Display device

Abstract

Embodiments of the disclosure provide a display device including a front member disposed on a front surface of a display panel and having a curved area and a flat area, a second adhesive layer disposed on a rear surface of the display panel, a first member disposed on the second adhesive layer, a second member disposed on the first member, a heat dissipation member disposed on the second member, an encapsulation member encapsulating the heat dissipation member and including a first area and second areas disposed on both sides of the first area, and a third adhesive layer disposed on the heat dissipation member, wherein the curved area is located at both ends of the front member in a width direction of the front member, and wherein a width of the encapsulation member is less than or equal to a width of the front member.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit and priority of Korean Patent Application No. 10-2021-0190852, filed in Korea on December 29, 2021, the entire contents of which are expressly incorporated herein by reference. Technical Field

[0003] This disclosure relates to a display device, and more specifically, to a display device capable of improving heat dissipation. Background Technology

[0004] Display devices are used in various forms and methods in televisions, monitors, smartphones, tablets, laptops, wearable devices, etc. Among the various forms and methods of display devices used, there are organic light-emitting display devices (OLED devices), etc.

[0005] Organic light-emitting display devices include self-emissive elements whose components are themselves light-emitting bodies, thus eliminating the need for a separate light source. This allows them to be flexible or to be implemented in display devices with various designs. Furthermore, organic light-emitting display devices can be manufactured to be thinner than liquid crystal displays (LCDs) and offer advantages such as excellent color reproduction, viewing angles, contrast ratios, and fast response times. Therefore, they can be used to create displays for high-definition video, leading to their expanding applications.

[0006] An organic light-emitting display device includes an active region for displaying on a screen and an active region formed along the outer edge of the active region. Additional components or various connecting components, such as flexible circuit boards for connecting the additional components, can be disposed in the active region.

[0007] The thickness and width of display devices increase with the addition of multiple components. This increase in thickness and width presents drawbacks in terms of design and portability; therefore, research is underway on technologies that reduce the thickness and width of display devices while maintaining their rigidity.

[0008] Furthermore, heat is generated in the driver integrated circuit and the like when the display device is driven. Therefore, a heat dissipation layer can be provided on the rear surface of the display panel to dissipate (or dissipate) the heat from the driver integrated circuit and the like, and research is underway on technologies to improve heat dissipation efficiency.

[0009] Recently, curved display devices have been developed to increase the viewer's immersion and tension or to provide a wide screen. Summary of the Invention

[0010] To effectively dissipate heat from the driving integrated circuit, the thickness of the heat dissipation layer can be increased, but the overall thickness of the display device increases with the increased thickness of the heat dissipation layer, so the bezel area increases.

[0011] In addition, after performing a process of manufacturing or bending the display panel, it can be difficult to additionally bond the heat dissipation layer in the process, so the driving integrated circuit can be difficult to effectively dissipate heat.

[0012] Therefore, the inventors of the present disclosure have conducted several experiments so that the heat dissipation performance can be improved without increasing the thickness of the display device. Through various experiments, a display device having a new structure capable of improving heat dissipation characteristics without increasing the thickness of the display device has been invented.

[0013] One aspect of the present disclosure provides a display device capable of maintaining rigidity and improving heat dissipation performance without increasing the overall thickness of the display device.

[0014] The object of the present disclosure is not limited to the above-mentioned object, and other objects not mentioned above can be clearly understood by those skilled in the art according to the following description.

[0015] The display device according to an exemplary embodiment of the present disclosure includes a front member disposed on a front surface of a display panel and having a curved area and a flat area, a second adhesive layer disposed on a rear surface of the display panel, a first member disposed on the second adhesive layer, a second member disposed on the first member, a heat dissipation member disposed on the second member, an encapsulation member encapsulating the heat dissipation member and including a first area and second areas disposed on both sides of the first area, and a third adhesive layer disposed on the heat dissipation member, wherein the curved area is located at both ends of the front member in a width direction of the front member, and wherein a width of the encapsulation member can be less than or equal to a width of the front member.

[0016] The display device according to another exemplary embodiment of the present disclosure includes a front member having a curved area and a flat area, a first adhesive layer disposed on a rear surface of the front member, a display panel disposed on the first adhesive layer, a second adhesive layer disposed on the display panel, a first heat dissipation layer disposed on the second adhesive layer and including a metal, a first buffer layer disposed on the first heat dissipation layer, a second heat dissipation layer disposed on the first buffer layer, an encapsulation layer having an encapsulation portion encapsulating an entire surface of the second heat dissipation layer and wing portions disposed on both sides of the encapsulation portion, and a third adhesive layer disposed on the second heat dissipation layer, wherein the first buffer layer and the third adhesive layer can contact each other through a plurality of holes formed in the wing portions of the encapsulation layer.

[0017] According to the disclosure, since the heat dissipation member is provided in the display device having the curved area and the flat area and the adhesive structure of the heat dissipation member is formed in the curved area, it is possible to improve the heat dissipation performance without increasing the total thickness of the display device.

