Ring filter integrated structure, radio frequency unit and base station

CN116365200BActive Publication Date: 2026-08-28HUAWEI TECH CO LTD
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Patent Information

Application Number
CN202111571613.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-12-21
Publication Date
2026-08-28
Estimated Expiration
2041-12-21

AI Technical Summary

Technical Problem

然而,通过级联匹配窗口300”调整环形滤波器100”的阻抗,导致环形滤波器10”的整体尺寸较大,在通道越来越多,元器件分布越来越密集的情况下,如何实现单板上元器件的紧密排列,如何优化单板上元器件的分布方案称为亟待解决的问题

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Abstract

The application relates to the technical field of wireless communication, and discloses a circulator filter integrated structure, a radio frequency unit and a base station. The circulator filter integrated structure comprises a conductor component, a filter and a circulator which are connected, signal transmission between the filter and the circulator can be realized through the conductor component, that is, the circulator filter integrated structure has the functions of one-way transmission and filtering at the same time. In the application, signal transmission between the dielectric filter and the circulator is realized through the conductor component. Since the conductor component has the characteristics of absorbing and radiating electromagnetic wave signals, the size of the position where the dielectric filter and the circulator are connected is reduced, the size of the circulator is reduced, the size of the connected dielectric filter and the circulator is reduced, that is, the size of the circulator filter integrated structure is reduced, single-board dense arrangement is facilitated, the layout scheme of components in the base station is optimized, and single-board dense arrangement in the base station is realized.
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Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and in particular to a circulator filter integrated structure, a radio frequency unit, and a base station. Background Technology

[0002] With the increasing development of wireless communication technology, base stations have attracted much attention. Figure 1 A schematic diagram of an active antenna element 1 in a base station is shown. Figure 1 As shown, the active antenna unit 1 forms several channels 11, each channel 11 including a Remote Radio Unit (RRU) and an antenna 30. The radio frequency components mainly include a filter 100 for filtering transmitted and received signals, a circulator / isolator 200 for unidirectional transmission of transmitted and received signals, a power amplifier tube 20, a duplexer (not shown), a combiner (not shown), a tower amplifier (not shown), and a power divider (not labeled), etc. The circulator / isolator 200 prevents the received signal from being transmitted to the power amplifier tube, thereby improving the power amplifier line performance of the radio frequency devices. It can be understood that a circulator can also be called a looper, which will not be elaborated upon below.

[0003] As the number of channels 11 increases, the distribution of components within the active antenna element 1 becomes increasingly dense, leading to a stronger demand for component integration. In some implementations of this application, the filter and circulator are integrated into a single ring filter to optimize the component layout within the active antenna element 1. Currently, the integration primarily includes the following two forms.

[0004] Figure 2 A ring filter 10' is shown, such as Figure 2 As shown, in some application scenarios, the filter is a metal cavity filter. The ring filter 10' includes a bandpass filter 100', a low-pass filter 200', a circulator 300', a base shell 400', and a top cover 500', wherein the circulator 300' includes a center conductor 310'. The bandpass filter 100' has a mounting slot, and the low-pass filter 200' is disposed within the mounting slot. The bandpass filter 100' is cascaded with both the low-pass filter 200' and the center conductor 310'. It is not difficult to see that although the above-mentioned ring filter 10' achieves integrated molding of the bandpass filter 100', low-pass filter 200', and embedded circulator 300', with the current evolution of filters from metal cavity filters to dielectric filters, dielectric filters are receiving increasing attention due to their advantages such as high Q value and small size. Based on this, Figure 2 The performance of the ring filter 10' in the current base station cannot meet the rapid development of the current base station, and the economic benefits are not high.

[0005] To address the aforementioned issues, current integration methods for components also include the integrated molding of dielectric filters and circulators. Figure 3 A ring filter 10” is shown, such as Figure 3 As shown, the ring filter 10” includes a dielectric filter 100”, a circulator 200”, and a cascaded matching window 300”. The circulator 200” is provided with a first end 210”, a second end 220”, and a third end 230”. One end of the dielectric filter 100” is connected to the first end 210” of the circulator 200”. A cascaded matching window 300” is provided at the connection between the dielectric filter 100” and the first end 210” of the circulator 200” to adjust the impedance of the ring filter 100”. Although the above-mentioned ring filter 10” achieves the integrated molding of the dielectric filter 100” and the circulator 200”, simplifying the connection between components and reducing the loss during transmission, adjusting the impedance of the ring filter 100” through the cascaded matching window 300” results in a large overall size of the ring filter 10”. With the increasing number of channels and the increasingly dense distribution of components, how to achieve a tight arrangement of components on the single board and how to optimize the distribution scheme of components on the single board become problems that urgently need to be solved. Summary of the Invention

[0006] To address the aforementioned issues, this application provides a circulator filter integrated structure, a radio frequency unit, and a base station.

[0007] A first aspect of this application provides a circulator filter integrated structure, which includes a dielectric filter, a circulator, and a conductor component. The dielectric filter and the circulator are connected. Electromagnetic wave signals in the dielectric filter are transmitted to the circulator through the conductor component, and electromagnetic wave signals in the circulator are transmitted to the dielectric filter through the conductor component.

[0008] In this application, a circulator refers to a product with unidirectional transmission functionality or a collection of components capable of achieving unidirectional transmission functionality. This application does not specifically limit the structural or assembly form of the circulator. Connecting the dielectric filter and the circulator means that the dielectric filter and the circulator are mechanically connected, i.e., the dielectric filter and the circulator are fixed together. Specifically, the dielectric filter includes a body, which includes a dielectric body and a conductive layer covering the surface of the dielectric body. A portion of this conductive layer can serve as the ground plane of the dielectric filter. In some implementations, the circulator is mounted on the surface of the conductive layer, and the circulator is connected to the ground plane on the surface of the dielectric body, achieving both mechanical connection between the circulator and the dielectric filter and grounding of the circulator.

[0009] The circulator filter integrated structure in this application utilizes the characteristics of the circulator within the structure to achieve unidirectional transmission of electromagnetic wave signals, while simultaneously utilizing the characteristics of the dielectric filter within the circulator filter integrated structure to filter radio frequency signals. The radio frequency signal can be a high-frequency electromagnetic wave signal with a frequency range of 300kHz to 300GHz. In this application, signal transmission between the filter and the circulator is achieved through a conductor component. Because the conductor component has the characteristics of absorbing and radiating electromagnetic wave signals, reducing the size at the junction of the dielectric filter and the circulator reduces the size of the circulator, thereby reducing the size of the junctioned dielectric filter and the circulator, and consequently reducing the size of the circulator filter integrated structure. This facilitates minimizing the space occupied by the circulator filter integrated structure, enabling dense single-board arrangement, and optimizing the layout of components in the base station.

[0010] In some possible implementations of the first aspect described above, the circulator filter integrated structure includes at least one dielectric filter and at least one circulator. In this application, the number of dielectric filters and circulators in the circulator filter integrated structure is not specifically limited.

[0011] In some possible implementations of the first aspect described above, the body is positioned on the layout plane, and the orthographic projection of the circulator onto the layout plane is at least partially located within the orthographic projection of the body onto the layout plane, with the circulator formed in a non-transparent area within the body. For example, the orthographic projection of the circulator onto the layout plane is located within the orthographic projection of the body onto the layout plane. In the aforementioned integrated circulator filter structure, the circulator is positioned within the original layout area of ​​the dielectric filter, integrating both filtering and unidirectional transmission functions while minimizing the use of additional layout area. This enhances the flexibility of high-density board layout, increases the diversity of high-density board layout schemes, and provides possibilities for further optimization of high-density board layout schemes.

[0012] In some possible implementations, the dielectric filter and the circulator are arranged side-by-side along the layout plane in the integrated circulator filter structure to minimize the thickness of the integrated structure. Thickness refers to the direction perpendicular to the layout plane. In other possible implementations, the dielectric filter and the circulator can be placed parallel to each other. In still other implementations, the extension directions of the dielectric filter and the circulator can be perpendicular to each other.

[0013] In some possible implementations of the first aspect described above, the circulator includes at least three ends, a conductor component disposed on the dielectric filter and not conductively connected to the ground plane of the dielectric filter, and the conductor component being electrically connected to one end of the circulator. The ground plane of the dielectric filter can be a portion of the conductive layer in the body of the aforementioned dielectric filter. The conductor component can be disposed on the dielectric filter by soldering it to the dielectric filter.

[0014] In some implementations of the first aspect described above, one of the other two ends of the circulator is connected to a resistor. In these implementations, the circulator and the resistor together constitute an isolator.

[0015] In some possible implementations of the first aspect described above, the surface of the dielectric filter has a conductive layer, which is etched to form a ground layer and a transmission region. The ground layer serves as the ground plane of the dielectric filter, and a conductor component is located within the transmission region. The conductor component includes at least one of a pin, a conductor sheet, a conductor block, and a conductor layer formed within the transmission region by etching the conductive layer.

[0016] The components include pins, also known as leads or PINs. The conductor sheet can be a pre-formed sheet-like conductor structure attached to the dielectric filter, and the conductor layer can be a separated metal layer formed by locally removing the conductive layer from the surface of the dielectric filter. The local removal process can be etching, or it can involve applying a protective film to the area where the conductive layer is to be removed before forming the conductive layer, and then removing the protective film after the conductive layer is formed. The conductor block can be a block structure integrally formed with the conductive layer. It is understood that the aforementioned conductor components are only some examples; conductor components can also be other structures capable of absorbing and radiating electromagnetic wave signals, and this application does not specifically limit them. In addition, the conductor component can be a combination of at least two of the following: pins, conductor sheets, conductor blocks, and conductor layers. For example, a conductor component includes pins and a conductor layer, with the pins mounted on the conductor layer. Another example is a conductor component including a conductor block and a conductor layer, with the conductor block and conductor layer integrally formed. It is understood that the ground layer and conductor layer only need to achieve grounding and conduction functions; the specific layout positions of the two in the first and second bodies are not specifically limited in this application.

[0017] In some possible implementations of the first aspect described above, the body of the dielectric filter includes a dielectric body and a conductive layer on the surface of the dielectric body. After etching, the conductive layer forms a non-conductive ground layer and a conductor layer. In some implementations of this application, the body includes a first body and a second body. The first body includes a first dielectric body and a conductive layer on the surface of the first dielectric body, and the second body includes a second dielectric body and a conductive layer on the surface of the second dielectric body. The ground layer includes a first ground layer in the first body and a second ground layer in the second body. The conductive layer in the first body is the first ground layer. A portion of the surface of the second body is the second ground layer, and the remaining portion is a transmission region. The conductor layer is located within the transmission region on the second body and is non-conductive to the second ground layer. The above-described circulator filter integrated structure, by setting a non-conductive conductor layer and a ground layer, simplifies the conduction path between the conductor component and the circulator, and facilitates the mounting of the conductor component onto the dielectric filter, reducing the installation difficulty of the conductor component.

