual layers; A conductive layer, wherein the conductive layer is configured as one of a plurality of individual layers of the ink layer; The frame members are directly connected to the ink layer; as well as An adhesive layer is disposed on the rear surface of the cover window and overlaps with the ink layer. The first of the plurality of individual layers is separated from the cover window by a gap, and the second of the plurality of individual layers extends through the gap and contacts the cover window.

22. The display panel according to claim 21, further comprising: A panel layer disposed on the adhesive layer; Adhesive disposed beneath the panel layer; as well as A buffer strip is positioned below the adhesive.

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