[0018] According to the disclosure, by forming a structure using an adhesive layer having a higher adhesive strength than the adhesive strength of the encapsulation member that encapsulates the heat dissipation member, it is possible to improve the adhesive performance of the heat dissipation member.

[0019] Effects according to the disclosure are not limited to the above-illustrated contents, and more various effects are included in the specification. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a plan view of a display device according to an exemplary embodiment of the disclosure.

[0021] Figure 2 is a cross-sectional view taken along a cutting line I-I' of Figure 1

[0022] Figure 3 is an enlarged view of a cross-section A-A' of Figure 2

[0023] Figure 4 is a real photo of a cross-sectional view according to Figure 2

[0024] Figure 5 is a plan view of an encapsulation member according to another exemplary embodiment of the disclosure.

[0025] Figure 6 is an enlarged view of a cross-section A-A' of Figure 2 DETAILED DESCRIPTION

[0026] Advantages and features of the disclosure and methods of achieving the advantages and features will become apparent by referring to the exemplary embodiments described below in detail with reference to the accompanying drawings. However, the disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example in order for those skilled in the art to completely understand the disclosure disclosed and the scope of the disclosure. Therefore, the disclosure will be limited only by the scope of the appended claims.

[0027] ​​​​The shapes, sizes, proportions, angles, numbers, etc. shown in the drawings for describing exemplary embodiments of the disclosure are merely examples and the disclosure is not limited thereto. Throughout the specification, like drawing reference numerals generally refer to the same element. Also, in the following description of the disclosure, detailed explanations of known related technologies can be omitted to avoid unnecessarily obscuring the subject matter of the disclosure. The terms such as "include," "have," and "consist of" used herein are generally intended to allow the addition of other components, unless the terms are used with the term "only." Any reference to the singular can include the plural unless explicitly stated otherwise.

[0028] Components are interpreted to include ordinary error ranges even if not explicitly stated.

[0029] When terms such as "upper," "above," "below," and "near" are used to describe the positional relationship between two components, one or more components can be located between the two components, unless the terms are used with the term "immediately" or "directly."

[0030] In describing the temporal relationship, for example, when the temporal order is described as "after," "subsequently," "next," and "before," unless "exactly" or "directly" is used, discontinuous cases can be included.

[0031] It should be understood that although the terms "first," "second," and the like can be used herein to describe various elements, the elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, the first element mentioned below can be the second element within the technical idea of the disclosure.

[0032] The features of the various embodiments of the disclosure can be partially or wholly joined or combined with each other and can be mutually operable and technically driven in various ways, and the various embodiments of the disclosure can be implemented independently of each other or can be implemented together in a mutually dependent relationship.

[0033] In the disclosure, the "display device" can include a display device in a narrow sense, such as a liquid crystal module (LCM), an organic light emitting module (OLED module), and a quantum dot module (QD module) including a display panel and a driving unit for driving the display panel. In addition, as a complete product (or final product) including the LCM, the OLED module, or the QD module, the display device can include a package (or a package device) or a package electronic device, such as a notebook computer, a television, a computer monitor, a device display device including a vehicle-mounted display device or other type of vehicle-use device, or a mobile electronic device such as a smartphone or an electronic tablet.

[0034] Accordingly, the display device of the disclosure can include a narrow display device itself (e.g., an LCM, an OLED module, or a QD module), as well as a kit device as a final consumption device or an application product including the LCM, the OLED module, or the QD module.

[0035] Further, in some cases, the LCM, the OLED module, and the QD module including the display panel and the driving unit can be referred to as a narrow "display device", and the electronic device including the LCM, the OLED module, and the QD module as a complete product can be referred to as a "kit device". For example, the narrow display device can include an LCD, an OLED, or a QD display panel, and a source printed circuit board (PCB) as a controller for driving the display panel. The kit device can further include a kit PCB, which is a kit controller electrically connected to the source PCB to control the entire kit device.

[0036] As the display panel used in the present embodiment, all types of display panels such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, a quantum dot (QD) display panel, an electroluminescent display panel, and the like can be used. Also, the display panel used in the present embodiment is not limited to a specific display panel capable of frame bending having a flexible substrate and a lower back plate support structure of an OLED display panel. Further, it is not limited to the shape or size of the display panel used in the display device according to the exemplary embodiment of the disclosure.

[0037] For example, when the display panel is an OLED display panel, it can include a plurality of gate lines and a plurality of data lines, and a pixel formed at an intersection of the gate lines and the data lines. Further, the display panel can be configured to include an array including a thin film transistor which is an element for selectively applying a voltage to each pixel, an organic light emitting diode (OLED) layer on the array, and an encapsulation substrate or an encapsulation layer or the like provided on the array to cover the organic light emitting diode layer. The encapsulation layer can protect the thin film transistor and the organic light emitting diode layer or the like from external impact, and prevent moisture or oxygen from penetrating into the organic light emitting diode layer. Further, the layer formed on the array can include an inorganic light emitting layer, such as a nano-sized material layer or a quantum dot.

[0038] Hereinafter, various configurations of a display device capable of improving a heat dissipation effect without increasing the total thickness will be described in detail.