[0018] In some possible implementations of the first aspect described above, the dielectric filter includes a body, which comprises a first body and a second body, and the second body includes a mounting portion for mounting a circulator, i.e., the circulator is disposed on the second body of the dielectric filter. The mounting portion includes at least one of a mounting recess (e.g., a mounting groove) and a mounting plane.

[0019] That is, a resonant cavity and a coupling hole are formed on the first body, and a circulator is mounted on the second body. The external shape of the first body and the second body as a whole can be a cuboid or a stepped shape, etc., and this application does not make a specific limitation.

[0020] In some implementations, when the mounting portion of the second body in the dielectric filter is a mounting recess, the circulator is mounted within the mounting recess. The circulator mounted within the mounting recess may not protrude from it, preventing conductor components from being touched by other components, facilitating the layout of conductor components, and reducing the layout difficulty of the circulator filter integrated structure. Alternatively, the circulator mounted within the mounting recess may partially protrude from it; this application does not impose specific limitations.

[0021] In some implementations, the first and second bodies of the dielectric filter are integrally formed.

[0022] The aforementioned circulator filter integrated structure reduces the number of components in the circulator filter integrated structure by integrally molding the first body and the second body, thereby simplifying the assembly scheme of the circulator filter integrated structure and reducing the assembly difficulty of the circulator filter integrated structure.

[0023] In some implementations, the first and second bodies are formed separately and then assembled into the body of the dielectric filter.

[0024] In the aforementioned circulator filter integrated structure, a first body and a second body are formed separately. Then, the relative positions of the first and second bodies and the conductor components are arranged to allow the conductor components to be mounted on the dielectric filter and electrically connected to the circulator. Finally, the dielectric filter and the circulator are soldered together, and the conductor components are assembled onto the dielectric filter and the circulator. This circulator filter integrated structure allows for flexible adjustment of the circulator's distribution relative to the dielectric filter according to user needs, expanding the structural options for circulator filter integrated structures and further broadening application scenarios.

[0025] In some possible implementations of the first aspect described above, a receiving slot is formed on the body of the dielectric filter, and at least a portion of the conductor component is located within the receiving slot. The receiving slot is located near the resonant cavity or feed end of the dielectric filter. The conductor component may be partially or completely located within the receiving slot; this application does not impose specific limitations. In some implementations, a receiving slot is formed on the mounting portion of the dielectric filter. It is understood that the receiving slot may be located inside or outside the mounting portion. When the receiving slot is located inside the mounting portion, it allows for a more compact arrangement of the circulator and conductor component, optimizing the layout of the integrated circulator filter structure. The receiving slot may be located on the first body or the second body. This application does not impose specific limitations on the location of the receiving slot.

[0026] In the above-mentioned integrated structure of the circulator filter, by mounting the conductor component in the receiving groove on the body, at least a part of the structure of the conductor component extends into the dielectric body of the dielectric filter, thereby bringing the conductor component closer to the resonant cavity or the feed end, further improving the transmission effect of the conductor component on the electromagnetic wave signal between the dielectric filter and the circulator.

[0027] In some possible implementations of the first aspect described above, the body of the dielectric filter includes a receiving surface, and a conductor component is disposed on the receiving surface.

[0028] In some possible implementations of the first aspect described above, at least three ends are included, and the circulator comprises a permanent magnet, an insulator, a metal conductor layer, and a ferrite layer stacked sequentially, with the ferrite layer connected to the dielectric filter. The metal conductor layer has a three-pronged structure, with each of its three prongs forming one of the three ends of the circulator. The metal conductor is also the center conductor.

[0029] The metal conductor layer can be a printed layer formed on the surface of the ferrite facing the permanent magnet by metal printing. Alternatively, the metal conductor layer can be a pre-formed metal sheet, which is fixed to the surface of the ferrite facing the permanent magnet by bonding or snap-fitting. The metal conductor layer can also be a microstrip formed on the surface of the ferrite facing the permanent magnet. Connecting the ferrite to the dielectric filter means that the ferrite is disposed on the dielectric filter, that is, the ferrite is disposed on the side closer to the dielectric filter.

[0030] It is understood that the grounding method of the circulator can be either connecting the ground plane of the circulator to the ground plane of the dielectric filter for grounding, or the ground plane of the circulator can be directly grounded; this application does not specifically limit this. In some possible implementations of the first aspect mentioned above, the circulator includes a ceramic substrate, ferrite, an insulator, and a permanent magnet. The ceramic substrate includes three branches distributed on the same plane, which intersect and converge at a junction point. A superimposed hole is formed at the junction point in the ceramic substrate, and the ends of the three branches away from the junction point respectively form the first end, second end, and third end of the circulator. The ferrite is housed at the bottom of the superimposed hole. The insulator is housed within the superimposed hole and superimposed on the surface of the ferrite. The permanent magnet is housed at the top of the superimposed hole and superimposed on the surface of the insulator.

[0031] In some possible implementations of the first aspect mentioned above, the ceramic substrate and the dielectric filter are integrally formed to reduce the number of components in the integrated structure of the circulator filter.

[0032] In some possible implementations of the first aspect described above, the dielectric filter includes a first input / output terminal and a second input / output terminal, and at least three ends including a first end, a second end, and a third end. The second end is electrically connected to the first input / output terminal of the dielectric filter. The circulator filter integrated structure also includes a first pin, a second pin, and a third pin, and the first, second, and third pins are not conductive to the ground plane of the dielectric filter. Specifically, the first pin is electrically connected to the first end of the circulator and to a transmitting device. The second pin is electrically connected to the second input / output terminal of the dielectric filter and to an antenna. The third pin is electrically connected to the third end of the circulator and to a receiving device.

[0033] In some possible implementations of the first aspect described above, the dielectric filter includes a first input / output terminal and a second input / output terminal, and at least three ends including a first end, a second end, and a third end. The second end is electrically connected to the first input / output terminal of the dielectric filter. The circulator filter integrated structure also includes a first pin, a second pin, and a resistor, and the first and second pins are not conductive to the ground plane of the dielectric filter. The first pin is electrically connected to the first end of the circulator and to the transmitting device. The second pin is electrically connected to the second input / output terminal of the dielectric filter and to the antenna. The resistor is electrically connected to the third end of the circulator. The circulator and the resistor together constitute an isolator.

[0034] In some possible implementations of the first aspect described above, the circulator filter integrated structure also includes another dielectric filter. The first input / output terminal of the other dielectric filter is electrically connected to the antenna, and the second input / output terminal of the other dielectric filter is electrically connected to the receiving device.

[0035] In some possible implementations of the first aspect described above, the number of dielectric filters is one, the number of circulators is at least one, the dielectric filter includes two input and output terminals, and each circulator includes at least three ends. One input and output terminal of the dielectric filter is electrically connected to one end of each circulator via a conductor component. The circulator filter integrated structure in this application can further reduce the layout area occupied by the circulator.

[0036] In some possible implementations of the first aspect described above, the number of dielectric filters is at least one, the number of circulators is one, each dielectric filter includes two input and output terminals, and the circulator includes at least three ends, one end of the circulator being electrically connected to one of the input and output terminals of each dielectric filter via a conductor component.

[0037] The aforementioned integrated circulator filter structure can further reduce the difficulty of placing circulators on dielectric filters. For example, a wide-band electromagnetic wave signal can be transmitted unidirectionally through a single circulator, while multiple dielectric filters filter out radio frequency signals within different frequency ranges.

[0038] A second aspect of this application provides a radio frequency unit, including a power amplifier tube and a circulator filter integrated structure of the first aspect and any one thereof, wherein the output terminal of the power amplifier tube is electrically connected to the input terminal of the circulator filter integrated structure, and the input terminal of the power amplifier tube is electrically connected to a transmitting device.

[0039] The integrated circulator filter structure includes an input terminal, an input / output terminal, and an output terminal. The input terminal of the integrated circulator filter structure can correspond to the end of the circulator used for connection to the transmitting device. For example, the input terminal of the integrated circulator filter structure can be the first pin. The input / output terminals of the integrated circulator filter structure can correspond to the end of the dielectric filter used for connection to the antenna. For example, the input / output terminal of the integrated circulator filter structure can be the second pin. The output terminal of the integrated circulator filter structure can correspond to the end of the circulator used for connection to the receiving device. For example, the output terminal of the integrated circulator filter structure can be the third pin. As another example, the output terminal of the integrated circulator filter structure can be a resistor.

[0040] In one possible implementation of the second aspect described above, the radio frequency unit further includes an antenna electrically connected to the input and output terminals of each dielectric filter.

[0041] A third aspect of this application provides a base station comprising at least one group of radio frequency units as described in the first aspect and any one of the first aspects. Attached Figure Description

[0042] Figure 1 This application shows schematic diagrams of the base station structure in some embodiments;

[0043] Figure 2 A schematic diagram of a circulator filter integrated structure 10' is shown;

[0044] Figure 3 A schematic diagram of a circulator filter integrated structure 10” is shown;

[0045] Figure 4 The diagram shows the composition of the base station in some other embodiments of this application;

[0046] Figure 5 This application shows a schematic diagram of the structure of channel 11 in a base station in some embodiments;

[0047] Figure 6(a) shows a perspective view of the circulator filter integrated structure 10 in some embodiments of this application;

[0048] Figure 6(b) shows a schematic diagram of the side-by-side arrangement of circulator 200 and filter 100 in the circulator filter integrated structure 10 in some embodiments of this application;

[0049] Figure 6(c) shows a schematic diagram of the relative positions of the circulator 200 and the filter 100 in the circulator filter integrated structure 10 in some embodiments of this application;

[0050] Figure 6(d) shows a schematic diagram of the relative positions of the circulator 200 and the filter 100 in the circulator filter integrated structure 10 in some other embodiments of this application;

[0051] Figure 6(e) shows a schematic diagram of the relative positions of the circulator 200 and the filter 100 in the circulator filter integrated structure 10 in some other embodiments of this application;

[0052] Figure 7(a) shows a perspective view of the layout of the circulator filter integrated structure 10 on the circuit board 60 in some embodiments of this application;

[0053] Figure 7(b) shows a bottom view of the circulator filter integrated structure 10 in some embodiments of this application;

[0054] Figure 7(c) shows a perspective view from a bottom angle of the circulator filter integrated structure 10 in some embodiments of this application;

[0055] Figure 8(a) shows the distribution scheme of the circulator 200 in the dielectric filter 100 in some embodiments of this application;

[0056] Figure 8(b) shows the distribution scheme of the circulator 200 in the dielectric filter 100 in some other embodiments of this application;

[0057] Figure 8(c) shows the distribution scheme of the circulator 200 in the dielectric filter 100 in some other embodiments of this application;

[0058] Figure 8(d) shows a perspective view of Figure 8(c) along a side view;

[0059] Figure 8(e) shows the distribution scheme of the circulator 200 in the dielectric filter 100 in some other embodiments of this application;

[0060] Figure 8(f) shows the distribution scheme of the circulator 200 in the dielectric filter 100 in some other embodiments of this application;

[0061] Figure 9(a) shows a bottom view of the carrier component 800 in the circulator filter integrated structure 10 in some embodiments of this application;

[0062] Figure 9(b) shows a bottom view of the carrier component 800 in the circulator filter integrated structure 10 in some other embodiments of this application;

[0063] Figure 9(c) shows a bottom view of the carrier component 800 in the circulator filter integrated structure 10 in some other embodiments of this application;

[0064] Figure 10 A perspective view of the circulator filter integrated structure 10 in some embodiments of this application is shown;

[0065] Figure 11(a) shows an exploded view of the circulator filter integrated structure 10 in some embodiments of this application;

[0066] Figure 11(b) shows a perspective view of the circulator 200 in some other embodiments of this application;

[0067] Figure 12(a) shows a bottom view of the circulator filter integrated structure 10 in some embodiments of this application;

[0068] Figure 12(b) shows a perspective view from a bottom angle of the circulator filter integrated structure 10 in some embodiments of this application, in which the output path of SIG1 is shown;

[0069] Figure 12(c) shows a perspective view from a bottom angle of the circulator filter integrated structure 10 in some embodiments of this application, in which the output path of SIG2 is shown;

[0070] Figure 13(a) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some embodiments of this application;

[0071] Figure 13(b) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some other embodiments of this application;

[0072] Figure 13(c) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some other embodiments of this application;

[0073] Figure 13(d) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some other embodiments of this application;

[0074] Figure 13(e) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some other embodiments of this application;

[0075] Figure 13(f) shows a magnified view of region C in Figure 13(e);

[0076] Figure 13(g) shows a cross-sectional view of the circulator filter integrated structure 10 and circuit board 60 along section AA in Figure 12(a) in some embodiments of the present application, wherein the dielectric filter 100 includes a carrier component 800;

[0077] Figure 13(h) shows a cross-sectional view of the circulator filter integrated structure 10 and the circuit board 60 along section AA in Figure 12(a) in some other embodiments of this application;

[0078] Figure 14A perspective view of the circulator filter integrated structure 10a in some embodiments of this application is shown;

[0079] Figure 15 An exploded view of the circulator filter integrated structure 10a in some embodiments of this application is shown;

[0080] Figure 16 A bottom view of the circulator filter integrated structure 10a in some embodiments of this application is shown;

[0081] Figure 17 The diagram shows the components in a channel of a base station in some other embodiments of this application;

[0082] Figure 18 A perspective view of the circulator filter integrated structure 10b in some embodiments of this application is shown;

[0083] Figure 19 An exploded view of the circulator filter integrated structure 10b in some embodiments of this application is shown;

[0084] Figure 20 A bottom view of the circulator filter integrated structure 10b in some embodiments of this application is shown;

[0085] Figure 21(a) shows a schematic diagram of the components in channel 11 in some embodiments of this application;

[0086] Figure 21(b) shows a schematic diagram of the components in a channel of a base station in some embodiments of this application;

[0087] Figure 22 The diagram shows a schematic of the components in the channel in some embodiments of this application.

[0088] Explanation of reference numerals in the attached figures

[0089] 1-Active antenna element;

[0090] 2-Baseband processing unit;

[0091] 3-Power supply;

[0092] 4-Fiber optic cable;

[0093] 5-Power cord;

[0094] 10'-ring filter;

[0095] 100'-bandpass filter;

[0096] 200'-Low-pass filter;

[0097] 300' - Circulator; 310' - Center conductor;

[0098] 400' - Bottom shell;

[0099] 500' - Top cover;

[0100] 10” - Ring filter;

[0101] 100” - Dielectric filter;

[0102] 200” - Circulator; 210” - First end; 220” - Second end; 230” - Third end;

[0103] 300” - Cascade Match Window;

[0104] Application Scenario 1

[0105] 10-Circulator Filter Integrated Structure;

[0106] 100 - Filter; 101 - First filter terminal; 102 - Second filter terminal; 103 - Dielectric body; 104 - Ground layer; 105 - Etching groove;

[0107] 110-Ontology;

[0108] 120 - Mounting slot;

[0109] 130 - Resonant cavity; 131 - First resonant cavity; 132 - Second resonant cavity; 133 - Third resonant cavity; 134 - Fourth resonant cavity; 135 - Fifth resonant cavity; 136 - Sixth resonant cavity; 137 - Seventh resonant cavity;

[0110] 140 - Coupling slot; 141 - First coupling slot; 142 - Second coupling slot; 143 - Third coupling slot;

[0111] 160 - Reception slot;

[0112] 200 - Circulator; 201 - First annular end; 202 - Second annular end; 203 - Third annular end;

[0113] 210 - Permanent magnet; 220 - Insulator; 230 - Metal conductor layer; 231 - First end; 232 - Second end; 233 - Third end; 240 - Ferrite;

[0114] 300 - Conductor component; 300a - Fourth pin; 300b - Fourth pin; 300c - Fourth pin; 300d - Embedded metal conductor; 300e - Conductor layer;

[0115] 400 - Pin 1;

[0116] 500 - Second pin;

[0117] 600 - Third pin;

[0118] 700- resistor;

[0119] 800 - Load-bearing components;

[0120] 810 - Clearance hole; 811 - First clearance hole; 812 - Second clearance hole; 813 - Third clearance hole;

[0121] 820 - solder pad;

[0122] 830 - Release port; 831 - First release port; 832 - Second release port; 833 - Third release port;

[0123] 20-Power amplifier tube;

[0124] 30-antenna;

[0125] 40 - Transmitting equipment;

[0126] 50 - Receiving equipment;

[0127] Application Scenario 2

[0128] 10a - Integrated structure of circulator filter;

[0129] 100-filter;

[0130] 200a-circulator;

[0131] 210a - Permanent magnet; 220a - Insulator; 230a - Ferrite; 240a - Ceramic base; 241a - Composite groove;

[0132] 300 - Conductor component;

[0133] 400 - Pin 1;

[0134] 500 - Second pin;

[0135] 600 - Third pin;

[0136] Application Scenario 3

[0137] 10b-circuit filter integrated structure;

[0138] 100-filter;

[0139] 200-circulator;

[0140] 300 - Conductor component;

[0141] 400 - Pin 1;

[0142] 500 - Second pin;

[0143] 700- resistor;

[0144] 10c-circuit filter integrated structure;

[0145] 10d-circuit filter integrated structure. Detailed Implementation

[0146] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0147] To address the problem of the inability to effectively optimize the distribution scheme of densely packed single-board units, this application provides a wireless communication base station. This base station can be a 4G base station, a 5G base station, or a 6G base station; this application does not specifically limit it.

[0148] Figure 4 A schematic diagram of a base station configuration is shown. (See attached image.) Figure 1 and Figure 4 As can be seen, in some embodiments of this application, the base station includes an active antenna unit (AAU) 1, a building baseband unit (BBU) 2, a power supply 3, an optical fiber 4, and a power line 5. The active antenna unit 1 is electrically connected to the baseband processing unit 2 via the optical fiber 4, and to the power supply 3 via the power line 5. The active antenna unit 1 includes a power amplifier, a circulator, a dielectric filter, and an antenna. Furthermore, considering the number of channels, the active antenna unit 1 includes several channels 11. The number of channels 11 in the base station can be 8, 16, 32, or 64, and this application does not specifically limit this number.

[0149] Figure 5 A channel 11 in antenna 1 of this application is shown. For example... Figure 5 As shown, each channel 11 may include a circulator filter integrated structure 10, a power amplifier tube 20, and an antenna 30. The circulator filter integrated structure 10 includes a connected filter 100, a circulator 200, and a conductor component (not shown). The conductor component enables signal transmission between the filter 100 and the circulator 200, thus giving the circulator filter integrated structure 10 both unidirectional transmission and filtering functions.

[0150] The circulator filter integrated structure 10 in this application utilizes the characteristics of the circulator 200 within the circulator filter integrated structure 10 to achieve unidirectional transmission of electromagnetic wave signals, and simultaneously utilizes the characteristics of the dielectric filter 100 within the circulator filter integrated structure 10 to achieve filtering of radio frequency signals. The radio frequency signal can be a high-frequency electromagnetic wave signal with a frequency range of 300kHz to 300GHz. In this application, signal transmission between the filter 100 and the circulator 200 is achieved through conductive components. Since the conductive components have the characteristics of absorbing and radiating electromagnetic wave signals, reducing the size at the junction of the dielectric filter and the circulator reduces the size of the circulator, thereby reducing the size of the junctioned dielectric filter and the circulator, and thus reducing the size of the circulator filter integrated structure. This facilitates reducing the space occupied by the circulator filter integrated structure 10, achieving dense single-board arrangement, and optimizing the layout of components in the base station.

[0151] It is understood that the connected filter 100 and circulator 200 can be integrally formed, or they can be separately formed and then assembled. The assembly process can be bonding or welding, and this application does not specifically limit this. Specifically, the dielectric filter 100 and circulator 200 are formed separately, and then the relative positions of the dielectric filter 100, circulator 200, and conductor component 300 are arranged so that the conductor component 300 can be installed on the dielectric filter 100 and electrically connected to the circulator 200. Finally, the dielectric filter 100 and circulator 200 are soldered, and the conductor component 300 is assembled on the dielectric filter 100 and circulator 200. The above-mentioned circulator filter integrated structure 10 can flexibly adjust the distribution position of the circulator 200 relative to the dielectric filter 100 according to user needs, expand the structural scheme of the circulator filter integrated structure 10, and further expand the application scenarios.

[0152] Continue reading Figure 5 It is understood that filter 100 may include two feed-in and feed-out terminals; for example, filter 100 includes a first filter terminal 101 and a second filter terminal 102. Circulator 200 may include at least three terminals; for example, circulator 200 includes a first loop terminal 201, a second loop terminal 202, and a third loop terminal 203. In addition, each channel 11 also includes a transmitting device (e.g., 40 below) and a receiving device (e.g., 50 below). The transmitting device may be an RF power supply device, and the receiving device may be an antenna receiving device. The first loop terminal 201 is electrically connected to the transmitting terminal 21 of power amplifier tube 20, and the receiving terminal 22 of power amplifier tube 20 is electrically connected to the transmitting device. The second loop terminal 202 is signal-connected to the first filter terminal 101 of filter 100, the second filter terminal 102 of filter 100 is electrically connected to antenna 30, and the third loop terminal 203 is electrically connected to the receiving device.

[0153] In some implementations of this application, the conductor component 300 is disposed on the dielectric filter 100 and is not conductive to the ground plane of the dielectric filter 100. The conductor component 300 is electrically connected to one end (e.g., the second ring end 202) of the circulator 200. The other two ends of the circulator 200 are electrically connected to the transmitting device and the receiving device, respectively.

[0154] In some alternative implementations of this application, one end of the other two ends of the circulator 200 (e.g., the first ring end 201) is electrically connected to the transmitting device, and the other end of the other two ends of the circulator 200 (e.g., the third ring end 203) is connected to a resistor (e.g., resistor 700 mentioned below). It is understood that the circulator 200, together with the resistor, constitutes an isolator.

[0155] In other embodiments of this application, another type of base station is also provided. This base station includes an antenna, a Remote Radio Unit (RRU), a baseband processing unit, a power supply, an optical fiber, and a power line. The antenna and the RRU are electrically connected, the RRU is electrically connected to the baseband processing unit via the optical fiber, and the RRU is electrically connected to the power supply via the power line. The RRU includes radio frequency components such as a power amplifier, a circulator, and a dielectric filter.