[0039] Figure 1 is a plan view of a display device according to an exemplary embodiment of the disclosure. Figure 2 is a cross-sectional view taken along a cutting line I-I' of Figure 1 Figure 3 is a cross-sectional view taken along a cutting line II-II' of Figure 2 ​an enlarged view of the cross section A-A' of FIG. 1. The rear direction and the upper direction defined herein can be the Z-axis direction, and the front direction and the lower direction can be the -Z-axis direction. For example, Figure 1 A front surface of the display device 100 is shown.

[0040] Referring to Figures 1 to 3 The display device 100 can be configured to include a front member 200, a display panel 400, and a heat dissipation structure 700.

[0041] The front member 200 can be attached to a front surface of the display panel 400. For example, the front member 200 can be bonded to the display panel 400 through a first adhesive layer 310.

[0042] The display panel 400 can include a display substrate formed of plastic (e.g., a polymer or polyimide (PI)) or glass. The display panel 400 can include an active area that displays an image and a non-active area. A plurality of sub-pixels for displaying an image and a driving circuit unit for driving the plurality of sub-pixels can be disposed in the active area. A pixel array unit can include the plurality of sub-pixels and the driving circuit unit. The non-active area is formed to surround the active area, and can be an area that does not display an image.

[0043] The bezel can be a non-active area that surrounds the active area in a display device product to which the display device 100 is applied. The non-active area of the display device 100 and the bezel can be the same area. The circuit board 105, the driving integrated circuit 110, and a connector 120 connected to an external device can be disposed in the non-active area. The connector 120 can be a current connector, but is not limited to the term.

[0044] According to an exemplary embodiment of the disclosure, a chip on film (COF) in which the driving integrated circuit 110 is directly mounted on the display panel 400 can be applied, but the disclosure is not limited thereto. The circuit board 105 can be a flexible printed circuit board (FPCB), and the circuit board 105 can be directly mounted or attached to the display panel 400.

[0045] One side (or one end portion) of the circuit board 105 can be attached to the non-active area of the display panel 400, and the other side (or the other end portion) of the circuit board 105 is bent and disposed on the rear surface of the display panel 400, and thus these structures can make the non-active area of the display panel 400 observed from the front to be reduced. Further, the end portion of the display panel 400 in which the circuit board 105 is mounted can also be bent to some degree later with the circuit board 105, so that the non-active area of the display panel 400 observed from the front can be further reduced.

[0046] According to another exemplary embodiment of the disclosure, one side (or one end portion) of the display panel 400 can be bent and disposed on the rear surface of the display panel 400 to minimize the non-active area of the display panel 400 viewed from the front. The driving integrated circuit 110 can be disposed on the rear surface of the display substrate based on the degree to which the circuit board 105 is bent.

[0047] As the radius of curvature of the display panel 400 or the circuit board 105 increases, the non-active area of the display panel 400 viewed from the front increases. Accordingly, if the total thickness of the display device 100 is reduced, the radius of curvature of the circuit board 105 can be formed to be small.

[0048] A pixel array unit including a thin film transistor layer and a light emitting element can be disposed on the display panel 400. The pixel array unit includes a plurality of sub-pixels. Each of the plurality of sub-pixels can be a separate light emitting unit, and a light emitting element can be disposed in each of the plurality of sub-pixels.

[0049] The driving integrated circuit 110 generates data signals and gate control signals based on image data and timing synchronization signals provided from an external host driving system. In addition, the driving integrated circuit 110 can provide the data signals to the data lines of the respective pixels through the display pad unit, and can provide the gate control signals to the gate driving circuit unit.

[0050] Since the driving integrated circuit 110 generates a large amount of heat, it can be necessary for the driving integrated circuit 110 to effectively dissipate heat. For example, heat in the display panel 400 and the driving integrated circuit 110 can be effectively dissipated through the first heat dissipation structure 500 or the second heat dissipation structure 700.

[0051] The first heat dissipation structure 500 and the second heat dissipation structure 700 are located between the display panel 400 and the driving integrated circuit 110, and can effectively dissipate heat generated from the display panel 400 and the driving integrated circuit 110. The first heat dissipation structure 500 and the second heat dissipation structure 700 can be a buffer plate, a heat dissipation layer, etc., but are not limited to the term. For example, the second heat dissipation structure 700 can be an extended heat dissipation structure, not limited to the term.

[0052] The first heat dissipation structure 500 can be configured to include a first member (or a first heat dissipation layer) 510 and a second member (or a first buffer layer) 520. The second heat dissipation structure 700 can be configured to further include a heat dissipation member (or a second heat dissipation layer) 600 on the first heat dissipation structure 500. For example, the first member 510, the second member 520, and the heat dissipation member 600 can be sequentially stacked in the rear surface direction of the display device 100.

[0053] A first member (or a first heat dissipation layer) 510 can be disposed on the display panel 400. The first member 510 can be disposed under a display substrate constituting the display panel 400 and supplement the rigidity of the display substrate. The first member 510 can be formed to have a certain strength and thickness to supplement the rigidity of the display substrate. The first member 510 can be a back plate, a support layer, a heat dissipation member, a rigid member, etc., but is not limited to such terms.

[0054] The first member (or the first heat dissipation layer) 510 can transfer heat generated from the display panel 400 upward. The first member 510 can absorb heat generated from the display panel 400 and transfer the heat to other media. The first member 510 can be formed of a material having high thermal conductivity or high heat dissipation efficiency. For example, the first member 510 can be a metal layer including copper, but is not limited to such a material.

[0055] A second adhesive layer 320 can be disposed between the display panel 400 and the first member 510. The second adhesive layer 320 can join the display panel 400 and the first member 510 to each other. The second adhesive layer 320 can transfer heat generated from the display panel 400 to the first member 510.

[0056] A second member (or a first buffer layer) 520 can be disposed on the first member 510. The second member 520 can have a heat dissipation function and an impact absorption function. The second member 520 can receive heat generated in the display panel 400 from the first member 510 and transfer it to other media. The second member 520 can absorb an external impact applied to the display device 100 and reduce the impact transferred to the display panel 400. The second member 520 can be a buffer layer, a foam layer, or an impact absorption layer, but is not limited thereto. For example, the second member 520 can be a foam having a plurality of air bubbles therein, and can be formed as a polyurethane foam, but the present disclosure is not limited thereto. For example, the second member 520 can have a thickness greater than that of the first member 510.

[0057] The second member 520 can be formed of a metal having a porous shape. For example, the second member 520 can be a metal foam or a flexible conductive film (FCF), but is not limited to such terms. The material of the second member 520 can be formed of a metal, but is not limited thereto. For example, the second member 520 can be formed of copper (Cu) which has high thermal conductivity and is easy to manufacture a porous shape (or a porous shape).

[0058] Since the second member 520 is formed of a metal having a porous shape, its weight is lighter than that of the same metal not having a pore. Since the second member 520 has a soft characteristic, its processability (e.g., cutting or bending) can be facilitated. In addition, since the second member 520 has a porous shape, its surface area in contact with air is large, and thus it can have the advantage of heat dissipation.

[0059] The thickness of the second member 520 can be greater than the thickness of the first member 510. For example, the second member 520 can absorb an external impact on the display device 400 and reduce the impact transmitted to the display panel 400. The adhesive layer can be interposed between the first member 510 and the second member 520.

[0060] The heat generated in the display panel 400 can be effectively dissipated by the first heat dissipation structure 500. In addition, by absorbing the external impact on the display device 100 by the first heat dissipation structure 500, the rigidity of the display device 100 can be supplemented, so that damage due to the external impact can be prevented.

[0061] In addition to the first heat dissipation structure 500, a heat dissipation member (or a second heat dissipation layer) 600 and a third adhesive layer 330 can be additionally provided in the display device 100. By providing the heat dissipation member 600 and the third adhesive layer 330, the heat dissipation efficiency can be improved, and the rigidity can be further supplemented.

[0062] The heat dissipation member (or the second heat dissipation layer) 600 can dissipate heat received from the first heat dissipation structure 500. The heat dissipation member 600 can be formed of a material having a higher thermal conductivity than the thermal conductivity of the first member 510. For example, the heat dissipation member 600 can be formed of graphite and is not limited to such a material.

[0063] The third adhesive layer 330 can be provided on the heat dissipation member 600. The third adhesive layer 330 can cover the heat dissipation member 600 and absorb an external impact on the display device 100. The third adhesive layer 330 can be an embossing layer or a buffer layer and is not limited to the term. For example, the third adhesive layer 330 can have a thickness of 60 µm and an adhesive strength of 1000 gf, but is not limited thereto.

[0064] The heat dissipation member 600 can be formed of a graphite material. Graphite is light in weight and thin, and has excellent thermal conductivity compared to aluminum (Al) or copper (Cu). For example, the thermal diffusivity in the planar direction is more than three times that of copper. In addition to the heat dissipation characteristics in the longitudinal direction (or Z-axis direction), graphite has heat dissipation characteristics in the lateral direction (or X-axis direction), and thus has a higher heat conduction efficiency compared to aluminum (Al) or copper (Cu). Graphite cannot be used alone, and graphite is used with a protective film due to the electrical conductivity and the possibility of generating dust.

[0065] Referring to Figure 3 The width of the heat dissipation member 600 can be less than the width of the front member 200. The encapsulation member (or the sealing layer) 340 can encapsulate (or seal) the heat dissipation member 600 at the upper and lower portions of the heat dissipation member 600. The encapsulation member 340 can eliminate the electrical conductivity and the possibility of generating dust of the heat dissipation member 600.

[0066] The encapsulation member 340 can be formed of two planar layers (or sheets) to encapsulate the heat dissipation member 600 at the upper and lower surfaces of the heat dissipation member 600, respectively. The encapsulation member 340 can be bonded to the third adhesive layer 330 disposed on the encapsulation member 340 and can be bonded to the second member 520 disposed under the encapsulation member 340. For example, each of the two planar layers of the encapsulation member 340 can be formed of a material having an adhesive property at both surfaces thereof. For example, the encapsulation member 340 can have a thickness of 5 µm to 10 µm and an adhesive strength of 500 gf to 600 gf, but is not limited thereto.