[0156] It is easy to see that the difference between the remote RF unit and the aforementioned active antenna unit 1 is that the remote RF unit can include a power amplifier tube, a circulator, and a filter, but does not include an antenna. Therefore, the connection method of the integrated circulator filter structure obtained by integrating the dielectric filter and the circulator in the remote RF unit is basically the same as the connection method in the active antenna unit. Thus, the connection method of the dielectric filter and the circulator in the remote RF unit can refer to the connection method of the dielectric filter and the circulator in the active antenna unit mentioned earlier, and will not be described in detail here.

[0157] The technical solution of this application will be described below with reference to specific structures. Figure 6(a) shows a perspective view of a circulator filter integrated structure 10 of this application. As shown in Figure 6(a), this application provides a circulator filter integrated structure 10. The circulator filter integrated structure 10 includes a dielectric filter 100, a circulator 200, and a conductor component 300. The dielectric filter 100 and the circulator 200 are mechanically connected, and the conductor component 300 is used to transmit electromagnetic wave signals between the filter 100 and the circulator 200. The circulator filter integrated structure 10 transmits the electromagnetic wave signals of the circulator 200 to the dielectric filter 100 through the conductor component 300, or the circulator filter integrated structure 10 transmits the electromagnetic wave signals of the dielectric filter 100 to the circulator 200 through the conductor component 300.

[0158] It is understood that the conductor component 300 can be at least one of a pin, a conductor block, a conductor sheet, and a conductor layer. This application does not specifically limit the number of dielectric filters 100 and circulators 200 in the circulator filter integrated structure 10. That is, in the circulator filter integrated structure 10, the number of dielectric filters 100 can be one, two, three, etc., and the number of circulators 200 can be one, two, three, etc.

[0159] In the aforementioned circulator filter integrated structure 10, electromagnetic wave signal transmission between the dielectric filter 100 and the circulator 200 is achieved through the conductor component 300. Since the conductor component 300 has the characteristics of absorbing and radiating electromagnetic wave signals, the size at the junction of the dielectric filter 100 and the circulator 200 is reduced, thus reducing the size of the circulator 200. This, in turn, reduces the size of the junction of the dielectric filter 100 and the circulator 200, and thus reduces the size of the circulator filter integrated structure 10. This facilitates the implementation of dense single-board arrangement, optimizes the layout scheme of components in the base station, and achieves dense single-board arrangement in the base station.

[0160] In addition, since signal transmission between the dielectric filter 100 and the circulator 200 can be realized through the conductor component 300, there is no need to impose special restrictions on the relative layout relationship between the dielectric filter 100 and the circulator 200. Based on this, it is easy to expand the relative layout scheme of the dielectric filter 100 and the circulator 200.

[0161] The dielectric filter 100 includes a body 110 and a plurality of resonant cavities (not shown) formed on the surface of the body 110. In some implementations of this application, the body 110 includes a first body (not shown) and a second body (not shown), and the second body has a mounting portion for mounting a circulator 200, that is, the circulator 200 is disposed on the second body of the dielectric filter 100. The mounting portion includes at least one of a mounting recess and a mounting plane. The external shape of the first body and the second body as a whole can be a cuboid or a stepped shape, etc., and is not specifically limited in this application.

[0162] In some implementations of this application, the first body and the second body are integrally formed. The aforementioned circulator filter integrated structure can reduce the number of components in the circulator filter integrated structure, simplify the assembly scheme of the circulator filter integrated structure, and reduce the assembly difficulty of the circulator filter integrated structure.

[0163] In some other implementations of this application, the first body and the second body are separately formed and then assembled into the body of the dielectric filter. The above-mentioned circulator filter integrated structure 10 can flexibly adjust the distribution position of the circulator 200 relative to the dielectric filter 100 according to user needs, expand the structural scheme of the circulator filter integrated structure 10, and further expand the application scenarios.

[0164] Figure 6(b) shows a schematic diagram of the parallel layout of circulator 200 and filter 100 in the circulator filter integrated structure 10 in some embodiments of this application. In some embodiments of this application, the dielectric filter 100 and circulator 200 are arranged side by side along a layout plane, as shown in Figure 6(b). The body 110 and circulator 200 are arranged within the layout plane. The layout plane refers to the plane on which the body 110 of the dielectric filter 100 in the circulator filter integrated structure 10 is distributed when in use. For example, when in use, the circulator filter integrated structure 10 is mounted on the surface of a circuit board (not shown), and the plane on the surface of the circuit board is the layout plane. It can be understood that the circulator filter integrated structure 10 is not directly mounted on the circuit board, but is mounted on the surface of the circuit board after being supported by a carrier plate; therefore, the layout plane can still be the surface of the circuit board. The carrier plate can be a circuit board with dimensions adapted to the circulator filter integrated structure 10. This circuit board is only used to support the circulator filter integrated structure 10 and for grounding the circulator filter integrated structure 10, but does not have signal transmission function.

[0165] In some implementations of this application, the dielectric filter 100 and the circulator 200 can be placed parallel to each other. In other implementations of this application, the dielectric filter 100 and the circulator 200 can be placed perpendicular to each other.

[0166] In other embodiments of this application, the dielectric filter 100 and the circulator 200 are stacked. The body 110 is positioned within a layout plane, and the orthographic projection of the circulator 200 onto the layout plane at least partially falls within the orthographic projection of the body 110 onto the layout plane. Furthermore, the circulator 200 is formed in a non-transparent area of ​​the body 110. It is understood that one orthographic projection falling within another orthographic projection means that one orthographic projection at least partially coincides with the other orthographic projection. In this application, the orthographic projection of the circulator 200 in the layout plane includes the following three cases: First, as shown in Figure 6(c), part of the orthographic projection of the circulator 200 in the layout plane coincides with the orthographic projection of the dielectric filter 100 in the layout plane, and the other part does not coincide with the orthographic projection of the dielectric filter 100 in the layout plane; Second, as shown in Figure 6(d), the orthographic projection of the circulator 200 in the layout plane falls entirely within the orthographic projection of the dielectric filter 100 in the layout plane; Third, as shown in Figure 6(e), the orthographic projection of the dielectric filter 100 in the layout plane falls entirely within the orthographic projection of the circulator 200 in the layout plane.

[0167] The non-transparent area refers to the area in the body 110 of the dielectric filter 100 other than the resonant cavity, coupling slot and tuning hole in three-dimensional space, that is, the solid area in the body 110.

[0168] In the aforementioned circulator filter integrated structure 10, the circulator 200 (or filter 100) is placed within the original layout area of ​​the dielectric filter 100 (or circulator 200), integrating both filtering and unidirectional transmission functions while minimizing the use of additional layout area. By rationally arranging the relative positions of the dielectric filter 100 and the circulator 200, the aforementioned circulator filter integrated structure 10 minimizes the increase in layout area occupied by the dielectric filter 100 (or circulator 200), enhancing the flexibility of high-density board layouts, increasing the diversity of high-density board layout schemes, and providing possibilities for further optimization of high-density board layout schemes.

[0169] Based on this, the layout of the dielectric filter 100 and the circulator 200 in the circulator filter integrated structure 10 of this application is varied. For ease of description, the following description will continue with the state shown in Figure 6(d) as an example.

[0170] The circulator filter integrated structure 10 disclosed in this application will be described in detail below with reference to the accompanying drawings.

[0171] Figure 7(a) shows a schematic diagram of the circulator filter integrated structure 10 mounted on the circuit board 60 in some embodiments of this application. As shown in Figure 7(a), in some embodiments of this application, the filter 100 in the circulator filter integrated structure 10 is mounted on the circuit board 60, and the body 110 is grounded and connected to the circuit board 60. Furthermore, for the purposes of subsequent description, the X direction, Y direction, and Z direction are now defined, where the X direction is the length direction of the circulator filter integrated structure 10 when normally placed, the Y direction is the width direction of the circulator filter integrated structure 10 when normally placed, and the Z direction is the height direction of the circulator filter integrated structure 10 when normally placed. That is, the surface facing the reader in Figure 6(a) is the bottom surface of the circulator filter integrated structure 10.

[0172] Figure 7(b) shows a bottom view of the circulator filter integrated structure 10 in some embodiments of this application, and Figure 7(c) shows a perspective view of the circulator filter integrated structure 10 from a bottom view perspective in some embodiments of this application. In some embodiments of this application, as shown in Figure 7(b), the circulator filter integrated structure 10 includes a cuboid-shaped dielectric filter 100 and a circulator 200. It is understood that the cuboid shape is only one example of the shape of the dielectric filter 100 in this application; the shape of the dielectric filter 100 can also be circular, elliptical, or polygonal, etc., and this application does not impose specific limitations on this.

[0173] In some embodiments of this application, as can be seen from Figures 7(b) and 7(c), the dielectric filter 100 includes a body 110 and a resonant cavity 130 and a coupling groove 140 formed on the surface of the body 110. The body 110 includes a dielectric body (not shown) and a conductive layer (not shown) covering the surface of the dielectric body.

[0174] As can be seen from the above, in some implementations of this application, the body includes a first body and a second body. Specifically, the first body includes a first dielectric body and a conductive layer on the surface of the first dielectric body, and the second body includes a second dielectric body and a conductive layer on the surface of the second dielectric body.

[0175] In some implementations of this application, the dielectric body is made of a low-loss dielectric material. The material of the dielectric body may include at least one of ceramics and plastics. For example, the dielectric body is formed by mixing and high-temperature sintering microwave dielectric powder materials (e.g., barium titanate, zirconate, etc.) with high dielectric constant, low loss, and low frequency temperature coefficient. The dielectric body can be formed by at least one of molding, sintering, machining, and additive manufacturing. For example, the forming process of the dielectric body may involve dry-pressing the dielectric powder into the desired structure using a press, and then curing it by high-temperature sintering.

[0176] It is understood that any low-loss dielectric material can be used as the material for the dielectric body, and this application does not specifically limit it. Furthermore, any molding method capable of forming the dielectric body is within the scope of protection of this application, and this application does not specifically limit it.

[0177] The conductive layer can be a silver plating layer. This application allows for the formation of a silver plating layer on the surface of the dielectric substrate using at least one of the following metallization processes: spraying, dipping, brushing, physical vapor deposition (PVD), electroplating, etc.

[0178] It is understood that this application does not specifically limit the structure or forming method of the conductive layer. Any conductive layer with any structure, and any forming process capable of forming any of the above conductive layers, is within the scope of protection of this application. Furthermore, in this application, the surface of the dielectric body refers to all exposed surfaces on the dielectric body, including the surfaces of structures such as resonant cavities, tuning holes, and coupling grooves. That is, when a resonant cavity and a coupling groove are formed on the body 110, a conductive layer is also formed on the inner surface of the resonant cavity and the groove surface of the coupling groove.

[0179] Therefore, in the circulator filter integrated structure 10 of this application, the placement of the circulator 200 on the dielectric filter 100 is particularly critical. Based on this, the relative positional relationship between the dielectric filter 100 and the circulator 200 will be described in detail below. However, to clearly describe the relative positional relationship between the dielectric filter 100 and the circulator 200, this application needs to first clearly describe the specific structure of the dielectric filter 100. It is understood that the structure of the dielectric filter 100 is diverse, and this application cannot exhaustively describe it; therefore, the following will use... Figures 7(a) to 7(c) The structural features of the dielectric filter 100 shown in the figure are described using this example.

[0180] As can be seen from Figures 7(a) and 7(b), the body 110 of the dielectric filter 100 includes a pair of opposing first surfaces 111 and second surfaces 112, and the layout plane is the surface of the circuit board 60 facing the dielectric filter 100. Specifically, the first surface 111 is the surface of the dielectric filter 100 facing the circuit board 60 (e.g., the bottom surface of the body 110 in Figure 7(a)), and the second surface is the surface of the dielectric filter 100 facing away from the circuit board (e.g., the top surface of the body 110 in Figure 7(a)).

[0181] In some implementations of this application, both the first surface 111 and the second surface 112 are parallel to the layout plane. It is understood that the parallelism in this application is not absolute; approximate parallelism due to manufacturing and assembly errors is also within the scope of parallelism in this application. This application does not impose specific limitations on this, and the definition of parallelism will not be repeated below.

[0182] In addition, the body 110 also has a plurality of coupling slots 140 connected to the first surface 111 and the second surface 112, which are used to adjust the coupling degree of the dielectric filter 100. In some embodiments of this application, as shown in FIG7(b), the coupling slots 140 specifically include a first coupling slot 141, a second coupling slot 142 and a third coupling slot 143 distributed from left to right. The first coupling slot 141, the second coupling slot 142 and the third coupling slot 143 are used to separate two adjacent rows of resonant cavities. It can be understood that the orthographic projection of the first coupling slot 141, the second coupling slot 142 and the third coupling slot 143 on the layout plane can be at least one of the following shapes: "I", "+", "T" and "5". This application does not specifically limit this.

[0183] As shown in Figure 7(c), the resonant cavities 130 in the dielectric filter 100 may include seven resonant cavities 130. The seven resonant cavities 130 are arranged along a layout plane in a first row of four resonant cavities 130 (e.g., the first resonant cavity 131, the second resonant cavity 132, the fifth resonant cavity 135, and the sixth resonant cavity 136 arranged from left to right as shown in Figure 8) and a second row of three resonant cavities 130 (e.g., the third resonant cavity 133, the fourth resonant cavity 134, and the seventh resonant cavity 137 arranged from left to right as shown in Figure 8). It is readily apparent that the lower left corner region of the dielectric filter 100 in the view is a solid region.

[0184] After introducing the specific structure of the dielectric filter 100 in this application, the following will continue to introduce the dielectric filter 100 and the space around it where the circulator 200 can be arranged in the circulator filter integrated structure 10, that is, the relative positional relationship between the dielectric filter 100 and the circulator 200 in the circulator filter integrated structure 10.

[0185] In some application scenarios, the dielectric filter 100 has a sufficiently large solid area in the orthographic projection of the layout plane, and the circulator 200 is disposed in the solid area of ​​the dielectric filter 100 in the orthographic projection of the layout plane. The solid area refers to a region in the dielectric filter 100 that is entirely solid along its thickness direction, without any coupling slots, resonant cavities, tuning holes, or other structures. For example, the lower left corner region S0 in Figure 8. Figure 8(a) shows a perspective view of the dielectric filter 100 in some embodiments of this application from a bottom view. As shown in Figure 8(a), the circulator 200 is disposed in the lower left corner region of the dielectric filter 100. It can be understood that since the circulator 200 has three ends, the area where the circulator 200 is disposed is represented as a triangular region S1 with a dashed border and gray fill.

[0186] It is understood that the thickness direction is a direction perpendicular to the layout plane, such as the Z-axis direction in Figure 7(a). It is also understood that the mutual perpendicularity in this application is not absolute; approximate perpendicularity due to processing and assembly errors is also within the scope of mutual perpendicularity in this application. This application does not specifically limit this, and the definition of perpendicularity will not be repeated later. The triangular region S1 in Figure 8(a) is one example. The area where the circulator 200 is set in the dielectric filter 100 can also be a rectangle, a circle, or any other area that can adapt to the shape of the circulator 200. This application does not specifically limit this. In the above-described circulator filter integrated structure 10, by making reasonable use of the space of the dielectric filter 100, the layout of the circulator 200 in the dielectric filter 100 can be achieved without increasing the layout area occupied by the dielectric filter 100 or the thickness of the dielectric filter 100.

[0187] In some other embodiments of this application, the dielectric filter 100 in the circulator filter integrated structure 10 does not have a sufficiently large solid area in the orthographic projection of the layout plane, and the circulator 200 is disposed in a region of the dielectric filter 100 that is offset from structures such as the coupling groove, resonant cavity, and tuning hole in the thickness direction. Figure 8(b) shows a perspective view of the dielectric filter 100 in some embodiments of this application from a side view. As shown in Figure 8(b), the resonant cavity 130 is disposed in the lower region of the dielectric filter 100, and the circulator 200 is disposed in the upper region of the dielectric filter 100, as shown in the rectangular region S2 filled with gray by the dashed border in Figure 8(b). It can be understood that the rectangular region S2 in Figure 8(b) is an example, and the placement area of ​​the circulator 200 can also be any region that can adapt to the shape of the circulator 200, such as a stepped shape, and this application does not impose specific limitations on this. In the above-described circulator filter integrated structure 10, without increasing the layout area occupied by the dielectric filter 100, the thickness of the dielectric filter 100 is appropriately increased to achieve a reasonable layout of the circulator 200.

[0188] In some other embodiments of this application, in the circulator filter integrated structure 10, the circulator 200 is disposed in a region of the dielectric filter 100 that is offset from the coupling slot, resonant cavity, and tuning hole in three-dimensional space. Figure 8(c) shows a perspective view of the dielectric filter 100 in some embodiments of this application from a top view. Figure 8(d) shows a perspective view of the dielectric filter 100 in some embodiments of this application from a side view. Combining Figures 8(c) and 8(d), it can be seen that the circulator 200 is disposed in the lower left corner region of the dielectric filter 100. The orthographic projection of the circulator 200 onto the layout plane coincides with a portion of the resonant cavity 130 in the dielectric filter 100, but in the thickness direction, the distribution area of ​​the circulator 200 is offset from the region where the resonant cavity 130 is located. It can be understood that region S3 in Figure 8(c) is an example, and the placement area of ​​the circulator 200 can also be any region of other shapes that can adapt to the shape of the circulator 200, and this application does not impose specific limitations on this. In the aforementioned circulator filter integrated structure 10, the circulator 200 is staggered and misplaced in the non-transparent area of ​​the dielectric filter 100, thereby improving the effective utilization rate of the original packaging area of ​​the dielectric filter 100.

[0189] The arrangement area on the dielectric filter 100 for arranging the circulator 200 can be an area adapted to the appearance characteristics of the circulator. For example, the arrangement area can be a square area and three intersecting strip areas connected to the square area. Another example is that the arrangement area can be a circular area and three intersecting strip areas connected to the circular area. Yet another example is that the arrangement area can also be a triangular area and three intersecting strip areas connected to the triangular area.

[0190] It is understood that, by combining the spatial three-dimensional structure of the circulator 200 with the cavity, holes, and slots on the dielectric filter 100, the arrangement area of ​​the circulator 200 on the dielectric filter 100 can be rationally selected, while ensuring the mechanical strength of the ceramic substrate, the filtering performance of the dielectric filter 100, and the unidirectional transmission performance of the circulator 200. This application does not specifically limit the arrangement area of ​​the circulator 200 on the dielectric filter 100.

[0191] In some implementations of this application, to reduce the difficulty of electrical connection between the circulator 200 and the circuit board, the circulator 200 and the conductor component 300 are formed on the first surface 111 of the dielectric filter 100. In other implementations of this application, the circulator 200 and the conductor component 300 may also be formed on the second surface 112 of the dielectric filter 100. In still other implementations of this application, the circulator 200 and the connector 300 may also be distributed on the first surface 111 and the second surface 112, respectively. For example, the circulator 200 is formed on the second surface 112 of the dielectric filter 100, and the conductor component 300 is formed on the first surface 111 of the dielectric filter 100.

[0192] In some embodiments of this application, the number of dielectric filters 100 is one, while the number of circulators 200 can be multiple. When multiple circulators 200 are arranged on a single dielectric filter 100, the distribution of the multiple circulators 200 on the dielectric filter 100 can be such that at least one circulator 200 is distributed on the first surface 111, and at least one circulator 200 is distributed on the second surface 112. This distribution of the circulators 200 can fully utilize the non-transparent areas on the dielectric filter 100, reducing the difficulty of laying out the circulators 200 on the dielectric filter 100.

[0193] In some embodiments of this application, the number of circulators 200 is one, while the number of dielectric filters 100 can be multiple. When multiple dielectric filters 100 are arranged around a single circulator 200, the multiple dielectric filters 100 are integrally formed, and their respective layouts on the circuit board are adjusted to cluster the areas on the multiple dielectric filters 100 available for circulator 200 placement, thereby creating a larger layout area. This distribution of circulators 200 fully utilizes the non-transparent areas on the dielectric filters 100, reducing the difficulty of placing the circulators 200 on the dielectric filters 100, while also facilitating further reduction of the layout area occupied by the dielectric filters 100.

[0194] To improve the structural strength of the dielectric filter 100, in some embodiments of this application, as shown in FIG7(a), the circulator filter integrated structure 10 further includes a support component 800, wherein the support component 800 is disposed on the side of the dielectric filter 100 near the circuit board 60. By providing the support component 800 in the dielectric filter 100, the mechanical strength of the dielectric filter 100 can be improved, the heat dissipation performance of the dielectric filter 100 can be improved, and the expansion coefficient of the dielectric filter 100 can be balanced, thereby improving the stability of the circulator filter integrated structure 10 during operation.

[0195] In some implementations of this application, one surface of the support member 800 is connected to the first surface 111 of the body 110 to enhance the structural strength of the body 110. In other implementations, another surface of the support member 800 opposite to one surface is connected to the circuit board 60 to achieve a stable connection between the body 110 and the circuit board 60.

[0196] In some implementations of this application, the supporting component 800 can be a circuit board whose orthographic projection size matches that of the body 110 in the layout plane. The supporting component 800 can also be made of other materials, which are not specifically limited in this application.

[0197] In some embodiments of this application, the body 110 is electrically connected to the circuit board 60 through the carrier component 800 to achieve grounding of the conductive layer in the body 110.

[0198] Figure 9(a) shows a bottom view of the carrier component 800 of the dielectric filter 100 in some embodiments of this application. In some implementations of this application, as can be seen from Figures 7(a) and 9(a), the carrier component 800 has recessed holes 810 that mate with the pins on the body 110. The recessed holes 810 include a first recessed hole 811, a second recessed hole 812, and a third recessed hole 813, so that the pins on the body 110 can pass through the first recessed hole 811, the second recessed hole 812, and the third recessed hole 813 on the carrier component 800 and then be electrically connected to the circuit board 60.