[0067] The encapsulation member 340 can be composed of a first region (or sealing portion) R1 encapsulating (or sealing) the heat dissipation member 600 between two planar layers and second regions (or wing portions) R2 disposed on both sides of the first region (or sealing portion) R1, which are directly bonded to each other. Accordingly, at least one region or all regions of the heat dissipation member 600 can be encapsulated by the encapsulation member 340.

[0068] According to an exemplary embodiment of the disclosure, the first heat dissipation structure 500 and the second heat dissipation structure 700 can be formed to be smaller than the size of the display panel 400. When the first heat dissipation structure 500 and the second heat dissipation structure 700 are formed to be larger than the display panel 400, a non-active area can be increased. Accordingly, the size of the first heat dissipation structure 500 and the second heat dissipation structure 700 can be formed to be smaller than the size of the display panel 400 so that the non-active area is not increased. As another example, when the first heat dissipation structure 500 and the second heat dissipation structure 700 are formed to be smaller than the display panel 400, the weight of the display device 100 can be reduced and the manufacturing cost can be reduced, but the heat dissipation function and the impact absorption function can be reduced.

[0069] In addition, when the first heat dissipation structure 500 and the second heat dissipation structure 700 are formed to be smaller than the display panel 400, a step is generated between the first heat dissipation structure 500 and the second heat dissipation structure 700 and the display panel 400, and at the end portion of the display panel 400 where the step is formed, since the display panel 400 protrudes without being supported by the first heat dissipation structure 500 and the second heat dissipation structure 700, it can be easily damaged when an external impact is applied thereto.

[0070] The display device 100 can be configured such that a portion of a region of the display panel 400 has a curved surface. Referring to Figures 1 to 2 , the front member 200 can have a curved region CA and a planar region PA.

[0071] The front member 200 can be encapsulation glass, a cover window, or tempered glass, etc., but is not limited to the term. The curved area CA can be provided at one or both ends of the front member 200 in the first direction (or X-axis direction). The radius of curvature of the curved area CA can not have a fixed value.

[0072] The display device 100 according to an exemplary embodiment of the disclosure can have curved areas CA at both ends of the front member 200. The values of the respective radii of curvature of the curved areas CA at both ends can be different from each other.

[0073] Referring to Figure 2 , components provided at the upper portion of the front member 200 can be affected by the shape of the front member 200. For example, the display panel 400, the first member 510, the second member 520, and the heat dissipation member 600 provided in the planar area PA of the front member 200 can have a planar shape, and the display panel 400, the first member 510, the second member 520, and the heat dissipation member 600 provided in the curved area CA of the front member 200 can have a curved shape.

[0074] The display panel 400, the first member 510, the second member 520, and the heat dissipation member 600 provided in the curved area CA of the front member 200 can maintain the curved shape by the adhesive strength of the first adhesive layer 310, the second adhesive layer 320, and the encapsulation member 340. The display panel 400, the first member 510, the second member 520, and the heat dissipation member 600 can have a restoring force (or elastic force) due to the material properties of the respective components. The restoring force can also be affected by the thickness of the respective components. For example, as the thickness of the respective components increases, the restoring force can increase.

[0075] The adhesive force and the restoring force act in opposite directions. For example, the adhesive force points to the outside of the arc formed by the curved area CA, and the restoring force points to the inside of the arc formed by the curved area CA. When the adhesive force is greater than the restoring force, the respective components can maintain their state of being joined to the curved area CA. If the restoring force is greater than the adhesive force, the respective components can not be able to maintain their state of being joined to the curved area CA. For example, at least one of the first adhesive layer 310, the second adhesive layer 320, and the encapsulation member 340 can be delaminated without maintaining the state of being joined.

[0076] Figure 4 is a real photo according to Figure 2 a cross-sectional view.

[0077] Referring to Figure 4It can be observed that the adhesion between the display panel 400 and the first heat dissipation structure 500 is maintained on the curved area CA of the front member 200 by the first adhesive layer 310 and the second adhesive layer 320, respectively. However, it can be observed that no adhesion is maintained between the first heat dissipation structure 500 and the encapsulation member 340 and a phenomenon of warpage (warpage phenomenon) occurs.

[0078] The encapsulation member 340 can include two planar layers to encapsulate (or seal) the heat dissipation member 600 at the upper surface and the lower surface of the heat dissipation member 600, respectively. Each of the two planar layers of the encapsulation member 340 can be formed of a material having an adhesive property at both surfaces thereof. The encapsulation member can consist of a first region (or sealing portion) R1 encapsulating (or sealing) the heat dissipation member 600 between the two planar layers and a second region (or wing portion) R2 in which the two planar layers are directly bonded to each other.

[0079] A location at which the warpage phenomenon of the encapsulation member 340 occurs can be a location within the curved area CA. For example, the warpage phenomenon of the encapsulation member 340 can occur in the second region R2 in the curved area CA. The warpage phenomenon of the encapsulation member 340 can be caused by a weak adhesive strength of the encapsulation member 340 itself and a stepped shape at a boundary between the first region R1 and the second region R2 of the encapsulation member 340, but the cause of the phenomenon is not limited thereto.

[0080] The stepped shape at the boundary between the first region R1 and the second region R2 can be moved from the curved area CA to the planar area PA by reducing the first region R1 in which the encapsulation member 340 encapsulates the heat dissipation member 600, for example, by reducing the width of the heat dissipation member 600. Accordingly, the warpage phenomenon of the encapsulation member 340 can be reduced, but as the area of the heat dissipation member 600 is reduced, the heat dissipation performance can be degraded.

[0081] The warpage phenomenon can be eliminated by supplementing the adhesive strength of the encapsulation member 340. As a method of supplementing the adhesive strength of the encapsulation member 340, a method of enhancing the adhesive strength of the encapsulation member 340 itself (or a first method) and a method of enhancing the adhesive strength from the outside of the encapsulation member 340 (or a second method) can be used. In the first method, there can be a limitation on the attempt of the first method since the thickness of the encapsulation member 340 is increased and the encapsulation function thereof can be affected by the change of the adhesive material.

[0082] The inventors of the disclosure have conducted several experiments to enhance the adhesive strength from the outside of the encapsulation member 340. Through various experiments, a display device having a new structure capable of enhancing the adhesive strength without changing the characteristics of the encapsulation member 340 has been invented.

[0083] Figure 5is a plan view of a packaging member according to another exemplary embodiment of the disclosure. Figure 6 is a plan view of a packaging member according to another exemplary embodiment of the disclosure. Figure 2 is an enlarged view of a cross-section A-A' of

[0084] Referring to Figure 5 , the display device 100 according to another exemplary embodiment of the disclosure can have a plurality of holes formed in a second area R2 of the packaging member 340. Referring to Figure 6 , the display device 100 according to another exemplary embodiment of the disclosure can include a front member 200, a first adhesive layer 310, a display panel 400, a second adhesive layer 320, a first member 510, a second member 520, a packaging member 340 of a packaging heat dissipation member 600, and a third adhesive layer 330. Here, components identical or similar to those of Figure 3 will be briefly described.

[0085] Referring to Figure 5 and Figure 6 , the packaging member 340 can be formed of two planar layers to package (or seal) the heat dissipation member 600 at upper and lower surfaces of the heat dissipation member 600, respectively. Each of the two planar layers of the packaging member 340 can be formed of a material having an adhesive property at both surfaces thereof. For example, the packaging member 340 can have a thickness of 5 µm to 10 µm and an adhesive strength of 500 gf to 600 gf, but is not limited thereto. The packaging member can be composed of a first area (or a sealing portion) R1 in which the heat dissipation member 600 is packaged (or sealed) between the two planar layers and a second area (or a wing portion) R2 in which the two planar layers are directly bonded to each other.

[0086] The packaging member 340 can have a plurality of holes HL in the second area R2. The third adhesive layer 330 can be directly bonded to the second member 520 through the plurality of holes HL in the second area R2. The adhesive strength of the third adhesive layer 330 can be 1000 gf, and the adhesive strength of the packaging member 340 can be 500 gf to 600 gf. Since the adhesive strength of the third adhesive layer 330 is higher than the adhesive strength of the packaging member 340, the force with which the third adhesive layer 330 is bonded to the second member 520 through the plurality of holes HL can be stronger than the force with which the packaging member 340 is bonded to the second member 520. Accordingly, the warping phenomenon between the packaging member 340 and the second member 520 can be addressed by supplementing the adhesive strength of the packaging member 340 and the second member 520.

[0087] Referring to Figure 6 , the front member 200 can be configured to have a curved area CA and a planar area PA. The curved area CA can be disposed at one or both ends of the front member 200 in a first direction (or an X-axis direction). The values of the respective radii of curvature of the curved areas CA at the both ends can be different from each other.

[0088] The display panel 400 can be bonded to the rear surface of the front member 200. For example, the display panel 400 can be bonded to the front member 200 through the first adhesive layer 310.

[0089] The first member (or first heat dissipation layer) 510 can be disposed on the display panel 400. The first member 510 can be disposed under a display substrate constituting the display panel 400 and supplement the rigidity of the display substrate. The first member 510 can absorb heat generated from the display panel 400 and transfer the heat to other media.

[0090] The second adhesive layer 320 can be disposed between the display panel 400 and the first member 510. The second adhesive layer 320 can bond the display panel 400 and the first member 510 to each other. The second adhesive layer 320 can transfer heat generated from the display panel 400 to the first member 510.

[0091] The second member (or first buffer layer) 520 can be disposed on the first member 510. The second member 520 can have a heat dissipation function and an impact absorption function. The second member 520 can receive heat generated in the display panel 400 from the first member 510 and transfer it to other media. The second member 520 can absorb external impact applied to the display panel 400 and reduce the impact transferred to the display panel 400.