[0199] In some embodiments of this application, as shown in FIG9(a), a plurality of pads 820 are arranged on one surface of the carrier component 800 facing the circuit board 60. It is easy to understand that a plurality of pads (not shown) are also arranged on the other surface of the carrier component 800 facing away from the circuit board 60. The pads on one surface and the other surface are electrically connected inside the carrier component. The pads on the carrier component 800 are soldered to the pads on the dielectric filter 100 and the circuit board 60 respectively by solder. Among them, the plurality of pads 820 on one surface are grounded to the circuit board 60 by solder, and the plurality of pads on the other surface are conductive to the conductive layer in the body 110 of the dielectric filter 100 by solder.

[0200] It is understood that, in this application, grounding the conductive layer in the body 110 of the dielectric filter 100 via the pad 820 on the carrier component 800 is only one grounding method for the dielectric filter 100. The dielectric filter 100 in this application can also be grounded in other ways, and this application does not specifically limit this method.

[0201] Figure 9(b) shows a bottom view of the support member 800 of the dielectric filter 100 in some other embodiments of this application. In some embodiments of this application, as shown in Figure 9(b), the support member 800 is also provided with a release hole 830. The release hole 830 is used to release the deformation stress of the dielectric filter 100 during operation and to provide for the dimensional changes caused by deformation during operation.

[0202] In some implementations of this application, the opening size and position of the release hole 830 on the carrier component 800 are adapted to the coupling groove 140 in the dielectric filter 100. Referring to Figures 7(a) and 9(b), in some embodiments of this application, the release hole 830 on the carrier component 800 includes a first release hole 831, a second release hole 832, and a third release hole 833. The first release hole 831 is adapted to the first coupling groove 141, the second release hole 832 is adapted to the second coupling groove 142, and the third release hole 833 is adapted to the third coupling groove 143.

[0203] In the aforementioned circulator filter integrated structure 10, the release hole 830 is adapted to the coupling groove 140. First, the circulator filter integrated structure 10 in this application can maximize the area of ​​the effective connection region between the dielectric filter 100 and the support component 800, thereby ensuring the bonding strength between the dielectric filter 100 and the support component 800. Second, the circulator filter integrated structure 10 in this application can maximize the release range of the release hole 830. Finally, the aforementioned circulator filter integrated structure 10 can also ensure the synchronous deformation of the dielectric filter 100 and the support component 800, avoiding the formation of cracks at the solder joints of the dielectric filter 100 and the support component 800 due to different deformations, which would ultimately lead to connection failure between the dielectric filter 100 and the support component 800.

[0204] In some other implementations of this application, the release hole 830 may also be a U-shaped hole (not shown) formed on the edge of the supporting component 800.

[0205] Figure 9(b) shows a bottom view of the carrier component 800 of the dielectric filter 100 in some other embodiments of this application. In some embodiments of this application, the carrier component 800 has clearance holes 810 that are adapted to the pins on the body 110. The clearance holes 810 include a first clearance hole 811 and a third clearance hole 813, so that the pins on the body 110 can pass through the first clearance hole 811 and the third clearance hole 813 on the carrier component 800 and be electrically connected to the circuit board 60.

[0206] After introducing the relative positional relationship between the dielectric filter 100 and the circulator 200 in the circulator filter integrated structure 10, the following will describe the circulator filter integrated structure 10 in more detail with reference to several application scenarios. For ease of description and understanding, the following will be a detailed description using the example of one dielectric filter 100, one circulator 200, and a circuit board as the layout plane.

[0207] Application Scenario 1

[0208] Figure 10 A perspective view of the circulator filter integrated structure 10 in some embodiments of this application is shown. For example... Figure 10 As shown, the circulator filter integrated structure 10 includes a dielectric filter 100, a circulator 200, a conductor component 300, a first pin 400, and a second pin 500. Electromagnetic wave signals are transmitted between the dielectric filter 100 and the circulator 200 via the conductor component 300. The conductor component 300 can be at least one of a pin, a conductor sheet, a conductor block, and a conductor layer within the mounting groove 120.

[0209] It can be understood that the dielectric filter 100 and the circulator 200 are arranged in parallel, or that the dielectric filter 100 and the circulator 200 are arranged in superimposed.

[0210] In some embodiments of this application, such as Figure 10 As shown, the outer contour of the dielectric filter 100 is a cuboid, and its orthographic projection in the layout plane is rectangular. A circulator 200 is formed in the non-transparent area of ​​the filter 100, and its orthographic projection in the layout plane lies within the orthographic projection of the dielectric filter 100 in the layout plane. Conductor components 300 are respectively connected to one end of the circulator 200 (e.g., the second ring end 202) and one end of the dielectric filter 100 (e.g., the first filter end 101 of the dielectric filter 100) to realize signal transmission between the dielectric filter 100 and the circulator 200. A first pin 400 is connected to one of the other two ends of the circulator 200 (e.g., the first ring end 201) to receive the fed electromagnetic wave signal. A second pin 500 is connected to the other end of the dielectric filter 100 (e.g., the second filter end 102 of the dielectric filter 100) to transmit the fed electromagnetic wave signal (or receive the fed electromagnetic wave signal).

[0211] like Figure 10 As shown, in some embodiments of this application, the circulator filter integrated structure 10 further includes a third pin 600. The third pin 600 is connected to the other end of the other two ends of the circulator 200 (e.g., the third circulator end 203) to transmit the fed-out electromagnetic wave signal.

[0212] Figure 11(a) shows an exploded view of the circulator filter integrated structure 10 in some embodiments of this application. As shown in Figure 11(a), in the dielectric filter 100, a mounting groove 120 is reserved on the surface 111 of the body 110 (e.g., a second body) parallel to the layout plane, and the circulator 200 is mounted in the mounting groove 120. It is worth noting that the inner surface of the mounting groove 120 is coated with a first conductive layer (not shown) and a second conductive layer (not shown).

[0213] The first conductive layer is connected to the conductive layer on the surface of the body 110, while the second conductive layer is separated from the conductive layer on the surface of the body 110. The circulator 200 is connected to the first conductive layer and then grounded through the first conductive layer and other conductive layers on the outer surface of the body 110. The end of the circulator 200 is connected to the conductor component 300 through the second conductive layer, thereby realizing signal transmission between the circulator 200 and the conductor component 300.

[0214] In some embodiments of this application, the mounting slot 120 includes a central slot (not shown) and three forked slots (not shown) respectively communicating with the central slot. A circulator 200 is mounted in the central slot, and at least three ends of the circulator 200 correspond to the three forked slots respectively. A conductor component 300 is mounted in one of the forked slots and electrically connected to one end of the circulator 200, but not conductive to the ground plane of the dielectric filter 100, so that electromagnetic wave signals in the dielectric filter 100 are transmitted to the circulator 200 through the conductor component 300, and electromagnetic wave signals in the circulator 200 are transmitted to the dielectric filter 100 through the conductor component 300.

[0215] In some implementations of this application, the mounting slot 120 is covered with a conductive layer electrically connected to the ground plane of the dielectric filter 100. The conductive layer at the bottom of the fork slot for mounting the conductor component is formed by etching a strip-shaped conductive strip, which is not conductive to the ground plane of the dielectric filter. The strip-shaped conductive strip can be used as a conductor component 300 or a part of a conductor component 300. The other end of the strip-shaped conductive strip is electrically connected to one end of the circulator 200, so that the electromagnetic wave signal in the dielectric filter 100 is transmitted to the circulator 200 through the conductor component 300, and the electromagnetic wave signal in the circulator 200 is transmitted to the dielectric filter 100 through the conductor component 300.

[0216] In some implementations of this application, the circulator 200 installed in the mounting groove 120 does not protrude from the mounting groove 120. That is, the end face of the circulator 200 away from the bottom of the mounting groove 120 is slightly lower than the surface of the body 110 where the mounting groove 120 is formed. In other implementations of this application, the circulator 200 installed in the mounting groove 120 may protrude slightly from the mounting groove 120. That is, the end face of the circulator 200 away from the bottom of the mounting groove 120 protrudes slightly from the surface of the body 110 where the mounting groove 120 is formed.

[0217] In other implementations of this application, the surface of the dielectric filter 100 does not have a mounting groove, but only a mounting plane, and the circulator 200 is mounted on the mounting plane of the dielectric filter 100. For example, the circulator 200 is fitted to the mounting plane of the dielectric filter 100.

[0218] As shown in Figure 11(a), the circulator 200 includes a permanent magnet 210, an insulator 220, a metal conductor layer 230, and a ferrite 240 stacked in sequence. The insulator 220 can be an insulating sheet.

[0219] In some implementations of this application, the ferrite 240 is mounted at the bottom of the mounting groove 120 and is in contact with the second conductive layer on the bottom wall of the mounting groove 120. The circulator 200 is grounded through the ferrite 240 and the second conductive layer. The metal conductor layer 230 includes a main body (not shown) and three branched structures (not shown) extending outward from the main body, wherein the first end 231, the second end 232, and the third end 233 of the three branched structures respectively form the first annular end 201, the second annular end 202, and the third annular end 203 of the circulator 200. It is understood that the shape of the metal conductor layer 230 is diverse, such as snowflake-shaped. The shape of the metal conductor layer 230 can be reasonably adjusted according to performance requirements in the above-described circulator filter integrated structure 10.

[0220] In some implementations of this application, the metal conductor layer 230 may be formed on the surface of the ferrite 240 facing the permanent magnet 210 by metal printing. In other alternative implementations, the metal conductor layer 230 may also be a pre-formed metal sheet, which is fixed to the surface of the ferrite 240 facing the permanent magnet 220 by bonding or snapping. In other alternative implementations, the metal conductor layer 230 may also be a microstrip formed on the surface of the ferrite 240 facing the permanent magnet 220.

[0221] Figure 11(b) illustrates the circulator 200 in some other embodiments of this application. As shown in Figure 11(b), the circulator 200 also includes an external metal housing 204, resulting in a larger layout space occupied by the circulator 200. Due to Figure 10 The circulator 200 in Figure 11(a) occupies less layout space, making it easier to integrate into the dielectric filter 200. Based on this, after describing the specific structures of the dielectric filter 100 and the circulator 200, the integrated circulator filter structure 10 in this application will be further described below, taking the integrated molding of the circulator 200 and the dielectric filter 100 in Figure 11(a) as an example.

[0222] Figure 12(a) shows a bottom view of the circulator filter integrated structure 10 in some embodiments of this application. Figure 12(b) shows a perspective view of the circulator filter integrated structure 10 in some embodiments of this application from a bottom view, showing the path of signal transmission from the circulator 200 to the filter 100. Referring to Figures 12(a) and 12(b), it can be seen that the circulator 200 in the circulator filter integrated structure 10 is arranged in the dielectric filter 100 according to the layout scheme shown in Figures 8(c) and 8(d).