[0092] The heat dissipation member (or second heat dissipation layer) 600 can be disposed on the second member 520. The heat dissipation member 600 can dissipate heat received from the second member 520. The heat dissipation member 600 can be formed of a graphite material.

[0093] The encapsulation member (or sealing layer) 340 can be formed of two planar layers to encapsulate the heat dissipation member 600 at the upper and lower surfaces of the heat dissipation member 600, respectively. The encapsulation member 340 can eliminate the electrical conductivity and the possibility of generating dust of the heat dissipation member 600. Each of the two planar layers of the encapsulation member 340 can be formed of a material having an adhesive property at both surfaces thereof. The adhesive strength of the encapsulation member 340 can be 500 gf to 600 gf, but is not limited thereto.

[0094] The encapsulation member 340 can be composed of a first region (or sealing portion) R1 encapsulating (or sealing) the heat dissipation member 600 between the two planar layers and a second region (or wing portion) R2 in which the two planar layers are directly bonded to each other. Accordingly, at least one region or all regions of the heat dissipation member 600 can be encapsulated by the encapsulation member 340. The encapsulation member 340 can have a plurality of holes HL in the second region R2.

[0095] A third adhesive layer 330 can be disposed on the heat dissipation member 600. The third adhesive layer 330 can cover the heat dissipation member 600 and absorb an external impact on the display device 100. The adhesive strength of the third adhesive layer 330 can be 1000 gf, but is not limited thereto.

[0096] In a display device according to another exemplary embodiment of the disclosure, in order to enhance the adhesive strength between the components in the curved area CA, for example, in order to supplement the adhesive strength between the second member 520 and the encapsulation member 340, the second area R2 of the encapsulation member 340 can have a plurality of holes HL.

[0097] The third adhesive layer 330 and the second member 520 can be directly bonded to each other through the plurality of holes HL. For example, the adhesive strength of the third adhesive layer 330 can be 1000 gf, and the adhesive strength of the encapsulation member 340 can be 500 gf to 600 gf, but is not limited thereto. Since the adhesive strength of the third adhesive layer 330 is higher than the adhesive strength of the encapsulation member 340, the force with which the third adhesive layer 330 is bonded to the second member 520 through the plurality of holes HL can be stronger than the force with which the encapsulation member 340 is bonded to the second member 520. Accordingly, the warping phenomenon between the encapsulation member 340 and the second member 520 can be addressed by supplementing the adhesive strength of the encapsulation member 340 and the second member 520. Accordingly, by improving the adhesive performance between the components in the curved area CA, a display device 100 capable of improving reliability can be provided.

[0098] The width of the encapsulation member 340 can be equal to or less than the width of the front member 200. The area of the second area R2 of the encapsulation member 340 can be affected by the area of the first area R1, for example, the area occupied by the heat dissipation member 600. The area of the second area R2 can be divided into the area of the region in which the plurality of holes HL are formed and the area of the region in which the plurality of holes HL are not formed. The area of the region in which the plurality of holes HL are formed can be affected by the shape and interval of the plurality of holes HL. For example, the area in which the third adhesive layer 330 is bonded to the second member 520 can be affected by the shape and interval of the plurality of holes HL. In addition, the area in which the third adhesive layer 330 and the second member 520 are bonded can be affected by the height of the encapsulation member 340 in the second area R2.

[0099] The plurality of holes HL can have a circular shape or a polygonal shape. The area of the plurality of holes HL can be adjusted by adjusting the circular shape or the polygonal shape of the plurality of holes HL. Accordingly, by making the force obtained by adding the adhesive strength of the encapsulation member 340 and the second member 520 and the adhesive strength of the third adhesive layer 330 and the second member 520 stronger than the restoring force of the heat dissipation member 600 or the encapsulation member 340, the warping phenomenon can be eliminated.

[0100] The plurality of holes HL can be arranged side by side at the same interval. The area of the plurality of holes HL can be adjusted by adjusting the interval between the plurality of holes HL. Accordingly, by making the force obtained by adding the adhesion strength of the encapsulation member 340 to the second member 520 and the adhesion strength of the third adhesive layer 330 to the second member 520 stronger than the restoring force of the heat dissipation member 600 or the encapsulation member 340, the warpage phenomenon can be eliminated.

[0101] Example embodiments of the present disclosure can also be described as follows:

[0102] A display device according to an embodiment of the present disclosure includes a front member disposed on a front surface of a display panel and having a curved area and a planar area, a second adhesive layer disposed on a rear surface of the display panel, a first member disposed on the second adhesive layer, a second member disposed on the first member, a heat dissipation member disposed on the second member and having a width different from a width of the front member, an encapsulation member encapsulating the heat dissipation member and including a first area and a second area, and a third adhesive layer disposed on the heat dissipation member, wherein the curved area is located at both ends of the front member in a width direction of the front member, and wherein the width of the encapsulation member is less than or equal to the width of the front member.

[0103] According to some embodiments of the present disclosure, the heat dissipation member can be encapsulated in the first area of the encapsulation member.

[0104] According to some embodiments of the present disclosure, the second area of the encapsulation member can include a plurality of holes.

[0105] According to some embodiments of the present disclosure, the plurality of holes can be arranged side by side at the same interval.

[0106] According to some embodiments of the present disclosure, the plurality of holes can have a circular shape or a polygonal shape.

[0107] According to some embodiments of the present disclosure, the third adhesive layer and the second member can contact each other in the plurality of holes.

[0108] According to some embodiments of the present disclosure, the first member can include a metal.

[0109] According to some embodiments of the present disclosure, the display device can further include a first adhesive layer between the display panel and the front member.

[0110] According to some embodiments of the present disclosure, the width of the heat dissipation member can be less than the width of the front member.

[0111] According to another embodiment of the disclosure, a display device includes a front member having a curved area and a flat area, a first adhesive layer disposed on a rear surface of the front member, a display panel disposed on the first adhesive layer, a second adhesive layer disposed on the display panel, a first heat dissipation layer disposed on the second adhesive layer and including a metal, a first buffer layer disposed on the first heat dissipation layer, a second heat dissipation layer disposed on the first buffer layer and having a width different from a width of the front member, an encapsulation layer having an encapsulation portion and a wing portion that encapsulate a front surface of the second heat dissipation layer, and a third adhesive layer disposed on the second heat dissipation layer, wherein the first buffer layer and the third adhesive layer contact each other through a plurality of holes formed in the wing portion of the encapsulation layer.

[0112] According to some embodiments of the disclosure, the plurality of holes can have a circular shape or a polygonal shape, and the plurality of holes can be disposed at the same interval.

[0113] According to some embodiments of the disclosure, the wing portion can be adjacent to one side of the curved area and disposed within the curved area.

[0114] According to some embodiments of the disclosure, the width of the second heat dissipation layer can be less than the width of the front member.

[0115] Although the exemplary embodiments of the disclosure have been described in detail with reference to the accompanying drawings, the disclosure is not limited thereto and can be implemented in many different forms without departing from the technical idea of the disclosure. Therefore, the exemplary embodiments of the disclosure are provided only for the purpose of illustration, and are not intended to limit the technical idea of the disclosure. The scope of the technical idea of the disclosure is not limited thereto. Therefore, it should be understood that the above-described exemplary embodiments are illustrative in all aspects and do not limit the disclosure. The scope of protection of the disclosure should be interpreted based on the appended claims, and all technical ideas within the equivalent scope thereof should be understood to fall within the scope of the disclosure.

Claims

1. A display device, comprising: The front component is disposed on the front surface of the display panel and has curved and flat areas; A second adhesive layer is disposed on the rear surface of the display panel; The first component is disposed on the second adhesive layer; The second component is disposed on the first component; A heat dissipation component is disposed on the second component; An encapsulation component encapsulates the heat dissipation component and includes a first region and a second region disposed on both sides of the first region; as well as A third adhesive layer is disposed on the heat dissipation component. The curved regions are located at both ends of the front member along its width direction. Wherein, the width of the encapsulation component is less than or equal to the width of the front component. The heat dissipation component is encapsulated in the first region of the encapsulation component. The second region of the encapsulation component includes a plurality of holes, and The third adhesive layer and the second component are in contact with each other in the plurality of holes.

2. The display device according to claim 1, wherein, The plurality of holes are arranged side by side at the same intervals.

3. The display device according to claim 1, wherein, The plurality of holes have a circular or polygonal shape.

4. The display device according to claim 1, wherein, The first component comprises metal.

5. The display device according to claim 1, further comprising: A first adhesive layer is located between the display panel and the front component.

6. The display device according to claim 1, wherein, The width of the heat dissipation component is smaller than the width of the front component.

7. The display device according to claim 1, wherein, The adhesive strength of the third adhesive layer is greater than the adhesive strength of the encapsulation component.

8. A display device, comprising: The front component has both curved and planar regions; A first adhesive layer is disposed on the rear surface of the front member; A display panel is disposed on the first adhesive layer; A second adhesive layer is disposed on the display panel; A first heat dissipation layer is disposed on the second adhesive layer and includes metal; A first buffer layer is disposed on the first heat dissipation layer; The second heat dissipation layer is disposed on the first buffer layer; The encapsulation layer has an encapsulation portion for encapsulating the front surface of the second heat dissipation layer and wings disposed on both sides of the encapsulation portion; as well as The third adhesive layer is disposed on the second heat dissipation layer. The first buffer layer and the third adhesive layer are in contact with each other through a plurality of holes formed in the wing of the encapsulation layer.

9. The display device according to claim 8, wherein, The plurality of holes have a circular or polygonal shape, and the plurality of holes are arranged at the same intervals.

10. The display device according to claim 8, wherein, The wing is adjacent to one side of the curved region and is disposed within the curved region.

11. The display device according to claim 8, wherein, The width of the second heat dissipation layer is smaller than the width of the front component.

12. The display device according to claim 8, wherein, The adhesive strength of the third adhesive layer is greater than that of the encapsulation layer.

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