[0223] In some embodiments of this application, the transmission path of the first signal SIG1 transmitted by the transmitting device 40 in the circulator filter integrated structure 10 is shown as the broken line l1 with arrows in Figure 12(b). In some embodiments of this application, after the first pin 400 receives the first signal SIG1, it transmits the first signal SIG1 to the conductor component 300 through the circulator 200. The conductor component 300 transmits the first signal to the second pin 500 after passing through the first resonant cavity 131, the second resonant cavity 132, the third resonant cavity 133, the fourth resonant cavity 134, the fifth resonant cavity 135, the sixth resonant cavity 136, and the seventh resonant cavity 137 in the dielectric filter 100. The second pin 500 feeds the received first signal SIG1 into the antenna 30.

[0224] Similarly, the transmission path of the second signal SIG2 received by antenna 30 in the circulator filter integrated structure 10 is basically the opposite of the transmission path of the first signal SIG1. The transmission path of the second signal SIG2 received by antenna 30 in the circulator filter integrated structure 10 is shown by the broken line l2 with arrows in Figure 12(c). After receiving the second signal SIG2, the second pin 500 transmits the second signal SIG2 through the seventh resonant cavity 137, the sixth resonant cavity 136, the fifth resonant cavity 135, the fourth resonant cavity 134, the third resonant cavity 133, the second resonant cavity 132, and the first resonant cavity 131 in the dielectric filter 100 to the conductor component 300. After receiving the second signal SIG2, the conductor component 300 transmits the second signal SIG2 to the third pin 600 through the circulator 200, and the third pin 600 feeds the received second signal SIG2 out to the receiving device 50.

[0225] It is understood that the aforementioned transmission paths of the first signal SIG1 in the circulator filter integrated structure 10 and the second signal SIG2 in the circulator filter integrated structure 10 are only partial examples, and this application does not specifically limit the transmission paths of signals in the circulator filter integrated structure 10.

[0226] After introducing the signal transmission path on the circulator filter integrated structure 10, the following section will specifically introduce several possible conductor components 300 and their relative positional relationship with the dielectric filter 100.

[0227] Figure 13(a) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some embodiments of this application. As shown in Figure 13(a), in some embodiments of this application, the conductor component 300 is a fourth pin 300a. A receiving groove 160 is formed at the bottom of the mounting groove 120, wherein the second conductive layer covers the receiving groove 160 and the bottom of the mounting groove 120 surrounding the receiving groove 160. The receiving groove 160 may be close to one of the resonant cavities of the dielectric filter 100 (e.g., the first resonant cavity 131). One end of the fourth pin 300a extends toward the first surface 111 of the body 110, and the other end is received in the receiving groove 160 and abuts against the bottom of the receiving groove 160, such that the other end of the fourth pin 300a is connected to the metal conductor layer 230 in the circulator 200 through the second conductive layer on the body 110, for example, the other end of the fourth pin 300a is connected to the second end 232 of the metal conductor layer 230.

[0228] In some implementations of this application, the receiving groove 160 is close to the resonant cavity 131. Specifically, the bottom of the receiving groove 160 may be close to the first resonant cavity 131, meaning the end of the conductor component 300 is close to the bottom surface of the resonant cavity. Alternatively, the wall of the receiving groove 160 may be close to the first resonant cavity 131, meaning the side of the conductor component 300 is close to the side surface of the resonant cavity.

[0229] In order to facilitate the formation of the first conductive layer and the second conductive layer, in some implementations of this application, the receiving groove 160 is located at the bottom of the mounting groove 120 and has a certain distance between it and the groove wall of the mounting groove 120.

[0230] In some other embodiments of this application, the receiving slot 160 is located near the feed end in the dielectric filter 100.

[0231] Figure 13(b) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some other embodiments of this application. As shown in Figure 13(b), in some embodiments of this application, the height of one end of the fourth pin 300b is the same as the height of one end of the first pin 400. It is understood that "same" in this application means that the two parameters are substantially the same, or are the same within a certain error range. In the above-described circulator filter integrated structure 10, the first pin 400 and the fourth pin 300b can serve as the feed-in and feed-out terminals of the dielectric filter 100, respectively.

[0232] Figure 13(c) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some other embodiments of this application. As shown in Figure 13(c), in some embodiments of this application, the conductor component 300 is a fourth pin 300c, and the circulator 100 and the fourth pin 300c are mounted on the bottom surface of the mounting groove 120.

[0233] In some other embodiments, the dielectric filter 100 is rectangular in shape, and the body 110 of the dielectric filter 100 does not have mounting slots or receiving slots. The circulator 100 and the conductor component 300 are mounted on the surface of the dielectric filter 100. It is understood that this application does not specifically limit the mounting method of the circulator 100 and the conductor component 300 on the dielectric filter 100; any feasible method is within the protection scope of this application, and this application does not impose specific limitations.

[0234] Figure 13(d) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some other embodiments of this application. As shown in Figure 13(d), a receiving groove 160 is provided at the bottom of the mounting groove 120 on the dielectric filter 100. The receiving groove 160 can be close to one of the resonant cavities of the dielectric filter 100 (e.g., the first resonant cavity 131). The conductor component 300 is a pre-embedded metal conductor 300d embedded in the receiving groove. The pre-embedded metal conductor 300d is connected to one end (e.g., the second end 232) of the metal conductor layer 230 in the circulator 200 through a conductive layer on the body 110.

[0235] In some implementations of this application, the embedded metal conductor 300d can be conductive silver embedded in the receiving groove 160. The conductive silver can be prepared from conductive silver paste. To further optimize the molding process of the circulator filter integrated structure 10, reduce its production cost, and improve its economic efficiency, in some implementations, the conductive silver can be integrally molded with the silver plating layer on the body 110.

[0236] It is understood that the above are only some examples of the connection methods between the embedded metal conductor 300d and the dielectric filter 100 in this application, and this application does not specifically limit the electrical connection method between the metal conductor 300d and the dielectric filter 100.

[0237] In the aforementioned circulator filter integrated structure 10, since the circulator 200 is built into the dielectric filter 100, that is, the dielectric filter 100 and the circulator 200 are integrated into one unit without occupying space other than the layout area of ​​the dielectric filter 100. This optimizes the layout scheme of the RF components in the RF unit, allowing the layout area of ​​each channel in the RF unit to be saved by approximately 100 mm². 2Secondly, the surface mount technology, reflow, debugging, testing, and packaging processes of the dielectric filter 100 and the circulator 200 are basically the same. The integrated component solution of this application can be manufactured without adding new equipment, while still maintaining the existing dielectric filter 100. Furthermore, the integrated circulator filter structure 10 provided in this application can save on the costs of surface mount technology, reflow, debugging, testing, and packaging processes, as well as packaging and transportation costs. Finally, the integrated molding of the dielectric filter 100 and the circulator 200 in this application simplifies the installation steps of the RF unit and improves installation efficiency.

[0238] Figure 13(e) shows a cross-sectional view of the circulator filter integrated structure 10 along section AA in Figure 12(a) in some embodiments of this application. Figure 13(f) shows a partial enlarged view of region C in Figure 13(e).

[0239] Combination Figure 13(e) and 13(f) As can be seen, the dielectric filter 100 includes a dielectric body 103 and a conductive layer on the outer surface of the dielectric body 103. The conductive layer is etched to form a ground layer 104 and a transmission region (not shown). The ground layer 104 serves as the ground plane of the dielectric filter 100, and the conductor component 300 is located within the transmission region. In some implementations of this application, the conductor component 300 is a conductor layer 300e formed by etching the conductive layer within the transmission region. It can be understood that etching separates the conductive layer into a non-conductive ground layer 104 and conductor layer 300e, and an annular etching groove 105 is formed between the ground layer 104 and conductor layer 300e.

[0240] Figure 13(g) shows a cross-sectional view of the circulator filter integrated structure 10 and circuit board 60 along section AA in Figure 12(a) in some embodiments of this application, wherein the dielectric filter 100 includes a carrier member 800. In some embodiments of this application, as shown in Figure 13(g), a first pin 400 passes through a recess hole 811 on the carrier member 800 and connects to a port on the circuit board 60.

[0241] Figure 13(h) shows a cross-sectional view of the circulator filter integrated structure 10 and the circuit board 60 along section AA in Figure 12(a) in some other embodiments of this application. In some other embodiments of this application, as shown in Figure 13(h), the first pin 400 is connected to a port on the circuit board 60. In some implementations of this application, the first pin 400 is inserted into a port on the circuit board 60. In other alternative implementations of this application, the first pin 400 is mated to a port on the circuit board 60, which is not specifically limited in this application.

[0242] Application Scenario 2

[0243] In application scenario 2, this application provides a circulator filter integrated structure 10a, which includes a dielectric filter 100, a circulator 200a, and a conductor component 300. Compared with the circulator filter integrated structure 10 in application scenario 1, the circulator 200a in the circulator filter integrated structure 10a in application scenario 2 is different from the circulator 200 in the circulator filter integrated structure 10 in application scenario 1.

[0244] Figure 14 A perspective view of the circulator filter integrated structure 10a in some other embodiments of this application is shown. Figure 15 An exploded view of the circulator filter integrated structure 10a in some other embodiments of this application is shown. Figure 16 A bottom view of the circulator filter integrated structure 10a in some other embodiments of this application is shown.

[0245] Combination Figures 14 to 16 It is known that the circulator 200a includes a ceramic base 240a in a triangular cross shape. The ceramic base 240a includes three branch structures distributed on the same plane, with the included angle between the extension directions of adjacent branches being approximately 120°. Each end of the three branch structures forms one of the three ends of the circulator 200a. The intersection of the three branch structures in the ceramic base 240a forms a lamination groove 241a. The circulator 200a also includes a permanent magnet 210a, an insulator 220a, and a ferrite 230a. The ferrite 230a, insulator 220a, and permanent magnet 210a are sequentially stacked within the lamination groove 241a, with the ferrite 230a located at the bottom of the lamination groove 241a.

[0246] In some embodiments of this application, such as Figure 16 As shown, the ceramic base 240a includes an inner ceramic layer and an outer conductive layer. The inner ceramic layer of the ceramic base 240a is integrally formed with the ceramic substrate in the body 110. The conductive layer of the ceramic base 240a is integrally formed with the conductive layer in the body 110. Based on this, the ceramic base 240a can be formed during the filter forming stage of the above-mentioned circulator filter integrated structure 10a, and subsequently only the permanent magnet 210a, insulator 220a and ferrite 230a need to be installed on the dielectric filter 100.

[0247] It is understandable that when the ceramic base 240a and the body 110 are integrally formed, it is also necessary to reasonably arrange structures such as coupling grooves to separate the three ends of the ceramic base 240a from the ceramic base 240a in the body 110 as much as possible. For example, adding coupling grooves or adjusting the extension direction of the coupling grooves (e.g.) Figure 14 , 15 and Figure 16The first coupling slot 141 in the circulator. It is understood that the added or extended coupling slot is not necessarily a through slot connecting the first surface 111 and the second surface 112. The coupling slot cooperates with the conductive layer to isolate the cavity in the circulator used for transmitting electromagnetic wave signals from the cavity in the dielectric filter as much as possible. This application does not make specific limitations in this regard.

[0248] In application scenario 2, the circulator filter integrated structure 10a can adjust its impedance variation based on the ceramic substrate 240a and the body 110, thereby adjusting the signal performance of the circulator filter integrated structure 10a to obtain a circulator filter integrated structure 10a that meets the requirements. For example, the signal performance of the circulator filter integrated structure can be adjusted by adjusting the coupling groove on the body 110 and the area of ​​the silver layer in the resonant cavity. Another example is adjusting the signal performance of the circulator filter integrated structure by adjusting the dielectric properties of the ceramic structure in the ceramic substrate 240a and the body 110.

[0249] Application Scenario 3

[0250] Figure 17 The diagram shows the components in channel 1 in some other embodiments of this application. Figure 18 A perspective view of the circulator filter integrated structure 10b in some other embodiments of this application is shown. Figure 19 An exploded view of the circulator filter integrated structure 10b in some other embodiments of this application is shown. Figure 20 A bottom view of the circulator filter integrated structure 10b in some other embodiments of this application is shown.

[0251] Combination Figure 17 and Figure 18 As can be seen, in application scenario 3, the circulator filter integrated structure 10b includes a dielectric filter 100, a circulator 200, a conductor component 300, and a resistor 700. Compared with the circulator filter integrated structure 10 in application scenario 1, the circulator filter integrated structure 10b in application scenario 3 has a resistor 700 on its third end 233.

[0252] In some embodiments of this application, in the above-described circulator filter integrated structure 10b, a resistive film is sintered at the third end of the circulator 200 to isolate and consume the echo interference signal.

[0253] like Figure 17As shown, in some embodiments of this application, the circulator filter integrated structure 10b includes a first dielectric filter 100a, a second dielectric filter 100b, a circulator 200, a conductor component 300, and a resistor 700. One end of the first dielectric filter 100a is connected to the second end 232 of the circulator 200, and the other end of the first dielectric filter 100a is connected to the antenna 30. One end of the second dielectric filter 100b is connected to the antenna 30, and the other end of the second dielectric filter 100b is connected to the receiving device 50. The resistor 700 is connected to the third end 233 of the circulator 200. In some implementations, the first dielectric filter 100a and the second dielectric filter 100b are used to filter radio frequency signals within different frequency bands.

[0254] Combination Figures 18 to 20 It is known that resistor 700 is connected to the third end 233 of circulator 200. In some implementations of this application, resistor 700 may be a resistive film sintered on the third end 233.

[0255] It is understood that this application does not specifically limit the number of dielectric filters 100 and circulators 200 in the circulator filter integrated structure 10. That is, in the circulator filter integrated structure 10, the number of dielectric filters 100 can be one, two, three, etc., and the number of circulators 200 can be one, two, three, etc. After introducing the above three application scenarios, the following will further describe several different circulator filter integrated structures 10 in terms of the number of dielectric filters 100 and circulators 200 in the circulator filter integrated structure 10.

[0256] In some embodiments of this application, the circulator filter integrated structure contains multiple dielectric filters and one circulator. Figure 21(a) shows a schematic diagram of the components in channel 11 in some embodiments of this application. For example, as shown in Figure 21(a), the circulator filter integrated structure 10c in this application includes three dielectric filters 100 and one circulator 200. One end of each of the three dielectric filters 100 is connected in parallel to the second end of the circulator 200. One input and one output terminal of each of the three dielectric filters 100 are respectively connected to the corresponding antenna 30.

[0257] In some aspects of this application, the structure of the circulator filter integrated structure 10 in application scenario 1 will be described below. Figure 21(b) shows a partial enlarged view of region B in Figure 12(a). The second annular end 202 of the circulator 200 is electrically connected to the three conductor components 300-1, 300-2, and 300-3 by etching the conductive layer on the surface of the body 110, and the conductor components 300-1, 300-2, and 300-3 are not conductive to the ground plane of the dielectric filter.

[0258] The aforementioned circulator filter integrated structure 10c can further reduce the difficulty of laying out the circulator 200 on the dielectric filter 100. For example, a wide-band electromagnetic wave signal can be transmitted unidirectionally through a single circulator, while multiple dielectric filters filter out radio frequency signals in different frequency ranges.

[0259] In some embodiments of this application, the circulator filter integrated structure contains one dielectric filter and multiple circulators. Figure 22 Schematic diagrams of components in a channel are shown in some embodiments of this application. For example... Figure 22 As shown, the circulator filter integrated structure 10d in this application may include a dielectric filter 100 and three circulators 200 to further reduce the layout area occupied by the circulators 200. It is understood that the electrical connection between one conductor component 300 and the second annular ends 202 of the three circulators 200 is achieved by etching the conductive layer on the surface of the body 110, and the conductor component 300 is not conductive to the ground plane of the dielectric filter.

[0260] In addition, this application also provides a radio frequency (RF) unit, which includes a power amplifier tube and any of the aforementioned circulator filter integrated structures. The transmitting end of the power amplifier tube is electrically connected to a first conductor component of the circulator filter integrated structure, and a fourth conductor component of the circulator filter integrated structure is used for electrical connection to an antenna. It is understood that the RF unit can be an active antenna unit or a remote RF unit.

[0261] In addition, this application also provides a base station that includes at least one of the aforementioned radio frequency units.

[0262] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0263] It should be noted that in this specification, similar reference numerals and letters in the above figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

Claims

1. A circulator filter integrated structure (10), characterized in that, It includes a dielectric filter (100), a circulator (200) and a conductor component (300), wherein the dielectric filter (100) and the circulator (200) are connected, and at least a portion of the dielectric filter (100) and the circulator (200) are stacked along the thickness direction of the circulator filter integrated structure (10); The electromagnetic wave signal in the dielectric filter (100) is transmitted to the circulator (200) through the conductor component (300), and the electromagnetic wave signal in the circulator (200) is transmitted to the dielectric filter (100) through the conductor component (300). The circulator (200) includes at least three ends. The conductor component (300) is disposed on the dielectric filter (100), and the conductor component (300) is not conductive to the ground plane of the dielectric filter (100), and the conductor component (300) is electrically connected to one of the ends of the circulator (200).

2. The circulator filter integrated structure (10) according to claim 1, characterized in that, The surface of the dielectric filter (100) has a conductive layer, which is etched to form a ground layer and a transmission region. The ground layer serves as the ground plane of the dielectric filter (100), and the conductor component (300) is located within the transmission region. The conductor component (300) includes at least one of a pin, a conductor sheet, a conductor block, and a conductive layer formed by etching within the transmission region.

3. The circulator filter integrated structure (10) according to claim 1, characterized in that, The dielectric filter (100) includes a body (110), the body (110) includes a first body and a second body connected to each other, and the second body includes a mounting portion for mounting the circulator (200), the mounting portion including at least one of a mounting recess and a mounting plane; The first body and the second body of the dielectric filter (100) are integrally formed, or the first body and the second body are separately formed and then assembled into the body (110) of the dielectric filter (100).

4. The circulator filter integrated structure (10) according to claim 3, characterized in that, The body (110) has a receiving groove (160) and at least a portion of the conductor component (300) is located in the receiving groove (160).

5. The circulator filter integrated structure (10) according to claim 3, characterized in that, The body includes a receiving surface, and the conductor component (300) is disposed on the receiving surface.

6. The circulator filter integrated structure (10) according to claim 1, characterized in that, The at least three ends include three ends, and the circulator (200) includes a permanent magnet (210), an insulator (220), a metal conductor layer (230) and a ferrite (240) stacked in sequence, and the ferrite (240) is connected to the dielectric filter (100); The metal conductor layer (230) has a trident structure, and the three ends of the trident structure respectively form the three ends of the circulator (200).

7. The circulator filter integrated structure (10) according to claim 1, characterized in that, The circulator (200a) includes: A ceramic substrate (240a) includes three branches distributed on the same plane, the three branches intersecting and converging at a junction point, the ceramic substrate (240a) forming a superimposed hole at the junction point, and the ends of the three branches away from the junction point respectively forming at least three ends of an annulus (200a). Ferrite (230a), said ferrite (230a) being housed at the bottom of the overlapping hole; An insulator (220a) is housed within the overlapping hole and overlapped on the surface of the ferrite (230a); A permanent magnet (210a) is housed at the top of the overlapping hole and overlapped on the surface of the insulator (220a).

8. The circulator filter integrated structure (10) according to claim 1, characterized in that, The dielectric filter (100) includes a first input / output terminal and a second input / output terminal. The at least three ends include a first end, a second end, and a third end, wherein the second end is electrically connected to the first input / output terminal of the dielectric filter (100). The circulator filter integrated structure (10) further includes: The first pin (400) is electrically connected to the first end of the circulator (200) and to the transmitting device (40); The second pin (500) is electrically connected to the second input / output terminal of the dielectric filter (100) and to the antenna (30); The third pin (600) is electrically connected to the third end of the circulator (200) and to the receiving device (50). The first pin (400), the second pin (500), and the third pin (600) are not connected to the ground plane of the dielectric filter (100).

9. The circulator filter integrated structure (10) according to claim 1, characterized in that, The dielectric filter (100) includes a first input / output terminal and a second input / output terminal. The at least three ends include a first end, a second end, and a third end, wherein the second end is electrically connected to the first input / output terminal of the dielectric filter (100). The circulator filter integrated structure (10) further includes: The first pin (400) is electrically connected to the first end of the circulator (200) and to the transmitting device (40); The second pin (500) is electrically connected to the second input / output terminal of the dielectric filter (100) and to the antenna (30); A resistor (700) is electrically connected to the third end of the circulator (200). The first pin (400) and the second pin (500) are not connected to the ground plane of the dielectric filter (100).

10. The circulator filter integrated structure (10) according to any one of claims 1 to 9, characterized in that, The number of dielectric filters (100) is one, the number of circulators (200) is at least one, the dielectric filter (100) includes two input and output terminals, each circulator (200) includes at least three ends, and one of the input and output terminals of the dielectric filter (100) is electrically connected to one of the ends of each circulator (200) through the conductor component (300).

11. The circulator filter integrated structure (10) according to any one of claims 1 to 9, characterized in that, The number of dielectric filters (100) is at least one, the number of circulators (200) is one, each dielectric filter (100) includes two input and output terminals, and the circulator (200) includes at least three ends, one of the ends of the circulator (200) being electrically connected to one of the input and output terminals of each dielectric filter (100) via the conductor component (300).

12. A radio frequency unit, characterized in that, It includes a power amplifier tube (20) and a circulator filter integrated structure (10) as described in any one of claims 1 to 11, wherein the output terminal of the power amplifier tube (20) is electrically connected to the input terminal of the circulator filter integrated structure (10), and the input terminal of the power amplifier tube (20) is electrically connected to a transmitting device (40).

13. The radio frequency unit according to claim 12, characterized in that, The radio frequency unit further includes an antenna (30) electrically connected to the input and output terminals of each of the dielectric filters (100).

14. A base station, characterized in that, It includes at least one set of radio frequency units as described in claim 12 or 13.

Citation Information

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